Substrate processing apparatus

Abstract

A substrate processing apparatus includes an adsorption holding mechanism, a rotation mechanism, a plurality of lift pins, an up-and-down movement mechanism, and a horizontal movement mechanism. The adsorption holding mechanism adsorbs and holds a substrate. The rotation mechanism rotates the adsorption holding mechanism holding the substrate around a rotation axis. The up-and-down movement mechanism moves the plurality of lift pins in an up-and-down direction. A sensor measures an eccentric state of the substrate (W) held by the adsorption holding mechanism. The up-and-down movement mechanism supports the substrate from the adsorption holding mechanism by moving the plurality of lift pins, and in a state where the substrate is supported, the horizontal movement mechanism moves the plurality of lift pins in a horizontal direction based on the eccentric state of the substrate measured by the sensor.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate processing apparatus. BACKGROUND

[0002] Conventionally, there has been proposed a substrate processing apparatus (for example, Patent Documents 1 to 3) which horizontally holds a circular plate-shaped substrate and processes the substrate while rotating the substrate around a vertical rotation axis passing through the center of the substrate. These substrate processing apparatuses include a vacuum chuck portion which sucks a lower surface of the substrate, a rotation portion which rotates the vacuum chuck portion around the rotation axis, and a positioning mechanism for adjusting the position of the substrate. The positioning mechanism makes the center of the substrate coincide with the rotation axis by sliding the substrate placed on the vacuum chuck portion with respect to the vacuum chuck portion by pushing an end portion of the substrate in the horizontal direction. Thereby, the substrate is rotated around the rotation axis passing through the center of the substrate.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT DOCUMENTS

[0005] Patent Document 1: Japanese Patent Application Publication No. 2011-258924

[0006] Patent Document 2: Japanese Patent Application Publication No. 2011-258925

[0007] Patent Document 3: Japanese Patent Application Publication No. 2019-149423 SUMMARY

[0008] PROBLEMS TO BE SOLVED BY THE INVENTION

[0009] In Patent Documents 1 to 3, since the positioning mechanism slides the substrate with respect to the vacuum chuck portion, there is a possibility that the lower surface of the substrate is damaged or contaminated.

[0010] Therefore, an object of the present application is to provide a substrate processing apparatus which can reduce damage or contamination of the lower surface of the substrate and reduce the eccentric state of the substrate.

[0011] MEANS FOR SOLVING THE PROBLEMS

[0012] A first aspect of a substrate processing apparatus for processing a substrate includes: an adsorption holding mechanism that adsorbs a back surface of a substrate and holds the substrate horizontally; a rotation mechanism that rotates the adsorption holding mechanism holding the substrate about a rotation axis in a vertical direction passing through a center of the substrate; a plurality of lift pins provided at positions opposed to the substrate held by the adsorption holding mechanism below the substrate; an up-down movement mechanism that moves upper ends of the plurality of lift pins in an up-down direction between a first position above an adsorption surface of the adsorption holding mechanism and a second position below the adsorption surface; a horizontal movement mechanism that moves the plurality of lift pins relative to the adsorption holding mechanism in a horizontal direction; and a sensor that measures an eccentric state of the substrate held by the adsorption holding mechanism. The up-down movement mechanism supports the substrate from the adsorption holding mechanism by moving the plurality of lift pins to the first position. The horizontal movement mechanism moves the plurality of lift pins in the horizontal direction based on the eccentric state of the substrate measured by the sensor in a state where the substrate is supported.

[0013] A second aspect of a substrate processing apparatus according to the first aspect includes that the rotation mechanism is linked to a shaft extending downward from the adsorption holding mechanism, and the up-down movement mechanism and the horizontal movement mechanism are linked to a housing member that houses the rotation mechanism.

[0014] A third aspect of a substrate processing apparatus according to the second aspect includes that the up-down movement mechanism and the horizontal movement mechanism are provided at an upper surface portion of the housing member.

[0015] A fourth aspect of a substrate processing apparatus according to any one of the first to third aspects includes that the plurality of lift pins are integrally moved in conjunction with each other.

[0016] A fifth aspect of a substrate processing apparatus according to any one of the first to fourth aspects includes that the plurality of lift pins are arranged at equal intervals on an imaginary circle centered on the rotation axis.

[0017] A sixth aspect of a substrate processing apparatus according to any one of the first to fifth aspects includes that, in a plan view, the plurality of lift pins are located within an annular region sandwiched by an imaginary inner circle and an imaginary outer circle. The imaginary inner circle has a radius of one fourth of a radius of the substrate held by the adsorption holding mechanism. The imaginary outer circle has a radius of three fourths of the radius of the substrate.

[0018] The seventh aspect of the substrate processing apparatus according to any one of the first to sixth aspects, wherein the plurality of lift pins are located outward of the adsorption holding mechanism in plan view.

[0019] The eighth aspect of the substrate processing apparatus according to any one of the first to sixth aspects, wherein a through-hole is formed in the adsorption holding mechanism by the plurality of lift pins.

[0020] The ninth aspect of the substrate processing apparatus according to any one of the first to sixth aspects, wherein the adsorption holding mechanism has a ring shape surrounding the rotation shaft, and the plurality of lift pins are located inward of the adsorption holding mechanism in plan view.

[0021] The tenth aspect of the substrate processing apparatus according to any one of the first to ninth aspects, wherein an adsorption port that adsorbs the substrate is formed in an upper end of at least one of the plurality of lift pins.

[0022] Effects of Invention

[0023] According to the substrate processing apparatus, damage or contamination of the lower surface of the substrate can be reduced, and the eccentric state of the substrate can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 FIG. 1 is a plan view schematically showing an example of the overall structure of a substrate processing system.

[0025] Figure 2 FIG. 2 is a diagram schematically showing an example of the structure of a substrate processing apparatus.

[0026] Figure 3 FIG. 3 is a diagram showing an example of a part of the structure of the substrate processing apparatus in an enlarged manner.

[0027] Figure 4 FIG. 4 is a plan view schematically showing an example of the structure of an adsorption holding mechanism and a lift pin.

[0028] Figure 5 FIG. 5 is a diagram schematically showing an example of the structure of a sensor and a substrate.

[0029] Figure 6 FIG. 6 is a graph showing an example of the relationship between the amount of light received and the rotational position of the substrate.

[0030] Figure 7 FIG. 7 is a block diagram schematically showing an example of the internal structure of a control unit.

[0031] Figure 8 FIG. 8 is a flowchart showing an example of the operation of the substrate processing apparatus.

[0032] Figure 9A plan view schematically showing an example of a structure of the substrate.

[0033] Figure 10 A flowchart showing a specific example of the position adjustment process of the substrate.

[0034] Figure 11 A plan view schematically showing another example of a structure of the lift pin and the adsorption holding mechanism.

[0035] Figure 12 A plan view schematically showing another example of a structure of the adsorption holding mechanism.

[0036] Figure 13 A plan view schematically showing an example of a structure of the lift pin.

[0037] Figure 14 A flowchart showing another example of the operation of the substrate processing apparatus 1.

[0038] Figure 15 A view schematically showing an example of a structure of the sensor 60A. DETAILED DESCRIPTION

[0039] Hereinafter, an embodiment will be described with reference to the drawings. Note that the structural elements described in the present embodiment are merely examples, and do not limit the scope of the present disclosure. In order to facilitate understanding, in the drawings, there are cases in which the size, the number, and the like of each part are exaggerated or simplified as needed.

[0040] Unless particularly stated, expressions indicating relative or absolute positional relationships (for example, "in a direction", "along a direction", "parallel", "orthogonal", "center", "concentric", "coaxial", and the like) not only strictly indicate the positional relationships, but also indicate states in which the positional relationships are relatively shifted in angle or distance within a range of tolerance or a range in which the same degree of function can be obtained. Unless particularly stated, expressions indicating equal states (for example, "identical", "equal", "uniform", and the like) not only strictly and quantitatively indicate the equal states, but also indicate states in which there is a difference within a range of tolerance or a range in which the same degree of function can be obtained. Unless particularly stated, expressions indicating shapes (for example, "quadrilateral shape" or "cylindrical shape", and the like) not only strictly indicate the shapes in geometry, but also indicate shapes having, for example, concavities and convexities, chamfers, and the like within a range in which the same degree of effect can be obtained. Expressions such as "provided with", "having", "including", or "comprising" a structural element are not exclusive expressions of the presence of other structural elements. The expression "at least any one of A, B, and C" includes only A, only B, only C, any two of A, B, and C, and all of A, B, and C.

[0041] First Embodiment

[0042] <Brief Structure of the Substrate Processing System>

[0043] Figure 1 This figure schematically illustrates an example of the structure of a substrate processing system 100. The substrate processing system 100 is a monolithic substrate processing system that processes generally circular substrates W, such as semiconductor wafers, one by one using a processing liquid such as a chemical solution or washing solution. The substrate processing system 100 includes: an indexing block 110; a processing block 120 coupled to the indexing block 110; and a control unit 130 that controls the operation of devices provided in the substrate processing system 100 and the opening and closing of valves.

