Molding device, liquid column moving device, molding method, liquid column moving method and program

Abstract

A molding device includes: a moving processing unit that moves a liquid column sandwiched between two substrates; and a molding unit that performs molding by converting a portion of the liquid column into a solid within a predetermined molding area.

Description

Technical Field

[0001] The present invention relates to a molding device, a liquid column moving device, a molding method, a liquid column moving method and a program.

[0002] This application claims priority based on Japanese Patent Application No. 2019-208227 filed in Japan on November 18, 2019, the contents of which are incorporated herein by reference. Background Art

[0003] Stereolithography is one of the methods for shaping three-dimensional objects. It creates objects by irradiating a liquid material with light, such as an ultraviolet laser beam, and partially solidifying it.

[0004] Regarding photomolding, a method for molding silver microstructures using photoreduction is described in Non-Patent Document 1. In the method described in Non-Patent Document 1, a laser beam is irradiated onto an aqueous solution containing silver ions to condense the silver into a target shape, and the aqueous solution is then removed.

[0005] Non-Patent Document 2 also describes an experimental example using a combination of multiple materials for photomolding. In this experimental example, acrylic resin and methacrylic resin were separately photopolymerized and then electroless plated onto the magnetic material. The results showed that only the acrylic resin was selectively plated.

[0006] Furthermore, the following method is used in Non-Patent Document 3. This method introduces acrylic resin or the like into a molding part using a microchannel, switches the materials using a valve, and performs molding using a plurality of resin materials.

[0007] By using a variety of materials for light shaping in this way, objects with a variety of characteristics can be shaped.

[0008] Prior art literature

[0009] Non-patent literature

[0010] Non-Patent Document 1: Yao-Yu Cao, Nobuyuki Takeyasu, Takuo Tanaka, Xuan-Ming Duan, and Satoshi Kawata, "3D Metallic Nanostructure Fabrication by Surfactant-Assisted Multiphoton-Induced Reduction", Small, 2009, Vol. 5, No. 10, pp. 1144-1148

[0011] Non-Patent Literature 2: Tommaso Zandrini, Shuhei Taniguchi and Shoji Maruo, "Magnetically Driven Micromachines Created by Two-Photon Microfabrication and Selective Electroless Magnetite Plating for Lab-on-a-Chip Applications", Micromachines, 2017, Vol. 8, No. 35, pp. 1-8

[0012] Non-patent document 3: Frederik Mayer, Stefan Richter, Johann Westhauser, Eva Blasco, Christopher Barner-Kowollik and Martin Wegener, "Multimaterial 3D lasermicroprinting using an integrated microfluidic system", Science Advances, February 2019, Volume 5, No. 2, p.1-7 Summary of the Invention

[0013] Problems to be solved by the invention

[0014] For example, as part of micro-photon micro-photon molding methods, such as two-photon micro-photon molding, multiple types of resins (photocurable resins) are used to form an integrated structure.

[0015] One method for using multiple resins involves temporarily removing the glass substrate from the molding apparatus and cleaning it when changing resins. For example, an operator uses the molding apparatus to drop a first resin onto the glass substrate, then focuses and scans a laser, such as a near-infrared pulsed laser, into the resin droplet to solidify it. After completing molding with the first resin, the operator removes the glass substrate from the molding apparatus and cleans the uncured resin. The operator then replaces the glass substrate in the molding apparatus and uses the molding apparatus to drop a second resin, restarting molding.

[0016] However, this method requires that the object formed by the first resin molding be positioned with high precision when the removed glass substrate is placed back into the molding apparatus. For example, if the object is misaligned from its intended position before removal from the glass substrate, the desired object cannot be produced.

[0017] In contrast, for example, by providing a microchannel on the substrate and sequentially flowing resin into the molding section, as described in Non-Patent Document 3, it is conceivable that the resin can be replaced and molded without removing the glass substrate. For uncured resin after molding, a waste valve can be installed below the molding section, and the valve can be opened to discharge the uncured resin from the molding section.

[0018] However, this method is considered difficult to transfer when the resin has high viscosity. In addition, since this method discards uncured resin every time the resin is replaced, even when the same type of resin is reused, it is impossible to reuse the uncured resin after molding.

[0019] An object of the present invention is to provide a molding device, a liquid column moving device, a molding method, a liquid column moving method and a program that can efficiently use materials.

[0020] Means for solving problems

[0021] According to a first aspect of the present invention, a molding apparatus includes: a moving processing unit that moves a liquid column sandwiched between two substrates; and a molding unit that performs molding by converting a portion of the liquid column into a solid within a predetermined molding area.

[0022] Magnetic particles may be mixed into the liquid column.

[0023] The movement processing unit may move the liquid column by moving the magnetic body.

[0024] The movement processing unit may move the liquid column by generating a temperature gradient in the liquid column using a point heater caused by electromagnetic waves.

[0025] The invention may further include a substrate control unit configured to control the two substrates to be separated while the liquid column is sandwiched between the substrates.

[0026] According to a second aspect of the present invention, a molding device includes: a moving processing unit that moves a magnetic droplet by moving a magnetic body; and a molding unit that performs molding by converting a portion of the droplet into a solid in a predetermined molding area.

[0027] According to a third aspect of the present invention, a liquid column moving device includes a moving processing unit configured to move a magnetic liquid column sandwiched between two substrates by moving a magnetic body.

[0028] According to a fourth aspect of the present invention, a liquid column moving device includes a moving processing unit configured to move a magnetic liquid droplet by moving a magnetic body.

[0029] According to a fifth aspect of the present invention, a molding method includes: moving a liquid column sandwiched between two substrates; and performing molding by converting a portion of the liquid column into a solid in a predetermined molding area.

[0030] According to a sixth aspect of the present invention, a molding method includes: moving a magnetic droplet by moving a magnetic body; and performing molding by converting a portion of the droplet into a solid in a predetermined molding area.

[0031] According to a seventh aspect of the present invention, a method for moving a liquid column includes moving a magnetic liquid column sandwiched between two substrates by moving a magnetic body.

[0032] According to an eighth aspect of the present invention, a method for moving a liquid column includes moving a magnetic liquid droplet by moving a magnetic body.

[0033] According to a ninth aspect of the present invention, a program is provided for causing a computer to execute: moving a liquid column sandwiched between two substrates; and performing molding by converting a portion of the liquid column into a solid within a predetermined molding region.

[0034] According to a tenth aspect of the present invention, a program is provided for causing a computer to execute: moving a magnetic droplet by moving a magnetic body; and performing shaping by converting a portion of the droplet into a solid within a predetermined shaping region.

[0035] According to an eleventh aspect of the present invention, a program is provided for causing a computer to execute a program for moving a magnetic body to move a liquid column having magnetism and sandwiched between two substrates.

[0036] According to a twelfth aspect of the present invention, a program is provided for causing a computer to execute the operation of moving a magnetic body to move a liquid droplet having magnetism.

[0037] Effects of the Invention

[0038] According to the embodiment of the present invention, materials can be used efficiently. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a figure which shows the structural example of the modeling system of 1st embodiment.

[0040] Figure 2 This is a diagram showing an example of the position where the focal point of the laser beam is focused in the molding part according to the first embodiment.

[0041] Figure 3 This is a diagram showing an example of magnetic driving of a liquid column according to the first embodiment.

[0042] Figure 4 This is a diagram showing an example of the positional relationship between the laser beam emitting portion and the liquid column of the molding portion according to the first embodiment.

[0043] Figure 5 It is a diagram showing a configuration example of the observation section according to the first embodiment.

