A Structure-Embedded On-Chip Calibration Component and Its Calibration Test Method

Abstract

The present invention discloses an in - chip calibration component with an embedded structure and its calibration test method. It includes seven calibration components, all of which include a substrate and a metal layer. The metal layer includes ground conductors on both sides and replaceable structures at both ends of the middle gap. The ground conductors are made of metal sheets, and the replaceable structure includes a fixed area and a replaceable area. The fixed area is adjacent to the edge of the substrate, and the replaceable area adjacent to the fixed area is one of four structures; the scattering parameter matrix and parasitic parameters of all calibration components are obtained through testing and input into a 16 - term error model for calibration fitting, and the scattering parameter matrix of the device under test is input into the 16 - term error model after calibration fitting to output the scattering parameter measurement value. By embedding the open - circuit, short - circuit, and load structures, the present invention avoids the change of parasitic parameters caused by the contact between the probe and calibration components of different structures, effectively reduces the test error, improves the accuracy of in - chip calibration, simplifies the structure of the calibration component, has no via - hole design, and reduces the difficulty of processing and manufacturing the calibration component.

Description

Technical Field

[0001] The invention relates to an on-wafer calibration piece in the technical field of on-wafer testing and calibration of microwave devices, and in particular to an on-wafer calibration piece with an embedded structure and a testing method thereof. Background Art

[0002] On-wafer testing of microwave devices refers to the process of directly measuring the scattering parameters of wafers or bare chips using a vector network analyzer and a microwave probe. Since the microwave probe itself will affect the test results, an on-wafer calibration piece is required to calibrate the error introduced by the microwave probe before testing. The purpose is to move the calibration reference plane from the coaxial end face of the vector network analyzer to the probe tip. The difference between an on-wafer calibration piece and a traditional coaxial calibration piece is that an on-wafer calibration piece is a planar device designed on a substrate material. On-wafer calibration pieces can be divided into two categories based on the substrate material. One category uses a ceramic substrate and is suitable for test pieces made on different substrates, with a wider range of applications. The other category uses the same substrate material as the test piece, usually a special calibration piece made on semiconductor materials such as silicon or gallium arsenide, and has relatively higher accuracy.

[0003] Currently, commonly used calibration methods include SOLT and TRL, and the corresponding calibration parts used are also different. The SOLT method only uses four calibration parts: short circuit, open circuit, load, and thru. The TRL method only uses three calibration parts: thru, reflect, and line. Both methods have a disadvantage, that is, no error correction is performed on the crosstalk between the probes, so the calibration accuracy is reduced in the microwave and millimeter wave frequency bands that are more significantly affected by the crosstalk error.

[0004] In a multi-port RF microwave calibration method based on a self-calibration algorithm in the prior art, a set of calibration parts for LRRM and SOLR methods is designed, including short circuit, open circuit, load and through circuit. However, this scheme cannot calibrate the crosstalk error, and different parasitic parameters will be generated when the probe directly contacts the calibration parts of different structures during the calibration process, and the calibration error model does not contain the description of this error, so the error caused by this cannot be removed during the calibration. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, an object of the present invention is to provide a structurally embedded 16-item error model on-wafer calibration part, to realize the design of a 16-item error model on-wafer calibration part, to reduce the complexity of the calibration part design and production, and to improve the accuracy of the 16-item error model calibration method.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] I. An in - chip calibration component with an embedded structure:

[0008] The in - chip calibration component includes seven calibration components: through - calibration component, open - open calibration component, short - short calibration component, load - load calibration component, open - short calibration component, open - load calibration component, and short - load calibration component. The in - chip calibration component is composed of a combination of multiple calibration components;

[0009] Each calibration component includes the following components:

[0010] A substrate;

[0011] A metal layer disposed on the substrate;

[0012] The metal layer includes:

[0013] Two ground conductors, respectively disposed on both sides of the substrate along the test signal transmission direction;

[0014] Two replaceable structures, respectively disposed at both ends of the gap between the two ground conductors;

[0015] Each of the replaceable structures includes:

[0016] A fixed area adjacent to the substrate edge, with a short - sheet metal disposed as an end structure;

[0017] An area adjacent to the fixed area, which is selected to be one of a through structure, an open structure, a short structure, and a load structure.