[0044] The indexing block 110 includes a carrier holding section 111, an indexing robot IR, and an IR moving mechanism 112. The carrier holding section 111 holds a carrier C capable of accommodating multiple substrates W. The multiple carriers C are held in the carrier holding section 111 in a horizontal carrier arrangement direction D. The IR moving mechanism 112 moves the indexing robot IR along the carrier arrangement direction D. The indexing robot IR performs a loading action of moving the substrates W into the carrier C held in the carrier holding section 111, and a loading action of moving the substrates W out of the carrier C. The substrates W are transported by the indexing robot IR in a horizontal posture. Here, "horizontal posture" means that the thickness direction of the substrate W is along the vertical direction.

[0045] On the other hand, the processing block 120 includes a plurality of (e.g., four or more) processing units 121 for processing the substrate W, and a central robot CR. The plurality of processing units 121 are configured to surround the central robot CR in a top view. The plurality of processing units 121 include, for example, a solution supply unit 121a that supplies a solution to the substrate W; a reaction unit 121b that causes a reaction between the solution and the substrate W; and a washing unit 121c that rinses the solution supplied to the substrate W. The central robot CR performs a loading action of moving the substrate W into the processing units 121 and a loading action of moving the substrate W out of the processing units 121. Furthermore, the central robot CR transports the substrate W between the plurality of processing units 121. The substrate W is transported by the central robot CR in a horizontal orientation. The central robot CR picks up the substrate W from the self-indexing robot IR and transfers the substrate W to the indexing robot IR.

[0046] <Structure of substrate processing device 1>

[0047] Figure 2 This figure schematically illustrates an example of the structure of a substrate processing apparatus 1, which is a processing unit 121. Figure 3 This figure shows an enlarged and schematic representation of a portion of the structure of the substrate processing apparatus 1. The substrate processing apparatus 1 includes an adsorption and holding mechanism 10, a rotation mechanism 20, a lifting pin 30, a vertical movement mechanism 40, a horizontal movement mechanism 50, a sensor 60, and a processing unit 90.

[0048] The adsorption holding mechanism 10 adsorbs the back surface of the substrate W and holds the substrate W horizontally. The so-called "back surface" herein refers to, for example, a surface of a main surface of the substrate W on which no component is formed. The substrate W is held by the adsorption holding mechanism 10 in a posture with the back surface facing downward. In Figure 2 In the example, the adsorption holding mechanism 10 includes an adsorption member 11 on which the substrate W is placed on an adsorption surface 11a of the adsorption member 11. In Figure 2 In the example, the adsorption member 11 includes a plate-shaped member 12 having the adsorption surface 11a on an upper surface thereof and a cylindrical member 13 extending downward from a central portion of a lower surface of the plate-shaped member 12. The adsorption surface 11a of the adsorption member 11 is, for example, circular in plan view. The diameter of the adsorption surface 11a of the adsorption member 11 is smaller than the diameter of the substrate W, for example, one fourth or less of the diameter of the substrate W.

[0049] An unillustrated adsorption port is formed on the adsorption surface 11a of the adsorption member 11. A plurality of adsorption ports can also be formed dispersedly on the adsorption surface 11a. An unillustrated internal flow path connected to the adsorption port is formed inside the adsorption member 11. The internal flow path is connected to a suction mechanism 16 via a suction pipe 15. The suction mechanism 16 includes, for example, a pump that suctions gas from the inside of the suction pipe 15. Thus, gas is suctioned from the adsorption port of the adsorption surface 11a, and further, the substrate W is adsorbed and held on the adsorption member 11. The suction mechanism 16 is controlled by a control section 130.

[0050] The rotation mechanism 20 rotates the adsorption holding mechanism 10 (more specifically, the adsorption member 11) about a rotation axis Ql. Thus, the substrate W adsorbed and held on the adsorption holding mechanism 10 is also rotated about the rotation axis Ql. The rotation axis Ql is an imaginary axis extending in the vertical direction.

[0051] The rotation mechanism 20 includes a motor 21. The motor 21 is coupled to the adsorption member 11 via a shaft 22. The shaft 22 extends along the rotation axis Ql, and an upper end thereof is coupled to the adsorption member 11. Specifically, the upper end of the shaft 22 is coupled to the cylindrical member 13 of the adsorption member 11. The shaft 22 is, for example, a hollow shaft having a cylindrical shape, and the suction pipe 15 is connected to the internal flow path of the adsorption member 11 through the hollow portion of the shaft 22.

[0052] The motor 21 is coupled to the shaft 22 and rotates the shaft 22 about the rotation axis Ql. In Figure 2 In the example, the motor 21 is disposed coaxially with the shaft 22. The shaft 22 extends upward from the motor 21. The motor 21 rotates the shaft 22, and thus, the adsorption member 11 can be rotated about the rotation axis Ql. The motor 21 is controlled by the control section 130.

[0053] The motor 21 is housed in a motor housing member 70. The motor housing member 70 has at least an upper surface portion 71 and a side surface portion 72 (also refer to Figure 3The upper surface portion 71 is located above the motor 21. The upper surface portion 71 has a substantially plate-like shape, for example, a circular plate-like shape centered on the rotation axis Ql. A through-hole 71a through which the shaft 22 passes is formed in a central portion of the upper surface portion 71. An unillustrated seal bearing can also be provided in the through-hole 71a of the upper surface portion 71. Specifically, an inner ring of the seal bearing is attached to an outer peripheral surface of the shaft 22, and an outer ring is attached to the upper surface portion 71. As a result, the shaft 22 is rotatably coupled to the motor housing member 70.

[0054] The side surface portion 72 has a cylindrical shape and extends downward from an outer peripheral edge of the upper surface portion 71. The side surface portion 72 surrounds the side surface of the motor 21. The lower end peripheral edge of the side surface portion 72 can be located at the same level as the lower end of the motor 21, for example, or can be located downward. The lower end peripheral edge of the side surface portion 72 is coupled to the floor of the substrate processing apparatus 1, for example. The floor of the substrate processing apparatus 1 is the upper surface of a support table provided with a plurality of processing units 121 (substrate processing apparatus 1), for example. The motor housing member 70 can be directly coupled to the floor of the substrate processing apparatus 1, or can be coupled to the floor via another fixing body such as a plate-like pedestal.

[0055] The motor housing member 70 is fixed within the substrate processing apparatus 1 and is a non-driven body that does not substantially displace. That is, no driven body is provided between the motor housing member 70 and the floor of the substrate processing apparatus 1.

[0056] The motor housing member 70 protects the motor 21 from the outside processing ambient gas. As a specific example, the motor 21 can be protected from the chemical liquid ejected from the nozzle 91 described below and the cleaning liquid ejected from a cleaning nozzle (not shown).

[0057] The processing portion 90 processes the substrate W held by the adsorption holding mechanism 10. In this embodiment, the processing portion 90 performs a bevel processing in which a processing liquid is supplied to the peripheral edge portion of the substrate W. In this embodiment, the processing portion 90 includes a nozzle 91, a pipe 92, and a valve 93. The nozzle 91 ejects a processing liquid to the peripheral edge portion of the substrate W held by the adsorption holding mechanism 10. In this embodiment, the nozzle 91 is located above the peripheral edge portion of the substrate W. Figure 2 Figure 2 The peripheral edge portion of the substrate W corresponds to a ring-shaped region having a predetermined width from the peripheral edge of the substrate W. The diameter of the substrate W is several hundred mm, for example, and the predetermined width is several mm or less, for example. The processing liquid includes a chemical liquid such as an etching liquid that can remove impurities (metal, etc.) adhering to the peripheral edge portion of the substrate W, for example.

[0058] The peripheral edge portion of the substrate W corresponds to a ring-shaped region having a predetermined width from the peripheral edge of the substrate W. The diameter of the substrate W is several hundred mm, for example, and the predetermined width is several mm or less, for example. The processing liquid includes a chemical liquid such as an etching liquid that can remove impurities (metal, etc.) adhering to the peripheral edge portion of the substrate W, for example.

[0059] ​Nozzle 91 is connected to processing liquid supply source 94 via piping 92. Processing liquid supply source 94 supplies the drug solution to nozzle 91 via piping 92. Nozzle 91 dispenses the drug solution toward the periphery of the surface of substrate W. Valve 93 is inserted in the piping 92. Valve 93 switches the opening and closing of the internal flow path of piping 92. Valve 93 is controlled by control unit 130. Valve 93 may also be a valve capable of adjusting the flow rate of the drug solution flowing inside piping 92.

[0060] With the rotating mechanism 20 causing the adsorption holding mechanism 10 and the substrate W to rotate, the valve 93 is opened, thereby supplying the liquid medicine to the periphery of the rotating substrate W through the nozzle 91. As a result, the liquid medicine is supplied throughout the entire periphery of the substrate W, and impurities at the periphery of the substrate W are removed (so-called edge treatment). The liquid medicine is dispersed outward from the periphery of the substrate W due to the centrifugal force accompanying the rotation of the substrate W.

[0061] exist Figure 2 In this example, nozzle 91 can move between a processing position and a standby position via nozzle moving mechanism 95. Nozzle moving mechanism 95 includes, for example, a motor and is controlled by control unit 130. The processing position is the position where nozzle 91 dispenses the liquid medicine. Figure 2 In the example, the position is above the substrate W and opposite the periphery of the substrate W. The standby position is the position where the nozzle 91 does not dispense liquid, which is, for example, a position that is not opposite to the substrate W in the vertical direction. That is, for example, the standby position is a position that is outside the periphery of the substrate W when viewed from above.

