Optical image stabilizing device, camera module, and electronic device

Abstract

An optical image stabilization device includes a circuit element, an electronic photosensitive element, a driving element, and a pressing element. The circuit element includes a fixed portion, a movable portion, and a connecting portion. The fixed portion surrounds the movable portion. The connecting portion connects the fixed portion and the movable portion, and the movable portion is movable relative to the fixed portion through the connecting portion. The electronic photosensitive element is electrically connected to the circuit element and disposed on the movable portion. The driving element is coupled to the movable portion to drive the movable portion to move relative to the fixed portion. The pressing element is coupled to the movable portion to hold the movable portion. The connecting portion includes a wire structure. The wire structure is connected between the fixed portion and the movable portion. The wire structure has flexibility. The wire structure has no function of physically supporting the movable portion. Each wire structure includes a circuit layer and an insulating layer stacked with each other. A camera module having the optical image stabilization device and an electronic device having the camera module are also disclosed.

Description

Technical Field

[0001] This invention relates to an optical image stabilization device, a camera module, and an electronic device, particularly an optical image stabilization device and camera module suitable for electronic devices. Background Technology

[0002] With advancements in semiconductor technology, the performance of electronic image sensors has improved, allowing for smaller pixel sizes. Therefore, high-quality optical lenses have become an indispensable component. Furthermore, as technology advances rapidly, the applications of electronic devices equipped with optical lenses are expanding, leading to more diverse requirements for these lenses. In particular, most modern optical lenses now feature image stabilization to compensate for blur caused by camera shake during shooting, ensuring excellent image quality.

[0003] However, captured images require physical cables to transmit them to the processor for image processing. These cables can be stretched by the optical lens during image capture to compensate for camera shake, causing mechanical interference and noise during image transmission, resulting in poor image quality. Therefore, improving the cables used for image transmission while maintaining good image quality to meet the high requirements of today's electronic devices has become an important issue in the field. Summary of the Invention

[0004] In view of the above-mentioned problems, the present invention provides an optical image stabilization device, a camera module, and an electronic device that helps to provide a wire structure with low mechanical interference, thereby reducing noise when transmitting electronic image signals.

[0005] An embodiment of the present invention discloses an optical image stabilization device comprising a circuit element, an electronic photosensitive element, a driving element, and a support element. The circuit element includes a fixed portion, a movable portion, and a connecting portion. The fixed portion surrounds the movable portion. The connecting portion connects the fixed portion and the movable portion, and the movable portion is movable relative to the fixed portion via the connecting portion. The electronic photosensitive element is electrically connected to the circuit element and disposed on the movable portion. The electronic photosensitive element is used to convert an optical image signal into an electronic image signal. The driving element is coupled to the movable portion to drive the movable portion to move relative to the fixed portion in a plane substantially parallel to the electronic photosensitive element. The support element is coupled to the movable portion to hold the movable portion in a plane substantially parallel to the electronic photosensitive element. The connecting portion includes a plurality of wire structures. The wire structures connect the fixed portion and the movable portion. The wire structures are flexible. The wire structures do not provide physical support for the movable portion. Each wire structure includes a circuit layer and an insulating layer. The circuit layer is used to transmit the electronic image signal. Insulating layers are stacked on top of circuit layers.

[0006] Another embodiment of the present invention discloses a camera module comprising an optical imaging device and the aforementioned optical image stabilization device, wherein the electronic photosensitive element of the optical image stabilization device is disposed on an imaging surface of the optical imaging device.

[0007] Another embodiment of the present invention discloses an electronic device that includes the above-described camera module.

[0008] According to the optical image stabilization device, camera module, and electronic device disclosed in this invention, since the electronic image signal is transmitted through a wire structure, mechanical interference of the wire structure can be reduced during the transmission of the electronic image signal, and noise during the transmission of the electronic image signal can be reduced, thereby accurately and smoothly moving the electronic photosensitive element to achieve the effect of stabilizing the optical image.

[0009] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Attached Figure Description

[0010] Figure 1 A perspective schematic diagram of an optical image stabilization device according to a first embodiment of the present invention is shown.

[0011] Figure 2 Draw Figure 1 An exploded view of the optical image stabilization device.

[0012] Figure 3 Draw Figure 2 A three-dimensional schematic diagram of the circuit components of an optical image stabilization device.

[0013] Figure 4 Draw Figure 3 A partially enlarged schematic diagram of region AA of the circuit element.

[0014] Figure 5 Draw Figure 3 A top view of the circuit components.

[0015] Figure 6 Draw Figure 5 A partially enlarged schematic diagram of the BB region of the circuit element.

[0016] Figure 7 Draw Figure 2 A top view of the first layer of the optical image stabilization device.

[0017] Figure 8 Draw Figure 2 A top view schematic diagram of the first and second layers of the optical image stabilization device.

[0018] Figure 9A perspective schematic diagram of an optical image stabilization device according to a second embodiment of the present invention is shown.

[0019] Figure 10 Draw Figure 9 An exploded view of the optical image stabilization device.

[0020] Figure 11 Draw Figure 10 A three-dimensional schematic diagram of the circuit components of an optical image stabilization device.

[0021] Figure 12 Draw Figure 11 A partially enlarged schematic diagram of the CC region of the circuit element.

[0022] Figure 13 Draw Figure 11 A top view of the circuit components.

[0023] Figure 14 Draw Figure 13 A partially enlarged schematic diagram of the DD region of the circuit element.

[0024] Figure 15 A perspective view of a camera module according to a third embodiment of the present invention is shown.

[0025] Figure 16 A perspective view of another camera module according to the present invention is shown.

