Antenna package and image display device

Abstract

The present invention provides an antenna package and an image display device. The antenna package includes: an antenna device including an antenna unit including a first radiator; and an intermediate circuit board coupled to the antenna device and electrically connected to the antenna unit. The intermediate circuit board includes a core layer, a first feed wiring formed on one surface of the core layer and electrically connected to the antenna unit, and a second radiator formed on the one surface of the core layer. Using an antenna included in the intermediate circuit board expands the radiation coverage.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2021-0006774 filed on January 18, 2021, in the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to an antenna package and an image display device. More particularly, the present invention relates to an antenna package including an antenna device and a circuit board and an image display device including the antenna package. Background Art

[0004] With the development of information technology, wireless communication technologies such as Wi-Fi, Bluetooth, etc. are combined with image display devices such as smart phones. In this case, an antenna can be combined with the image display device to provide a communication function.

[0005] According to the development of mobile communication technology, an antenna capable of realizing communication in a high frequency band or an ultra-high frequency band, for example, is required in an image display device.

[0006] However, if the driving frequency of the antenna increases, the signal loss may increase. In addition, as the transmission path length increases, the antenna gain may be reduced.

[0007] In order to connect the antenna to the main board of the image display device, for example, a connection intermediate structure such as a printed circuit board may be added. In this case, the connection intermediate structure may also increase signal loss.

[0008] In addition, when the antenna is disposed on the front of the image display device, the radiation direction of the antenna is limited. Therefore, the antenna radiation with a wide band or a high coverage range may be significantly limited. When the antenna is inserted into the image display device to improve the antenna radiation characteristics, the thickness of the image display device may increase and radiation interference may be generated due to the conductive structure of the display panel.

[0009] For example, Korean Patent Application Publication No. 2013-0095451 discloses an antenna integrated into a display panel, but does not provide any effective circuit connection in consideration of the above-mentioned problems. Summary of the invention

[0010] According to one aspect of the present invention, an antenna package having improved radiation characteristics and space efficiency is provided.

[0011] According to one aspect of the present invention, there is provided an image display device including an antenna package having improved radiation characteristics and space efficiency.

[0012] (1) An antenna package comprising: an antenna device comprising an antenna unit, the antenna unit comprising a first radiator; and an intermediate circuit board coupled to the antenna device and thereby electrically connected to the antenna unit, the intermediate circuit board comprising: a core layer; a first feed wiring formed on one surface of the core layer and electrically connected to the antenna unit; and a second radiator formed on one surface of the core layer.

[0013] (2) The antenna package according to (1) above, wherein the intermediate circuit board further includes a second feed wiring extending from the second radiator on one surface of the core layer.

[0014] (3) The antenna package according to (2) above, wherein the intermediate circuit board further includes a third radiator formed on one surface of the core layer.

[0015] (4) The antenna package according to (3) above, wherein the intermediate circuit board further includes a third feed wiring extending from the third radiator on one surface of the core layer.

[0016] (5) An antenna package according to (4) above, wherein a core layer has a first area joined to an antenna device, a second area having a bending area, and a third area having an end of an intermediate circuit board, and a second radiator is formed on the second area of ​​the core layer, and a third radiator is formed on the third area of ​​the core layer.

[0017] (6) The antenna package according to (5) above, wherein the second radiator functions as a horizontal radiator with respect to the antenna device, and the third radiator functions as a vertical radiator in a bottom surface direction of the antenna device.

[0018] (7) The antenna package according to (6) above, wherein the first radiator is a vertical radiator in a top surface direction of the antenna device.

[0019] (8) The antenna package according to (5) above, wherein the second feed wiring extends from the second radiator on the second region and the third region, and the third feed wiring extends from the third radiator on the third region.

[0020] (9) The antenna package according to (5) above, wherein the first radiator has a different size or a different resonance frequency from the second radiator or the third radiator.

[0021] (10) The antenna package according to (9) above, wherein the first radiator, the second radiator, and the third radiator have sizes that decrease in sequence.

[0022] (11) The antenna package according to (9) above, wherein the first radiator, the second radiator, and the third radiator have resonance frequencies that increase in sequence.

[0023] (12) The antenna package according to (5) above, further comprising an antenna driving integrated circuit chip electrically connected to the first feed wiring, the second feed wiring, and the third feed wiring through the third region of the core layer.

