printed circuit boards

Abstract

According to an embodiment, a printed circuit board includes: an insulating layer; and a through hole, which is arranged in the insulating layer, the through hole including: a first solder pad, which is arranged at the bottom of the insulating layer; a second solder pad, which is arranged at the top of the insulating layer; and a through hole portion, which is arranged between the first solder pad and the second solder pad in the insulating layer, wherein the width of the first solder pad is less than or equal to the width of the lower surface of the through hole portion.

Description

Technical Field

[0001] Embodiments relate to a printed circuit board and a method of manufacturing the same. Background Art

[0002] As electronic components become increasingly miniaturized, lightweight, and integrated, circuit line widths are shrinking. In particular, as semiconductor chip design rules are integrated at the nanoscale, the circuit line widths of package substrates or printed circuit boards on which semiconductor chips are mounted are shrinking to a few micrometers or less.

[0003] Various methods have been proposed to increase the circuit integration density of printed circuit boards (PCBs), that is, to miniaturize the line width of circuits. To prevent line width loss during the etching step for patterning after copper plating, a semi-additive process (SAP) and a modified semi-additive process (MSAP) have been proposed.

[0004] Since then, the embedded trace substrate (hereinafter referred to as "ETS") method has been used in the art, in which copper foil is buried in an insulating layer to achieve a finer circuit pattern. The ETS method is produced by embedding copper foil circuits into the insulating layer rather than forming copper foil circuits on the surface of the insulating layer. Due to this, there is no circuit loss due to etching, which is conducive to finer circuit pitch.

[0005] Meanwhile, recently, efforts are underway to develop improved fifth-generation (5G) communication systems or pre-5G communication systems to meet the demand for wireless data services. Here, 5G communication systems use ultra-high frequency (millimeter wave) bands (less than 6 GHz, 28 GHz, 38 GHz, or higher frequencies) to achieve high data rates.

[0006] Furthermore, integrated technologies such as beamforming, massive MIMO, and array antennas are being developed to mitigate path loss in very high frequency bands and increase the propagation distance of radio waves in 5G communication systems. Given that these frequency bands can require active antennas with hundreds of wavelengths, the antenna systems become relatively large.

[0007] Because these antennas and AP modules are patterned or mounted on printed circuit boards, low losses in the printed circuit boards are crucial. This means that the several substrates that make up the active antenna system—the antenna substrate, antenna feed substrate, transceiver substrate, and baseband substrate—must be integrated into a compact unit.

[0008] Also, the printed circuit boards applied to the 5G communication system as described above are manufactured in accordance with the trend of being thin, light and compact, and accordingly, the circuit patterns are gradually becoming finer.

[0009] However, the printed circuit board of the related art has significantly reduced design freedom due to the pads connected to the through-holes, and this has a problem in that RF performance also degrades in the 5G NR era.

[0010] Therefore, in accordance with the 5G era, a new technology for miniaturization and thinning of semiconductor packaging technology is required. Summary of the Invention

[0011] Technical issues

[0012] The embodiment provides a printed circuit board having a new structure and a method of manufacturing the same.

[0013] Furthermore, embodiments provide a printed circuit board including via portions having the same width as a via and a first pad directly connected to the via, and a method of manufacturing the same.

[0014] Furthermore, embodiments provide a printed circuit board including a through-hole portion, wherein a width of the through-hole is greater than a width of a first pad directly connected to the through-hole, and a method of manufacturing the same.

[0015] The technical problems to be solved by this embodiment are not limited to the above-mentioned technical problems, and a person skilled in the art to which the present invention pertains will clearly understand another technical problem not mentioned through the following description.

[0016] Technical Solution

[0017] According to an embodiment, a printed circuit board includes an insulating layer; and a through-hole portion, which is arranged on the insulating layer, wherein the through-hole portion includes: a first solder pad, which is arranged below the insulating layer; a second solder pad, which is arranged on the insulating layer; and a through-hole portion, which is arranged between the first solder pad and the second solder pad in the insulating layer; and wherein the width of the first solder pad is less than or equal to the width of the lower surface of the through-hole portion.

[0018] In addition, the width of the upper surface of the through-hole portion is greater than the width of the lower surface of the through-hole portion.

[0019] In addition, the width of the upper surface of the first pad is the same as the width of the lower surface of the first pad.

[0020] In addition, the first pad is provided in a lower region of the insulating layer, and the through hole portion is provided to cover the upper surface and the side surface of the first pad.

[0021] Furthermore, a lower surface of the through-hole portion is positioned on the same plane as each of a lower surface of the first pad and a lower surface of the insulating layer.

[0022] Furthermore, the first pad is provided to protrude below the lower surface of the insulating layer, and

[0023] The through-hole portion includes a first region in contact with an upper surface of the first pad and a second region not in contact with the upper surface of the first pad.

[0024] Furthermore, the center portion of the through hole portion and the center portion of the first pad are aligned on the same vertical line.

[0025] In addition, the first pad is disposed in a lower area of ​​the insulating layer, wherein a portion of an upper surface and a portion of a side surface of the first pad are covered by the insulating layer, and wherein the remaining portion of the upper surface and the remaining portion of the side surface of the first pad are covered by the through-hole pad.

[0026] Furthermore, the center portion of the through hole portion is displaced from the center portion of the first pad on the same vertical line.

[0027] Furthermore, the insulating layer is formed of a photocurable resin (PID: Photo Imageable Dielectric).

[0028] On the other hand, a method for manufacturing a printed circuit board according to an embodiment includes: preparing a carrier; forming a first solder pad on the carrier; forming an insulating layer covering the first solder pad on the carrier; forming a via hole passing through the insulating layer and exposing at least a portion of the upper surface of the first solder pad; forming a via portion in the via hole; forming a second solder pad on the insulating layer in contact with the upper surface of the via portion; and removing the carrier; wherein the width of the lower portion of the via hole is greater than or equal to the width of the first solder pad, and wherein the width of the lower surface of the via portion is greater than or equal to the width of the first solder pad.

[0029] Furthermore, the width of the upper surface of the through-hole portion is greater than the width of the lower surface of the through-hole portion, and the width of the upper surface of the first pad is the same as the width of the lower surface of the first pad.

[0030] In addition, the width of the first pad is smaller than the width of the lower surface of the through-hole portion, and the central portion of the through-hole portion is aligned on the same vertical line as the central portion of the first pad, and the through-hole portion is arranged to cover the upper surface and side surfaces of the first pad.

[0031] Furthermore, lower surfaces of the through-hole portion are positioned on the same plane as the lower surface of the first pad and the lower surface of the insulating layer, respectively.

[0032] In addition, the center portion of the through-hole portion is displaced on the same vertical line as the center portion of the first pad, and a portion of the side surface and a portion of the upper surface of the first pad are covered by the insulating layer, and a remaining portion of the side surface and a remaining portion of the upper surface of the first pad are covered by the through-hole pad.

[0033] In addition, the manufacturing method of the printed circuit board of this embodiment includes: preparing an insulating layer; forming a first solder pad on the lower surface of the insulating layer; forming a through hole in the insulating layer to expose at least a portion of the upper surface of the first solder pad; forming a through hole portion in the through hole; and forming a second solder pad on the upper surface of the insulating layer in contact with the upper surface of the through hole portion; wherein the width of the upper surface of the through hole portion is greater than the width of the lower surface of the through hole portion, wherein each of the first solder pad and the second solder pad includes an upper surface and a lower surface having the same width as each other, and wherein the width of the lower surface of the through hole portion is greater than or equal to the width of the first solder pad.

