System, method and equipment for measuring uncontrolled release of chemical reactions

Abstract

The embodiments of the present disclosure provide a system, method and device for measuring the amount of uncontrolled release of a chemical reaction. The system includes: a VSP2 test device, including: a pressure vessel, a test cell and a first sensor group, the test cell is placed in the pressure vessel, a test material is placed in the test cell, the test material produces a discharge during the chemical reaction, and the first sensor group is used to detect the reaction parameters of the test cell; a discharge pipeline for the discharge to flow from the test cell into a discharge collection device; the discharge collection device includes: a discharge collection tank and a second sensor group, the discharge collection tank is used to collect the discharge, and the second sensor group is used to measure the discharge parameters of the discharge; a calculation device is used to calculate the discharge amount according to the reaction parameters and the discharge parameters. In this way, the discharge amount can be calculated more accurately in combination with the reaction parameters and the discharge parameters, thereby improving the calculation accuracy of the discharge amount.

Description

Technical Field

[0001] The present disclosure relates to the field of chemical reactions, and in particular to the field of uncontrolled release technology. Background Art

[0002] In fine chemical production, uncontrolled chemical reactions are an important cause of accidents. Conducting reaction safety risk assessment and uncontrolled reaction release calculations are of great significance to ensuring safe production in enterprises. However, in the current research on uncontrolled reaction releases, there is no technical solution that can accurately measure the release rate and accurately obtain the release amount. Summary of the invention

[0003] The present disclosure provides a system, method, device and storage medium for measuring the amount of uncontrolled release of a chemical reaction.

[0004] According to a first aspect of the present disclosure, a system for measuring the amount of uncontrolled release of a chemical reaction is provided. The system comprises:

[0005] VSP2 test device, discharge pipeline, discharge collection device and calculation device; including:

[0006] The VSP2 test device comprises: a pressure vessel, a test cell and a first sensor group,

[0007] The test cell is placed in the pressure vessel,

[0008] The test pool contains a test material, which generates discharge during a chemical reaction.

[0009] The first sensor group is used to detect the reaction parameters of the test cell;

[0010] The discharge pipeline has one end connected to the test tank and the other end connected to the discharge collection device, so that the discharge flows from the test tank into the discharge collection device;

[0011] The discharge collection device comprises: a discharge collection tank and a second sensor group, wherein the discharge collection tank is used to collect the discharge, and the second sensor group is used to measure the discharge parameters of the discharge;

[0012] The calculation device is connected to the first sensor group and the second sensor group, and is used to calculate the discharge amount according to the reaction parameter and the discharge parameter.

[0013] According to the above aspect and any possible implementation manner, there is further provided an implementation manner, wherein the first sensor group includes:

[0014] A test pool temperature sensor, inserted into the test pool, for measuring the reaction temperature of the test pool;

[0015] The test cell pressure sensor is installed outside the pressure container and connected to the test cell to measure the reaction pressure of the test cell.

[0016] According to the above aspect and any possible implementation manner, there is further provided an implementation manner, wherein the second sensor group includes:

[0017] A collection tank internal temperature sensor, installed inside the discharge collection tank, for measuring the gas temperature of the discharge collection tank;

[0018] The collecting tank pressure sensor is installed on the outer top of the discharge collecting tank and is used to measure the gas pressure of the discharge collecting tank.

[0019] According to the above aspects and any possible implementation manner, an implementation manner is further provided, wherein the system further includes:

[0020] A gas cooler, wherein the discharge pipeline is bent into a spiral coil shape and is located inside the gas cooler, and the gas cooler is used to cool the non-condensable gas in the discharge flowing through the discharge pipeline to room temperature.

[0021] According to the above aspects and any possible implementation, there is further provided an implementation in which the system further includes:

[0022] A pipeline heat-insulating heating device, wrapped around the discharge pipeline, for heat-insulating the discharge flowing through the discharge pipeline;

[0023] The first heating controller is connected to the pipeline thermal insulation and heating device and is used to control the switch of the pipeline thermal insulation and heating device.

[0024] According to the above aspects and any possible implementation manner, an implementation manner is further provided, wherein the system further includes:

[0025] A collection tank heat-insulating heating device, wrapped around the outer wall of the discharge collection tank, for heat-insulating the discharge collection tank;

[0026] The second heating controller is connected to the collection tank heat preservation and heating device and is used to control the switch of the collection tank heat preservation and heating device.