[0024] (13) The antenna package according to (5) above, wherein the first feed wiring, the second feed wiring, the third feed wiring, the second radiator, and the third radiator are formed together at the same layer on one surface of the core layer.

[0025] (14) The antenna package according to (5) above, wherein the second radiator has a bent shape.

[0026] (15) An image display device includes: a display panel; and the antenna package according to the above embodiment provided on the display panel.

[0027] (16) The image display device according to (15) above further includes a chip mounting board arranged below the display panel and an antenna driving integrated circuit chip mounted on the chip mounting board, wherein the intermediate circuit board of the antenna package is bent to below the display panel to couple with the chip mounting board and be electrically connected to the antenna driving integrated circuit chip.

[0028] (17) The image display device according to (16) above, wherein the second radiator is provided on a side of the display panel.

[0029] (18) The image display device according to (17) above, wherein the intermediate circuit board further includes a third radiator formed on one surface of the core layer and disposed below the display panel.

[0030] According to an embodiment of the present invention, the antenna unit included in the antenna device can be basically used as an antenna of a display screen antenna (antenna-on-display, AOD), and an additional antenna unit can be formed on a circuit board connected to the antenna unit. The total antenna gain can be improved by the antenna unit included in the circuit board, and the antenna radiation direction or radiation coverage can be expanded by bending the circuit board.

[0031] Therefore, an antenna package capable of increasing the radiation coverage and the radiation frequency band while maintaining or improving the radiation characteristics and reliability can be provided.

[0032] In some embodiments, the antenna unit included in the circuit board may be used as a high frequency antenna having a higher resonance frequency than the AOD antenna to substantially implement a multi-band antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic top plan view illustrating an antenna package according to an exemplary embodiment.

[0034] Figure 2 is a schematic cross-sectional view illustrating an antenna package according to an exemplary embodiment.

[0035] Figure 3 is a schematic top plan view illustrating an antenna package according to some exemplary embodiments.

[0036] Figure 4 and Figure 5 1 and 2 are respectively a schematic cross-sectional view and a schematic top plan view showing an image display device according to an exemplary embodiment. DETAILED DESCRIPTION

[0037] According to an exemplary embodiment of the present invention, there is provided an antenna package in which an antenna device and a circuit board are combined and a plurality of antenna units are included. According to an exemplary embodiment of the present invention, there is also provided an image display device including the antenna package.

[0038] However, those skilled in the art should understand that these embodiments described with reference to the accompanying drawings are provided for further understanding of the spirit of the present invention, and are not intended to limit the subject matter disclosed in the detailed description and the appended claims.

[0039] Figure 1 is a schematic top plan view illustrating an antenna package according to an exemplary embodiment. Figure 2 is a schematic cross-sectional view showing an antenna package according to an exemplary embodiment. Figure 1 and Figure 2 FIG. 4 shows the middle circuit board in a flat state before being bent.

[0040] Reference Figure 1 and Figure 2 , the antenna package may include an antenna device 100 and an intermediate circuit board 200 .

[0041] The antenna device 100 may include an antenna dielectric layer 110 and an antenna unit layer 120 disposed on the antenna dielectric layer 110 .

[0042] The antenna dielectric layer 110 may include a transparent resin film, which may include polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate and polybutylene terephthalate; cellulose resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymers; polyolefin resins such as polyethylene, polypropylene, cycloolefin or polyolefin with a norbornene structure and ethylene-propylene copolymers; vinyl chloride resins; amide resins such as nylon and aromatic polyamide; imide resins; polyether sulfone resins; sulfone resins; polyether ether ketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allyl resins; polyoxymethylene resins; epoxy resins; polyurethane or acrylic polyurethane resins; silicone resins, etc. These may be used alone or in combination of two or more.

[0043] In one embodiment, for stable formation of an antenna unit described later and reliability of connection with the intermediate circuit board 200 , the antenna dielectric layer 110 may include a cycloolefin polymer (COP) layer.

[0044] The antenna dielectric layer 110 may include an adhesive material such as an optically clear adhesive (OCA) or an optically clear resin (OCR). In some embodiments, the antenna dielectric layer 110 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0045] In some embodiments, the dielectric constant of the antenna dielectric layer 110 may be adjusted to be within a range of about 1.5 to about 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, thereby failing to achieve a desired high frequency band or ultra-high frequency band driving.