[0026] Figure 17 A perspective view of yet another camera module according to the present invention is shown.

[0027] Figure 18 A perspective view of an electronic device according to a fourth embodiment of the present invention is shown.

[0028] Figure 19 Draw Figure 18 A three-dimensional diagram of the other side of the electronic device.

[0029] Figure 20 Draw Figure 18 System block diagram of an electronic device.

[0030] Figure 21 A perspective schematic diagram of another electronic device according to the present invention is shown.

[0031] [Symbol Explanation]

[0032] 1, 2… Optical image stabilization devices

[0033] 101, 201... Optical axis

[0034] 11, 21...Substrate

[0035] 12, 22… First layer

[0036] 121…First Outer Ring Section

[0037] 221…First Bearing Section

[0038] 122…First Central Division

[0039] 222…First Follower Part

[0040] 13, 23… Second layer

[0041] 131…Second Outer Ring Section

[0042] 231…Second Bearing Section

[0043] 132…Second Central Division

[0044] 232…Second Follower

[0045] 14, 24... circuit elements

[0046] 141, 241… Fixing parts

[0047] 142, 242... movable parts

[0048] 143, 243… connecting parts

[0049] 1431, 2431… conductor structure

[0050] 1431a, 2431a... Circuit Layer

[0051] 1431b, 2431b... Insulation layer

[0052] 1431c, 2431c... Bending sections

[0053] 15, 25… electronic photosensitive elements

[0054] 16, 26… driving elements

[0055] 161, 261… First driving element

[0056] 162, 262… Second drive element

[0057] 17, 27… Support elements

[0058] 171, 271… First support element

[0059] 172, 272… Second support element

[0060] 28… Plastic parts

[0061] 281… Opening

[0062] 282… Supporting Structure

[0063] 3, 3a, 3b... Camera modules

[0064] 31…Optical Imaging Device

[0065] 32… Drive unit

[0066] 36…Flash module

[0067] 37…Focus Assist Module

[0068] 38… Expanded Image Signal Processor

[0069] 4, 4a… Electronic devices

[0070] 41…Image Signal Processor

[0071] 42… Display device

[0072] 43…Image Software Processor

[0073] 46…Subject

[0074] D1…First Direction

[0075] D2…Second Direction

[0076] DAX…optical axis direction

[0077] d…cross-sectional width of the conductor structure

[0078] The spacing between the two ends of the W… conductor structure Detailed Implementation

[0079] The following detailed description of the features and advantages of the present invention in the embodiments is sufficient to enable anyone skilled in the art to understand the technical content of the present invention and implement it accordingly. Based on the disclosure of this specification, the scope of the claims, and the accompanying drawings, any person skilled in the art can easily understand the related objectives and advantages of the present invention. The following embodiments further illustrate the points of the present invention in detail, but are not intended to limit the scope of the present invention in any way.

[0080] This invention provides an optical image stabilization device, comprising a circuit element, an electronic photosensitive element, a driving element, and a support element. The circuit element includes a fixed part, a movable part, and a connecting part.

[0081] The fixed part surrounds the movable part. The fixed part can be a closed loop surrounding the movable part. Please refer to [reference needed]. Figure 2 and Figure 10The diagrams illustrate fixed portions 141 and 241 that are closedly surrounding the movable portions 142 and 242, respectively, according to the first and second embodiments of the present invention. The fixed portions may also be openly surrounding the movable portions.

[0082] The connecting part connects the fixed part and the movable part, and the movable part can move relative to the fixed part through the connecting part. Specifically, the connecting part includes multiple wire structures. The wire structures connect the fixed part and the movable part. The wire structures are flexible, and the movable part can move relative to the fixed part through the flexibility of the wire structures.

[0083] The fixed, movable, and connecting parts of a circuit element can essentially be located on the same plane. As a result, planar circuit boards are easier to manufacture and offer manufacturability for mass production.

[0084] An electronic photosensitive element is used to receive optical image signals and convert them into electronic image signals. The electronic photosensitive element is electrically connected to circuit elements to transmit the electronic image signals to the circuit elements. The electronic photosensitive element is disposed in a movable part so that it can move relative to a fixed part along with the movable part. The electronic photosensitive element may have a flat shape.

[0085] A driving element is coupled to the movable part to drive the movable part to move relative to the fixed part in a plane substantially parallel to the electronic photosensitive element. The driving element may be electrically, magnetically, or physically coupled to the movable part to drive the movable part by electric power, magnetic force, or contact force.

[0086] Specifically, the driving element may include a first driving element and a second driving element. The first driving element may be coupled to the movable part in a first direction to drive the movable part to move relative to the fixed part along the first direction. The second driving element may be coupled to the movable part in a second direction to drive the movable part to move relative to the fixed part along the second direction. The second direction may be orthogonal to the first direction, and both the first and second directions may be parallel to the surface of the electronic photosensitive element. This provides two dimensions of driving force to the electronic photosensitive element, thereby improving the driving efficiency of optical image stabilization. Please refer to... Figure 2 The illustration shows a first driving element 161 indirectly connected to the movable part 142 via a first central portion 122 and a second central portion 132 in a first direction D1, and a second driving element 162 indirectly connected to the movable part 142 via a second central portion 132 in a second direction D2, according to a first embodiment of the present invention. The first direction D1 and the second direction D2 are orthogonal to each other and are both substantially parallel to the upper surface (unless otherwise labeled) of the electronic photosensitive element 15.

