Ultra-wideband antenna module

Abstract

The present invention discloses an ultra-wideband antenna module, which includes a multilayer board and a double-sided frame. The multilayer board has an antenna layer and multiple circuit layers. The antenna layer is located on the front side of the multilayer board, and the circuit layers are located below the antenna layer. The antenna layer is provided with an ultra-wideband antenna. The circuit layers include a ground plane. A wireless chip is disposed on the back side of the multilayer board and has a first circuit pad for connecting the pins of the wireless chip. The first circuit pad is located at the four peripheral edges of the back side. The double-sided frame is placed under the multilayer board and includes a first surface, a planar hollow frame material, and a second surface. The first surface has a second circuit pad, and the second surface has a third circuit pad. The first surface is connected to the back side of the multilayer board so that the first circuit pad is connected to the second circuit pad. The planar hollow frame material surrounds the periphery of the wireless chip. The third circuit pad is connected to the second circuit pad, and the thickness of the planar hollow frame material is greater than the thickness of the wireless chip. The present invention can reduce the development cost in terms of the demand for product performance improvement.

Description

Technical Field

[0001] The present invention relates to an antenna module, and particularly to an ultra-wideband antenna module. Background Art

[0002] Industrial wireless devices, such as industrial wireless control devices, are very costly. The reasons are not only that the requirements for device reliability are very high, but also that there are many application scenarios for industrial devices. Therefore, manufacturers of industrial wireless devices try to design models with a wide range of applications as much as possible to reduce the number of developed models, which not only reduces the R & D costs, but also reduces the production line layout costs after mass production, so as to be more cost-effective.

[0003] Because the demand for the service life of industrial wireless devices is higher than that of general consumer products, in order to improve reliability, manufacturers often use the same public version of the wireless module for multiple models. The public version usually separates the circuit part and the antenna part independently. Referring to Figure 1 and Figure 2 , circuit 1 and antenna 2 are separated from each other independently. The design of the public version is expected to reduce the mutual interference factors between circuit parameters when the product is updated. However, when the communication specification needs to be changed, because the wireless chips are different, the antennas used also change, so that the entire circuit board still needs to be completely redesigned, resulting in the overall R & D cost of industrial wireless devices being difficult to be significantly reduced. Summary of the Invention

[0004] Aiming at the above-mentioned defects of the prior art, the task of the present invention is to provide an ultra-wideband antenna module to solve the problem that when the performance of the antenna module is improved, the antenna design needs to be changed simultaneously, thus increasing the R & D cost.

[0005] The technical solution of the present invention is as follows: An ultra-wideband antenna module, comprising:

[0006] A multilayer board having an antenna layer and a plurality of circuit layers. The antenna layer is located on the front surface of the multilayer board, and the circuit layers are located below the antenna layer. The antenna layer is provided with an ultra-wideband antenna. The circuit layers include a ground plane. A wireless chip is disposed on the back surface of the multilayer board. The wireless chip has a plurality of pins. The back surface of the multilayer board has a plurality of first circuit pads for correspondingly connecting the pins, wherein the first circuit pads are located at the four peripheral edges of the back surface; and

[0007] The double-sided frame is disposed under the multilayer board and includes a first surface, a planar hollow frame material, and a second surface. The first surface has a plurality of second circuit pads, and the second surface has a plurality of third circuit pads. The first surface is connected to the back surface of the multilayer board so that the first circuit pads are correspondingly connected to the second circuit pads, and the planar hollow frame material surrounds the periphery of the wireless chip. The third circuit pads are correspondingly connected to the second circuit pads, and the thickness of the planar hollow frame material is greater than the thickness of the wireless chip.

[0008] Further, the third circuit pads are used to connect to a plurality of fourth circuit pads on the circuit main board.

[0009] Further, the patterns of the first circuit pads, the second circuit pads, the third circuit pads, and the fourth circuit pads are all the same.

[0010] Further, the ultra-wideband antenna module is a cuboid module, and the wireless chip and the attached plurality of surface-mounted circuit components are fixedly connected to the back surface of the multilayer board by surface mounting technology. The fourth pads on the circuit main board define a circuit clearance block, and the periphery of the circuit clearance block on the circuit main board is all circuit grounded. The circuit layer, the wireless chip, and the ultra-wideband antenna share the circuit clearance block.