[0034] Furthermore, the through-hole portion includes a first region in contact with the upper surface of the first pad and a second region out of contact with the upper surface of the first pad.

[0035] Beneficial effects

[0036] The through-hole portion of the embodiment includes a through-hole portion passing through the insulating layer, a first pad disposed below the through-hole portion, and a second pad disposed on the through-hole portion. In this case, the width of the first pad in the printed circuit board of the embodiment is not greater than the width of the through-hole portion. In other words, the width of the first pad in the printed circuit board of the embodiment can be equal to or less than the width of the through-hole portion.

[0037] According to this, the printed circuit board of the embodiment can increase the spacing distance between a plurality of through-hole portions adjacent to each other, and thus, easily realize a fine pattern of a circuit pattern, making it possible to increase circuit density.

[0038] Furthermore, the embodiment can improve the degree of freedom in design of the entire printed circuit board according to the design variation of the through-hole portion, and therefore, can ensure fine pattern realization and substrate reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 is a view showing a printed circuit board according to a comparative example.

[0040] Figure 2 is a view showing a printed circuit board according to the first embodiment.

[0041] Figures 3 to 8 The order of the process is shown Figure 2 FIG. 2 is a diagram of a method for manufacturing a printed circuit board according to a first embodiment shown in FIG.

[0042] Figure 9 is a view comparing spacing distances between a plurality of through-hole portions in printed circuit boards according to a comparative example and an embodiment.

[0043] Figure 10 is a view showing a printed circuit board according to a second embodiment.

[0044] Figures 11 to 13 The order of the process is shown Figure 10 FIG. 2 is a diagram of a method for manufacturing a printed circuit board according to a second embodiment shown in FIG.

[0045] Figure 14 is a view showing a printed circuit board according to a third embodiment.

[0046] Figure 15 is a view showing a printed circuit board according to a fourth embodiment.

[0047] Figure 16 is a view showing a printed circuit board according to a fifth embodiment. Specific embodiments

[0048] Hereinafter, the embodiments disclosed in this specification will be described in detail with reference to the accompanying drawings, but the same or similar parts are designated by the same drawing numbers regardless of the drawing numbers, and repeated descriptions thereof will be omitted. The component suffixes "module" and "section" used in the following description are given or mixed together only in consideration of the ease of creating the specification, and they themselves have no meaning or function that distinguishes one from another. In addition, when describing the embodiments disclosed in this specification, when it is determined that the detailed description of the relevant known technology unnecessarily obscures the main purpose of the embodiments disclosed in this specification, its detailed description will be omitted. Further, the drawings are only helpful in understanding the embodiments disclosed in this specification, and the technical scope disclosed in this specification is not limited by the drawings, and should be understood to include all modifications, equivalents and substitutes that fall within the spirit and scope of the invention.

[0049] It will be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0050] It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements.

[0051] A singular expression includes a plural expression unless the context clearly requires otherwise.

[0052] It will be further understood that the terms “including” or “having” when used herein specify the presence of stated features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0053] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0054] Figure 1 is a view showing a printed circuit board according to a comparative example. Figure 1 (a) is a view showing a printed circuit board including an embedded circuit pattern manufactured by the ETS method, and Figure 1 (b) is a view showing a printed circuit board having a general protruding circuit pattern.

[0055] refer to Figure 1 (a) A printed circuit board according to a comparative example includes a circuit pattern manufactured by an ETS method.

[0056] Specifically, the printed circuit board manufactured by the ETS method includes an insulating layer 11, a circuit pattern 12, and a through-hole portion 16. At this time, although the circuit pattern 12 is illustrated as being provided only below the insulating layer in the drawings, the circuit pattern is additionally provided with a protruding structure on the upper surface of the insulating layer 11.

[0057] The circuit pattern 12 is embedded in the insulating layer 11 .

[0058] Preferably, the circuit pattern 12 is buried in a lower region of the insulating layer 11. Therefore, a lower surface of the circuit pattern 12 is disposed on the same plane as a lower surface of the insulating layer 11.

[0059] An upper circuit pattern (not shown) is additionally provided on the upper surface of the insulating layer 11 , and the upper circuit pattern has a structure protruding on the upper surface of the insulating layer 11 .

[0060] A through-hole portion 16 is provided in the insulating layer 11 .

[0061] At this time, the through hole portion includes a through hole part 15 provided in and passing through the insulating layer 11 , a first pad 13 buried in a lower region of the insulating layer 11 , and a second pad 14 provided on an upper surface of the insulating layer 11 .

[0062] In this case, the first pad 13 has a first width w1, and the second pad 14 has a second width w2. The first width w1 may be the same as the second width w2, or alternatively, the first width w1 may be smaller than the second width w2.

[0063] Furthermore, the lower surface of the through-hole portion 15 contacts the upper surface of the first pad 13 and has a third width w3. Furthermore, the upper surface of the through-hole portion 15 contacts the lower surface of the second pad 14 and has a fourth width w4. In this case, the third width w3 is smaller than the fourth width w4, and therefore, the through-hole portion 15 has a shape in which the width gradually decreases from the upper portion to the lower portion.

[0064] At the same time, the third width w3 of the lower surface of the through-hole portion 15 is smaller than the first width w1 of the first pad 13. In addition, the fourth width w4 of the upper surface of the through-hole portion 15 is smaller than the second width w2 of the second pad 14. That is, the first pad 13 and the second pad 14 have a structure extending in the horizontal direction from the upper and lower portions of the through-hole portion 15, respectively.

[0065] Meanwhile, in recent years, circuit patterns have gradually become thinner. Furthermore, in the case of fine circuit patterns with a width / space of 15μm / 15μm or less, the outermost layer must be formed using the ETS method. That is, in the case of fine circuit patterns where each circuit pattern must be separated by a distance of 15μm or less and the outermost layer circuit pattern has a width of 15μm, only when the circuit pattern is formed using the ETS method can a stable fine pattern be formed.

[0066] However, in the printed circuit board of the comparative example described above, the first width w1 of the first pad 13 is greater than the third width w3 of the lower surface of the through-hole portion 15, and the second width w2 of the second pad 14 is greater than the fourth width w4 of the upper surface of the through-hole portion 15. Therefore, the spacing distance between adjacent through-hole portions is reduced. In other words, in the printed circuit board of the comparative example, the spacing distance w5 between adjacent first pads 13 can be reduced.

[0067] In other words, the spacing distance between the first pads 13 is smaller than the spacing distance between the lower regions of the adjacent through-hole portions in the printed circuit board in the comparative example.

[0068] refer to Figure 1 (b) A printed circuit board according to a comparative example includes a circuit pattern having a protruding structure.

[0069] Specifically, the printed circuit board includes an insulating layer 21, a circuit pattern 22, and a through-hole portion 26. At this time, although the circuit pattern 22 is illustrated as being disposed only below the insulating layer 21 in the drawings, the circuit pattern is additionally disposed on the upper surface of the insulating layer 21 having the protruding structure.

[0070] The circuit pattern 22 has a structure protruding below the lower surface of the insulating layer 21. Therefore, the upper surface of the circuit pattern 22 is disposed on the same plane as the lower surface of the insulating layer 21.

