Transfer device and transfer method

Abstract

The embodiment of the present application discloses a transfer device and a transfer method. The transfer device comprises a spraying assembly, a transfer assembly and a heating assembly. The spraying assembly is used for spraying a first medium in a liquid state on a light emitting device. The transfer assembly is used for changing the first medium in the liquid state into a first medium in a solid state. The first medium in the solid state connects the transfer assembly and the light emitting device. Then, the transfer assembly performs transfer of the light emitting device. The heating assembly is used for heating the first medium in the solid state and converting it into a gaseous state, so as to separate the transfer substrate and the light emitting device. In the transfer process, the use of viscous material is avoided, the production cost is reduced, the problem of residual adhesive in the existing transfer technology is solved, the use of the light emitting device is not affected, and better transfer effect is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a transfer device and a transfer method thereof. BACKGROUND

[0002] The size of a Micro LED (Micro Light Emitting Diode) is generally less than 100 μm and the number of transfer is large, for example, 2654 million Micro LEDs are needed to be transferred for a 4k (4096x2160) resolution, so the difficulty of mass transfer is large.

[0003] At present, a viscous material such as PDMS (Polydimethylsiloxan) and photoresist is usually used to transfer the Micro LED in mass, and this viscous transfer method needs to use a large amount of glue material, which increases the production cost, and after the mass transfer is completed, the adhesion on the surface of the Micro LED is easy to remain, the remaining adhesion is not easy to remove and affects the use of the Micro LED, resulting in poor transfer effect of the Micro LED. SUMMARY

[0004] The embodiments of the present application provide a transfer device and a transfer method thereof to solve the technical problem that the existing Micro LED transfer technology is easy to have residual glue and cause poor transfer effect.

[0005] The embodiments of the present application provide a transfer device for transferring a plurality of light emitting devices on a carrier substrate to a target substrate, comprising:

[0006] A spraying assembly is provided with a first medium in a liquid state, and the spraying assembly is used to spray the first medium in a liquid state on the light emitting devices on the carrier substrate, and the first medium includes a liquid state, a solid state and a gaseous state.

[0007] A transfer assembly includes an adsorption surface and a refrigeration component, and the refrigeration component is used to make the temperature of the adsorption surface lower than the freezing point of the first medium, so that the first medium in a liquid state on the light emitting devices to be transferred is converted into a solid state and connected with the adsorption surface of the transfer assembly.

[0008] A heating assembly is used to heat the first medium in a solid state and convert it into a gaseous state after the transfer assembly connected with the light emitting devices is closed with the target substrate, so that the transfer assembly is separated from the light emitting devices.

[0009] In the transfer device provided by the embodiments of the present application, the adsorption surface is located on the heat absorption surface of the semiconductor refrigeration sheet.

[0010] In the transfer device provided by the embodiment of the present application, the refrigeration component comprises a receiving cavity arranged inside the transfer substrate and a second medium arranged in the receiving cavity, the second medium is used to make the temperature of the transfer substrate lower than the freezing point of the first medium, and the adsorption surface is located on one side of the transfer substrate.

[0011] In the transfer device provided by the embodiment of the present application, the thickness of the inner wall of the receiving cavity on the side close to the adsorption surface of the transfer substrate is less than or equal to the thickness of the inner wall of the receiving cavity on the side away from the adsorption surface.

[0012] In the transfer device provided by the embodiment of the present application, a plurality of adsorption grooves are arranged on the side of the transfer substrate close to the adsorption surface.

[0013] In the transfer device provided by the embodiment of the present application, the first medium comprises water, and the second medium comprises liquid nitrogen or dry ice.

[0014] In the transfer device provided by the embodiment of the present application, the spraying assembly comprises a moving component and at least one spraying element arranged on the moving component, the moving component is used to drive the spraying element to move above the carrier substrate in a direction parallel to the carrier substrate.

[0015] In the transfer device provided by the embodiment of the present application, the heating component comprises a welding device, the welding device is used to weld the light emitting device and the target substrate, and the first medium is heated to make the solid first medium change into a gaseous state.

