Semiconductor module

Abstract

The semiconductor module of the present invention ensures the bending angle of the external terminals and prevents damage to the housing. The semiconductor module (1) includes: semiconductor elements (3, 4); a housing (11) for housing the semiconductor elements; and external terminals (12, 13, 14) for electrically connecting the main electrodes of the semiconductor elements to external conductors. The external terminals protrude from the upper surface of the housing and bend at a right angle along the upper surface of the housing. The housing has: a protrusion (11d) that protrudes from the upper surface of the housing at a predetermined height and serves as the bending fulcrum of the external terminals; and a slit (11e) that breaks the protrusion in a direction intersecting the protrusion direction.

Description

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[0001] The present invention relates to a semiconductor module. Background Art

[0002] A semiconductor device has a substrate provided with semiconductor elements such as an IGBT (Insulated Gate Bipolar Transistor), a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor), and a FWD (Free Wheeling Diode), and is used for an inverter device or the like.

[0003] In such a semiconductor module, semiconductor elements arranged on a prescribed substrate are accommodated in, for example, a resin-made housing member. External terminals for connection to a bus bar or the like are provided on the outer periphery of the housing member. The external terminals are formed of a metal plate and are arranged to project in the vertical direction from the upper surface of the housing. In addition, the front end of the projecting external terminal is bent at a right angle along the upper surface of the housing (see, for example, Patent Documents 1 to 3).

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Laid-Open No. 9-45831

[0007] Patent Document 2: Japanese Patent Laid-Open No. 2015-53301

[0008] Patent Document 3: Japanese Patent Laid-Open No. 2015-220188 Summary of the Invention

[0009] Problems to be Solved by the Invention

[0010] However, when bending the external terminal as described above at a right angle, if an external force is removed from the front end of the external terminal, the front end of the external terminal is slightly pushed back due to the resilience generated by the elasticity of the external terminal. As a result, the end face of the external terminal is not parallel to the upper surface of the housing, which may affect the mountability of components such as a bus bar.

[0011] Therefore, for example, in Patent Document 1, an electrode terminal as an external terminal projects from the upper surface of the housing, and a protrusion is formed at the base end portion thereof. The protrusion projects from the upper surface of the housing at a prescribed height and serves as a bending fulcrum of the electrode terminal. The height of the protrusion is set to be equal to the distance by which the front end of the external terminal returns due to the resilience after bending. Thereby, the bending angle of the electrode terminal can be controlled to be approximately a right angle.

[0012] However, the aforementioned protrusion is part of a housing formed of resin or the like. Therefore, when the external terminal is bent, stress concentrates on the protrusion, which serves as its fulcrum, and may cause breakage.

[0013] The present invention was made in view of the above-mentioned problems, and one of its objectives is to provide a semiconductor module that can ensure the bending angle of the external terminals and prevent the housing from breaking.

[0014] Solution for solving the problem

[0015] A semiconductor module according to one embodiment of the present invention includes: a semiconductor element; a housing for housing the semiconductor element; and an external terminal for electrically connecting the main electrode of the semiconductor element to an external conductor. The external terminal protrudes from the upper surface of the housing and bends at a right angle along the upper surface of the housing. The housing has: a protrusion that protrudes from the upper surface of the housing at a predetermined height and serves as the bending fulcrum of the external terminal; and a slit that disconnects the protrusion in a direction intersecting the protrusion direction.

[0016] The effects of the invention

[0017] According to the present invention, the bending angle of the external terminals can be ensured and the housing can be prevented from breaking. Attached Figure Description

[0018] Figure 1 This is a perspective view of the semiconductor module involved in this embodiment.

[0019] Figure 2 This is a top view of the semiconductor module involved in this embodiment.

[0020] Figure 3 It is self Figure 2 The semiconductor module shown is a top view with its housing removed.

[0021] Figure 4 This is a top view of the periphery of the external terminals involved in this embodiment.

[0022] Figure 5 yes Figure 4 A partial cross-sectional view of the periphery of the external terminals.

[0023] Figure 6 This is an example of an action transition diagram illustrating the bending process of an external terminal.

[0024] Figure 7 This is a structural diagram of the area surrounding the external terminals as described in the reference example.

[0025] Figure 8This is a structural diagram of the area surrounding the external terminals involved in this embodiment.

[0026] Figure 9 This is a structural diagram of the area surrounding the external terminals involved in the modified example.

[0027] Figure 10 This is a structural diagram of the area surrounding the external terminals involved in the modified example.

[0028] Figure 11 This is a structural diagram of the area surrounding the external terminals involved in the modified example.

[0029] Figure 12 This is a structural diagram of the area surrounding the external terminals involved in the modified example.

[0030] Figure 13 This is a structural diagram of the area surrounding the external terminals involved in the modified example.

[0031] Figure 14 This is a structural diagram of the area surrounding the external terminals involved in the modified example.

[0032] Figure 15 This is a structural diagram of the area surrounding the external terminals involved in the modified example. Detailed Implementation

[0033] The following describes a semiconductor module to which the present invention can be applied. Figure 1 This is a perspective view of the semiconductor module involved in this embodiment. Figure 2 This is a top view of the semiconductor module involved in this embodiment. Figure 3 It is self Figure 2 The diagram shows a top view of the semiconductor module after the housing has been removed. Furthermore, the semiconductor module shown below is merely an example and is not limited to this; appropriate modifications are possible.