[0071] The through-hole portion 26 is provided in the insulating layer 21 .

[0072] In this case, the through hole portion 26 includes a through hole section 25 provided in and passing through the insulating layer 21 , a first pad 23 protruding below the lower surface of the insulating layer 21 , and a second pad 24 provided on the upper surface of the insulating layer 21 .

[0073] In this case, the first pad 23 has a first width w1 ', and the second pad 24 has a second width w2 '. The first width w1 ' may be the same as the second width w2 ', or alternatively, the first width w1 ' may be smaller than the second width w2 '.

[0074] Furthermore, the lower surface of the through-hole portion 25 contacts the upper surface of the first pad 23 and has a third width w3'. Furthermore, the upper surface of the through-hole portion 25 contacts the lower surface of the second pad 24 and has a fourth width w4'. In this case, the third width w3' is smaller than the fourth width w4', and therefore, the through-hole portion 25 has a shape in which the width gradually decreases from the upper portion to the lower portion.

[0075] At the same time, the third width w3' of the lower surface of the through-hole portion 25 is smaller than the first width w1' of the first pad 23. In addition, the fourth width w4' of the upper surface of the through-hole portion 25 is smaller than the second width w2' of the second pad 24. That is, the first pad 23 and the second pad 24 have a structure extending in the horizontal direction above and below the through-hole portion 25, respectively.

[0076] However, in the printed circuit board of the comparative example described above, the first width w1′ of the first pad 23 is greater than the third width w3′ of the lower surface of the through-hole portion 25, and the second width w2′ of the second pad 24 is greater than the fourth width w4′ of the upper surface of the through-hole portion 25. Therefore, the spacing distance between adjacent through-hole portions is reduced. In other words, in the printed circuit board of the comparative example, the spacing distance w5′ between adjacent first pads 23 can be reduced.

[0077] Furthermore, with the recent development of 5G technology, interest in printed circuit boards (PCBs) that reflect this trend is growing. To facilitate the application of 5G technology, PCBs must have a highly multilayered structure, and therefore, circuit patterns must be miniaturized. However, while the comparative example can form fine patterns due to the structure of the through-hole portions described above, there is a problem of reduced circuit density in the spaces between the through-hole portions.

[0078] Figure 2 is a view showing a printed circuit board according to the first embodiment.

[0079] refer to Figure 2 , the printed circuit board 100 includes an insulating layer 110 , a circuit pattern 120 and a through-hole portion 130 .

[0080] The printed circuit board 100 can represent the electrical wiring that connects circuit components based on the circuit design as a wiring diagram, and can reproduce electrical conductors on an insulator. In addition, the printed circuit board 100 can mount electronic components and form wiring for connecting them in a circuit, and can mechanically fix components in addition to the electrical connection function of the components.

[0081] The insulating layer 110 may be a supporting substrate of the printed circuit board 100 on which a single circuit pattern is formed, but it may refer to an insulating region in which any one circuit pattern of the printed circuit board 100 having a plurality of stacked structures is formed.

[0082] Preferably, the insulating layer 110 may represent an insulating region of any one printed circuit board 100 having a plurality of stacked structures.

[0083] The insulating layer 110 may include a photocurable resin or a photosensitive resin. That is, the insulating layer 110 may be formed of a PID (Photo Imageable Dielectric) material.

[0084] To this end, the insulating layer 110 may include epoxy resin, a photoinitiator, a silicon-based filler (Si filler), a curing agent, and the like. For example, the insulating layer 110 may be formed by laminating a photocurable resin film or applying a photocurable resin paste or liquid. In this case, the photocurable resin material in one example may include any one or more selected from photocurable polyhydroxystyrene (PHS), photocurable polybenzoxazole (PBO), photocurable polyimide (PI), photocurable benzocyclobutene (BCB), photocurable polysiloxane, photocurable epoxy resin, and novolac resin.

[0085] In the embodiment, by forming the insulating layer 110 using a photocurable resin, a small-sized circuit pattern and a fine through-hole portion to be cleaned can be formed using exposure and development, etc.

[0086] The circuit pattern 120 may be provided in a lower region of the insulating layer 110. The circuit pattern 120 may have a structure buried in the lower region of the insulating layer 110. The circuit pattern 120 according to the first embodiment may be manufactured by an embedded trace substrate (ETS) method.

[0087] The circuit pattern 120 is a conductive wire that transmits electrical signals and can be formed from a metal material having high electrical conductivity. To this end, the circuit pattern 120 can be formed from at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Furthermore, the circuit pattern 120 can be formed from a paste or solder paste containing one of the metal materials, gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), which have excellent bonding strength. Preferably, the circuit pattern 120 can be formed from copper (Cu), which has high electrical conductivity and is relatively inexpensive.

[0088] In addition, the printed circuit board 100 may include a through hole portion 130 .

[0089] The through hole portion 130 includes a first pad 131 disposed under the insulating layer 110 , a second pad 132 disposed on the insulating layer 110 , and a through hole section 133 passing through the insulating layer 110 .

[0090] The first pad 131 may have a structure buried in a lower region of the insulating layer 110 . The first pad 131 may be formed together with the circuit pattern 120 , and thus, a portion of the circuit pattern 120 may be the first pad 131 .

[0091] The second pad 132 may be disposed on the upper surface of the insulating layer 110. The second pad 132 may have a structure protruding above the upper surface of the insulating layer 110.

[0092] The first pad 131 may be provided in a lower region of the insulating layer 110 to have a first width W1. The first pad 131 may also be referred to as a land pad. The width of the lower surface of the first pad 131 may be the same as the width of the upper surface of the first pad 131.

[0093] In addition, the second pad 132 may be provided on the upper surface of the insulating layer 110 to have a second width W2. The second pad 132 may also be referred to as a capture pad. The width of the lower surface and the width of the upper surface of the second pad 132 may be the same as each other.

[0094] Furthermore, a through hole portion 133 of the through hole part 130 may be provided in the insulating layer 110. A lower surface of the through hole portion 133 may directly contact an upper surface of the first pad 131. Furthermore, an upper surface of the through hole portion 133 may directly contact a lower surface of the second pad 132.

[0095] The width of the lower surface of the via portion 133 may be the same as the first width W1 of the first pad 131. That is, the lower surface of the via portion 133 may have the first width W1.

[0096] In addition, the width of the upper surface of the via portion 133 may be smaller than the second width W2 of the second pad 132 . That is, the upper surface of the via portion 133 may have a fourth width W4 smaller than the second width W2 of the second pad 132 .

[0097] Furthermore, the first width W1 of the lower surface of the through-hole portion 133 is smaller than the fourth width W4 of the upper surface of the through-hole portion 133. That is, the through-hole portion 133 may have a shape in which the width gradually decreases from the upper surface to the lower surface. In this case, the planar shapes of the lower and upper surfaces of the through-hole portion 133 may be circular. Therefore, the overall shape of the through-hole portion 133 may be cylindrical, but is not limited thereto. Furthermore, when the through-hole portion 133 has a cylindrical shape, the first width W1 of the lower surface of the through-hole portion 133 may be the diameter of the lower surface of the through-hole portion 133. Furthermore, the fourth width W1 of the upper surface of the through-hole portion 133 may be the diameter of the upper surface of the through-hole portion 133.

