Inspection devices, control methods and control procedures

Abstract

The present invention provides an inspection device, control method, and control program for selecting an appropriate temperature sensor for temperature control during inspection of an object to be inspected. The inspection device of the present invention includes: an acquisition unit that acquires first coordinate information indicating the position of the object to be inspected on a mounting platform and a plurality of second coordinate information indicating the positions of a plurality of temperature sensors on the mounting platform during inspection of the object to be inspected; a calculation unit that calculates the Mahalanobis distance between a position determined by an average vector of the first coordinate information and the positions of the plurality of temperature sensors; a selection unit that selects at least one temperature sensor, including the temperature sensor with the smallest Mahalanobis distance; and a control unit that uses temperature data measured by the selected temperature sensor to control the temperature of the object to be inspected.

Description

Technical Field

[0001] The present invention relates to an inspection device, a control method and a control program. Background Art

[0002] Generally, the electrical characteristics of electronic devices (objects under inspection) are inspected using a predetermined inspection apparatus. Specifically, a wafer with electronic devices mounted thereon is fixed to a mounting table (chuck), and electrical power from a tester is supplied to the electronic devices using probes or the like to conduct the inspection.

[0003] In such an inspection apparatus, a temperature controller disposed inside a mounting table is used to control the temperature of the electronic device during inspection. In this case, the inspection apparatus selects a temperature sensor closest to the electronic device to be inspected from among a plurality of temperature sensors to perform temperature control.

[0004] The temperature sensor closest to the electronic device is, for example, a temperature sensor with the shortest physical distance from a position determined by the average value (i.e., average vector) of coordinates representing the positions of the electronic devices when multiple electronic devices are arranged on a wafer.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2009-21311 Summary of the Invention

[0008] Technical problem to be solved by the invention

[0009] However, when a plurality of electronic devices are arranged on a wafer in an uneven distribution, the temperature sensor located closest to the electronic device is not necessarily the most suitable temperature sensor for temperature control.

[0010] The present invention provides an inspection device, a control method and a control program for selecting an appropriate temperature sensor to perform temperature control when inspecting an object to be inspected.

[0011] Technical solutions to technical problems

[0012] An inspection device according to one aspect of the present invention has, for example, the following structure. Specifically, it includes:

[0013] an acquisition unit that acquires first coordinate information indicating a position of the inspection object on the mounting table and a plurality of second coordinate information indicating positions of a plurality of temperature sensors on the mounting table when the inspection object is detected;

[0014] a calculation unit configured to calculate a Mahalanobis distance between a position specified by an average vector of the first coordinate information and positions of the plurality of temperature sensors;

[0015] a selection unit that selects at least one temperature sensor including the temperature sensor with the smallest Mahalanobis distance; and

[0016] The control unit controls the temperature of the inspection object using the temperature data measured by the selected temperature sensor.

[0017] Effects of the Invention

[0018] The present invention can provide an inspection apparatus, a control method, and a control program for selecting an appropriate temperature sensor to perform temperature control when inspecting an object to be inspected. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic cross-sectional view showing a structural example of an inspection device.

[0020] Figure 2 This is a diagram showing an example of the hardware configuration of the control device.

[0021] Figure 3 It is a diagram showing details of the configuration related to the temperature control function among the various configurations of the inspection device.

[0022] Figure 4 This is a diagram showing an example of the positional relationship between electronic components and temperature sensors during inspection.

[0023] Figure 5 This is a diagram showing an example of the functional configuration of a temperature sensor selection unit of a control device.

[0024] Figure 6 It is a diagram showing a specific example of the processing performed by the temperature sensor selection unit.

[0025] Figure 7 It is a diagram showing the details of the processing performed by the Mahalanobis distance calculation unit.

[0026] Figure 8 This is a flowchart showing the flow of inspection processing in the inspection device.

[0027] Figure 9 This is a flowchart showing the flow of temperature sensor selection processing.

[0028] Figure 10 This is a diagram showing another example of the positional relationship between the electronic component and the temperature sensor during inspection.

