A power module and a battery pack

Abstract

The application discloses a kind of power module and battery pack, wherein power module includes multilayer circuit board structure and radiator base plate, multilayer circuit board structure includes capacitor circuit board, power circuit board and drive circuit board, drive circuit board is arranged between capacitor circuit board and power circuit board, and three circuit boards are detachably fixedly connected and electrically connected;One side of radiator base plate is provided with insulator, and the insulator is detachably fixedly connected with multilayer circuit board structure through radiator base plate;Battery pack includes liquid cooling plate, battery pack and the above-mentioned power module, battery pack and radiator base plate are all attached to the connection with liquid cooling plate, and power module is detachably fixedly connected with battery pack.The power module provided by the application meets the high voltage requirement, the overall structure is more stable, and higher voltage requirement can be achieved.The battery pack can meet the cooling demand.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of power electronics and battery management, and particularly relates to a power module and a battery pack. BACKGROUND

[0002] In recent years, energy problems have been closely concerned internationally, in order to solve the current energy supply problem, China has introduced many policies to vigorously support the development of clean energy related technologies, among which the energy storage technology for storing energy can be used as emergency energy, and the energy storage technology based on power electronics and battery management is widely concerned.

[0003] In the existing direct current energy storage system, in order to ensure the capacity of energy storage, multiple direct current battery packs (PACK) or clusters are connected in series and parallel through a direct current system to form a direct current energy storage system, and the existing technical problems mainly have two aspects, on the one hand, the volume of the power module is large, the cost is high and the insulation withstand voltage is difficult to meet the high voltage requirement, on the other hand, with the increase of the surface heat flux density and the volume power density of the power module, the traditional forced air cooling method cannot meet the cooling demand of the direct current battery pack.

[0004] Therefore, a power module capable of meeting the demand of high insulation withstand voltage and a battery pack capable of meeting the cooling demand are urgently needed. SUMMARY

[0005] In view of the deficiencies in the prior art, the present application provides a power module and a battery pack, which solve the technical problems that the insulation withstand voltage of the power module in the prior art is difficult to meet the high voltage requirement and the battery pack cannot meet the cooling demand.

[0006] The present application provides a power module, which comprises:

[0007] A multilayer circuit board structure and a heat sink substrate, wherein the multilayer circuit board structure comprises:

[0008] A capacitor circuit board for filtering;

[0009] A power circuit board for outputting power;

[0010] A drive circuit board for a drive circuit, the drive circuit board is arranged between the capacitor circuit board and the power circuit board, and the capacitor circuit board, the drive circuit board and the power circuit board are detachably fixedly connected and electrically connected;

[0011] One side of the heat sink substrate is provided with an insulating sub, and the insulating sub is detachably fixedly connected with the multilayer circuit board structure close to the power circuit board through the heat sink substrate.

[0012] Optionally, the power module further comprises an insulating heat-conducting pad, which is attached between the power circuit board and the heat sink base plate.

[0013] Optionally, a plurality of square grooves are formed on the side of the heat sink base plate away from the power circuit board, the square grooves are used for placing the insulator, and a first connecting hole is formed in the square groove, and the insulator is detachably fixedly connected with the multi-layer circuit board structure through the first connecting hole.

[0014] Optionally, the multi-layer circuit board structure comprises a plurality of conductive connecting columns, and the plurality of conductive connecting columns are detachably fixedly connected with the capacitor circuit board, the driving circuit board and the power circuit board in sequence.

[0015] Optionally, the conductive connecting column comprises a conductive pipe and a bolt, the conductive pipe is supported between the capacitor circuit board and the driving circuit board, and supported between the driving circuit board and the power circuit board, and the bolt passes through the conductive pipe between the capacitor circuit board and the driving circuit board and the conductive pipe between the driving circuit board and the power circuit board to fix the multi-layer circuit board structure.

