Method for manufacturing wiring board, wiring board, method for manufacturing molded product, and molded product

Abstract

The method for manufacturing a wiring board comprises: a first configuration step of configuring a first resist material (200) on a substrate (10); a first curing step of curing the first resist material (200) to form a first resist layer (20); a first forming step of forming an outer coating layer (70) on a release film (80); a second forming step of forming first and second conductor portions (41, 61) on the outer coating layer (70); and a second configuration step of covering the first and second conductor portions. (41, 61) method is used to configure a second anti-etching material (300) on the outer coating layer (70); a second curing step is used to cure the second anti-etching material (300) to form a second anti-etching layer (30); a bonding step is used to bond the first anti-etching layer (20) and the second anti-etching layer (30); a hot pressing step is used to hot press the first anti-etching layer (20) and the second anti-etching layer (30) after the bonding step; and a stripping step is used to strip the release film (80).

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a wiring board for a molded product, a wiring board for a molded product, a method for manufacturing a molded product, and a molded product.

[0002] For designated countries recognized by reference document description, the contents described in Japanese Patent Application No. 2019-212302 filed in Japan on November 25, 2019 are incorporated into this specification by reference as a part of the description of this specification. Background Art

[0003] The molded body is produced by molding a conductive laminate, wherein the conductive laminate comprises a substrate, an inner coating layer laminated on the substrate, a nanocarbon layer laminated on the inner coating layer, and an outer coating layer laminated on the nanocarbon layer (for example, see Patent Document 1). The inner coating layer, the nanocarbon layer, and the outer coating layer are formed by repeatedly heating the coating liquid after applying the coating liquid and drying it.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: International Publication No. 2016 / 208371 Summary of the invention

[0007] 1. Technical issues to be resolved

[0008] In the conductive laminate for molding as described above, a resin with low heat resistance and large linear expansion coefficient, such as polycarbonate resin and ABS resin (acrylonitrile-butadiene-styrene copolymer resin), is used as a substrate. Therefore, there is a problem that when the drying process of the coating liquid is repeated to produce the conductive laminate as described above, the substrate composed of the above resin is repeatedly heated, resulting in shrinkage and deformation of the substrate, so that there is a possibility of fracture in the nanocarbon layer.

[0009] An object of the present invention is to provide a method for manufacturing a wiring board and a wiring board capable of suppressing the occurrence of breakage in a conductor portion.

[0010] (II) Technical solution

[0011] [1] The manufacturing method of the wiring board of the present invention comprises: a first configuration step of configuring a first anti-etching material on a substrate; a first curing step of curing the first anti-etching material to form a first anti-etching layer; a first forming step of forming a resin layer on a release film; a second forming step of forming a conductor portion on the resin layer; a second configuration step of configuring a second anti-etching material on the resin layer in a manner covering the conductor portion; a second curing step of curing the second anti-etching material to form a second anti-etching layer; a bonding step of bonding the first anti-etching layer and the second anti-etching layer; a thermocompression bonding step of thermocompressing the first anti-etching layer and the second anti-etching layer after the bonding step; and a peeling step of peeling the release film from the resin layer.

[0012] [2] The manufacturing method of the wiring board of the present invention comprises: a first configuration step of configuring a first anti-etching material on a substrate; a first forming step of forming a resin layer on a release film; a second forming step of forming a conductor portion on the resin layer; a second configuration step of configuring a second anti-etching material on the resin layer in a manner covering the conductor portion; a bonding step of bonding the first anti-etching material and the second anti-etching material; a curing step of curing the first anti-etching material and the second anti-etching material after the bonding step to form a first anti-etching layer and a second anti-etching layer; and a stripping step of stripping the release film from the resin layer.

[0013] [3] In the above invention, the first resist layer may have a breaking elongation of 50% or more at 100°C, and the second resist layer may have a breaking elongation of 50% or more at 100°C.

[0014] [4] In the above invention, the first resist material and the second resist material may have the same composition.

[0015] [5] In the above invention, it may be that the conductor part includes a first conductor part and a second conductor part, the wiring board has an insulating layer between the first conductor part and the second conductor part, and the second forming process includes the following steps: forming the second conductor part on the resin layer; forming the insulating layer on at least a portion of the second conductor part; and forming the first conductor part on the resin layer and the insulating layer.

[0016] [6] In the above invention, the material constituting the substrate may be ABS resin or polycarbonate resin.

[0017] [7] The method for manufacturing a molded product of the present invention comprises: the above-mentioned method for manufacturing a wiring board; and a molding step of three-dimensionally molding at least a portion of the wiring board manufactured by the wiring board manufacturing method to form a molded portion, and at least a portion of the conductor portion is arranged in the molded portion.

[0018] [8] The manufacturing method of the molded product of the present invention comprises the above-mentioned manufacturing method of the wiring board, and the manufacturing method of the molded product comprises: a molding process, before the first configuration process, three-dimensionally molding at least a portion of the substrate to form a molded portion, and at least a portion of the conductor portion is configured in the molded portion via the first anti-etching layer and the second anti-etching layer.

[0019] [9] The wiring board of the present invention comprises: a substrate; a first anti-etching layer, which is arranged on the substrate; a second anti-etching layer, which is arranged on the first anti-etching layer; a conductor part, which is arranged on the second anti-etching layer; and an outer coating, which is arranged on the second anti-etching layer in a manner covering at least a portion of the conductor part.