[0027] According to a second aspect of the present disclosure, a method for measuring the release of an uncontrolled chemical reaction is provided. The method includes: a system for measuring the release of an uncontrolled chemical reaction, the system including: a VSP2 test device, a release pipeline, a release collection device, and a computing device, the VSP2 test device including: a pressure vessel, a test cell, and a first sensor group, the test cell is placed in the pressure vessel, a test material is placed in the test cell, and the test material generates releases during a chemical reaction, the release collection device including: a release collection tank and a second sensor group, the release collection tank is used to collect the release, and the method includes:

[0028] The first sensor group detects the reaction parameters of the test cell;

[0029] The second sensor group measures the discharge parameters of the discharge object;

[0030] The calculation device calculates the discharge amount according to the reaction parameter and the discharge parameter.

[0031] According to the above aspects and any possible implementation, there is further provided an implementation, wherein the reaction parameters include: a pressure increase rate in the test cell, a material temperature in the test cell;

[0032] The discharge parameters include: the pressure increase rate of the discharge collection tank, the gas temperature in the discharge collection tank;

[0033] The calculation device calculates the discharge amount according to the reaction parameter and the discharge parameter, including:

[0034] Determining the discharge temperature according to the material temperature in the test pool when the pressure increase rate is the maximum;

[0035] Determine the discharge pressure according to the maximum bearing pressure of the real reactor corresponding to the test pool;

[0036] Obtaining the sum of the gas phase space volumes of the test pool and the discharge collection tank, the material mass of the test material, and the material mass in the real reactor corresponding to the test pool, measured before the VSP2 test device starts testing;

[0037] Calculating a gas generation rate according to the discharge temperature, the discharge pressure, the discharge parameter, the sum of the gas phase space volumes, the material mass of the test material, and the material mass in the real reactor;

[0038] Calculating the discharge volume according to the gas generation rate and the gas density in the discharge collection tank; or

[0039] The discharge volume is calculated according to the gas generation rate, the gas density in the discharge collection tank, the mass of the material in the real reactor and the volume of the real reactor.

[0040] According to a third aspect of the present disclosure, an electronic device is provided, which includes a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the program, the method described above is implemented.

[0041] According to a fourth aspect of the present disclosure, a computer-readable storage medium is provided, on which a computer program is stored, and when the program is executed by a processor, the method according to the first aspect and / or the second aspect of the present disclosure is implemented.

[0042] In the present disclosure, by combining the reaction parameters and the release parameters to calculate the release amount, compared with the prior art of only using the reaction parameters in the VSP2 test device to calculate the release rate and then determine the release amount, the release amount can be calculated more accurately, thereby improving the calculation accuracy of the release amount.

[0043] It should be understood that the contents described in the summary of the invention are not intended to limit the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. The accompanying drawings are used to better understand the present solution and do not constitute a limitation of the present disclosure. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, among which:

[0045] Figure 1 A block diagram of a system for measuring the amount of uncontrolled release of a chemical reaction according to an embodiment of the present disclosure is shown;

[0046] Figure 2 A schematic diagram of a system for measuring the amount of uncontrolled release of a chemical reaction according to an embodiment of the present disclosure is shown;

[0047] Figure 3 A schematic diagram of another system for measuring the amount of uncontrolled release of a chemical reaction according to an embodiment of the present disclosure is shown;

[0048] Figure 4 A flow chart of a method for measuring the amount of uncontrolled release of a chemical reaction according to an embodiment of the present disclosure is shown;

[0049] Figure 5 A block diagram of an exemplary electronic device capable of implementing embodiments of the present disclosure is shown.

[0050] Figures 1 to 3 The corresponding relationship between the parts and numbers is as follows:

[0051] 1. Pressure vessel; 2. Test pool; 3. Test pool pressure sensor; 4. Test pool temperature sensor; 5. Stop valve; 6. Pipeline insulation and heating device; 7. Discharge collection tank; 8. Collection tank pressure sensor; 9. Collection tank internal temperature sensor; 10. Collection tank outer wall temperature sensor; 11. Collection tank insulation and heating device; 12. Second heating controller; 13. First heating controller; 14. Discharge pipeline; 15. First sensor group; 16. Second sensor group. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0053] In addition, the term "and / or" in this article is only a description of the association relationship between the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0054] Figure 1 A block diagram of a system for measuring the amount of uncontrolled release of a chemical reaction according to an embodiment of the present disclosure is shown. The system 100 may include: a VSP2 test device, a release pipeline, a release collection device, and a computing device; wherein:

[0055] The VSP2 test device comprises: a pressure vessel 1, a test pool 2 and a first sensor group 15, wherein the pressure vessel 1 is a vessel;

[0056] The test cell 2 is placed in the pressure vessel 1.