[0011] Further, the ultra-wideband antenna is a planar inverted-F antenna (PIFA).

[0012] Further, the ultra-wideband antenna has a first radiator, a second radiator, and a ground portion.

[0013] Further, the first center frequency at which the first radiator of the ultra-wideband antenna operates is 6489.6 MHz, and the bandwidth is 500 MHz.

[0014] Further, the second center frequency at which the second radiator of the ultra-wideband antenna operates is 7987.2 MHz, and the bandwidth is 500 MHz.

[0015] Further, the antenna layer of the multilayer board is further provided with a Bluetooth antenna.

[0016] Further, the ultra-wideband antenna module is applied to industrial wireless devices.

[0017] The advantages of the present invention compared with the prior art are as follows:

[0018] The ultra-wideband antenna module of the present invention not only forms an antenna and a wireless communication circuit in a three-dimensional stacked manner, can integrate the active circuits of the antenna and the wireless module, but also enables an old-type wireless device not to modify the circuit design of the main circuit board of the device. The circuit pads of the double-sided frame can replace the patterns according to the applied model. The ultra-wideband antenna module provided by the present invention can directly replace the wireless chip and its attached circuits of the traditional wireless module, and directly replace it with the ultra-wideband antenna module of the present invention to provide applications in the ultra-wideband operating frequency band. Because only the occupied area of the circuit part of the traditional wireless module is used, the need for an antenna clearance area can be directly eliminated, so that the traditional old-type wireless module can be easily upgraded to a new type of ultra-wideband wireless module. Therefore, the single module of the present invention can be widely applied to various different models of wireless device models, and the update and upgrade of wireless models can be completed with less design changes. Furthermore, even when applied to new product designs, the occupied area of the antenna module can be reduced, which has high industrial application value. Description of the Drawings

[0019] Figure 1 It is a schematic diagram of the wireless module of a traditional industrial wireless device.

[0020] Figure 2 It is a schematic diagram of the wireless module of a traditional industrial wireless device.

[0021] Figure 3 It is a schematic diagram of the front side and the antenna structure of the multilayer board provided by the embodiment of the present invention.

[0022] Figure 4 It is a side view of the multilayer board provided by the embodiment of the present invention.

[0023] Figure 5 It is a schematic diagram of the back side of the multilayer board provided by the embodiment of the present invention.

[0024] Figure 6 It is a schematic diagram of the first side of the double-sided frame provided by the embodiment of the present invention.

[0025] Figure 7 It is a schematic diagram of the side of the double-sided frame provided by the embodiment of the present invention.

[0026] Figure 8 It is a schematic diagram of the second side of the double-sided frame provided by the embodiment of the present invention.

[0027] Figure 9 It is an assembly schematic diagram of the ultra-wideband antenna module provided by the embodiment of the present invention from the first perspective.

[0028] Figure 10 It is an assembly schematic diagram of the ultra-wideband antenna module provided by the embodiment of the present invention from the second perspective. Detailed Description of the Invention

[0029] The present invention will be further described below in conjunction with embodiments, but it is not intended to limit the present invention.

