Light emitting diode package device for optical coupling device

Abstract

The application relates to a light emitting diode packaging device for an optical coupling device, wherein a light input first electrode pad and a light input second electrode pad and a light detection first electrode pad and a light detection second electrode pad are arranged on the front surface of a packaging substrate; the light input first electrode pad and the light input second electrode pad are connected with an input power supply through wires; the light detection first electrode pad and the light detection second electrode pad are connected with a current detector through wires; a light input light emitting diode and a light detection diode are arranged on the front surface of the packaging substrate; the light input light emitting diode is electrically connected with the light input first electrode pad and the light input second electrode pad through light input first pads and light input second pads arranged on the light input light emitting diode; the light detection diode is electrically connected with the light detection first electrode pad and the light detection second electrode pad through light detection first pads and light detection second pads arranged on the light detection diode; the light input light emitting diode and the light detection diode are connected through a substrate, and a distributed Bragg reflector is arranged on the front surface of the substrate. The application can not only improve the response frequency of the optical coupling device but also enhance the coupling efficiency of the optical coupling device.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor technology, specifically a light-emitting diode packaging device for optical coupling devices. Background Technology

[0002] Optical couplers are devices that transmit electrical signals using light as a medium. They are widely used in solid-state switches, trigger circuits, and pulse amplifier circuits. The response frequency of an optocoupler is limited by the switching speed of the light source, the coupling distance, and the response speed of the photodetector, and is typically in the range of tens of kHz. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a light-emitting diode packaging device for an optical coupling device that can improve the response frequency and enhance the coupling efficiency of the optical coupling device.

[0004] According to the technical solution provided by the present invention, the light-emitting diode packaged device for the optical coupling device has a light input first electrode pad, a light input second electrode pad, a light detection first electrode pad, and a light detection second electrode pad spaced apart on the front side of the packaged substrate; the light input first electrode pad and the light input second electrode pad are connected to the input power supply through wires; the light detection first electrode pad and the light detection second electrode pad are connected to the current detector through wires.

[0005] On the front side of the packaging substrate, light-emitting diodes and photodetectors are arranged at intervals; the light-emitting diodes are electrically connected to the first light-input electrode pad and the second light-input electrode pad respectively through the first light-input pad and the second light-input pad; the photodetectors are electrically connected to the first light-detector electrode pad and the second light-detector electrode pad respectively through the first light-detector pad and the second light-detector pad.

[0006] The light input LED and the light detection LED are connected through a substrate, and a distributed Bragg reflector is provided on the front side of the substrate.

[0007] Preferably, a first insulating transparent adhesive or a second insulating transparent adhesive is filled between the back of the distributed Bragg reflector and the front of the substrate, as well as the side of the substrate.

[0008] Preferably, a first insulating transparent adhesive or a second insulating transparent adhesive is filled between the back side of the substrate and the front side of the substrate, and the distributed Bragg reflector also covers the side side of the substrate and part of the front side of the first insulating transparent adhesive or the second insulating transparent adhesive.

[0009] Preferably, a second insulating transparent adhesive is filled on the upper side of the substrate, and a first insulating transparent adhesive is filled on the back of the second insulating transparent adhesive. The thickness of the first insulating transparent adhesive is sufficient to cover at least the upper side of the first light input pad, the second light input pad, the first light detection pad, and the second light detection pad. The second insulating transparent adhesive is filled between the back of the first insulating transparent adhesive and the front of the substrate.

[0010] Preferably, the refractive index of the first insulating transparent adhesive is greater than or equal to 1.5, and the refractive index of the second insulating transparent adhesive is less than 1.3.

[0011] Preferably, the substrate between the light-input LED and the photodetector LED and the distributed Bragg reflector are either disconnected or integrally connected.

[0012] A light-emitting diode package for an optical coupling device has a light input first electrode pad, a light input second electrode pad, a light detection first electrode pad, and a light detection second electrode pad spaced apart on the front side of the package substrate; the light input first electrode pad and the light input second electrode pad are connected to an input power supply via wires; the light detection first electrode pad and the light detection second electrode pad are connected to a current detector via wires.