[0018] In the present invention, by setting a fixed area between the replaceable area and the substrate edge, and disposing the open structure, short structure, and load structure at a certain distance from the substrate edge, the contact area between the probe and different calibration components can maintain the same structure, avoiding changes in the parasitic parameters of the contact area, achieving the effect of removing the parasitic parameters as error terms, and achieving higher calibration accuracy.

[0019] The present invention has no via structure and design, solving the problem that it is difficult to fabricate vias with small dimensions caused by the via structure disposed on the surface of the ground conductor, and suppressing the multimode transmission of signals.

[0020] Moreover, in the present invention, through the arrangement of the fixed area relative to the replaceable area in combination with a 16 - term error model, the advantages of calibrating crosstalk errors with the 16 - term error model can be combined. By improving the design structure of the calibration component, changes in error terms during the calibration process are avoided, achieving the effect of further improving the in - chip calibration accuracy.

[0021] The ground conductor is made of a metal sheet, and there is a strip - shaped gap between the metal sheets of the two ground conductors. Three edges of the ground conductor metal sheet outside the strip - shaped gap are respectively flush with the edge of the substrate.

[0022] In the through calibration component, both of the two replaceable regions are set as through structures, and the two through structures are directly connected to each other, so that the end structures of the two fixed regions are connected into an integral metal sheet through the through structures of the two replaceable regions as a signal conductor;

[0023] The cross-sections of the through structure and the end structure are set the same.

[0024] In the open-open calibration component, both of the two replaceable regions are set as open structures, and there is an interval between the two open structures without connection;

[0025] In the short-short calibration component, both of the two replaceable regions are set as short structures, and there is an interval between the two short structures without connection; in the load-load calibration component, both of the two replaceable regions are set as load structures, and there is an interval between the two load structures without connection; in the open-short calibration component, one replaceable region is set as an open structure, and the other replaceable region is set as a short structure, and there is an interval between the open structure and the short structure without connection;

[0026] In the open-load calibration component, one replaceable region is set as an open structure, and the other replaceable region is set as a load structure, and there is an interval between the open structure and the load structure without connection;

[0027] In the short-load calibration component, one replaceable region is set as a short structure, and the other replaceable region is set as a load structure, and there is an interval between the short structure and the load structure without connection.

[0028] The open structure is not provided with any metal sheet, and is essentially filled with other non-conductive media such as air, so that there is no connection between the end structure and the ground conductors on both sides.

[0029] The short structure is composed of a section of metal sheet, which is connected to the end structure and the ground conductors on both sides, and the metal sheet connects the end structure and the ground conductors on both sides.

[0030] The load structure is composed of a section of metal sheet in the middle and loads located on both sides of the metal sheet. The metal sheet is connected to the end structure, and is respectively connected to the ground conductors on both sides through a load, and the end structure is connected to the two loads through the metal sheet and then respectively connected to the ground conductors on both sides.

[0031] The load is a parallel connection of multiple resistors.

[0032] The length of the fixed region in the direction of the gap between the two ground conductors is in the range of 0.1 mm to 0.5 mm, and the direction of the gap between the two ground conductors is the direction of test signal transmission.

[0033] The structures of the cross-sections at both edges along the test signal transmission direction of all calibration components are the same.

[0034] The open-circuit structures in the open-open calibration component, open-short calibration component, and open-load calibration component are the same; the short-circuit structures in the short-short calibration component, open-short calibration component, and short-load calibration component are the same; the load structures in the load-load calibration component, open-load calibration component, and short-load calibration component are the same.

[0035] The total lengths of different calibration components remain unchanged, and the length of the calibration component is close to or the same as the length of the device under test.

