Chip production automatic detection system based on optical CCD module

Abstract

The application discloses a kind of chip production automatic detection systems based on optical CCD module, belong to intelligent detection control technical field, including image acquisition module, signal processing module, main control module, display module and alarm module;The present application is collected and identified by optical CCD module, with the help of its high stability and definition performance, greatly improve the collection quality of IC image, so as to improve the accuracy of chip anomaly detection;In addition, the present application adopts group comparison logic to detect whether the IC placement state in the target area is normal, and further prevents the IC from being damaged during the taking and placing process due to abnormal IC placement. This detection logic selects a standard placed IC, sets a green detection frame for a normal IC, and simultaneously sets the surface brightness characteristics of the standard placed IC as the detection standard, thereby improving the accuracy and reliability of the IC detection result.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of intelligent detection control, and particularly relates to a chip production automatic detection system based on an optical CCD module. BACKGROUND

[0002] A chip, also known as an integrated circuit or a microchip, is a semiconductor product based on a silicon wafer. Since its birth in the middle of the 20th century, the chip has been ubiquitous and widely used in computers, mobile phones, smart terminals, and other digital appliances. It is an important part of the modern information society. The chip manufacturing process is complex and includes chip design, wafer fabrication, packaging, and cost testing. Defects that affect the function and reliability of the chip may occur at each stage of the production process. Therefore, real-time detection of the chip production process is particularly important. Currently, mechanical arms are mainly used to pick and place chips during chip production. If the picking and placing is abnormal, it is easy to cause direct or indirect damage to the chip. The current CCD technology has been relatively mature, and it is widely used in the field of image recognition. Optical CCD can sense optical signals and convert them into electrical signals. It has high resolution, small size, light weight, long service life, strong impact resistance, low power consumption, and other advantages. It can automatically identify the color, pattern, and character of a product and has a wide range of applications. Currently, there is a lack of a detection system for chip production that can detect the state of ICs placed in the IC fixture in real time and prevent damage to the ICs caused by abnormal positioning of the mechanical arm during picking and placing. Therefore, how to apply CCD technology to the chip production process to detect the production process in real time, detect abnormal behavior in a timely manner, and correct it to reduce the chip damage rate has become a research focus. Therefore, we propose a chip production automatic detection system based on an optical CCD module. SUMMARY

[0003] The purpose of the present application is to solve the defects in the prior art and provide a chip production automatic detection system based on an optical CCD module.

[0004] To achieve the above purpose, the present application adopts the following technical solutions:

[0005] A chip production automatic detection system based on an optical CCD module includes an image acquisition module, a signal processing module, a main control module, a display module, and an alarm module.

[0006] The image acquisition module, the signal processing module, the main control module, and the alarm module are electrically connected through a communication bus. The image acquisition module is installed on a carrying object, and the carrying object is specifically a mechanical arm.

[0007] The signal processing module is specifically a signal acquisition card, which comprises a vacuum value reading unit and a Motor step value reading unit;

[0008] The vacuum value reading unit is used for reading the vacuum value of the carried object, wherein the vacuum value refers to the change of air pressure of the vacuum suction nozzle of the carrying device, resulting in the change of high and low level, and further resulting in a digital signal;

[0009] The Motor step value reading unit is used for reading the Motor step value of the carried object;

[0010] The image acquisition module is used for acquiring IC images and other information in real time;

[0011] The signal processing module comprises a signal conversion unit for converting the acquired vacuum value, Motor step value and IC image, and transmitting them to the main control module for processing;

[0012] The main control module is used for IC target judgment, photographing opportunity determination and control, and abnormality detection and control according to the acquired vacuum value, Motor step value and IC image;

[0013] The display module is used for displaying IC images in real time, providing a system operation portal and displaying other information;

[0014] The alarm module is used for abnormality alarm according to the corresponding detection result of the abnormality detection.

[0015] Further, the image acquisition module is specifically a set of high-definition image acquisition recognition lenses comprising 8 optical CCDs, which can adjust focal length and light source brightness, and have high stability and definition.

[0016] Further, the communication bus comprises a CDD data bus, a CCD power line, an encoder line, a light source extension line, a 32-way signal line, a host power line, a signal line and a keyboard and mouse line.