[0034] In the following figures, the long side direction of the semiconductor module (the direction in which multiple stacked substrates are arranged) is defined as the X direction, the short side direction as the Y direction, and the height direction (the thickness direction of the substrate) as the Z direction. The X, Y, and Z axes in the figures are orthogonal to each other, forming a right-handed system. Additionally, depending on the situation, the X direction may sometimes be referred to as the left-right direction, the Y direction as the front-back direction, and the Z direction as the up-down direction. These directions (front-back, left-right, up-down) are terms used for ease of explanation, and their correspondence with the X, Y, and Z directions may change depending on the mounting orientation of the semiconductor module. For example, the heat dissipation surface side (cooler side) of the semiconductor module may be called the lower surface side, and its opposite side as the upper surface side. Furthermore, in this specification, "top view" refers to the view of the upper surface of the semiconductor module from the Z-direction. Also, in this specification, the descriptions of directions and angles are only approximate and are permissible within ±10 degrees.

[0035] The semiconductor module involved in this embodiment, for example, is used in power conversion devices such as power modules, and is a power module constituting a converter circuit. Figures 1-3 As shown, the semiconductor module 1 is configured to include: a base plate 10; a plurality of stacked substrates 2 disposed on the base plate 10; a plurality of semiconductor elements 3 and 4 disposed on the stacked substrates 2; a housing member 11 that houses the stacked substrates 2 and the plurality of semiconductor elements; and a sealing resin (not shown) that fills the housing member 11.

[0036] The base plate 10 is a rectangular plate with an upper surface and a lower surface. The base plate 10 functions as a heat sink. Furthermore, the base plate 10 has a rectangular shape in plan view, with a long side in the X direction and a short side in the Y direction. The base plate 10 may be a metal plate made of, for example, copper, aluminum, or their alloys, and its surface may be plated.

[0037] A housing member 11, which is rectangular in shape when viewed from above, is disposed on the upper surface of the base plate 10. The housing member 11 is formed as a box with an opening at the bottom to cover the top of the base plate 10 and multiple semiconductor components. The housing member 11 defines a space for housing the laminated substrate 2, semiconductor components, sealing resin, etc.

[0038] Additionally, the housing member 11 is provided with external terminals. Specifically, the external terminals consist of a positive terminal 12 (P terminal), a negative terminal 13 (N terminal), and an output terminal 14 (M terminal). Furthermore, the external terminals may include multiple control terminals 15. Each external terminal is inserted into a through hole (through hole 11c described later) provided in the housing member 11. One end of the external terminal is connected to a predetermined circuit board inside the housing member 11, and the other end of the external terminal protrudes outward from the upper surface of the housing member 11.

[0039] Furthermore, the resin constituting the shell component 11 is a thermoplastic resin. Examples of such resins include polyphenylene sulfide (PPS) resin, polybutylene terephthalate (PBT) resin, polybutylene succinate (PBS) resin, polyamide (PA) resin, or acrylonitrile butadiene styrene (ABS) resin. Additionally, fillers may be added to the resin of the shell 11. Examples of fillers include ceramics. Examples of such fillers include silica, alumina, boron nitride, or aluminum nitride.

[0040] Specifically, a terminal arrangement portion 11a is formed at the center of the upper surface of the housing member 11. A positive terminal 12, a negative terminal 13, and an output terminal 14 are arranged in the terminal arrangement portion 11a. Additionally, a plurality of terminal arrangement portions 11b, each containing a control terminal 15, are formed on the outer periphery of the housing member 11. The terminal arrangement portions 11a and 11b are formed as a part of the housing member 11. The terminal arrangement portion 11a has a rectangular parallelepiped shape that is longer in the X direction. The ends of the output terminal 14, the positive terminal 12, and the negative terminal 13 are arranged sequentially on the upper surface of the terminal arrangement portion 11a, starting from the negative side in the X direction.

[0041] Each external terminal has a plate shape. Each external terminal is formed by stamping or other processes on a metal plate made of copper, copper alloy, aluminum alloy, iron alloy, or the like. Specifically, the positive terminal 12 has a first end 12a as one end, a second end 12b as the other end, and an intermediate portion 12c between the first end 12a and the second end 12b.

[0042] The first end portion 12a is provided in multiples (6) corresponding to the laminated substrate 2. The 6 first end portions 12a are disposed within the housing member 11 and embedded in the sealing resin. The first end portions 12a are connected to a predetermined circuit board (circuit board 21 described later) within the housing member 11.

[0043] The intermediate portion 12c is connected to a plurality of first ends 12a on one side embedded in the sealing resin. Furthermore, the intermediate portion 12c is formed by an elongated strip extending in the X direction within the housing member 11. In addition, the intermediate portion 12c extends toward the upper surface of the housing member 11 and is connected to the second ends 12b on the upper surface of the housing member 11 through a through hole (the through hole 11c described later) provided in the housing member 11.

[0044] The second end portion 12b is disposed outside the housing member 11. The second end portion 12b protrudes from the upper surface of the housing member 11, and its front end bends at approximately a right angle along the upper surface of the housing member 11 (terminal mounting portion 11a). That is, the positive terminal 12 is arranged such that its main surface runs along the inner wall surface (opposite wall portion 11f, described later) and the upper surface of the terminal mounting portion 11a. Two second end portions 12b are arranged in the X direction. A through hole 12d extending in the thickness direction is formed at the center of each second end portion 12b.

[0045] Alternatively, grooves or protrusions may be formed on the main surface of the bent portion, which serves as the connection between the intermediate portion 12c and the second end portion 12b. This makes the terminal easier to bend and helps to suppress cracking of the terminal.

[0046] Similarly, the negative terminal 13 has a first end 13a as one end, a second end 13b as the other end, and an intermediate portion 13c between the first end 13a and the second end 13b. A plurality of first ends 13a are provided corresponding to the laminated substrate 2 (six in total). The six first ends 13a are disposed within the housing member 11 and embedded in sealing resin. The first ends 13a are connected within the housing member 11 to a predetermined circuit board (circuit board 23 described later).