[0020]

[10] In the above invention, the first resist layer may have a breaking elongation of 50% or more at 100°C, and the second resist layer may have a breaking elongation of 50% or more at 100°C.

[0021]

[11] In the above invention, the first resist layer and the second resist layer may be made of a material having the same composition.

[0022]

[12] In the above invention, the conductor part may include a first conductor part and a second conductor part, the wiring board may include an insulating layer between the first conductor part and the second conductor part, the first conductor part is formed on the second anti-etching layer, and the second conductor part is formed on the second anti-etching layer and the insulating layer.

[0023]

[13] In the above invention, the material constituting the substrate may be ABS resin or polycarbonate resin.

[0024]

[14] The molded product of the present invention includes the above-mentioned wiring board, wherein the wiring board includes a molded portion formed by three-dimensionally molding at least a portion of the wiring board, and at least a portion of the conductor portion is arranged in the molded portion.

[0025] (III) Beneficial effects

[0026] In the present invention, the resin layer, the conductor part, and the second resist layer are not formed on the substrate, but these layers are formed on the release film and then transferred to the substrate, so the substrate is not repeatedly heated. Therefore, according to the present invention, by suppressing the shrinkage and deformation of the substrate, the conductor part can be suppressed from breaking. In addition, if the second resist layer is directly attached to the substrate, sufficient peeling strength cannot be obtained, which will cause the second resist layer to be peeled off from the substrate. In the present invention, since the second resist layer is transferred to the substrate via the first resist layer, sufficient peeling strength can be obtained, and the peeling as described above can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a top view showing a wiring board according to an embodiment of the present invention.

[0028] Figure 2 It means along Figure 1 A cross-sectional view of the cross section taken along line II-II.

[0029] Figure 3 It is a top view showing a molded product according to an embodiment of the present invention.

[0030] Figure 4 It means along Figure 3 A cross-sectional view of the cross section taken along line IV-IV.

[0031] Figure 5 (a) to (j) are cross-sectional views showing a first method for manufacturing a wiring board according to an embodiment of the present invention.

[0032] Figure 6 (a) and (b) are detailed descriptions of Figure 5 A cross-sectional view of the thermocompression bonding step shown in (i).

[0033] Figure 7 (a) to (c) are cross-sectional views showing molding steps of a method for producing a molded article according to an embodiment of the present invention.

[0034] Figure 8 (a) to (i) are cross-sectional views showing a second method for manufacturing a wiring board according to an embodiment of the present invention.

[0035] Fig. 9 (a) to (l) are cross-sectional views showing another example of the method for producing a molded article according to an embodiment of the present invention. DETAILED DESCRIPTION

[0036] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0037] Figure 1 1 is a plan view showing a wiring board 1 in this embodiment. Figure 2 It is along Figure 1 The wiring board 1 in this embodiment corresponds to an example of the "wiring board" in the present invention.

[0038] The wiring board 1 in this embodiment is a wiring board for molding that is molded into a predetermined three-dimensional shape by thermoforming or vacuum molding. The wiring board 1 is assembled to an electronic device or the like after molding. The wiring board 1 in this embodiment can be used for a capacitive touch sensor or the like. In addition, as the use of the wiring board 1 and its molded product, a capacitive touch sensor is exemplified in the above embodiment, but it is not limited thereto.

[0039] like Figure 2 As shown, the wiring board 1 includes: a substrate 10, a first resist layer 20, a second resist layer 30, a first conductor portion 41, an insulating layer 50, a second conductor portion 61, and an outer coating layer 70. The substrate 10 in this embodiment is equivalent to an example of the "substrate" in the present invention, the first resist layer 20 in this embodiment is equivalent to an example of the "first resist layer" in the present invention, and the second resist layer 30 in this embodiment is equivalent to an example of the "second resist layer" in the present invention. In addition, the first conductor portion 41 in this embodiment is equivalent to an example of the "first conductor portion" in the present invention, the second conductor portion 61 in this embodiment is equivalent to an example of the "second conductor portion" in the present invention, the insulating layer 50 in this embodiment is equivalent to an example of the "insulating layer" in the present invention, and the outer coating layer 70 in the present invention is equivalent to an example of the "outer coating layer" in the present invention.

[0040] The substrate 10 is a film for forming that has a thin plate shape and can be used for forming processes such as vacuum forming and thermoforming. The substrate 10 of the present embodiment is composed of a thermoplastic resin that softens at about 100° C. to 200° C. Specifically, polycarbonate resin, ABS resin, acrylic resin, cyclic olefin resin, polyester resin, or polyarylate resin can be cited as the thermoplastic resin constituting the substrate 10. After the substrate 10 is heated to the above-mentioned softening temperature, it is formed into a predetermined three-dimensional shape by a mold, etc., and then cooled and cured while maintaining the three-dimensional shape.

