A wafer calibration adsorption device

Abstract

This invention discloses a wafer alignment adsorption device, comprising a substrate, a bearing component, an adsorption stage, a vacuum generator, and a belt drive mechanism. The bearing component includes an inner ring fixed to the substrate and a rotatable outer ring. The outer ring is fixedly connected to the adsorption stage. The belt drive mechanism drives the outer ring of the bearing component to rotate, thereby rotating the adsorption stage. The adsorption stage has a plurality of adsorption holes, which are connected to the vacuum generator. The vacuum generator generates an adsorption airflow to fix the product on the adsorption stage. This invention uses the bearing component to drive the adsorption stage to rotate, thereby adjusting the position of the wafer fixed on the adsorption stage to correspond to the position of the detection mechanism, improving the positional accuracy of the product during detection.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and more specifically to a wafer alignment adsorption device. Background Technology

[0002] Wafer testing is a crucial step in the semiconductor chip manufacturing process. It enables the evaluation of the electrical parameters of devices, thereby identifying qualified chips before packaging. Furthermore, it allows production personnel to assess the quality level of the manufacturing process based on the device yield rate.

[0003] During testing, the wafer is held in place on the stage. However, there may be an angular misalignment between the wafer's position and the detection mechanism. In this case, the stage needs to be rotated to correct the wafer's position, ensuring that the detection areas on the wafer correspond one-to-one with the probe cards. Current technology typically places a rotating shaft beneath the stage, with a rotation drive mechanism directly connected to the shaft to drive the stage's rotation. However, this connection structure can cause the stage to tilt during rotation when the stage has a large mass or diameter. Furthermore, addressing the issue of large gaps that occur during stage rotation is also a crucial challenge for improving wafer positioning accuracy. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a wafer alignment adsorption device, wherein the wafer alignment adsorption device realizes the rotation of the adsorption stage through bearing components, and is provided with a limiting mechanism to reduce or eliminate the radial gap between the inner and outer rings of the bearing components, thereby improving the positioning accuracy of the wafer.

[0005] To achieve all or part of the above-mentioned objectives, the present invention provides the following technical solutions:

[0006] This invention provides a wafer alignment adsorption device, comprising a substrate, a bearing component, an adsorption stage, a vacuum generator, and a belt drive mechanism. The bearing component has an inner ring fixed to the substrate and a rotatable outer ring, the outer ring being fixedly connected to the adsorption stage. The belt drive mechanism drives the outer ring of the bearing component to rotate, thereby rotating the adsorption stage. The adsorption stage has a plurality of adsorption holes, which are connected to the vacuum generator. The vacuum generator generates an adsorption airflow to fix the product on the adsorption stage. The beneficial effect of this technical solution is that by driving the outer ring of the bearing component to rotate through the belt drive mechanism, the rotation of the adsorption stage is achieved. This transmission method prevents the stage from tilting during rotation, making the rotation of the stage more stable. It should be noted that the product described in this invention can be a semiconductor device such as a wafer.

[0007] The wafer alignment adsorption device may further include a limiting mechanism, which includes a fixed end and a limiting end. The fixed end is fixedly connected to the substrate, and the limiting end abuts against the adsorption stage and applies a force toward the rotation axis to the adsorption stage. The beneficial effect of this technical solution is that the limiting mechanism is used to eliminate or reduce the radial clearance between the inner and outer rings of the bearing component, ensuring that the outer ring of the bearing component does not shift position during rotation, thereby improving the positioning accuracy of the product on the adsorption stage. The limiting mechanism is suitable for bearing components with radial clearance between the inner and outer rings, such as slewing bearings.

[0008] The fixed end is a connecting block, and the limiting end is a roller. One end of the connecting block is connected to the roller, and the other end is fixedly mounted on the substrate. A limiting groove is formed on the circumference of the adsorption stage, and the roller abuts against the limiting groove. The beneficial effect of this technical solution is that the roller rotates due to the force exerted on it by the adsorption stage, so severe wear is less likely to occur between the roller and the limiting groove, which helps to extend the service life of the device.