[0062] The processing unit 90 can also dispense various processing liquids to the periphery of the substrate W. For example, the processing unit 90 can have multiple nozzles corresponding to the types of processing liquids. For example, as processing liquids, chemical solutions and washing solutions can be used. Furthermore, as chemical solutions, two types of chemical solutions can be used (e.g., an alkaline chemical solution and an acidic chemical solution). As washing solutions, for example, pure water can be used. These nozzles can be arranged circumferentially along the substrate W and integrally connected to each other. Such a structure connecting multiple nozzles is also called a nozzle head.

[0063] The following description describes a configuration where a washing nozzle is provided in addition to nozzle 91. Specifically, the processing unit 90 may also include, for example, a washing nozzle, washing piping, and a washing valve (not shown). The washing nozzle dispenses washing liquid into the periphery of the substrate W held by the adsorption and holding mechanism 10. The washing liquid is a processing liquid used to rinse the chemical solution on the periphery of the substrate W.

[0064] The washing nozzle is connected to the washing liquid supply source via a washing pipe. A washing valve is inserted into the washing pipe to switch the opening and closing of the internal flow path of the washing pipe. The washing valve is controlled by the control unit 130. The washing valve may also be a valve capable of adjusting the flow rate of the washing liquid flowing inside the washing pipe.

[0065] The processing section 90 supplies the rinse liquid after supplying the liquid chemical to the peripheral portion of the substrate W, and thereby can flush the liquid chemical on the peripheral portion of the substrate W. In other words, the liquid chemical on the peripheral portion of the substrate W can be replaced with the rinse liquid. The rinse liquid is scattered outward from the periphery of the substrate W by the centrifugal force accompanying the rotation of the substrate W. The rinse nozzle is connected to, for example, the nozzle 91, and is movable between the processing position and the standby position by the nozzle moving mechanism 95.

[0066] In Figure 2 In the example, the substrate processing apparatus 1 further includes a shield 96. The shield 96 has a cylindrical shape that surrounds the substrate W in plan view. The shield 96 blocks the processing liquid scattered from the periphery of the substrate W, and causes the processing liquid to flow to a recovery section not shown. The shield 96 is movable in the vertical direction by a shield moving mechanism 97. The shield moving mechanism 97 moves the shield 96 between an upper position in which the upper end of the shield 96 is located above the substrate W, and a lower position in which the upper end of the shield 96 is located below the substrate W. The shield moving mechanism 97 includes, for example, a cylinder mechanism or a ball screw mechanism.

[0067] In addition, in the above-described edge processing, the impurities of the peripheral portion of the substrate W are removed by the liquid chemical. On the other hand, the area inside the peripheral portion in the surface of the substrate W corresponds to a component area in which a component is formed, and thus it is desirable that the liquid chemical not intrude into this component area. Therefore, the landing position of the liquid chemical with respect to the substrate W is important. For example, if the center of the substrate W is offset from the rotation axis Q1, that is, if the substrate W is eccentric, the landing position of the liquid chemical with respect to the substrate W varies in the radial direction with the rotation of the substrate W. If this variation becomes large, the liquid chemical enters the component area, and thus it is desirable that the offset (eccentricity) of the center of the substrate W from the rotation axis Q1 be small.

[0068] In the present embodiment, the substrate processing apparatus 1 includes a position adjustment mechanism for adjusting the position of the substrate W in the horizontal plane, and eliminating the eccentric state of the substrate W. Specifically, the substrate processing apparatus 1 includes a plurality of lift pins 30, an up-down moving mechanism 40, and a horizontal moving mechanism 50 as the position adjustment mechanism.

[0069] The plurality of lift pins 30 are provided at positions opposed to the back surface of the substrate W held by the adsorption holding mechanism 10. That is, the plurality of lift pins 30 are provided below the substrate W and on the rotation axis Q1 side of the periphery of the substrate W. Each lift pin 30 has an elongated shape extending in the up-down direction. Specifically, the lift pin 30 has a rod shape having a length in the up-down direction longer than in the horizontal direction. Here, the up-down direction is parallel to the vertical direction. The front end portion of the lift pin 30 can also have a tapered shape in which the width becomes narrower toward the upper side. In Figure 2 In the example, the upper end of the lift pin 30 has a shape along a semisphere.

[0070] The plurality of lift pins 30 are arranged around the rotation axis Ql, and more specifically, are arranged at equal intervals on an imaginary circle centered on the rotation axis Ql. Figure 4 A plan view schematically showing an example of the structure of the adsorption holding mechanism 10 and the lift pins 30. In Figure 4 In this example, three lift pins 30 are arranged at 120-degree intervals. The number of lift pins 30 can be changed as appropriate.

[0071] The plurality of lift pins 30 are configured to be movable in the up-and-down direction. The up-and-down moving mechanism 40 moves the plurality of lift pins 30 to and from between an upper position and a lower position. The lower position is a position in which the upper ends of the lift pins 30 are lower than the adsorption surface 11a of the adsorption holding mechanism 10. In Figure 2 and Figure 3 The lift pins 30 are in the lower position. The upper position is a position in which the upper ends of the lift pins 30 are higher than the adsorption surface 11a of the adsorption holding mechanism 10. The plurality of lift pins 30 are capable of supporting the substrate W in a state in which they are in the upper position. In Figure 3 In this example, the lift pins 30 and the substrate W in the upper position are shown by imaginary lines. The structure of the up-and-down moving mechanism 40 is not particularly limited, but includes, for example, a linear motor mechanism, a ball screw mechanism, or a cylinder mechanism, and is controlled by the control section 130.

[0072] The plurality of lift pins 30 can also be connected to each other by a connecting member 31, for example. The connecting member 31 has a plate-like shape in a ring shape around the rotation axis Ql. In Figure 3 and Figure 4 In this example, the lift pins 30 protrude upward from the upper surface of the connecting member 31. The up-and-down moving mechanism 40 moves the connecting member 31 in the up-and-down direction. Thus, the plurality of lift pins 30 connected to the connecting member 31 are integrally moved in the up-and-down direction.

[0073] The up-and-down moving mechanism 40 includes a fixed body 41, a movable body 42, and a drive mechanism 43. In Figure 3 In this example, the fixed body 41, the movable body 42, and the drive mechanism 43 are schematically shown by squares. In addition, Figure 3 The shapes, sizes, and positional relationships of the respective squares shown in the drawing are not indicative of the shapes, sizes, and positional relationships of the fixed body 41, the movable body 42, and the drive mechanism 43. This point is also true for the horizontal moving mechanism 50 described later.

[0074] The movable body 42 is configured to be movable in the up-down direction with respect to the fixed body 41. The drive mechanism 43 acts on the movable body 42 with a driving force for moving the movable body 42 in the up-down direction with respect to the fixed body 41. The drive mechanism 43 includes, for example, a motor. The movable body 42 is connected to a rotor of the motor, for example, via a link member or the like that is displaced by the motor, whereby the movable body 42 is moved in the up-down direction with respect to the fixed body 41. The movable body 42 is connected to the link member 31. The drive mechanism 43 moves the movable body 42 in the up-down direction with respect to the fixed body 41, whereby the link member 31 connected to the movable body 42, and the plurality of lift pins 30 connected to the link member 31 are integrally moved in the up-down direction.

[0075] The plurality of lift pins 30 are integrally moved from the lower position to the upper position, whereby the substrate W can be lifted from the adsorption holding mechanism 10 in a state where the substrate W is placed on the adsorption surface 11a of the adsorption holding mechanism 10. At this time, the upper ends of the plurality of lift pins 30 abut against the back surface of the substrate W, and the plurality of lift pins 30 horizontally support the substrate W. The lift pins 30 can also abut against the lower surface of the substrate W in point contact. Thus, the contamination of the lower surface of the substrate W by the lift pins 30 can be reduced.

[0076] The horizontal movement mechanism 50 moves the plurality of lift pins 30 horizontally. The horizontal movement mechanism 50 moves the plurality of lift pins 30 integrally in one direction in the horizontal direction, for example. In the following description, the one direction is referred to as the horizontal movement direction. The horizontal movement direction is a direction along the radial direction of the rotation axis Q1. The horizontal movement mechanism 50 is not particularly limited, but includes, for example, a linear motor mechanism, a ball screw mechanism, or a cylinder mechanism, and is controlled by the control section 130.

[0077] The horizontal movement mechanism 50 includes a fixed body 51, a movable body 52, and a drive mechanism 53. The movable body 52 is configured to be movable in the horizontal movement direction with respect to the fixed body 51. The drive mechanism 53 acts on the movable body 52 with a driving force for moving the movable body 52 with respect to the fixed body 51. For example, in the case where the horizontal movement mechanism 50 has a linear motor mechanism, the drive mechanism 53 is a linear motor. The linear motor includes a stator and a mover, and moves the mover with respect to the stator in the horizontal movement direction. For example, the linear motor includes a coil mounted to the stator and a permanent magnet mounted to the mover, and moves the mover with respect to the stator in the horizontal movement direction by the magnetic action thereof. The fixed body 51 is connected to the stator of the linear motor, and the movable body 52 is connected to the mover of the linear motor.