[0087] The first and second driving elements may each comprise at least one shape memory alloy (SMA). The SMA may be a titanium-nickel alloy, a titanium-nickel-palladium alloy, a titanium-nickel-copper alloy, a copper-zinc alloy, a copper-zinc-aluminum alloy, a copper-zinc-tin alloy, a titanium-niobium alloy, a cobalt-nickel-gallium alloy, a cobalt-nickel-aluminum alloy, or any mixture thereof; the invention is not limited thereto. When a bias voltage is applied to the SMA, the SMA will change in length or shape, thereby generating the driving force of the driving element. Therefore, the driving element configured as a shape memory alloy can reduce power consumption and achieve miniaturization of the optical image stabilization device. Please refer to... Figure 2 The illustration shows a first driving element 161 and a second driving element 162 comprising a shape memory alloy according to a first embodiment of the present invention.

[0088] The first and second driving elements may each comprise at least one piezoelectric material. The piezoelectric material may be lead zirconate titanate (PZT), lithium niobate (LiNbO3), barium titanate (BaTiO3), lithium tantalate (LiTaO3), or strontium titanate (SrTiO3), and this invention is not limited thereto. When a bias voltage is applied to the piezoelectric material, the material will undergo a shape change or vibrate, thereby generating a driving force for the driving element. Therefore, the driving element configured with a piezoelectric material can provide a wide driving distance range and high driving accuracy. Please refer to... Figure 10 The illustration shows a first driving element 261 and a second driving element 262 comprising piezoelectric materials according to a second embodiment of the present invention.

[0089] The driving force applied to the movable part by the driving element can be much greater than the flexible restoring force applied to the movable part by the wire structure of the connecting part. Therefore, in optical image stabilization devices, the flexible restoring force of the wire structure is a negligible mechanical element and can be considered as the function of the wire structure providing no physical support to the movable part. Furthermore, the position of the movable part is mainly controlled by the driving force of the driving element. This improves the accuracy of the driving element in driving the movable part.

[0090] A support element is coupled to the movable part to hold the movable part in a plane substantially parallel to the photosensitive element. The support element can be electrically, magnetically, or physically coupled to the movable part to maintain its position by electric, magnetic, or contact force. The support element applies a supporting force to the movable part and, in conjunction with the driving force of the drive element, prevents the movable part from tilting during movement. The support element can be an elastic element, a ball element, or a guide rod element; the invention is not limited to these. Please refer to... Figure 2 The diagram illustrates a compression element 17 comprising an elastic element according to a first embodiment of the present invention. Please refer to... Figure 10The illustration shows a support element 27 comprising ball elements according to a second embodiment of the present invention.

[0091] Each conductive wire structure includes a circuit layer and an insulating layer. The circuit layer is used to transmit electronic image signals. Specifically, the electronic photosensitive element is electrically connected to the movable part of the circuit element to transmit the electronic image signal to the movable part. The electronic image signal is then transmitted to the fixed part through the circuit layer of the conductive wire structure of the connecting part, and then to the processing element (not shown) for image processing. The insulating layer is laminated on the circuit layer. The flexible conductive wire structure can be manufactured by etching the laminated circuit board. This provides a low level of mechanical interference and reduces signal transmission noise. This invention utilizes a flexible conductive wire structure configuration to enable the electronic photosensitive element to move, thereby providing the effect of stable optical imaging.

[0092] The number of insulating layers can be two. A circuit layer is disposed between the two insulating layers, and at least one of the two insulating layers has a blackened surface. This reduces the probability of generating non-imaging light.

[0093] Each conductor structure may include at least one bent portion. The bent portion is curved and located between the two ends of the conductor structure. This improves the flexibility of the conductor structure, preventing damage during operation. Please refer to [reference needed]. Figure 4 and Figure 6 The diagram illustrates a curved portion 1431c located between the two ends of the conductor structure 1431 according to a first embodiment of the present invention. Please refer to... Figure 12 and Figure 14 The diagram illustrates a curved portion 2431c located between the two ends of the conductor structure 2431 according to a second embodiment of the present invention.

[0094] The number of conductor structures is N, which satisfies the following condition: N≥10. This ensures stable image signal transmission.

[0095] Each conductor structure has a cross-sectional width of d and a distance of W between its two ends, satisfying the condition: d / W ≤ 0.2. This balances the manufacturing yield of circuit components with the reliability of the conductor structures. Please refer to... Figure 6 and Figure 14 The diagrams illustrate parameters d and W according to the first and second embodiments of the present invention, respectively.

[0096] The optical image stabilization device disclosed in this invention may further include a plastic component. The plastic component may be disposed on a movable part. The plastic component may have an opening, and the opening may surround an electronic photosensitive element. The plastic component may also include at least one supporting structure, and the supporting structure may overlap at least one of a driving element and a supporting element. The plastic component may be directly molded onto the circuit element by injection molding; alternatively, the plastic component may be fixed to the circuit element using an adhesive, and this invention is not limited thereto. In this way, the plastic component can prevent the electronic components on the circuit element from being exposed, which is beneficial for shielding stray light from the periphery of the electronic photosensitive element. Please refer to... Figure 10 The illustration shows a plastic part 28 disposed on a movable part 242 according to a second embodiment of the present invention; the plastic part 28 has an opening 281 surrounding an electronic photosensitive element 25, and the plastic part 28 includes a support structure 282 indirectly connected to a second drive element 262 via a second driven part 232.

[0097] The optical image stabilization device disclosed in this invention may further include a position sensor (not shown). The position sensor can detect and provide real-time feedback on the position of the movable part relative to the fixed part, thereby improving the driving stability of the optical image stabilization device.