[0013] On the front side of the packaging substrate, light-emitting diodes and photodetectors are spaced apart. The light-emitting diodes and photodetectors are connected through a substrate, and the substrate is connected to the packaging substrate through a packaging insulating transparent adhesive.

[0014] The first light input electrode and the first light input electrode pad on the light input LED are electrically connected through a first light input solder ball and a first interconnect line; the second light input electrode and the second light input electrode pad on the light input LED are electrically connected through a second light input solder ball and a second interconnect line; the first light detection electrode and the first light detection electrode pad on the photodetector diode are electrically connected through a first light detection solder ball and a third interconnect line; the second light detection electrode and the second light detection electrode pad on the photodetector diode are electrically connected through a second light detection solder ball and a fourth interconnect line.

[0015] Preferably, a second insulating transparent adhesive that can cover the lower side of the substrate is filled on the front side of the packaging substrate, a first insulating transparent adhesive that can cover the light input light-emitting diode and the photodetector diode is filled on the front side of the second insulating transparent adhesive, and a second insulating transparent adhesive is filled on the front side of the first insulating transparent adhesive, and the front side of the second insulating transparent adhesive is a convex arc shape, and the first interconnect line, the second interconnect line, the third interconnect line and the fourth interconnect line are located inside the first insulating transparent adhesive and the second insulating transparent adhesive.

[0016] Preferably, the refractive index of the first insulating transparent adhesive is greater than or equal to 1.5, and the refractive index of the second insulating transparent adhesive is less than 1.3.

[0017] This invention can not only improve the response frequency of the optical coupling device, but also enhance the coupling efficiency of the optical coupling device. Attached Figure Description

[0018] Figure 1 This is a top view of Embodiment 1 of the present invention.

[0019] Figure 2 yes Figure 1 AA sectional view.

[0020] Figure 3 This is a cross-sectional view of Embodiment 2 of the present invention.

[0021] Figure 4 This is a cross-sectional view of Embodiment 3 of the present invention.

[0022] Figure 5 This is a cross-sectional view of Embodiment 4 of the present invention.

[0023] Figure 6 This is a top view of Embodiment 5 of the present invention.

[0024] Figure 7 yes Figure 6 BB cross-sectional view.

[0025] Figure 8 This is a cross-sectional view of Embodiment 6 of the present invention.

[0026] Figure 9 This is a cross-sectional view of Embodiment 7 of the present invention. Detailed Implementation

[0027] The present invention will be further described below with reference to specific embodiments.

[0028] The light-input light-emitting diodes in Examples 1 to 5 include: a light-input light-emitting epitaxial stack, which includes a light-input buffer layer, a first light-input semiconductor layer, a light-input active layer, and a second light-input semiconductor layer stacked sequentially on the back side of a substrate; a light-input transparent conductive layer covering a portion of the second light-input semiconductor layer; a first light-input electrode connected to the first light-input semiconductor layer; a second light-input electrode connected to the transparent conductive layer; and a light-input insulating protective layer covering the sidewalls of the light-input light-emitting epitaxial stack and the back side of the transparent conductive layer, the insulating protective layer having a first via and a second via; a first light-input pad electrically connected to the first light-input electrode through the first via, and a second light-input pad electrically connected to the second light-input electrode through the second via.

[0029] The photodetector diodes in Examples 1 to 5 include: a photodetector epitaxial stack, which includes a photodetector buffer layer, a photodetector first semiconductor layer, a photodetector active layer, and a photodetector second semiconductor layer stacked sequentially on the back side of a substrate; a photodetector transparent conductive layer covering a portion of the photodetector second semiconductor layer; a photodetector first electrode connected to the photodetector first semiconductor layer; a photodetector second electrode connected to the photodetector transparent conductive layer; and a photodetector insulating protective layer covering the sidewalls of the photodetector epitaxial stack and the back side of the photodetector transparent conductive layer, the photodetector insulating protective layer having a third via and a fourth via; a photodetector first pad electrically connected to the photodetector first electrode through the third via, and a photodetector second pad electrically connected to the photodetector second electrode through the fourth via.

