Optical device

Abstract

The present disclosure discloses an optical device, comprising two substrates arranged opposite to each other, each of the substrates having a periphery and a side surface at the periphery. A wavelength conversion layer is arranged between the two substrates. A light-emitting unit is arranged between the corresponding wavelength conversion layer and one of the two substrates corresponding to the wavelength conversion layer. A sealing member is arranged along the periphery and in contact with the side surfaces of the two substrates to seal the wavelength conversion layer and the light-emitting unit located between the two substrates.

Description

[0001] The present invention is a divisional application of the invention patent application with application number 2020101403344 filed on March 3, 2020 and invention name “Optical Device”. Technical Field

[0002] The present disclosure relates to a technology of an optical device, and more particularly to a structure of a light-emitting panel. Background Art

[0003] Electronic devices including display panels have been widely used in various fields of life, such as smart phones, tablet computers, televisions, etc., to display images.

[0004] For example, a display panel composed of a light emitting unit includes two substrates arranged opposite to each other. Some corresponding components are first manufactured on the respective substrates, and then the component structure layers on the two substrates are bonded to each other, so that the two substrates are arranged opposite to each other on the outside, and optical components including the light emitting unit, wavelength conversion layer and / or color filter layer are sandwiched between the two substrates.

[0005] Among these optical components, for example, the wavelength conversion layer is easily affected by moisture and / or oxygen, which may cause performance degradation. How to protect the optical component between the two substrates is an issue that needs to be considered. Summary of the invention

[0006] The present disclosure provides an optical device that can protect optical components between two substrates, reduce the intrusion of moisture and / or oxygen into the optical device, and enhance the ability of the optical device to block moisture and / or oxygen.

[0007] In one embodiment, the present disclosure provides an optical device, comprising two substrates arranged opposite to each other, each of the substrates having a periphery and a side surface at the periphery. A wavelength conversion layer is disposed between the two substrates. A light-emitting unit is disposed between the corresponding wavelength conversion layer and one of the two substrates corresponding to the wavelength conversion layer. A sealing member is disposed along the periphery and in contact with the side surfaces of the two substrates, sealing the wavelength conversion layer and the light-emitting unit located between the two substrates.

[0008] In order to better understand the above and other aspects of the present disclosure, embodiments are given below and described in detail with reference to the accompanying drawings: BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a schematic cross-sectional structure diagram of an optical device according to an embodiment of the present disclosure;

[0010] Figure 2is a schematic cross-sectional structural diagram of an optical device according to yet another embodiment of the present disclosure;

[0011] Figure 3 is a schematic cross-sectional structure diagram of the periphery of an optical device according to yet another embodiment of the present disclosure;

[0012] Figure 4A , Figure 4B is a schematic cross-sectional structural diagram of an optical device according to yet another embodiment of the present disclosure;

[0013] FIG. 5A to FIG. 5C is a schematic cross-sectional structural diagram of an optical device according to yet another embodiment of the present disclosure;

[0014] Fig. 6A , Figure 6B According to yet another embodiment of the present disclosure, a schematic cross-sectional structure diagram of an optical device; and

[0015] Figure 7 According to yet another embodiment of the present disclosure, a schematic cross-sectional structure of an optical device is shown.

[0016] Description of reference numerals:

[0017] 20: light emitting unit;

[0018] 30, 44: substrate;

[0019] 30a, 44a: side surface;

[0020] 30b: upper surface;

[0021] 32: pixel definition layer;

[0022] 34: Enclosed member;

[0023] 341, 342, 343, 344, 345, 346: covering layer;

[0024] 36: Partition wall structure;

[0025] 38: black matrix;

[0026] 40: wavelength conversion layer;

[0027] 42: color filter layer;

[0028] 46: adhesive layer;

[0029] 60: local area;

[0030] 70: light shielding layer;

[0031] 100: Optical device. DETAILED DESCRIPTION

[0032] In this document, some embodiments of the present disclosure are described with reference to the accompanying drawings. In fact, these embodiments can use a variety of different variations and are not limited to the embodiments described herein. The same reference symbols in the accompanying drawings are used to represent the same or similar components.

[0033] The present disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that in order to facilitate the understanding of the readers and the simplicity of the drawings, the multiple drawings in the present disclosure only depict a portion of the optical device, and the specific components in the drawings are not drawn according to the actual scale. In addition, the number and size of each component in the drawings are only for illustration and are not intended to limit the scope of the present disclosure.