[0017] Further, the signal processing module further comprises an encoder card, which is used for reading, recognizing and signal converting the vacuum value, Motor step value and IC image, and transmitting them to the main control module for processing and recognition.

[0018] Further, the main control module further comprises a storage unit, which is used for storing IC images, system programs, detection parameters, light source parameters, various signals and abnormality detection records.

[0019] Further, the IC target judgment is used to determine whether the corresponding area has an IC target by the vacuum value IC judgment technology, and an IC target judgment result is generated, and the specific process is as follows:

[0020] S1: Obtain the high and low level change information generated by the air pressure change of the vacuum suction nozzle of the mounting device;

[0021] S2: Determine whether there is an IC on each suction nozzle according to the high and low level change information generated by the air pressure change:

[0022] If the suction nozzle is low pressure, that is, low level is generated, it is determined that there is an IC target on the vacuum suction nozzle at this time;

[0023] If the suction nozzle is high pressure, that is, high level is generated, it is determined that there is no IC target on the vacuum suction nozzle at this time.

[0024] Further, the photographing opportunity determination and control adopts the Motor step value determination photographing opportunity principle, and determines the IC photographing opportunity based on the IC target judgment result, and the specific process is as follows:

[0025] SS1: Obtain the IC target judgment result, if the IC target judgment result is that the IC target is on the corresponding suction nozzle, call the Motor step value;

[0026] SS2: Compare the Motor step value with the Motor step value threshold set in the storage unit to determine:

[0027] If the Motor step value is within the set Motor step value threshold, it is determined that the mechanical arm has moved to the IC placement position;

[0028] Otherwise, it is determined that the mechanical arm has not moved to the IC placement position;

[0029] SS3: According to the determination that the mechanical arm has moved to the IC placement position, and the IC target detection result is abnormal, the corresponding time is taken as the photographing opportunity, and the system will control the image acquisition module to take a photograph of the abnormal IC.

[0030] Further, the abnormality detection and control are used to detect whether the placement of the IC is normal by using the group comparison logic, and further determine whether the taking and placing action of the mechanical arm on the chip is abnormal, and prevent the abnormal action from causing damage to the chip in time, and the specific process is as follows:

[0031] SSS1: A standard placed IC is framed, a green detection frame of the standard placed IC is set, and the surface brightness feature of the standard placed IC is also set as a detection standard;

[0032] SSS2: Acquire the real-time captured IC image and compare it with the detection standard for judgment:

[0033] If all parts of the IC in the IC image are within the green box area, and the brightness characteristics of the IC surface are consistent with the brightness of the set detection template, then the IC under test is determined to be normal.

[0034] If any part of the IC in the IC image, or even a tiny bit of the IC edge, extends beyond the detection frame, the IC under inspection is determined to be abnormal, and abnormal information is generated.

[0035] SSS3: An abnormal alarm is generated based on the abnormal information, and the system will automatically stop the operation of the control equipment and wait for personnel to handle it.

[0036] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0037] 1. This automatic inspection system for chip production based on optical CCD modules uses a set of high-definition image acquisition and recognition lenses containing eight optical CCDs to acquire and recognize IC images. With the help of its functions of adjusting focus and light source brightness, as well as its high stability and clarity, the quality of the acquired IC images is greatly improved, thereby helping to improve the accuracy of chip anomaly detection.

[0038] 2. The automatic detection system for chip production based on optical CCD module is equipped with a vacuum value reading unit, which acquires the level change information caused by the air pressure change of the vacuum nozzle of the mounted device, and performs high and low level judgment based on the main control module, thereby helping to determine whether there is an IC target on the corresponding nozzle, so as to accurately identify and collect the IC target to be monitored.

[0039] 3. The automatic inspection system for chip production based on optical CCD modules is equipped with a Motor step value reading unit, which reads the Motor step value of the mounted object and compares it with the Motor step value threshold in the main control module to determine the appropriate time to take pictures of the IC target.

[0040] 4. This automated chip production inspection system based on optical CCD modules uses group comparison logic to detect the inspected IC target and determine whether the robotic arm's chip picking and placing actions are abnormal. It selects a standard-placed IC, sets a green detection box for the standard-placed IC, and simultaneously sets the surface brightness characteristics of the standard-placed IC as the detection standard. This helps to detect abnormalities in the robotic arm's chip picking and placing actions in a timely manner. At the same time, the main control module prevents abnormal actions in a timely manner, which helps to avoid direct or indirect damage to the chip and thus helps to reduce the chip damage rate. Attached Figure Description

[0041] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof.