[0098] The various technical features in the optical image stabilization device of the present invention can be combined and configured to achieve the corresponding effects.

[0099] Based on the above implementation methods, specific embodiments are presented below and described in detail with reference to the accompanying drawings.

[0100] <First Embodiment>

[0101] Please refer to Figures 1 to 8 ,in Figure 1 A perspective schematic diagram of an optical image stabilization device according to a first embodiment of the present invention is shown. Figure 2 Draw Figure 1 An exploded view of an optical image stabilization device. Figure 3 Draw Figure 2 A three-dimensional schematic diagram of the circuit components of an optical image stabilization device. Figure 4 Draw Figure 3 A partially enlarged schematic diagram of region AA of the circuit element. Figure 5 Draw Figure 3 A top view of the circuit components. Figure 6 Draw Figure 5 A partially enlarged schematic diagram of the BB region of the circuit element. Figure 7 Draw Figure 2 A top view schematic diagram of the first layer of the optical image stabilization device, and Figure 8 Draw Figure 2 A top view schematic diagram of the first and second layers of the optical image stabilization device.

[0102] In this embodiment, the optical image stabilization device 1 includes a substrate 11, a first layer 12, a second layer 13, a circuit element 14, an electronic photosensitive element 15, a driving element 16, and a support element 17. The optical image stabilization device 1 has an optical axis 101, and the optical axis 101 defines an optical axis direction DAX. The substrate 11, the first layer 12, the second layer 13, the circuit element 14, and the electronic photosensitive element 15 are sequentially stacked in the optical axis direction DAX. The driving element 16 and the support element 17 are indirectly connected to the circuit element 14.

[0103] In detail, the first layer 12 includes a first outer ring portion 121 and a first central portion 122. The first outer ring portion 121 is disposed on the substrate 11 and surrounds the first central portion 122 in a closed manner. The first central portion 122 is indirectly in contact with the first outer ring portion 121 through a driving element 16 and a pressing element 17. The second layer 13 includes a second outer ring portion 131 and a second central portion 132. The second outer ring portion 131 is disposed on the first outer ring portion 121 and surrounds the second central portion 132 in a closed manner. The second central portion 132 is disposed on the first central portion 122.

[0104] The circuit element 14 includes a fixed portion 141, a movable portion 142, and a connecting portion 143, all substantially located on the same plane. The fixed portion 141 is disposed on the second outer ring portion 131 and surrounds the movable portion 142 in a closed manner. The movable portion 142 is disposed on the second central portion 132. The connecting portion 143 connects the fixed portion 141 and the movable portion 142, and the movable portion 142 can move relative to the fixed portion 141 through the connecting portion 143.

[0105] Specifically, the connecting portion 143 includes a plurality of wire structures 1431. The wire structures 1431 are connected between the fixed portion 141 and the movable portion 142. The wire structures 1431 are flexible, and the movable portion 142 can move relative to the fixed portion 141 due to the flexibility of the wire structures 1431.

[0106] An electronic photosensitive element 15 is used to receive an optical image signal. For example, the electronic photosensitive element 15 may have a flat shape, and its upper surface (not shown) is disposed on an imaging surface (not shown) of an optical lens (not shown) to receive the optical image signal imaged by the optical lens on the imaging surface. Furthermore, the electronic photosensitive element 15 is also used to convert the optical image signal into an electronic image signal. The electronic photosensitive element 15 is electrically connected to the circuit element 14 to transmit the electronic image signal to the circuit element 14. The electronic photosensitive element 15 may be disposed on the movable part 142 with its lower surface facing the movable part 142, and the electronic photosensitive element 15 may move relative to the fixed part 141 along with the movable part 142.

[0107] The driving element 16 includes a first driving element 161 and a second driving element 162, each comprising a shape memory alloy. The two ends of the first driving element 161 are connected to the first outer ring portion 121. The middle portion of the first driving element 161 physically contacts one side of the first central portion 122 in a first direction D1, and the first central portion 122 has no physical contact with the substrate 11. When a bias is applied to the shape memory alloy first driving element 161, the first driving element 161 changes in length or shape, thereby generating a driving force on the side physically contacting the first central portion 122 in the first direction D1. Since the first central portion 122, the second central portion 132, and the movable portion 142 are stacked on top of each other and can move together, the first driving element 161 can be considered as indirectly connected to the movable portion 142 in the first direction D1. In this way, the first driving element 161 can drive the movable portion 142 to move relative to the fixed portion 141 along the first direction D1.

[0108] The two ends of the second driving element 162 are connected to the second outer ring portion 131, and the middle portion of the second driving element 162 substantially contacts one side of the second center portion 132 in a second direction D2. When a bias is applied to the shape memory alloy second driving element 162, the second driving element 162 changes in length or shape, thereby generating a driving force on the side substantially in contact with the second center portion 132 in the second direction D2. Since the second center portion 132 and the movable portion 142 are stacked on top of each other and can move together, the second driving element 162 can be considered to be indirectly connected to the movable portion 142 in the second direction D2. In this way, the second driving element 162 can drive the movable portion 142 to move relative to the fixed portion 141 along the second direction D2. Figure 2As shown, the first direction D1 and the second direction D2 are orthogonal to each other and both parallel to the upper surface of the electronic photosensitive element 15, so that the driving element 16 can drive the movable part 142 to move relative to the fixed part 141 on a plane that is substantially parallel to the upper surface of the electronic photosensitive element 15, so that the electronic photosensitive element 15 can stably receive optical image signals.