[0078] The movable body 52 of the horizontal movement mechanism 50 is connected to the fixed body 41 of the up-down movement mechanism 40. Thus, by moving the movable body 52 in the horizontal movement direction, the up-down movement mechanism 40, the link member 31, and the plurality of lift pins 30 are integrally moved in the horizontal movement direction.

[0079] A position measurement sensor 55 may also be provided in the substrate processing apparatus 1. This position measurement sensor 55 detects the position of the movable body 52 of the horizontal movement mechanism 50 in the horizontal movement direction. The position measurement sensor 55 is also referred to as a linear encoder. For example, the position measurement sensor 55 includes a scale extending in the horizontal movement direction and a scanning member configured to move in the horizontal movement direction relative to the scale. The scanning member is connected to the movable body 52 and moves integrally with the movable body 52. ​​The scanning member may include, for example, a light source for illuminating light onto the scale and a light-receiving element for receiving light transmitted through or reflected from the scale. By illuminating the scale with light, the position of the scanning member relative to the scale, that is, the position of the movable body 52 in the horizontal movement direction, is detected. The position measurement sensor 55 outputs an electrical signal indicating the position of the movable body 52 to the control unit 130. The position measurement sensor 55 may also be integrated into the horizontal movement mechanism 50. The control unit 130 controls the horizontal movement mechanism 50 based on the position of the movable body 52 measured by the position measurement sensor 55.

[0080] The up-and-down moving mechanism 40 moves multiple lifting pins 30 from a lower position to an upper position, enabling the substrate W to be lifted and supported from the adsorption and holding mechanism 10. In this state, the horizontal moving mechanism 50 moves the multiple lifting pins 30 in the horizontal moving direction, thereby adjusting the position of the substrate W in the horizontal moving direction. After adjusting the position of the substrate W by the horizontal moving mechanism 50, the up-and-down moving mechanism 40 moves the multiple lifting pins 30 from an upper position to a lower position. As a result, the substrate W is placed on the adsorption surface 11a of the adsorption and holding mechanism 10. As described above, the position of the substrate W in the horizontal moving direction can be adjusted, and the substrate W can be re-placed on the adsorption surface 11a of the adsorption and holding mechanism 10.

[0081] Furthermore, in one example of this embodiment, the rotation mechanism 20 is also used to adjust the horizontal position of the substrate W by rotating it. This will be described in detail later.

[0082] exist Figure 3 In this example, the vertical moving mechanism 40 and the horizontal moving mechanism 50 are connected to the motor housing member 70. As a more specific example, the vertical moving mechanism 40 and the horizontal moving mechanism 50 are provided on the upper surface of the upper surface portion 71 of the motor housing member 70. Figure 3 In this example, the fixing body 51 of the horizontal moving mechanism 50 is connected to the upper surface 71 of the motor housing member 70. Since the fixing body 51 is connected to the motor housing member 70 (i.e., a non-driving body) which is fixed to the floor of the substrate processing apparatus 1, it is not driven. That is, in Figure 2 In the example, the fixed body 51 is also a non-driving body.

[0083] Further, in the above example, the up-down moving mechanism 40 moves in the horizontal moving direction by the horizontal moving mechanism 50, but is not necessarily limited thereto. For example, the positional relationship of the up-down moving mechanism 40 and the horizontal moving mechanism 50 can also be reversed. That is, the up-down moving mechanism 40 can also move the horizontal moving mechanism 50 and the plurality of lift pins 30 integrally in the up-down direction. In other words, the fixed body 41 of the up-down moving mechanism 40 can be linked to the motor housing member 70, the movable body 42 can be linked to the fixed body 51 of the horizontal moving mechanism 50, and the movable body 52 can be linked to the linking member 31.

[0084] As Figure 3 illustrated, a moving mechanism housing member 75 that houses the up-down moving mechanism 40 and the horizontal moving mechanism 50 can also be provided in the substrate processing apparatus 1. In Figure 3 the example, the moving mechanism housing member 75 includes an upper surface portion 76, an inner peripheral wall 77, and an outer peripheral wall 78. The inner peripheral wall 77 has a cylindrical shape that surrounds the outer peripheral surface of the shaft 22. The inner peripheral wall 77 is spaced apart from the shaft 22. The lower end periphery of the inner peripheral wall 77 is linked to the upper surface portion 71 of the motor housing member 70.

[0085] The outer peripheral wall 78 has a cylindrical shape that surrounds the outer peripheral surface of the inner peripheral wall 77 at a spacing. The lower end periphery of the outer peripheral wall 78 is also linked to the upper surface portion 71 of the motor housing member 70. The up-down moving mechanism 40 and the horizontal moving mechanism 50 are provided between the inner peripheral wall 77 and the outer peripheral wall 78.

[0086] The upper surface portion 76 is located upward of both the up-down moving mechanism 40 and the horizontal moving mechanism 50, and is linked to the upper end periphery of the outer peripheral wall 78 and the upper end periphery of the inner peripheral wall 77. Through-holes 76a through which the respective lift pins 30 pass are formed in the upper surface portion 76. The number of the through-holes 76a is equal to the number of the lift pins 30. In the above example, three lift pins 30 are provided, and therefore three through-holes 76a are formed in the upper surface portion 76. The through-holes 76a are larger than the lift pins 30 in plan view, and the lift pins 30 can move in the horizontal moving direction in a state of passing through the through-holes 76a.

[0087] When the lift pins 30 move in the horizontal moving direction and abut against the periphery portion around the through-holes 76a in the upper surface portion 76, the lift pins 30 cannot move further. That is, the movable distance of the lift pins 30 is determined by the size of the lift pins 30 in plan view and the size of the through-holes 76a. The movable distance can be set to a value that is sufficient to eliminate the eccentric state of the substrate W, for example, several mm or less.

[0088] A seal member 80 that seals the through-hole 76a is provided between the upper surface portion 76 of the moving mechanism housing member 75 and each lift pin 30. The seal member 80 seals between the upper surface portion 76 and the lift pin 30 in a manner that allows the lift pin 30 to move in the vertical direction and the horizontal movement direction. The seal member 80 is composed of a material that can be elastically deformed (for example, a resin such as rubber), and includes a contact portion 81, a contact portion 82, and a deformation portion 83. The contact portion 81 has a ring shape, and is in contact with a portion of the entire circumference of the lift pin 30 in the longitudinal direction. The contact portion 82 has a larger ring shape than the contact portion 81, and is in contact with a circumferential portion of the upper surface portion 76 in which the through-hole 76a is formed. In the example shown in FIG. 6, the contact portion 82 is in contact with the lower surface of the upper surface portion 76, and is fixed to the upper surface portion 76 by a predetermined fixing member (not shown). Figure 4

[0089] The deformation portion 83 is connected to the contact portion 81 and the contact portion 82. The contact portion 81, the contact portion 82, and the deformation portion 83 can be integrally composed of the same material. The deformation portion 83 is a thin film portion that is thinner than the contact portion 81 and the contact portion 82, and has a substantially gusset shape. As a specific example, the deformation portion 83 includes a first umbrella portion that extends downward as it moves away from the circumference of the contact portion 81, a first inverted umbrella portion that extends upward as it moves away from the outer circumference of the first umbrella portion, and a second umbrella portion that extends downward as it moves away from the outer circumference of the first inverted umbrella portion and is connected to the contact portion 82. The connection angles of the first umbrella portion and the first inverted umbrella portion, and the connection angle of the first inverted umbrella portion and the second umbrella portion are each variable by elastic deformation of the deformation portion 83. Such a seal member 80 can also be referred to as a sleeve.

[0090] The deformation portion 83 elastically deforms as the lift pin 30 moves in the vertical direction and the horizontal movement direction. Specifically, the deformation portion 83 elastically deforms in a manner that the connection angles appropriately change. By the elastic deformation of the deformation portion 83, even if the lift pin 30 moves in the vertical direction and the horizontal movement direction, the contact portion 81 continues to be in contact with the lift pin 30, and the contact portion 82 continues to be in contact with the upper surface portion 76. That is, the seal member 80 is able to seal the through-hole 76a.

[0091] The moving mechanism housing member 75 and the seal member 80 are able to protect the vertical movement mechanism 40 and the horizontal movement mechanism 50 from the outside processing environment gas. As a specific example, the vertical movement mechanism 40 and the horizontal movement mechanism 50 are able to be protected from the chemical liquid that is ejected from the nozzle 91 and the washing liquid that is ejected from the washing nozzle.

[0092] In the example shown in FIG. 6, the seal member 80 is provided between the upper surface portion 76 of the moving mechanism housing member 75 and each lift pin 30. The seal member 80 is composed of a material that can be elastically deformed (for example, a resin such as rubber), and includes a contact portion 81, a contact portion 82, and a deformation portion 83. The contact portion 81 has a ring shape, and is in contact with a portion of the entire circumference of the lift pin 30 in the longitudinal direction. The contact portion 82 has a larger ring shape than the contact portion 81, and is in contact with a circumferential portion of the upper surface portion 76 in which the through-hole 76a is formed. In the example shown in FIG. 6, the contact portion 82 is in contact with the lower surface of the upper surface portion 76, and is fixed to the upper surface portion 76 by a predetermined fixing member (not shown). Figure 2 ​In this example, the substrate processing apparatus 1 is provided with a sensor 60 for detecting the eccentricity of the substrate W. The so-called eccentricity here refers to the amount of deviation (hereinafter also referred to as eccentricity) between the center of the substrate W and the rotation axis Q1, and the direction of deviation (hereinafter also referred to as eccentricity direction).