[0098] As described above, the width of the lower surface of the through hole portion 133 in the embodiment is the same as the width of the first pad 131 provided below the through hole portion 133. Figure 1 Compared to the comparative example shown in FIG, the spacing distance W5 between the plurality of through-hole portions in the embodiment can be increased. That is, in the embodiment, the spacing distance between the lower surfaces of the plurality of through-hole portions can be the same as the spacing distance between the plurality of first pads. Therefore, the spacing distance between the plurality of through-hole portions in the embodiment can be increased, thereby improving circuit density and design freedom.

[0099] At this time, the insulating layer 11 in the comparative example is formed of a thermosetting resin. Therefore, a through-hole hole for forming a through-hole portion can be formed by a laser process. In this case, when the width of the first pad 131 and the width of the lower surface of the through-hole portion 133 are the same as those in the embodiment, even if the formation position of the through-hole hole is slightly shifted, the through-hole hole may penetrate into another insulating layer below, and thus defects may occur. That is, the first pad in the comparative example serves as a stopper for performing the laser process, and therefore there is a limitation in reducing the width of the first pad.

[0100] In contrast, the insulating layer 110 in the embodiment is formed of a photocurable resin as described above. Therefore, the through-hole holes for forming the through-hole portions 133 in the embodiment are formed through an exposure and development process, and thus, the through-hole holes can be formed only in the desired insulating layer, regardless of the width of the first pads 131. Therefore, as described above, the width of the first pads 131 in the embodiment can be reduced, and thus the spacing distance between the plurality of through-hole portions 130 can be increased.

[0101] The through hole portion 133 as described above may be formed by filling the inside of the through hole formed as described above with a metal material or plating with a metal material.

[0102] The metal material used to form the through hole portion 133 can be any one material selected from Cu, Ag, Sn, Au, Ni and Pd, and the metal material can be filled by any one or a combination of electroless plating, electrolytic plating, screen printing, sputtering, evaporation, inkjet and dispensing.

[0103] The through-hole portion of the embodiment includes a through-hole portion passing through the insulating layer, a first pad disposed below the through-hole portion, and a second pad disposed on the through-hole portion. In this case, the width of the first pad in the printed circuit board of the embodiment is no greater than the width of the through-hole portion. In other words, the width of the first pad of the printed circuit board of the embodiment can be the same as the width of the through-hole portion.

[0104] According to this, the printed circuit board of the embodiment can increase the spacing distance between a plurality of through-hole portions adjacent to each other, and thus, easily realize a fine pattern of a circuit pattern, making it possible to increase circuit density.

[0105] Furthermore, the embodiment can improve the degree of freedom in design of the entire printed circuit board according to the design variation of the through-hole portion, and thus can ensure fine pattern realization and substrate reliability.

[0106] Figures 3 to 8 The order of the process is shown Figure 2 FIG. 2 is a diagram of a method for manufacturing a printed circuit board according to a first embodiment shown in FIG.

[0107] In the method of manufacturing the printed circuit board 100 according to the first embodiment, a manufacturing process of a plurality of printed circuit boards is performed on both sides of the carrier 101 based on the carrier 101 .

[0108] refer to Figure 3 , a carrier 101 for manufacturing a printed circuit board 100 is prepared. Carrier 101 includes a dummy insulating layer 102 and copper foil layers 103 and 104 disposed on both surfaces of dummy insulating layer 102. Thus, printed circuit board 100 uses carrier 101 to simultaneously manufacture multiple printed circuit boards. However, this is merely an example, and the printed circuit board manufacturing process may be performed only on the upper or lower portion relative to carrier 101.

[0109] The copper foil layers 103 and 104 may be formed by electrolessly plating a metal material including copper on the dummy insulating layer 102 .

[0110] In addition, unlike the copper foil layers 103 and 104 formed on the surface of the dummy insulating layer 102 by chemical plating, a general CCL (copper clad laminate) can be used. In this case, when the copper foil layers 102 and 103 are formed by chemical plating, the chemical plating process can be performed in the order of a degreasing process, a soft etching process, a catalyst pretreatment process, an activation process, an chemical plating process, and an oxidation treatment process.

[0111] Furthermore, the copper foil layers 103 and 104 may be formed by sputtering metal particles on the surface of the dummy insulating layer 102 using plasma, instead of plating.

[0112] Next, refer to Figure 4 , a circuit pattern 120 is formed on the copper foil layers 103 and 104. The circuit pattern 120 may be formed by an ETS method using the carrier 101. However, this is merely an example, and the circuit pattern 120 may be formed using an additive process, a subtractive process, a modified semi-additive process (MSAP), and a SAP (semi-additive process) method, which are typical printed circuit board manufacturing processes, and a detailed description thereof will be omitted here.

[0113] Meanwhile, a portion of the circuit pattern 120 formed on the copper foil layers 103 and 104 may serve as a first pad 131 constituting the through hole portion 130 .

[0114] Next, refer to Figure 5 , an insulating layer 110 is formed by covering the circuit pattern 120 on the copper foil layers 103 and 104 .

[0115] The insulating layer 110 may include a photocurable resin or a photosensitive resin. To this end, the insulating layer 110 may include an epoxy resin, a photoinitiator, a silicon-based filler (Si filler), a curing agent, and the like. For example, the insulating layer 110 may be formed by laminating a photocurable resin film or applying a photocurable resin paste or liquid. In this case, the photocurable resin material in one example may include any one or more selected from photocurable polyhydroxystyrene (PHS), photocurable polybenzoxazole (PBO), photocurable polyimide (PI), photocurable benzocyclobutene (BCB), photocurable polysiloxane, photocurable epoxy resin, and phenolic varnish resin.

[0116] Next, refer to Figure 6, forming a through hole 140 in the insulating layer 110. In this case, the through hole 140 can be formed by performing an exposure and development process. Therefore, the first pad 131 in the embodiment is not affected by the size of the through hole 140. That is, the through hole in the comparative example is formed by a laser process. Therefore, the first pad serves as a stopper for determining the depth of the through hole in the laser process. Therefore, the width of the first pad is affected by the size of the through hole, and preferably, the width of the first pad is formed to be larger than the width of the through hole.

[0117] Alternatively, by forming the insulating layer 110 using a photocurable resin as described above, the depth of the via hole 140 in the embodiment may be easily adjusted without a barrier layer such as the first pad 131 , and thereby forming the via hole 140 through exposure and development processes or the like.

[0118] Therefore, the width of the lower portion of the via hole 140 may be the same as the width of the upper surface of the first pad 131 .

[0119] Next, refer to Figure 7 , the through-hole portion 133 may be formed by filling the inside of the through-hole 140 formed in the insulating layer 110 with a metal material.

[0120] Preferably, the through-hole portion 133 may be formed by filling the through-hole 140 with a metal material or plating the through-hole 140 with a metal material.

[0121] The metal material used to form the through hole portion 133 can be any one material selected from Cu, Ag, Sn, Au, Ni and Pd, and the metal material can be filled by any one or a combination of chemical plating, electrolytic plating, screen printing, sputtering, evaporation, inkjet and dispensing.

[0122] Furthermore, second pads 132 contacting the upper surface of the via portion 133 are formed on the insulating layer 110. In this case, in an embodiment, an additional circuit pattern (not shown) disposed on the upper surface of the insulating layer together with the second pads 132 may be formed.

[0123] Next, refer to Figure 8 , by removing the carrier 101 , the plurality of printed circuit boards 100 manufactured on both sides of the carrier 101 are separated from each other.