[0029] Description of Reference Numerals

[0030] 100: Inspection device

[0031] 110: Loading room

[0032] 120: Storage room

[0033] 121: Main chuck

[0034] 122: Probe Card

[0035] 122A: Probe Group

[0036] 123: Alignment mechanism

[0037] 124: Temperature regulator control circuit

[0038] 125: Control device

[0039] 130: Test head

[0040] 131: Tester

[0041] 220_1 to 220_4: Temperature sensors

[0042] 310: Temperature regulator

[0043] 320: Temperature sensor selection unit

[0044] 330: Temperature control department

[0045] 501: Electronic device location information acquisition unit

[0046] 502: Temperature sensor position information acquisition unit

[0047] 503: Average vector calculation unit

[0048] 504: Mahalanobis distance calculation unit

[0049] 505: Selection Department. DETAILED DESCRIPTION

[0050] In the present specification and the drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and repeated descriptions are omitted.

[0051] [First embodiment]

[0052] <Configuration Example of Inspection Device>

[0053] First, a configuration example of the inspection device according to the first embodiment will be described. Figure 1 : is a cross-sectional schematic diagram showing a structural example of an inspection device. Figure 1 As shown, the inspection apparatus 100 includes a loader chamber 110 , a storage chamber 120 , a test head 130 , a tester 140 , and a display device 150 .

[0054] The loader chamber 110 has a mechanism for taking out wafers W stored in a transport container and transporting them to the storage chamber 120. The loader chamber 110 also has a mechanism for receiving wafers W after electrical characteristics inspection of electronic devices is completed and storing them in a transport container.

[0055] The storage chamber 120 includes a main chuck 121 , a probe card 122 , an alignment mechanism 123 , a temperature regulator control circuit 124 , and a control device 125 .

[0056] The main chuck 121 is an example of a mounting table, which fixes the wafer W and moves it in the horizontal and vertical directions to adjust the relative position of the probe card 122 and the wafer W. In this way, the main chuck 121 can bring the electrodes of the electronic components arranged on the wafer W into contact with the probe group 122A of the probe card 122.

[0057] The probe card 122 is positioned above the main chuck 121 and is electrically connected to the test head 130 via an interface 122B. The probe group 122A contacts electrodes of electronic devices disposed on the wafer W, thereby supplying electrical power from the test head 130 to the electronic devices via the interface 122B. In response to the supply of electrical power, the electronic devices transmit signals to the test head 130 via the interface 122B.

[0058] The alignment mechanism 123 acquires data for alignment adjustment between the probe group 122A of the probe card 122 and the electrode pads of the electronic device on the wafer W fixed to the main chuck 121 .

[0059] Specifically, the alignment mechanism 123 includes an alignment bridge 123A that moves horizontally between the back surface of the storage chamber 120 and the detection center, and a first imaging device 123B provided on the alignment bridge 123A.

[0060] The first imaging device 123B moves from the back side of the storage chamber 120 to the detection center using the alignment bridge 123A, thereby moving to a position between the probe card 122 and the main chuck 121. Furthermore, while the main chuck 121 is moving horizontally, the first imaging device 123B detects the positions of the electrodes of the electronic components arranged on the wafer W at this position.

[0061] The alignment mechanism 123 further includes a second imaging device 123C. After the alignment bridge 123A retreats to the back of the storage chamber 120 , the second imaging device 123C detects the position of the probe group 122A from below the probe card 122 while the main chuck 121 moves horizontally below the probe card 122 .

[0062] To perform a high-temperature or low-temperature inspection of the electronic components on wafer W, the temperature regulator control circuit 124 operates a temperature regulator (not shown) mounted within the main chuck 121. This allows the electronic components on wafer W, secured to the main chuck 121, to be heated or cooled within a set target temperature range. Furthermore, multiple temperature sensors (not shown) are mounted within the main chuck 121. Temperature data measured by any selected temperature sensor is used as temperature data for the electronic components mounted on wafer W.

[0063] The control device 125 performs temperature control of electronic components of the wafer W fixed to the main chuck 121 , horizontal and vertical movement control of the main chuck 121 , movement control of the alignment mechanism 123 , and the like.

[0064] Test head 130 is connected to tester 140. Tester 140 includes a test board that reproduces a portion of the circuit configuration of a motherboard on which electronic components are mounted. The test board is connected to control device 125, which determines whether the electronic components are functioning properly based on signals from the electronic components. Tester 140 can reproduce the circuit configurations of various motherboards by replacing the test board.