[0030] Please refer to Figures 3 to 10 , the ultra-wideband antenna module provided by the embodiment of the present invention includes a multilayer board 3 and a double-sided frame 4. For the structure of the multilayer board 3, please refer to Figure 3 , Figure 4 and Figure 5 . The multilayer board 3 has an antenna layer 31 and a plurality of circuit layers 32. The antenna layer 31 is located on the front surface 301 of the multilayer board 3, and the plurality of circuit layers 32 are located below the antenna layer 31. The antenna layer 31 is provided with an ultra-wideband antenna 311. The plurality of circuit layers 32 include a ground plane, and the ground plane configured by the circuit shares the ground connection with the antenna, and it is not limited to which layer or those layers of the plurality of circuit layers 32 the ground plane is located in. The ground plane can be provided on each circuit layer 32. A wireless chip 5 is disposed on the back surface 302 of the multilayer board 3, and the installation position of the wireless chip 5 is indicated by a dotted line in Figure 5 . The wireless chip 5 has a plurality of pins (not shown in the figure). The back surface 302 of the multilayer board 3 has a plurality of first circuit pads 33 for correspondingly connecting the plurality of pins, wherein the plurality of first circuit pads 33 are located around the edges of the back surface 302, as shown in Figure 5 . For the double-sided frame 4, please refer to Figure 6 , Figure 7 and Figure 8 . The double-sided frame 4 is placed under the multilayer board 3 and includes a first surface 41, a planar hollow frame 42 and a second surface 43. The first surface 41 has a plurality of second circuit pads 411, and the second surface 43 has a plurality of third circuit pads 431. Among them, the first surface 41 is connected to the back surface 302 of the multilayer board 3 so that the plurality of first circuit pads 33 are correspondingly connected to the plurality of second circuit pads 411, and the planar hollow frame 42 surrounds the periphery of the wireless chip 5. Refer to Figure 9 and Figure 10Schematic diagram of the assembly structure. The multiple third circuit pads 431 are correspondingly connected to the multiple second circuit pads 411. The connection can be achieved by using vias, which are not shown in the figure. Alternatively, conductor traces of the conductor structure are arranged around the side surface of the planar hollow frame 42 to serve as a connection medium (or called an intermediary) between the third circuit pads 431 and the second circuit pads 411, so that the multiple third circuit pads 431 and the multiple second circuit pads 411 are correspondingly connected. Furthermore, the thickness of the planar hollow frame 42 is greater than the thickness of the wireless chip 5. After the planar hollow frame 42 is connected to the multilayer board 3, the wireless chip 5 does not protrude beyond the planar hollow frame 42, and the planar hollow frame 42 can be connected to the circuit main board 6 to complete the stacking of the three-dimensional structure.

[0031] The plurality of third circuit pads 431 are used to connect to the multiple fourth circuit pads 61 of the circuit main board 6. When the fourth circuit pads 61 on the circuit main board 6 are the same as the pad shapes of the ultra-wideband antenna module, the patterns of the plurality of first circuit pads 33, the plurality of second circuit pads 411, the third circuit pads 431, and the plurality of fourth circuit pads 61 are all the same. If the fourth pads 61 on the circuit main board 6 are not the same as the pad shapes of the ultra-wideband antenna module, the shape of the third circuit pads 431 can be matched to the shape of the fourth circuit pads 61. In this way, by only changing the design of the third circuit pads 431, the ultra-wideband antenna module of the embodiment of the present invention can be applied to circuit main boards 6 with various different designs, which can greatly improve the application range of this ultra-wideband antenna module.

[0032] In this embodiment, this ultra-wideband antenna module is a cuboid module, which only occupies the circuit space of the wireless chip 5 originally designed on the circuit main board 6. That is to say, the space occupied by this ultra-wideband antenna module replaces the circuit clearance block 601 for the wireless chip 5 on the circuit main board 6. In other words, in the embodiment of the present invention, the wireless chip 5 originally on the circuit main board 6 is moved to the back surface 302 of the multilayer board 3, and this original circuit clearance block 601 is changed to be occupied by the ultra-wideband antenna module with an antenna, and the antenna clearance area originally designed on the circuit main board 6 is no longer needed (for example Figure 1 and Figure 2 the space used by the antenna 2 of

[0033] Furthermore, the ultra-wideband antenna 311 is, for example, a planar inverted F-shaped antenna (PIFA). The ultra-wideband antenna 311 has a first radiator 311a, a second radiator 311b and a grounding portion 311c. The first center frequency at which the first radiator 311a of the ultra-wideband antenna 311 operates is 6489.6MHz, and the bandwidth is 500MHz. The second center frequency at which the second radiator 311b of the ultra-wideband antenna 311 operates is 7987.2MHz, and the bandwidth is 500MHz. Furthermore, the antenna layer 301 of the multilayer board 3 is further provided with a Bluetooth antenna 312. The ultra-wideband antenna module can be particularly applied to industrial wireless devices, and can enable the ultra-wideband antenna module to have the function of ultra-wideband communication and also have the function of Bluetooth communication. In other words, the ultra-wideband antenna module can carry two or more wireless communication systems of different specifications at the same time.