[0016] The embodiment of the present application provides a transfer method, comprising the following steps:

[0017] Providing a carrier substrate and a target substrate, the carrier substrate is provided with a plurality of light emitting devices to be transferred;

[0018] Spraying the liquid first medium on the light emitting device on the carrier substrate by using the spraying assembly;

[0019] Reducing the temperature of the adsorption surface to be lower than the freezing point of the first medium by using the refrigeration component, and moving the adsorption surface of the transfer assembly to be in contact with the first medium on the light emitting device, so that the liquid first medium on the light emitting device changes into a solid state and connects with the adsorption surface of the transfer assembly;

[0020] Moving the transfer assembly connected with the light emitting device to be in abutment with the target substrate, heating the solid first medium by using the heating component and changing it into a gaseous state, so that the transfer assembly is separated from the light emitting device.

[0021] In the transfer method provided by the embodiment of the present application, the heating assembly comprises the soldering device, the first medium in solid state is heated and converted into gaseous state by using the heating assembly, and the step of separating the transfer assembly from the light emitting device comprises:

[0022] The soldering device is used to solder the light emitting device to the target substrate, and the first medium is heated to convert the first medium in solid state into gaseous state, so as to separate the transfer assembly from the light emitting device.

[0023] The present application has the following beneficial effects: the present application provides a transfer device and a transfer method, liquid first medium is sprayed on the light emitting device by using the spraying assembly, the transfer assembly with a temperature lower than the freezing point of the first medium is used to contact the liquid first medium on the light emitting device, so that the liquid first medium is converted into solid first medium, the solid first medium connects the transfer assembly and the light emitting device, the transfer of the light emitting device is realized, the use of adhesive material in the transfer process is avoided, the production cost is reduced, the problem of residual adhesive material in the existing transfer technology is solved, the use of the light emitting device is not affected, and better transfer effect is achieved. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0025] Figure 1 The structural schematic diagram of the transfer device provided by the embodiment of the present application is shown in the figure.

[0026] Figure 2 The first structural schematic diagram of the transfer assembly in the transfer device provided by the embodiment of the present application is shown in the figure.

[0027] Figure 3 The second structural schematic diagram of the transfer assembly in the transfer device provided by the embodiment of the present application is shown in the figure.

[0028] Figure 4 The top view structural schematic diagram of the spraying assembly in the transfer device provided by the embodiment of the present application is shown in the figure.

[0029] Figure 5 The flowchart of the transfer method provided by the embodiment of the present application is shown in the figure.

[0030] Figures 6 to 8 The structural flowchart of the transfer method provided by the embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by a person skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation manners described herein are only used for illustrating and explaining the present application, and are not used for limiting the present application. In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, and are only used for facilitating the description of the present application and simplifying the description, and are not used for indicating or implying that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only used for description purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0032] The present application provides a transfer device and a transfer method. The following will be described in detail. It should be noted that the description order of the following embodiments is not limited as the preferred order of the embodiments.

[0033] Reference Figure 1The present application provides a transfer device 100 for transferring a plurality of light emitting devices 30 on a carrier substrate 40 to a target substrate 50, the transfer device 100 comprising: a spraying assembly 10, the spraying assembly 10 being provided with a first medium 101 in a liquid state, the spraying assembly 10 being used for spraying the first medium 101 in a liquid state on the light emitting devices 30 located on the carrier substrate 40, the first medium 101 comprising a liquid state, a solid state and a gaseous state; a transfer assembly 20 comprising an adsorption surface 201 and a refrigeration component, the refrigeration component being used for lowering the temperature of the adsorption surface 201 to below the freezing point of the first medium 101, so as to convert the first medium 101 in a liquid state on the light emitting devices 30 to be transferred into a solid state and connect with the adsorption surface 201 of the transfer assembly 20; a heating assembly (not shown in the figure) being used for heating the first medium 101 in a solid state and converting it into a gaseous state after the transfer assembly 20 connected with the light emitting devices 30 is closed with the target substrate 50, so as to separate the transfer assembly 20 from the light emitting devices 30.