[0065] The display device 150 displays various data including the set target temperature, image data captured by the first and second imaging devices 123B and 123C, and the like.

[0066] <Hardware Structure of Control Device>

[0067] Next, the hardware configuration of the control device 125 will be described. Figure 2 It is a diagram showing an example of the hardware configuration of the control device 125 .

[0068] like Figure 2 As shown, the control device 125 includes a processor 201, a memory 202, an auxiliary storage device 203, an I / F (Interface) device 204, a communication device 205, and a drive device 206. The hardware components of the control device 125 are interconnected via a bus 207.

[0069] The processor 201 includes various computing devices such as a CPU (Central Processing Unit) and reads various programs (for example, a control program described later) from the memory 202 and executes them.

[0070] The memory 202 includes a main storage device such as ROM (Read Only Memory) or RAM (Random Access Memory). The processor 201 and the memory 202 form a so-called computer. The processor 201 executes various programs read from the memory 202, thereby realizing various functions of the computer.

[0071] The auxiliary storage device 203 stores various programs and various data used when the processor 201 executes the various programs.

[0072] The I / F device 204 is a connection device that connects the temperature regulator control circuit 124 , a plurality of temperature sensors (here, temperature sensors 220_1 to 220_4 are exemplified), the display device 150 , and the like, as examples of external devices, to the control device 125 .

[0073] The communication device 205 is a communication device for communicating with the tester 140 .

[0074] Drive 206 is a device for placing recording medium 210. Recording medium 210 herein includes media that record information optically, electrically, or magnetically, such as CD-ROMs, floppy disks, and magneto-optical disks. Recording medium 210 may also include semiconductor memories that store information electronically, such as ROMs and flash memories.

[0075] The various programs installed in the auxiliary storage device 203 can be installed by, for example, placing the recording medium 210 containing the programs in the drive device 206 and having the drive device 206 read the various programs recorded in the recording medium 210. Alternatively, the various programs installed in the auxiliary storage device 203 can be downloaded from a network via the communication device 205.

[0076] <Structure related to temperature control function>

[0077] Next, among the components of the inspection apparatus 100 , a description will be given of a component related to a temperature control function for controlling the temperature of electronic components during inspection. Figure 3 This is a diagram showing a configuration related to a temperature control function among various configurations of the inspection apparatus.

[0078] like Figure 3 As shown, the structure related to the temperature control function in the inspection device 100 includes:

[0079] The temperature regulator 310 and temperature sensors 220_1 to 220_4 installed in the main chuck 121;

[0080] Temperature regulator control circuit 124;

[0081] The temperature sensor selection unit 320 and the temperature control unit 330 implemented in the control device 125 .

[0082] Furthermore, a control program is installed in the control device 125 , and by executing the program, the control device 125 functions as at least a temperature sensor selection unit 320 and a temperature control unit 330 .

[0083] like Figure 3 As shown, when the target temperature is set in the temperature control unit 330 and temperature control is started, the temperature control unit 330 calculates a control amount corresponding to the set target temperature and sends it to the temperature regulator control circuit 124. The temperature regulator control circuit 124 sends an operation signal corresponding to the notified control amount to the temperature regulator 310, thereby operating the temperature regulator 310.

[0084] When the temperature of the main chuck 121 changes due to the operation of the temperature regulator 310 , the temperature sensors 220_1 to 220_4 detect this change and feed back the temperature data to the temperature control unit 330 .

[0085] Temperature control unit 330 obtains temperature data from the temperature sensor preselected by temperature sensor selection unit 320, among the temperature data fed back from temperature sensors 220_1 to 220_4, and calculates the difference between the temperature data and the target temperature. Temperature control unit 330 also calculates a control variable based on the calculated difference (based on the difference, the differential value of the difference, or the integrated value of the difference) and transmits it to temperature regulator control circuit 124.

[0086] In this manner, the temperature control unit 330 feeds back the temperature data and performs temperature control of the electronic device through PID control.

[0087] Furthermore, the temperature sensor selection unit 320 pre-selects a temperature sensor suitable for temperature control based on the “number and positions of electronic components to be inspected” and the “positions of the temperature sensors 220_1 to 220_4 ” and notifies the temperature control unit 330 .