[0057] A test material is placed in the test pool 2 , and the test material generates discharge during a chemical reaction. The test pool 2 is closed during the chemical reaction.

[0058] The first sensor group 15 is used to detect the reaction parameters of the test cell;

[0059] Reaction parameters include but are not limited to pressure parameters and temperature parameters in the test cell.

[0060] The discharge pipeline 14 has one end connected to the test pool 2 and the other end connected to the discharge collection device, so that the discharge flows from the test pool into the discharge collection device;

[0061] The discharge collection device comprises: a discharge collection tank 7 and a second sensor group 16, wherein the discharge collection tank 7 is used to collect the discharge, and the second sensor group 16 is used to measure the discharge parameters of the discharge; the discharge parameters include but are not limited to the pressure parameters and temperature parameters in the discharge collection tank after the discharge is generated.

[0062] The calculation device is connected to the first sensor group and the second sensor group, and is used to calculate the discharge amount according to the reaction parameter and the discharge parameter.

[0063] By connecting the discharge pipeline 14, the discharge collection device and the calculation device outside the VSP2 test device, not only the reaction parameters of the test pool during the test material reaction process can be detected, but also the discharge parameters of the discharge generated in the discharge collection tank can be measured. Since the environment in the discharge collection tank is relatively simple, for example, the temperature field inside it is uniform and the temperature at each position is the same, the measured temperature can represent the entire discharge collection tank. Therefore, by combining the reaction parameters and the discharge parameters to calculate the discharge amount, compared with the prior art that only the reaction parameters in the VSP2 test device are used to calculate the discharge rate and then determine the discharge amount, the discharge amount can be calculated more accurately, thereby improving the calculation accuracy of the discharge amount.

[0064] In one embodiment, the first sensor group 15 includes:

[0065] The test pool temperature sensor 4 is inserted into the test pool 2 to measure the reaction temperature of the test pool; to be precise, the reaction temperature is the reaction temperature of the test material in the test pool.

[0066] The test cell pressure sensor 3 is installed outside the pressure vessel 1 and connected to the test cell 2 to measure the reaction pressure of the test cell.

[0067] The test pool temperature sensor 4 may be a thermocouple, which may be inserted into the test pool to accurately measure the reaction temperature of the test pool 2;

[0068] The test cell pressure sensor 3 and the test cell 2 may be connected via a pipeline, so that the gas in the test cell 2 is introduced into the test cell pressure sensor 3 via the pipeline, so that the test cell pressure sensor 3 can accurately measure the reaction pressure of the test cell.

[0069] In one embodiment, the second sensor group 16 includes:

[0070] A collection tank internal temperature sensor 9, installed inside the discharge collection tank 7, for measuring the gas temperature of the discharge collection tank 7;

[0071] The collecting tank pressure sensor 8 is installed on the outer top of the discharge collecting tank 7 and is used to measure the gas pressure of the discharge collecting tank 7 .

[0072] The internal temperature sensor 9 of the gas collection tank may be a thermocouple, which may be inserted into the gas collection tank to accurately measure the gas temperature of the gas collection tank;

[0073] The collecting tank pressure sensor 8 can be connected to the discharge collecting tank 7 through a pipeline, so that the gas in the discharge collecting tank 7 can be introduced into the collecting tank pressure sensor 8 through the pipeline, so that the collecting tank pressure sensor 8 can accurately measure the reaction pressure of the discharge collecting tank 7.

[0074] like Figure 2 As shown, in one embodiment, under normal circumstances, the discharge will contain both non-condensable gas and condensable steam. If it is only for measuring the gas production rate of the non-condensable gas in the discharge, the system further includes:

[0075] The gas cooler 6, wherein the discharge pipeline 14 is bent into a spiral coil shape and is located inside the gas cooler 6, and the gas cooler 6 is used to cool the non-condensable gas flowing through the discharge pipeline to room temperature.