[0047] The intermediate portion 13c is connected to a plurality of first ends 13a on one side embedded in the sealing resin. Furthermore, the intermediate portion 13c is formed of an elongated strip extending in the X direction within the housing member 11. Additionally, the intermediate portion 13c extends toward the upper surface of the housing member 11 and is connected to a second end 13b on the upper surface of the housing member 11 through a through hole (the through hole 11c described later). The second end 13b is disposed outside the housing member 11.

[0048] The second end portion 13b is disposed outside the housing member 11. The second end portion 13b protrudes from the upper surface of the housing member 11, and its front end is bent at approximately a right angle along the upper surface of the housing member 11 (terminal mounting portion 11a). That is, the negative terminal 13 is disposed with its main surface along the inner wall surface (opposite wall portion 11f described later) and the upper surface of the terminal mounting portion 11a. Two second end portions 13b are arranged in the X direction. A through hole 13d extending in the thickness direction is formed in the center of each second end portion 13b.

[0049] Alternatively, grooves or protrusions may be formed on the main surface of the bent portion, which serves as the connection between the intermediate portion 13c and the second end portion 13b. This makes the terminal easier to bend and helps to suppress terminal cracking.

[0050] Furthermore, the output terminal 14 has a first end portion 14a as one end, a second end portion 14b as the other end, and an intermediate portion 14c between the first end portion 14a and the second end portion 14b. A plurality of first end portions 14a are provided corresponding to the laminated substrate 2 (six in total). The six first end portions 14a are disposed within the housing member 11 and embedded in sealing resin. These first end portions 14a are connected within the housing member 11 to a predetermined circuit board (circuit board 22 described later).

[0051] The intermediate portion 14c is connected to a plurality of first ends 14a on one side embedded in the sealing resin. Furthermore, the intermediate portion 14c is formed of an elongated strip extending in the X direction within the housing member 11. Additionally, the intermediate portion 14c extends toward the upper surface of the housing member 11 and is connected to a second end 14b on the upper surface of the housing member 11 through a through hole (the through hole 11c described later) provided in the housing member 11. The second end 14b is disposed outside the housing member 11.

[0052] The second end portion 14b is disposed outside the housing member 11. The second end portion 14b protrudes from the upper surface of the housing member 11, and its front end is bent at approximately a right angle along the upper surface of the housing member 11 (terminal mounting portion 11a). That is, the output terminal 14 is arranged such that its main surface runs along the inner wall surface (opposite wall portion 11f described later) and the upper surface of the terminal mounting portion 11a. Two second end portions 14b are arranged in the X direction. A through hole 14d extending in the thickness direction is formed in the center of each second end portion 14b.

[0053] Alternatively, grooves or protrusions may be formed on the main surface of the bent portion, which serves as the connection between the intermediate portion 14c and the second end portion 14b. This makes the terminal easier to bend and helps to suppress terminal cracking.

[0054] Additionally, one end of the control terminal 15 is connected to a predetermined circuit board within the housing member 11. The other end of the control terminal 15 protrudes from the upper surface of the housing member 11, and its front end is bent at approximately a right angle along the upper surface of the housing member 11 (terminal configuration portion 11b).

[0055] Use bolt 6 to secure the external conductors 7, such as the busbar (see reference). Figure 5 These external terminals are fixed in place, details of which will be explained later. Additionally, a nut 8 is provided below the second end of each external terminal for the front end of the bolt 6 to be screwed into (see [reference]). Figure 5 Nut 8 is housed in nut storage portion 16 formed in each terminal configuration portion (see reference). Figure 4 ).

[0056] Furthermore, inside the housing member 11, six stacked substrates 2 are disposed on the upper surface of the base plate 10. The stacked substrates 2 are, for example, formed into a rectangular shape when viewed from above. The six stacked substrates 2 are arranged in the X direction. The stacked substrates 2 are formed by stacking metal layers and insulating layers, and are, for example, composed of a DCB (Direct Copper Bonding) substrate, an AMB (Active Metal Brazing) substrate, or a metal substrate. Specifically, the stacked substrate 2 has an insulating plate 20, a heat sink (not shown) disposed on the lower surface of the insulating plate 20, and circuit boards 21, 22, and 23 disposed on the upper surface of the insulating plate 20.

[0057] The insulating plate 20 is formed as a flat plate having a predetermined thickness in the Z direction and having an upper surface and a lower surface. The insulating plate 20 is formed from insulating materials such as ceramic materials like alumina (Al2O3), aluminum nitride (AlN), and silicon nitride (Si3N4), resin materials like epoxy, or epoxy resin materials using ceramic materials as fillers. Furthermore, the insulating plate 20 may also be referred to as an insulating layer or insulating film.

[0058] The heat sink is formed to have a specified thickness in the Z direction, covering approximately the entire lower surface of the insulating plate. The heat sink is formed, for example, from a metal plate with good thermal conductivity, such as copper or aluminum.

[0059] On the upper surface (main surface) of the insulating plate 20, three circuit boards 21, 22, and 23 are independently formed into an island shape, electrically insulated from each other. In addition to the three circuit boards 21, 22, and 23, two circuit boards 24 are also provided as control circuit boards. The two circuit boards 24 are located at opposite corners of the insulating plate 20. These circuit boards are constructed of a metal layer of a specified thickness formed using copper foil or the like.

[0060] The ends of the aforementioned external terminals are connected to the upper surfaces of these circuit boards. Specifically, the first end 12a of the positive terminal 12 is disposed on the upper surface of circuit board 21. Additionally, semiconductor elements 3 and 4 (described later) are disposed on the upper surface of circuit board 21. The first end 14a of the output terminal 14 is disposed on the upper surface of circuit board 22. Additionally, semiconductor elements 3 and 4 (described later) are disposed on the upper surface of circuit board 22. The first end 13a of the negative terminal 13 is disposed on the upper surface of circuit board 23. The first ends of each of these external terminals are directly connected to the upper surface of the specified circuit board using ultrasonic bonding, laser bonding, or other methods, or connected to the upper surface of the specified circuit board via bonding materials such as solder or sintered metal. Thus, the first ends 12a, 13a, and 14a of the external terminals are electrically connected to circuit boards 21, 23, and 22.