[0093] exist Figure 2 In this example, the substrate processing apparatus 1 includes a sensor moving mechanism 65. The sensor moving mechanism 65 moves the sensor 60 back and forth between the measurement position (described later) and the standby position. The sensor moving mechanism 65 includes, for example, a linear motor mechanism, a ball screw mechanism, or a cylinder mechanism, and is controlled by the control unit 130.

[0094] The standby position of sensor 60 is the position where sensor 60 does not measure the eccentric state of substrate W, for example, a position that is not aligned with substrate W in the vertical direction. Figure 2 In this example, sensor 60 is in the standby position.

[0095] The measurement position of sensor 60 is the position of sensor 60 when measuring the eccentric state of substrate W. Figure 5 This diagram schematically illustrates an example of the structure of the sensor 60 and the substrate W. Figure 5 In the middle, sensor 60 stops at the measurement position. Figure 5 In this example, the sensor 60 includes a light-emitting portion 61 and a light-receiving portion 62. The light-emitting portion 61 is located above the substrate W held by the adsorption and holding mechanism 10. When the sensor 60 is stopped at the measurement position, the light-emitting portion 61 is opposed to the periphery of the substrate W in the vertical direction. The light-emitting portion 61 irradiates light L1 onto the periphery of the substrate W. The light-emitting portion 61 includes, for example, a light source such as an LED. The wavelength of light L1 is not particularly limited, but infrared light can be used as light L1, for example. Light L1 is wider at least radially about the rotation axis Q1. A portion of the radially inner side of the light L1 is blocked by the periphery of the substrate W, and the remaining portion of the light L1 (hereinafter referred to as light L11) shines on the outer side of the substrate W in the vertical direction.

[0096] exist Figure 5 In this example, the light-receiving portion 62 is located on the side opposite to the light-emitting portion 61 relative to the periphery of the substrate W held by the adsorption and holding mechanism 10. That is, the periphery of the substrate W is located between the light-emitting portion 61 and the light-receiving portion 62. The light-receiving portion 62 receives light L11 from the light L1 emitted by the light-emitting portion 61 that travels radially outward from the substrate W. The light-receiving portion 62 includes, for example, light-receiving elements such as phototransistors and photodiodes (also called photoelectric conversion elements). The light-receiving portion 62 outputs an electrical signal to the control unit 130 indicating the amount (e.g., intensity) of the received light L11.

[0097] When the center of the substrate W is aligned with the rotation axis Q1, the amount of light received by the light-receiving part 62 during one revolution of the substrate W is ideally constant. On the other hand, when the center of the substrate W is offset from the rotation axis Q1, the amount of light received by the light-receiving part 62 during one revolution of the substrate W varies depending on the rotational position of the substrate W.

[0098] Figure 6 This is a graph illustrating an example of the relationship between the amount of light L11 and the rotational position of the substrate W. Figure 6 The curve represents the case where the center of substrate W deviates from the rotation axis Q1. For example... Figure 6 As illustrated, the amount of light received varies sinusoidally with respect to the rotational position of the substrate W. In this waveform of light received amount, the amplitude of the light received amount represents the eccentricity of the substrate W, and the rotational position when the light received amount is at its maximum or minimum value represents the eccentricity direction. In other words, the control unit 130 can determine the eccentricity state of the substrate W based on the waveform of the light received amount obtained by the sensor 60 during one rotation of the substrate W. Specifically, the control unit 130 determines the amplitude of the light received amount based on the signal from the sensor 60, and determines the eccentricity based on the amplitude. Furthermore, the control unit 130 determines the rotational angle at which the light received amount is at its maximum or minimum value as the eccentricity direction. The eccentricity state calculation function of the control unit 130 can also be said to belong to the sensor 60. That is, the light-emitting unit 61, the light-receiving unit 62, and the eccentricity state calculation function of the control unit 130 can also be said to constitute the sensor 60. In addition, the arithmetic processing unit with the eccentricity state calculation function can also be provided separately from the control unit 130.

[0099] Alternatively, the standby position of sensor 60 can also be contained within the same horizontal plane as the measurement position. That is, the sensor moving mechanism 65 can also move sensor 60 horizontally. However, as... Figure 2 As shown, when the protective body 96 is in the upper position, the sensor 60 and the protective body 96 may collide. Therefore, the sensor moving mechanism 65 moves the sensor 60 horizontally between the standby position and the measurement position when the protective body 96 is in the lower position. This avoids collision between the sensor 60 and the protective body 96.

[0100] The control unit 130 controls the board processing device 1. The control unit 130 can also be referred to as a control circuit. Figure 7Fig. 1 is a block diagram schematically showing an example of the internal structure of the control section 130. The control section 130 includes an arithmetic processing section 131 and a storage medium 132. The arithmetic processing section 131 includes, for example, a processing device such as a CPU (Central Processing Unit). The storage medium 132 includes, for example, a nonvolatile storage medium 1321 and a volatile storage medium 1322. The nonvolatile storage medium 1321 includes, for example, a memory such as a ROM (Read Only Memory). The volatile storage medium 1322 includes, for example, a memory such as a RAM (Random Access Memory). In Figure 7 In the example shown in Fig. 1, the arithmetic processing section 131 and the storage medium 132 are connected to each other through a bus 133. The above-described various structures of the control section 130 are connected to the bus 133 directly or via a communication circuit.

[0101] A program executed by the arithmetic processing section 131 is stored in the nonvolatile storage medium 1321. By executing the program by the arithmetic processing section 131, the control section 130 can perform various functions. However, a part or all of the functions performed by the control section 130 can also be implemented by a hardware circuit without software such as a program.

[0102] <Operation of substrate processing apparatus>

[0103] Next, an example of the operation of the substrate processing apparatus 1 will be described. Figure 8 Fig. 4 is a flowchart showing an example of the operation of the substrate processing apparatus 1. Initially, the nozzle 91, the cleaning nozzle, and the sensor 60 are positioned at the standby position, and the lift pin 30 and the shield 96 are positioned at the lower position.

[0104] First, the central robot CR hands over the substrate W to the adsorption holding mechanism 10, and the adsorption holding mechanism 10 adsorbs and holds the substrate W (step S1). Specifically, the adsorption holding mechanism 10 adsorbs and holds the substrate W by suction of gas by the suction mechanism 16. Then, the control section 130 performs eccentricity measurement processing (step S2). Specifically, first, the sensor moving mechanism 65 moves the sensor 60 horizontally from the standby position to the measurement position. Next, the light emitting section 61 emits the light L1, the rotation mechanism 20 rotates the substrate W, and the light receiving section 62 sequentially measures the light receiving amount and outputs the measurement result to the control section 130. The light receiving section 62 measures the light receiving amount, for example, every predetermined rotation angle. When the waveform of the light receiving amount is obtained, the rotation mechanism 20 stops the rotation of the substrate W, and the sensor moving mechanism 65 moves the sensor 60 from the measurement position to the standby position. The control section 130 calculates the eccentricity state (specifically, the eccentricity amount and the eccentricity direction) of the substrate W based on the waveform of the light receiving amount.

[0105] Then, the control unit 130 determines whether a position adjustment process for the substrate W is required (step S3). Specifically, the control unit 130 determines whether the eccentricity of the substrate W is less than a reference value. The reference value is, for example, on the order of hundreds of micrometers or less and can be preset. If the eccentricity is less than the reference value, it is determined that the substrate W is approximately not eccentric, and therefore the control unit 130 determines that no adjustment of the substrate W is required. In this case, the control unit 130 does not perform the position adjustment process described later (step S4) but performs the crystal edge processing (step S5).

[0106] On the other hand, when the eccentricity is greater than the reference value, the substrate W is eccentric, so the control unit 130 determines that the position adjustment process of the substrate W needs to be performed. Figure 9 This is a top view schematically illustrating an example of the structure of substrate W. Figure 9 In this example, the center Q2 of the substrate W is offset from the rotation axis Q1. Specifically, the center Q2 of the substrate W is offset diagonally upward and to the right of the paper relative to the rotation axis Q1. In this case, the control unit 130 determines that the position adjustment process of the substrate W needs to be performed, and performs the position adjustment process of the substrate W (step S4).

[0107] Figure 10 The flowchart illustrates a specific example of the position adjustment process for substrate W. First, the rotation mechanism 20 rotates substrate W so that the eccentric direction of substrate W is along the horizontal movement direction D1 of the horizontal movement mechanism 50 (see also...). Figure 9 (Step S41). In Figure 9 In the example, the rotated substrate W is represented by a dashed line. Figure 9 In the example, the center Q2 of the rotated substrate W is aligned with the rotation axis Q1 in the horizontal movement direction D1.

[0108] Then, the lifting pins 30 lift the substrate W from the adsorption and holding mechanism 10 (step S42). Specifically, after the suction mechanism 16 stops the gas suction and releases the adsorption on the substrate W, the up-down movement mechanism 40 moves the multiple lifting pins 30 from the lower position to the upper position. Through this movement, the multiple lifting pins 30 take the substrate W from the adsorption and holding mechanism 10 and lift it up. Thus, the substrate W is supported by the multiple lifting pins 30.