[0088] The number and positions of the electronic components to be inspected can be determined by, for example, pre-receiving component configuration information from the control device 125 and reading this information from the temperature sensor selection unit 320. Alternatively, if an imaging device for inspecting electronic components is installed within the storage chamber 120, the number and positions of the electronic components can be determined based on images captured by the imaging device (device inspection results). Furthermore, the positions of the temperature sensors 220_1 to 220_4 can be determined by the temperature sensor selection unit 320 reading sensor configuration information pre-received by the inspection apparatus 100.

[0089] <Positional Relationship Between Inspection Object and Temperature Sensor During Inspection>

[0090] Next, the positional relationship between the electronic component to be inspected and the temperature sensor during inspection will be described. Figure 4 This is a diagram showing an example of the positional relationship between electronic components and temperature sensors during inspection, showing the positional relationship between electronic components and temperature sensors arranged on wafer W when wafer W is fixed to the main chuck 121 during inspection, as viewed from above.

[0091] in, Figure 4 The example (a) shows the positional relationship between four temperature sensors 220_1 to 220_4 and one electronic device 401 as an inspection object. Figure 4 In (a), the dotted lines represent the average value of the longitudinal direction and the average value of the transverse direction of the coordinates for indicating the position of the electronic device 401. Figure 4 In (a), the intersection of the dotted lines becomes the average vector of the electronic device 401.

[0092] in addition, Figure 4 The example (b) shows the positional relationship between the four temperature sensors 220_1 to 220_4 and the four electronic devices 411 to 414 to be inspected. Figure 4 In (b), the dotted lines represent the average values of the vertical and horizontal coordinates for indicating the positions of the electronic devices 411 to 414. Figure 4 In (b), the intersection of the dotted lines becomes the average vector of the electronic devices 411 to 414.

[0093] in addition, Figure 4 The example (c) shows the positional relationship between the four temperature sensors 220_1 to 220_4 and the four electronic devices 421 to 424 to be inspected. Figure 4 In (c), the dotted lines represent the average values of the vertical and horizontal coordinates for indicating the positions of the electronic devices 421 to 424. Figure 4 In (c), the intersection of the dotted lines becomes the average vector of the electronic devices 421 to 424.

[0094] As described above, the number and position (ie, distribution) of the electronic components to be inspected vary, and the positional relationship with the temperature sensors 220_1 to 220_4 also changes depending on the number and position (distribution) of the electronic components to be inspected.

[0095] So, for example, Figure 4As in example (c), when the four electronic devices 421 to 424 are arranged in an uneven distribution from the upper left to the lower right, the temperature sensor closest to the average vector is not necessarily the temperature sensor suitable for temperature control.

[0096] exist Figure 4 In the example of (c), the temperature sensor closest to the position determined by the average vector (the intersection of the dotted lines) is temperature sensor 220_3, but the temperature sensor closest to the dotted line extending from the upper left to the lower right is temperature sensor 220_1.

[0097] Here, in order to properly control the temperature of the electronic device, it is necessary to use representative temperature data related to the electronic device to be inspected. Therefore, as described above, in the case where the positional relationship between the temperature sensors 220_1 to 220_4 changes depending on the distribution of the electronic devices to be inspected, it is necessary to select a temperature sensor that can measure representative temperature data based on the distribution. That is, in Figure 4 In the example of (c), it is preferable to select the temperature sensor 220_1 instead of the temperature sensor 220_3 to perform temperature control.

[0098] Thus, the control device 125 of the present embodiment is configured to be able to select temperature sensors according to the number and positions (distribution) of electronic components to be inspected.

[0099] <Functional Structure of Temperature Sensor Selection Section>

[0100] Next, the function of the temperature sensor selection unit among the functions realized by the execution of the control program in the control device 125 will be described. Figure 5 FIG. 1 is a diagram showing an example of the functional structure of the temperature sensor selection unit of the control device. Figure 5 As shown, the temperature sensor selection unit 320 includes an electronic device position information acquisition unit 501 , a temperature sensor position information acquisition unit 502 , an average vector calculation unit 503 , a Mahalanobis distance calculation unit 504 , and a selection unit 505 .