[0044] Figure 6 This is a flowchart showing an example of the operation of the molding system according to the first embodiment.

[0045] Figure 7 This is a diagram showing an example of the relationship between the angle of the shaping beam and the focal position according to the first embodiment.

[0046] Figure 8 This is a diagram showing an experimental example of the relationship between the amount of iron powder mixed and the moving speed of the liquid column in the first embodiment.

[0047] Figure 9 This is a diagram showing a first example of a solid object molded using the molding system of the first embodiment.

[0048] Figure 10 This is a diagram showing a second example of a solid object molded using the molding system of the first embodiment.

[0049] Figure 11 This is a diagram showing an example of a movement processing unit according to the second embodiment.

[0050] Figure 12 It is a figure which shows the example of the shape of the heating beam irradiated by the moving processing part of 2nd Embodiment.

[0051] Figure 13This is a diagram showing an example of a temperature gradient generated by irradiation with a heating beam according to the second embodiment.

[0052] Figure 14 This is a diagram showing a first example of the force relationship of the liquid column according to the second embodiment.

[0053] Figure 15 This is a diagram showing a second example of the force relationship of the liquid column in the second embodiment.

[0054] Figure 16 It is a diagram showing a configuration example of a molding system according to a third embodiment.

[0055] Figure 17 This is a diagram showing an example of the focal position of a laser beam from a molding portion according to the third embodiment.

[0056] Figure 18 This is a diagram showing an example of the relationship between the substrate 810 and droplets according to the fourth embodiment.

[0057] Figure 19 A schematic block diagram showing an example of the configuration of a computer according to at least one embodiment.

[0058] Explanation of symbols

[0059] 1: Modeling system

[0060] 100: Modeling device

[0061] 110: Modeling Department

[0062] 120: Mobile Processing Department

[0063] 121: Magnetic body

[0064] 122: Mask

[0065] 130: Heater

[0066] 131, 131A, 131B: Support platform

[0067] 150: Observation Department

[0068] 151: Observe the light source

[0069] 152: Beam splitter

[0070] 153: Observation lens

[0071] 154: CCD camera

[0072] 155: Display device

[0073] 200: Control device

[0074] 210: Display unit

[0075] 220: Operation input unit

[0076] 230: Substrate control unit

[0077] 280: Storage

[0078] 290: Processing Department

[0079] 700: Computer

[0080] 710: CPU

[0081] 720: Main storage device

[0082] 730: Auxiliary storage device

[0083] 740: Interface

[0084] 810, 810A, 810B: Substrate

[0085] 820: Liquid Column

[0086] 830: Droplets

[0087] 840: Solid matter

[0088] 900: Die-hard fans DETAILED DESCRIPTION

[0089] The following describes embodiments of the present invention. However, the following embodiments do not limit the scope of the invention as defined in the claims. Furthermore, the solution to the problem does not necessarily require all combinations of the features described in the embodiments.

[0090] <First embodiment>

[0091] (Configuration of the Molding System of the First Embodiment)

[0092] Figure 1 It is a figure which shows the structural example of the modeling system of 1st embodiment.

[0093] exist Figure 1 In the illustrated configuration, the molding system 1 includes a molding apparatus 100 and a control apparatus 200. The molding apparatus 100 includes a molding unit 110, a movement processing unit 120, and an observation unit 150. The control apparatus 200 includes a display unit 210, an operation input unit 220, a storage unit 280, and a processing unit 290.

[0094] The molding system 1 converts a portion of a liquid column into a solid to create a target object. An example of a liquid column is a columnar liquid formed by sandwiching a liquid between two substrates. Furthermore, a liquid column has magnetic properties. For example, a mixture of iron powder and a non-magnetic liquid can be formed into a liquid column. Iron powder is an example of a magnetic particle.

[0095] The molding device 100 is a device that creates a target object under the control of the control device 200. Specifically, the molding device 100 shapes the target object by converting a portion of a liquid column of one or more materials into a solid. Molding, as used herein, refers to the creation of an object with a given shape.

[0096] The shaping unit 110 performs shaping by converting a portion of the liquid column into a solid within a predetermined shaping area. Specifically, a laser beam is directed toward the liquid column and the laser beam is focused within the liquid column, thereby converting a portion of the liquid column into a solid at the focal point. The shaping area herein refers to the area where the shaping unit 110 can convert the material into a solid. Specifically, the shaping area is the area where the shaping unit 110 can focus the laser beam.

[0097] Laser beam is also simply called laser.

[0098] Hereinafter, the case where the material forming the liquid column is a photocurable resin and the shaping unit 110 solidifies the photocurable resin from liquid to solid by light shaping will be described as an example.

[0099] However, the shaping method performed by the shaping unit 110 is not limited to a specific method as long as it can convert the liquid column into a solid. For example, the shaping method performed by the shaping unit 110 can be photopolymerization, photocrosslinking, photoreduction, photo-induced aggregation, or a combination thereof.

[0100] Furthermore, the laser beam used for shaping can be any laser beam that can solidify the material and is not limited to a specific wavelength. For example, the shaping unit 110 can use an ultraviolet laser beam or a blue laser beam. Alternatively, the shaping unit 110 can use a near-infrared femtosecond-pulse laser beam and perform shaping using a two-photon shaping method using two-photon absorption.

[0101] Figure 2 This is a diagram showing an example of the position where the shaping unit 110 focuses the laser beam. Figure 2 The laser beam emitting portion of the molding unit 110 is shown in the figure. Substrate 810 is a glass plate used as a substrate for molding an object. Molding apparatus 100 includes substrates 810A and 810B as substrates 810. Substrates 810A and 810B sandwich a liquid column 820. The laser beam emitted by molding unit 110 is also referred to as molding beam B1.

[0102] The substrate 810 may be configured as a part of the molding device 100 or may be configured as a component separate from the molding device 100 .

[0103] Figure 2 The figure shows an example of a lateral (horizontal) view of the molding unit 110, the moving processing unit 120, the substrate 810, and the liquid column 820. The moving processing unit 120 includes a magnetic body 121. Examples of the magnetic body 121 include a permanent magnet, an electromagnet, or a neodymium magnet. When describing the magnetic body, it will also be simply referred to as a magnet.

[0104] exist Figure 2 The shaping unit 110 shown in FIG. irradiates the liquid column 820, which has been transmitted by the shaping beam B1, with the shaping beam B1 from below the substrate 810A, focusing the beam within the liquid column 820. The shaping beam B1 irradiated by the shaping unit 110 is focused on point P11. This causes the portion of the liquid column 820 at point P11 to transform from liquid to solid.

[0105] The laser beam emitting portion of the shaping portion 110 can be directed toward Figure 2 Move forward, backward, left and right. Figure 2 The front, back and left and right of the beam B1 can be horizontal directions. Figure 2 Move up and down. Figure 2 Therefore, the shaping unit 110 can move the focal position of the shaping beam B1 in three dimensions: up and down, left and right, and front and back.

[0106] The shaping unit 110 can process the material into the shape of the target object by moving the focal position of the shaping beam B1 along the shape of the target object within the liquid column 820 .

[0107] In addition to or in lieu of moving the laser beam emitting portion of the shaping unit 110, the focal position of the shaping beam B1 may be changed using a galvanometer mirror. Furthermore, in addition to or in lieu of the above methods, the shaping unit 110 may also change the focal position of the shaping beam B1 in the liquid column 820 by moving the substrate 810, moving the laser beam focusing lens in the direction of the optical axis, or a combination thereof.