[0030] The light-input light-emitting diodes in Embodiments 6 and 7 include: a light-input light-emitting epitaxial stack, which includes a light-input buffer layer, a first light-input semiconductor layer, a light-input active layer, and a second light-input semiconductor layer stacked sequentially on the front side of a substrate; a first light-input electrode electrically connected to the first light-input semiconductor layer; and a second light-input electrode electrically connected to the second light-input semiconductor layer.

[0031] The photodetector diodes in Examples 6 and 7 include: a photodetector epitaxial stack, which includes a photodetector buffer layer, a photodetector first semiconductor layer, a photodetector active layer, and a photodetector second semiconductor layer stacked sequentially on the front side of a substrate; a photodetector first electrode electrically connected to the photodetector first semiconductor layer; and a photodetector second electrode electrically connected to the photodetector second electrode.

[0032] Example 1

[0033] A light-emitting diode packaged device for use in optocouplers, such as Figure 1 and Figure 2 As shown, on the front side of the packaging substrate 5, there are spaced light input first electrode pad 5.1, light input second electrode pad 5.2, light detection first electrode pad 5.3, and light detection second electrode pad 5.4; the light input first electrode pad 5.1 and the light input second electrode pad 5.2 are connected to the input power supply 6 through wires; the light detection first electrode pad 5.3 and the light detection second electrode pad 5.4 are connected to the current detector 7 through wires.

[0034] On the front side of the packaging substrate 5, light-emitting diodes 3 and photodetectors 4 are arranged at intervals. The light-emitting diodes 3 are electrically connected to the first light-emitting electrode pad 5.1 and the second light-emitting electrode pad 5.2 via the first light-emitting pad and the second light-emitting pad, respectively. The photodetectors 4 are electrically connected to the first light-emitting electrode pad 5.3 and the second light-emitting electrode pad 5.4 via the first light-emitting pad and the second light-emitting pad, respectively.

[0035] The light input light-emitting diode 3 and the light detection diode 4 are connected through the substrate 2, and a distributed Bragg reflector 1 is provided on the front side of the substrate 2.

[0036] The substrate 2 between the light input LED 3 and the light detection LED 4 and the distributed Bragg reflector 1 are both integrally connected structures.

[0037] This structure effectively improves the optical coupling response frequency and efficiency through precise control and optimization of the spacing between the light-emitting diode 3 (light input diode) and the photodetector diode 4. Simultaneously, the integrated connection structure effectively simplifies the packaging process, improves packaging precision, and thus enhances the consistency of the optical coupling device's performance.

[0038] Example 2

[0039] like Figure 3 As shown, this embodiment adds the following technical features based on embodiment 1: a second insulating transparent adhesive 8.2 is filled between the back of the distributed Bragg reflector 1 and the front of the substrate 5 and the side of the substrate 2, and the refractive index of the second insulating transparent adhesive 8.2 is less than 1.3.

[0040] This structure can effectively enhance the transmission and reception of side light, thereby improving the coupling efficiency of the optical coupling device.

[0041] Example 3

[0042] like Figure 4 As shown, this embodiment adds the following technical features based on embodiment 1: a second insulating transparent adhesive 8.2 is filled between the back side of the substrate 2 and the front side of the substrate 5, and the distributed Bragg reflector 1 also covers the side side of the substrate 2 and part of the front side of the second insulating transparent adhesive 8.2, and the refractive index of the second insulating transparent adhesive 8.2 is less than 1.3.

[0043] Compared to Embodiment 2, this structure can utilize the high reflectivity of the distributed Bragg reflector 1 to reflect a portion of the light from the front to the photodetector diode, further enhancing the light reception on the side of the photodetector diode and thus improving the coupling efficiency of the optical coupling device.

[0044] Example 4

[0045] like Figure 5As shown, this embodiment adds the following technical features based on embodiment 1: a second insulating transparent adhesive 8.2 is filled on the upper side of the substrate 2, and a first insulating transparent adhesive 8.1 is filled on the back of the second insulating transparent adhesive 8.2. The thickness of the first insulating transparent adhesive 8.1 is sufficient to cover at least the upper side of the light input first pad, the light input second pad, the light detection first pad and the light detection second pad, and the second insulating transparent adhesive 8.2 is filled between the back of the first insulating transparent adhesive 8.1 and the front of the substrate 5.