[0101] The electronic device position information acquisition unit 501 is an example of an acquisition unit. It acquires coordinates (first coordinate information) indicating the position of the electronic device to be inspected and notifies the coordinates to the average vector calculation unit 503 and the Mahalanobis distance calculation unit 504. The electronic device position information acquisition unit 501 acquires the coordinates of each vertex (the coordinates of four points) of the electronic device to be inspected.

[0102] Specifically, when there is one electronic component to be inspected, the electronic component position information acquiring unit 501 acquires coordinates of four points. Alternatively, when there are four electronic components to be inspected, the electronic component position information acquiring unit 501 acquires coordinates of 16 points.

[0103] The temperature sensor position information acquisition unit 502 is an example of an acquisition unit, and acquires coordinates (second coordinate information) indicating the positions of the temperature sensors and notifies the Mahalanobis distance calculation unit 504. The temperature sensor position information acquisition unit 502 acquires the coordinates of the center point of each temperature sensor.

[0104] Specifically, when there are four temperature sensors, the temperature sensor position information acquiring unit 502 acquires the coordinates of the four points.

[0105] The average vector calculation unit 503 calculates an average vector (the average value of each coordinate) based on the coordinates representing the position of the electronic device to be inspected, and notifies the average vector to the Mahalanobis distance calculation unit 504. For example, if there is only one electronic device to be inspected, the average vector of the electronic device to be inspected is calculated using the average value of the coordinates of each vertex of the electronic device (the coordinates of four points). Alternatively, if there are four electronic devices to be inspected, the average vector of the electronic device to be inspected is calculated using the average value of the coordinates of each vertex of the four electronic devices (the coordinates of a total of 16 points).

[0106] The Mahalanobis distance calculation unit 504 is an example of a calculation unit.

[0107] It is based on

[0108] The coordinates indicating the position of the electronic device to be inspected, notified from the electronic device position information acquisition unit 501,

[0109] The average vector of the electronic device to be inspected, notified from the average vector calculation unit 503,

[0110] The coordinates indicating the position of the temperature sensor notified from the temperature sensor position information acquisition unit 502,

[0111] The Mahalanobis distance between the position specified by the average vector of the electronic device to be inspected and the position of each temperature sensor is calculated. The Mahalanobis distance calculation unit 504 notifies the selection unit 505 of the calculated Mahalanobis distance between the position of each temperature sensor.

[0112] The selection unit 505 selects a temperature sensor having the smallest Mahalanobis distance from the positions of the temperature sensors notified from the Mahalanobis distance calculation unit 504 , and notifies the temperature control unit 330 of the selected temperature sensor.

[0113] By calculating the Mahalanobis distance in this manner, it is possible to select temperature sensors that correspond to the number and location (distribution) of electronic components to be inspected. Consequently, the temperature control unit 330 can use appropriate temperature sensors to control the temperature of the electronic components to be inspected.

[0114] <Specific Example of Processing by Temperature Sensor Selection Section>

[0115] Next, a specific example of the processing performed by the temperature sensor selection unit 320 will be described. Figure 6 is a diagram showing a specific example of the processing performed by the temperature sensor selection unit. Figure 4 The positional relationships between the electronic components and the temperature sensors shown in (a) to (c) of FIG. 1 show specific examples of processing when the temperature sensor selection unit 320 selects one temperature sensor.

[0116] like Figure 6 As shown in (a), the electronic device position information acquisition unit 501 acquires the coordinates representing the position of the electronic device 401 (see the four black dots). In addition, the average vector calculation unit 503 calculates the average vector based on the coordinates representing the position of the electronic device 401 (see the × mark). Furthermore, the Mahalanobis distance calculation unit 504 calculates the Mahalanobis distance between the position determined by the average vector of the electronic device 401 and the positions of the four temperature sensors 220_1 to 220_4. Figure 6 In (a), a plurality of dashed concentric circles represent positions where Mahalanobis distances are equal when viewed from a position determined by the average vector of the electronic device 401 .

[0117] according to Figure 6 In the example of (a), the selection unit 505 selects the temperature sensor 220_3 having the smallest Mahalanobis distance from the position specified by the mean vector of the electronic device 401. In this way, the temperature sensor selection unit 320 can select an appropriate temperature sensor even when only one electronic device to be inspected is provided.