[0036] The material of the substrate is a dielectric ceramic material with a high relative dielectric constant and low dielectric loss.

[0037] The ground conductor in the metal layer and the metal material in the replaceable structure are both gold.

[0038] By adjusting the parameters of the relative dielectric constant ε r of the substrate of the calibration component, the width w of the signal conductor, the spacing g between the signal conductor and the ground conductor, the thickness h of the substrate, and the thickness t of the metal layer, the characteristic impedance of the through calibration component is controlled.

[0039] II. A method for calibrating and testing a device under test of an on-chip calibration component, the method comprising the following steps:

[0040] Perform on-chip testing on the on-chip calibration component to obtain the scattering parameter matrix of each calibration component. There is no requirement for the test order of each different calibration component in the on-chip calibration component, and the scattering parameter vector is composed of all scattering parameters. Obtain the parasitic parameters through calibration and processing of each calibration component of the on-chip calibration component. Input the scattering parameter matrix and parasitic parameters of all calibration components of the on-chip calibration component into a 16-term error model for calibration fitting, specifically using a calibration algorithm for processing to obtain the calibrated and fitted 16-term error model; in the present invention, the 16-term error model is characterized through the combination of the calibration components, and the error terms are removed through the calibration algorithm.

[0041] After calibration, test the device under test. Perform on-chip testing on the device under test to obtain the scattering parameter matrix of the device under test, and input the scattering parameter matrix of the device under test into the calibrated and fitted 16-term error model to output the calibrated scattering parameter matrix of the device under test as the true value of the scattering parameters of the device under test.

[0042] The parasitic parameters of the calibration component are obtained by means of equivalent circuit modeling or three-dimensional electromagnetic simulation, etc.

[0043] The beneficial effects produced by adopting the above technical solutions are as follows:

[0044] The present invention specially designs a 16-item error model in-chip calibration component with an embedded structure and performs calibration in combination with the 16-item error model.

[0045] The present invention improves the structural design of the existing in-chip calibration component. By embedding the open-circuit, short-circuit, and load structures, it avoids the change of parasitic parameters caused by the contact between the probe and calibration components with different structures, thereby effectively reducing the test error of the 16-item error model calibration component and improving the accuracy of in-chip calibration. By simplifying the structure of the calibration component, a via-free design is achieved, reducing the difficulty of processing and manufacturing the calibration component.

[0046] Compared with traditional TRL and SOLT calibration components, the technical solution of the present invention can perform crosstalk correction, improve the calibration accuracy under high-frequency crosstalk, reduce the difficulty of designing and manufacturing calibration components, and at the same time avoid the problem of increased calibration error caused by the changing parasitic parameters due to the contact between the probe tip and calibration components with different structures through the embedding of open-circuit, short-circuit, and load structures. Description of the Drawings

[0047] Figure 1 It is a cross-sectional schematic diagram of the through calibration component in the embodiment;

[0048] Figure 2 It is a three-dimensional structural schematic diagram of the through calibration component in the embodiment;

[0049] Figure 3 It is a three-dimensional structural schematic diagram of the open-open calibration component in the embodiment;

[0050] Figure 4 It is a three-dimensional structural schematic diagram of the load-load calibration component in the embodiment;

[0051] Figure 5 It is a three-dimensional structural schematic diagram of the short-short calibration component in the embodiment;

[0052] Figure 6 It is a three-dimensional structural schematic diagram of the short-open calibration component in the embodiment;

[0053] Figure 7 It is a three-dimensional structural schematic diagram of the load-open calibration component in the embodiment;

[0054] Figure 8 It is a three-dimensional structural schematic diagram of the load-short calibration component in the embodiment;

[0055] Figure 9 It is a three-dimensional electromagnetic simulation model structural schematic diagram of the probe and through calibration component in the embodiment;

[0056] Figure 10 It is a comparison diagram of the calibration results obtained by three-dimensional electromagnetic simulation of the present invention and other technical solutions in the embodiment.