[0108] In addition, if Figure 2 As shown, the molding unit 110 irradiates the molding beam B1 from the underside of the substrate 810. The focal position of the molding beam B1 is not affected by refraction due to the shape of the liquid column 820 caused by surface tension. This allows the molding system 1 to accurately align the focal position of the molding beam B1.

[0109] Iron powder 900 is mixed in the liquid column 820 and is attracted to a position close to the magnetic body 121 by the magnetic force of the magnetic body 121. Figure 2 In the illustrated example, the magnetism of the magnetic body 121 causes a plurality of iron powders 900 to aggregate and form a mass. The size and shape of the iron powders 900 can be adjusted to suit the size and shape of the object to be molded using the molding system 1. Furthermore, the amount of iron powders 900 can be adjusted to suit the surface tension and viscous friction of the liquid forming the liquid column 820.

[0110] exist Figure 2 In the example, the shaping unit 110 is located below the substrate 810A and the moving processing unit 120 is located above the substrate 810B, but the positional relationship is not limited to this. For example, the shaping unit 110 may be located above the substrate 810B and the moving processing unit 120 may be located below the substrate 810A.

[0111] Furthermore, the shaping unit 110 and the moving processing unit 120 may be disposed below the substrate 810A. In this case, the shaping unit 110 and the moving processing unit 120 may be disposed at separate locations to prevent the shaping beam B1 from being irradiated onto the iron powder 900 .

[0112] Alternatively, the shaping unit 110 and the moving processing unit 120 may be disposed above the substrate 810B. In this case, the shaping unit 110 and the moving processing unit 120 may be disposed at separate locations to prevent the shaping beam B1 from being irradiated onto the iron powder 900.

[0113] Figure 3 is a diagram showing an example of magnetic driving of a liquid column 820.

[0114] exist Figure 3 In the example shown, iron powder 900 is mixed in a liquid column 820 of resin sandwiched between substrates 810A and 810B. When the processing unit 120 moves the magnetic body 121 close to the liquid column 820, the iron powder 900 inside the liquid column 820 becomes magnetic and is attracted by the magnetic body 121.

[0115] like Figure 3 As shown, when the moving processing unit 120 moves the magnetic body 121 in the direction A, the iron powder 900 pushes the side of the liquid column 820 with a force F m Pull the liquid column 820 as a whole. m Viscous friction F greater than the liquid column 820 drag1 and F drag2 and surface tension γ s1 , γ s2 , γ s3 and γ s4When the combined force of F is greater than 1 / 2, the liquid column 820 will move in the direction of movement of the magnetic body 121. m Greater than F drag1 and F drag2 and γ s1 , γ s2 , γ s3 and γ s4 When the combined force of m The molding system 1 can move the liquid column 820 in the same direction as the direction A by operating the magnetic body 121 and moving the liquid column 820 in the horizontal direction, for example, by using the above-mentioned driving principle.

[0116] Figure 4 1 and 2 are diagrams showing an example of the positional relationship between the laser beam emitting portion of the molding unit 110 and the liquid column 820 . Figure 4 An example of a laser beam emitting portion of the molding unit 110 as viewed from obliquely above is shown.

[0117] exist Figure 4 In the example, the substrate 810A is located above the laser beam emitting portion of the molding unit 110, and four liquid columns 820 made of different materials are sandwiched between the substrate 810A and the substrate 810B.

[0118] The four liquid columns 820 are a liquid column 820-11 of a first material, a liquid column 820-12 of a second material, a liquid column 820-13 of a third material, and a liquid column 820-14 of a fourth material. The first material, the second material, the third material, and the fourth material may be materials of the same composition or materials of different compositions.

[0119] exist Figure 4 In the example shown, the first material liquid column 820-11, the third material liquid column 820-13, and the fourth material liquid column 820-14 are photocurable resin liquid columns 820, and the second material liquid column 820-12 is a cleaning liquid containing components capable of cleaning substrates 810A and 810B.

[0120] Iron powder 900-11 is mixed in the liquid column 820-11, and iron powder 900-12 is mixed in the liquid column 820-12. Furthermore, iron powder 900-13 is mixed in the liquid column 820-13, and iron powder 900-14 is mixed in the liquid column 820-14.

[0121] exist Figure 4 In the illustrated state, iron powders 900-12, 900-13, and 900-14 are all located away from magnetic body 121, and are less affected by the magnetic force of magnetic body 121. Consequently, iron powders 900-12, 900-13, and 900-14 are all precipitated by gravity below liquid column 820 (at or near the bottom).

[0122] On the other hand, the iron powder 900 - 11 is attracted toward the magnetic body 121 by the magnetic force of the magnetic body 121 .

[0123] The magnetic body 121 moves in the direction C1 or the direction C2 or a combination thereof, thereby moving the iron powder 900 by magnetic force. The magnetic body 121 moves the iron powder 900, and the liquid column 820 mixed with the iron powder 900 moves.

[0124] Liquid column 820-11 of the first material within liquid column 820 is positioned above the laser beam emitting portion of molding section 110. Molding section 110 irradiates molding beam B1 and focuses the molding beam B1 within liquid column 820-11 of the first material. As a result, the focused portion within liquid column 820-11 transforms from liquid to solid, thereby generating solid object 840.

[0125] Next, an example of the operation of the molding system 1 will be described.

[0126] The molding system 1 uses the magnetic body 121 to move the liquid column 820-11 from position D to above the molding section 110, which is the molding area. Furthermore, the molding system 1 transforms a portion of the liquid column 820-11 from liquid to solid in the molding area, molding a solid object 840, which is part of the three-dimensional model.

[0127] The molding system 1 moves the magnetic body 121 from position D to above the molding section 110. The iron powder 900-11 mixed in the liquid column 820-11 is moved from position D to above the molding section 110 by the magnetic force of the magnetic body 121. Since the iron powder 900-11 moves from position D to above the molding section 110, the liquid column 820-11 mixed with the iron powder 900-11 is also pulled by the iron powder 900-11 and moves from position D to above the molding section 110.

[0128] After molding system 1 molds solid object 840, it uses magnetic body 121 to move the remaining uncured liquid column 820-11 from above molding section 110, serving as the molding area, to position D. Next, molding system 1 uses magnetic body 121 to move liquid column 820-12 of cleaning liquid above molding section 110, serving as the molding area. This movement of cleaning liquid cleans the remaining liquid resin from solid object 840. Since iron powder 900-12 is also mixed in liquid column 820-12, molding system 1 also uses magnetic body 121 to move it in the same manner as liquid column 820-11.

[0129] After the solid object 840 is cleaned, the molding system 1 uses the magnetic body 121 to move the liquid column 820-12 of the cleaning liquid to another place. For example, the molding system 1 moves the liquid column 820-12 of the cleaning liquid to Figure 4 The original position is shown.

[0130] Thereafter, the molding system 1 uses the magnetic body 121 to move the liquid column 820 - 13 , which is a new resin, to above the molding section 110 , which is a molding area, and restarts molding of the solid object 840 .

[0131] The molding system 1 molds the solid object 840 of a three-dimensional model integrally using a plurality of resins by repeating the above steps.

[0132] The molding system 1 allows for contactless resin replacement, eliminating the need for the contact step described below: During molding, the substrate 810 is removed from the molding apparatus 100, uncured resin is cleaned, and new resin is dripped in to restart the molding process. The term "contactless" here refers to the user of the molding system 1, acting as an operator, not directly touching the substrate 810. This method prevents displacement of the solid object 840, the molding object, in the molding system 1, allowing for multi-material molding while reusing uncured resin.