[0109] Then, the horizontal moving mechanism 50 moves the substrate W along the horizontal moving direction D1 in the direction that reduces the eccentricity of the substrate W (step S43). Figure 9 In this example, the rotated substrate W is moved downwards from the paper. The amount of movement of the substrate W can be measured by the eccentricity of the substrate W by the sensor 60. Thus, ideally, in a top view, the center Q2 of the substrate W is aligned with the rotation axis Q1.

[0110] Then, the lift pin 30 places the substrate W on the adsorption surface 10a of the adsorption holding mechanism 10 (step S44). Specifically, the up-and-down moving mechanism 40 moves the lift pin 30 from the upper position to the lower position. By this movement, the substrate W is placed on the adsorption surface 11a of the adsorption holding mechanism 10 again. Then, the horizontal moving mechanism 50 can also move the lift pin 30 to the original position in the horizontal moving direction Dl.

[0111] As described above, in the state where the eccentricity of the substrate W is reduced, the lift pin 30 is moved to the lower position to place the substrate W on the adsorption surface 11a, and thus the adsorption holding mechanism 10 can adsorb and hold the substrate W in the state where the eccentricity is small.

[0112] Then, the control section 130 performs the edge processing (step S5). Specifically, the nozzle moving mechanism 95 moves the nozzle 91 and the rinsing nozzle to the processing position, and the shield moving mechanism 97 moves the shield 96 from the lower position to the upper position. Then, the rotation mechanism 20 rotates the substrate W at a rotation speed suitable for the edge processing. Then, the valve 93 is opened, and thus the chemical liquid is supplied from the nozzle 91 to the peripheral portion of the substrate W, and the impurities on the peripheral portion of the substrate W are removed. When the impurities are sufficiently removed, the valve 93 is closed, and the rinsing valve is opened. Thus, the rinsing liquid is supplied from the rinsing nozzle to the peripheral portion of the substrate W. The rinsing liquid flushes the chemical liquid on the peripheral portion of the substrate W. In other words, the chemical liquid on the peripheral portion of the substrate W is replaced with the rinsing liquid. When the chemical liquid is sufficiently flushed, the rinsing valve is closed. Then, in order to dry the substrate W, the rotation mechanism 20 increases the rotation speed of the substrate W to rotate the substrate W at a rotation speed suitable for drying (so-called spin-drying). When the drying processing is completed, the rotation mechanism 20 ends the rotation of the substrate W.

[0113] Then, the processed substrate W is carried out (step S6). Specifically, the suction mechanism 16 releases the suction of the substrate W, and the central robot CR takes the substrate W from the adsorption holding mechanism 10 to carry it to the outside.

[0114] As described above, according to the substrate processing apparatus 1, it is possible to reduce the eccentricity of the substrate W. Thus, it is possible to perform the edge processing on the substrate W in the state where the eccentricity is small. Therefore, it is possible to reduce the possibility that the chemical liquid enters the component area of the substrate W.

[0115] Further, according to the substrate processing apparatus 1, in the state where the lift pin 30 lifts the substrate W, the lift pin 30 and the substrate W are integrally moved in the horizontal moving direction Dl to reduce the eccentricity of the substrate W. Thus, compared with the case where the substrate W is slid in the horizontal direction with respect to the adsorption holding mechanism 10 in the state where the substrate W is placed on the adsorption surface 11a as in the prior art documents 1 and 2, it is possible to avoid the abrasion between the substrate W and the adsorption surface 11a. Thus, it is possible to reduce the contamination or damage of the lower surface of the substrate W due to the abrasion.

[0116] Further, according to the above-described example, the pin moving mechanism (the up-and-down moving mechanism 40 and the horizontal moving mechanism 50) that moves the lift pins 30 is provided to the motor housing member 70. The motor housing member 70 is located directly below the adsorption holding mechanism 10, and thus the pin moving mechanism can be provided in the vicinity of the substrate W. In Figure 3 In the example, the pin moving mechanism is provided to the upper surface portion 71 of the motor housing member 70. Thus, the pin moving mechanism can be disposed further closer to the substrate W. Thus, the pin moving mechanism adjusts the position of the substrate W in the vicinity of the substrate W, and thus the accuracy of the position adjustment of the substrate W can be improved. The position of the substrate W can be adjusted with higher accuracy than when the central robot CR adjusts the position of the horizontal plane of the substrate W.

[0117] Further, in the above-described example, the pin moving mechanism is linked to the motor housing member 70, which is a non-driven body fixed to the floor of the substrate processing apparatus 1. That is, no other driven body is interposed between the pin moving mechanism and the motor housing member 70 (non-driven body). Thus, the position of the substrate W can be adjusted with higher accuracy than when the adjustment mechanism that adjusts the position in the horizontal plane of the substrate is linked to a driven body such as the guard body 96. That is, when the adjustment mechanism is linked to a driven body such as the guard body 96, normal slight displacement of the driven body affects the adjustment mechanism, and can cause an error in the position adjustment of the adjustment mechanism. In contrast, when the pin moving mechanism is linked to a non-driven body (for example, the motor housing member 70), such an error can be avoided.

[0118] Further, in the above-described example, the pin moving mechanism (the up-and-down moving mechanism 40 and the horizontal moving mechanism 50) required for the position adjustment of the substrate W, the linking member 31, and the lift pins 30 are located on the rotation axis Ql side of the periphery of the substrate W in plan view. Thus, the space outside the substrate W in plan view can be used for the arrangement of other members.

[0119] Further, in the above-described example, the plurality of lift pins 30 are linked by the linking member 31 and integrally moved by the pin moving mechanism. Thus, the pin moving mechanism can be downsized compared to when the pin moving mechanism is provided individually for each lift pin 30.

[0120] <Position of lift pin>

[0121] The lift pins 30 can be located within a region described below in plan view. Specifically, the plurality of lift pins 30 can be located within a ring-shaped region sandwiched by an imaginary inner circle having a diameter of one fourth of the diameter of the substrate W and an imaginary outer circle having a diameter of three fourths of the diameter of the substrate W.

[0122] For comparison, a case where the lift pins 30 are located at the periphery of the substrate W in plan view is examined. In this case, the lift pins 30 support the periphery of the lower surface of the substrate W. Thus, the distance between the support point of the substrate W (i.e., the periphery of the substrate) and the central portion of the substrate W is long. Therefore, in a state where the lift pins 30 lift the substrate W, the central portion of the substrate W is greatly bent downward with respect to the support point. If the substrate W is thus greatly bent, the possibility that the substrate W deviates in the horizontal direction with respect to the adsorption surface 11a increases when the substrate W is placed on the adsorption surface 11a of the adsorption holding mechanism 10.

[0123] In contrast, in a case where the lift pins 30 are located within the above-described annular region, it is possible to reduce the distance between the support point of the substrate W by the lift pins 30 and the central portion of the substrate W. Thus, it is possible to reduce the amount of bending of the substrate W. Therefore, it is possible to reduce the misalignment of the substrate W when placed on the adsorption surface 11a.

[0124] <Positional relationship between lift pins and adsorption holding mechanism>

[0125] In the above-described example, the lift pins 30 are located radially outward of the adsorption holding mechanism 10 (the adsorption member 11). However, this is not necessarily limited thereto. Figure 11 A plan view schematically showing another example of the structure of the lift pins 30 and the adsorption holding mechanism 10 is shown. A through-hole 11b is formed at a position on the adsorption member 11 of the adsorption holding mechanism 10 that opposes the lift pins 30. The through-hole 11b penetrates the adsorption member 11 (more specifically, the plate-shaped member 12) in the vertical direction. The through-hole 11b is formed so as not to interfere with the internal flow path for adsorption formed in the adsorption member 11. In plan view, the through-hole 11b is larger than the lift pins 30, and the lift pins 30 are movable in the horizontal movement direction D1 in a state where they penetrate the through-hole 11b. The size of the through-hole 11b is set so as to ensure the movable range of the lift pins 30.

[0126] Figure 12 A plan view schematically showing another example of the structure of the adsorption holding mechanism 10 is shown. The adsorption holding mechanism 10 includes an adsorption member 11A. The adsorption member 11A has a cylindrical shape that surrounds the rotation axis Q1. Thus, the adsorption surface 11Aa of the adsorption member 11A has an annular shape in plan view. The substrate W is placed on the adsorption surface 11Aa of the adsorption member 11A. The outer diameter of the adsorption surface 11Aa is, for example, smaller than the diameter of the substrate W. An adsorption port, not shown, is formed in the adsorption surface 11Aa. An internal flow path that is connected to the adsorption port is formed in the adsorption member 11A, and the internal flow path is connected to a suction mechanism, not shown, via a suction pipe, not shown. The back surface of the substrate W is suctioned to the adsorption surface 11Aa of the adsorption member 11A by the suction mechanism suctioning gas. Thus, the substrate W is adsorbed and held by the adsorption member 11A.

[0127] The lower end of the adsorption component 11A is connected to the motor 21 via the shaft 22. The motor 21 rotates the shaft, thereby causing the adsorption component 11A to rotate about the rotation axis Q1. The shaft 22 is a hollow shaft.