[0046] The antenna unit layer 120 may include an antenna unit formed on the top surface of the antenna dielectric layer 110. For example, a plurality of antenna units may be arranged along a width direction of the antenna device 100.

[0047] The antenna unit may include a first radiator 122 and a transmission line 124. The first radiator 122 may have, for example, a polygonal flat plate shape, and the transmission line 124 may extend from one side of the first radiator 122. The transmission line 124 may be formed as a single member substantially integral with the first radiator 122, and may have a narrower width than the first radiator 122.

[0048] The antenna unit may further include a signal pad 126. The signal pad 126 may be connected to an end portion of the transmission line 124. In one embodiment, the signal pad 126 may be provided as a substantially integral member with the transmission line 124, and the end portion of the transmission line 124 may serve as the signal pad 126.

[0049] In some embodiments, a ground pad 128 may be disposed around the signal pad 126. For example, a pair of ground pads 128 may be disposed to face each other with the signal pad 126 interposed therebetween. The ground pad 128 may be electrically and physically separated from the transmission line 124 and the signal pad 126.

[0050] The antenna unit or the first radiator 122 may be designed to have a resonant frequency corresponding to a high frequency band or an ultra-high frequency band such as 3G, 4G, 5G or higher. For example, the resonant frequency of the antenna unit may have a resonant frequency of about 10 GHz or more, or in the range of about 20 to 40 GHz.

[0051] The antenna unit may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. They may be used alone or in combination of at least two.

[0052] The antenna unit may include silver (Ag) or a silver alloy (eg, silver-palladium-copper (APC)) or copper (Cu) or a copper alloy (eg, copper-calcium (CuCa)) to achieve low resistance and a fine line width pattern.

[0053] In some embodiments, the antenna unit may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnOx), indium zinc tin oxide (IZTO), and the like.

[0054] In some embodiments, the antenna unit may include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, the antenna unit may include a double-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, flexibility can be improved by the metal layer, and signal transmission speed can also be improved by the low resistance of the metal layer. Corrosion resistance and transparency can be improved by the transparent conductive oxide layer.

[0055] In some embodiments, the antenna unit may include a blackened portion so that reflectivity at a surface of the antenna unit may be reduced to suppress visual recognition of the antenna unit due to light reflection.

[0056] In one embodiment, the surface of the metal layer included in the antenna unit may be converted into a metal oxide or a metal sulfide to form a black layer. In one embodiment, a black layer, such as a black material coating or plating, may be formed on the antenna unit or the metal layer. The black material or plating may include silicon, carbon, copper, molybdenum, tin, chromium, nickel, cobalt, or an oxide, sulfide, or alloy containing at least one of them.

[0057] The composition and thickness of the blackened layer may be adjusted in consideration of the reflectivity reduction effect and antenna radiation characteristics.

[0058] In some embodiments, Figure 1 As shown, the first radiator 122 and the transmission line 124 may include a mesh pattern structure to improve light transmittance. In this case, a dummy mesh pattern (not shown) may be formed around the first radiator 122 and the transmission line 124.

[0059] Considering the reduction of feeding resistance, the improvement of noise absorption efficiency, the horizontal radiation characteristic, etc., the signal pad 126 and the ground pad 128 may have a solid pattern structure formed of the above-mentioned metal or alloy.

[0060] In one implementation, the first radiator 122 may have a mesh pattern structure, and at least a portion of the transmission line 124 may include a solid metal pattern.

[0061] The first radiator 122 may be disposed in the display area of ​​the image display device, and the signal pad 126 and the ground pad 128 may be disposed in the non-display area or the frame area of ​​the image display device. At least a portion of the transmission line 124 may also be disposed in the non-display area or the frame area.

[0062] The antenna ground layer 130 may be formed on the bottom surface of the antenna dielectric layer 110. The antenna ground layer 130 may include the above-mentioned metal and / or alloy.

[0063] In some embodiments, the antenna ground layer 130 may be included as a separate component of the antenna device 100. In some embodiments, a conductive member of an image display device to which the antenna device 100 is applied may be used as the antenna ground layer 130.

[0064] The conductive member may include, for example, a gate electrode of a thin film transistor (TFT), various wirings such as a scan line or a data line, various electrodes such as a pixel electrode or a common electrode included in a display panel.

[0065] In one embodiment, various structures including a conductive material, for example, disposed below the display panel, may be used as the antenna ground layer 130. For example, a metal plate (for example, a stainless steel plate such as a SUS plate), a pressure sensor, a fingerprint sensor, an electromagnetic wave shielding layer, a heat sink, a digitizer, etc. may be used as the antenna ground layer 130.