[0046] The first insulating transparent adhesive 8.1 has a refractive index greater than or equal to 1.5, and the second insulating transparent adhesive 8.2 has a refractive index less than 1.3.

[0047] This structure utilizes a principle similar to optical fiber to better confine light within the first insulating transparent adhesive 8.1 region, effectively enhancing light reception on the side of the photodetector diode, thereby improving the coupling efficiency of the optical coupling device.

[0048] Example 5

[0049] like Figure 6 and Figure 7 As shown, the difference between this embodiment and Embodiment 1 is that the substrate 2 between the light input light-emitting diode 3 and the light detection diode 4 and the distributed Bragg reflector 1 are disconnected.

[0050] This structure allows for more flexible adjustment of optical coupling efficiency by adjusting the spacing between the light-input LED and the photodetector LED through packaging.

[0051] Example 6

[0052] like Figure 8 As shown, a light-emitting diode (LED) package for an optical coupling device has a light input first electrode pad 5.1, a light input second electrode pad 5.2, a light detection first electrode pad 5.3, and a light detection second electrode pad 5.4 spaced apart on the front side of the package substrate 5. The light input first electrode pad 5.1 and the light input second electrode pad 5.2 are connected to an input power supply 6 via wires; the light detection first electrode pad 5.3 and the light detection second electrode pad 5.4 are connected to a current detector 7 via wires.

[0053] On the front side of the encapsulation substrate 5, light input light-emitting diodes 3 and light detection diodes 4 are spaced apart. The light input light-emitting diodes 3 and light detection diodes 4 are connected through a substrate 2. The substrate 2 is connected to the encapsulation substrate 5 through an encapsulation insulating transparent adhesive 10.

[0054] The first light input electrode on the light input LED 3 is electrically connected to the first light input electrode pad 5.1 via the first light input solder ball 9.1 and the first interconnect line. The second light input electrode on the light input LED 3 is electrically connected to the second light input electrode pad 5.2 via the second light input solder ball 9.2 and the second interconnect line. The first light detection electrode on the photodetector diode 4 is electrically connected to the first light detection electrode pad 5.3 via the first light detection solder ball 9.3 and the third interconnect line. The second light detection electrode on the photodetector diode 4 is electrically connected to the second light detection electrode pad 5.4 via the second light detection solder ball 9.4 and the fourth interconnect line.

[0055] This structure can also effectively improve the optical coupling response frequency and efficiency through precise control and optimization of the spacing between the light-input LED 3 and the photodetector LED 4. Furthermore, compared to Embodiment 1, the structure of the light-input LED and the photodetector LED is simpler, effectively reducing the cost of the coupling devices.

[0056] Example 7

[0057] like Figure 9 As shown, this embodiment adds the following technical features based on embodiment 6: a second insulating transparent adhesive 8.2 that can cover the lower side of the substrate 2 is filled on the front side of the packaging substrate 5; a first insulating transparent adhesive 8.1 that can cover the light input light-emitting diode 3 and the photodetector diode 4 is filled on the front side of the second insulating transparent adhesive 8.2; a second insulating transparent adhesive 8.2 is filled on the front side of the first insulating transparent adhesive 8.1; and the front side of the second insulating transparent adhesive 8.2 is a convex arc shape; the first interconnect line, the second interconnect line, the third interconnect line and the fourth interconnect line are located within the first insulating transparent adhesive 8.1 and the second insulating transparent adhesive 8.2.

[0058] The first insulating transparent adhesive 8.1 has a refractive index greater than or equal to 1.5, and the second insulating transparent adhesive 8.2 has a refractive index less than 1.3.

[0059] The principle and advantages of this structure are the same as those of Embodiment 4. Compared with Embodiment 4, the structure of the light input light-emitting diode 3 and the light detection diode 4 is simpler, and the cost of the coupling device is lower.