[0128] Motor 21 is housed in motor housing component 70A. A through hole 70Aa is formed on the upper surface of motor housing component 70A, through which shaft 22 passes. A sealed bearing (not shown) may also be provided in the through hole 70Aa. Shaft 22 is rotatably connected to motor housing component 70A via this sealed bearing.

[0129] exist Figure 12 In the substrate processing apparatus 1, a plurality of pins 30A are provided. The plurality of pins 30A are vertically disposed on the upper surface 31Aa of the lifting member 31A. The plurality of pins 30A are arranged at equal intervals on an imaginary circle centered on the rotation axis Q1. For example, three pins 30A are arranged at 120-degree intervals. Each pin 30A protrudes upward from the upper surface 31Aa. The lifting member 31A functions as a connecting member connecting the plurality of pins 30A.

[0130] The lifting component 31A extends vertically within the hollow portion of the adsorption component 11A and the shaft 22. Consequently, the plurality of pins 30A, when viewed from above, are located on the side closer to the rotation shaft Q1 than the adsorption surface 11Aa of the adsorption component 11A.

[0131] Multiple pins 30A can move vertically via a vertical moving mechanism 40A. Figure 12 In this example, the up-and-down moving mechanism 40A moves the lifting component 31A in the up-and-down direction, thereby causing multiple pins 30A to move integrally in the up-and-down direction. The up-and-down moving mechanism 40A moves the lifting component 31A between an upper position and a lower position. The upper position is when the upper end of the pin 30A is above the adsorption surface 11Aa, and the lower position is when the upper end of the pin 30A is below the adsorption surface 11Aa. The structure of the up-and-down moving mechanism 40A is the same as that of the up-and-down moving mechanism 40. Since the pins 30A move in the up-and-down direction, they can also be called lifting pins.

[0132] The up-and-down moving mechanism 40A moves the lifting component 31A from a lower position to an upper position, thereby causing multiple pins 30A to abut against the back of the substrate W and lift the substrate W. Thus, the substrate W is supported by the multiple pins 30A.

[0133] Multiple pins 30A can move in the horizontal direction via a horizontal moving mechanism 50A. Figure 12In the example, the horizontal movement mechanism 50A moves the up-and-down movement mechanism 40A in the horizontal movement direction, thereby moving the plurality of pins 30A in the horizontal movement direction. In a state where the plurality of pins 30A lift the substrate W, the plurality of pins 30A are moved in the horizontal movement direction, thereby moving the substrate W in the horizontal movement direction. The movable distance of the plurality of pins 30A in the horizontal movement direction is determined by the size of the lifting member 31A in plan view, the size of the hollow portion of the adsorption member 11A, and the size of the hollow portion of the shaft 22. The movable distance is only required to be set to a value sufficient to eliminate the eccentric state of the substrate W.

[0134] In Figure 12 In the example, the horizontal movement mechanism 50A is coupled to the lower surface portion of the motor housing member 70A. The motor housing member 70A is a non-driven body (in other words, a fixed body). That is, the pin movement mechanism (the up-and-down movement mechanism 40A and the horizontal movement mechanism 50A) that moves the plurality of pins 30A is coupled to the non-driven body. More specifically, the pin movement mechanism is coupled to the non-driven body without passing through another driven body. Thereby, the pin movement mechanism can adjust the position of the substrate W with high precision. Further, in a case where the motor housing member 70 does not have the lower surface portion, and the lower end periphery of the side surface portion thereof is coupled to the floor of the substrate processing apparatus 1, the pin movement mechanism (the up-and-down movement mechanism 40A and the horizontal movement mechanism 50A) can be directly coupled to the floor of the substrate processing apparatus 1. Further, the positional relationship of the up-and-down movement mechanism 40A and the horizontal movement mechanism 50A can be reversed.

[0135] <Adsorption mechanism of lifting pin>

[0136] An adsorption port can be formed at the upper end of at least any one of the plurality of lifting pins 30. Figure 13 A plan view schematically showing an example of the structure of the lifting pin 30. In Figure 13 In the example, the three lifting pins 30 each have the adsorption port 30a. The upper end surface of each of the lifting pins 30 is parallel to the lower surface of the substrate W, and the adsorption port 30a is formed at the upper end surface of the lifting pin 30. The lifting pin 30 has an internal flow path connected to the adsorption port 30a, and the internal flow path is connected to the suction mechanism 39 via the suction pipe 38. The suction pipe 38 has flexibility and deforms according to the movement of the lifting pin 30. The suction mechanism 39 includes a pump that suctions gas in the inside of the suction pipe 38. Thereby, gas is suctioned from the adsorption port 30a. The suction mechanism 39 is controlled by the control section 130.

[0137] In a state where the plurality of lifting pins 30 are moved upward and support the substrate W, the suction mechanism 39 suctions gas, thereby the substrate W is adsorbed and held by the lifting pins 30. Thereby, it is possible to reduce the possibility that misalignment occurs between the lifting pins 30 and the substrate W accompanying the movement of the lifting pins 30.

[0138] Position adjustment of substrate

[0139] The eccentricity of the substrate W can be confirmed again after the position of the substrate W is adjusted. Figure 14 A flowchart showing another example of the operation of the substrate processing apparatus 1. First, an unprocessed substrate W is carried in and held by the suction holding mechanism 10 (step S1). Then, the sensor 60 measures the eccentricity of the substrate W (step S2), the control section 130 determines the necessity of the position adjustment process of the substrate W (step S3), and the control section 130 performs the position adjustment process of the substrate W as necessary (step S4).

[0140] When the position adjustment process of the substrate W is completed, the sensor 60 measures the eccentricity again (step S2A). That is, the control section 130 confirms whether the position adjustment process of the substrate W by step S3 has appropriately eliminated the eccentricity of the substrate W. The specific process of step S2A is the same as that of step S2.

[0141] Next, the control section 130 determines whether the position adjustment process of the substrate W needs to be performed again (step S3A). The specific process of step S3A is the same as that of step S3. When the eccentricity amount is smaller than the reference value, the position adjustment process by step S3 has eliminated the eccentricity of the substrate W, and thus the control section 130 determines that the position adjustment process does not need to be performed again, and performs the edge processing of step S5.

[0142] On the other hand, when the eccentricity amount is larger than the reference value, the control section 130 determines that the position adjustment process needs to be performed again, and performs the position adjustment process of the substrate W again (step S4A). The specific process of step S4A can be the same as that of step S4, for example. Next, the control section 130 performs the edge processing (step S5). After the edge processing, the processed substrate W is carried out of the substrate processing apparatus 1 (step S6).

[0143] According to the above-described operation, the eccentricity of the substrate W is measured again after the first position adjustment process of the substrate W, and the position adjustment process of the substrate W is performed again based on the measurement result. Thus, the eccentricity amount of the substrate W can be more appropriately reduced.

[0144] Further, in the above-described example, the position adjustment process is performed twice as necessary, but is not necessarily limited to twice. The control section 130 can repeatedly perform the position adjustment process of the substrate W until the eccentricity amount of the substrate W is lower than the reference value.

[0145] Further, in the adjustment processing of the substrate W after the second time, as the moving amount of the horizontal moving direction Dl of the substrate W, not the eccentricity amount measured immediately before, but a value corrected from the eccentricity amount can be used. For example, assume the case where the eccentricity directions of the substrate W measured before (step S2) and after (step S2A) the position adjustment processing of step S4 are opposite to each other, and the eccentricity amounts of the substrate W measured before and after the position adjustment are 1 mm and 0.2 mm, respectively. These values are not actual values, but exaggerated values for explanation.

[0146] In this case, it can be considered that an error of 0.2 mm is generated corresponding to the moving amount of 1 mm in the horizontal moving direction. That is, it can be considered that an error of 20% (0.2 mm) is generated with respect to the moving amount of 1 mm in the position adjustment processing of step S4. In other words, it can be considered that the actual moving amount is 1.2 mm, which is 20% more than the set moving amount of 1 mm.

[0147] Therefore, the moving amount of the substrate W in step S4A can be calculated based on the ratio of the eccentricity amount measured in step S2A to the eccentricity amount measured in step S2. That is, if the substrate W moves by 20% more, as the moving amount in step S4A, 0.16{= (0.2) · (1 - 0.2 / 1)} mm, which is 20% less, is used. Thus, by the position adjustment processing of step S4A, the eccentric state of the substrate W can be more appropriately eliminated.

[0148] Further, the control section 130 can store the eccentricity amounts before and after the position adjustment processing as a database in the storage medium 132 each time, and determine the moving amount of the substrate W in the subsequent position adjustment processing based on the database.

[0149] Second Embodiment

[0150] The structure of the substrate processing apparatus 1 of the second embodiment is the same as that of the first embodiment except for the structure of the sensor 60. In the second embodiment, the sensor 60A is provided instead of the sensor 60. However, the second embodiment does not necessarily need to be premised on the first embodiment, and the sensor 60A can be appropriately applied to other substrate processing apparatuses.

[0151] Figure 15 A diagram schematically showing an example of the structure of the sensor 60A is shown in FIG. 8. In the example of FIG. 8, the sensor 60A is located at the measurement position, and opposes the peripheral portion of the substrate W. In the example of FIG. 8, the sensor 60A is located at the measurement position, and opposes the peripheral portion of the substrate W. Figure 15 Figure 15 ​In the example of FIG. 6, the sensor 60A includes the light emitting portion 61, the light receiving portion 62, and the light path changing element 64. Hereinafter, the light emitting portion 61, the light receiving portion 62, and the light path changing element 64 in a state where the sensor 60A is located at the measurement position will be described. The light emitting portion 61, like the first embodiment, irradiates the light L1 to the peripheral portion of the substrate W at the measurement position. The light emitting portion 61 is located above the surface of the substrate W.