[0066] The intermediate circuit board 200 may include a core layer 210 and a conductive layer 220 formed on one surface of the core layer 210. A ground layer 230 may be formed on the other surface of the core layer 210 opposite to the one surface.

[0067] The intermediate circuit board 200 may be made of, for example, a flexible printed circuit board (FPCB).

[0068] The core layer 210 may include a flexible resin. For example, the core layer 210 may include a flexible resin such as polyimide resin, modified polyimide (MPI), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), etc. The core layer 210 may include an inner insulating layer included in the intermediate circuit board 200.

[0069] Preferably, the core layer 210 may include LCP or MPI to provide sufficient flexibility and bending properties.

[0070] The conductive layer 220 may include a first feed wiring 222 electrically connected to the antenna unit layer 120. The first feed wiring 222 may be connected or bonded to the signal pad 126 of the antenna unit layer 120.

[0071] For example, one end of the first feed wiring 222 may be exposed by partially removing a cover film (not shown) of the intermediate circuit board 200. The exposed one end of the first feed wiring 222 may be bonded to the antenna unit layer 120 including the signal pad 126.

[0072] For example, the intermediate circuit board 200 and the antenna device 100 may be bonded to each other through a heat treatment / pressurization process using a conductive bonding structure 150 such as an anisotropic conductive film (ACF).

[0073] The intermediate circuit board 200 or the core layer 210 may include a first region I, a second region II, and a third region III. The first region I may be provided as a bonding region between the intermediate circuit board 200 and the antenna device 100 .

[0074] In an exemplary embodiment, the second region II may be located between the first region I and the third region III and may be used as a bending region of the intermediate circuit board 200. For example, the intermediate circuit board 200 may be bent or folded by the second region II so that the third region III may be disposed below the display panel.

[0075] In this case, the second region II may be located on the side of the display panel.

[0076] In an exemplary embodiment, the conductive layer 220 of the intermediate circuit board 200 may include a second radiator 224. The second radiator 224 may be formed on the one surface of the core layer 210 in the second region II. In some embodiments, the second radiator 224 may be formed at the same layer or level as the first feed wiring 222.

[0077] For example, a plurality of second radiators 224 may be arranged along the width direction of the middle circuit board 200 in the second region II.

[0078] The second feed wiring 226 may extend from one side of the second radiator 224. The second feed wiring 226 may extend from one side of the second radiator 224, and may extend throughout the second region II and the third region III.

[0079] In some embodiments, the conductive layer 220 of the intermediate circuit board 200 may further include a third radiator 223. The third radiator 223 may be formed on the one surface of the core layer 210 in the third region III. In some embodiments, the third radiator 223 may be formed at the same layer or level as the first feed wiring 222.

[0080] For example, a plurality of third radiators 223 may be arranged along the width direction of the middle circuit board 200 in the third region III.

[0081] The third feeding wiring 225 may extend from one side of the third radiator 223. The third feeding wiring 225 may extend from one side of the third radiator 223 on the third region III.

[0082] According to the above exemplary embodiment, the first radiator 122 can be basically used as an AOD (Antenna on Display) antenna unit. Therefore, sufficient radiation characteristics and gain can be obtained from the front of the image display device through the first radiator 122. For example, vertical radiation in a direction toward the front of the image display device can be achieved through the first radiator 122.

[0083] The second radiator 224 and the third radiator 223 may be used as an antenna unit substantially integrated with the intermediate circuit board 200. Therefore, when the feeding and signal control of the AOD antenna unit are performed through the intermediate circuit board 200, auxiliary antenna radiation may be achieved. The core layer 210 of the intermediate circuit board 200 may be substantially used as an antenna dielectric layer of the second radiator 224 and the third radiator 223.

[0084] For example, horizontal radiation in a lateral direction of the image display device may be achieved through the second radiator 224 , and vertical radiation in a rearward direction of the image display device may be achieved through the third radiator 223 .

[0085] Therefore, the antenna radiation coverage provided by the image display device can be expanded using the intermediate circuit board 200. In addition, horizontal radiation and rear vertical radiation by the second radiator 224 and the third radiator 223 can be easily achieved by bending the intermediate circuit board 200 having relatively improved flexibility.