[0133] If the molding system 1 uses the two-photon molding method described above, the solid object 840 as the molding object needs to stay in the molding area of ​​the substrate 810. Figure 4 As shown, if the molding system 1 uses a plurality of liquid columns 820 , the liquid columns 820 need not stay in the molding area of ​​the substrate 810 to prevent the plurality of liquid columns 820 from mixing.

[0134] Therefore, surface treatment can be applied so that the solid object 840 remains in the formation area relative to the substrate 810, while the liquid column 820 moves in a manner that does not remain in the formation area of ​​the substrate 810. In this case, various surface treatments can be used depending on the location on the surface of the substrate 810. For example, a methacrylate-based treatment that exhibits high adhesion to the photocurable resin used as the material for the liquid column 820 can be applied to the surface of the substrate 810A near the center of the surface, near the area where the solid object 840 is formed by laser irradiation. On the other hand, a fluorine coating treatment that exhibits low adhesion to the photocurable resin can be applied to other areas of the surface of the substrate 810A and the surface of the substrate 810B where the liquid column 820 is moved using the magnetic body 121. By applying such surface treatments, it is possible to achieve a balance between adhesion between the solid object 840 and the substrate 810 and movement of the liquid column 820.

[0135] The observation unit 150 captures an image of the target object.

[0136] Figure 5 1 is a diagram showing an example of the configuration of the observation unit 150. Figure 5 In the example shown in FIG. 1 , the observation unit 150 includes an observation light source 151 , a beam splitter 152 , an observation lens 153 , a CCD camera 154 , and a display device 155 .

[0137] The observation light source 151 emits illumination light B13 for capturing an image of a target object. The target object may be an object being shaped. The illumination light B13 is directed toward the target object. After a portion of the illumination light B13 is reflected or absorbed, the remaining light passes through the laser beam emitting portion of the sculpting unit 110 and enters the beam splitter 152.

[0138] exist Figure 5 In the example, the observation light source 151 is located above the modeling area.

[0139] The beam splitter 152 includes a half-mirror that reflects the illumination light B13. In addition to the illumination light B13, the beam splitter 152 also receives the shaping beam B1. The beam splitter 152 allows the shaping beam B1 to pass through and advance toward the laser beam emitting portion of the shaping unit 110. By reflecting the illumination light B13, the beam splitter 152 redirects the illumination light B13, which travels along the same path as the shaping beam B1 in a direction opposite to that of the shaping beam B1, toward a direction different from that of the shaping beam B1.

[0140] The observation lens 153 refracts the illumination light B13 to form an image of the illumination light B13 at the position of the imaging element of the CCD camera 154 .

[0141] The CCD camera 154 receives the illumination light B13 and performs photoelectric conversion to generate image data of the target object.

[0142] The display device 155 includes a display screen such as a liquid crystal panel or an LED panel, and displays an image of the object. Specifically, the display device 155 receives image data of the object generated by a CCD camera and displays the image represented by the image data.

[0143] However, the configuration and arrangement of the observation unit 150 are not limited to Figure 5 For example, the observation unit 150 can photograph the target from above, or from obliquely above or below.

[0144] The control device 200 controls the shaping device 100 to create the target object. For example, the control device 200 controls the timing at which the shaping unit 110 irradiates the shaping beam B1 and the focal position of the shaping beam B1. Furthermore, the control device 200 controls the position of the magnetic body 121 included in the moving processing unit 120 by controlling the position of the moving processing unit 120.

[0145] Furthermore, the control device 200 functions as a user interface of the molding system 1. The control device 200 is configured using a computer such as a personal computer (Personal Computer) or a workstation (Workstation).

[0146] The display unit 210 has a display screen such as a liquid crystal panel or an LED panel, and displays various images. In particular, the display unit 210 presents information related to the modeling system 1 to the user.

[0147] The display unit 210 may be configured using the display device 155 or may be configured separately from the display device 155 .

[0148] The operation input unit 220 includes input devices such as a keyboard and a mouse, and receives user operations. In particular, the operation input unit 220 receives user operations to perform settings related to the modeling system 1.

[0149] The storage unit 280 stores various data and is configured using a storage device included in the control device 200 .

[0150] Processing unit 290 controls each unit of control device 200 and executes various processes. The functions of processing unit 290 are performed by a CPU (Central Processing Unit) included in control device 200 reading and executing a program from storage unit 280.

[0151] The control device 200 can automatically control the molding device 100 based on a pre-set program, etc. Alternatively, a user can input instructions to the control device 200 online, so that the control device 200 controls the molding device 100 according to the user's instructions.

[0152] exist Figure 5 Although the iron powder 900 is not shown in the figure, the iron powder 900 is mixed in the liquid column 820 .

[0153] The division of processing for controlling the various components of the molding apparatus 100 between the molding apparatus 100 and the control apparatus 200 is not limited to a specific division. For example, the control apparatus 200 may fully control the various components of the molding apparatus 100. Alternatively, the molding apparatus 100 and the control apparatus 200 may jointly control the various components of the molding apparatus 100. For example, the molding apparatus 100 may perform lower-level control of the various components of the molding apparatus 100, while the control apparatus 200 may perform higher-level control. Alternatively, the molding apparatus 100 may perform control of the various components of the molding apparatus 100, such as by integrating the molding apparatus 100 and the control apparatus 200.

[0154] Next, regarding the operation of the molding system 1, refer to Figure 6 Provide explanation.

[0155] Figure 6 This is a flowchart showing an example of the operation of the molding system 1. Figure 6 The display control device 200 controls an example of a process procedure of the modeling device 100 to generate an object.

[0156] exist Figure 6 During the molding process, the control device 200 controls the molding unit 110 to perform the molding process (step S101). Under the control of the control device 200, the molding unit 110 irradiates the liquid column 820 within the molding area with the molding beam B1, focusing the molding beam B1 within the resin liquid column 820. The material transforms from liquid to solid at the focal position.

[0157] Next, the control device 200 controls the movement processing unit 120 to withdraw the resin column 820 outside the molding area (the withdrawal area) (step S102). The movement processing unit 120 moves the liquid column 820 in the molding area outside the molding area under the control of the control device 200.

[0158] Next, the control device 200 controls the movement processing unit 120 to move the liquid column 820 of the cleaning liquid (step S103 ). In this way, the molding system 1 cleans the solid object 840 in the molding area.

[0159] Next, the control device 200 controls the movement processing unit 120 to retract the liquid column 820 of the cleaning liquid (step S104 ).

[0160] Next, the user of the modeling system 1 determines whether the target object is completed (step S105). If it is determined that the target object is completed (step S105: Yes), the process ends. Figure 6 processing.

[0161] On the other hand, if the target object is determined to be unfinished (step S105: No), the control device 200 controls the movement processing unit 120 to move the next resin liquid column 820 to the molding area (step S106). Under the control of the control device 200, the movement processing unit 120 moves the next resin liquid column 820 from outside the molding area to the molding area.

[0162] After step S106 , the process returns to step S101 .

[0163] The laser beam emitting portion of the shaping section 110 can change the angle at which the shaping beam B1 is emitted.

[0164] Figure 7 This is a diagram showing an example of the relationship between the angle of the shaping beam B1 and the focal position.

[0165] exist Figure 7 In the example, the laser beam emitting portion of the shaping unit 110 functions as an objective lens, and the laser beam is emitted from the side opposite to the liquid column 820 ( Figure 7 The incident shaping beam B1 is refracted to the side of the liquid column 820 ( Figure 7 irradiation on the upper side).