[0057] In the figure: 1. Substrate; 7. Metal layer; 2. Signal conductor; 3. Ground conductor; 4. Open-circuit structure; 5. Short-circuit structure; 6. Load structure. Detailed implementation mode

[0058] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation examples. It is necessary to point out here that the described embodiments are only for further illustration of the present invention, but should not be construed as any limitation to the protection scope of the present invention. Modifications, adjustments and promotions made by those skilled in the art on the basis of the technology of the present invention should all be included within the protection scope of the present invention.

[0059] The on-chip calibration components designed by the present invention include seven calibration components: through calibration component, open-open calibration component, short-short calibration component, load-load calibration component, open-short calibration component, open-load calibration component, and short-load calibration component;

[0060] Each calibration component includes a substrate 1 and a metal layer 7 arranged on the substrate 1, and there is no metal layer on the lower surface of the substrate 1.

[0061] The metal layer 7 includes two ground conductors 3 respectively arranged on both sides of the substrate 1 along the test signal transmission direction, and two replaceable structures respectively arranged at both ends of the gap between the two ground conductors 3.

[0062] The ground conductor 3 is made of a metal sheet, and there is a strip-shaped gap between the metal sheets of the two ground conductors 3. The three edges of the metal sheet of the ground conductor 3 outside the strip-shaped gap are respectively flush with the edges of the substrate 1.

[0063] As Figure 1 shown, the cross-sections at both ends of the seven calibration components are all composed of a substrate 1, ground conductors 3 located on both sides of the substrate 1, and end structures in the fixed area in the middle of the substrate 1 and between the two ground conductors 3, forming a coplanar waveguide transmission line structure.

[0064] Each replaceable structure includes a fixed area and a replaceable area:

[0065] The fixed area is adjacent to the edge of the substrate 1. A short piece of sheet metal is arranged in the fixed area as an end structure. The sheet metal of the end structure is arranged along the direction parallel to the gap, and there is a gap between the sheet metal and the two ground conductors 3 on both sides. The end of the sheet metal of the end structure close to the edge of the substrate 1 is flush with the edge of the substrate 1;

[0066] The replaceable area is adjacent to the fixed area and not adjacent to the edge of the substrate 1. The replaceable area is selectively set as one of a through structure, an open-circuit structure 4, a short-circuit structure 5, or a load structure 6.

[0067] As Figure 2As shown, the through calibration component includes two metal sheets located on both sides of the substrate 1 as ground conductors 3, and a metal strip in the gap between the two ground conductors 3 as a signal conductor 2. The signal conductor 2 is not in contact connection with the ground conductors 3 on both sides. Both ends of the ground conductors 3 and the signal conductor 2 extend to both ends of the substrate 1 and the edges are flush.

[0068] As Figure 3 shown, the open - open calibration component includes two metal sheets located on both sides of the substrate 1 as ground conductors 3, and a replaceable structure at each end of the gap between the two ground conductors 3 respectively. The replaceable structures at both ends are the same and are symmetrically arranged with respect to the mid - line between both ends of the substrate 1. Each includes a fixed area arranged adjacent to the edge of the substrate 1 and having a sheet - like metal as the end structure, and an open - circuit structure 4 arranged adjacent to the fixed area and without any metal sheets provided.

[0069] As Figure 4 shown, the short - short calibration component includes two metal sheets located on both sides of the substrate 1 as ground conductors 3, and a replaceable structure at each end of the gap between the two ground conductors 3 respectively. The replaceable structures at both ends are the same and are symmetrically arranged with respect to the mid - line between both ends of the substrate 1. Each includes a fixed area arranged adjacent to the edge of the substrate 1 and having a sheet - like metal as the end structure, and a short - circuit structure 5 arranged adjacent to the fixed area and having a metal sheet connecting the end structure and the ground conductors 3 on both sides.