[0034] It can be understood that at present, the light emitting devices are usually transferred by adhesion through using viscous materials, such a viscous transfer method needs to use a large amount of glue materials, which increases the production cost, and after completing the mass transfer, the adhesion materials are easily left on the surface of the light emitting devices, the left adhesion materials are difficult to remove and affect the use of the light emitting devices, which leads to poor transfer effect of the light emitting devices. In the present application, the transfer device 100 uses the first medium 101 in a liquid state to convert into the first medium 101 in a solid state to connect the transfer assembly 20 and the light emitting devices 30, and the first medium 101 in a solid state converts into the first medium 101 in a gaseous state to separate the transfer assembly 20 and the light emitting devices 30, so as to complete the transfer of the light emitting devices 30, which avoids the use of viscous materials in the transfer process, reduces the production cost, solves the problem of adhesion material left in the existing transfer technology, does not affect the use of the light emitting devices, and realizes better transfer effect.

[0035] It should be noted that when the adhesive material is used to transfer the light emitting device, the adhesion between the adhesive material and the light emitting device is difficult to control, and meanwhile, the alignment of the adhesive material is difficult during the transfer process, which reduces the transfer efficiency and leads to poor transfer effect. In the embodiment of the present application, the spraying assembly 10 uniformly sprays the liquid first medium 101 on the light emitting device 30, and the adsorption surface 201 contacts the liquid first medium 101 to change the liquid first medium 101 into the solid first medium 101. The solid first medium 101 connects the transfer assembly 20 and the light emitting device 30, the adhesion between the transfer assembly 20 and the light emitting device 30 is uniform and stable, and the transfer assembly 20 does not need to be aligned with the light emitting device 30. Any area on one side of the adsorption surface 201 can contact the liquid first medium 101 on the light emitting device 30 to change the liquid first medium 101 into the solid first medium 101, connect the transfer assembly 20 and the light emitting device 30, and transfer the light emitting device 30, which further improves the transfer efficiency and achieves better transfer effect.

[0036] In the embodiment of the present application, the light emitting device 30 can be a Micro LED, and the target substrate 50 is provided with an area for placing the light emitting device 30. The positional relationship between the carrier substrate 40 and the target substrate 50 is not limited.

[0037] In some embodiments, the refrigeration component includes a sheet-shaped semiconductor refrigeration sheet (not shown in the figure), and the adsorption surface 201 is located on the heat absorption surface of the semiconductor refrigeration sheet.

[0038] It can be understood that the working principle of the semiconductor cooling sheet is to utilize the Peltier effect. When a direct current passes through an electric couple composed of two different semiconductor materials, heat can be absorbed and released at the two ends of the electric couple, respectively, so that the purpose of refrigeration can be achieved. Specifically, the refrigeration component includes the semiconductor cooling sheet, which is composed of two different semiconductor materials, such as an N-type semiconductor material and a P-type semiconductor material. When a current passes through the thermocouple composed of the two different semiconductor materials, heat transfer occurs between the two ends, and heat is transferred from one end to the other end, thereby generating a temperature difference to form cold and hot ends. The adsorption surface 201 is located at the heat absorption end of the semiconductor cooling sheet. When a current passes through the semiconductor cooling sheet, the semiconductor cooling sheet absorbs heat on one side of the adsorption surface 201, so that the temperature on one side of the adsorption surface 201 is reduced to below the freezing point of the first medium 101. Contacting the adsorption surface 201 with the first medium 101 in a liquid state on the light-emitting device 30 can convert the first medium 101 in a liquid state into the first medium 101 in a solid state, and the transfer assembly 20 and the light-emitting device 30 are connected.

[0039] In some embodiments, referring to Figure 2 , the transfer assembly 20 includes a transfer substrate 203, the refrigeration component includes a containing cavity 2023 arranged inside the transfer substrate 203 and a second medium 2024 arranged in the containing cavity 2023, and the adsorption surface 201 is located on one side of the transfer substrate 203.