[0166] Using Θ I θ represents the incident angle of the shaping beam B1 toward the laser beam emitting portion of the shaping unit 110. O The emission angle θ represents the emission angle of the shaping beam B1 from the laser beam emitting portion of the shaping unit 110. O According to the incident angle Θ I As the exit angle Θ O Therefore, the shaping unit 110 changes the incident angle θ of the shaping beam B1 toward the laser beam emitting portion by changing the incident angle θ of the shaping beam B1 toward the laser beam emitting portion. I , the position of the focal point of the shaping beam B1 can be changed without changing the position of the laser beam emitting portion and the position of the substrate 810.

[0167] As the incident angle Θ changes I For example, a method of placing a reflecting mirror between the light source of the shaping beam B1 and the laser beam emitting portion of the shaping section 110 and changing the direction of the reflecting mirror may be used.

[0168] Next, an experimental example of the relationship between the amount of iron powder 900 mixed into the liquid column 820 and the moving speed of the liquid column 820 made of different materials will be described.

[0169] Figure 8 This is a diagram showing an example of the relationship between the amount of iron powder 900 mixed in and the moving speed of the liquid column 820 . Figure 8 This is an experimental example showing the relationship between the amount of iron powder 900 mixed in and the upper limit speed at which the liquid column 820 can move, for liquid columns 820 made of different materials. Figure 8 In the graph of FIG. 8 , the horizontal axis represents the amount of iron powder 900 mixed in, and the vertical axis represents the moving speed of the liquid column 820 .

[0170] exist Figure 8 In the experimental example shown, fluorine-coated cover glass was used as substrates 810A and 810B. The volume of liquid column 820 was set to 6 microliters (μL), and the distance between substrates 810A and 810B was set to 1 millimeter (mm). The volume of liquid column 820 includes the amount of iron powder 900 mixed in liquid column 820.

[0171] The materials used for the liquid column 820 are pure water, ethanol, low-viscosity photocurable resin, and high-viscosity photocurable resin. The symbols E, F, G, and H are used to represent pure water, ethanol, low-viscosity photocurable resin, and high-viscosity photocurable resin, respectively.

[0172] Pure water E and ethanol F were used to compare surface tension. Low-viscosity resin G and high-viscosity resin H were used to compare viscosity. In addition, a neodymium magnet having a magnetic flux density of 280 millitesla (mT) was used as the magnetic body 121 .

[0173] First, the upper limit of the speed at which the iron powder 900 can move without separating from the liquid column 820 was investigated for the iron powder 900 mixed in the liquid column 820 at 5 g / L, 10 g / L, 20 g / L, and 30 g / L. Figure 8 As shown, it was found that, in any material, as the amount of iron powder 900 mixed in increases, the upper limit speed at which the liquid column 820 can move increases.

[0174] Regarding the difference in surface tension, when the amount of iron powder 900 mixed is approximately 24 g / L or less, the moving speed of ethanol F is higher, while when the amount of iron powder 900 mixed is approximately 24 g / L or more, the moving speed of pure water E is higher. When the amount of iron powder 900 mixed is small, it is believed that the surface tension of pure water E is greater than that of ethanol F, and the surface tension γ of the receding angle caused by the deformation of the liquid column 820 is greater than that of the pure water E. S1 (Please refer to Figure 3 On the other hand, when the amount of iron powder 900 mixed is large, it is considered that the surface tension γ is larger than the magnetic force applied to the liquid column 820. S1 The smaller the value, the faster the pure water E moves.

[0175] Regarding the difference in viscosity, regardless of the amount of iron powder 900, the movement speed of the high-viscosity resin H is slower than that of the low-viscosity resin G. This is believed to be because the higher viscosity results in greater viscous resistance, making it difficult to move.

[0176] Hereinafter, an example of a solid object 840 formed by using the forming system 1 will be described. Figure 9 and Figure 10 One example demonstrates multi-material molding using magnetic actuation of a liquid column 820. This multi-material molding utilizes a liquid column 820 composed of two photocurable resins (an acrylate resin and a methacrylate resin) and a cleaning liquid. The amount of resin used for the movement was 6 μL, and the amount of iron powder 900 mixed was 23 g / L.

[0177] Figure 9 FIG. 8 is a diagram showing a first example of a solid object 840 molded using the molding system 1 .

[0178] exist Figure 9In the example shown, the YNU model M1 in the first row and the YNU model M3 in the third row were molded using colorless acrylic resin, while the YNU model M2 in the second row was molded using red-dyed methacrylate resin. This experimental result confirms that different resin materials can be used for molding within the same plane.

[0179] Figure 10 FIG. 8 is a diagram showing a second example of a solid object 840 molded using the molding system 1 .

[0180] exist Figure 10 In the example shown, a four-level pyramid model was modeled as a three-dimensional microstructure. The resin was replaced three times, alternating between the red-dyed methacrylate resin (M4) and the colorless acrylic resin (M5). This experimental result demonstrates that this method can achieve multi-material modeling, even for three-dimensional structures.

[0181] The molding apparatus 100 including the movement processing unit 120 described in the above embodiment corresponds to an example of a liquid column moving apparatus.

[0182] (Effects of the First Embodiment)

[0183] The molding apparatus 100 of the first embodiment includes a moving processing unit 120 that moves a liquid column 820 sandwiched between two substrates 810, and a molding unit 110 that performs molding by partially converting the liquid column 820 into a solid within a predetermined molding area.

[0184] The molding apparatus 100 can move and process a liquid column 820 sandwiched between two substrates 810. This allows the user of the molding apparatus 100 to minimize misalignment of the molded object, resin waste, and material mixing by simply moving the liquid column 820. Furthermore, the user can use the liquid column 820 to generate a solid object 840 at a low cost.

[0185] Furthermore, magnetic particles are mixed in the liquid column 820 .

[0186] In this way, the user of the molding device 100 can use a magnetic object to move the magnetic particles mixed in the liquid column, thereby easily moving the liquid column 820. Furthermore, since this does not involve heat, the liquid column 820 of a volatile material, an aqueous liquid column 820, or a biopolymer liquid column 820 can also be moved.

[0187] Furthermore, the movement processing unit 120 moves the liquid column 820 by moving the magnetic body 121 .

[0188] Thus, the user of the molding apparatus 100 can easily move the liquid column 820 using the magnetic body 121 .

[0189] <Second embodiment>

[0190] (Configuration of the Molding System of the Second Embodiment)

[0191] The method by which the moving processing unit 120 moves the liquid column 820 is not limited to the above-described method using the magnetic body 121. In the second embodiment, a case where the moving processing unit 120 moves the liquid column 820 using the spot heater 130 will be described.

[0192] Thus, in the second embodiment, the method by which the movement processing unit 120 moves the liquid column 820 differs from that in the first embodiment. Consequently, in the second embodiment, the liquid column 820 does not need to be magnetic. In the second embodiment, the case where iron powder is not mixed in the liquid column 820 is described as an example.

[0193] Otherwise, the molding system 1 of the second embodiment is the same as the molding system 1 of the first embodiment.

[0194] Figure 11 1 is a diagram showing an example of the movement processing unit 120 according to the second embodiment. Figure 11 In the illustrated example, the movement processing unit 120 includes an electromagnetic wave spot heater 130. Spot heater 130 uses electromagnetic waves, such as far-infrared radiation or a laser beam from a carbon dioxide gas laser, to heat the liquid column 820. Heating by spot heater 130 creates a temperature gradient in the liquid column 820, causing the liquid column 820 to move.