[0061] Multiple semiconductor elements 3 and 4 are disposed on the upper surfaces of circuit boards 21 and 22 via bonding materials such as solder. Thus, the lower surface electrodes of each semiconductor element 3 and 4 are electrically connected to circuit boards 21 and 22. Consequently, each external terminal is electrically connected to each semiconductor element.

[0062] Semiconductor elements 3 and 4 are formed from semiconductor substrates such as silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) into a rectangular shape in top view. Furthermore, semiconductor elements 3 and 4 may be switching elements such as IGBTs (Insulated Gate Bipolar Transistors), power MOSFETs (Metal Oxide Semiconductor Field Effect Transistors), or diodes such as FWDs (Free Wheeling Diodes). In this embodiment, one semiconductor element 3 is designated as an IGBT, and the other semiconductor element 4 as a diode. Alternatively, RC (Reverse Conducting) IGBTs integrating an IGBT and an FWD, power MOSFETs, or RB (Reverse Blocking) IGBTs with sufficient reverse bias withstand voltage can also be used. The shape, number, and placement of the semiconductor elements can be appropriately varied. In this embodiment, the semiconductor element is a vertically shaped switching element formed by forming functional elements such as transistors on a semiconductor substrate.

[0063] In this embodiment, semiconductor elements 3 and 4 are arranged sequentially along the Y direction on the upper surface of circuit board 21. In circuit board 21, semiconductor element 3 is located on the positive side of the Y direction, and semiconductor element 4 is located on the negative side of the Y direction. Similarly, semiconductor elements 3 and 4 are arranged sequentially along the Y direction on the upper surface of circuit board 22. In circuit board 22, semiconductor element 4 is located on the positive side of the Y direction, and semiconductor element 3 is located on the negative side of the Y direction. In this embodiment, semiconductor elements 3 and 4 on circuit board 21 constitute the upper arm, and semiconductor elements 3 and 4 on circuit board 22 constitute the lower arm.

[0064] Furthermore, semiconductor elements 3 and 4, arranged in the Y direction, are electrically connected using wiring components. Additionally, semiconductor element 4 is electrically connected to a predetermined circuit board using wiring components. Furthermore, the gate electrode of semiconductor element 3 is electrically connected to circuit board 24 using wiring components.

[0065] These wiring components use conductive wires (bonding wires). The conductive wires can be made of any one of gold, copper, aluminum, gold alloys, copper alloys, aluminum alloys, or combinations thereof. Furthermore, components other than conductive wires can also be used as wiring components. For example, strips can be used as wiring components. Additionally, the wiring components are not limited to wires; they can also be formed from metal sheets made of copper, copper alloys, aluminum alloys, iron alloys, etc.

[0066] Next, refer to Figure 4 and Figure 5 The fixing structure of the external conductor involved in this embodiment will be described in detail. Figure 4 This is a top view of the periphery of the external terminals involved in this embodiment. Figure 5 yes Figure 4 A partial cross-sectional view of the periphery of the external terminals is shown. Furthermore, in... Figure 4 The housing component 11 is represented by a solid line, and the external terminal 12 is represented by a double-dotted line. Figure 5 Solid lines represent housing component 11, external terminal 12, and nut 8, while double-dotted lines represent the outline and position of bolt 6 and external conductor 7. Figure 4 , Figure 5 For simplicity, the description uses the periphery of the positive terminal 12 as an example, but it is not limited to this. The periphery of the negative terminal 13 and the output terminal 14 also have the same structure. In addition, the same structure can also be used in the control terminal 15.

[0067] like Figure 4 , Figure 5 As shown, a through hole 11c is formed on the upper surface of the housing member 11 (terminal arrangement portion 11a), penetrating the inner side of the housing member 11 and the outer side. The middle portion 12c of the positive terminal 12, which stands upright in the Z direction between the first end 12a and the second end 12b, is inserted into the through hole 11c. Such a through hole 11c has a flat shape that is longer in the X direction. The through hole 11c is preferably rectangular when viewed from above, and more preferably has a width and thickness that are slightly larger than the cross-section of the middle portion 12c of the positive terminal 12 that passes through it.

[0068] Additionally, a protrusion 11d is formed on the side adjacent to the short side of the through hole 11c, protruding upward in the Z direction. The protrusion 11d is formed by an elongated body extending in the X direction along the long side of the inner wall surface of the through hole 11c (the opposing wall 11f described later) at a position closer to the positive side in the Y direction than the through hole 11c. The protrusion 11d can be a cuboid shape, a cuboid shape with rounded corners on its upper surface, or a semi-cylindrical shape.

[0069] The height (length in the Z direction) of the protrusion 11d can be more than 10% and less than 150% of the thickness of the second end 12b. The width (length in the Y direction) of the protrusion 11d can be more than 10% and less than 150% of the thickness of the second end 12b. By setting the height and width to the above ranges, terminal bending that takes into account the springback described later can be achieved.

[0070] Furthermore, the length (length in the X direction) of the protrusion 11d can be 70% or more and 150% or less of the width of the second end 12b. Preferably, the length of the protrusion 11d is 80% or more and 120% or less of the width of the second end 12b. Additionally, the length (length in the X direction) of the protrusion 11d is 70% or more and 150% or less of the length of the through hole 11c. Preferably, the length (length in the X direction) of the protrusion 11d is 100% or more and 120% or less of the width of the through hole 11c, and the two ends (ends in the X direction) of the protrusion 11d are located outside the two ends (ends in the X direction) of the through hole 11c. This suppresses stress concentration applied to the two ends (ends in the X direction) of the protrusion 11d.