[0040] It can be understood that the second medium 2024 is used to reduce the temperature of the transfer substrate 203, so that the temperature of the adsorption surface 201 is lower than the freezing point of the first medium 101. Contacting the adsorption surface 201 with the first medium 101 in a liquid state on the light-emitting device 30 can convert the first medium 101 in a liquid state into the first medium 101 in a solid state, and the transfer assembly 20 and the light-emitting device 30 are connected.

[0041] It should be noted that the shape of the containing cavity 2023 is not specifically required. In this embodiment, the shape of the containing cavity 2023 is rectangular. In other embodiments, the shape of the containing cavity 2023 can be circular, elliptical, rhombic, or a combination of one or more irregular shapes. It can be understood that the containing cavity 2023 provides sufficient space to accommodate the second medium 2024, so that the second medium 2024 is sufficient to reduce the temperature of the adsorption surface 201 to below the freezing point of the first medium 101. There is no necessary connection between the shape and volume of the containing cavity 2023. Therefore, the shape of the containing cavity is not specifically required.

[0042] In some embodiments, continuing to refer to Figure 2 , the thickness of the inner wall of the transfer substrate 203 on the side of the accommodating cavity 2023 close to the adsorption surface 201 is less than or equal to the thickness of the inner wall on the side of the accommodating cavity 2023 away from the adsorption surface 201.

[0043] Specifically, the second medium 2024 is arranged in the accommodating cavity 2023, and the inner wall between the accommodating cavity 2023 and the adsorption surface 201 serves as a temperature conduction medium, so that the temperature of the adsorption surface 201 is reduced to below the freezing point of the first medium 101. The smaller the thickness of the inner wall between the accommodating cavity 2023 and the adsorption surface 201, the higher the heat conduction rate, the shorter the time for reducing the temperature of the adsorption surface 201 to below the freezing point of the first medium 101, the higher the transfer efficiency, and the temperature of the adsorption surface 201 can also be closer to the temperature of the second medium 2024. When the adsorption surface 201 contacts the first medium 101 in a liquid state on the light emitting device 30, the time for converting the first medium 101 in a liquid state to the first medium 101 in a solid state can be shortened, further improving the transfer efficiency. Further, the inner wall of the transfer substrate 203 on the side of the accommodating cavity 2023 away from the adsorption surface 201 and the inner wall of the transfer substrate 203 in the direction perpendicular to the adsorption surface 201 are both provided with a vacuum layer 2025, that is, except for the inner wall between the adsorption surface 201 and the accommodating cavity 2023, the other inner walls are provided with the vacuum layer 2025. The vacuum layer 2025 is conducive to maintaining the temperature of the second medium 2024 in the accommodating cavity 2023, reducing the heat transfer between the external environment and the second medium 2024, and further improving the transfer efficiency.

[0044] In some embodiments, the first medium 101 can be water, and the second medium 2024 can be liquid nitrogen or dry ice. Specifically, water is a non-toxic, harmless and non-polluting liquid, water has no corrosion to the light emitting device 30 and the transfer assembly 20, and the water vapor state after vaporization diffuses in the air, which also does not pollute the environment; the temperature of liquid nitrogen is minus 196℃ at normal pressure, and the temperature of dry ice is minus 78.5℃ at normal pressure, both of which are lower than the freezing point of water (0℃). Therefore, the second medium 2024 can reduce the temperature of the adsorption surface 201 to below the freezing point of the first medium 101, and when the adsorption surface 201 contacts the first medium 101 in a liquid state on the light emitting device 30, the first medium 101 in a liquid state can be quickly converted to the first medium 101 in a solid state, greatly improving the transfer efficiency.

[0045] In some embodiments, referring to Figure 3The transfer substrate 203 is provided with a plurality of grooves 2026 on one side of the adsorption surface 201. When the transfer substrate 203 is aligned with the light emitting device 30 on the carrier substrate 40, any of the grooves 2026 corresponds to any of the light emitting devices 30 on the carrier substrate 40.