[0124] In this case, the separation of the carrier 101 may be achieved by flash etching the copper foil layers 103 and 104 provided on both surfaces of the dummy insulating layer 102 .

[0125] The first pad 131 may be provided in a lower region of the insulating layer 110 to have a first width W1. The first pad 131 may also be referred to as a ground pad. The width of the lower surface of the first pad 131 may be the same as the width of the upper surface.

[0126] In addition, the second pad 132 may be provided on the upper surface of the insulating layer 110 to have a second width W2. The second pad 132 may also be referred to as a capture pad. The width of the lower surface and the width of the upper surface of the second pad 132 may be the same as each other.

[0127] Furthermore, a through hole portion 133 of the through hole part 130 may be provided in the insulating layer 110. A lower surface of the through hole portion 133 may directly contact an upper surface of the first pad 131. Furthermore, an upper surface of the through hole portion 133 may directly contact a lower surface of the second pad 132.

[0128] The width of the lower surface of the via portion 133 may be the same as the first width W1 of the first pad 131. That is, the lower surface of the via portion 133 may have the first width W1.

[0129] In addition, the width of the upper surface of the via portion 133 may be smaller than the second width W2 of the second pad 132 . That is, the upper surface of the via portion 133 may have a fourth width W4 smaller than the second width W2 of the second pad 132 .

[0130] Furthermore, the first width W1 of the lower surface of the through-hole portion 133 is smaller than the fourth width W4 of the upper surface of the through-hole portion 133. That is, the through-hole portion 133 may have a shape in which the width gradually decreases from the upper surface to the lower surface. In this case, the planar shapes of the lower and upper surfaces of the through-hole portion 133 may be circular. Therefore, the overall shape of the through-hole portion 133 may be cylindrical, but is not limited thereto. Furthermore, when the through-hole portion 133 has a cylindrical shape, the first width W1 of the lower surface of the through-hole portion 133 may be the diameter of the lower surface of the through-hole portion 133. Furthermore, the fourth width W1 of the upper surface of the through-hole portion 133 may be the diameter of the upper surface of the through-hole portion 133.

[0131] As described above, the width of the lower surface of the through hole portion 133 in the embodiment is the same as the width of the first pad 131 provided below the through hole portion 133. Figure 1 Compared to the comparative example shown in FIG, the spacing distance W5 between the plurality of through-hole portions in the embodiment can be increased. That is, the spacing distance between the lower surfaces of the plurality of through-hole portions in the embodiment can be the same as the spacing distance between the plurality of first pads. Therefore, the spacing distance between the plurality of through-hole portions in the embodiment can be increased, thereby improving circuit density and design freedom.

[0132] In this case, the insulating layer 11 in the comparative example is formed from a thermosetting resin. Therefore, a through-hole hole for forming the through-hole portion can be formed using a laser process. In this case, when the width of the first pad 131 and the width of the lower surface of the through-hole portion 133 are the same as those in the embodiment, even if the formation position of the through-hole hole is slightly shifted, the through-hole hole may penetrate into the other insulating layer below, and thus defects may occur. In other words, the first pad in the comparative example acts as a stopper for performing laser processing, and therefore there is a limit to reducing the width of the first pad.

[0133] In contrast, the insulating layer 110 in the embodiment is formed of a photocurable resin as described above. Therefore, the through-hole holes for forming the through-hole portions 133 in the embodiment are formed by exposure and development processes, and thus, the through-hole holes can be formed only in the desired insulating layer without considering the width of the first pads 131. Therefore, as described above, the width of the first pads 131 in the embodiment can be reduced, and thus the spacing distance between the plurality of through-hole portions 130 can be increased.

[0134] Figure 9 is a view comparing spacing distances between a plurality of through-hole portions in printed circuit boards according to a comparative example and an embodiment.

[0135] like Figure 9 As shown in (a), the first width w1 of the first pad 13 of the comparative example printed circuit board is greater than the third width w3 of the lower surface of the through-hole portion 15, and the second width w2 of the second pad 14 is greater than the fourth width w4 of the upper surface of the through-hole portion 15. Therefore, the spacing distance between adjacent through-hole portions is reduced. In other words, in the comparative example printed circuit board, the spacing distance w5 between adjacent first pads 13 can be reduced.

[0136] In other words, the spacing distance between the first lands 13 in the printed circuit board in the comparative example is smaller than the spacing distance between the lower regions of the adjacent through-hole portions.

[0137] In contrast, Figure 9 As shown in (b), the width of the lower surface of the through hole portion 133 in the embodiment is the same as the width of the first pad 131 provided below the through hole portion 133. Figure 1 Compared to the comparative example shown in FIG, the spacing distance W5 between the plurality of through-hole portions in the embodiment can be increased. That is, in the embodiment, the spacing distance between the lower surfaces of the plurality of through-hole portions can be the same as the spacing distance between the plurality of first pads. Therefore, the spacing distance between the plurality of through-hole portions in the embodiment can be increased, thereby improving circuit density and design freedom.

[0138] Figure 10 is a view showing a printed circuit board according to a second embodiment.

[0139] refer to Figure 10 , the printed circuit board 200 includes an insulating layer 210 , a circuit pattern 220 and a through-hole portion 230 .

[0140] The insulating layer 210 may include a photocurable resin or a photosensitive resin. To this end, the insulating layer 210 may include an epoxy resin, a photoinitiator, a silicon-based filler (Si filler), a curing agent, and the like. For example, the insulating layer 210 may be formed by laminating a photocurable resin film or applying a photocurable resin paste or liquid. In this case, the photocurable resin material in one example may include one or more selected from photocurable polyhydroxystyrene (PHS), photocurable polybenzoxazole (PBO), photocurable polyimide (PI), photocurable benzocyclobutene (BCB), photocurable polysiloxane, photocurable epoxy resin, and phenolic varnish resin.

[0141] The circuit pattern 220 may be provided in the lower region of the insulating layer 210. The circuit pattern 220 may have a structure buried in the lower region of the insulating layer 210. The circuit pattern 220 having a protruding structure may be formed using an additive process, a subtractive process, a modified semi-additive process (MSAP), and a SAP (semi-additive process) method, etc., which are typical printed circuit board manufacturing processes, and a detailed description thereof will be omitted herein.

[0142] The circuit pattern 220 may be formed of at least one metal material selected from the group consisting of gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Furthermore, the circuit pattern 220 may be formed of a paste or solder paste containing one of the metal materials, gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), which have excellent bonding strength. Preferably, the circuit pattern 120 may be formed of copper (Cu), which has high conductivity and is relatively inexpensive.

[0143] In addition, the printed circuit board 200 may include a through hole portion 230 .

[0144] The through hole portion 230 includes a first pad 231 disposed under the insulating layer 110 , a second pad 232 disposed on the insulating layer 210 , and a through hole section 233 passing through the insulating layer 210 .

[0145] The first pad 231 may have a structure buried in a lower region of the insulating layer 210 . The first pad 231 may be formed together with the circuit pattern 220 , and thus, a portion of the circuit pattern 220 may be the first pad 231 .

[0146] The second pad 232 may be disposed on the upper surface of the insulating layer 210. The second pad 232 may have a structure protruding above the upper surface of the insulating layer 210.

[0147] The first pad 231 may be provided in a lower region of the insulating layer 210 to have a first width W1. The first pad 231 may also be referred to as a ground pad. The width of the lower surface of the first pad 231 may be the same as the width of the upper surface of the first pad 231.