[0034] Certain words are used throughout the specification and the appended claims of this disclosure to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. This document is not intended to distinguish between components that have the same function but different names. In the following specification and claims, the words "include", "contain", "have" and the like are open-ended words, and therefore should be interpreted as "including but not limited to...". Therefore, when the terms "include", "contain" and / or "have" are used in the description of this disclosure, they specify the presence of corresponding features, regions, steps, operations and / or components, but do not exclude the presence of one or more corresponding features, regions, steps, operations and / or components.

[0035] Directional terms mentioned herein, such as "up", "down", "front", "back", "left", "right", etc., are only with reference to the directions of the accompanying drawings. Therefore, the directional terms used are for illustration and not for limiting the present disclosure. In the accompanying drawings, each figure shows the general characteristics of the methods, structures and / or materials used in a particular embodiment. However, these drawings should not be interpreted as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative size, thickness and position of each film layer, region and / or structure may be reduced or enlarged.

[0036] When a corresponding component such as a film layer or region is referred to as being "on another component", it may be directly on the other component, or other components may exist between the two. On the other hand, when a component is referred to as being "directly on another component", there is no component between the two. In addition, when a component is referred to as being "on another component", the two have a top-down relationship in a top-down direction, and the component may be above or below the other component, and this top-down relationship depends on the orientation of the device.

[0037] It should be understood that when a component or a film layer is referred to as being "connected to" another component or a film layer, it can be directly connected to the other component or film layer, or there can be an intervening component or film layer between the two. When a component is referred to as being "directly connected to" another component or a film layer, there can be no intervening components or film layers between the two. In addition, when a component is referred to as being "coupled to another component (or a variation thereof)", it can be directly connected to the other component, indirectly connected (e.g., electrically connected) to the other component through one or more components.

[0038] The ordinal numbers used in the specification and claims, such as "first", "second", etc., are used to modify components. They do not imply or represent that the component or components have any previous ordinal numbers, nor do they represent the order of one component and another component, or the order of the manufacturing method. The use of these ordinal numbers is only used to make a component with a certain name clearly distinguishable from another component with the same name. The claims and the specification may not use the same words. Accordingly, the first component in the specification may be the second component in the claims.

[0039] In the present disclosure, the electronic device may include a display device, an optical device, other suitable electronic devices, or a combination of the above devices, but is not limited thereto.

[0040] In the present disclosure, the optical device may include an organic light-emitting diode (OLED), an inorganic light-emitting diode (LED), such as a micro-LED, mini-LED, a quantum dot light-emitting diode (QLED, QDLED) or a similar light-emitting component. The light-emitting diode may use quantum dots (QDs) materials, fluorescence materials, phosphor materials, other suitable materials or a combination thereof, but is not limited thereto.

[0041] Some embodiments are given below to illustrate the technology disclosed herein, but the disclosure is not limited to the given embodiments. In addition, possible combinations are allowed between the embodiments.

[0042] The optical device disclosed in the present invention, such as a light-emitting diode (LED) light-emitting panel, can have a good moisture and / or oxygen barrier function, and can especially enhance the moisture and / or oxygen barrier function around the light-emitting panel.

[0043] Figure 1 FIG. 1 is a schematic cross-sectional view of an optical device according to an embodiment of the present disclosure. Figure 1The optical device 100 includes a structure in which a substrate 30 and a substrate 44 are arranged opposite to each other. A variety of optical components are included between the substrate 30 and the substrate 44. In some embodiments, some optical components may be formed on the substrate 30 or the substrate 44 respectively, and then the substrate 30 and the substrate 44 are combined to form the optical device 100.

[0044] In some embodiments, a pixel definition layer 32 is formed on the substrate 30, which defines a space for accommodating the light-emitting unit 20. The substrate 30 may also include a circuit (not shown) for driving the light-emitting unit 20. The light-emitting unit 20 is, for example, a light-emitting diode, and the wavelength of the light emitted by it is, for example, in the wavelength range of ultraviolet light or blue light. The substrate 30 is, for example, glass or sapphire or similar materials, which have a low permeability to moisture and / or oxygen.

[0045] In addition, a color filter layer 42 is formed on the substrate 44, and the color filter layer 42 may include a red filter layer, a green filter layer, and a blue filter layer, but is not limited thereto. A black matrix (BM) 38 is also included around the color filter layer 42, which isolates the color filter layers 42 of different colors. A partition wall structure 36 is also formed on the black matrix 38. The wavelength conversion layer 40 corresponding to the color filter layer 42 is filled in the space surrounded by the partition wall structure 36. The substrate 44 is also, for example, glass or sapphire or a similar material, which has a low permeability to moisture and / or oxygen.