[0118] In addition, if Figure 6 As shown in (b), the electronic device position information acquisition unit 501 acquires the coordinates representing the positions of the electronic devices 411 to 414 (see 16 black dots). In addition, the average vector calculation unit 503 calculates the average vector based on the coordinates representing the positions of the electronic devices 411 to 414 (see the × mark). Furthermore, the Mahalanobis distance calculation unit 504 calculates the Mahalanobis distance between the position determined by the average vector of the electronic devices 411 to 414 and the position of each of the four temperature sensors 220_1 to 220_4. Figure 6In (b), a plurality of dashed concentric circles represent positions where Mahalanobis distances are equal when viewed from a position determined by the average vector of the electronic devices 411 to 414 .

[0119] according to Figure 6 In the example of (b), the selection unit 505 selects the temperature sensor 220_3 having the smallest Mahalanobis distance from the position specified by the average vector of the electronic devices 411 to 414. Thus, the temperature sensor selection unit 320 can select an appropriate temperature sensor even when multiple electronic devices to be inspected are evenly distributed.

[0120] In addition, if Figure 6 As shown in (c), the electronic device position information acquisition unit 501 acquires the coordinates representing the positions of the electronic devices 421 to 424 (see 16 black dots). In addition, the average vector calculation unit 503 calculates the average vector based on the coordinates representing the positions of the electronic devices 421 to 424 (see the × mark). Furthermore, the Mahalanobis distance calculation unit 504 calculates the Mahalanobis distance between the position determined by the average vector of the electronic devices 421 to 424 and the position of each of the four temperature sensors 220_1 to 220_4. Figure 6 In (c), a plurality of dotted concentric ellipses represent positions where the Mahalanobis distances are equal when viewed from the position determined by the average vector of the electronic devices 421 to 424 .

[0121] according to Figure 6 In the example of (c), the selection unit 505 selects the temperature sensor 220_1 having the smallest Mahalanobis distance from the position specified by the average vector of the electronic devices 421 to 424. Thus, the temperature sensor selection unit 320 can select an appropriate temperature sensor even when the plurality of electronic devices to be inspected are arranged in an uneven distribution.

[0122] <Details of Processing by the Mahalanobis Distance Calculation Unit>

[0123] Next, details of the process performed by the Mahalanobis distance calculation unit 504 when calculating the Mahalanobis distance between the position specified by the average vector of the electronic device and the position of each of the temperature sensors 220_1 to 220_4 will be described. Figure 7 It is a diagram showing the details of the processing performed by the Mahalanobis distance calculation unit.

[0124] like Figure 7 As shown, the Mahalanobis distance dis(Tx, Ty) between the temperature sensor 220_1 and the temperature sensor 220_1 is calculated based on the following formula 1, for example.

[0125]

[0126] in,

[0127]

[0128] In the above formula 1, p n x represents the x-coordinate for indicating the position of the n-th (here, n=1) temperature sensor 220_1, p n y Ave represents the y coordinate for indicating the position of the nth (n=1 in this case) temperature sensor 220_1. x Ave represents the x-coordinate of the average vector of the electronic device to be inspected. y represents the y-coordinate of the average vector of the electronic device to be inspected. Furthermore, N represents the number of coordinates used to represent the position of the electronic device to be inspected. For example, if there is one electronic device to be inspected, N = 4; if there are four electronic devices to be inspected, N = 16.

[0129] Similarly, the Mahalanobis distance calculation unit 504 also calculates the Mahalanobis distance dis(T x ,T y ).

[0130] <Inspection Process>

[0131] Next, the flow of the inspection process in the inspection apparatus 100 will be described. Figure 8 This is a flow chart showing the flow of inspection processing in the inspection device. Figure 8 (a) shows the flow of the inspection process when the number and positions of electronic components to be inspected are acquired by reading the component arrangement information.

[0132] In step S801 , the inspection apparatus 100 reads device configuration information of electronic devices to be inspected, and acquires the number and positions of the electronic devices to be inspected.

[0133] In step S802, the inspection apparatus 100 performs a temperature sensor selection process to select temperature sensors corresponding to the number and positions of the electronic components to be inspected. The temperature sensor selection process will be described in detail later.

[0134] In step S803 , the inspection apparatus 100 moves the wafer W on which the electronic devices to be inspected are arranged to an inspection position.