[0041] The first resist layer 20 is formed on the substrate 10 and is solid at room temperature (e.g., 27° C.). As a material constituting the first resist layer 20, for example, resins such as polyester resin, polyurethane resin, acrylic resin, and silicone resin can be cited. In addition, if heated to 80° C. or above during molding, the hot melt and the adhesive tape will melt and peel off or break from the substrate 10. Therefore, as a material constituting the first resist layer 20, hot melt and adhesive tape cannot be used. In this way, if the hot melt and the adhesive tape peel off or break, there is a possibility that the first and second conductor parts 41, 61 and the outer coating layer 70 will break. In addition, if the hot melt and the adhesive tape peel off or break, the first and second conductor parts 41, 61 and the outer coating layer 70 may also peel off from the substrate 10.

[0042] In addition, it is preferred that the elongation at break E1 of the first resist layer 20 at 100° C. is 50% or more (E1≧50%). Since the first resist layer 20 has an elongation at break of 50% or more at 100° C., the first resist layer 20 can more reliably follow the deformation of the substrate 10 during molding, and thus it is less likely for the first resist layer 20 to peel off from the substrate 10, and for the first and second conductor portions 41, 61 and the outer coating layer 70 to break.

[0043] In addition, the elongation at break of the first resist layer 20 can be measured using a measurement method based on JIS K 7161-1 and JIS K 7161-2. There is no particular limitation, and for example, a thermostatic chamber tensile tester produced by Shimadzu Corporation can be used to measure the elongation at break of a test piece made of the same material as the first resist layer 20 in a thermostatic chamber with an atmosphere temperature set to 100°C.

[0044] In addition, the glass transition temperature Tg1 of the first resist layer 20 is preferably below 100° C. (Tg1≦100° C.). Since the first resist layer 20 softens below 100° C., the first resist layer 20 can more reliably follow the deformation of the substrate 10 during molding, and thus the first resist layer 20 is less likely to be peeled off from the substrate 10 and the first and second conductor portions 41 and 61 are less likely to break.

[0045] The second resist layer 30 is formed on the first resist layer 20 and is solid at room temperature. As a material constituting the second resist layer 30, the same material as that constituting the first resist layer 20 can be used.

[0046] In this embodiment, the material constituting the first resist layer 20 has the same composition as the material constituting the second resist layer 30. Thus, by making the materials constituting the first and second resist layers 20, 30 have the same composition, the bonding strength between the first and second resist layers 20, 30 can be further improved.

[0047] In addition, it is preferred that the second resist layer 30 has an elongation at break E2 of 50% or more (E2≧50%) at 100°C, similarly to the first resist layer 20. Since the second resist layer 30 has an elongation at break of 50% or more at 100°C, the second resist layer 30 can more reliably follow the deformation of the substrate 10 during molding, and thus it is less likely for the second resist layer 30 to peel off from the substrate 10 and for the first and second conductor portions 41, 61 to break.

[0048] In addition, it is preferred that the glass transition temperature Tg2 of the second resist layer 30 is 100°C or less (Tg2≦100°C) similarly to the first resist layer 20. Since the second resist layer 30 also softens below 100°C, the second resist layer 30 can more reliably follow the deformation of the substrate 10 during molding, and thus it is less likely for the second resist layer 30 to be peeled off from the substrate 10 and the first and second conductor portions 41, 61 to be broken.

[0049] Furthermore, the material constituting the first resist layer 20 and the material constituting the second resist layer 30 may have different compositions. In this case, as the material constituting the first resist layer 20 and the material constituting the second resist layer 30, resist materials compatible with each other can be used.

[0050] like Figure 1 As shown in FIG. 1 , each first conductor portion 41 is a linear wiring extending along the X direction in the figure. The plurality of first conductor portions 41 are arranged along the Y direction. Figure 2 As shown, a plurality of first conductor portions 41 are buried in the second resist layer 30 .

[0051] In addition, if Figure 1 and Figure 2 As shown, in a plan view from the Z direction, the portion of the first conductor portion 41 that intersects with the second conductor portion 61 is covered by the insulating layer 50 and is electrically insulated from the second conductor portion 61. On the other hand, the portion of the first conductor portion 41 that does not intersect with the second conductor portion 61 is covered by the outer coating 70.

[0052] The first connection portion 42 is disposed at both ends of the first conductor portion 41 and is formed integrally with the first conductor portion 41. The first connection portion 42 has a convex shape protruding in a direction away from the second resist layer 30 and is exposed from the outer coating layer 70. The first connection portion 42 is not particularly limited and can be used as a connection terminal with an electronic device.

[0053] The first conductor part 41 is formed by dispersing conductive particles in a binder, and has a high expansion and contraction rate. Here, the binder contained in the first conductor part 41 is formed of a material having a high expansion and contraction rate, so that the first conductor part 41 also has a high expansion and contraction rate. As such a binder, an elastomer is preferably used, for example, polyester resin, polyurethane resin, acrylic resin, silicone resin, a composite of two or more of these, etc. can be used. As conductive particles, metals such as gold, silver, platinum, ruthenium, lead, tin, zinc, bismuth, etc. or metal materials composed of their alloys, or non-metallic materials such as carbon can be used. As the shape of the conductive particles, a scaly or amorphous shape is preferably used.

[0054] The first connection portion 42 is made of the same material as the first conductor portion 41. In addition, the conductive particles included in the first connection portion 42 may be different from the conductive particles included in the first conductor portion 41 in type according to the application of the wiring board 1. For example, without particular limitation, carbon may be used as the conductive particles included in the first connection portion 42, and silver may be used as the conductive particles included in the first conductor portion 41.