[0071] Furthermore, a slit portion 11e extending in the Z direction is formed on the inner surface of the through hole 11c (the opposing wall portion 11f described later) and the protrusion 11d, as detailed below. Moreover, rounded corners 11g may also be formed at both ends of the inner surface of the through hole 11c (the opposing wall portion 11f) (see reference). Figure 8 ).

[0072] As described above, the second end portion 12b protrudes from the upper surface of the housing member 11, and its front end bends at approximately a right angle towards the positive Y direction along the upper surface of the housing member 11 (terminal arrangement portion 11a). At this time, the protrusion 11d becomes the bending fulcrum of the second end portion 12b, and a small gap C1 is provided between the upper surface of the terminal arrangement portion 11a and the lower surface of the second end portion 13b. The gap C1 is a size that is 80% or more and 120% or less of the height of the protrusion 11d. Preferably, it is the same size as the height of the protrusion.

[0073] Additionally, a nut storage portion 16 for storing the nut 8 is formed on the upper surface of the terminal configuration portion 11a. The nut 8 is a so-called hexagonal nut, with a threaded hole 8a formed in the center. The nut 8 is constructed, for example, by forming a threaded hole 8a through the center of a hexagonal prism.

[0074] The nut receiving portion 16 is provided corresponding to the through hole 11c. Specifically, the nut receiving portion 16 is formed near the through hole 11c at a predetermined position on the negative side of the Y direction than the through hole 11c. The nut receiving portion 16 has a first recess 16a for receiving the nut 8 and a second recess 16b for receiving the front end of the threaded portion 61 of the bolt 6.

[0075] The first recess 16a is a recess that opens on the upper surface of the terminal mounting portion 11a and extends in the -Z direction with a length equal to or slightly longer than the outer length of the nut 8, and has a bottom surface. Furthermore, the bottom surface has a circular opening concentric with the opening formed on the upper surface, its shape smaller than the nut 8 and its outer diameter slightly larger than the outer diameter of the threaded portion 61 of the bolt 6. The first recess 16a is formed at a position away from the through hole 11c in the positive Y direction. That is, it is formed opposite to the middle portion of the positive terminal 12 that stands upright in the Z direction. The first recess 16a has a regular hexagonal shape corresponding to the shape of the nut 8 when viewed from above. The first recess 16a is formed such that a pair of opposing faces of the defined hexagonal shape face each other in the Y direction. In other words, the opposing direction of the pair of opposing faces of the defined hexagonal shape of the first recess 16a is consistent with the direction opposite to the positive terminal 12 that stands upright in the Z direction. One side of the first recess 16a faces parallel to the main surface of the middle portion of the positive terminal 12. In addition, the depth of the first recess 16a is formed in accordance with the thickness of the nut 8.

[0076] The bottom surface of the first recess 16a may also have a second recess 16b. The second recess 16b is formed by a hole formed from the center of the bottom surface of the first recess 16a to a predetermined depth. The second recess 16b has a circular shape that is concentric with the first recess 16a and is smaller than the inner diameter of the first recess 16a but slightly larger than the outer diameter of the threaded portion 61 of the bolt 6.

[0077] The second recess 16b may not extend into the housing member 11, but its bottom may be closed by the housing member 11. In this case, the depth of the second recess 16b is formed to be deeper than the lower end of the threaded portion 61 screwed into the nut 8. Alternatively, the second recess 16b may also extend through the gap 17. In addition, the center of the nut receiving portion 16 (the second recess 16b) coincides with the center of the through hole 12c of the second end portion 12b. That is, the second end portion 12b and the nut receiving portion 16 are opposite each other in the Z direction.

[0078] The thickness (length in the Z direction) of the terminal mounting portion 11a can be greater than the depth at which the first recess 16a and the second recess 16b are joined together. Furthermore, the depth (length in the Z direction) of the through hole 11c is the same as the thickness of the terminal mounting portion 11a. Therefore, the depth of the through hole 11c can be greater than the depth at which the first recess 16a and the second recess 16b are joined together. Conversely, the thickness (length in the Z direction) of the terminal mounting portion 11a can be less than the depth at which the first recess 16a and the second recess 16b are joined together. Again, the depth (length in the Z direction) of the through hole 11c is the same as the thickness of the terminal mounting portion 11a. Therefore, the depth of the through hole 11c can be less than the depth at which the first recess 16a and the second recess 16b are joined together.

[0079] To eliminate the thick-walled portion, the terminal mounting section 11a, in addition to the nut housing section 16 and the through hole 11c, also has a gap 17. The gap 17 is formed on the inner side of the housing such that a predetermined thickness is maintained between the external space, the nut housing section 16, and the through hole 11c. For example, as... Figure 5 As shown, a gap 17 can be formed between the second recess 16b and the through hole 11c.

[0080] Next, refer to Figures 6 to 8 The bending structure of the external terminal involved in this embodiment will be described. Figure 6 ( Figure 6 A~ Figure 6 C) is an action transition diagram representing an example of the bending process of an external terminal. Figure 7 This is a structural diagram of the area surrounding the external terminals as described in the reference example. Figure 8 This is a structural diagram of the area surrounding the external terminals according to this embodiment. Figure 7 , Figure 8 middle, Figure 7 A, Figure 8 A is a top view of the perimeter of the external terminals. Figure 7 B. Figure 8 B is a three-dimensional view of the vicinity of the through hole 11c.

[0081] However, in the aforementioned semiconductor module, an external terminal protrudes from the upper surface of the housing member 11. During the manufacturing process of the semiconductor module, the main surface of the end of the external terminal protruding from the upper surface of the housing member 11 is bent at a right angle along the upper surface of the housing member 11. At this time, if the external force is removed from the front end of the external terminal, the front end of the external terminal is slightly pushed back due to the springback caused by the elasticity of the external terminal. As a result, the end face of the external terminal is not parallel to the upper surface of the housing, which may affect the installability of components such as busbars.