[0148] In addition, the second pad 232 may be provided on the upper surface of the insulating layer 210 to have a second width W2. The second pad 232 may also be referred to as a capture pad. The width of the lower surface and the width of the upper surface of the second pad 232 may be the same as each other.

[0149] Furthermore, the through hole portion 233 of the through hole part 230 may be provided in the insulating layer 210. The lower surface of the through hole portion 233 may directly contact the upper surface of the first pad 231. Furthermore, the upper surface of the through hole portion 233 may directly contact the lower surface of the second pad 232.

[0150] In this case, the through hole portion 233 according to the second embodiment may be provided to cover the first pad 231. That is, the width of the lower surface of the through hole portion 233 is greater than the width of the upper surface of the first pad 231. Therefore, the through hole portion 233 may be provided in the insulating layer 210 while surrounding the first pad 231.

[0151] That is, the third width W3 of the lower surface of the via portion 233 may be greater than the first width W1 of the first pad 231. That is, the lower surface of the via portion 233 may have the third width W3 greater than the first width W1.

[0152] In addition, the width of the upper surface of the via portion 233 may be smaller than the second width W2 of the second pad 232. That is, the upper surface of the via portion 233 may have a fourth width W4 smaller than the second width W2 of the second pad 232.

[0153] Furthermore, the first width W1 of the lower surface of the through-hole portion 233 is smaller than the fourth width W4 of the upper surface of the through-hole portion 233. That is, the through-hole portion 233 may have a shape in which the width gradually decreases from the upper surface to the lower surface. In this case, the planar shapes of the lower and upper surfaces of the through-hole portion 233 may be circular. Therefore, the overall shape of the through-hole portion 233 may be cylindrical, but is not limited to this. Furthermore, when the through-hole portion 233 has a cylindrical shape, the third width W3 of the lower surface of the through-hole portion 233 may be the diameter of the lower surface of the through-hole portion 233. Furthermore, the fourth width W4 of the upper surface of the through-hole portion 233 may be the diameter of the upper surface of the through-hole portion 233.

[0154] As described above, the width W3 of the lower surface of the through-hole portion 233 in the embodiment is greater than the width W1 of the first pad 231 provided below the through-hole portion 233. Therefore, the through-hole portion 233 may not be provided on the first pad 231, but its lower surface may be positioned on the same plane as the lower surface of the first pad 231. That is, the lower surface of the through-hole portion 233 may be positioned on the same plane as the lower surface of the first pad 231. In addition, the lower surface of the through-hole portion 233 may be positioned on the same plane as the lower surface of the insulating layer 210. In addition, the lower surface of the through-hole portion 233 constituting the through-hole portion 230 may be positioned lower than the upper surface of the first pad W1. Therefore, the through-hole portion 233 in the embodiment may be provided to cover the side surface and the upper surface of the first pad 231.

[0155] Therefore, with Figure 1 Compared to the comparative example shown in FIG, the spacing distance W5 between the plurality of through-hole portions in the embodiment can be increased. That is, the spacing distance between the lower surfaces of the plurality of through-hole portions in the embodiment can be the same as the spacing distance between the plurality of first pads. Therefore, the spacing distance between the plurality of through-hole portions in the embodiment can be increased, thereby improving circuit density and design freedom.

[0156] The through-hole portion of the embodiment includes a through-hole portion passing through the insulating layer, a first pad disposed below the through-hole portion, and a second pad disposed on the through-hole portion. In this case, the width of the first pad in the printed circuit board of the embodiment is not greater than the width of the through-hole portion. In other words, the width of the first pad in the printed circuit board of the embodiment can be smaller than the width of the through-hole portion.

[0157] According to this, the printed circuit board of the embodiment can increase the spacing distance between a plurality of through-hole portions adjacent to each other, and thus, easily realize a fine pattern of a circuit pattern, making it possible to increase circuit density.

[0158] Furthermore, the embodiment can improve the degree of freedom in design of the entire printed circuit board according to the design variation of the through-hole portion, and therefore, can ensure fine pattern realization and substrate reliability.

[0159] Figures 11 to 13 The order of the process is shown Figure 10 FIG. 2 is a diagram of a method for manufacturing a printed circuit board according to a second embodiment shown in FIG.

[0160] Hereinafter, a detailed description of components substantially the same as those in the manufacturing process of the printed circuit board according to the first embodiment will be omitted.

[0161] refer to Figure 11 , an insulating layer 210 covering the circuit pattern 220 is formed on the copper foil layers 203 and 204 of the carrier 201 .

[0162] The insulating layer 210 may include a photocurable resin or a photosensitive resin. To this end, the insulating layer 210 may include an epoxy resin, a photoinitiator, a silicon-based filler (Si filler), a curing agent, and the like. For example, the insulating layer 210 may be formed by laminating a photocurable resin film or applying a photocurable resin paste or liquid. In this case, the photocurable resin material in one example may include one or more selected from photocurable polyhydroxystyrene (PHS), photocurable polybenzoxazole (PBO), photocurable polyimide (PI), photocurable benzocyclobutene (BCB), photocurable polysiloxane, photocurable epoxy resin, and phenolic varnish resin.

[0163] Next, the via hole 240 is formed in the insulating layer 210. In this case, the via hole 240 may be formed by performing exposure and development processes.

[0164] At this time, by forming the insulating layer 210 using the photocurable resin as described above and thereby forming the via hole 240 through exposure and development processes, the depth of the via hole 240 in the embodiment can be easily adjusted without a barrier layer such as the first pad 231 .

[0165] Therefore, the width of the lower portion of the through hole 240 is greater than the width of the upper surface of the first pad 231 .

[0166] That is, by exposing the upper surface and the side surface of the first pad 231, the through hole 240 may be formed to surround the periphery of the first pad 231. Therefore, a portion of the copper foil layers 203 and 204 may be exposed through the through hole 240.

[0167] Next, refer to Figure 12 , the through-hole portion 233 may be formed by filling the inside of the through-hole 240 formed in the insulating layer 210 with a metal material.

[0168] Preferably, the through-hole portion 233 may be formed by filling the through-hole 240 with a metal material or plating the through-hole 240 with a metal material.

[0169] The metal material used to form the through hole portion 233 can be any one material selected from Cu, Ag, Sn, Au, Ni and Pd, and the metal material can be filled by any one or a combination of chemical plating, electrolytic plating, screen printing, sputtering, evaporation, inkjet and dispensing.

[0170] In this case, the through hole portion 233 may be formed to surround the side surface of the first pad 231. That is, the width of the lower surface of the through hole portion 233 is greater than the width of the first pad 231, and thus may be formed in the insulating layer 210 while covering the side surface and upper surface of the first pad 231.

[0171] In addition, a second pad 232 in contact with the upper surface of the through-hole portion 233 is formed on the insulating layer 210 .

[0172] Next, refer to Figure 13 , by removing the carrier 201 , the plurality of printed circuit boards 200 manufactured on both sides of the carrier 201 are separated from each other.

[0173] As described above, the first pad 1231 may be disposed on the lower surface of the insulating layer 210 to have the first width W1.

[0174] Furthermore, a through hole portion 233 of the through hole part 230 may be provided in the insulating layer 210. A lower surface of the through hole portion 233 may directly contact an upper surface and a side surface of the first pad 231. In addition, an upper surface of the through hole portion 233 may directly contact a lower surface of the second pad 232.