[0086] In some embodiments, the second radiator 224 and the third radiator 223 may be disposed at the periphery (or frame portion) and the rear portion of the image display device, respectively, as the intermediate circuit board 200 is bent. Therefore, the second radiator 224 and the third radiator 223 may not be visually recognized by the user, and thus may be formed of a solid metal pattern, thereby improving signal efficiency through low resistance.

[0087] As described above, the first radiator 122 may be provided as an AOD antenna pattern. Therefore, the first radiator 122 may be formed in a mesh pattern structure to increase light transmittance and prevent visual recognition of a user.

[0088] The ground layer 230 may be formed on the bottom surface of the core layer 210 over the first region I, the second region II, and the third region III. The ground layer 230 may cover the first to third feeding wirings 222, 226, and 225 in a plan view to facilitate feeding and signal transmission for the first to third radiators 122, 224, and 223 by forming an electric field.

[0089] The ground layer 230 may also overlap the second radiator 224 and the third radiator 223 in a thickness direction or in a plan view to generate antenna radiation through the intermediate circuit board 200 .

[0090] The conductive layer 220 and the ground layer 230 of the intermediate circuit board 200 may include the above-mentioned metal or alloy. For example, the conductive layer 220 and the ground layer 230 may be made by a metal layer included on one surface and the other surface of the copper clad board. For example, the first to third feed wirings 222, 226 and 225, the second radiator 224 and the third radiator 223 may be formed by etching the metal layer formed on the above-mentioned one surface of the copper clad board.

[0091] like Figure 2 As shown, the intermediate circuit board 200 may be electrically connected to the chip mounting board 300 .

[0092] For example, end portions of the first to third feed wirings 222 , 226 , and 225 may be electrically connected to a connection wiring 330 included in the chip mounting board 300 through a connector 320 .

[0093] The antenna driving integrated circuit (IC) chip 340 may be mounted on the chip mounting board 300 using surface mounting technology (SMT) to be electrically connected to the connection wiring 330. Therefore, feeding and applying control signals (e.g., phase signals, beam tilt signals, etc.) to the first to third radiators 122, 224, and 223 may be performed through the antenna driving IC chip 340.

[0094] The chip mounting board 300 may include, for example, a main board, a package board, or a rigid printed circuit board. The chip mounting board 300 may include an insulator 310 on which a connector 320, a connection wiring 330, and an antenna driving integrated circuit (IC) chip 340 are disposed. The insulator 310 may include, for example, a resin impregnated with an inorganic material such as glass fiber (e.g., prepreg), and may have higher rigidity or lower flexibility than the core layer 210.

[0095] Figure 3 is a schematic top plan view showing an antenna package according to some exemplary embodiments. Figure 1 and Figure 2 Detailed description of elements and structures described that are substantially the same or similar.

[0096] Reference Figure 3 , the antenna package may include radiators having different sizes and / or resonant frequencies. For example, the first to third radiators 122, 224, and 223 may have different sizes.

[0097] In one embodiment, the first radiator 122 having a relatively long signal path through the first feeding wiring 222 may have a relatively low resonance frequency and a large size to prevent a reduction in radiation reliability due to a signal loss.

[0098] In one embodiment, the third radiator 223 having a shorter signal path through the third feeding wiring 225 may have a relatively higher frequency and a smaller size.

[0099] For example, the first radiator 122, the second radiator 224, and the third radiator 223 may have successively decreasing sizes. For example, in the range of 10 GHz to 40 GHz, the first radiator 122, the second radiator 224, and the third radiator 223 may have successively increasing resonant frequencies.

[0100] Figure 4 and Figure 51 and 2 are schematic cross-sectional views and schematic top plan views respectively showing an image display device according to an exemplary embodiment. For convenience of description, illustrations of some elements of the antenna device 100 and the intermediate circuit board 200 are omitted. For example, illustrations of feed wiring in the conductive layer 220 of the intermediate circuit board 200 are omitted. Figure 5 , the second region II of the intermediate circuit board 200 is shown in a flat state before being bent.

[0101] Reference Figure 4 and Figure 5 , the image display device 400 may be made into a form of a smart phone, for example, and Figure 5 The front or window surface of the image display device 400 is shown. The front of the image display device 400 may include a display area 410 and a peripheral area 420. The peripheral area 420 may correspond to, for example, a light shielding portion or a frame portion of the image display device.