[0055] The insulating layer 50 is disposed between the first conductor portion 41 and the second conductor portion 61 to electrically insulate the two. Examples of the material constituting the insulating layer 50 include polyester resin, polyurethane resin, acrylic resin, and silicone resin. In addition, it is preferred that the elongation at break E3 of the insulating layer 50 at 100° C. is 50% or more (E3≧50%). As described above, this is to enable the insulating layer 50 to more reliably follow the deformation of the substrate 10 during molding. In addition, the glass transition temperature Tg3 of the insulating layer 50 is, for example, below 100° C.

[0056] like Figure 1 As shown in FIG. 1 , each second conductor portion 61 is a linear wiring extending along the Y direction in the figure. The plurality of second conductor portions 61 are arranged along the X direction. Each second conductor portion 61 is orthogonal to the first conductor portion 41 in a plan view. Figure 2 As shown, the second conductor portion 61 is provided on the second resist layer 30 and the insulating layer 50 , and is covered by the overcoat layer 70 .

[0057] Second connection parts 62 are arranged at both ends of the second conductor part 61, and the second connection parts 62 are formed integrally with the second conductor part 61. The second connection parts 62 have a convex shape protruding in a direction away from the second resist layer 30, and are exposed from the overcoat layer 70. The second connection parts 62 are not particularly limited, and can be used as connection terminals with electronic devices.

[0058] The material constituting the second conductor portion 61 and the second connection portion 62 is not particularly limited, and a conductive material having the same expansion and contraction coefficient as that of the first conductor portion 41 and the second connection portion 62 can be used.

[0059] The overcoat layer 70 is provided on the second resist layer 30 and covers the first and second conductor portions 41 and 61. The overcoat layer 70 has a plurality of holes 701 penetrating from one main surface to the other main surface, and the first and second connection portions 42 and 62 are formed inside the holes 701.

[0060] The material constituting the outer coating layer 70 is not particularly limited, and examples thereof include the same resin materials as those of the insulating layer 50 described above. In addition, it is preferred that the elongation at break E4 of the outer coating layer 70 at 100° C. is 50% or more (E4≧50%). As described above, this is to allow the outer coating layer 70 to more reliably follow the deformation of the substrate 10 during molding. In addition, the glass transition temperature Tg4 of the outer coating layer 70 is, for example, 100° C. or less.

[0061] Figure 3 is a top view showing a molded product according to an embodiment of the present invention, Figure 4 It means along Figure 3 Only the differences between the molded product 1a and the wiring board 1 will be described below, and the same reference numerals are given to the same parts as those of the wiring board 1 and their description will be omitted.

[0062] like Figure 3 and Figure 4 As shown, the molded product 1a is produced by molding the wiring board 1 having the above-mentioned planar shape into a three-dimensional shape by vacuum molding, thermoforming, or the like.

[0063] like Figure 3 and Figure 4 As shown, the molded product 1a has: a molded portion M, which is molded into a three-dimensional shape; and a non-molded portion N, which is not molded and has a planar shape. The molded product 1a in this embodiment is equivalent to an example of the "molded product" in the present invention, and the molded portion M in this embodiment is equivalent to an example of the "molded portion" in the present invention.

[0064] The molded portion M has a rectangular planar shape and is arranged in the central part of the molded product 1a. The molded portion M is composed of a curved portion M1 curved in the Z direction and a flat portion M2. The curved portion M1 is arranged along the periphery of the flat portion M2 and is connected to the periphery of the flat portion M2. Therefore, the molded portion M has a convex shape protruding in the Z direction.

[0065] The first and second conductor portions 41 and 61 are arranged on the molded portion M. On the molded portion M, the shapes of the first and second conductor portions 41 and 61 correspond to the three-dimensional shape of the molded portion M.

[0066] On the other hand, the non-molded portion N has a frame-like planar shape and is disposed on the outer peripheral portion of the molded product 1a. The non-molded portion N is planar in shape as a whole and has no convex or concave portion.

[0067] The molded article 1 a of the present embodiment is not limited to a three-dimensional shape having a molded portion M protruding in the Z direction, and the shape of the molded article 1 a may be appropriately selected according to the purpose of the molded article 1 a .

[0068] Next, refer to Figures 5 to 9 A method for producing the above-described molded product 1 a will be described.

[0069] <<First Manufacturing Method>>

[0070] Figure 5 (a) to (j) are cross-sectional views showing a first method for manufacturing the wiring board 1 in the present embodiment. Figure 6 (a) and (b) are detailed descriptions of Figure 5 A cross-sectional view of the thermal compression bonding process shown in (i), Figure 7 (a) to (c) are cross-sectional views showing molding steps of the method for producing a molded product in the present embodiment.

[0071] First, if Figure 5 As shown in (a), the first resist material 200 is disposed on the substrate 10. As the substrate 10, the above-mentioned thermoplastic resin can be used, and as the first resist material, the above-mentioned resist material can be used.

[0072] The first resist material 200 is disposed on the substrate 10 by coating, for example. As the coating method, various coating methods such as screen printing, spray coating, bar coating, dip coating, and inkjet coating can be used. Figure 5 The step shown in (a) corresponds to an example of the "first arrangement step" in the present invention.