[0195] Spot heater 130 irradiates the liquid column 820 with a heating laser beam, surrounding the liquid column 820 in the horizontal direction. This causes motion processing unit 120 to generate a temperature gradient in the horizontal direction of the liquid column 820, causing the temperature at the periphery to be higher than that at the center. The term "peripheral" refers to the side of liquid column 820 closer to the boundary between the liquid column 820 and the outside. The term "center" refers to the side of liquid column 820 farther from the boundary between the liquid column 820 and the outside.

[0196] This temperature gradient can prevent the liquid column 820 from expanding in the horizontal direction when the liquid column 820 is heated.

[0197] Hereinafter, when describing the positional relationship of horizontal liquid column 820, the phrase "in the horizontal direction" may be omitted. For example, the periphery of horizontal liquid column 820 is simply referred to as the periphery of liquid column 820. The peripheral side of horizontal liquid column 820 is simply referred to as the peripheral side of liquid column 820. The center side of horizontal liquid column 820 is simply referred to as the center side of liquid column 820. The extension of horizontal liquid column 820 is simply referred to as the extension of liquid column 820.

[0198] In addition, the electromagnetic waves irradiated by the spot heater 130 are also simply referred to as heating beams.

[0199] Figure 12 : is a diagram showing an example of the shape of the heating beam irradiated by the mobile processing unit 120. Figure 12 In the example shown in FIG. 8 , the liquid column 820 is located above the substrate 810A, and the spot heater 130 irradiates the liquid column 820 with the heating beam B12 .

[0200] However, spot heater 130 does not irradiate heating beam B12 directly onto liquid column 820, but rather irradiates it around liquid column 820. A cavity (a portion not irradiated by heating beam B12) is formed within heating beam B12, and liquid column 820 is located within this cavity. The cavity in heating beam B12 is formed when a portion of heating beam B12 irradiated by spot heater 130 is blocked by mask 122.

[0201] like Figure 12 For example, a case where the spot heater 130 irradiates the periphery of the liquid column 820 with the heating beam B12 is also described as the spot heater 130 irradiating the liquid column 820 with the heating beam B12 .

[0202] Figure 13 This is a diagram showing an example of a temperature gradient generated by irradiation with the heating beam B12. Figure 13 Display usage as Figure 12 Temperature distribution of the liquid column 820 irradiated with the heating beam B12 of the spot heater 130.

[0203] exist Figure 13 In the graph, the vertical axis represents temperature. The horizontal axis represents the horizontal position of a virtual cross section cut vertically through liquid column 820 near its center. Line T represents the temperature distribution of substrate 810B and liquid column 820 in the cross section. Specifically, line T shows the relationship between the position represented by the horizontal axis and the temperature of substrate 810B and liquid column 820.

[0204] In addition, Figure 13 In FIG, the position of the liquid column 820 is shown by illustrating the liquid column 820. Figure 12 As shown, the spot heater 130 irradiates the periphery of the liquid column 820 with the heating beam B12 , and as shown by line T, a temperature gradient is generated in which the temperature at the periphery of the liquid column 820 is higher than the temperature at the center of the liquid column 820 .

[0205] The spot heater 130 moves the heating beam B12 so that the heating beam B12 surrounds the liquid column 820. In this way, the spot heater 130 moves the liquid column 820 while preventing the liquid column 820 from expanding. Figure 14 and Figure 15Provide explanation.

[0206] Figure 14 8 is a diagram showing a first example of the force relationship of the liquid column 820. Figure 14 This shows an example of the force relationship of the liquid column 820 when the spot heater 130 does not irradiate the heating beam B12 to the liquid column 820 and the liquid column 820 is at room temperature. Figure 14 In the example, γ L γ represents the surface tension of the liquid column 820. S γ represents the surface tension of the solid (surface tension of the substrate 810). LS Θ represents the contact angle of the liquid column 820 relative to the substrate 810.

[0207] exist Figure 14 In this case, according to Young's equation, the forces within the liquid column 820 are balanced, so that the liquid column 820 does not move.

[0208] In addition, if Figure 12 For example, when the spot heater 130 irradiates the liquid column 820 with the heating beam B12 so as to surround the liquid column 820 to generate a temperature gradient and the heating beam B12 does not move, the forces in the liquid column 820 are also balanced, and the liquid column 820 does not move.

[0209] In this case, irradiation with heating beam B12 causes the temperature of the periphery of liquid column 820 to rise relative to the temperature of the center of liquid column 820. Consequently, the surface tension of the center of liquid column 820 becomes greater than the surface tension of the periphery of liquid column 820, and a force acts on liquid column 820 in a direction that maintains its shape.

[0210] On the other hand, the entire temperature of the liquid column 820 is increased by irradiation with the heating beam B12. This temperature increase increases the surface tension ( Figure 14 γ L ) decreases, the contact angle (θ) of liquid column 820 with respect to substrate 810 decreases, and a force acts in the direction of expansion of liquid column 820. This force that causes liquid column 820 to expand due to the increase in temperature of liquid column 820 is balanced by the force that causes liquid column 820 to maintain its shape due to the increase in surface tension at the center of liquid column 820 as described above, and liquid column 820 is prevented from expanding further.

[0211] Figure 15 8 is a diagram showing a second example of the force relationship of the liquid column 820. Figure 15 An example of the force relationship of the liquid column 820 when the spot heater 130 moves the heating beam B12 to generate a temperature gradient at the end of the liquid column 820 is shown. Figure 15 The heater 130 directs the heating beam B12 toward the Figure 15In the case of rightward movement, at the left and right ends of the liquid column 820, Figure 15 The temperature at the left end is higher than Figure 15 The temperature of the right end.

[0212] Use in Figure 14 The variable name used in the variable name is appended with <'> to show the lower temperature side ( Figure 15 Specifically, γ' L γ' represents the surface tension of the liquid column 820. S γ' represents the surface tension of the solid (surface tension of the substrate 810). LS Θ' represents the contact angle of the liquid column 820 relative to the substrate 810.

[0213] On the other hand, appending <"> to the variable name shows the side with higher temperature ( Figure 15 Specifically, γ" L Represents the surface tension of the liquid column 820. γ" S γ" represents the surface tension of the solid (surface tension of the substrate 810). LS represents the solid-liquid interfacial tension. Θ” represents the contact angle of the liquid column 820 relative to the substrate 810.

[0214] exist Figure 15 In the example, the temperature T on the high temperature side is generated. H and the temperature T on the low temperature side L (T H >T L Due to this temperature difference, the contact angle and surface tension on each of the high temperature side and the low temperature side are changed from the case where the spot heater 130 does not move the heating beam B12.

[0215] On the low temperature side, the contact angle θ' increases compared to the case where the spot heater 130 does not move the heating beam B12, and the surface tension γ' between the liquid and the gas increases. L The horizontal component is reduced.

[0216] That is to say, in Figure 14 The balanced forces will change and generate the surface tension γ' of the solid S The same direction and direction Figure 15 On the other hand, on the high temperature side, the contact angle Θ" becomes smaller than when the spot heater 130 does not move the heating beam B12, and the surface tension γ" between the liquid and the gas becomes smaller. L That is, in Figure 14 The balanced forces will change and generate surface tension γ"S The direction is opposite to that of Figure 15 The force on the right side.

[0217] Since the forces generated on the low temperature side and the high temperature side are both directed to the right, the combined force of the two is also directed to the right. The liquid column 820 uses this force as a driving force to Figure 15 Specifically, the liquid column 820 moves in accordance with the movement of the heating beam B12 so as to remain located in the cavity inside the heating beam B12.