[0076] Non-condensable gases refer to gases that are in the gas phase at room temperature, such as carbon monoxide, carbon dioxide, methane, etc.

[0077] If the purpose is only to measure the production rate of non-condensable gas in the discharge, a gas cooler is added between the VSP2 test device and the discharge collection device to condense the condensable steam and cool the non-condensable gas to room temperature, and only measure the production rate of the non-condensable gas.

[0078] like Figure 3 As shown, in one embodiment, if it is necessary to measure the total gas production rate of non-condensable gas and condensable steam in the discharge, the system further includes:

[0079] The pipeline heat-insulating heating device 6 is wrapped on the discharge pipeline and is used to insulate the discharge flowing through the discharge pipeline; the discharge includes condensable steam, and the discharge can be only condensable steam, or the discharge consists of condensable steam and non-condensable steam. Non-condensable gas refers to gas that is in liquid phase at room temperature, such as water vapor.

[0080] The first heating controller 13 is connected to the pipeline thermal insulation and heating device 6 and is used to control the switch of the pipeline thermal insulation and heating device 6 .

[0081] If the purpose of the system is to measure the total gas production rate of non-condensable gas and condensable steam, a pipeline insulation heating device 6 can be added between the VSP2 test device and the discharge collection device to insulate the discharge flowing through the discharge pipeline to prevent the condensable steam from condensing before flowing into the discharge collection tank 7, thereby causing inaccurate measurement of discharge parameters and further inaccurate calculation of the discharge volume.

[0082] Heating and heat preservation devices are installed on the discharge pipeline and the discharge collection tank, and temperature control is performed separately to maintain constant temperature. The heating temperature of the discharge pipeline and the discharge collection tank is higher than the discharge temperature. The initial back pressure of the test pool and the discharge collection tank at the heating temperature is set to the discharge pressure.

[0083] In one embodiment, the system further comprises:

[0084] The collecting tank insulation and heating device 11 is wrapped around the outer wall of the discharge collecting tank 7 to insulate the discharge collecting tank 7; the collecting tank insulation and heating device 7 is composed of a heating belt and insulation cotton. First, the discharge collecting tank is wrapped with the heating belt, and then the insulation cotton is wrapped around the heating belt and fixed.

[0085] The second heating controller 12 is connected to the collection tank heat preservation and heating device 11 and is used to control the switch of the collection tank heat preservation and heating device.

[0086] By wrapping the collection tank insulation and heating device on the outer wall of the discharge collection tank, the discharge collection tank can also be automatically insulated to prevent the condensable steam in the discharge collection tank from being cooled and condensed in advance.

[0087] The following will be combined Figure 2 and Figure 3 (certainly, Figure 2 and Figure 3 The computing device is omitted) to further describe the technical solution of the present disclosure in detail:

[0088] In chemical equipment, the calculation of the release volume of the uncontrolled chemical reaction of the reactor or storage tank requires the non-condensable gas production rate under the secondary reaction of the material for composite systems and gas systems. The conventional experimental method is to use the VSP2 open test, that is, to use an open test cell. The non-condensable gas produced by the secondary reaction of the material accumulates in the container. Therefore, the non-condensable gas production rate can be calculated based on the pressure rise rate in the VSP2 container and the gas temperature in the container. However, since VSP2 uses a heater to maintain the insulation of the test cell, the temperature field in the container is complex and is constantly changing. For example, the pressure vessel 1 has a test cell, a heater, thermal insulation cotton, etc. The temperature in the middle of the container is high and the temperature at the edge is low. The measured temperature is not representative. Therefore, the non-condensable gas production rate calculated in this way is inaccurate. For this reason, the present invention is designed. Figure 2The device shown in the figure adds equipment (6-9) based on the original test device (1-5) of VSP2. The experimental steps are as follows:

[0089] 1. Use 1 / 8 inch pipeline to connect the closed test pool interface and install the stop valve 5

[0090] 2. Install the gas cooling device 6, which can bend the connecting pipeline into a spiral coil and place it in cold water.

[0091] 3. The connecting pipeline terminal is connected to the discharge collection tank 7. The volume of the discharge collection tank is 1.0L. A pressure sensor 8 is installed on the top, a temperature sensor 9 is installed inside, and a pipeline and a stop valve are connected at the bottom to discharge gas and condensate.