[0073] Then, if Figure 5 As shown in (b), the first resist material 200 is cured to form the first resist layer 20. As a method for curing the first resist material 200, for example, irradiation with energy rays such as ultraviolet rays and infrared lasers, heating, heating and cooling, drying, etc. can be used. In addition, when heating is used as a curing method, for example, the first resist material 200 is heated to 80°C to 100°C using a far-infrared heating furnace (IR furnace), so that the first resist material 200 can be cured. Figure 5 The step shown in (b) corresponds to an example of the "first curing step" in the present invention.

[0074] Then, if Figure 5As shown in (c), a release film 80 is prepared separately from the substrate 10, and the overcoat layer 70 is formed on the release film 80. At this time, the overcoat layer 70 is not formed on the release film 80 in the portion where the hole 701 is arranged.

[0075] The release film 80 is a resin film subjected to a release treatment, and is not particularly limited. For example, a release-treated PET film can be used as the release film 80. As the release treatment, for example, a method of coating a release agent on a resin film and drying the coated release agent to form a release material layer can be cited. As the release agent, for example, a silicone release agent, a fluorine release agent, etc. can be cited.

[0076] The outer coating layer 70 is formed by coating the material constituting the outer coating layer 70 on the release film 80 and curing it. As a coating method, various coating methods such as screen printing, spray coating, rod coating, dip coating, inkjet coating, etc. can be used. As a curing method, energy ray irradiation such as ultraviolet rays and infrared lasers, heating, heating and cooling, drying, etc. can be used. In addition, when heating is used as a curing method, for example, the material constituting the outer coating layer 70 is heated to 100° C. to 150° C. using an IR furnace, so that the outer coating layer 70 can be formed.

[0077] The release film 80 in this embodiment corresponds to an example of the “release film” in the present invention, and the overcoat layer 70 in this embodiment corresponds to an example of the “resin layer” in the present invention. Figure 5 The step shown in (c) corresponds to an example of the "first forming step" in the present invention.

[0078] Then, if Figure 5 As shown in (d) of FIG. 7 , the second conductor portion 61 is formed on the overcoat layer 70 . At this time, the second connection portion 62 is formed inside the hole 701 .

[0079] The second conductor portion 61 is formed by applying a conductive paste on the outer coating 70 and curing it. At this time, the conductive paste is also filled in the inside of the hole 701 of the outer coating 70 and cured. As a specific example of such a conductive paste, a conductive paste composed of mixed conductive particles, a binder, water or a solvent, and various additives can be illustrated. As a solvent contained in the conductive paste, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, dipropylene glycol monobutyl ether, diethylene glycol monoethyl ether, cyclohexanone, isophorone, and pinene alcohol can be illustrated. The coating method and curing method of the conductive paste can use the same method as when forming the outer coating 70.

[0080] Then, if Figure 5 As shown in (e), the insulating layer 50 is formed on a portion of the second conductor portion 61. Figure 5In step (f), the insulating layer 50 is formed on the portion of the upper surface of the second conductor portion 61 where the first conductor portion 41 is formed. The insulating layer 50 is made of the same material as the outer coating layer 70 and can be formed by the same coating method and curing method as the outer coating layer 70.

[0081] Then, if Figure 5 As shown in (f), the first conductor portion 41 is formed. The first conductor portion 41 is formed on the above-mentioned insulating layer 50 and the outer coating layer 70. Figure 5 In the cross-sectional view shown in (f) of FIG. 1 , the portion formed on the outer coating 70 in the first conductor portion 41 is not shown. Figure 5 Although not shown in the cross section of (f), the first connection portion 42 is formed in the hole 701 of the outer coating layer 70 at this time.

[0082] The first conductor portion 41 and the first connection portion 42 are made of the same material as the second conductor portion 61 and the second connection portion 62, and can be formed by the same method as the second conductor portion 61 and the second connection portion 62 described above. Figure 5 (d)~ Figure 5 The step shown in (f) corresponds to an example of the "second forming step" in the present invention.

[0083] Then, if Figure 5 As shown in (g), the second resist material 300 is arranged on the first and second conductor parts 41, 61, the first and second connecting parts 42, 62 and the outer coating 70. As the second resist material 300, a material having the same composition as the first resist material 200 can be used. In addition, similarly to the first resist material 200, the second resist material 300 can be arranged by coating. Figure 5 The step shown in (g) corresponds to an example of the "second configuration step" in the present invention.

[0084] Then, if Figure 5 As shown in (h), the second resist material 300 is cured to form the second resist layer 30. As a method for curing the second resist material 300, the same method as the curing method of the first resist material 200 described above can be used. Figure 5 The step shown in (h) corresponds to an example of the "second curing step" in the present invention.

[0085] Then, if Figure 5 As shown in (i), the first resist layer 20 and the second resist layer 30 are bonded together and then thermally pressed. Figure 6 (a) and (b) describe the thermocompression bonding method of this embodiment in detail.