[0016] Optionally, the plurality of conductive pipes are arranged along the two side edges between the capacitor circuit board and the driving circuit board and along the two side edges between the driving circuit board and the power circuit board, and the plurality of conductive pipes between the capacitor circuit board and the driving circuit board and the plurality of conductive pipes between the driving circuit board and the power circuit board are arranged in one-to-one correspondence.

[0017] Optionally, the end of the insulator close to the power circuit board is threadedly connected with the bolt.

[0018] Optionally, copper bars are welded on the two side edges of the side of the capacitor circuit board close to the driving circuit board, the two side edges of the side of the driving circuit board close to the power circuit board and the two side edges of the side of the power circuit board close to the driving circuit board, and a second connecting hole is formed in the copper bar, and the bolt passes through the second connecting hole to fix the multi-layer circuit board structure.

[0019] The power module provided by the application realizes the circuit function by the multi-layer circuit board structure, wherein the capacitor circuit board, the driving circuit board and the power circuit board are detachably fixedly connected and electrically connected, so that the multi-layer circuit board structure is stable; the multi-layer circuit board structure as a whole is connected with the heat sink base plate through the insulator, meets the high voltage resistance requirement of the power module, makes the overall structure of the power more stable and improves the reliability; and the modular design makes the overall power module meet higher voltage requirement.

[0020] The battery pack provided by the application comprises:

[0021] A liquid cooling plate;

[0022] A battery pack, which is connected with the liquid cooling plate in a fit manner;

[0023] The power module as claimed in any one of the preceding claims, wherein the heat sink substrate is connected with the liquid cooling plate in a fit manner, and the power module is detachably fixed with the battery pack.

[0024] Optionally, the heat sink substrate and the liquid cooling plate are filled with a heat-conducting silicone grease.

[0025] The battery pack provided by the application sets the power module and the battery pack on the liquid cooling plate, uses the high specific heat capacity of the cooling fluid to take away the heat generated by the high-power device, reduces the temperature change rate of the heating element, meets the heat dissipation requirement of the high-power device, and improves the reliability of the product.

[0026] Other features and advantages of the present application will be further described in the following description, and become apparent from the description, or be learned through the practice of the present application. The objectives and other advantages of the present application can be achieved and obtained by the structure particularly pointed out in the written description, claims, and drawings.

[0027] The technical solutions of the present application will be further described in detail below with the help of the drawings and examples. BRIEF DESCRIPTION OF DRAWINGS

[0028] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, which together with the embodiments of the present application serve to explain the present application, and do not constitute a limitation to the present application. In the drawings:

[0029] Figure 1 A structural schematic diagram of a power module provided by an embodiment of the present application;

[0030] Figure 2 A structural schematic diagram of a power module provided by an embodiment of the present application from a perspective;

[0031] Figure 3 Another structural schematic diagram of a power module provided by an embodiment of the present application from another perspective;

[0032] Figure 4 A front view of a power module provided by an embodiment of the present application;

[0033] Figure 5 A structural schematic diagram of one side of a heat sink substrate of a power module provided by an embodiment of the present application, which is fixed with an insulator;

[0034] Figure 6 A structural schematic diagram of a battery pack provided by an embodiment of the application.

[0035] In the drawings:

[0036] 1 - power module, 101 - capacitor circuit board, 102 - power circuit board, 103 - drive circuit board, 104 - heat sink base plate, 105 - insulating sub, 106 - insulating heat-conducting pad, 107 - conductive tube, 108 - bolt, 109 - copper bar;

[0037] 2 - battery pack;

[0038] 3 - liquid cooling plate. DETAILED DESCRIPTION

[0039] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0040] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0041] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0042] The present application provides a power module 1, as shown in Figures 1 to 4The power module 1 is realized by a multi-layer circuit board structure, and the multi-layer circuit board structure comprises a capacitor circuit board 101, a power circuit board 102 and a driving circuit board 103, the capacitor circuit board 101 is used for filtering, the power circuit board 102 is used for outputting power, and the driving circuit board 103 is used for driving a circuit, the driving circuit board 103 is arranged between the capacitor circuit board 101 and the power circuit board 102, and the capacitor circuit board 101, the driving circuit board 103 and the power circuit board 102 are detachably fixedly connected and electrically connected; one side of the heat sink base plate 104 is provided with an insulating sub 105, and the insulating sub 105 is detachably fixedly connected to the side of the multi-layer circuit board structure close to the power circuit board 102 through the heat sink base plate 104.