[0218] While the above description focuses on a method of generating a temperature gradient by heating the liquid column 820 in a manner surrounding the liquid column 820, the method of heating the liquid column 820 is not limited to heating the liquid column 820 in a manner surrounding the liquid column 820. For example, the molding system 1 can generate a temperature gradient in the liquid column 820 by heating any portion of the substrate 810 or the liquid column 820 using a carbon dioxide gas laser, thereby moving the liquid column 820.

[0219] (Effects of the Second Embodiment)

[0220] The movement processing unit 120 of the molding apparatus 100 according to the second embodiment generates a temperature gradient in the liquid column 820 by using the spot heater 130 caused by electromagnetic waves, thereby moving the liquid column 820 .

[0221] In this manner, the user of the molding apparatus 100 can move the liquid column 820 using the laser light of the spot heater 130 caused by electromagnetic waves.

[0222] <Third embodiment>

[0223] (Configuration of the Molding System of the Third Embodiment)

[0224] The third embodiment will be described below. In addition to the components of the control device 200 of the first embodiment, the control device 200 of the third embodiment further includes a substrate control unit 230. Accordingly, the molding system 1 of the third embodiment molds a solid object 840 by moving the substrate 810 up and down.

[0225] Figure 16 This is a schematic block diagram showing a configuration example of the molding system 1 of the third embodiment. As described above, in the third embodiment, the control device 200 includes the substrate control unit 230. Otherwise, the molding system 1 of the third embodiment is the same as the molding system 1 of the first embodiment.

[0226] For example, the substrate control unit 230 controls the two substrates 810 to separate or approach each other in a state where the liquid column 820 is sandwiched between the substrates 810 , based on a user operation received by the operation input unit 220 .

[0227] Figure 17 The figure shows an example of the focal position of the laser beam from the molding unit 110 of the third embodiment. The molding system 1 of the first embodiment molds the solid object 840 on the substrate 810A. However, Figure 17 As shown, the molding system 1 of the third embodiment molds a solid object 840 on an upper substrate 810B.

[0228] exist Figure 17 In the example of FIG, the shaping unit 110 irradiates the shaping beam B1 from one side of the substrate 810A into the liquid column 820. In this case, the substrate 810A is made of a transparent material such as glass.

[0229] On the other hand, for the substrate 810B, when light does not need to be transmitted, an opaque material can be used. Examples of opaque materials include, but are not limited to, ceramic substrates and semiconductor substrates. In addition, as examples of cases where light needs to be transmitted, reference Figure 5 The following describes a case where the light from the observation light source 151 of the observation unit 150 is irradiated from one side of the substrate 810B.

[0230] The same applies to the first and second embodiments. In the second embodiment, the surface of the substrate 810B on the liquid column 820 side only needs to be heated using the heating beam B12 from the spot heater 130, and the substrate 810B does not need to pass through the heating beam B12.

[0231] In particular, Figure 17 For example, when attaching solid object 840 to substrate 810B, since light transmission is not required, the material of substrate 810B to be processed can be varied, and molding system 1 can be used for various purposes. For example, a semiconductor substrate can be arranged as substrate 810B, and a portion of the semiconductor substrate can be coated with resin.

[0232] The substrate control unit 230 moves the substrate 810B in the vertical direction by sending an electrical signal to the actuator of the support table 131 bonded to the substrate 810B. Figure 17 In the example of , the substrate control unit 230 sends an electrical signal to the actuators of the support table 131A and the support table 131B to move the support table 131 in the Z direction, thereby moving the support table 131A and the support table 131B in the Z direction and moving the substrate 810B in the Z direction. Figure 17 In the , Z direction indicates upward. Figure 17 In the example of FIG. 8 , the substrate control unit 230 may move the substrate 810B downward in addition to moving the substrate 810B upward.

[0233] When the substrate 810B is moved vertically, the liquid column 820 remains in contact with the substrate 810B due to the viscosity between the substrate 810B and the liquid column 820. When the substrate 810B is moved upward, the liquid column 820 remains in contact with the substrate 810B, but the height of the liquid column 820 increases.

[0234] Because the working distance of the shaping beam B1 of the shaping unit 110 is limited, the height of the solid object 840 that can be shaped using the shaping unit 110 is limited. The working distance of the shaping beam B1 referred to herein is the distance from the reference position of the shaping unit 110, such as the laser beam emitting portion of the shaping unit 110, to the focal point of the shaping beam B1.

[0235] However, due to the Figure 17 The molding system 1 of the third embodiment shown generally performs molding while moving the substrate 810B in the Z direction. Therefore, the user of the molding apparatus 100 can mold a solid object 840 having a height exceeding the limit of the working distance of the molding unit 110 .

[0236] The method of performing shaping while moving the substrate 810B upward is also referred to as the pull-up method.

[0237] (Effects of the Third Embodiment)

[0238] The molding apparatus 100 of the third embodiment further includes a substrate control unit 230 that controls the two substrates 810 to separate in a state where the liquid column 820 is sandwiched between the substrates 810 .

[0239] In this manner, the user of the molding system 1 can mold the substrate 810B while moving it, thereby molding the solid object 840 having a height exceeding the limit of the working distance of the molding unit 110 .

[0240] The third embodiment can also be applied to the second embodiment. Specifically, the liquid column movement method using far-infrared ring heating, described in the second embodiment, can be used in the pull-up method described in the third embodiment. In this case, the solid object 840 can be molded through the same processing steps as described above when the third embodiment is applied to the first embodiment. When the third embodiment is applied to the second embodiment, the molding system 1 of the third embodiment is identical to the molding system 1 of the second embodiment, except that the control device 200 includes a substrate control unit 230.

[0241] <Fourth embodiment>

[0242] (Configuration of the Molding System of the Fourth Embodiment)

[0243] The molding system 1 can use liquid in the shape of a droplet instead of the liquid column 820. This point will be described in the fourth embodiment.

[0244] Figure 18 This is a diagram showing an example of the relationship between the substrate 810 and the droplets in the fourth embodiment. Figure 18 In the example shown, a droplet 830 of liquid material is located above substrate 810A. A droplet as used herein refers to a mass of liquid held together by surface tension.

[0245] The liquid material itself does not have magnetism, but iron powder 900 is mixed in. The iron powder 900 makes the liquid droplet 830 magnetic. Since the liquid droplet 830 has magnetism, the movement processing unit 120 can move the liquid droplet 830 by moving the magnetic body 121.

[0246] Figure 18 Examples and Figure 2 Compared to the example in Figure 2 In the embodiment, as the substrate 810, a substrate 810A is provided below the liquid column 820 and a substrate 810B is provided above the liquid column 820. Figure 18 In FIG. 8 , only substrate 810A is provided as substrate 810 , and no substrate corresponding to substrate 810B is provided.

[0247] Regarding the position of the mobile processing unit 120, Figure 2 In the example, as described above, the mobile processing unit 120 can be located below the substrate 810A or above the substrate 810B. Figure 18 In the example shown in FIG, the processing unit 120 may be located below the substrate 810A or above the droplet 830. The term "above the droplet 830" does not necessarily mean that the processing unit 120 is located directly above the droplet 830, but may also be located obliquely above the droplet 830.

[0248] Thus, in the fourth embodiment, only substrate 810A is provided as substrate 810 , and no substrate corresponding to substrate 810B is provided, and liquid such as material or cleaning agent is formed as droplets 830 rather than liquid columns 820 , which is different from the first embodiment.

[0249] Except for this, the molding system 1 of the fourth embodiment is the same as the molding system 1 of the first embodiment.