[0086] In the thermocompression bonding method of this embodiment, the Figure 6 The heat pressing machine 900 shown in (a) of FIG. The heat pressing machine 900 includes a pressing head 901 and a pressing table 902. The pressing head 901 includes a heater (not shown) which has the function of raising the temperature of the pressing head 901 to a predetermined temperature. In addition, the pressing head 901 can press the object to be pressed placed on the pressing table 902 toward the pressing table 902 by being relatively close to the pressing table 902.

[0087] In the heat compression bonding method using the heat compression bonding machine 900, first, Figure 6 As shown in (a) of the present embodiment, the intermediate body 100 produced by laminating the first resist layer 20 and the second resist layer 30 is placed on a pressure bonding table 902. Figure 6 The step shown in (a) corresponds to an example of the "bonding step" in the present invention.

[0088] Then, if Figure 6 As shown in (b), after the pressure-bonding head 901 is heated to a predetermined temperature, the pressure-bonding head 901 is brought into contact with the intermediate body 100. Thus, the first resist layer 20 and the second resist layer 30 are thermally pressure-bonded.

[0089] In this thermal compression bonding, the temperature of the compression head 901 can be set to, for example, 100°C to 150°C, and the compression bonding time can be set to, for example, 10 seconds to 120 seconds. At this time, the first and second resist layers 20 and 30 of the intermediate 100 can be heated to 80°C to 130°C. Figure 6 The step shown in (b) corresponds to an example of the "thermocompression bonding step" in the present invention.

[0090] Then, if Figure 5 As shown in (j) of FIG. 1 , the release film 80 is peeled off from the outer coating layer 70 to produce the wiring board 1. Figure 5 The step shown in (j) corresponds to an example of the "peeling step" in the present invention.

[0091] Next, by treating the wiring board 1 manufactured as described above Figure 7 (a)~ Figure 7 By performing thermoforming as shown in (c) of FIG. 1 , it is possible to produce the molded product 1 a of the present embodiment.

[0092] like Figure 7 As shown in (a), a mold 950 is used in the thermoforming of this embodiment. The mold 950 has a male mold 951 and a female mold 952 that fit together, and the fitting surfaces 953 and 954 of the male mold 951 and the female mold 952 have shapes corresponding to the three-dimensional shape of the molded product 1a.

[0093] In the thermoforming method using such a mold 950, Figure 7 As shown in (b), after the male mold 951 and the female mold 952 are heated to a predetermined temperature, the wiring board 1 is sandwiched from above and below by the fitting surfaces 953 and 954 of the male mold 951 and the female mold 952.

[0094] At this time, the temperature of the mold 950 may be set to a temperature at which the substrate 10 can be deformed. At this time, the first and second resist layers 20 and 30 of the intermediate body 100 may be heated to 100°C to 200°C.

[0095] Then, if Figure 7 As shown in (c) of the embodiment, the molded product 1a is manufactured by separating the male mold 951 and the female mold 952 from each other. Figure 7 The steps (a) to (c) correspond to an example of the "molding step" in the present invention.

[0096] In addition, in this embodiment, thermoforming is exemplified as a molding method, but it is not limited thereto, and the molding method may also be vacuum molding. In the case of vacuum molding, after heating the wiring board 1 to soften it, the wiring board 1 is vacuum-adsorbed on a mold having the same shape as the above-mentioned convex mold 951. Thereafter, the wiring board 1 is cooled while being maintained along the shape of the mold. In this way, the above-mentioned molded product 1a can be manufactured.

[0097] As described above, in this embodiment, the substrate 10 is not repeatedly heated, and a plurality of layers (the first and second conductor portions 41, 61, the insulating layer 50, and the outer coating layer 70) are formed on the release film 80 and then transferred to the substrate 10. Therefore, before the lamination process, the plurality of layers are separated from the substrate 10 and formed, and since heat is not repeatedly applied to the substrate 10, shrinkage and deformation of the substrate 10 can be suppressed, and the first and second conductor portions 41, 61 can be suppressed from being broken.

[0098] In addition, in this embodiment, since the first anti-etching layer 20 is formed on the substrate 10 side, the close adhesion between the second anti-etching layer 30 and the first anti-etching layer 20 can be improved, and during molding, the first and second conductor parts 41, 61, the insulating layer 50 and the outer coating 70 can reliably follow the deformation of the substrate 10.

[0099] In addition, in the present embodiment, even if a material having low heat resistance and large linear expansion coefficient such as polycarbonate resin or ABS resin is used as the substrate 10 , the occurrence of shrinkage and deformation of the substrate 10 can be suppressed.

[0100] In addition, in this embodiment, a plurality of conductor parts (first and second conductor parts 41, 61) are formed. In the past, when a plurality of conductor parts are formed, the number of heating times of the substrate may increase, which may increase the shrinkage and deformation of the substrate. In contrast, in this embodiment, even if the total number of conductor parts increases, only the number of heating times of the release film 80 is increased, and the number of heating times of the substrate 10 is not increased, so the shrinkage and deformation of the substrate 10 can be suppressed.

[0101] In addition, in the present embodiment, the overcoat layer 70 and the first and second conductor portions 41 and 61 are bonded to the substrate 10 via the first and second resist layers 20 and 30. The first and second resist layers 20 and 30 do not lose their adhesiveness even at the temperature during molding as described later, and can follow the deformation of the substrate 10 at the temperature during molding. Therefore, it is possible to suppress the first and second resist layers 20 and 30 from peeling off from the substrate 10 during molding, and to suppress the first and second conductor portions 41 and 61 from breaking. On the other hand, if a hot melt or an adhesive tape is used instead of the first and second resist layers 20 and 30, the hot melt or the adhesive tape will melt at the temperature during molding, thereby causing the substrate 10 to peel off and the first and second conductor portions 41 and 61 to break.