[0043] The power module 1 is realized by a multi-layer circuit board structure, and the multi-layer circuit board structure comprises a capacitor circuit board 101, a power circuit board 102 and a driving circuit board 103, the capacitor circuit board 101 is used for filtering, the power circuit board 102 is used for outputting power, and the driving circuit board 103 is used for driving a circuit, the driving circuit board 103 is arranged between the capacitor circuit board 101 and the power circuit board 102, and the capacitor circuit board 101, the driving circuit board 103 and the power circuit board 102 are detachably fixedly connected and electrically connected; one side of the heat sink base plate 104 is provided with an insulating sub 105, and the insulating sub 105 is detachably fixedly connected to the side of the multi-layer circuit board structure close to the power circuit board 102 through the heat sink base plate 104.

[0044] Specifically, in the above embodiment, the power module 1 further comprises an insulating heat-conducting pad 106, and the insulating heat-conducting pad 106 is attached between the power circuit board 102 and the heat sink base plate 104. In the embodiment, the insulating heat-conducting pad 106 is a high-functionality elastomer insulating material with a special film as a base material, has good anti-cutting capacity and good heat-conducting function, is widely used in electronic and electrical industries, and in application, the insulating heat-conducting pad 106 with a proper thickness is selected according to the size of a heating interface, is cut, and is placed at a gap between the heating interface and a component, so as to play a role of a heat-conducting medium. In the application, the heat-conducting coefficient of the insulating heat-conducting pad 106 is 5 W / (m.K), the heat-conducting performance is stable, the insulating heat-conducting pad 106 is resistant to high temperature, compressible, and can absorb a certain degree of height difference of a structural member, reduces the requirement for processing precision of a contact surface, is installed between the power circuit board 102 and the heat sink base plate 104, can be repeatedly used in the process of installation and testing, is convenient to use and replace in time, and the convenience of use is improved.

[0045] Specifically, in the above embodiment, the heat sink substrate 104 is provided with a plurality of square grooves on the side away from the power circuit board 102, the square grooves are used to place the insulator 105, the first connecting hole is provided in the square groove, and the insulator 105 is detachably fixedly connected with the multi-layer circuit board structure through the first connecting hole. In this embodiment, the insulator 105 functions as an insulating current-carrying conductor, and the insulator 105 is glued by a cement adhesive from a porcelain part and a metal fitting part. The porcelain part ensures that the insulator 105 has good electrical insulation strength, and the metal fitting part functions as a fixing part. In this application, as shown in FIG. 1, the insulator 105 is connected with the multi-layer circuit board structure through the first connecting hole in the square groove and the heat sink substrate 104, which ensures the stability of the overall structure. A plurality of square grooves are provided on both sides and inside the length direction of the heat sink substrate 104, and the insulator 105 is placed in the square groove, so that the insulator 105 can meet the 11mm creepage distance, thereby meeting the high voltage insulation requirement of the power module 1. Figure 5

[0046] Specifically, in the above embodiment, the multi-layer circuit board structure includes a plurality of conductive connecting columns, and the plurality of conductive connecting columns are detachably fixedly connected with the capacitor circuit board 101, the driving circuit board 103 and the power circuit board 102 in sequence. In this embodiment, the capacitor circuit board 101, the driving circuit board 103 and the power circuit board 102 are connected by a plurality of conductive connecting columns, which ensures the stability of the multi-layer circuit board structure and ensures that the three circuit boards can maintain stable electrical connection.