[0046] In one embodiment, after the required optical components are completed on the substrate 30 or the substrate 44, the substrate 30 and the substrate 44 are combined to form the optical device 100. Each light-emitting unit 20 corresponds to a sub-pixel of a color light. The wavelength conversion layer 40 first converts the light emitted by the light-emitting unit 20 into a color light, and then the color light passes through the color filter layer 42 to obtain a color light, such as red light, green light or blue light.

[0047] Among various optical components, for example, the wavelength conversion layer 40 is more susceptible to the influence of moisture and / or oxygen and thus degrades in quality. Although the substrate 30 or the substrate 44 has a better function of blocking moisture and / or oxygen, the moisture and / or oxygen blocking function of the surrounding black matrix 38, the partition wall structure 36 and / or the pixel definition layer 32 is relatively low, and when the partition wall structure 36 and the pixel definition layer 32 are combined, for example, by bonding, moisture and / or oxygen may also invade from the periphery or from the joint surface between the partition wall structure 36 and the pixel definition layer 32.

[0048] The present disclosure proposes a sealing member 34, which is at least along the periphery of the optical member between the two substrates 30, 44 and in contact with the side surfaces 30a, 44a of the two substrates 30, 44, so as to reduce the chance of moisture and / or oxygen intruding from the periphery and / or from the joint surface, thereby improving the optical device 100's ability to block moisture and / or oxygen intrusion from the side.

[0049] In one embodiment, the sealing member 34 contacts and covers the side surfaces 30 a and 44 a of the substrates 30 and 44 . In one embodiment, the sealing member 34 can seal the interface between the partition wall structure 36 and the pixel definition layer 32 .

[0050] The material of the sealing member 34 is, for example, a siloxane-containing material or silicon oxide (SiOx), which can block moisture and / or oxygen, etc., but the present disclosure is not limited thereto.

[0051] according to Figure 1 The present disclosure may be further designed in other ways and is not limited to the embodiments given above.

[0052] Figure 2 FIG. 1 is a cross-sectional structural diagram of an optical device according to another embodiment of the present disclosure. Figure 2 , considering increasing the protection of the wavelength conversion layer 40, such as the substrate 44 is a material with a high moisture and / or oxygen permeability, such as polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), polymethylmethacrylate (PMMA), or similar materials, but not limited to these. A covering layer 342 can be first formed on the substrate 44. In addition, a covering layer 341 can also be formed on the surface of the wavelength conversion layer 40. After the substrate 44 is combined with the substrate 30, a closed component 34 is formed. The covering layer 342 and the covering layer 341 can block moisture and / or oxygen, etc., to serve as a barrier layer for moisture and / or oxygen. The closed component 34 combined with the covering layer 341 and the covering layer 342 can cover the wavelength conversion layer 40, which can enhance the optical device 100's barrier to moisture and / or oxygen.

[0053] The sealing member 34 , the covering layer 341 , and the covering layer 342 may be in a fluid state, or may be formed by using physical vapor deposition (PVD) or chemical vapor deposition (CVD) or similar techniques, but the present disclosure is not limited thereto.

[0054] Figure 3FIG. 1 is a schematic cross-sectional structure diagram of the periphery of an optical device according to another embodiment of the present disclosure. Figure 2 and Figure 3 , the cover layer 341 is disposed on the substrate 44. In the process of the manufacturing process, the structure to be formed is formed from the substrate 44 upward. After forming the black matrix 38, the color filter layer 42, the partition wall structure 36 and the wavelength conversion layer 40, the cover layer 341 is formed on the substrate 44. In addition, for example, Figure 2 In a specific embodiment, the covering layer 341 may cover a portion of the surface of the partition wall structure 36 and / or the wavelength conversion layer 40. In one embodiment, the covering layer 341 may also additionally cover a portion of the surface of the black matrix 38.

[0055] In one embodiment, the partition wall structure 36 disposed around the optical device has a cross-section that is similar to a trapezoid. The partition wall structure 36 has an inclined portion on the outside, which is covered by the covering layer 341. The partition wall structure 36 has an inclined portion on the inside, which is not covered by the covering layer 341. In another embodiment, the cross-section of the black matrix 38 may also be similar to a trapezoid, with an inclined portion on the outside, which is covered by the covering layer 341. The angle θ2 of the inclined portion on the outside of the partition wall structure 36 is smaller than the angle θ1 of the inclined portion on the inside of the partition wall structure 36. In addition, in terms of width, the maximum width W of the black matrix 38 is BM is greater than the maximum width W of the partition wall structure 36 Bank For example, in the direction parallel to the surface of the substrate 44, or in the X direction, the maximum width W of the black matrix 38 is BM is greater than the maximum width W of the partition wall structure 36 Bank .