[0102] In addition, the wiring board 1 and the molded product 1a of the present embodiment have first and second anti-etching layers 20 and 30 that are bonded to each other and can improve the peeling strength, thereby suppressing the peeling of the first and second conductor parts 41, 61 and the outer coating 70 from the substrate 10, and suppressing the breakage of the substrate 10, the first and second conductor parts 41, 61 and the outer coating 70.

[0103] <<Second Manufacturing Method>>

[0104] Figure 8 (a) to (i) are cross-sectional views showing a second method for manufacturing a wiring board 1 in an embodiment of the present invention. The difference from the first method is that the first resist material 200 and the second resist material 300 are bonded together before curing, and the other structures are the same as those of the first method.

[0105] First, if Figure 8 As shown in (a), a first resist material 200 is formed on a substrate 10. This step is similar to the first manufacturing method. Figure 5 The same steps as (a).

[0106] Then, if Figure 8As shown in (b) to (f) of the first manufacturing method, an outer coating 70, a second conductor portion 61 and a second connecting portion 62, an insulating layer 50, a first conductor portion 41 and a first connecting portion 42, and a second resist material 300 are sequentially formed on the release film 80. These steps are similar to those of the first manufacturing method. Figure 5 The same steps as (c) to (g) are repeated.

[0107] Then, if Figure 8 As shown in (g), the first and second resist materials 200 and 300 in a paste state before curing are bonded together. Figure 8 The step shown in (g) corresponds to an example of the "bonding step" in the present invention.

[0108] Then, if Figure 8 As shown in (h), the first and second resist materials 200 and 300 are cured to form the first resist layer 20 and the second resist layer 30.

[0109] Then, if Figure 8 As shown in (i) of the first manufacturing method, the release film 80 is peeled off from the outer coating 70 and the second connecting portion 62 to produce the wiring board 1. This step is similar to the first manufacturing method. Figure 5 The same steps as (j).

[0110] Next, the wiring board 1 manufactured as described above is Figure 7 The molded article 1 a of the present embodiment can be manufactured by performing thermoforming according to the above method described in (a) to (c).

[0111] In the above manufacturing method of the wiring board 1 and the molded product 1a, since the first and second resist materials 200 and 300 are cured after being bonded together, the heating of the substrate 10 is increased once compared with the first manufacturing method, but the number of heating times of the substrate 10 is reduced compared with the method of forming the first and second conductor parts and the outer coating on the substrate. Therefore, by using this manufacturing method, it is also possible to suppress the shrinkage and deformation of the substrate 10 in the wiring board 1 and the molded product 1a, and to suppress the breakage of the first and second conductor parts 41 and 61.

[0112] <<Third Manufacturing Method>>

[0113] Fig. 9 (a) to (l) are cross-sectional views showing another method for manufacturing the molded product 1a according to the embodiment of the present invention. The difference between this method and the first method for molding the wiring board 1 is that the substrate 10 is molded in advance before the lamination process, and the other structures are the same as the first method.

[0114] First, if Fig. 9 As shown in (a), a substrate 10 is prepared. Fig. 9 As shown in (b), the substrate 10 is molded. Thus, a molded portion M and a non-molded portion N are formed on the substrate 10. As a method for molding the substrate 10, the above-mentioned thermal molding and vacuum molding can be used.

[0115] Then, if Fig. 9 As shown in (c), a first resist material 200 is disposed on the molded substrate 10, and Fig. 9 As shown in (d) of FIG. 8 , the first resist material 200 is cured to form the first resist layer 20 .

[0116] Then, if Fig. 9 As shown in (e) to (j) of the first manufacturing method, an outer coating layer 70, a second conductor portion 61 and a second connecting portion 62, an insulating layer 50, a first conductor portion 41 and a first connecting portion 42, and a second resist layer 30 are sequentially formed on the release film 80. These steps are similar to those of the first manufacturing method. Figure 5 The same steps as (c) to (h) are repeated.

[0117] Then, if Fig. 9 As shown in (k), after the first resist layer 20 and the second resist layer 30 are attached to each other, they are thermally pressed. At this time, the release film 80, the outer coating 70, the second conductor portion 61, the insulating layer 50, the first conductor portion 41, and the second resist layer 30 are in a three-dimensional shape along the substrate 10. In addition, as a thermal pressing method, the above-mentioned Figure 6 The same method as (a) and (b).

[0118] Then, if Fig. 9 As shown in (l), the release film 80 is peeled off from the outer coating 70 and the second connecting portion 62 to produce the wiring board 1. This step is similar to the first manufacturing method. Figure 5 The same steps as (j).

[0119] As in the first manufacturing method, in the third manufacturing method, the substrate 10 is not repeatedly heated, but these layers are formed on the release film 80 and then transferred to the substrate 10. Therefore, as in the first manufacturing method, the shrinkage and deformation of the substrate 10 can be suppressed, and the breakage of the first and second conductor portions 41 and 61 can be suppressed.