[0009] The limiting groove is a V-shaped limiting groove, and the surface of the roller that contacts the V-shaped limiting groove is set with a matching V-shaped structure. The beneficial effect of this technical solution is that it ensures that there is a certain contact area between the V-shaped limiting groove and the roller, so that the roller and the follower ring can make stable contact when the adsorption platform rotates.

[0010] The adsorption stage may further include a support portion for fixing the product, and a follower portion located below the support portion, detachably connected to the support portion, and coaxially arranged, with the limiting groove formed on the circumferential surface of the follower portion. The beneficial effect of this technical solution is that, because the adsorption stage needs to support and adsorb products such as wafers, its size is somewhat limited. By dividing the adsorption stage into a detachably connected support portion and a follower portion, with the support portion used to adsorb the product and the follower portion used to form the limiting groove, the size of the follower portion can be flexibly selected as needed, ensuring optimal fit with the rollers without being limited by the product size. Preferably, the follower portion can be set as a hollow follower ring to reduce the weight of the adsorption stage.

[0011] The structure of the limiting mechanism mounted on the substrate can be as follows: the bottom of the substrate is provided with grooves corresponding to the number of limiting mechanisms, and the limiting mechanisms are disposed in the grooves.

[0012] The limiting mechanism is provided in at least three parts, and the at least three limiting mechanisms are arranged at equal angles around the rotation axis of the adsorption platform.

[0013] The wafer correction adsorption device also includes a tensioning mechanism, which is mounted on the substrate and is used to adjust the tension of the synchronous belt.

[0014] The adsorption platform is provided with a sensing block, and the substrate is provided with a sensing mechanism for sensing the sensing block.

[0015] Specifically, the sensing mechanism includes an origin sensor and a first limit sensor and a second limit sensor symmetrically arranged on both sides of the origin sensor. When the rotation angle of the adsorption stage is 0, the sensing block is located in the sensing area of ​​the origin sensor. When the adsorption stage reaches the limit rotation angle, the sensing block is located in the sensing area of ​​the first limit sensor or the second limit sensor. If the wafer is positioned accurately, the detection area on the wafer corresponds to the detection mechanism. At this time, the adsorption stage does not need to rotate, and the wafer is in the optimal detection position. At this time, the sensing block is located in the sensing area of ​​the origin sensor. However, in reality, when the wafer is placed, the detection area on the wafer is at a certain deviation angle from the detection mechanism. At this time, the control system controls the rotation drive mechanism to work, so that the adsorption stage rotates at a certain angle, making the detection area on the product correspond to the detection mechanism. When the first limit sensor or the second limit sensor senses the sensing block, it means that the adsorption stage has rotated to the limit position. The rotation angle of the adsorption stage at this time is the limit rotation angle. If the deviation angle between the product and the detection mechanism is less than or equal to the limit rotation angle, positioning can be achieved by rotating the adsorption stage.

[0016] The adsorption platform has a plurality of adsorption holes arranged in a ring. A ring-shaped gas storage tank is connected below each adsorption hole, and the gas storage tank is connected to a gas inlet, which in turn is connected to a vacuum generator. The advantage of this technical solution is that it achieves vacuum adsorption of the product along its entire circumference through a ring of adsorption holes, thus fixing the product on the adsorption platform.

[0017] Compared with the prior art, the present invention has at least the following beneficial effects:

[0018] (1) The present invention reduces the radial gap between the inner and outer rings of the bearing component by setting a limiting mechanism, thereby improving the positioning accuracy of the wafer and ensuring that the detection area of ​​the wafer corresponds to the detection mechanism.

[0019] (2) The present invention further discloses that the limiting end of the limiting mechanism can be a roller, and a limiting groove matching the roller can be opened on the adsorption platform. The roller and the limiting groove abut against each other to reduce / eliminate the radial clearance of the bearing components. At the same time, the roller and the limiting groove are less likely to experience severe wear, which is beneficial to extend the service life of the device.