[0109] The driving force applied by the driving element 16 to the movable part 142 is much greater than the flexible restoring force applied by the wire structure 1431 of the connecting part 143 to the movable part 142. Therefore, in the optical image stabilization device 1, the flexible restoring force applied by the wire structure 1431 to the movable part 142 is a negligible mechanical element and can be regarded as the wire structure 1431 having no physical support function for the movable part 142, while the position of the movable part 142 is mainly controlled by the driving force of the driving element 16.

[0110] The support element 17 includes a first support element 171 and a second support element 172, and each of the first support element 171 and the second support element 172 includes an elastic element. The first support element 171 is in solid contact with the first outer ring portion 121 and the first central portion 122 in the first direction D1, and the first support element 171 and the first driving element 161 are in solid contact with opposite sides of the first central portion 122 in the first direction D1. When a bias is applied to the first driving element 161, the first support element 171 can indirectly apply a supporting force or elastic restoring force to the movable portion 142 in the first direction D1 through the first central portion 122 and the second central portion 132. The first support element 171 can also cooperate with the driving force applied to the first central portion 122 by the first driving element 161 in the first direction D1 to prevent the movable portion 142 from tilting during movement, further enhancing the effect of allowing the electronic photosensitive element 15 to stably receive optical image signals.

[0111] The second support element 172 is in solid contact with the second outer ring portion 131 and the second central portion 132 in the second direction D2, and the second support element 172 and the second drive element 162 are in solid contact with opposite sides of the second central portion 132 in the second direction D2. When a bias is applied to the second drive element 162, the second support element 172 can indirectly apply a supporting force or elastic restoring force to the movable portion 142 in the second direction D2 through the second central portion 132. The second support element 172 can also cooperate with the second drive element 162 to apply a driving force to the second central portion 132 in the second direction D2 to prevent the movable portion 142 from tilting during movement, further enhancing the effect of allowing the electronic photosensitive element 15 to stably receive optical image signals, and keeping the movable portion 142 on a plane substantially parallel to the upper surface of the electronic photosensitive element 15.

[0112] In this embodiment, the first driving element 161 and the second driving element 162 of the driving element 16 are respectively disposed on the first layer 12 and the second layer 13, and the first pressing element 171 and the second pressing element 172 of the pressing element 17 are respectively disposed on the first layer 12 and the second layer 13, so as to form two sets of driving forces that respectively move the movable part 142 along the first direction D1 and the second direction D2. Please refer to Figure 7 The diagram shows a top view of a single-layer first body 12, a first driving element 161, and a first supporting element 171. Please refer to... Figure 8 The diagram shows a top view of a multi-layered structure comprising a first layer 12, a second layer 13, a first driving element 161, a second driving element 162, a first support element 171, and a second support element 172. However, the invention is not limited to this configuration.

[0113] Each conductor structure 1431 includes a circuit layer 1431a and two insulating layers 1431b. The circuit layer 1431a is stacked between the two insulating layers 1431b and is used to transmit electronic image signals. Specifically, the electronic photosensitive element 15 is electrically connected to the movable part 142 of the circuit element 14 to transmit electronic image signals to the movable part 142. The electronic image signals are then transmitted to the fixed part 141 through the circuit layer 1431 of the conductor structure 1431 of the connecting part 143, and then to the processing element (not shown) for image processing. The conductor structure 1431 is a flexible structure manufactured by etching a laminated circuit board. Therefore, the conductor structure 1431 reduces mechanical interference when transmitting electronic image signals, thereby reducing noise and smoothly moving the electronic photosensitive element 15 to achieve the effect of stabilizing the optical image.

[0114] The insulating layer 1431b closer to the electronic photosensitive element 15 has a blackened surface (not shown) in the optical axis direction DAX to reduce the probability of generating non-imaging light. However, the invention is not limited thereto. In some embodiments, each of the two insulating layers may have a blackened surface on the side away from the circuit layer.

[0115] Each conductor structure 1431 also includes two bent portions 1431c. For example... Figure 4 and Figure 6 As shown, the bent portion 1431c is bent and is located between the two ends of the conductor structure 1431 to further enhance the bendability of the conductor structure 1431 and prevent damage to the conductor structure 1431 when it is driven.

[0116] The number of conductor structures 1431 is N, which satisfies the following condition: N = 44.

[0117] The cross-sectional width of each conductor structure 1431 is d, and the distance between the two ends of each conductor structure 1431 is W, which satisfies the following conditions: d = 0.04 [mm]; W = 1 [mm]; and d / W = 0.04.

[0118] <Second Embodiment>

[0119] Please refer to Figures 9 to 14 ,in Figure 9 A perspective schematic diagram of an optical image stabilization device according to a second embodiment of the present invention is shown. Figure 10 Draw Figure 9 An exploded view of an optical image stabilization device. Figure 11 Draw Figure 10 A three-dimensional schematic diagram of the circuit components of an optical image stabilization device. Figure 12 Draw Figure 11 A partially enlarged schematic diagram of the CC region of the circuit element. Figure 13 Draw Figure 11 A top view of the circuit components, and Figure 14 Draw Figure 13 A partially enlarged schematic diagram of the DD region of the circuit element.

[0120] In this embodiment, the optical image stabilization device 2 includes a substrate 21, a first layer 22, a second layer 23, a circuit element 24, an electronic photosensitive element 25, a driving element 26, a supporting element 27, and a plastic component 28. The optical image stabilization device 2 has an optical axis 201, and the optical axis 201 defines an optical axis direction DAX. The first layer 22 and the second layer 23 are sequentially stacked in the optical axis direction DAX within the accommodating space (not otherwise labeled) surrounded by the substrate 21. The substrate 21, the circuit element 24, and the electronic photosensitive element 25 are sequentially stacked in the optical axis direction DAX. The driving element 26 and the supporting element 27 are indirectly connected to the circuit element 24. The plastic component 28 is disposed on the circuit element 24 and the second layer 23.