[0092] 4. Before the experiment begins, nitrogen should be used to pressurize the discharge collection tank 7 and the test pool 2 according to the discharge pressure to achieve the required back pressure. The purpose is to restore the real discharge scene, and the measured non-condensable gas production rate is consistent with the actual working conditions. Of course, the pressure vessel 1 is also inflated so that there is a certain pressure difference between the test pool 2 and the pressure vessel 1 (such as within 3 bar) to avoid excessive pressure difference, which may cause the test pool 2 to rupture (and inflation is a function of the VSP2 test device), and the pressure of the pressure vessel 1 is always less than the pressure of the test pool 2. The purpose of pressurizing the test pool 2 is to suppress the volatilization of light component materials.

[0093] 5. Set the VSP2 test program as needed and start the test.

[0094] 6. After the test is completed, the gas in the discharge collection tank 7 is sampled and analyzed to determine the gas phase composition for subsequent calculations of the discharge diameter, etc.

[0095] The gas generation rate (i.e., release rate) of the real reactor simulated by the test pool 2 can be calculated by the following formula:

[0096]

[0097] In the formula, Q G is the gas generation rate (unit: cubic meter per hour, not mass rate); T r is the discharge temperature, which can be taken as the material temperature corresponding to the maximum pressure rise rate in test pool 2; P r is the discharge pressure; dP / dt is the pressure rise rate of the discharge collection tank measured experimentally; V b It is the sum of the gas phase space volumes of the release collection tank and the test pool; T b is the gas temperature in the discharge collection tank; m e is the material mass of the test material; m is the material mass in the actual reactor corresponding to the test cell.

[0098] Furthermore, as required, the maximum gas generation rate can be calculated to obtain the single-phase gas release amount or the homogeneous two-phase flow release amount.

[0099] The calculation formula for the single-phase gas release amount can be:

[0100] W=Q G ρ g , ρ g The density of the gas or vapor in the tank that collects the discharge during the release process;

[0101] The calculation formula for the discharge of homogeneous two-phase flow can be:

[0102]

[0103] Wherein, V is the container volume of the real reactor simulated by the test tank 2.

[0104] Single-phase means that the discharge contains only gas, and two-phase means that the discharge contains both gas and liquid.

[0105] [Example 2]

[0106] In chemical plants, the calculation of the release volume of uncontrolled chemical reactions in reactors or storage tanks is very conservative for unadjustable composite systems (i.e., the release contains condensable steam and non-condensable gases). First, the maximum gas production rate of non-condensable gas is obtained based on the VSP2 open-mouth test, and then the maximum temperature rise rate of the material under the secondary reaction is obtained based on the VSP2 closed-mouth test. Then the release volume is calculated according to the following formula:

[0107]

[0108] Where W is the homogeneous discharge, Q Gmax is the maximum gas production rate (maximum gas production rate of non-condensable gas), Q Vmax is the maximum steam generation rate (maximum condensable steam production rate), m R is the mass of the discharged material (i.e. the mass of the material in the actual reactor), V is the volume of the pressure vessel (the volume of the actual reactor), C f is the specific heat capacity of the discharged material, h fg is the vaporization enthalpy of the discharged material, ρ V is the steam density.

[0109] This method of using the maximum temperature rise rate to calculate the steam generation rate is very conservative. It does not take into account the increase in material temperature caused by the heat released by the secondary reaction and the changes in the material composition during the discharge process. In order to be closer to the actual working conditions, the present disclosure has designed Figure 3The device shown in the figure adds equipment (6-13) on the basis of the original standard closed-end test device (1-5) of VSP2. The experimental steps are as follows:

[0110] 1. Use 1 / 8 inch pipeline to connect the closed test pool interface and install the stop valve 5

[0111] 2. Install the pipeline heating and insulation device 6, make the connecting pipeline as short as possible, and wrap all the pipelines with heating tape, and wrap the heating tape with insulation cotton.

[0112] 4. The connecting pipeline terminal is connected to the discharge collection tank 7. The volume of the discharge collection tank is 1.0L. A pressure sensor 8 is installed on the top, a temperature sensor 9 is installed inside, and a temperature sensor 10 is installed on the wall. The bottom is connected to the pipeline and the stop valve to discharge gas and condensate. A heating and heat preservation device 11 is set outside the discharge collection tank. First, the gas collection tank is wrapped with a heating belt, and then the insulation cotton is wrapped outside the heating belt and fixed. The connecting pipeline and the heating belt outside the discharge collection tank are connected to the temperature control device respectively.