[0020] (3) The present invention further discloses that the limiting groove can be a V-shaped limiting groove, and the contact surface between the roller and the limiting groove is set to a matching V-shaped structure to ensure the stability of the contact structure between the roller and the limiting groove. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the specific embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the wafer correction adsorption device in Embodiment 1 of the present invention;

[0023] Figure 2 This is a top view of a wafer correction adsorption device according to an embodiment of the present invention;

[0024] Figure 3 yes Figure 2 Sectional view along AA;

[0025] Figure 4 yes Figure 3 Enlarged view of point B in the middle;

[0026] Figure 5 This is a bottom view of the wafer correction adsorption device in Embodiment 1 of the present invention;

[0027] Figure 6 This is a schematic diagram of the limiting mechanism and the follower ring in Embodiment 1 of the present invention;

[0028] Figure 7 This is a schematic diagram of the adsorption stage in Embodiment 1 of the present invention.

[0029] Reference numerals: 1-substrate, 101-groove, 2-bearing component, 201-outer ring, 202-inner ring, 3-adsorption platform, 301-follower ring, 3011-V-shaped limiting groove, 302-plate support platform, 4-rotation drive mechanism, 5-synchronous pulley, 6-synchronous belt, 7-limiting mechanism, 701-connecting block, 702-roller, 8-tensioning mechanism, 9-sensing block, 10-sensing mechanism, 1001-origin sensor, 1002-first limiting sensor, 1003-second limiting sensor, 11-adsorption hole, 12-air inlet. Detailed Implementation

[0030] The technical solutions in specific embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example 1

[0032] This invention provides a wafer alignment adsorption device, please refer to the reference. Figure 1-3 The system includes a substrate 1, a bearing component 2, an adsorption platform 3, a vacuum generator (not shown), and a belt drive mechanism. Specifically, the belt drive mechanism includes a rotary drive mechanism 4, a synchronous belt 6, and a synchronous pulley 5. The inner ring 202 of the bearing component 2 is fixedly mounted on the substrate 1, and the outer ring 201 is fixedly connected to the adsorption platform 3. The output end of the rotary drive mechanism 4 is connected to the synchronous pulley 5. The synchronous belt 6 is fitted onto the outer ring 201 of the bearing component 2 and the synchronous pulley 5. The rotary drive mechanism 4 drives the synchronous pulley 5 to rotate, thereby moving the synchronous belt 6 and causing the outer ring 201 of the bearing component 2 to rotate relative to the inner ring 202. The adsorption platform 3 connected to the outer ring 201 rotates accordingly. The substrate 1 also has a tensioning mechanism 8, which is located outside the synchronous belt 6 and is used to adjust the tension of the synchronous belt 6.

[0033] In this embodiment, the rotary drive mechanism 4 is a rotary motor, but in other embodiments, it can be replaced by a rotary cylinder or other mechanism with the same or similar function.

[0034] Please refer to the reference. Figure 3-6 To reduce the radial clearance between the inner ring 202 and the outer ring 201 of the bearing component 2, the wafer correction adsorption device provided in this embodiment also includes four limiting mechanisms 7. Four grooves 101 are provided at the bottom of the substrate 1, and the limiting mechanisms 7 are installed in the grooves 101. The four limiting mechanisms 7 are arranged symmetrically about the rotation axis of the adsorption platform 3. The limiting mechanism 7 includes a roller 702 and a connecting block 701. One end of the connecting block 701 is fixedly installed in the groove 101, and the other end is connected to the roller 702. The adsorption platform 3 includes a bearing part for bearing the product above, and a follower ring 301 that is detachably connected to the bearing part and coaxially arranged. A V-shaped limiting groove 3011 is provided on the circumferential surface of the follower ring 301. The roller 702 of the limiting mechanism 7 abuts against the V-shaped limiting groove 3011, and the contact surface of the roller 702 abutting against the V-shaped limiting groove 3011 is also set as a corresponding V-shaped structure to ensure stable contact between the roller 702 and the V-shaped limiting groove 3011. When the follower ring 301 rotates, on the one hand, the connecting block 701 of the limiting mechanism 7 is fixedly installed on the base plate 1, maintaining a constant relative position with the inner ring 202 of the bearing component 2, which is also installed on the base plate 1. On the other hand, the roller 702 in the limiting mechanism 7 abuts against the follower ring 301 through the V-shaped limiting groove 3011 and applies a force toward the rotation axis to the follower ring 301. The follower ring 301 is indirectly connected to the outer ring 201 of the bearing component 2 through the bearing portion of the adsorption platform 3. Therefore, the roller 702 actually indirectly applies a force toward the rotation axis to the outer ring 201 of the bearing component 2, which plays the role of pressing the outer ring 201, thereby reducing or eliminating the radial gap between the inner ring 202 and the outer ring 201 of the bearing component 2 and improving the alignment accuracy.