[0121] In detail, the first layer 22 includes a first support portion 221 and a first driven portion 222. The first support portion 221 is connected to the substrate 21. The first driven portion 222 is indirectly in contact with the first support portion 221 through a driving element 26. The second layer 23 includes a second support portion 231 and a second driven portion 232. The second support portion 231 is disposed on the first driven portion 222, and the second support portion 231 is indirectly in contact with the first support portion 221 through a support element 27. The second driven portion 232 is indirectly in contact with the second support portion 231 through the driving element 26.

[0122] The circuit element 24 includes a fixed portion 241, a movable portion 242, and a connecting portion 243, all substantially located on the same plane. The fixed portion 241 is disposed on the substrate 21 and surrounds the movable portion 242 in a closed manner. The movable portion 242 indirectly contacts the second support portion 231 through a support element 27 and indirectly contacts the second driven portion 232 through a plastic part 28. The connecting portion 243 connects the fixed portion 241 and the movable portion 242, and the movable portion 242 can move relative to the fixed portion 241 through the connecting portion 243.

[0123] Specifically, the connecting part 243 includes a plurality of wire structures 2431. The wire structures 2431 are connected between the fixed part 241 and the movable part 242. The wire structures 2431 are flexible, and the movable part 242 can move relative to the fixed part 241 due to the flexibility of the wire structures 2431.

[0124] The electronic photosensitive element 25 is used to receive an optical image signal. For example, the electronic photosensitive element 25 may have a flat shape, and its upper surface (not shown) is disposed on an imaging plane (not shown) of an optical lens (not shown) to receive the optical image signal imaged by the optical lens on the imaging plane. Furthermore, the electronic photosensitive element 25 is also used to convert the optical image signal into an electronic image signal. The electronic photosensitive element 25 is electrically connected to the circuit element 24 to transmit the electronic image signal to the circuit element 24. The electronic photosensitive element 25 may be disposed on the movable part 242 with its lower surface facing the movable part 242, and the electronic photosensitive element 25 may move relative to the fixed part 241 along with the movable part 242.

[0125] The driving element 26 includes a first driving element 261 and a second driving element 262, and each of the first driving element 261 and the second driving element 262 comprises a piezoelectric material. The first driving element 261 is disposed between the first support portion 221 and the first driven portion 222, so as to physically contact and separate the first support portion 221 and the first driven portion 222 in a first direction D1. Furthermore, the first driven portion 222 has no physical contact with the substrate 21. When a bias is applied to the first driving element 261, which is made of piezoelectric material, the first driving element 261 will change its shape or vibrate, thereby generating a driving force on the first driven portion 222, which has no physical contact with the substrate 21, in the first direction D1. Since the first driven portion 222 and the second support portion 231 are stacked on top of each other and can move together, and the second support portion 231 and the movable portion 242 are indirectly in contact through the support element 27 and can move together, the first driving element 261 can be regarded as being indirectly connected to the movable portion 242 in the first direction D1. In this way, the first driving element 261 can drive the movable part 242 to move relative to the fixed part 241 along the first direction D1.

[0126] The second driving element 262 is disposed between the second supporting portion 231 and the second driven portion 232, so as to physically contact and separate the second supporting portion 231 and the second driven portion 232 in a second direction D2. When the second driving element 262, which is biased to the piezoelectric material, is applied, the second driving element 262 will change shape or vibrate, thereby generating a driving force on the second driven portion 232, which does not have physical contact with the second supporting portion 231, in the second direction D2. Since the second driven portion 232 and the movable portion 242 can move together through indirect contact via the plastic part 28, the second driving element 262 can be regarded as being indirectly connected to the movable portion 242 in the second direction D2. In this way, the second driving element 262 can drive the movable portion 242 to move relative to the fixed portion 241 along the second direction D2. Figure 10 As shown, the first direction D1 and the second direction D2 are orthogonal to each other and both parallel to the upper surface of the electronic photosensitive element 25, so that the driving element 26 can drive the movable part 242 to move relative to the fixed part 241 on a plane that is substantially parallel to the upper surface of the electronic photosensitive element 25, so that the electronic photosensitive element 25 can stably receive optical image signals.

[0127] The driving force applied by the driving element 26 to the movable part 242 is much greater than the flexible restoring force applied by the wire structure 2431 of the connecting part 243 to the movable part 242. Therefore, in the optical image stabilization device 2, the flexible restoring force applied by the wire structure 2431 to the movable part 242 is a negligible mechanical element and can be regarded as the wire structure 2431 having no physical support function for the movable part 242, while the position of the movable part 242 is mainly controlled by the driving force of the driving element 26.

[0128] The support element 27 comprises a first support element 271 and a second support element 272, each including a ball bearing element. The first support element 271 is in solid contact with the first support portion 221 and the second support portion 231 in the optical axis direction DAX, and the ball bearing element of the first support element 271 can roll in place relative to the first support portion 221 without relative displacement. When a bias is applied to the first drive element 261, the first support element 271 can indirectly apply a supporting force to the movable portion 242 in the optical axis direction DAX through the first support portion 221 and the second support portion 231. The first support element 271 can also cooperate with the first drive element 261 to apply a driving force to the first driven portion 222 in the first direction D1 to prevent the movable portion 242 from tilting during movement, further enhancing the effect of allowing the electronic photosensitive element 25 to stably receive optical image signals.