[0082] Therefore, for example, Figure 6 As shown in Figure A, a protrusion 11d is considered to be provided at the location that serves as a bending fulcrum for the external terminal (second end 12b). Because of the protrusion 11d, the second end 12b can be bent by more than 90 degrees using the protrusion 11d as a fulcrum (see Figure A). Figure 6 B). The height of the protrusion 11d is set to be equal to the distance the front end of the external terminal returns due to springback after bending. That is, the height of the protrusion 11d is set taking into account the amount of springback when the external force during bending is removed. Therefore, the bending angle of the external terminal can be controlled to be approximately a right angle (see reference). Figure 6 C).

[0083] However, as Figure 7As shown in Figure A, the protrusion 11d is part of the shell member 11 formed of resin or the like. Therefore, when the second end 12b is bent, stress concentrates on the protrusion 11d, which serves as its fulcrum, potentially causing the second end 12b to break. Specifically, a force acts downwards from the upper end of the protrusion 11d along the inner surface of the through hole 11c, and this force extends to both sides in the X direction from the lower end of the protrusion 11d, concentrating stress at the edge portion of the through hole 11c.

[0084] Thus, the inventors of this application conceived of the present invention by focusing on the stress concentration area when a protrusion 11d for controlling the bending angle of the external terminal is provided. Specifically, in this embodiment, as... Figure 4 , Figure 5 , Figure 8 As shown, the second end 12b of the external terminal (positive terminal 12) protrudes from the upper surface of the housing member 11 and bends at a right angle along the upper surface of the housing member 11. The housing member 11 has: a protrusion 11d that protrudes from the upper surface of the terminal arrangement portion 11a at a predetermined height and becomes the bending fulcrum of the second end 12b; and a slit portion 11e that breaks off the protrusion 11d in a direction (X direction) intersecting the protrusion direction (Z direction) of the protrusion 11d.

[0085] Additionally, the housing member 11 has a facing wall 11f that faces one side of the positive terminal 12 that stands upright in the Z direction. A protrusion 11d is formed along the facing wall 11f. That is, the end face of the protrusion 11d is smoothly connected to the facing wall 11f.

[0086] The slit portion 11e extends vertically along the protruding direction of the protrusion 11d, i.e., the Z direction. Furthermore, the lower end of the slit portion 11e extends to the lower end of the opposing wall portion 11f. The depth (length in the Y direction) of the slit portion 11e relative to the opposing wall portion 11f is greater than or equal to the width (length in the Y direction) of the protrusion 11d and less than or equal to the length from the opposing wall portion 11f to the nut receiving portion 16. In other words, the slit portion 11e only needs to be greater than or equal to the depth at which the protrusion 11d is interrupted. The slit portion 11e is formed at the center of the protrusion 11d in the longitudinal direction (X direction).

[0087] Based on these structures, the opposing wall portions 11f are split into two in the X direction using the slit portion 11e. Therefore, the force applied to the upper end of the protrusion 11d when the external terminal is bent propagates along the multiple split opposing wall portions 11f. That is, the force concentrated at one location is distributed along the multiple opposing wall portions 11f. Thus, stress concentration at the corners of the housing member 11 can be suppressed. Therefore, damage to the protrusion 11d and damage to the corners of the housing can be prevented. In other words, the bending angle of the external terminal can be ensured, and damage to the housing member 11 can be prevented.

[0088] Furthermore, the bottom of the slit portion 11e in the depth direction (Y direction) relative to the opposing wall portion 11f is formed into an arc shape. That is, the end face of the slit portion 11e is formed by an arc surface in a way that appears as an arc when viewed from above. According to this structure, stress concentration at the end face of the slit portion 11e can be prevented, and cracks can be suppressed from forming in the slit portion 11e.

[0089] In addition, such as Figure 8 As shown, fillets 11g of a predetermined radius can also be formed at both ends of the inner side surface (opposite wall portion 11f) of the through hole 11c. Furthermore, fillets 11h of a predetermined radius can also be formed at the lower end of the through hole 11c. Thus, by providing fillet shapes at the corners of the through hole 11c, stress concentration at those corners can be suppressed.

[0090] Furthermore, in the above embodiment, the case where the slit portion 11e is formed to the lower end of the opposing wall portion 11f, i.e., the opposing wall portion 11f is completely broken into multiple parts in the X direction, has been described, but this structure is not limited to this. For example, as Figure 9 As shown in the modified example, the slit portion 11e may also be formed only in the protrusion 11d. In this case, the protrusion 11d is broken into multiple parts by the slit portion 11e (in... Figure 9 (There are two in the middle). Even with such a structure, stress concentration at the slit 11e can be prevented, thereby suppressing crack formation.

[0091] Alternatively, it could be Figure 11 The structure shown. Figure 11 A is the structure around the external terminal in another variation. Figure 11 B is along Figure 11 A sectional view cut by line AA of A. For example... Figure 11 As shown in the modified example, the lower end of the slit portion 11e can also be formed from the upper end of the protrusion 11d to a height midway in the Z direction. In this case, the lower end of the slit portion 11e in the Z direction is formed into an arc shape. According to this structure, stress concentration at the edge of the lower end of the slit portion 11e can be prevented, and cracks can be suppressed from forming in the slit portion 11e.

[0092] In addition, Figure 11 In this structure, a thick-walled portion 18 is formed at the location corresponding to the lower end of the slit portion 11e. This thick-walled portion 18 functions as a reinforcement to increase the rigidity of the opposing wall portion 11f surrounding the slit portion 11e. The thick-walled portion 18 has a convex shape that bulges toward the gap 17 on the inner side (back side) of the opposing wall portion 11f. Furthermore, the thick-walled portion 18 is provided at the location opposite to the second recess. By thickening the back side of the opposing wall portion 11f corresponding to the lower end of the slit portion 11e, the generation of cracks penetrating from the lower end of the slit portion 11e to the back side of the opposing wall portion 11f can be suppressed.