[0035] In this embodiment, the bearing component 2 used is a slewing bearing. To ensure a certain force between the synchronous belt 6 and the outer ring 201 of the bearing component 2, the outer ring 201 of the bearing component 2 is textured to increase friction. In addition to slewing bearings, the aforementioned limiting mechanism 7 is also applicable to other types of bearing components 2 with radial clearance. In this embodiment, four limiting mechanisms 7 are provided. However, in other embodiments, the number of limiting mechanisms 7 can be specifically set according to the diameter of the bearing component 2 or other factors. However, to ensure the effect of reducing radial clearance, the number of limiting mechanisms 7 is preferably not less than three, and the three limiting mechanisms 7 are not simultaneously located on the same side of the axis of symmetry of the adsorption platform 3. Furthermore, in this embodiment, the limiting groove is V-shaped, and the surface of the roller 702 that abuts against it is also set to a matching V-shaped structure to ensure that there is a certain contact area between the limiting groove and the roller 702 to improve the stability of the contact structure. However, in other embodiments, while ensuring that the limiting mechanism 7 reduces / eliminates the radial clearance of the bearing component 2, the limiting groove and the roller 702 can also be other shaped structures. For example, the contact structure between the limiting groove and the roller 702 can be a line contact. In this embodiment, the limiting end is the roller 702. When the follower ring 301 rotates, the roller 702 rotates due to the force exerted on it by the follower ring 301. Therefore, severe wear is not likely to occur between the roller 702 and the V-shaped limiting groove 3011, which is beneficial to extending the service life of the device. However, the roller 702 can also be replaced by other components with the same or similar effects.

[0036] like Figure 1 and Figure 2As shown, a sensing block 9 is provided at the edge of the adsorption stage 3, and a sensing mechanism 10 is provided on the substrate 1 accordingly. The sensing mechanism 10 includes an origin sensor 1001, a first limit sensor 1002, and a second limit sensor 1003. When the rotation angle of the adsorption stage 3 is 0 (i.e., when the sensing block 9 is at the origin), the sensing block 9 is located in the sensing area of ​​the origin sensor 1001. The first limit sensor 1002 and the second limit sensor 1003 are symmetrically arranged on both sides of the origin sensor 1001. The sensing areas of the first limit sensor 1002 and the second limit sensor 1003 are the limit positions that the adsorption stage 3 can reach when it rotates. If the wafer is positioned accurately, each detection area on the wafer corresponds to a probe. At this time, the adsorption stage 3 does not need to rotate (i.e., the origin sensor 1001 senses the sensing block 9), and the wafer is in the optimal detection position. However, in reality, there will be an angular deviation when the wafer is placed, that is, the detection area on the wafer and the probe will have a certain deviation angle. At this time, the control system controls the rotation drive mechanism 4 to work, so that the adsorption stage 3 rotates a certain angle, so that the detection area on the wafer corresponds to the probe. When the first limit sensor 1002 or the second limit sensor 1003 senses the sensing block 9, it means that the adsorption stage 3 has reached the limit rotation angle. If the deviation angle between the wafer and the probe is less than or equal to the limit rotation angle, the wafer can be positioned by rotating the adsorption stage 3.