[0120] In addition, the above-described embodiments are described to facilitate understanding of the present invention and do not limit the present invention. Therefore, each element disclosed in the above-described embodiments also includes all design changes and equivalents belonging to the technical scope of the present invention.

[0121] For example, the conductor part of the above embodiment has two layers of conductor parts 41, 61, but the number of layers of the conductor part is not limited thereto, and can also be one layer, or more than three layers. In addition, the conductor part of the above embodiment is a linear wiring, but the plane shape of the conductor part is not limited thereto, and can be any shape.

[0122] Furthermore, in the above-described embodiment, the first conductor portion 41 and the second conductor portion 61 are completely electrically insulated from each other, but the present invention is not limited thereto and they may be partially connected depending on the application of the molded product 1 a .

[0123] Description of Reference Numerals

[0124] 1-wiring board; 1a-molded product; 10-substrate; 20-first anti-etching layer; 30-second anti-etching layer; 41-first conductor portion; 42-first connecting portion; 50-insulating layer; 61-second conductor portion; 62-second connecting portion; 70-outer coating; 701-hole; 80-mold release film; M-molding portion; N-non-molding portion; 100-intermediate; 200-first anti-etching material; 300-second anti-etching material; 900-thermal pressing machine; 901-crimping head; 902-crimping table; 950-mold; 951-convex mold; 952-concave mold; 953, 954-mating surfaces.

Claims

1. A method for manufacturing a wiring board, comprising: A first configuration step of configuring a first resist material on a substrate; a first curing step of curing the first resist material to form a first resist layer; A first forming step of forming a resin layer on the release film; a second forming step of forming a conductor portion on the resin layer; a second disposing step of disposing a second resist material on the resin layer so as to cover the conductor portion; a second curing step of curing the second resist material to form a second resist layer; A laminating step of laminating the first resist layer and the second resist layer; A thermal compression bonding process, after the laminating process, thermally compressing the first resist layer and the second resist layer; as well as a peeling step of peeling the release film from the resin layer, The material constituting the substrate is ABS resin or polycarbonate resin.

2. A method for manufacturing a wiring board, comprising: A first configuration step of configuring a first resist material on a substrate; A first forming step of forming a resin layer on the release film; a second forming step of forming a conductor portion on the resin layer; a second disposing step of disposing a second resist material on the resin layer so as to cover the conductor portion; A laminating step of laminating the first resist material and the second resist material; A curing step, after the laminating step, curing the first resist material and the second resist material by heating to form a first resist layer and a second resist layer; as well as a peeling step of peeling the release film from the resin layer, The material constituting the substrate is ABS resin or polycarbonate resin.

3. The method for manufacturing a wiring board according to claim 1 or 2, characterized in that: The first resist layer has a breaking elongation of 50% or more at 100° C., and the second resist layer has a breaking elongation of 50% or more at 100° C.

4. The method for manufacturing a wiring board according to claim 1 or 2, characterized in that: The first resist material and the second resist material have the same composition.

5. The method for manufacturing a wiring board according to claim 1 or 2, characterized in that: The conductor part includes a first conductor part and a second conductor part. The wiring board includes an insulating layer interposed between the first conductor portion and the second conductor portion. The second forming process comprises the following steps: forming the second conductor portion on the resin layer; forming the insulating layer on at least a portion of the second conductor portion; as well as The first conductor portion is formed on the resin layer and the insulating layer.

6. A method for manufacturing a molded product, comprising: The method for manufacturing a wiring board according to any one of claims 1 to 5; and a molding step of three-dimensionally molding at least a portion of the wiring board manufactured by the manufacturing method of the wiring board to form a molded portion; At least a portion of the conductor portion is disposed on the molded portion.

7. A method for producing a molded product, comprising the method for producing a wiring board according to any one of claims 1 to 5, and comprising: a molding step of three-dimensionally molding at least a portion of the substrate to form a molding portion before the first arrangement step; At least a portion of the conductor portion is disposed on the molded portion via the first resist layer and the second resist layer.

8. A wiring board manufactured by the method for manufacturing a wiring board according to any one of claims 1 to 5, comprising: substrate; A first resist layer disposed on the substrate; a second resist layer disposed on the first resist layer; A conductor portion, which is disposed on the second resist layer; as well as An overcoat layer is provided on the second resist layer so as to cover at least a portion of the conductor portion.

9. The wiring board according to claim 8, characterized in that The first resist layer has a breaking elongation of 50% or more at 100° C., The second resist layer has a breaking elongation of 50% or more at 100°C.

10. The wiring board according to claim 8 or 9, characterized in that: The first resist layer and the second resist layer are made of a material having the same composition.

11. The wiring board according to claim 8 or 9, characterized in that: The conductor part includes a first conductor part and a second conductor part. The wiring board includes an insulating layer interposed between the first conductor portion and the second conductor portion. The first conductor portion is formed on the second resist layer, The second conductor portion is formed on the second resist layer and the insulating layer.

12. A molded product comprising the wiring board according to any one of claims 8 to 11, The wiring board includes a molding portion formed by three-dimensionally molding at least a portion of the wiring board. At least a portion of the conductor portion is disposed on the molded portion.

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