[0152] In the second embodiment, the light receiving portion 62 is also located above the surface of the substrate W. The light receiving portion 62 is adjacent to the light emitting portion 61 and the substrate W without overlapping them in plan view. Figure 15 In the example of FIG. 6, the light receiving portion 62 is located radially outward of the light emitting portion 61, and is arranged in the radial direction from the light emitting portion 61. In addition, the light receiving portion 62 can also be adjacent to the light emitting portion 61 in the circumferential direction of the rotation axis Q1.

[0153] The light path changing element 64 changes the travel route of the light L11 passing outside the substrate W from the light L1 irradiated from the light emitting portion 61, and causes the light L11 to travel toward the light receiving portion 62. That is, the light receiving portion 62 receives the light L11 passing outside the substrate W from the light L1 via the light path changing element 64. The light path changing element 64 is, for example, a prism. The light path changing element 64 has higher chemical resistance than the light emitting portion 61 and the light receiving portion 62. For example, the prism is formed of quartz or sapphire glass, or the like. In addition, the light path changing element 64 can also be constituted by a plurality of mirrors.

[0154] The light emitting portion 61, the light receiving portion 62, and the light path changing element 64 can also be connected to each other by a connection member not shown. Thereby, the sensor moving mechanism 65 can move the light emitting portion 61, the light receiving portion 62, and the light path changing element 64 integrally.

[0155] The measurement algorithm of the sensor 60A for the eccentric state of the substrate W is the same as the first embodiment.

[0156] According to the second embodiment, the light emitting portion 61 and the light receiving portion 62 are provided above the substrate W, and the light path changing element 64 is provided below the substrate W. The components below the substrate W can be attached with the processing liquid, or the space below the substrate W can be formed with an environmental gas having a large amount of volatile components of the processing liquid (e.g., a drug liquid). If the light emitting portion 61 or the light receiving portion 62 is provided below the substrate W, there is a case where the processing liquid or the volatile components are attached to the light emitting portion 61 or the light receiving portion 62, and corrode them. Thereby, the measurement accuracy of the sensor 60 can be decreased.

[0157] On the other hand, in the second embodiment, the light emitting portion 61 and the light receiving portion 62 are located above the substrate W, and the treatment liquid or the volatile component is less likely to adhere. Thus, problems caused by the treatment liquid or the volatile component adhering to the light emitting portion 61 and the light receiving portion 62 are less likely to occur.

[0158] In Figure 15 In the example, the light emitting portion 61 and the light receiving portion 62 are covered with the protective member 66 having high chemical resistance. At least a portion of the protective member 66 opposing the light emitting surface of the light emitting portion 61 and a portion opposing the light receiving surface of the light receiving portion 62 have light transmittance with respect to the light L1. The light emitting surface is a surface opposing the light source, and the light L1 emitted from the light source is transmitted through the light emitting surface. The light receiving surface is a surface opposing the light receiving element, and the light L11 is transmitted through the light receiving surface. As a material constituting the protective member 66, for example, a fluorine-based resin or the like is exemplified.

[0159] The light emitting portion 61 and the light receiving portion 62 are located above the substrate W, and thus even if the protective member 66 is provided to the light emitting portion 61 and the light receiving portion 62, compared with the case where the light emitting portion 61 or the light receiving portion 62 is provided below the substrate W, a spatial difficulty is less likely to occur. A reason for this is simply explained. In a space below the substrate W, for example, other members such as a heater that heats the peripheral portion of the substrate W over the entire circumference can be provided. The heater has a ring shape in plan view, and opposes the peripheral portion of the substrate W over substantially the entire circumference. On the other hand, in a space above the peripheral portion of the substrate W, compared with the space below, a large member is not provided. Thus, in the space, the light emitting portion 61 and the light receiving portion 62 can be easily covered with the large protective member 66.

[0160] On the other hand, in the case where the light path changing member 64 has higher chemical resistance than the light emitting portion 61 and the light receiving portion 62, the protective member can not be provided to the light path changing member 64. Alternatively, the protective member can be appropriately provided to the light path changing member 64. The light path changing member 64 has a simpler configuration than the light emitting portion 61 and the light receiving portion 62, and thus can be made thinner than them. Thus, even if the protective member is provided to the light path changing member 64 located below the substrate W, a spatial difficulty is less likely to occur.

[0161] Although the substrate processing apparatus 1 has been described in detail, the above description is merely an example, and the substrate processing apparatus 1 is not limited to this. It should be understood that numerous unillustrated modifications can be conceived without departing from the scope of the present disclosure. The structures described in the above embodiments and the modifications can be appropriately combined or omitted without being mutually contradictory.

[0162] For example, in the first embodiment, the sensor 60 can also include a camera. It can also be that the camera captures an image of the substrate W held by the adsorption holding mechanism 10 to obtain image data, and the control section 130 performs image processing on the image data to thereby determine the center of the substrate W.

[0163] Further, in the first and second embodiments, in the case where the lift pins 30 have the adsorption ports 30a, the lift pins 30 can also be provided above the substrate W. In this case, the lift pins 30 are provided with the adsorption ports 30a facing the surface of the substrate W. In a state where the lift pins 30 are moved to the lower position and the adsorption ports 30a abut against the surface of the substrate W, gas is drawn from the adsorption ports 30a to thereby enable the lift pins 30 to adsorb and hold the substrate W. In this state, the lift pins 30 can also be moved to the upper position to lift the substrate W, and then moved in the horizontal movement direction, and then moved to the lower position to transfer the substrate W to the adsorption holding mechanism 10.

[0164] Symbol Explanation

[0165] 1 - substrate processing apparatus, 10 - adsorption holding mechanism, 20 - rotation mechanism, 30, 30A - lift pin, 40, 40A - up-down movement mechanism, 50, 50A - horizontal movement mechanism, 60 - sensor, 70 - housing member (motor housing member).

Claims

1. A substrate processing apparatus for processing a substrate, the substrate processing apparatus characterized by comprising: an adsorbing and holding mechanism that adsorbs a back surface of a substrate and holds the substrate horizontally; a rotating mechanism that rotates the adsorbing and holding mechanism holding the substrate about a rotation axis in a vertical direction passing through a center of the substrate; a plurality of lift pins provided at positions opposed to the substrate held by the adsorbing and holding mechanism below the substrate and arranged around the rotation axis; an up-and-down moving mechanism that links the plurality of lift pins and moves upper ends of the plurality of lift pins in an up-and-down direction between a first position above an adsorbing surface of the adsorbing and holding mechanism and a second position below the adsorbing surface of the adsorbing and holding mechanism; a horizontal moving mechanism that links the plurality of lift pins and moves the plurality of lift pins relative to the adsorbing and holding mechanism in a horizontal direction; and a sensor that measures an eccentricity of the substrate held by the adsorbing and holding mechanism, the up-and-down moving mechanism supports the substrate from the adsorbing and holding mechanism by moving the plurality of lift pins to the first position, the horizontal moving mechanism moves the plurality of lift pins in the horizontal direction based on the eccentricity of the substrate measured by the sensor in a state where the substrate is supported, the rotating mechanism is linked to a shaft extending downward from the adsorbing and holding mechanism, the up-and-down moving mechanism and the horizontal moving mechanism are linked to a housing member that houses the rotating mechanism, and the housing member is linked to a floor of the substrate processing apparatus.

2. The substrate processing apparatus according to claim 1, wherein the up-and-down moving mechanism and the horizontal moving mechanism are provided at an upper surface portion of the housing member.

3. The substrate processing apparatus according to claim 1, wherein the plurality of lift pins are integrally moved by being linked to each other.

4. The substrate processing apparatus according to claim 2, wherein the plurality of lift pins are integrally moved by being linked to each other.

5. The substrate processing apparatus according to any one of claims 1 to 4, wherein the plurality of lift pins are arranged at equal intervals on an imaginary circle centered on the rotation axis.

6. The substrate processing apparatus according to any one of claims 1 to 4, wherein, in a plan view, the plurality of lift pins are located within a ring-shaped region sandwiched by an imaginary inner circle having a radius of one fourth of a radius of the substrate held by the adsorbing and holding mechanism and an imaginary outer circle having a radius of three fourths of the radius of the substrate.

7. The substrate processing apparatus according to any one of claims 1 to 4, wherein, in a plan view, the plurality of lift pins are located outward of the adsorbing and holding mechanism.

8. The substrate processing apparatus according to any one of claims 1 to 4, wherein the adsorbing and holding mechanism is formed with through holes through which the plurality of lift pins pass in the up-and-down direction. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 9. The substrate processing apparatus according to any one of claims 1 to 4, characterized by the adsorption holding mechanism has a ring shape that surrounds the rotation shaft, in a plan view, the plurality of lift pins are located inward of the adsorption holding mechanism.

10. The substrate processing apparatus according to any one of claims 1 to 4, characterized by an adsorption port that adsorbs the substrate is formed at an upper end of at least one of the plurality of lift pins.

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