[0113] 5. After all components are assembled and before the experiment begins, use nitrogen to pressurize the discharge collection tank system and heat the discharge collection tank. The final temperature of the discharge collection tank (the temperature measured in 9) should be higher than the temperature at the maximum discharge of the equipment, or higher than the critical temperature of the material decomposition to produce steam, and maintain constant. It should be ensured that when the temperature of the discharge collection tank is constant, its pressure should be equal to the discharge pressure.

[0114] 6. Set the VSP2 test program as needed and start the test.

[0115] 7. After the test is completed, wait for the temperature of the discharge collection tank to cool down to room temperature, and then sample and analyze the gas and condensate in the discharge collection tank.

[0116] The following formula can be used to calculate the generation rate of non-condensable gas and (condensable) steam in a real reactor, avoiding the use of the maximum temperature rise rate to estimate the steam generation rate, which may lead to an overly conservative steam generation rate:

[0117]

[0118] In the formula, Q G is the gas volume generation rate (i.e., gas generation rate); T r is the discharge temperature, which can be taken as the material temperature corresponding to the maximum pressure rise rate in test pool 2; P r is the discharge pressure; dP / dt is the pressure rise rate of the discharge collection tank measured experimentally; V b It is the sum of the gas phase space volumes of the release collection tank and the test pool; T bis the gas temperature in the discharge collection tank; m is the mass of the discharged material ((the mass of the material in the actual reactor)); m e To test the material mass (the initial material mass in test pool 2).

[0119] Based on the gas generation rate, the single-phase gas release or homogeneous two-phase flow release can be calculated.

[0120] The calculation formula for the single-phase gas release amount can be:

[0121] W=Q G ρ g , ρ g The density of the gas or vapor in the tank that collects the discharge during the release process;

[0122] The calculation formula for the discharge of homogeneous two-phase flow can be:

[0123]

[0124] Wherein, V is the container volume of the real reactor simulated by the test tank 2.

[0125] The above is an introduction to the device embodiment. The following is a method embodiment to further illustrate the solution disclosed in the present disclosure.

[0126] Figure 4 FIG. 4 is a block diagram of a method 400 for measuring the amount of chemical reaction out of control release according to an embodiment of the present disclosure. Figure 4 As shown, the method is applicable to a chemical reaction uncontrolled release measurement system, the chemical reaction uncontrolled release measurement system comprising: a VSP2 test device, a release pipeline, a release collection device and a computing device, the VSP2 test device comprising: a pressure vessel, a test cell and a first sensor group, the test cell being placed in the pressure vessel, a test material being placed in the test cell, the test material generating releases during a chemical reaction, the release collection device comprising: a release collection tank and a second sensor group, the release collection tank being used to collect the releases, the method 400 comprising:

[0127] Step 410, the first sensor group detects the reaction parameters of the test cell;

[0128] Step 420, the second sensor group measures the discharge parameters of the discharge object;

[0129] In step 430, the calculation device calculates the discharge amount according to the reaction parameter and the discharge parameter.

[0130] Since the environment in the discharge collection tank is relatively simple, for example, the temperature field inside it is uniform and the temperature at each position is the same, the measured temperature can represent the entire discharge collection tank, while the temperature field distribution of the gas phase space in the VSP2 test device is complex. Affected by the gas replenishment rate of the container, the power of the external heater of the test pool, and the heating time, the average temperature of the gas phase space in the VSP2 test device is difficult to accurately calculate. Therefore, this embodiment calculates the discharge amount by combining the reaction parameters and the discharge parameters. Compared with the prior art that only uses the reaction parameters in the VSP2 test device to calculate the discharge rate and then determine the discharge amount, the discharge amount can be calculated more accurately, thereby improving the calculation accuracy of the discharge amount.

[0131] In one embodiment, the reaction parameters include: the pressure increase rate in the test cell, the material temperature in the test cell;

[0132] The discharge parameters include: the pressure increase rate of the discharge collection tank, the gas temperature in the discharge collection tank;

[0133] The calculation device calculates the discharge amount according to the reaction parameter and the discharge parameter, including:

[0134] Determining the discharge temperature according to the material temperature in the test pool when the pressure increase rate is the maximum;

[0135] The discharge pressure is determined according to the maximum bearing pressure of the real reactor corresponding to the test pool; for example, the maximum bearing pressure can be determined as the discharge pressure.