[0070] As Figure 5 shown, the load - load calibration component includes two metal sheets located on both sides of the substrate 1 as ground conductors 3, and a replaceable structure at each end of the gap between the two ground conductors 3 respectively. The replaceable structures at both ends are the same and are symmetrically arranged with respect to the mid - line between both ends of the substrate 1. Each includes a fixed area arranged adjacent to the edge of the substrate 1 and having a sheet - like metal as the end structure, and a load structure 6 arranged adjacent to the fixed area and having a metal sheet connecting the end structure to two loads and then connecting to the ground conductors 3 on both sides respectively. One end of the two loads is connected by a metal sheet to the end structure, and the other ends of the two loads are respectively connected to the ground conductors 3 on both sides.

[0071] As Figure 6As shown, the open - short calibration component includes two metal sheets on both sides of the substrate 1 as ground conductors 3, and one replaceable structure at each end of the gap between the two ground conductors 3 respectively. The replaceable structures at both ends are different and are symmetrically arranged with respect to the mid - line between the two ends of the substrate 1. One replaceable structure includes a fixed area arranged adjacent to the edge of the substrate 1 and having a sheet - shaped metal as the end structure, and an open - circuit structure 4 arranged adjacent to the fixed area and without any metal sheets. The other replaceable structure includes a fixed area arranged adjacent to the edge of the substrate 1 and having a sheet - shaped metal as the end structure, and a short - circuit structure 5 arranged adjacent to the fixed area and having a metal sheet connecting the end structure to the ground conductors 3 on both sides. The fixed areas of the two replaceable structures are the same and symmetrically arranged.

[0072] As Figure 7 shown, the open - load calibration component includes two metal sheets on both sides of the substrate 1 as ground conductors 3, and one replaceable structure at each end of the gap between the two ground conductors 3 respectively. The replaceable structures at both ends are different and are symmetrically arranged with respect to the mid - line between the two ends of the substrate 1. One replaceable structure includes a fixed area arranged adjacent to the edge of the substrate 1 and having a sheet - shaped metal as the end structure, and an open - circuit structure 4 arranged adjacent to the fixed area and without any metal sheets. The other replaceable structure includes a load structure 6 arranged adjacent to the fixed area and having a metal sheet connecting the end structure to two loads and then connecting to the ground conductors 3 on both sides respectively. The fixed areas of the two replaceable structures are the same and symmetrically arranged.

[0073] As Figure 8 shown, the short - load calibration component includes two metal sheets on both sides of the substrate 1 as ground conductors 3, and one replaceable structure at each end of the gap between the two ground conductors 3 respectively. The replaceable structures at both ends are different and are symmetrically arranged with respect to the mid - line between the two ends of the substrate 1. One replaceable structure includes a fixed area arranged adjacent to the edge of the substrate 1 and having a sheet - shaped metal as the end structure, and a short - circuit structure 5 arranged adjacent to the fixed area and having a metal sheet connecting the end structure to the ground conductors 3 on both sides. The other replaceable structure includes a load structure 6 arranged adjacent to the fixed area and having a metal sheet connecting the end structure to two loads and then connecting to the ground conductors 3 on both sides respectively. The fixed areas of the two replaceable structures are the same and symmetrically arranged.

[0074] In a specific implementation, the form of the load implementation is two 100 - ohm resistors in parallel.

[0075] The length of the fixed area in the direction of the gap between the two ground conductors 3 is in the range of 0.1 mm - 0.5 mm.

[0076] By adjusting the relative dielectric constant ε of the substrate of the calibration component rThese parameters, namely the width w of the signal conductor, the spacing g between the signal conductor and the ground conductor, the thickness h of the substrate, and the thickness t of the metal layer 7, control the characteristic impedance of the through calibration component to be 50 ohms. Setting it to 50 ohms can achieve impedance matching with test systems such as vector network analyzers.

[0077] In a specific implementation, the material of the substrate 1 is alumina ceramic, with a relative dielectric constant of 9.6 - 9.8, and the thickness of the substrate is h. The material of the metal layer 7 is gold, and the thickness is t.