[0056] Under the geometric conditions, taking the case where the covering layer 341 is in a fluid state, the covering layer 341 can easily cover the outer sidewalls of the partition wall structure 36 and / or the black matrix 38. Figure 2 In the structure of the embodiment, a covering layer 342 may be first formed on the substrate 44 to protect the wavelength conversion layer 40 , the color filter layer 42 and the black matrix 38 .

[0057] In one embodiment, when the substrate 44 is made of a material with low moisture and / or oxygen permeability, the cover layer 342 may not be required. In this case, the wavelength conversion layer 40 may be sealed by the cover layer 341 and the substrate 44 .

[0058] In one embodiment, the substrate 44 and the optical components thereon, such as the wavelength conversion layer 40, the color filter layer 42, the partition wall structure 36, and the black matrix 38 may be first covered with a covering layer 341 to improve the ability to block moisture and / or oxygen. After being combined with the substrate 30 to form the optical device 100, a closed component 34 may still be formed around the optical device 100 to improve the ability of the optical device 100 to block moisture and / or oxygen.

[0059] According to the present disclosure, the optical device may have many other variations and is not limited to the embodiments described above.

[0060] Figure 4A , Figure 4B FIG. 4 is a schematic cross-sectional structural diagram of an optical device according to yet another embodiment of the present disclosure.

[0061] See also Figure 4A ,by Figure 1 Based on the structure of the embodiment, and then with part Figure 2 Embodiment of the invention. Figure 4A The optical device 100 further includes a covering layer 343 and a covering layer 344, which are first formed on the substrate 30 and the substrate 44, respectively. The sealing member 34 is bonded to the two covering layers 343 and 344, so that the wavelength conversion layer 40, the color filter layer 42, the partition wall structure 36, the black matrix 38, and the light-emitting unit 20 can be sealed by the sealing member 34 and the two covering layers 343 and 344, thereby improving the ability of the optical device 100 to block moisture and / or oxygen, and protecting various optical components on the substrate 30 and the substrate 44. These optical components are as described above and will not be described again here.

[0062] See also Figure 4B , similar to Figure 4A In the structure of the optical device 100, the covering layer 343 and the covering layer 344 may also be first formed on the outer side of the substrate 30 and the substrate 44, and then the optical component is manufactured. In another embodiment, the covering layer 343 and the covering layer 344 may also be formed on the outer side of the substrate 30 and the substrate 44 during the process of forming the optical component. In another embodiment, the covering layer 343 and the covering layer 344 may also be formed on the outer side of the substrate 30 and the substrate 44 after the substrate 30 and the substrate 44 are combined into the optical device 100. When the substrate 30 and the substrate 44 are combined into the optical device 100, a closed component 34 may be formed around the optical device 100, so that the wavelength conversion layer 40, the color filter layer 42, the partition wall structure 36, the black matrix 38, and the light-emitting unit 20 may be sealed by the closed component 34 and the two covering layers 343 and 344 to improve the ability of the optical device 100 to block moisture and / or oxygen.

[0063] Here, in Figure 4A and Figure 4B The bonding mechanism between the periphery of the substrate 30 and the substrate 44 can be, for example, Figure 3 In the design, the substrate 44 is covered with a covering layer 341 , but the disclosure is not limited thereto.

[0064] In one embodiment, Figure 4A and Figure 4BThe substrates 30 and 44 are made of a material with a high moisture and / or oxygen permeability, such as polyimide, polycarbonate, or polymethyl methacrylate, but not limited thereto.

[0065] Without departing from the technical concept of the present disclosure, the present disclosure provides more embodiments of the optical device. FIG. 5A to FIG. 5C FIG. 1 is a schematic cross-sectional view of an optical device according to another embodiment of the present disclosure. FIG. 5A to FIG. 5C In the embodiment, the substrate 30 or the substrate 44 is, for example, glass or sapphire or similar materials, which have a low permeability to moisture and / or oxygen, but is not limited thereto.