[0102] The antenna device 100 included in the above-described antenna package may be disposed toward the front of the image display device 400, and, for example, may be disposed on the display panel 405. In one embodiment, the first radiator 122 may be at least partially disposed in the display region 410.

[0103] In this case, the first radiator 122 may include a mesh pattern structure and may prevent a reduction in transmittance caused by the first radiator 122. The signal pad 126 and the ground pad 128 included in the antenna unit may be formed of a solid metal pattern and may be disposed in the peripheral area 420 to prevent a reduction in image quality.

[0104] In some embodiments, the intermediate circuit board 200 may be bent and disposed on the rear of the image display device 400 to extend toward the chip mounting board 300 on which the antenna driving IC chip 340 is mounted.

[0105] As described above, the first region I of the intermediate circuit board 200 may be bonded to the antenna device 100, and the second region II may be bent so as to be disposed, for example, on the side of the display panel 405. The second radiator 224 may be disposed on the side of the display panel 405 to provide horizontal radiation. For example, the second radiator 224 may have an arc shape.

[0106] The third region III of the intermediate circuit board 200 may be located below the display panel 405 or at the rear of the image display device. For example, the third region III may face the antenna device 100.

[0107] Therefore, the third radiator 223 may be provided as a vertical radiator at the rear. Therefore, radiation may be provided together in the front, rear, and lateral directions of the image display device, thereby making it possible to expand the antenna coverage.

Claims

1. An antenna package, characterized in that: It includes: An antenna device comprising an antenna unit, wherein the antenna unit comprises a first radiator; as well as An intermediate circuit board coupled to the antenna device so as to be electrically connected to the antenna unit, the intermediate circuit board comprising: Core layer; a first feed wiring formed on one surface of the core layer and electrically connected to the antenna unit; a second radiator formed on the one surface of the core layer; and a third radiator formed on the one surface of the core layer, wherein the core layer has a first region joined to the antenna device, a second region having a bending region, and a third region having an end portion of the intermediate circuit board, and The second radiator is formed on the second region of the core layer, and the third radiator is formed on the third region of the core layer.

2. The antenna package according to claim 1, characterized in that: The intermediate circuit board further includes a second feed wiring extending from the second radiator on the one surface of the core layer.

3. The antenna package according to claim 2, characterized in that: The intermediate circuit board further includes a third feed wiring extending from the third radiator on the one surface of the core layer.

4. The antenna package according to claim 1, characterized in that: The second radiator acts as a horizontal radiator relative to the antenna arrangement, and The third radiator functions as a vertical radiator in a bottom surface direction of the antenna device.

5. The antenna package according to claim 4, characterized in that: The first radiator is a vertical radiator in a direction of a top surface of the antenna device.

6. The antenna package according to claim 3, characterized in that: The second feed wiring extends from the second radiator over the second area and the third area, and The third feeding wiring extends from the third radiator on the third area.

7. The antenna package according to claim 1, characterized in that: The first radiator has a different size or a different resonant frequency than the second radiator or the third radiator.

8. The antenna package according to claim 7, characterized in that: The first radiator, the second radiator, and the third radiator have successively decreasing sizes.

9. The antenna package according to claim 7, characterized in that: The first radiator, the second radiator, and the third radiator have resonance frequencies that increase in sequence.

10. The antenna package according to claim 3, characterized in that: It also includes an antenna driving integrated circuit chip electrically connected to the first feeding wiring, the second feeding wiring, and the third feeding wiring through the third region of the core layer.

11. The antenna package according to claim 3, characterized in that: The first feed wiring, the second feed wiring, the third feed wiring, the second radiator, and the third radiator are formed together at the same layer on the one surface of the core layer.

12. The antenna package according to claim 1, characterized in that: The second radiator has a bent shape.

13. An image display device, characterized in that: It includes: Display panel; as well as The antenna package according to claim 1 is disposed on the display panel.

14. The image display device according to claim 13, characterized in that: It also includes a chip mounting board arranged below the display panel and an antenna driving integrated circuit chip mounted on the chip mounting board. The intermediate circuit board of the antenna package is bent under the display panel to be coupled with the chip mounting board and electrically connected with the antenna driving integrated circuit chip.

15. The image display device according to claim 14, characterized in that: The second radiator is disposed on a side of the display panel.

16. The image display device according to claim 15, characterized in that: The intermediate circuit board further includes a third radiator formed on the one surface of the core layer and disposed under the display panel.

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