[0175] The width of the lower surface of the through-hole portion 233 may have a third width W3 greater than the first width W1 of the first pad 231. Therefore, the through-hole portion 233 may be provided to surround the periphery of the first pad 231. As described above, the width of the first pad 231 in the second embodiment may be formed to be smaller than the width of the through-hole portion 233, and thus the degree of freedom in design may be further improved.

[0176] Figure 14 is a view showing a printed circuit board according to a third embodiment.

[0177] Figure 2 and Figure 10 , the circuit pattern has an ETS structure embedded in an insulating layer. On the other hand, Figure 4 The circuit pattern in the embodiment may have a structure protruding from the surface of the insulating layer.

[0178] refer to Figure 14 , the printed circuit board 300 includes an insulating layer 310 , a circuit pattern 320 and a through-hole portion 330 .

[0179] The insulating layer 310 may include a photocurable resin or a photosensitive resin. To this end, the insulating layer 310 may include an epoxy resin, a photoinitiator, a silicon-based filler (Si filler), a curing agent, and the like. For example, the insulating layer 310 may be formed by laminating a photocurable resin film or applying a photocurable resin paste or liquid. In this case, the photocurable resin material in one example may include any one or more selected from photocurable polyhydroxystyrene (PHS), photocurable polybenzoxazole (PBO), photocurable polyimide (PI), photocurable benzocyclobutene (BCB), photocurable polysiloxane, photocurable epoxy resin, and novolac resin.

[0180] In the embodiment, by forming the insulating layer 310 with a photocurable resin, a fine circuit pattern and a fine via portion of a small size can be formed through exposure and development, etc.

[0181] The circuit pattern 320 may be disposed below the lower surface of the insulating layer 310. That is, the circuit pattern 320 may have a structure protruding below the lower surface of the insulating layer 310.

[0182] In addition, the printed circuit board 300 may include a through hole portion 330 .

[0183] The through hole portion 330 includes a first pad 331 disposed below the lower surface of the insulating layer 310 , a second pad 332 disposed on the insulating layer 310 , and a through hole portion passing through the insulating layer 310 .

[0184] The first pad 331 may have a structure protruding below the lower surface of the insulating layer 310 . The first pad 331 may be formed together with the circuit pattern 320 , and thus, a portion of the circuit pattern 320 may be the first pad 331 .

[0185] The second pad 332 may be provided on the upper surface of the insulating layer 310. The second pad 332 may have a structure protruding on the upper surface of the insulating layer 310.

[0186] The first pad 331 may be disposed on the lower surface of the insulating layer 310 to have a first width W1. The first pad 331 may also be referred to as a ground pad. The width of the lower surface of the first pad 331 may be the same as the width of the upper surface of the first pad 331.

[0187] In addition, the second pad 332 may be provided on the upper surface of the insulating layer 310 to have a second width W2. The second pad 332 may also be referred to as a capture pad. The width of the lower surface and the width of the upper surface of the second pad 332 may be the same as each other.

[0188] Furthermore, the through hole portion 333 of the through hole part 330 may be provided in the insulating layer 310. The lower surface of the through hole portion 333 may directly contact the upper surface of the first pad 331. Furthermore, the upper surface of the through hole portion 333 may directly contact the lower surface of the second pad 332.

[0189] The width of the lower surface of the via portion 333 may be the same as the first width W1 of the first pad 331. That is, the lower surface of the via portion 333 may have the first width W1.

[0190] In addition, the width of the upper surface of the via portion 333 may be smaller than the second width W2 of the second pad 332 . That is, the upper surface of the via portion 333 may have a fourth width W4 smaller than the second width W2 of the second pad 332 .

[0191] In addition, a first width W1 of the lower surface of the through hole portion 333 is smaller than a fourth width W4 of the upper surface of the through hole portion 333. That is, the through hole portion 333 may have a shape in which the width gradually decreases from the upper surface to the lower surface.

[0192] As described above, the width of the lower surface of the through hole portion 333 in the embodiment is the same as the width of the first pad 331 provided below the through hole portion 333. Figure 1 Compared to the comparative example shown in FIG, the spacing distance W5 between the plurality of through-hole portions in the embodiment can be increased. That is, the spacing distance between the lower surfaces of the plurality of through-hole portions in the embodiment can be the same as the spacing distance between the plurality of first pads. Therefore, the spacing distance between the plurality of through-hole portions in the embodiment can be increased, thereby improving circuit density and design freedom.

[0193] Figure 15 is a view showing a printed circuit board according to a fourth embodiment.

[0194] Figure 2 and Figure 10 , the circuit pattern has an ETS structure embedded in an insulating layer. In contrast, Figure 15 The circuit pattern in the embodiment may have a structure protruding from the surface of the insulating layer.

[0195] refer to Figure 15 , the printed circuit board 400 includes an insulating layer 410 , a circuit pattern 420 and a through-hole portion 430 .

[0196] The insulating layer 410 may include a photocurable resin or a photosensitive resin. To this end, the insulating layer 410 may include an epoxy resin, a photoinitiator, a silicon-based filler (Si filler), a curing agent, and the like. For example, the insulating layer 410 may be formed by laminating a photocurable resin film or applying a photocurable resin paste or liquid. In this case, the photocurable resin material in one example may include any one or more selected from photocurable polyhydroxystyrene (PHS), photocurable polybenzoxazole (PBO), photocurable polyimide (PI), photocurable benzocyclobutene (BCB), photocurable polysiloxane, photocurable epoxy resin, and phenolic varnish resin.

[0197] The circuit pattern 420 may be disposed below the lower surface of the insulating layer 410. That is, the circuit pattern 420 may have a structure protruding below the lower surface of the insulating layer 410.

[0198] In addition, the printed circuit board 400 may include a through hole portion 430 .

[0199] The through hole portion 430 may include a first pad 431 disposed below the lower surface of the insulating layer 410 , a second pad 432 disposed on the insulating layer 410 , and a through hole part 433 passing through the insulating layer 410 .

[0200] The first pad 431 may have a structure protruding below the lower surface of the insulating layer 410 . The first pad 431 may be formed together with the circuit pattern 420 , and thus, a portion of the circuit pattern 420 may be the first pad 431 .

[0201] The second pad 432 may be provided on the upper surface of the insulating layer 410. The second pad 432 may have a structure protruding on the upper surface of the insulating layer 410.

[0202] The first pad 431 may be disposed on the lower surface of the insulating layer 410 to have a first width W1. The first pad 431 may also be referred to as a ground pad. The width of the lower surface of the first pad 431 may be the same as the width of the upper surface of the first pad 431.

[0203] In addition, the second pad 432 may be provided on the upper surface of the insulating layer 410 to have a second width W2. The second pad 432 may also be referred to as a capture pad. The width of the lower surface of the second pad 432 may be the same as the width of the upper surface thereof.

[0204] Furthermore, the through hole portion 433 of the through hole part 430 may be provided in the insulating layer 410. The lower surface of the through hole portion 433 may directly contact the upper surface of the first pad 431. Furthermore, the upper surface of the through hole portion 433 may directly contact the lower surface of the second pad 432.

[0205] The width of the lower surface of the via portion 433 may be greater than the first width W1 of the first pad 431. That is, the lower surface of the via portion 433 may have a third width W3 greater than the first width W1.