[0066] See also Figure 5A Based on the manufacturing process on the substrate 30 and the substrate 44, the black matrix 38 and the color filter layer 42 can be manufactured on the substrate 44. The partition wall structure 36 and the wavelength conversion layer 40 can be formed on the substrate 30. Based on the consideration of protecting the wavelength conversion layer 40, combined with Figure 3 In some embodiments, the cover layer 345 can be formed on the outer sidewalls of the partition wall structure 36 and the pixel definition layer 32. The outer sidewall of the pixel definition layer 32 can also be an inclined structure, which is conducive to the cover layer 345 covering the sidewall and contacting the substrate 30 to improve the effect of blocking moisture and / or oxygen.

[0067] In addition, the cover layer 345 may also extend on the upper surface of the partition wall structure 36 and the wavelength conversion layer 40, that is, cover the optical components disposed on the substrate 30. Here, the cover layer 345 extends on the upper surface of the partition wall structure 36 and the wavelength conversion layer 40 and seals at least the wavelength conversion layer 40 with the substrate 30 to improve the effect of the optical device 100 in blocking moisture and / or oxygen.

[0068] The substrate 30 and the substrate 44 may be joined together by, for example, using an adhesive layer 46 to combine the substrate 30 and the substrate 44 into the optical device 100. The material of the adhesive layer 46 may be, for example, liquid optical clear resin (OCR) or optical clear adhesive (OCA) or a suitable material, or a combination of the aforementioned materials. The adhesive layer 46 disclosed herein is not limited to the above-mentioned method.

[0069] After forming the optical device 100 , the present disclosure may form a sealing member 34 around the periphery of the optical device 100 to reduce the intrusion of moisture and / or oxygen from the side and / or joint surface of the optical device 100 .

[0070] See also Figure 5B, and for example, the color filter layer 42 and the black matrix 38 may also be formed on the substrate 30. In one embodiment, after the optical components are formed on the substrate 30, the cover layer 345 is first formed, and then the black matrix 38 and the color filter layer 42 are formed. At this time, the substrate 44 may be a transparent substrate on which no optical components are formed, but is not limited thereto. The substrate 44 is then combined with the substrate 30 with an adhesive layer 46, such as a liquid optical glue or an optical glue, to form the optical device 100. As described above, a sealing member 34 may be formed around the optical device 100 to reduce the intrusion of moisture and / or oxygen from the side and / or the joint surface of the optical device 100.

[0071] See also Figure 5C For example, the color filter layer 42 and the black matrix 38 may also be formed on the substrate 30. In one embodiment, the black matrix 38 and the color filter layer 42 are formed on the partition wall structure 36 and the wavelength conversion layer 40, and then the covering layer 345 is formed. Therefore, the covering layer 345 will cover the color filter layer 42 and the black matrix 38. Thereafter, an adhesive layer 46, such as a liquid optical glue or an optical glue, is used to adhere the substrate 44 to the closed member 34 to form the optical device 100. As described above, the closed member 34 may be formed around the optical device 100 to reduce the intrusion of moisture and / or oxygen from the side and / or the joint surface of the optical device 100. At this time, the substrate 44 may be a transparent substrate, and the substrate 44 may not form an optical member, but is not limited thereto.

[0072] Fig. 6A , Figure 6B According to another embodiment of the present disclosure, a cross-sectional structural diagram of an optical device is provided. FIG. 6A to FIG. 6B In the embodiment, the substrate 30 or the substrate 44 is, for example, glass or sapphire or similar materials, which have a low permeability to moisture and / or oxygen, but is not limited thereto. Fig. 6A ,according to Figure 3 The optical device may be further modified by modifying the partial structure of the optical device. Optical components such as the light emitting unit 20 and the pixel definition layer 32 may be formed on the substrate 30, but are not limited thereto. Optical components such as the color filter layer 42, the black matrix 38, the partition wall structure 36, the wavelength conversion layer 40, and the cover layer 346 may be formed on the substrate 44, but are not limited thereto.

[0073] The outer sidewalls of the pixel definition layer 32 or the partition wall structure 36 also have inclined portions. The substrate 30 and the substrate 44 are combined into the optical device 100, for example, via the adhesive layer 46. Thereafter, a sealing member 34 is formed outside the periphery of the optical device 100 to reduce the intrusion of moisture and / or oxygen from the side and / or the joint surface of the optical device 100.

[0074] In this embodiment, the covering layer 346 may be selectively formed on the black matrix 38 without contacting the substrate 44 . However, both the sealing member 34 and the covering layer 346 can reduce the intrusion of moisture and / or oxygen from the side and / or the joint surface of the optical device 100 .