[0129] The second support element 272 is in solid contact between the second support portion 231 and the movable portion 242 in the optical axis direction DAX, and the ball element of the second support element 272 can roll in place without relative displacement relative to the second support portion 231. When a bias is applied to the second drive element 262, the second support element 272 can directly apply a supporting force to the movable portion 242 in the optical axis direction DAX, and the second support element 272 can also cooperate with the second drive element 262 to apply a driving force to the second driven portion 232 in the second direction D2 to prevent the movable portion 242 from tilting during movement, further enhancing the effect of allowing the electronic photosensitive element 25 to stably receive optical image signals, and keeping the movable portion 242 on a plane substantially parallel to the upper surface of the electronic photosensitive element 25.

[0130] In this embodiment, the first driving element 261 and the second driving element 262 of the driving element 26 are respectively disposed on the first layer 22 and the second layer 23, and the first pressing element 271 and the second pressing element 272 of the pressing element 27 are respectively disposed on the first layer 22 and the second layer 23, so as to form two sets of driving forces that respectively move the movable part 242 along the first direction D1 and the second direction D2. Please refer to Figure 10 The illustration shows a first driving element 261 and a second driving element 262 that can respectively drive the movable part 242 to move along a first direction D1 and a second direction D2, and a first pressing element 271 and a second pressing element 272 that can respectively stabilize the movable part 242 as it moves along the first direction D1 and the second direction D2. However, the present invention is not limited to this configuration.

[0131] Each conductor structure 2431 includes a circuit layer 2431a and two insulating layers 2431b. The circuit layer 2431a is stacked between the two insulating layers 2431b and is used to transmit electronic image signals. Specifically, the electronic photosensitive element 25 is electrically connected to the movable part 242 of the circuit element 24 to transmit electronic image signals to the movable part 242. The electronic image signals are then transmitted to the fixed part 241 through the circuit layer 2431a of the conductor structure 2431 of the connecting part 243, and then to the processing element (not shown) for image processing. The conductor structure 2431 is a flexible structure manufactured by etching the laminated circuit board. Therefore, the conductor structure 2431 reduces mechanical interference when transmitting electronic image signals, thereby reducing noise and smoothly moving the electronic photosensitive element 25 to achieve the effect of stabilizing the optical image.

[0132] The insulating layer 2431b closer to the electronic photosensitive element 25 has a blackened surface (not shown) in the optical axis direction DAX to reduce the probability of generating non-imaging light. However, the invention is not limited thereto. In some embodiments, each of the two insulating layers may have a blackened surface on the side away from the circuit layer.

[0133] Each conductor structure 2431 also includes three bent portions 2431c. For example... Figure 12 and Figure 14 As shown, the bent portion 2431c is bent and is located between the two ends of the conductor structure 2431 to further enhance the bendability of the conductor structure 2431 and prevent damage to the conductor structure 2431 when it is driven.

[0134] The number of conductor structures 2431 is N, which satisfies the following condition: N = 34.

[0135] The cross-sectional width of each conductor structure 2431 is d, and the distance between the two ends of each conductor structure 2431 is W, which satisfies the following conditions: d = 0.04 [mm]; W = 1 [mm]; and d / W = 0.04.

[0136] A plastic part 28 is disposed on the movable part 242. The plastic part 28 has an opening 281. The opening 281 surrounds the photosensitive element 25. The plastic part 28 includes a support structure 282. The support structure 282 is disposed on the second driven part 232 and indirectly connected to the second drive element 262 through the second driven part 232.

[0137] <Third Embodiment>

[0138] Please refer to Figure 15 This diagram illustrates a perspective view of a camera module according to a third embodiment of the present invention. In this embodiment, the camera module 3 includes the optical image stabilization device 1, an optical imaging device 31, and a driving device 32 described in the first embodiment. The camera module 3 may also be configured with the optical image stabilization device described in other embodiments, and the present invention is not limited thereto. The optical imaging device 31 is, for example, an optical lens. The camera module 3 uses the optical imaging device 31 to focus light to generate an image, and cooperates with the driving device 32 to focus the image on the imaging surface of the optical imaging device 31. Finally, the image signal is formed and imaged onto the electronic photosensitive element 15, and the optical image signal can be converted into an electronic image signal by the electronic photosensitive element 15 so as to output the electronic image signal as image data.

[0139] The drive unit 32 may have an auto-focus function, and its driving method can use drive systems such as voice coil motors (VCM), microelectromechanical systems (MEMS), piezoelectric systems, and shape memory alloys. The drive unit 32 enables the optical imaging device 31 to achieve a better imaging position, allowing clear images to be captured of the subject at different object distances.

[0140] The camera module of the present invention is not limited to the structure described above. Figure 16 A perspective view of another camera module according to the present invention is shown, wherein the camera module 3 is further equipped with a flash module 36. The flash module 36 can provide supplementary lighting during shooting to improve image quality.

[0141] Figure 17 A perspective view of yet another camera module according to the present invention is shown, wherein the camera module 3 is further equipped with a focus assist module 37. The focus assist module 37 can provide object distance information of the subject to facilitate fast focusing. The focus assist module 37 can employ an infrared or laser focus assist system to achieve fast focusing.

[0142] <Fourth Embodiment>

[0143] Please refer to Figures 18 to 20 ,in Figure 18 A perspective view of an electronic device according to a fourth embodiment of the present invention is shown. Figure 19 Draw Figure 18 A three-dimensional diagram of the other side of the electronic device, and Figure 20 Draw Figure 18 System block diagram of an electronic device.