[0047] Further, the conductive connecting column includes a conductive pipe 107 and a bolt 108. The conductive pipe 107 is supported between the capacitor circuit board 101 and the driving circuit board 103, and between the driving circuit board 103 and the power circuit board 102, respectively. The bolt 108 passes through the conductive pipe 107 between the capacitor circuit board 101 and the driving circuit board 103, and the conductive pipe 107 between the driving circuit board 103 and the power circuit board 102 to fix the multi-layer circuit board structure. In this embodiment, the bolt 108 passes through the capacitor circuit board 101, the driving circuit board 103 and the power circuit board 102 in sequence, which ensures the stability of the overall structure connection, and facilitates disassembly and replacement when one of the circuit boards is damaged. The conductive pipe 107 is sleeved outside the bolt 108, which is used for transmitting current between the capacitor circuit board 101, the driving circuit board 103 and the power circuit board 102.

[0048] ​Further, the plurality of conductive pipes 107 are arranged along the two side edges between the capacitor circuit board 101 and the driving circuit board 103, and arranged along the two side edges between the driving circuit board 103 and the power circuit board 102, and the plurality of conductive pipes 107 between the capacitor circuit board 101 and the driving circuit board 103 and the plurality of conductive pipes 107 between the driving circuit board 103 and the power circuit board 102 are arranged in one-to-one correspondence. In the embodiment, the conductive pipes 107 between the capacitor circuit board 101 and the driving circuit board 103 and the conductive pipes 107 between the capacitor circuit board 101 and the driving circuit board 103 are arranged in one-to-one correspondence and play a role of shunt, and the larger current in each power module 1 is uniformly shunted through the conductive pipes 107, wherein the conductive pipes 107 are preferably copper pipes.

[0049] Further, the insulator 105 is threadedly connected to the bolt 108 near one end of the power circuit board 102. In the embodiment, the insulator 105 serves as an insulating voltage-resistant structure of the power module 1, penetrates from one side of the heat sink base plate 104 and is threadedly connected to the bolt 108, so that the entire power module 1 can be stably fixed on the heat sink base plate 104, ensuring reliable connection of the power module 1, and the threaded connection also facilitates timely replacement when damage occurs to the components.

[0050] Specifically, in the above embodiment, the copper bars 109 are welded on both side edges of the capacitor circuit board 101 near the driving circuit board 103, both side edges of the driving circuit board 103 near the power circuit board 102, and both side edges of the power circuit board 102 near the driving circuit board 103, and the second connecting holes are formed on the copper bars 109, and the bolt 108 passes through the second connecting holes to fix the multi-layer circuit board structure. In the embodiment, the copper bars 109 are welded between the capacitor circuit board 101, the driving circuit board 103 and the power circuit board 102, and the bolt 108 passes through the copper bars 109 and is sequentially connected to the capacitor circuit board 101, the driving circuit board 103 and the power circuit board 102, and the copper bars 109 are in contact with the conductive pipes 107 to play a role of conducting current.

[0051] The application also provides a battery pack, referring to Figure 6 , comprising the liquid cooling plate 3, the battery pack 2 and the power module 1 described above, the battery pack 2 is attached to the liquid cooling plate 3, the heat sink base plate 104 is attached to the liquid cooling plate 3, and the power module 1 is detachably fixed to the battery pack 2.

[0052] The battery pack provided by the application sets the power module 1 and the battery pack 2 on the liquid cooling plate 3, uses the high specific heat capacity of the cooling fluid to take away the heat generated by the high-power device, reduces the temperature change rate of the heating element, meets the heat dissipation requirement of the high-power device, and improves the reliability of the product.

[0053] Specifically, in the above embodiment, the heat-conductive silicone grease is filled between the heat sink substrate 104 and the liquid cooling plate 3. In the present embodiment, the heat-conductive silicone grease has the characteristics of small thickness, low thermal resistance, excellent heat resistance and heat conduction performance. In the present application, the heat-conductive silicone grease is used to fill the gap between the heat sink substrate 104 and the liquid cooling plate 3 on the one hand, and to assist the heat dissipation of the liquid cooling plate 3 on the other hand, to strengthen the cooling effect and make the battery pack meet the heat dissipation requirements.