[0042] Figure 1 This is a schematic diagram of the overall structure of an automated chip manufacturing inspection system based on an optical CCD module proposed in this invention. Detailed Implementation

[0043] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0044] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0045] Reference Figure 1 This embodiment discloses an automatic inspection system for chip production based on an optical CCD module, including an image acquisition module, a signal processing module, a main control module, a display module, and an alarm module;

[0046] The image acquisition module, signal processing module, main control module, and alarm module are all electrically connected via a communication bus; the image acquisition module is mounted on a mounted object, specifically a robotic arm.

[0047] Specifically, the communication bus includes the CDD data bus, CCD power line, encoder line, light source extension line, 32 signal lines, host power line, signal lines, and keyboard and mouse lines.

[0048] The signal processing module is specifically a signal acquisition card, which includes a vacuum value reading unit and a motor step value reading unit;

[0049] The vacuum value reading unit is used to read the vacuum value of the mounted object. The vacuum value refers to the change in air pressure at the vacuum nozzle of the mounted device, which causes a change in high or low level, and thus generates a digital signal.

[0050] The Motor step value reading unit is used to read the Motor step value of the mounted object;

[0051] The image acquisition module is used to acquire IC images and other information in real time;

[0052] Specifically, the image acquisition module is specifically a set of high-definition image acquisition recognition lenses containing 8 optical CCDs. The optical CCDs can adjust the focal length and light source brightness, and have high stability and definition.

[0053] It should be noted that the module supports the addition or reduction of CCD lenses according to requirements, and can perform light source brightness compensation and mechanical focusing.

[0054] The signal processing module is used for signal conversion of the collected vacuum value, Motor step value and IC image, and transmission to the main control module for processing.

[0055] Specifically, the signal processing module further includes an encoder card, which is used for reading, identifying and signal converting the vacuum value, Motor step value and IC image, and transmitting to the main control module for identification and processing.

[0056] The main control module is used for IC target judgment, photographing opportunity determination and control, and abnormality detection and control according to the collected vacuum value, Motor step value and IC image.

[0057] Specifically, the main control module further includes a storage unit, which is used for storing IC images, system programs, detection parameters, light source parameters, various signals and abnormality detection records.

[0058] Specifically, the IC target judgment is used to determine whether the corresponding area has an IC target through vacuum value IC judgment technology, and to generate an IC target judgment result. The specific process is as follows: obtaining the air pressure change of the vacuum suction nozzle of the mounting device, and then generating high-low level change information; performing IC target judgment according to the high-low level change information generated by the air pressure change:

[0059] If the suction nozzle is low pressure, i.e. low level, it is determined that the IC target is on the corresponding vacuum suction nozzle.

[0060] If the suction nozzle is high pressure, i.e. high level, it is determined that there is no IC target on the vacuum suction nozzle at this time.

[0061] Specifically, the photographing opportunity determination and control is used to determine the photographing opportunity through Motor step value judgment technology, and to determine whether to take a picture based on the IC target judgment result, and to determine the IC photographing opportunity. The specific process is as follows: obtaining the IC target judgment result, if the IC target judgment result is to determine the IC target in the corresponding area, calling the Motor step value; comparing the Motor step value with the Motor step value threshold in the storage unit to determine:

[0062] If the motor step value is within the motor step value threshold, it is determined that the robot has moved to the IC placement position;

[0063] If not, it is determined that the robot has not moved to the IC placement position;

[0064] According to the determination that the robot has moved to the IC placement position, the corresponding time is taken as the shooting opportunity, and the control module will identify the shooting and control the image acquisition module to shoot the IC;

[0065] Specifically, the abnormality detection and control are used to detect whether the pick-and-place action of the robot on the chip is abnormal by using group comparison logic, and to prevent the abnormal action from causing damage to the chip in time. The specific process is as follows: a standard placed IC is framed, a green detection frame of a normal IC is set, and the surface brightness feature of the standard placed IC is also set as a detection standard at the same time; the real-time acquired IC image is compared with the detection standard to determine whether it is abnormal:

[0066] If all parts of the IC in the IC image are within the green frame area, and the brightness of the IC surface is consistent with the set detection template, it is determined that there is no abnormality;

[0067] If any part of the IC in the IC image, or a very small part of the IC edge, is outside the detection frame, it is determined that the detected IC is abnormal, and abnormal information is formed;

[0068] According to the abnormal information control module, the device will be automatically controlled to stop running and an abnormal alarm will be sent to remind the technical personnel to handle the abnormality.