[0144] In this embodiment, the electronic device 4 is a smartphone. The electronic device 4 includes the camera module 3, image signal processor 41, display device (user interface) 42, and image software processor 43 described in the third embodiment above. In this embodiment, the camera module 3 includes an optical image stabilization device 1, an optical imaging device 31, and a driving device 32, and is also equipped with a flash module 36 and a focus assist module 37.

[0145] When the user photographs the subject 46, the electronic device 4 uses the camera module 3 to focus the light for image capture, activates the flash module 36 for supplemental lighting, and uses the subject distance information provided by the focus assist module 37 for fast focusing. Furthermore, the image signal processor 41 performs image optimization processing to further improve the image quality produced by the optical imaging device 31. The focus assist module 37 can employ an infrared or laser focus assist system to achieve fast focusing. The display device 42 can use a touchscreen or physical shooting button, combined with the diverse functions of the image software processor 43 for image capture and processing. The image processed by the image software processor 43 can be displayed on the display device 42.

[0146] The electronic device of the present invention is not limited to the number of camera modules described above. Figure 21 A perspective view of another electronic device according to the present invention is shown, wherein the electronic device 4a further includes a camera module 3a and a camera module 3b. Camera modules 3a, 3b, and 3a face the same direction and are all single-focus, and have different viewing angles (wherein camera module 3a is a telephoto device, camera module 3b is a wide-angle device, and the viewing angle of camera module 3 can be between that of camera module 3a and camera module 3b), allowing the electronic device to provide different magnifications to achieve optical zoom shooting effects. Furthermore, in this embodiment, camera module 3 is further equipped with an extended image signal processor 38, enabling the camera module 3, when paired with the telephoto camera module 3a and the wide-angle camera module 3b, to perform zoom operation on the image image displayed on the touch screen, thus supporting multi-lens image processing functions. The electronic device 4a, equipped with camera module 3, has multiple shooting modes, such as zoom, telephoto, multi-lens simultaneous photography, optimized selfie, high dynamic range (HDR) in low light, and high-resolution 4K video recording.

[0147] The optical image stabilization device disclosed in this invention is not limited to applications in smartphones. It can also be applied to systems with optical image stabilization, offering excellent aberration correction and good image quality. For example, the optical image stabilization device can be widely used in electronic devices such as 3D image capture, digital cameras, mobile devices, tablet computers, smart TVs, network monitoring equipment, dashcams, reversing cameras, multi-lens systems, recognition systems, motion-sensing game consoles, and wearable devices. The aforementioned electronic devices are merely illustrative examples of practical applications of this invention and do not limit the scope of application of the camera module.

[0148] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the appended claims.

Claims

1. An optical image stabilization device, characterized in that, Include: A circuit element comprising: One fixed part; A movable part, wherein the fixed part surrounds the movable part; and A connecting part connects the fixed part and the movable part, wherein the movable part is movable relative to the fixed part through the connecting part; An electronic photosensitive element is electrically connected to the circuit element and disposed in the movable part, wherein the electronic photosensitive element is used to convert an optical image signal into an electronic image signal; A driving element, coupled to the movable part, drives the movable part to move relative to the fixed part in a plane substantially parallel to the electronic photosensitive element; as well as A support element, coupled to the movable part, holds the movable part substantially parallel to the plane of the electronic photosensitive element. When a bias is applied to the drive element, the support element applies a supporting force or elastic restoring force to the movable part in a driving direction opposite to that of the drive element. The driving element and the supporting element are located on different layers than the fixed part, the movable part and the connecting part are located on. The connecting part includes multiple wire structures, which are connected between the fixed part and the movable part; The wire structure is flexible and does not provide physical support for the movable part. Each wire structure includes: A circuit layer for transmitting the electronic image signal; and Two insulating layers, with the circuit layer disposed between the two insulating layers; Wherein, the cross-sectional width of each of the conductor structures is d, and the distance between the two ends of each of the conductor structures is W, which satisfies the following conditions: d / W ≤ 0.

2.

2. The optical image stabilization device according to claim 1, characterized in that, The driving element includes: A first driving element is coupled to the movable part in a first direction to drive the movable part to move relative to the fixed part in the first direction; as well as A second driving element is coupled to the movable part in a second direction to drive the movable part to move relative to the fixed part in the second direction, wherein the second direction is orthogonal to the first direction.

3. The optical image stabilization device according to claim 2, characterized in that, The first driving element and the second driving element each comprise at least one shape memory alloy.

4. The optical image stabilization device according to claim 2, characterized in that, The first driving element and the second driving element each contain at least one piezoelectric material.

5. The optical image stabilization device according to claim 1, characterized in that, The fixed part, the movable part, and the connecting part of the circuit element are substantially located on the same plane.

6. The optical image stabilization device according to claim 1, characterized in that, It also includes a plastic part disposed on the movable part, the plastic part having an opening surrounding the electronic photosensitive element.

7. The optical image stabilization device according to claim 1, characterized in that, The number of the wire structures is N, and they satisfy the following condition: N ≥ 10。 8. The optical image stabilization device according to claim 1, characterized in that, Each of the wire structures includes at least one bent portion, the bent portion being curved and located between the two ends of the wire structure.

9. The optical image stabilization device according to claim 1, characterized in that, At least one of the two insulating layers has a blackened surface.

10. A camera module, characterized in that, Include: An optical imaging device; and According to claim 1, the optical image stabilization device, wherein the electronic photosensitive element of the optical image stabilization device is disposed on an imaging surface of the optical imaging device.

11. An electronic device, characterized in that, Include: The camera module according to claim 10.

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