[0054] The above merely describes the preferred embodiments of the present application, but the protection scope of the present application is not limited thereto. Any modification or substitution within the technical scope disclosed in the present application can be easily thought of by those skilled in the art, and should be included in the protection scope of the present application.

[0055] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the claims of the present application and their equivalents, the present application also intends to include these modifications and variations.

Claims

1. A power module, characterized by The application relates to a power module (1) comprising: a multilayer circuit board structure and a heat sink substrate (104), wherein the multilayer circuit board structure comprises: a capacitor circuit board (101) for filtering; a power circuit board (102) for outputting power; a drive circuit board (103) for a drive circuit, the drive circuit board (103) being arranged between the capacitor circuit board (101) and the power circuit board (102), and the capacitor circuit board (101), the drive circuit board (103) and the power circuit board (102) being detachably fixedly connected and electrically connected; one side of the heat sink substrate (104) is provided with an insulator (105), the insulator (105) is detachably fixedly connected to the multilayer circuit board structure through the heat sink substrate (104) and close to one side of the power circuit board (102), and the insulator (105) satisfies a creepage distance of 11 mm; the multilayer circuit board structure comprises a plurality of conductive connecting columns, the conductive connecting columns comprise conductive pipes (107) and bolts (108), the plurality of conductive connecting columns are detachably fixedly connected to the capacitor circuit board (101), the drive circuit board (103) and the power circuit board (102) in sequence, the plurality of conductive pipes (107) are arranged along two side edges between the capacitor circuit board (101) and the drive circuit board (103) and between the drive circuit board (103) and the power circuit board (102) respectively, and the plurality of conductive pipes (107) between the capacitor circuit board (101) and the drive circuit board (103) and the plurality of conductive pipes (107) between the drive circuit board (103) and the power circuit board (102) are arranged in one-to-one correspondence.

2. The power module of claim 1, wherein, The power module (1) further comprises an insulating heat-conducting pad (106), which is attached between the power circuit board (102) and the heat sink substrate (104).

3. The power module of claim 1, wherein, A plurality of square grooves are formed on the side of the heat sink substrate (104) away from the power circuit board (102), the square grooves are used for placing the insulator (105), first connecting holes are formed in the square grooves, and the insulator (105) is detachably fixedly connected to the multilayer circuit board structure through the first connecting holes.

4. The power module of claim 1, wherein, The conductive pipes (107) are respectively supported between the capacitor circuit board (101) and the drive circuit board (103) and between the drive circuit board (103) and the power circuit board (102), and the bolts (108) pass through the conductive pipes (107) between the capacitor circuit board (101) and the drive circuit board (103) and the conductive pipes (107) of the drive circuit board (103) and the power circuit board (102) to fix the multilayer circuit board structure.

5. The power module of claim 4, wherein, One end of the insulator (105) close to the power circuit board (102) is threadedly connected with the bolt (108).

6. The power module of claim 1, wherein, The copper bars (109) are welded on both side edges of one side of the capacitor circuit board (101) close to the drive circuit board (103), both side edges of one side of the drive circuit board (103) close to the power circuit board (102), and both side edges of one side of the power circuit board (102) close to the drive circuit board (103), second connecting holes are formed on the copper bars (109), and the bolts (108) pass through the second connecting holes to fix the multi-layer circuit board structure.

7. A battery pack, characterized by, Comprise: A liquid cooling plate (3); A battery pack (2) connected with the liquid cooling plate (3); The power module (1) according to any one of claims 1-6, wherein the heat sink substrate (104) is connected with the liquid cooling plate (3), and the power module (1) is detachably fixedly connected with the battery pack (2).

8. The battery pack of claim 7, wherein, Thermal conductive silicone grease is filled between the heat sink substrate (104) and the liquid cooling plate (3).

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