[0069] The display module is used to display the IC image in real time, provide a system operation portal, and display other information;

[0070] The alarm module is used to alarm according to the corresponding detection result of the abnormality detection.

[0071] This embodiment will introduce the working principle of a chip production automatic detection system based on an optical CCD module according to specific conditions. The specific process is as follows:

[0072] In this embodiment, the signal processing module is specifically a signal acquisition card PCI-9111DG; the vacuum value reading unit in the signal processing module reads the vacuum value of the suction nozzle on the mechanical arm. The vacuum value refers to the change of the air pressure of the vacuum suction nozzle of the mounted device, which causes the change of the high and low levels, and further generates a digital signal;

[0073] In this embodiment, the encoder card is specifically an encoder card DMC3400A; the encoder card reads, identifies and converts the signal of the vacuum value, and transmits it to the main control module for processing and identification;

[0074] In the embodiment, the host module is specifically a system host GKH6588SC. The host module performs IC target judgment according to the collected vacuum value: by obtaining the air pressure change of the vacuum suction nozzle of the mounting device, and then generating high-low level change information, it is determined whether there is an IC on the corresponding suction nozzle.

[0075] If the suction nozzle is low pressure, that is, low level, it is determined that there is an IC target on the corresponding suction nozzle;

[0076] If the suction nozzle is high pressure, that is, high level, it is determined that there is no IC target on the corresponding suction nozzle;

[0077] The Motor step value reading unit in the signal processing module will read the Motor step value of the mounting object according to the determination result of the IC target in the corresponding area, and after recognition and signal conversion by the encoder card, it is transmitted to the system host GKH6588SC;

[0078] The system host GKH6588SC will determine the shooting opportunity and make control actions of shooting or not according to the matching result of the determination result of the IC on the corresponding suction nozzle and the Motor step value threshold set in the system, and the specific process is as follows: obtain the IC target determination result, if the IC target determination result is to determine that the IC target is in the corresponding area, call the Motor step value; compare the Motor step value with the Motor step value threshold in the storage unit to determine:

[0079] If the Motor step value is within the Motor step value threshold, it is determined that the mechanical arm has moved to the IC placement position;

[0080] On the contrary, it is determined that the mechanical arm has not moved to the IC placement position;

[0081] According to the determination that the mechanical arm has moved to the IC placement position, the corresponding time is taken as the shooting opportunity. At this time, if the detection result of the inspected IC target is abnormal, the system control module will control the image acquisition module to take a photo of the abnormal IC target;

[0082] In the embodiment, the image acquisition module is specifically a set of 8-unit CCD module of CM130S-60BL type, which can continuously collect real-time images of ICs and display them in real time through the display module, and after detecting an abnormal IC target, it will take a photo of the abnormal IC target according to the shooting instruction issued by the system host module.

[0083] The system master control host GKH6588SC judges whether the IC target is abnormal according to the IC image collected by the CCD module in real time, and further judges whether the chip taking and placing action of the mechanical arm is abnormal, and the specific process is as follows: a standard placed IC is framed, a green detection frame of a normal IC is set, and the surface brightness feature of the standard placed IC is also set as a detection standard; the real-time collected IC image is acquired, and is compared with the detection standard to judge:

[0084] If all parts of the IC in the IC image are in the green frame area, and the IC surface brightness is consistent with the set detection template brightness, it is judged that there is no abnormality.

[0085] If any part of the IC in the IC image, or a very small point of the IC edge, exceeds the detection frame, it is judged that there is an abnormality, and abnormal information is generated.

[0086] The system master control host GKH6588SC will make an automatic stop device action according to the abnormality detection result, and issue an abnormality alarm through an alarm module to remind the technical personnel to handle the abnormality.