[0250] Regarding the position of the shaping portion 110, Figure 18In the example shown, the shaping unit 110 irradiates the shaping beam B1 from the underside of the substrate 810. After focusing, the shaping beam B1 reaches the surface of the droplet 830. Therefore, the position where the shaping beam B1 is focused is not affected by refraction caused by the shape of the droplet 830 due to surface tension. This allows the shaping system 1 to accurately align the focal position of the shaping beam B1.

[0251] However, the shaping unit 110 can also irradiate the shaping beam B1 from above the liquid droplet 830. In this way, even when the liquid droplet 830 is on an opaque object, such as when the liquid droplet 830 is dropped onto an opaque substrate 810, the shaping beam B1 can be irradiated onto the liquid droplet 830 to partially convert the material into a solid.

[0252] Alternatively, as in the case of the third embodiment, a substrate 810B may be provided, wherein the substrate 810B is configured to be spaced apart from the substrate 810A in a variable manner. Figure 17 Similarly to the case described above, the support table 131 can support the substrate 810B. Then, the substrate control unit 230 can move the support table 131 up and down to move the substrate 810B up and down.

[0253] When the distance between substrate 810B and substrate 810A is variable, substrate control unit 230 positions substrate 810B so that it can contact the liquid, thereby forming the liquid into liquid columns 820. Alternatively, substrate control unit 230 increases the distance between substrates 810A and 810B so that substrate 810B cannot contact the liquid, thereby forming the liquid into liquid droplets 830.

[0254] Thus, the molding system 1 can distinguish between using the liquid column 820 and the liquid droplet 830. For example, the molding system 1 can form the liquid droplet 830 when moving the liquid, and can form the liquid column 820 when converting a portion of the liquid into a solid.

[0255] (Effects of the Fourth Embodiment)

[0256] The molding apparatus 100 of the fourth embodiment includes a moving processing unit 120 that moves a magnetic droplet 830 by moving a magnetic body 121, and a molding unit 110 that performs molding by partially converting the droplet 830 into a solid in a predetermined molding area.

[0257] The molding apparatus 100 can move and process the droplets 830. This allows the user of the molding apparatus 100 to minimize misalignment of the molded object, resin waste, and material mixing by simply moving the droplets 830. Furthermore, the user can use the droplets 830 to generate the solid object 840 at a low cost.

[0258] Figure 19 A schematic block diagram showing an example of the configuration of a computer according to at least one embodiment.

[0259] exist Figure 19 In the illustrated configuration, the computer 700 includes a CPU (Central Processing Unit) 710 , a main storage device 720 , an auxiliary storage device 730 , and an interface 740 .

[0260] One or more of the molding device 100 and the control device 200 may be installed in the computer 700. In this case, the operations of the aforementioned processing units are stored in the form of programs in the auxiliary storage device 730. The CPU 710 reads the programs from the auxiliary storage device 730 and stores them in the main storage device 720, and executes the aforementioned processing according to the programs. Furthermore, the CPU 710 reserves storage areas corresponding to the aforementioned storage units in the main storage device 720 according to the programs.

[0261] When the modeling apparatus 100 is installed in the computer 700, the operations of the modeling unit 110, the movement processing unit 120, and the observation unit 150 are stored in the form of a program in the auxiliary storage device 730. The CPU 710 reads the program from the auxiliary storage device 730 and stores it in the main storage device 720, and executes the processing of each unit according to the program.

[0262] Furthermore, the CPU 710 reserves a storage area for processing executed by the molding apparatus 100 in the main storage device 720 according to a program. Communication between the molding apparatus 100 and other devices is performed by the interface 740 having a communication function and operating under the control of the CPU 710.

[0263] The interaction between the modeling device 100 and the user is carried out through the interface 740 including the input device and the output device and under the control of the CPU 710 , the output device presents information to the user and the input device accepts user operations.

[0264] When control device 200 is installed in computer 700, operations of processing unit 290 are stored as a program in auxiliary storage device 730. CPU 710 reads the program from auxiliary storage device 730 and stores it in main storage device 720, and executes processing of each unit according to the program.

[0265] As described above, the control device 200 may include a substrate control unit 230. When the substrate control unit 230 is installed in the computer 700, the operations of the substrate control unit 230 are stored in the form of a program in the auxiliary storage device 730. The CPU 710 reads the program from the auxiliary storage device 730 and stores it in the main storage device 720, and executes the processing of each component according to the program.

[0266] Furthermore, CPU 710 reserves a storage area in main storage device 720 for processing executed by control device 200 according to a program. Communication between control device 200 and other devices is performed by interface 740 having a communication function and operating under the control of CPU 710.

[0267] The interaction between the control device 200 and the user is performed through the interface 740 including the input device and the output device and under the control of the CPU 710 , the output device presents information to the user and the input device accepts user operations.

[0268] Furthermore, the processing of each component can be performed by storing a program for realizing all or part of the functions of the processing executed by the molding device 100 and the control device 200 on a computer-readable recording medium, and causing a computer system to read and execute the program stored on the recording medium. The "computer system" referred to here refers to hardware including the OS (Operating System) and peripheral devices.

[0269] "Computer-readable recording media" refers to removable media such as floppy disks, magneto-optical disks, ROMs (Read Only Memory), and CD-ROMs (Compact Disc Read Only Memory), as well as storage devices such as hard disks built into computer systems. Furthermore, the aforementioned program may be a program for implementing a portion of the aforementioned functions, or may be a program that implements the aforementioned functions in combination with a program pre-stored in the computer system.

[0270] As mentioned above, the embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and design changes are also included within the scope that does not depart from the gist of the invention.

[0271] Industrial Applicability

[0272] The embodiments of the present invention are applicable to a molding apparatus, a liquid column moving apparatus, a molding method, a liquid column moving method, and a program.

Claims

1. A shaping device, characterized in that: include: a moving processing unit configured to move a liquid column sandwiched between two substrates and formed into a columnar shape by surface tension; a shaping section that performs shaping by irradiating the shaping beam with a shaping beam focused within a predetermined shaping area and within the liquid column, thereby converting a portion of the liquid column into a solid, and shaping the solid to adhere to the substrate farther from the moving processing section of the two substrates; and The substrate control unit controls the movement of the substrate so that the substrate to which the solid object is attached is separated from the substrate on the side close to the shaping unit when the shaping unit is shaping.

2. The molding device according to claim 1, characterized in that Magnetic particles are mixed in the liquid column.

3. The molding device according to claim 1 or 2, characterized in that: The movement processing unit moves the liquid column by moving a magnet.

4. The molding device according to claim 1, characterized in that The movement processing unit moves the liquid column by generating a temperature gradient in the liquid column using a point heater caused by electromagnetic waves.

5. A shaping method, characterized in that: include: Moving a liquid column sandwiched between two substrates and formed into a columnar shape by surface tension; The shaping portion irradiates the shaping beam with a shaping beam focused within a predetermined shaping area and within the liquid column, thereby converting a portion of the liquid column into a solid, and shaping is performed in such a manner that the solid adheres to the substrate on the side farther from the moving processing portion than the two substrates; and During the shaping process, the movement of the substrate is controlled so that the substrate to which the solid object is attached is separated from the substrate on a side close to the shaping portion.

6. A program, characterized in that The program is used to cause a computer to execute: Moving a liquid column sandwiched between two substrates and formed into a columnar shape by surface tension; The shaping portion irradiates the shaping beam with a shaping beam focused within a predetermined shaping area and within the liquid column, thereby converting a portion of the liquid column into a solid, and shaping is performed in such a manner that the solid adheres to the substrate on the side farther from the moving processing portion than the two substrates; and During the shaping process, the movement of the substrate is controlled so that the substrate to which the solid object is attached is separated from the substrate on a side close to the shaping portion.

Images