[0135] In step S804 , the inspection apparatus 100 performs temperature control of the main chuck using the temperature data measured by the temperature sensor selected in step S802 .

[0136] In step S805 , the inspection apparatus 100 inspects the electrical characteristics of the electronic device to be inspected.

[0137] In this way, when the number and positions of electronic devices to be inspected are acquired by reading device arrangement information, the temperature sensor selection process can be executed before moving the wafer W on which the electronic devices to be inspected are arranged to the inspection position.

[0138] on the other hand, Figure 8 (b) shows the flow of the inspection process when the number and positions of electronic components to be inspected are acquired based on the component inspection results.

[0139] In step S811 , the inspection apparatus 100 moves the wafer W on which electronic devices to be inspected are arranged to an inspection position.

[0140] In step S812 , the inspection apparatus 100 acquires the number and positions of the electronic components to be inspected based on the device inspection results obtained by imaging the electronic components to be inspected.

[0141] In step S813, the inspection apparatus 100 performs a temperature sensor selection process to select temperature sensors corresponding to the number and positions of the electronic components to be inspected. The temperature sensor selection process will be described in detail later.

[0142] In step S814 , the inspection apparatus 100 performs temperature control of the main chuck using the temperature data measured by the temperature sensor selected in step S813 .

[0143] In step S815 , the inspection apparatus 100 inspects the electrical characteristics of the electronic device to be inspected.

[0144] In this way, when the number and positions of electronic devices to be inspected are determined based on the device inspection results, the temperature sensor selection process can be executed after the wafer W, on which the electronic devices to be inspected are arranged, is moved to the inspection position. This allows, for example, the selection of appropriate temperature sensors even when inspecting electronic devices at a number or position different from the previously acquired device arrangement information.

[0145] Furthermore, examples of inspecting with a number or position different from the device arrangement information acquired in advance include performing a second inspection after the first inspection is completed, removing electronic devices determined to be good.

[0146] <Flow of Temperature Sensor Selection Processing by Temperature Sensor Selection Section>

[0147] Then, Figure 8 The flow of the temperature sensor selection process shown in steps S802 and 813 will be described. Figure 9 This is a flowchart showing the flow of temperature sensor selection processing.

[0148] In step S901 , the average vector calculation unit 503 calculates an average vector based on the number and positions of electronic components to be inspected.

[0149] In step S902 , the temperature sensor position information acquisition unit 502 acquires the position of each temperature sensor.

[0150] In step S903 , the Mahalanobis distance calculation unit 504 calculates the Mahalanobis distance between the position specified by the average vector of the electronic device to be inspected and the position of each temperature sensor.

[0151] In step S904 , the selection unit 505 selects a temperature sensor having the smallest Mahalanobis distance from a position specified by the average vector of the electronic device to be inspected.

[0152] Summary

[0153] As can be seen from the above description, the inspection device 100 of the first embodiment:

[0154] Acquiring coordinates indicating the position of the electronic device in the main chuck and the coordinates indicating the positions of a plurality of temperature sensors in the main chuck when inspecting the electrical characteristics of the electronic device;

[0155] Calculating an average vector based on coordinates representing the position of the electronic device in the master chuck, and calculating Mahalanobis distances between the position determined by the calculated average vector and the positions of each of the plurality of temperature sensors;

[0156] Select the temperature sensor with the smallest calculated Mahalanobis distance;

[0157] Use the temperature data measured by the selected temperature sensor to perform temperature control of electronic devices.

[0158] As described above, in the inspection apparatus of the first embodiment, by calculating the Mahalanobis distance from the position specified by the mean vector of the inspection object, it is possible to select a temperature sensor that corresponds to the distribution of the inspection object.

[0159] As a result, according to the first embodiment, when inspecting a test object, it is possible to select an appropriate temperature sensor and perform temperature control.

[0160] [Second embodiment]

[0161] In the first embodiment, the positional relationship between the electronic device to be inspected and the temperature sensor is exemplified. Figure 4 However, the positional relationship between the electronic device to be inspected and the temperature sensor is not limited to Figure 4 The situation shown. Figure 10 This is a diagram showing another example of the positional relationship between the electronic component and the temperature sensor during inspection.