[0034] In summary, the ultra-wideband antenna module provided by the embodiment of the present invention forms an antenna and a wireless communication circuit in a three-dimensional stacking manner, and can integrate the active circuits of the antenna and the wireless module. It can make it possible for old wireless devices (especially those for industrial use) to not need to modify the circuit design of the main circuit board of the device, and the circuit pads of the double-sided frame can be replaced with patterns in accordance with the application model. The ultra-wideband antenna module provided by the present invention can directly replace the wireless chip and its auxiliary circuit of the traditional wireless module, and directly replace them with the ultra-wideband antenna module of the present invention to provide at least two ultra-wideband working frequency band applications and a new Bluetooth antenna application. Because only the occupied area of ​​the circuit part of the traditional wireless module is used, the need to use the antenna clearance area can be directly eliminated, so that the wireless module (especially for industrial use) can be easily upgraded to a new type of ultra-wideband wireless module, and can be accompanied by a newly added Bluetooth wireless function. Therefore, the single module of the present invention can be widely used in a variety of different models of wireless device models, and can complete the update and upgrade of wireless models (especially for industrial use) with reduced design changes. Furthermore, even if it is applied to new product designs, it can reduce the occupied area of ​​the antenna module, and has a high industrial application value.

Claims

1. A ultra-wideband antenna module, characterized in that, Comprising: A multilayer board having an antenna layer and a plurality of circuit layers, the antenna layer being located on the front side of the multilayer board, the circuit layers being located below the antenna layer, the antenna layer being provided with an ultra-wideband antenna, the circuit layers including a ground plane, a wireless chip being disposed on the back side of the multilayer board, the wireless chip having a plurality of pins, and the back side of the multilayer board having a plurality of first circuit pads for correspondingly connecting the pins, wherein the first circuit pads are located at the four peripheral edges of the back side; And A double-sided frame body disposed below the multilayer board, comprising a first surface, a planar hollow frame material and a second surface, the first surface having a plurality of second circuit pads, the second surface having a plurality of third circuit pads, wherein the first surface is connected to the back side of the multilayer board so that the first circuit pads are correspondingly connected to the second circuit pads, and the planar hollow frame material surrounds the periphery of the wireless chip, wherein the third circuit pads are correspondingly connected to the second circuit pads, and the thickness of the planar hollow frame material is greater than the thickness of the wireless chip.

2. The ultra-wideband antenna module according to claim 1, characterized in that The third circuit pads are used to connect a plurality of fourth circuit pads of a circuit main board.

3. The ultra-wideband antenna module according to claim 2, characterized in that, The patterns of the first circuit pads, the second circuit pads, the third circuit pads and the fourth circuit pads are all the same.

4. The ultra-wideband antenna module according to claim 2, characterized in that, The ultra-wideband antenna module is a cuboid module, and the wireless chip and a plurality of attached surface-mounted circuit components are fixedly connected to the back side of the multilayer board by surface mounting technology, wherein the fourth circuit pads of the circuit main board define a circuit clearance block, and the periphery of the circuit clearance block of the circuit main board is all circuit grounded, and the circuit layers, the wireless chip and the ultra-wideband antenna share the circuit clearance block.

5. The ultra-wideband antenna module according to claim 1, characterized in that The ultra-wideband antenna is a planar inverted-F antenna.

6. The ultra-wideband antenna module according to claim 1, characterized in that, The ultra-wideband antenna has a first radiator, a second radiator and a ground portion.

7. The ultra-wideband antenna module according to claim 6, characterized in that, The first center frequency at which the first radiator of the ultra-wideband antenna operates is 6489.6 MHz, and the bandwidth is 500 MHz.

8. The ultra-wideband antenna module according to claim 6, characterized in that, The second center frequency at which the second radiator of the ultra-wideband antenna operates is 7987.2 MHz, and the bandwidth is 500 MHz.

9. The ultra-wideband antenna module according to claim 1, characterized in that The antenna layer of the multilayer board is further provided with a Bluetooth antenna.

10. The ultra-wideband antenna module according to claim 1, characterized in that, The ultra-wideband antenna module is applied to an industrial wireless device.

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