[0087] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. An automatic detection system for chip production based on an optical CCD module, characterized in that, The image acquisition module, the signal processing module, the main control module, the display module and the alarm module are electrically connected through a communication bus. The image acquisition module is installed on the carrying object, and the carrying object is specifically a mechanical arm. The signal processing module is specifically a signal acquisition card, which includes a vacuum value reading unit and a Motor step value reading unit. The vacuum value reading unit is used to read the vacuum value of the carrying object. The Motor step value reading unit is used to read the Motor step value of the carrying object. The image acquisition module is used to collect IC image information in real time. The signal processing module includes a signal conversion unit for converting the collected vacuum value, Motor step value and IC image and transmitting them to the main control module for processing. The main control module is used to determine IC targets, determine and control the photographing time, and detect and control abnormalities according to the collected vacuum value, Motor step value and IC image. The display module is used to display the IC image in real time and provide system operation entry information. The alarm module is used to alarm according to the corresponding detection results of the abnormal detection. The image acquisition module is specifically a set of high-definition image acquisition recognition lenses containing 8 optical CCDs, which can adjust the focal length and light source brightness. The communication bus includes a CDD data bus, a CCD power line, an encoder line, a light source extension line, a 32-way signal line, a host power line, a signal line and a keyboard and mouse line. The signal processing module further includes an encoder card for reading, identifying and signal converting the vacuum value, Motor step value and IC image, transmitting them to the main control module for processing and identification, and compiling the output instructions of the main control module to generate a photograph, not to photograph and to make an alarm action. The main control module further includes a storage unit for storing IC images, system programs, detection parameters, light source parameters, various signals and abnormal detection records.

2. The automatic chip production detection system based on the optical CCD module according to claim 1, characterized in that, The IC target determination is used to determine whether the corresponding area has an IC target through vacuum value IC determination technology to generate an IC target determination result, and the specific process is as follows: S1: Obtain the pressure change of the vacuum nozzle of the carrying object, and generate high-low level change information. S2: Determine whether there is an IC on each nozzle according to the high-low level change information caused by the pressure change. If the nozzle is low pressure, i.e. low level, it is determined that there is an IC target on the vacuum nozzle at this time. If the nozzle is high pressure, i.e. high level, it is determined that there is no IC target on the vacuum nozzle at this time.

3. The automatic chip production detection system based on the optical CCD module according to claim 1, characterized in that, The photographing time determination and control adopts the Motor step value determination photographing time principle, and determines whether to photograph based on the IC target determination result to determine the IC photographing time, and the specific process is as follows: SS1: Obtain the IC target determination result, if the IC target determination result is that the IC target is determined to be on the corresponding suction nozzle, call the motor step value; SS2: Compare the motor step value with the motor step value threshold set in the storage unit to determine: If the motor step value is within the set motor step value threshold, it is determined that the mechanical arm has moved to the IC placement position; Otherwise, it is determined that the mechanical arm has not moved to the IC placement position; SS3: According to the determination that the mechanical arm has moved to the IC placement position and the IC target detection result is abnormal, the corresponding time is taken as the shooting opportunity, and the system will control the image acquisition module to take a photo of the abnormal IC.

4. The automatic chip production detection system based on the optical CCD module according to claim 1, characterized in that, The abnormality detection and control are used to detect whether the IC is normally placed by using group comparison logic to further determine whether the mechanical arm action of picking and placing the chip is abnormal, and to prevent the abnormal action from causing damage to the chip in time. The specific process is as follows: SSS1: A normally placed IC is framed to set a green detection frame of a standard placed IC, and the surface brightness feature of the standard placed IC is also set as a detection standard; SSS2: Obtain the real-time collected IC image, compare it with the detection standard to determine: If all parts of the IC in the IC image are within the green detection frame area, and The brightness feature of the IC surface is consistent with the set detection template brightness, it is determined that the detected IC is normal; If any part of the IC in the IC image, or a very small point of the IC edge, exceeds the detection frame, it is determined that the detected IC is abnormal, and abnormal information is generated; SSS3: According to the abnormal information, an abnormal alarm is generated, and the system will control the equipment to automatically stop running and wait for personnel to handle.

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