[0078] The through calibration component adopts a coplanar waveguide transmission line structure, where the width of the signal conductor is w, and the spacing between the signal conductor and the ground conductor is g. Its cross-section is as Figure 1 shown, and the three-dimensional diagram is as Figure 2 shown. During testing, the tip of the microwave probe is located at the edges of both ends of the calibration component. The signal tip of the probe contacts the signal conductor of the calibration component, and the ground tip of the probe contacts the ground conductor of the calibration component. The contact positions of the probe tips of the other calibration components are the same as those of the through calibration component.

[0079] Input the above parameters into the LineCalc calculation tool of ADS software to calculate the characteristic impedance of the through calibration component. By controlling the characteristic impedance to be 50 ohms, the above parameters are determined as: h = 200 μm, t = 36 μm, w = 0.09 mm, g = 0.12 mm.

[0080] In the existing structure, the two edges of the open calibration component are open circuits, the two edges of the short calibration component are short circuits, and the two edges of the load calibration component are loads. However, when the microwave probe contacts calibration components with different structures, different parasitic parameters will be generated, causing the error network (that is, the combination of error terms in the 16 - term error model, which is the object that needs to be calibrated and removed) to change. In the present invention, by embedding the open - circuit structure of the open calibration component, the short - circuit structure of the short calibration component, and the load structure of the load calibration component and setting them through a fixed area away from the edge positions at both ends, the same parasitic parameters are generated when the probe tests the open, short, and load calibration components as when testing the through calibration component, that is, the error network remains unchanged.

[0081] The lengths of the above calibration components are all 2 mm, and the lengths of the fixed areas along the gap direction are all 0.2 mm.

[0082] In the deformation of other beneficial embodiments, the lengths of the calibration components and the lengths of the fixed areas along the gap direction can also be changed according to actual needs, but it is required that the lengths of different calibration components remain the same, and the length of the calibration component is close to the length of the device under test.

[0083] The calibration piece is calibrated and tested based on three-dimensional electromagnetic full-wave simulation. The test frequency range is 10MHz to 80GHz, and the device under test is a through calibration piece. The 16 error models are established in the simulation software. The calibration piece is connected to the microwave probe in turn and all scattering parameters are simulated, such as Figure 9 shown.

[0084] In the specific implementation, each calibration piece in the on-wafer calibration piece is tested using a vector network analyzer and a microwave probe calibration piece. Two microwave probes are respectively connected to the two end edges of the calibration piece. Both microwave probes are electrically connected to the vector network analyzer, and the scattering parameters are obtained by detection by the vector network analyzer.

[0085] After completing the test of the 7 combinations of 16 error model calibration parts, all scattering parameters contain complete information of the error network. The 16 error model algorithm removes the influence of the error network from all scattering parameters to complete the calibration. The calibration value of the calibration part is also obtained by simulation.

[0086] The measured scattering parameter values ​​of the DUT were compared with the pre-known calibrated scattering parameters of the DUT to verify the effect of the present invention. The through calibration component was re-tested after calibration, and the final test results showed that in the frequency band of 10MHz to 80GHz, the amplitude of the scattering parameter S21 of the DUT after calibration was only 0.007dB different from the simulation value.

[0087] In the specific implementation, the 16-item error model calibration scheme of the existing on-wafer calibration piece without fixed area and interchangeable area, the existing TRL technical scheme and the SOLT calibration scheme using the on-wafer calibration piece with fixed area and interchangeable area are also implemented, and the implementation results of the present invention are compared. Figure 10 As shown, it can be seen that the accuracy of the calibration result of the present invention is significantly improved. It can be seen that the embodiment of the present invention has certain advantages over the prior art solution and improves the accuracy of on-wafer calibration.

[0088] The above description is a preferred embodiment of the present invention and should not be construed as any limitation on the scope of protection of the present invention. Modifications, adjustments and extensions made by technicians in this field based on the technology of the present invention should all be included in the scope of protection of the present invention.