[0037] like Figure 1 and Figure 7 As shown, the adsorption stage 3 is provided with a raised wafer support stage 302 for supporting the wafer. The wafer support stage 302 is provided with a plurality of adsorption holes 11 arranged in a ring. The bottom of the plurality of adsorption holes 11 is connected to a ring-shaped gas storage tank. The gas storage tank is provided with a gas inlet 12, which is connected to a vacuum generator. The vacuum generator is used to generate an adsorption gas flow to fix the wafer on the wafer support stage 302.

[0038] Example 2

[0039] The difference between this embodiment and Embodiment 1 is that the bearing component 2 is selected as a crossed roller bearing with radial clearance within an acceptable range. Therefore, the wafer correction adsorption device in this embodiment does not need to be equipped with a limiting mechanism 7 and a follower ring 301.

[0040] The wafer correction adsorption device provided by the present invention has been described in detail above. Specific examples have been used to illustrate the principle of the invention. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principle of the invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A wafer correction adsorption device, characterized by, The utility model relates to a kind of vacuum adsorption rotary table, including substrate (1), bearing piece (2), adsorption platform (3), vacuum generating device and belt drive mechanism, the bearing piece (2) includes fixed on substrate (1) inner ring (202) and rotatable outer ring (201), the outer ring (201) is fixedly connected with the adsorption platform (3), the belt drive mechanism drives the outer ring (201) of the bearing piece (2) rotation, to drive the adsorption platform (3) rotation;The adsorption platform (3) is equipped with several adsorption holes (11), the several adsorption holes (11) are communicated with the vacuum generating device, and the vacuum generating device is used to generate adsorption airflow and fix product on the adsorption platform (3); It further includes limiting mechanism (7), the limiting mechanism (7) includes fixed end and limiting end, the fixed end is fixedly connected with the substrate (1), and the limiting end is abutted with the adsorption platform (3) and applies the force towards the rotation axis to the adsorption platform (3); The fixed end is connecting block (701), the limiting end is gyro wheel (702), one end of the connecting block (701) is connected gyro wheel (702), and the other end is fixedly installed on the substrate (1);The circumferential surface of the adsorption platform (3) is provided with a circle of limiting slot, and the gyro wheel (702) is abutted with the limiting slot; The limiting slot is V-shaped limiting slot (3011), and the surface of the gyro wheel (702) and the V-shaped limiting slot (3011) is provided with matching V-shaped structure; The adsorption platform (3) includes the load-bearing part for fixing product, and the follow-up part is coaxially arranged below the load-bearing part and detachably connected with the load-bearing part, and the limiting slot is provided on the circumferential surface of the follow-up part.

2. The wafer correction adsorption apparatus according to claim 1, wherein The bottom of the substrate (1) is provided with recess (101) corresponding to the number of the limiting mechanism (7), and the limiting mechanism (7) is arranged in the recess (101).

3. The wafer correction adsorption apparatus according to claim 1, wherein The limiting mechanism (7) is provided with at least three, and the at least three limiting mechanisms (7) are arranged at equal angles around the rotation axis of the adsorption platform (3).

4. The wafer correction adsorption apparatus according to claim 1, wherein The adsorption platform (3) is provided with sensing block (9), and the substrate (1) is provided with sensing mechanism (10) for sensing the sensing block (9).

5. The wafer correction adsorption apparatus according to claim 4, wherein The sensing mechanism (10) includes origin sensor (1001) and first limit sensor (1002) and second limit sensor (1003) symmetrically arranged on both sides of the origin sensor (1001), when the rotation angle of the adsorption platform (3) is 0, the sensing block (9) is located in the sensing area of the origin sensor (1001), and when the adsorption platform (3) reaches the limit rotation angle, the sensing block (9) is located in the sensing area of the first limit sensor (1002) or the second limit sensor (1003).

6. The wafer correction adsorption apparatus according to claim 1, wherein The several adsorption holes (11) on the adsorption platform (3) are arranged in a ring, and the adsorption holes (11) are communicated with annular gas storage groove below, the gas storage groove is communicated with gas inlet (12), and the gas inlet (12) is communicated with vacuum generating device.

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