[0136] Obtaining the sum of the gas phase space volumes of the pressure vessel and the discharge collection tank, the material mass of the test material, and the material mass in the real reactor corresponding to the test cell, measured before the VSP2 test device starts testing;

[0137] Calculating a gas generation rate according to the discharge temperature, the discharge pressure, the discharge parameter, the sum of the gas phase space volumes, the material mass of the test material, and the material mass in the real reactor;

[0138] Calculating the discharge volume according to the gas generation rate and the gas density in the discharge collection tank; or

[0139] The discharge volume is calculated according to the gas generation rate, the gas density in the discharge collection tank, the mass of the material in the real reactor and the volume of the real reactor.

[0140] The gas generation rate is calculated by combining the discharge temperature, the discharge pressure, the discharge parameter, the sum of the gas phase space volumes, the material mass of the test material, and the material mass in the actual reactor. This can improve the accuracy of the gas generation rate, thereby improving the calculation accuracy of the discharge amount, compared with the prior art which only uses the discharge temperature, the discharge pressure, the material mass of the test material, the material mass in the actual reactor, and the inaccurate temperature measured in the VSP2 test device to calculate the gas generation rate, or directly uses the maximum temperature rise rate in the VSP2 test device to conservatively estimate the steam generation rate.

[0141] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should be aware that the present disclosure is not limited by the order of the actions described, because according to the present disclosure, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by the present disclosure.

[0142] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the described module can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0143] According to an embodiment of the present disclosure, the present disclosure also provides an electronic device and a non-transitory computer-readable storage medium storing computer instructions.

[0144] Figure 5 A schematic block diagram of an electronic device 500 that can be used to implement an embodiment of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present disclosure described and / or required herein.

[0145] The device 500 includes a computing unit 501, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 502 or a computer program loaded from a storage unit 505 into a random access memory (RAM) 503. In the RAM 503, various programs and data required for the operation of the device 500 can also be stored. The computing unit 501, the ROM 502, and the RAM 503 are connected to each other via a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0146] A number of components in the device 500 are connected to the I / O interface 505, including: an input unit 506, such as a keyboard, a mouse, etc.; an output unit 507, such as various types of displays, speakers, etc.; a storage unit 508, such as a disk, an optical disk, etc.; and a communication unit 509, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 509 allows the device 500 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0147] The computing unit 501 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 501 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 501 performs the various methods and processes described above, such as method 100. For example, in some embodiments, the method 100 may be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 508. In some embodiments, part or all of the computer program may be loaded and / or installed on the device 500 via the ROM 502 and / or the communication unit 509. When the computer program is loaded into the RAM 503 and executed by the computing unit 501, one or more steps of the method 100 described above may be performed. Alternatively, in other embodiments, the computing unit 501 may be configured to perform the method 100 in any other appropriate manner (e.g., by means of firmware).

[0148] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0149] The program code for implementing the method of the present disclosure may be written in any combination of one or more programming languages. These program codes may be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the program code, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0150] In the context of the present disclosure, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0151] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0152] The systems and techniques described herein may be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0153] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The relationship of client and server is generated by computer programs running on respective computers and having a client-server relationship with each other. The server may be a cloud server, a server of a distributed system, or a server combined with a blockchain.

[0154] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0155] The above specific implementations do not constitute a limitation on the protection scope of the present disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A system for measuring the amount of uncontrolled release of chemical reactions, characterized in that: include: VSP2 test device, discharge pipeline, discharge collection device and calculation device; including: The VSP2 test device comprises: a pressure vessel, a test cell and a first sensor group, The test cell is placed in the pressure vessel, The test pool contains a test material, which generates discharge during a chemical reaction. The first sensor group is used to detect the reaction parameters of the test cell; The discharge pipeline has one end connected to the test tank and the other end connected to the discharge collection device, so that the discharge flows from the test tank into the discharge collection device; The discharge collection device comprises: a discharge collection tank and a second sensor group, wherein the discharge collection tank is used to collect the discharge, and the second sensor group is used to measure the discharge parameters of the discharge; The calculation device is connected to the first sensor group and the second sensor group, and is used to calculate the discharge amount according to the reaction parameter and the discharge parameter; The reaction parameters include: the pressure increase rate in the test pool, the material temperature in the test pool; The discharge parameters include: the pressure increase rate of the discharge collection tank, the gas temperature in the discharge collection tank; The computing device is specifically used for: Determining the discharge temperature according to the material temperature in the test pool when the pressure increase rate is the maximum; Determine the discharge pressure according to the maximum bearing pressure of the real reactor corresponding to the test pool; Obtaining the sum of the gas phase space volumes of the test pool and the discharge collection tank, the material mass of the test material, and the material mass in the real reactor corresponding to the test pool, measured before the VSP2 test device starts testing; Calculating a gas generation rate according to the discharge temperature, the discharge pressure, the discharge parameter, the sum of the gas phase space volumes, the material mass of the test material, and the material mass in the real reactor; Calculating the discharge volume according to the gas generation rate and the gas density in the discharge collection tank; or The discharge volume is calculated according to the gas generation rate, the gas density in the discharge collection tank, the mass of the material in the real reactor and the volume of the real reactor.