[0046] In the embodiment, the projection of the grooves 2026 on the carrier substrate 40 is rectangular. When the adsorption surface 201 is in contact with the first medium 101 in liquid state on the light emitting device 30, the grooves 2026 are above the light emitting device 30 and correspond to the light emitting device 30 one by one. Any of the grooves 2026 adsorbs any of the light emitting devices 30 on the carrier substrate 40. The projection of any of the grooves 2026 on the carrier substrate 40 covers at least the projection of any of the light emitting devices 30 on the carrier substrate 40. The depth of any of the grooves 2026 is greater than 1 / 2 of the thickness of any of the light emitting devices 30 and less than or equal to the thickness of any of the light emitting devices 30. When the grooves 2026 on the transfer substrate 203 are aligned with the light emitting device 30, the bottom of the grooves 2026 should be in contact with the first medium 101 in liquid state on the light emitting device 30. It can be understood that when the transfer substrate 203 adsorbs the light emitting device 30, the light emitting device 30 is in the groove 2026, the temperature conduction in the groove is faster, and the first medium 101 in liquid state on the light emitting device 30 can be quickly converted into the first medium 101 in solid state, achieving higher transfer efficiency. In other embodiments, the projection of the grooves 2026 on the carrier substrate 40 can also be circular or other irregular shapes, as long as the projection of any of the grooves 2026 on the carrier substrate 40 covers at least the projection of any of the light emitting devices 30 on the carrier substrate 40 when the grooves 2026 on the transfer substrate 203 are aligned with the light emitting device 30, and the depth of any of the grooves 2026 is greater than 1 / 2 of the thickness of any of the light emitting devices 30 and less than or equal to the thickness of any of the light emitting devices 30.

[0047] Referring to Figure 4 and Figure 6 In some embodiments of the present application, the spraying assembly 10 comprises a moving member 102 and at least one spraying element 103 arranged on the moving member 102.

[0048] It can be understood that the moving member 102 comprises a moving device and a liquid storage device, the moving device can be a ball screw or a mechanical arm, the moving device comprises a driving element for driving the moving device to move the spraying assembly 10, and the liquid storage device is used for storing the first medium 101 in a liquid state for spraying by the spraying element 103. The spraying assembly 10 is moved by the moving member 102 in a direction parallel to the carrier substrate 40, the spraying assembly 10 comprises a plurality of spraying elements 103, and the arrangement direction of the spraying elements 103 on the spraying assembly 10 is perpendicular to the moving direction of the spraying assembly 10 moved by the moving member 102. For example, the spraying elements 103 are arranged in a row in a first direction X on the spraying assembly 10, any spraying element 103 corresponds to any light emitting device 30 arranged in the first direction on the carrier substrate 40, the moving direction of the spraying assembly 10 moved by the moving member 102 is a second direction Y, the first direction X is perpendicular to the second direction Y, and both the first direction X and the second direction Y are on a horizontal plane parallel to the carrier substrate 40. When the spraying assembly 10 sprays above the light emitting device 30, the spraying elements 103 on the spraying assembly 10 correspond to the light emitting devices 30 on the carrier substrate 40 one by one, any spraying element 103 corresponds to any light emitting device 30 on the carrier substrate 40, and the spraying is more uniform. The transfer assembly 20 is as described above, and details are not described here. The projection of the adsorbing surface 201 on the carrier substrate 40 covers at least the projection of the light emitting device 30 sprayed by the spraying assembly 10 on the carrier substrate 40.

[0049] In some embodiments of the present application, the heating assembly comprises a welding device, and the welding temperature is higher than the temperature at which the first medium 101 in a solid state is converted into the first medium 101 in a gaseous state. The welding device is used for welding the pins of the light emitting device 30 with the target substrate 50, so as to fix the light emitting device 30 on the target substrate 50. The light emitting device 30 is heated during the welding process, and due to the temperature difference between the light emitting device 30 and the first medium 101 in a solid state on the light emitting device 30, the light emitting device 30 releases heat to the first medium 101 in a solid state. When the temperature of the light emitting device 30 exceeds the temperature at which the first medium 101 in a solid state is converted into the first medium 101 in a gaseous state, the first medium is finally completely converted into a gaseous state and diffused into the air, and there is no residue on the light emitting device 30, and the performance of the light emitting device 30 is not affected.