[0093] Alternatively, it could be Figure 10 The structure shown. In Figure 10 In this design, two slits 11k (second slits) are provided at the lower edge of the opposing wall portion 11f. The slits 11k are formed such that the lower end of the opposing wall portion 11f is R-shaped (rounded corner). This can suppress the generation of cracks at the lower edge of the opposing wall portion 11f and at the center of the lower end of the opposing wall portion 11f.

[0094] In addition, such as Figure 12 As shown in the modified example, the lower end of the slit portion 11e can also branch into multiple parts. Figure 12 In A, the lower end of the slit portion 11e branches into two, forming a roughly Y-shaped structure. In this case, the lower end of the slit portion 11e in the Z direction ends midway, and its end forms an arc shape. Alternatively, it can be as follows... Figure 11 As shown, a thick-walled portion 18 is formed as a reinforcement in the opposite wall portion 11f at the lower end of the slit portion 11e. For example, the reinforcement 18 can be formed by thickening the back side of the opposite wall portion 11f corresponding to the lower end of the slit portion 11e.

[0095] In addition, such as Figure 12 As shown in B, multiple branched slit portions 11e can also be formed to the lower end of the opposite wall portion 11f.

[0096] In addition, such as Figure 13 As shown in Figure A, multiple slit portions 11e can also be arranged in a direction (X direction) intersecting the protrusion direction (Z direction) of the protrusion portion 11d. Furthermore, as... Figure 13 As shown in B, multiple slits 11e can also be formed up to the lower end of the opposite wall 11f.

[0097] Furthermore, in the above embodiment, the case where the slit portion 11e stops midway in the Y direction before reaching the nut receiving portion, i.e., stopping midway in the Y direction at the opposite wall portion 11f, has been described, but this structure is not limited to this one. For example, it could also be... Figure 14 , Figure 15 The structure shown. In Figure 14 , Figure 15 In the middle, it indicates that the slit portion 11e is connected to the nut receiving portion 16. Figure 14 , Figure 15 In this design, the slit portion 11e is formed to extend through the first recess 16a. Alternatively, the slit portion 11e may also be formed to extend through the second recess 16b. The slit portion 11e may also be further connected to the gap 17 below it. As a result, cracks can be suppressed from the Y-direction end of the slit portion 11e.

[0098] Furthermore, in the above embodiment, the case where the slit portion 11e is formed at the center in the X direction opposite to the wall portion 11f and is positioned opposite one side of the first recess 16a has been described, but this structure is not limited to this. The slit portion 11e may also be disposed biased to one side in the X direction.

[0099] Furthermore, in the above embodiment, the case where the slit portion 11e extends straight in the vertical direction (Z direction) has been described, but this structure is not limited to this. The slit portion 11e may also be inclined. In this case, it is preferable that the lower end of the slit portion 11e is inclined outwards than the upper end.

[0100] Furthermore, in the above embodiment, the case where a through hole 11c for inserting an external terminal is formed in the housing member 11 has been described, but this structure is not limited to this. It is not necessary to form a through hole 11c; the external terminal may also be integrally embedded in the housing member 11. Alternatively, the housing member 11 may be a combination of a housing frame and a housing cover, in which case the through hole 11c may also be formed at the boundary between the housing frame and the housing cover.

[0101] Furthermore, in the above embodiments, the number and layout of the circuit boards are not limited to the above structure and can be appropriately changed.

[0102] Furthermore, in the above embodiment, the stacked substrate 2 and the semiconductor element are configured to have a rectangular or square shape when viewed from above, but are not limited to this structure. The stacked substrate 2 and the semiconductor element may also be configured to have a polygonal shape other than those described above.

[0103] Furthermore, while this embodiment and its variations have been described, the above embodiments and variations may be combined in whole or in part as other embodiments.

[0104] Furthermore, this embodiment is not limited to the above-described embodiments and variations, and various changes, substitutions, and modifications can be made without departing from the spirit of the technical concept. Moreover, if the technical concept can be realized in other ways using technological advancements or derived technologies, this method can also be used. Therefore, the claims cover all embodiments that can be included within the scope of the technical concept.

[0105] The following is a summary of the feature points in the above embodiments.

[0106] The semiconductor module described in the above embodiments includes: a semiconductor element; a housing that houses the semiconductor element; and an external terminal that electrically connects the main electrode of the semiconductor element to an external conductor. The external terminal protrudes from the upper surface of the housing and bends at a right angle along the upper surface of the housing. The housing has: a protrusion that protrudes from the upper surface of the housing at a predetermined height and serves as the bending fulcrum of the external terminal; and a slit that disconnects the protrusion in a direction intersecting the protrusion direction.

[0107] Furthermore, in the semiconductor module described in the above embodiments, the housing has a facing wall portion opposite to one side of the external terminal, the protrusion portion is formed along the upper end of the facing wall portion, the slit portion extends up and down along the protruding direction of the protrusion portion, and its lower end is formed to the facing wall portion.

[0108] Furthermore, in the semiconductor module described in the above embodiments, the lower end of the slit portion is formed to the lower end of the opposing wall portion.

[0109] Furthermore, in the semiconductor module described in the above embodiments, the lower end of the slit portion is formed to the middle of the opposite wall portion, and the lower end of the slit portion is formed in an arc shape.

[0110] Furthermore, in the semiconductor module described in the above embodiments, the bottom of the slit portion in the depth direction relative to the opposing wall portion is formed into an arc shape.

[0111] Furthermore, in the semiconductor module described in the above embodiments, the slit portion extends all the way through the recess for receiving the nut.