2. The system according to claim 1, characterized in that The first sensor group includes: A test pool temperature sensor is inserted into the test pool and used to measure the reaction temperature of the test pool; a test pool pressure sensor is installed outside the pressure vessel and connected to the test pool and used to measure the reaction pressure of the test pool.

3. The system according to claim 1, characterized in that The second sensor group includes: A collection tank internal temperature sensor, installed inside the discharge collection tank, for measuring the gas temperature of the discharge collection tank; The collecting tank pressure sensor is installed on the outer top of the discharge collecting tank and is used to measure the gas pressure of the discharge collecting tank.

4. The system according to claim 1, characterized in that The system further comprises: A gas cooler, wherein the discharge pipeline is bent into a spiral coil shape and is located inside the gas cooler, and the gas cooler is used to cool the non-condensable gas in the discharge flowing through the discharge pipeline to room temperature.

5. The system according to claim 1, characterized in that The system further comprises: A pipeline heat-insulating heating device, wrapped around the discharge pipeline, for heat-insulating the discharge flowing through the discharge pipeline; The first heating controller is connected to the pipeline thermal insulation and heating device and is used to control the switch of the pipeline thermal insulation and heating device.

6. The system according to claim 5, characterized in that The system further comprises: A collection tank heat-insulating heating device, wrapped around the outer wall of the discharge collection tank, for heat-insulating the discharge collection tank; The second heating controller is connected to the collection tank heat preservation and heating device and is used to control the switch of the collection tank heat preservation and heating device.

7. A method for measuring the amount of uncontrolled release of a chemical reaction, characterized in that: The method is applicable to a system for measuring the release of an uncontrolled chemical reaction, the system comprising: a VSP2 test device, a release pipeline, a release collection device and a calculation device, the VSP2 test device comprising: a pressure vessel, a test cell and a first sensor group, the test cell being placed in the pressure vessel, a test material being placed in the test cell, the test material generating releases during a chemical reaction, the release collection device comprising: a release collection tank and a second sensor group, the release collection tank being used to collect the releases, the method comprising: The first sensor group detects the reaction parameters of the test cell; The second sensor group measures the discharge parameters of the discharge object; The calculation device calculates the discharge amount according to the reaction parameter and the discharge parameter; The reaction parameters include: the pressure increase rate in the test pool, the material temperature in the test pool; The discharge parameters include: the pressure increase rate of the discharge collection tank, the gas temperature in the discharge collection tank; The calculation device calculates the discharge amount according to the reaction parameter and the discharge parameter, including: Determining the discharge temperature according to the material temperature in the test pool when the pressure increase rate is the maximum; Determine the discharge pressure according to the maximum bearing pressure of the real reactor corresponding to the test pool; Obtaining the sum of the gas phase space volumes of the test pool and the discharge collection tank, the material mass of the test material, and the material mass in the real reactor corresponding to the test pool, measured before the VSP2 test device starts testing; Calculating a gas generation rate according to the discharge temperature, the discharge pressure, the discharge parameter, the sum of the gas phase space volumes, the material mass of the test material, and the material mass in the real reactor; Calculating the discharge volume according to the gas generation rate and the gas density in the discharge collection tank; or The discharge volume is calculated according to the gas generation rate, the gas density in the discharge collection tank, the mass of the material in the real reactor and the volume of the real reactor.

8. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method of claim 7.

9. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to cause the computer to execute the method according to claim 7.

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