Claims

1. An in - chip calibration component with an embedded structure, characterized in that: The on-chip calibration components described above include seven calibration components: through calibration component, open-open calibration component, short-short calibration component, load-load calibration component, open-short calibration component, open-load calibration component, and short-load calibration component; Each calibration component includes the following components: Substrate (1); Metal layer (7), arranged on the substrate (1); The metal layer (7) described above includes: Two ground conductors (3), respectively arranged on both sides of the substrate (1); Two replaceable structures, respectively arranged at both ends of the gap between the two ground conductors (3); Each of the replaceable structures described above includes: A fixed area adjacent to the edge of the substrate (1), arranging a sheet of metal as the end structure; A replaceable area adjacent to the fixed area, selectively set to be one of a through structure, an open structure (4), a short structure (5), and a load structure (6).

2. The in - chip calibration component with an embedded structure according to claim 1, characterized in that: The ground conductor (3) uses a metal sheet, and there is a strip-shaped gap between the metal sheets of the two ground conductors (3).

3. The in - chip calibration component with an embedded structure according to claim 1, characterized in that: In the through calibration component, both replaceable areas are set to through structures, and the two through structures are directly connected, so that the end structures of the two fixed areas are connected into an integral metal sheet as the signal conductor (2) through the through structures of the two replaceable areas; The through structure and the end structure are the same.

4. The in - chip calibration component with an embedded structure according to claim 1, characterized in that: In the open-open calibration component, both replaceable areas are set to open structures (4), and there is no connection between the two open structures (4); In the short-short calibration component, both replaceable areas are set to short structures (5), and there is no connection between the two short structures (5); In the load-load calibration component, both replaceable areas are set to load structures (6), and there is no connection between the two load structures (6); In the open-short calibration component, one replaceable area is set to an open structure (4), and the other replaceable area is set to a short structure (5), and there is no connection between the open structure (4) and the short structure (5); In the open-load calibration component, one replaceable area is set to an open structure (4), and the other replaceable area is set to a load structure (6), and there is no connection between the open structure (4) and the load structure (6); In the short-load calibration component, one replaceable area is set to a short structure (5), and the other replaceable area is set to a load structure (6), and there is no connection between the short structure (5) and the load structure (6).

5. The in - chip calibration component with an embedded structure according to claim 1, characterized in that: The open structure (4) is not provided with any metal sheet, so that there is no connection between the end structure and the ground conductors (3) on both sides.

6. The in - chip calibration component with an embedded structure according to claim 1, characterized in that: The short structure (5) is composed of a section of metal sheet, and this metal sheet connects between the end structure and the ground conductors (3) on both sides.

7. The in - chip calibration component with an embedded structure according to claim 1, characterized in that: The load structure (6) is composed of a section of metal sheet in the middle and loads located on both sides of the metal sheet. After connecting the end structure to the two loads through the metal sheet, it is then connected to the ground conductors (3) on both sides respectively.

8. The in - chip calibration component with an embedded structure according to claim 1, characterized in that: The length of the fixed area in the direction of the gap between the two ground conductors (3) is in the range of 0.1 mm - 0.5 mm.

9. The in - chip calibration component with an embedded structure according to claim 1, characterized in that: The structures of the cross-sections at both ends of all calibration components along the edge in the test signal transmission direction are the same.

10. The calibration test method for the device under test applied to the in-chip calibration component described in claim 1, characterized in that: The method includes the following steps: On-wafer calibration components are tested on-wafer to obtain the scattering parameter matrices of each calibration component. Parasitic parameters are obtained through calibration processing of each calibration component of the on-wafer calibration components. The scattering parameter matrices and parasitic parameters of the on-wafer calibration components are both input into a 16-term error model for calibration fitting to obtain the calibrated and fitted 16-term error model; The device under test is tested on-wafer to obtain the scattering parameter matrix of the device under test. The scattering parameter matrix of the device under test is input into the calibrated and fitted 16-term error model, and the calibrated scattering parameter matrix of the device under test is output as the true value of the scattering parameters of the device under test.

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