[0060] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A light-emitting diode packaged device for use in optical coupling devices, characterized in that: in The front side of the packaging substrate (5) is provided with a light input first electrode pad (5.1), a light input second electrode pad (5.2), a light detection first electrode pad (5.3), and a light detection second electrode pad (5.4) spaced apart; the light input first electrode pad (5.1) and the light input second electrode pad (5.2) are connected to the input power supply (6) through wires; the light detection first electrode pad (5.3) and the light detection second electrode pad (5.4) are connected to the current detector (7) through wires; On the front side of the packaging substrate (5), there are light-input light-emitting diodes (3) and light-detecting diodes (4) spaced apart; the light-input light-emitting diodes (3) are electrically connected to the light-input first electrode pad (5.1) and the light-input second electrode pad (5.2) on it through the light-input first pad and the light-input second pad respectively; the light-detecting diodes (4) are electrically connected to the light-detecting first electrode pad (5.3) and the light-detecting second electrode pad (5.4) on it through the light-detecting first pad and the light-detecting second pad respectively; The light input light-emitting diode (3) and the light detection diode (4) are connected through the substrate (2), and a distributed Bragg reflector (1) is provided on the front side of the substrate (2). A second insulating transparent adhesive (8.2) is filled on the upper side of the substrate (2), and a first insulating transparent adhesive (8.1) is filled on the back side of the second insulating transparent adhesive (8.2). The thickness of the first insulating transparent adhesive (8.1) is sufficient to cover at least the upper side of the first light input pad, the second light input pad, the first light detection pad, and the second light detection pad. The second insulating transparent adhesive (8.2) is filled between the back side of the first insulating transparent adhesive (8.1) and the front side of the substrate (5). The first insulating transparent adhesive (8.1) has a refractive index greater than or equal to 1.5, and the second insulating transparent adhesive (8.2) has a refractive index less than 1.

3.

2. The light-emitting diode package device for an optocoupler as described in claim 1, characterized in that: The substrate (2) between the light input light-emitting diode (3) and the light detection diode (4) and the distributed Bragg reflector (1) are either disconnected or integrally connected.

3. A light-emitting diode packaged device for use in optical coupling devices, characterized in that: in The front side of the packaging substrate (5) is provided with a light input first electrode pad (5.1), a light input second electrode pad (5.2), a light detection first electrode pad (5.3), and a light detection second electrode pad (5.4) spaced apart; the light input first electrode pad (5.1) and the light input second electrode pad (5.2) are connected to the input power supply (6) through wires; the light detection first electrode pad (5.3) and the light detection second electrode pad (5.4) are connected to the current detector (7) through wires; On the front side of the encapsulation substrate (5), there are light input light-emitting diodes (3) and light detection diodes (4) spaced apart. The light input light-emitting diodes (3) and light detection diodes (4) are connected through a substrate (2). The substrate (2) is connected to the encapsulation substrate (5) through an encapsulation insulating transparent adhesive (10). The first light input electrode on the light input LED (3) is electrically connected to the first light input electrode pad (5.1) via the first light input solder ball (9.1) and the first interconnect line; the second light input electrode on the light input LED (3) is electrically connected to the second light input electrode pad (5.2) via the second light input solder ball (9.2) and the second interconnect line; the first light detection electrode on the photodetector diode (4) is electrically connected to the first light detection electrode pad (5.3) via the first light detection solder ball (9.3) and the third interconnect line; the second light detection electrode on the photodetector diode (4) is electrically connected to the second light detection electrode pad (5.4) via the second light detection solder ball (9.4) and the fourth interconnect line. A second insulating transparent adhesive (8.2) that can cover the lower side of the substrate (2) is filled on the front side of the packaging substrate (5). A first insulating transparent adhesive (8.1) that can cover the light input light-emitting diode (3) and the photodetector diode (4) is filled on the front side of the second insulating transparent adhesive (8.2). A second insulating transparent adhesive (8.2) is filled on the front side of the first insulating transparent adhesive (8.1). The front side of the second insulating transparent adhesive (8.2) is a convex arc shape. The first interconnect line, the second interconnect line, the third interconnect line and the fourth interconnect line are located in the first insulating transparent adhesive (8.1) and the second insulating transparent adhesive (8.2). The first insulating transparent adhesive (8.1) has a refractive index greater than or equal to 1.5, and the second insulating transparent adhesive (8.2) has a refractive index less than 1.3.

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