[0162] in, Figure 10 (a) shows that there are 9 electronic devices to be inspected, and each electronic device is arranged in a grid. Figure 10 (b) shows that there are four electronic devices to be inspected, and each electronic device is arranged in a horizontal row. Figure 10 (c) shows a case where there are three electronic components to be inspected, and the electronic components are arranged in a horizontal row with one component being skipped.

[0163] exist Figure 10 In any of the cases shown in (a) to (c), an appropriate temperature sensor can be selected by executing the temperature sensor selection process described in the first embodiment to select a temperature sensor.

[0164] [Third embodiment]

[0165] In the above embodiments, the case of selecting a temperature sensor having the smallest Mahalanobis distance from a position determined by the average vector of the electronic device is described. However, the method of selecting a temperature sensor is not limited to this. For example, the first m (m is an integer greater than or equal to 1) temperature sensors arranged in order of the smallest Mahalanobis distance may be selected.

[0166] In this case, the temperature data measured by the m temperature sensors may be weighted and added according to the calculated Mahalanobis distance.

[0167] In addition, in the above embodiments, the coordinates of each vertex of the electronic device are used as the coordinates indicating the position of the electronic device. However, the coordinates indicating the position of the electronic device are not limited to the coordinates of each vertex of the electronic device. For example, the coordinates of points distributed two-dimensionally on the electronic device, such as the coordinates of the midpoints of each side of the electronic device, may also be used.

[0168] In addition, the present invention can be combined with other elements on the structure etc. listed in the above embodiment, and is not limited to the structure shown here. About these aspects, can be changed within the scope of not departing from the gist of the present invention, can be appropriately determined according to its application mode.

Claims

1. An inspection device, characterized in that: include: an acquisition unit that acquires first coordinate information indicating a position of the inspection object on the mounting table and a plurality of second coordinate information indicating positions of a plurality of temperature sensors on the mounting table when inspecting the inspection object; a calculation unit that calculates a Mahalanobis distance between a position specified by an average vector of the first coordinate information and positions of the plurality of temperature sensors; a selection unit configured to select at least one temperature sensor including the temperature sensor having the smallest Mahalanobis distance; as well as The control unit controls the temperature of the inspection object using the temperature data measured by the selected temperature sensor.

2. The inspection device according to claim 1, wherein: The average vector of the first coordinate information is an average value of the x-coordinate and an average value of the y-coordinate among the coordinates indicating the position of the subject.

3. The inspection device according to claim 1, wherein: The selection unit selects first m temperature sensors arranged in order of shorter Mahalanobis distances, where m is an integer greater than or equal to 1.

4. The inspection device according to claim 3, characterized in that: When the selection unit selects a plurality of temperature sensors, the control unit performs weighted addition on each temperature data measured by the selected plurality of temperature sensors according to the Mahalanobis distance.

5. The inspection device according to claim 1, wherein: The acquisition unit acquires the first coordinate information by imaging the inspection object moved to the inspection position.

6. The inspection device according to claim 1, wherein: The first coordinate information acquired by the acquisition unit is the coordinates of each vertex of the inspection object.

7. A control method, characterized in that: include: an acquisition step of acquiring first coordinate information indicating a position of the inspection object on the mounting table and a plurality of second coordinate information indicating positions of a plurality of temperature sensors on the mounting table when the inspection object is inspected; a calculating step of calculating a Mahalanobis distance between a position determined by an average vector of the first coordinate information and positions of the plurality of temperature sensors; a selection step of selecting at least one temperature sensor including the temperature sensor with the smallest Mahalanobis distance; as well as A control step of controlling the temperature of the inspection object using the temperature data measured by the selected temperature sensor.

8. A program product, characterized in that: The program product includes a control program, When the control program is executed by a computer, it realizes: an acquisition step of acquiring first coordinate information indicating a position of the inspection object on the mounting table and a plurality of second coordinate information indicating positions of a plurality of temperature sensors on the mounting table when the inspection object is inspected; a calculating step of calculating a Mahalanobis distance between a position determined by an average vector of the first coordinate information and positions of the plurality of temperature sensors; a selection step of selecting at least one temperature sensor including the temperature sensor with the smallest Mahalanobis distance; as well as A control step of controlling the temperature of the inspection object using the temperature data measured by the selected temperature sensor.

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