[0112] Furthermore, in the semiconductor module described in the above embodiments, the slit portions are formed in such a way that multiple slit portions are arranged in a direction that intersects the protrusion direction of the protrusion portion.

[0113] Furthermore, in the semiconductor module described in the above embodiments, the lower end branch of the slit portion is multiple.

[0114] In addition, in the semiconductor module described in the above embodiments, the housing also has a through hole through which the external terminal can pass. The through hole is rectangular when viewed from above and is formed to be slightly larger than the width and thickness of the cross section of the external terminal. The external terminal passes through the through hole from the inside of the housing and protrudes from the upper surface of the housing.

[0115] Furthermore, in the semiconductor module described in the above embodiments, the housing also has a reinforcement portion at the portion corresponding to the lower end of the slit portion.

[0116] Furthermore, in the semiconductor module described in the above embodiments, the housing has a opposing wall portion facing one side of the external terminal, and the reinforcement portion is formed by a thick wall portion that bulges on the back side of the opposing wall portion.

[0117] Furthermore, in the semiconductor module described in the above embodiments, the housing has a facing wall portion opposite to one side of the external terminal, and a second slit portion is formed at the lower end of the facing wall portion.

[0118] Furthermore, in the semiconductor module described in the above embodiments, the housing has a opposing wall portion that faces one side of the external terminal, and a rounded corner is formed on the inner side surface of the opposing wall portion.

[0119] Furthermore, in the semiconductor module described in the above embodiments, a recess for receiving a nut is formed on the upper surface of the housing, at a location opposite to the bent external terminal, and a through hole is formed on the external terminal, at a location opposite to the recess.

[0120] Industrial availability

[0121] As described above, the present invention has the effect of ensuring the bending angle of the external terminals and preventing the housing from breaking, which is particularly useful for semiconductor modules.

[0122] This application is based on Japanese Special Application 2020-103814, filed on June 16, 2020. Its entire contents are contained herein.

Claims

1. A semiconductor module, wherein, The semiconductor module includes: Semiconductor components; A housing that houses the semiconductor element; and External terminals electrically connect the main electrode of the semiconductor element to an external conductor. The external terminal protrudes from the upper surface of the housing and bends at a right angle along the upper surface of the housing. The housing has: A protrusion that extends from the upper surface of the housing at a predetermined height and serves as a bending fulcrum for the external terminals; and A slit portion that breaks off the protrusion in a direction intersecting the protruding direction of the protrusion. The protrusion is divided into a first protrusion and a second protrusion, which respectively become the bending fulcrum, by the slit.

2. The semiconductor module according to claim 1, wherein, The housing has a facing wall portion opposite to one side of the external terminal. The protrusion is formed along the upper end of the opposing wall portion. The slit extends vertically along the protruding direction of the protrusion, and its lower end forms to the opposing wall.

3. The semiconductor module according to claim 2, wherein, The lower end of the slit portion extends to the lower end of the opposite wall portion.

4. The semiconductor module according to claim 2, wherein, The lower end of the slit extends to the middle of the opposite wall portion, and the lower end of the slit is formed in an arc shape.

5. The semiconductor module according to any one of claims 2 to 4, wherein, The bottom of the slit portion in the depth direction relative to the opposing wall portion is formed in an arc shape.

6. The semiconductor module according to any one of claims 2 to 4, wherein, The slit portion extends in the depth direction relative to the opposing wall portion to the recess for receiving the nut.

7. The semiconductor module according to any one of claims 1 to 4, wherein, The slit portions are formed in a manner in which multiple slit portions are arranged in a direction that intersects the protrusion direction of the protrusion portion.

8. A semiconductor module, wherein, The semiconductor module includes: Semiconductor components; A housing that houses the semiconductor element; and External terminals electrically connect the main electrode of the semiconductor element to an external conductor. The external terminal protrudes from the upper surface of the housing and bends at a right angle along the upper surface of the housing. The housing has: A protrusion that extends from the upper surface of the housing at a predetermined height and serves as a bending fulcrum for the external terminals; and A slit portion that breaks off the protrusion in a direction intersecting the protruding direction of the protrusion. The lower end of the slit portion has multiple branches.

9. The semiconductor module according to any one of claims 1 to 4, wherein, The housing also has a through hole through which the external terminal can pass. The through hole is rectangular when viewed from above, and is formed to be slightly larger than the width and thickness of the cross-section of the external terminal. The external terminal extends through the through hole from the interior of the housing and protrudes from the upper surface of the housing.

10. A semiconductor module, wherein, The semiconductor module includes: Semiconductor components; A housing that houses the semiconductor element; and External terminals electrically connect the main electrode of the semiconductor element to an external conductor. The external terminal protrudes from the upper surface of the housing and bends at a right angle along the upper surface of the housing. The housing has: A protrusion that extends from the upper surface of the housing at a predetermined height and serves as a bending fulcrum for the external terminals; and A slit portion that breaks off the protrusion in a direction intersecting the protruding direction of the protrusion. The housing also has a reinforcing portion at the location corresponding to the lower end of the slit portion.

11. The semiconductor module according to claim 10, wherein, The housing has a facing wall portion opposite to one side of the external terminal. The reinforcement is formed by a thick-walled portion that bulges on the back side of the opposing wall portion.

12. The semiconductor module according to any one of claims 1 to 4, wherein, The housing has a facing wall portion opposite to one side of the external terminal. A second slit is formed at the lower end of the opposite wall portion.

13. The semiconductor module according to any one of claims 1 to 4, wherein, The housing has a facing wall portion opposite to one side of the external terminal. The inner surface of the opposing wall portion has rounded corners.

14. The semiconductor module according to any one of claims 1 to 4, wherein, A recess for receiving a nut is formed on the upper surface of the housing, specifically at the location opposite the bent external terminal. A through hole is formed at the external terminal, specifically at the location opposite to the recess.

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