[0050] Reference is made to Figure 5The application also provides a transfer method using the transfer device of any of the preceding embodiments, the transfer method comprising the following steps:

[0051] S10, providing a carrier substrate 40 and a target substrate 50, the carrier substrate being provided with a plurality of light emitting devices 30 to be transferred.

[0052] S20, spraying the liquid first medium 101 on the light emitting devices 30 on the carrier substrate 40 using the spraying assembly 10.

[0053] Specifically, referring to Figure 6 , moving the spraying assembly 10 above the light emitting devices 30 to be transferred, the spraying elements 103 on the spraying assembly 10 being opposite to the light emitting devices 30 on the carrier substrate 40, moving the spraying assembly 10 in a direction parallel to the carrier substrate 40 by the moving member 102, the spraying direction being perpendicular to the arrangement direction of the spraying elements 103 on the spraying assembly 10, and the spraying elements 103 uniformly spraying the liquid first medium 101 on the light emitting devices 30 to be transferred.

[0054] S30, reducing the temperature of the adsorption surface 201 to below the freezing point of the liquid first medium 101 using the refrigeration member, and moving the adsorption surface 201 of the transfer assembly 20 to contact the liquid first medium 101 on the light emitting devices 30, so that the liquid first medium 101 on the light emitting devices 30 is converted into solid state and connected with the adsorption surface 201 of the transfer assembly 20.

[0055] Specifically, referring to Figure 7 , the refrigeration member absorbs the heat of the adsorption surface 201 to reduce the temperature of the adsorption surface 201 to below the freezing point of the liquid first medium 101, the adsorption surface 201 being in contact with the liquid first medium 101 on the light emitting devices 30, and since the temperature of the adsorption surface 201 is below the freezing point of the liquid first medium 101, there is a temperature difference between the adsorption surface 201 and the liquid first medium 101, the liquid first medium 101 releases heat and solidifies between the adsorption surface 201 and the light emitting devices 30, and the solid first medium 101 connects the transfer assembly 20 and the light emitting devices 30.

[0056] S40, moving the transfer assembly 20 connected with the light emitting devices 30 to be aligned with the target substrate 50, and heating and converting the solid first medium 101 into gaseous state using the heating assembly, so that the transfer assembly 20 is separated from the light emitting devices 30.

[0057] Specifically, referring to Figure 8 The transfer assembly 20 connected with the light emitting device 30 moves above the target substrate 50 and is aligned with the target substrate 50, the heating assembly includes the soldering device, the soldering device can solder the pins of the light emitting device 30 with the target substrate 50, so that the light emitting device 30 is fixed on the target substrate 50, at the same time, the heat generated by soldering makes the temperature of the light emitting device 30 rise, the temperature of the light emitting device 30 is higher than the temperature at which the first medium 101 in a solid state changes into the first medium 101 in a gaseous state, and the first medium finally diffuses into the air in a gaseous state, and the transfer assembly 20 and the light emitting device 30 are separated.

[0058] In summary, the present application provides a transfer device and a transfer method, the first medium 101 in a liquid state is sprayed on the light emitting device 30 by the spraying assembly 10, the transfer assembly 20 with a temperature lower than the freezing point of the first medium 101 contacts the first medium 101 in a liquid state on the light emitting device 30, so that the first medium 101 in a liquid state changes into the first medium 101 in a solid state, the first medium 101 in a solid state connects the transfer assembly 20 and the light emitting device 30, and the transfer of the light emitting device 30 is realized, the use of adhesive material in the transfer process is avoided, the production cost is reduced, the problem of residual adhesive material in the existing transfer technology is solved, the use of the light emitting device is not affected, and better transfer effect is achieved; at the same time, the adsorption force between the transfer assembly 20 and the light emitting device 30 is uniform and stable, the transfer assembly 20 does not need to be aligned with the light emitting device 30, any area on one side of the adsorption surface 201 can contact the first medium 101 in a liquid state on the light emitting device 30, so that the first medium 101 in a liquid state changes into the first medium 101 in a solid state, the transfer assembly 20 and the light emitting device 30 are connected to take out the light emitting device 30, and the transfer efficiency is further improved, and better transfer effect is achieved.