[0075] See also Figure 6B ,according to Fig. 6A The structure of the substrate 30 may be further modified, for example, a cover layer 345 may be further provided to cover the optical components on the substrate 30. Here, the cover layer 345 may selectively cover the upper surface 30b of the substrate 30, or may not cover the upper surface 30b of the substrate 30. Figure 6B In the structure, the cover layer 345 contacts a portion of the upper surface 30b of the substrate 30. The present disclosure is not limited to the above-mentioned method.

[0076] Figure 7 According to another embodiment of the present disclosure, a cross-sectional structural diagram of an optical device is provided. Figure 7 In the embodiment, the substrate 30 or the substrate 44 is, for example, glass or sapphire or similar materials, which have a low permeability to moisture and / or oxygen, but is not limited thereto. Figure 7 The cover layer 346 covers the inclined portion formed by the black matrix 38 and the partition wall structure 36. The cover layer 346 can selectively contact the substrate 44 on the detailed structure of the local area 60. In one embodiment, another light shielding layer 70 is formed on the periphery of the substrate 44 and on the cover layer 346, which can further reduce the leakage of light emitted by the light-emitting unit 20 from the side and improve the image quality.

[0077] Then, for example, Fig. 6A In the same manner, the substrate 44 is combined with the substrate 30 via the adhesive layer 46 to form the optical device 100 , and a sealing member 34 is formed on the outer side thereof to reduce the intrusion of moisture and / or oxygen from the side and / or the joint surface of the optical device 100 .

[0078] In addition, as described, the multiple embodiments listed above can be partially combined to form other embodiments. The present disclosure is not limited to the individual embodiments listed above.

[0079] Although the embodiments and advantages of the present disclosure have been disclosed as above, it should be understood that any person skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person skilled in the art can understand the current or future developed processes, machines, manufacturing, material compositions, devices, methods and steps from the disclosure of the present disclosure. As long as the same functions can be implemented in the embodiments described herein or the same results can be obtained, they can be used according to the present disclosure. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each patent application constitutes an individual embodiment, and the scope of protection of the present disclosure also includes the combination of each patent application and the embodiment. The scope of protection of the present disclosure shall be determined by the attached claims.

Claims

1. An optical device, characterized in that: include: Two substrates are arranged opposite to each other, each of the substrates has a periphery and a side surface at the periphery; A wavelength conversion layer is disposed between the two substrates; a light emitting unit, corresponding to the wavelength conversion layer and disposed between the corresponding wavelength conversion layer and one of the two substrates; A sealing member, along the periphery and in contact with the side surfaces of the two substrates, sealing the wavelength conversion layer and the light emitting unit between the two substrates; a partition wall structure disposed on the other of the two substrates, wherein the partition wall structure has an inclined portion adjacent to the periphery of the other of the two substrates; A black matrix is ​​disposed between the partition wall structure and the other of the two substrates on which the partition wall structure is disposed, wherein a width of the black matrix is ​​greater than a width of the partition wall structure; a covering layer, disposed between the two substrates and covering the inclined portion of the partition wall structure; as well as A light shielding layer is located at the periphery of the other of the two substrates on which the partition wall structure is provided and overlaps with the covering layer on the inclined portion.

2. The optical device according to claim 1, characterized in that Also includes: The color filter layer is disposed between the wavelength conversion layer and the other of the two substrates.

3. The optical device according to claim 1, characterized in that Also includes: The color filter layer is adjacent to the black matrix.

4. The optical device according to claim 1, characterized in that The partition wall structure and the black matrix are arranged between the cover layer and the other of the two substrates.

5. The optical device according to claim 4, characterized in that The cover layer contacts the black matrix.

6. The optical device according to claim 4, characterized in that Also includes: A color filter layer, wherein the color filter layer and the wavelength conversion layer are arranged between the cover layer and the other of the two substrates.

7. The optical device according to claim 6, characterized in that The color filter layer, the partition wall structure and the black matrix are enclosed by the two substrates and the enclosing component.

8. The optical device according to claim 1, characterized in that Also includes: The color filter layer is disposed corresponding to the wavelength conversion layer, and the wavelength conversion layer is between the color filter layer and the light emitting unit.

9. The optical device according to claim 1, characterized in that Also includes: An adhesive layer, wherein the adhesive layer is disposed between the light emitting unit and the wavelength conversion layer.

10. The optical device according to claim 9, characterized in that The cover layer is disposed between the adhesive layer and the other of the two substrates.

Images