[0206] Therefore, the lower surface of the through-hole portion 433 may include a first region in contact with the upper surface of the first pad 431 and a second region in contact with the first pad 431. In this case, the second region may be covered by an additional insulating layer provided under the insulating layer 410, or alternatively, it may be covered by a solder resist (SR).

[0207] In addition, the width of the upper surface of the via portion 433 may be smaller than the second width W2 of the second pad 432. That is, the upper surface of the via portion 433 may have a fourth width W4 of the second width W2 of the second pad 432.

[0208] In addition, the third width W3 of the lower surface of the through hole portion 433 is smaller than the fourth width W4 of the upper surface of the through hole portion 433. That is, the through hole portion 433 may have a shape in which the width gradually decreases from the upper surface to the lower surface.

[0209] As described above, the width of the lower surface of the through hole portion 433 in the embodiment is greater than the width of the first pad 431 provided below the through hole portion 433. Therefore, in contrast to the first to third embodiments and Figure 1 Compared to the comparative example illustrated in , the spacing distance W5 ′ between the plurality of through holes in the embodiment may be increased.

[0210] Figure 16 is a view showing a printed circuit board according to a fifth embodiment.

[0211] refer to Figure 16 , the printed circuit board 500 includes an insulating layer 510 , a circuit pattern 520 and a through-hole portion 530 .

[0212] In this case, the center of the through hole portion and the center of the first pad in the through hole portion of the first to fourth embodiments are aligned on the same vertical line. In other words, the through hole portion is aligned with the first pad and is arranged on a vertical line.

[0213] Alternatively, the through hole portion and the first pad of the through hole part 530 according to the fifth embodiment may be displaced from each other and not aligned on the same vertical line.

[0214] The insulating layer 510 may include a photocurable resin or a photosensitive resin. To this end, the insulating layer 510 may include an epoxy resin, a photoinitiator, a silicon-based filler (Si filler), a curing agent, and the like. For example, the insulating layer 510 may be formed by laminating a photocurable resin film or applying a photocurable resin paste or liquid. In this case, the photocurable resin material in one example may include any one or more selected from photocurable polyhydroxystyrene (PHS), photocurable polybenzoxazole (PBO), photocurable polyimide (PI), photocurable benzocyclobutene (BCB), photocurable polysiloxane, photocurable epoxy resin, and phenolic varnish resin.

[0215] The circuit pattern 520 may be disposed under the insulating layer 510. That is, the circuit pattern 520 may have a structure buried in a lower region of the insulating layer 510.

[0216] In addition, the printed circuit board 500 may include a through hole portion 530 .

[0217] The through hole portion 530 may include a first pad 531 disposed below the lower surface of the insulating layer 510 , a second pad 532 disposed on the insulating layer 510 , and a through hole portion 533 passing through the insulating layer 510 .

[0218] The first pad 531 may be provided in a lower region of the insulating layer 410 to have a first width W1. The first pad 531 may also be referred to as a ground pad. The width of the lower surface of the first pad 531 may be the same as the width of the upper surface of the first pad 531.

[0219] In addition, the second pad 532 may be provided on the upper surface of the insulating layer 510 to have a second width W2. The second pad 532 may also be referred to as a capture pad. The width of the lower surface and the width of the upper surface of the second pad 532 may be the same as each other.

[0220] Furthermore, a through hole portion 533 of the through hole part 530 may be provided in the insulating layer 510. A lower surface of the through hole portion 533 may directly contact an upper surface of the first pad 531. Furthermore, an upper surface of the through hole portion 533 may directly contact a lower surface of the second pad 532.

[0221] The width of the lower surface of the through-hole portion 533 may be the same as the first width W1 of the first pad 531 , and alternatively, may have a third width W3 greater than the first width W1 .

[0222] However, the vertical center of the through-hole portion 533 in the fifth exemplary embodiment may not be aligned with the vertical center of the first pad 531 on the same vertical line and may be shifted.

[0223] Therefore, the lower surface of the through-hole portion 533 may include a first region in contact with the upper surface of the first pad 531 and a second region in contact with the first pad 531. In this case, the second region may be covered by an additional insulating layer provided under the insulating layer 510, or alternatively, it may be covered by a solder resist (SR).

[0224] In addition, the width of the upper surface of the via portion 533 may be smaller than the second width W2 of the second pad 532. That is, the upper surface of the via portion 533 may have a fourth width W4 smaller than the second width W2 of the second pad 532.

[0225] As described above, the width of the lower surface of the through-hole portion 533 in the embodiment may be equal to or greater than the width of the first pad 531 provided below the through-hole portion 533. However, the center of the through-hole portion 533 may not be aligned with the center of the first pad 531 on a vertical line and may be shifted. In this case, the reliability of the through-hole portion in the comparative example is determined by the alignment between the through-hole portion and the first pad. This is because the through-hole portion in the comparative example is formed in a through-hole hole formed by a laser. In contrast, the through-hole hole of the embodiment is formed in a photocurable resin through processes such as exposure and development, and a metal material is filled in the formed through-hole hole to form a through-hole portion. Therefore, even if the center of the through-hole hole and the center of the first pad are not aligned on the same vertical line and deviate from each other, the reliability of the through-hole portion in the embodiment is not affected. That is, the insulating layer is formed of a photocurable resin, and therefore, it is easy to control the formation of through-hole holes only in the desired area of ​​the insulating layer through the exposure and development processes.

Claims

1. A circuit board, comprising: an insulating layer, the insulating layer comprising an upper surface and a lower surface opposite to the upper surface; a through electrode passing through the upper and lower surfaces of the insulating layer and having a slope whose width varies in a vertical direction from the upper surface to the lower surface of the insulating layer; as well as a first pad disposed on a lower surface of the insulating layer; The slope is a slope in which the width of the through electrode decreases toward the lower surface of the insulating layer. wherein a width of the first pad in a first horizontal direction perpendicular to the vertical direction is smaller than a width of a lower surface of the through electrode in the first horizontal direction, wherein the first pad includes a first side surface and a second side surface facing each other in the first horizontal direction, The first side surface of the first pad is covered with the through electrode, and The second side surface of the first pad is covered with the insulating layer and overlaps with the slope of the through electrode and the upper surface of the through electrode along the vertical direction.

2. The circuit board according to claim 1, further comprising: A circuit pattern is provided on a lower surface of the insulating layer so as to be spaced apart from the first pad in the first horizontal direction and not overlap with the through electrode in the vertical direction.

3. The circuit board according to claim 2, wherein: A width of the circuit pattern in the first horizontal direction is the same as a width of the first pad.

4. The circuit board according to claim 1, further comprising: A second pad is provided on upper surfaces of the through electrode and the insulating layer.

5. The circuit board according to claim 3, wherein A lower surface of the through electrode, a lower surface of the first pad, and a lower surface of the circuit pattern are positioned on the same plane.

6. The circuit board according to claim 4, wherein A width of the second pad in the first horizontal direction is greater than a width of an upper surface of the through electrode in the first horizontal direction.

7. The circuit board according to claim 2, wherein: The through-electrode includes a plurality of through-electrodes spaced apart from each other in the insulating layer in the first horizontal direction, and The plurality of circuit patterns are provided between two through-electrodes that are adjacent to each other.

8. The circuit board according to claim 1, wherein The insulating layer is formed of a photocurable resin.

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