[0059] The embodiments of the present application are described in detail above, specific examples are applied to the principles and implementation modes of the present application, the above description of the embodiments is only used to help understand the method of the present application and its core idea; at the same time, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed, and the above description should not be understood as a limitation of the present application.

Claims

1. A transfer device, characterized by, A transfer device for transferring a plurality of light emitting devices on a carrier substrate to a target substrate, the transfer device comprising: a spraying assembly configured to spray a first medium in a liquid state on the light emitting devices on the carrier substrate, the first medium comprising a liquid state, a solid state and a gaseous state; a transfer assembly comprising an adsorption surface and a refrigeration component, the refrigeration component configured to lower a temperature of the adsorption surface below a freezing point of the first medium, so that the first medium in a liquid state on the light emitting devices to be transferred is converted to a solid state and connected to the adsorption surface of the transfer assembly; the transfer assembly comprises a transfer substrate, the refrigeration component comprises a receiving cavity arranged inside the transfer substrate and a second medium arranged in the receiving cavity, the second medium configured to lower a temperature of the transfer substrate below the freezing point of the first medium, the adsorption surface arranged on a side of the transfer substrate; a thickness of an inner wall of the receiving cavity on a side of the adsorption surface is less than or equal to a thickness of an inner wall of the receiving cavity on a side away from the adsorption surface; a heating assembly configured to heat and convert the first medium in a solid state to a gaseous state after the transfer assembly with the light emitting devices connected is mated with the target substrate, so that the transfer assembly is separated from the light emitting devices.

2. The transfer device of claim 1, wherein, the refrigeration component comprises a semiconductor refrigeration sheet, and the adsorption surface is arranged on a heat absorption surface of the semiconductor refrigeration sheet.

3. The transfer device of claim 1, wherein, a plurality of adsorption grooves are arranged on the side of the adsorption surface of the transfer substrate.

4. The transfer device of claim 1, wherein, the first medium comprises water, and the second medium comprises liquid nitrogen or dry ice.

5. The transfer device of claim 1, wherein, the spraying assembly comprises a moving component and at least one spraying element arranged on the moving component, the moving component configured to drive the spraying element to move above the carrier substrate in a direction parallel to the carrier substrate.

6. The transfer device of claim 1, wherein, the heating assembly comprises a soldering device configured to solder the light emitting devices to the target substrate and heat the first medium, so that the first medium in a solid state is converted to a gaseous state.

7. A transfer method characterized by, a method for transferring a plurality of light emitting devices on a carrier substrate to a target substrate, the method comprising the following steps: providing a carrier substrate and a target substrate, the carrier substrate comprising a plurality of light emitting devices to be transferred; spraying a first medium in a liquid state on the light emitting devices on the carrier substrate by using a spraying assembly; lowering a temperature of an adsorption surface of a transfer assembly below a freezing point of the first medium by using a refrigeration component, and moving the adsorption surface of the transfer assembly to contact the first medium on the light emitting devices, so that the first medium in a liquid state on the light emitting devices is converted to a solid state and connected to the adsorption surface of the transfer assembly; moving the transfer assembly with the light emitting devices connected to the target substrate to be mated, and heating and converting the first medium in a solid state to a gaseous state by using a heating assembly, so that the transfer assembly is separated from the light emitting devices.

8. The transfer method according to claim 7, characterized by, The heating assembly includes a soldering device, and the step of separating the transfer assembly from the light emitting device by heating and converting the first medium from a solid state to a gaseous state using the heating assembly includes: using the soldering device to solder the light emitting device to the target substrate and to heat the first medium to convert the first medium from a solid state to a gaseous state, thereby separating the transfer assembly from the light emitting device.

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