Camera module and electronic device

Abstract

The present invention discloses an imaging module and an electronic device, relating to the technical field of electronic devices. The imaging module includes: a first lens barrel, a second lens barrel, and a flexible circuit board; the second lens barrel is movably disposed inside the first lens barrel, and there is a first gap between the inner sidewall of the first lens barrel and the outer sidewall of the second lens barrel, and a first portion of the flexible circuit board is located in the first gap.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic devices, and particularly relates to an imaging module and an electronic device. Background Art

[0002] With the development of technology, the manufacturing technology of electronic devices has also been rapidly improved. To further improve the shooting effect of the camera of an electronic device, a telescopic zoom camera has emerged. By moving the lens, the telescopic zoom camera effectively expands the height space, reduces the space occupied by the lens in the imaging module, enables a larger aperture and a larger sensor to be used in the imaging module, improves the optical performance, and thus enhances the photo-taking effect.

[0003] In the existing telescopic zoom camera solutions, a flexible circuit board is usually arranged in the inner cavity of the camera and is electrically connected to the VCM (Voice Coil Motor) at the lens to achieve power supply and signal transmission.

[0004] When using the existing telescopic zoom camera, since the flexible circuit board will block the lens barrel inside the camera, the area of the image sensor is limited, and the flexible circuit board will also block the light in the lens from entering the sensor, affecting the shooting quality. Summary of the Invention

[0005] An object of an embodiment of the present invention is to provide an imaging module and an electronic device, which can solve the problem that in the prior art, the flexible circuit board blocks the lens barrel inside the camera and affects the shooting quality.

[0006] To solve the above technical problem, the present invention is implemented as follows:

[0007] In a first aspect, an embodiment of the present invention provides an imaging module, including: a first lens barrel, a second lens barrel, and a flexible circuit board;

[0008] The second lens barrel is movably arranged inside the first lens barrel, and there is a first gap between the inner side wall of the first lens barrel and the outer side wall of the second lens barrel, and a first part of the flexible circuit board is located in the first gap.

[0009] In a second aspect, an embodiment of the present invention provides an electronic device, including the above imaging module.

[0010] In an embodiment of the present invention, the camera module includes a first lens barrel, a second lens barrel, and a flexible circuit board; the second lens barrel is movably disposed inside the first lens barrel, and there is a first gap between the inner side wall of the first lens barrel and the outer side wall of the second lens barrel, and a first portion of the flexible circuit board is located in the first gap. By accommodating the first portion of the flexible circuit board in the first gap, the position of the flexible circuit board inside the lens barrel is relatively fixed, the bending deformation of the flexible circuit board is controllable, and the shielding of the internal space of the lens barrel can be reduced, thereby facilitating the improvement of the light input amount of the lens and the arrangement of a larger-sized photosensitive chip, and improving the shooting quality.

[0011] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic structural diagram of the camera module when the second lens barrel is in the first position in an embodiment of the present invention;

[0013] Figure 2 is a schematic structural diagram of the camera module when the second lens barrel is in the second position in an embodiment of the present invention;

[0014] Figure 3 is a schematic structural diagram of the camera module when the second lens barrel is in the first position and the third lens barrel is in the retracted position in an embodiment of the present invention;

[0015] Figure 4 is a schematic structural diagram of the camera module when the second lens barrel is in the second position and the third lens barrel is in the extended position in an embodiment of the present invention;

[0016] Figure 5 is one of the schematic structural diagrams of the flexible circuit board described in an embodiment of the present invention;

[0017] Figure 6 is another schematic structural diagram of the flexible circuit board described in an embodiment of the present invention;

[0018] Figure 7 is an embodiment of the present invention Figure 6 an enlarged view of part Ⅰ;

[0019] Figure 8 is a third schematic structural diagram of the flexible circuit board described in an embodiment of the present invention;

[0020] Figure 9 An embodiment of the present invention Figure 8 a schematic structural diagram along the a direction;

[0021] Figure 10 is a schematic structural diagram of the hinge described in an embodiment of the present invention.

[0022] Description of reference numerals:

[0023] 10-first lens barrel; 20-second lens barrel; 30-flexible circuit board; 40-driving assembly; 50-lens assembly; 60-photosensitive chip; 70-first guide member; 80-hinge; 90-third lens barrel; 100-second guide member; 101-first gap; 102-second gap; 301-first part; 302-second part; 303-connecting part; 304-soldering pad; 801-connecting shaft; 802-support plate; 3011-first bending section; 3021-second bending section. DETAILED DESCRIPTION

[0024] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0025] The terms "first", "second", etc. in the specification and claims of the present invention are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable under appropriate circumstances, so that the embodiments of the present invention can be implemented in an order other than those illustrated or described herein. In addition, the term "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0026] In the description of the present invention, it is necessary to understand that the terms "length", "up", "down", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] Reference Figures 1 to 2As shown in the figure, an embodiment of the present invention provides an imaging module, including: a first lens barrel 10, a second lens barrel 20, and a flexible circuit board 30; the second lens barrel 20 is movably disposed inside the first lens barrel 10, and there is a first gap 101 between the inner sidewall of the first lens barrel 10 and the outer sidewall of the second lens barrel 20, and a first portion 301 of the flexible circuit board 30 is located in the first gap 101.

[0029] Specifically, as Figures 1 to 2 shown, the imaging module includes a first lens barrel 10 and a second lens barrel 20. The inner diameter of the first lens barrel 10 is slightly larger than the outer diameter of the second lens barrel 20. The first lens barrel 10 is sleeved on the second lens barrel 20 for installation. The inner sidewall of the first lens barrel 10 faces the outer sidewall of the second lens barrel 20, and there is a first gap 101 between the inner sidewall of the first lens barrel 10 and the outer sidewall of the second lens barrel 20. The first gap 101 is about 0.5 mm.

[0030] A lens assembly 50 is installed inside the second lens barrel 20, and the flexible circuit board 30 is used to supply power to the lens assembly 50. Along the optical axis direction of the imaging module, the first lens barrel 10 and the second lens barrel 20 can move relative to each other. Specifically, a slide rail can be provided on the inner sidewall of the first lens barrel 10 or the outer sidewall of the second lens barrel 20 to realize the relative movement of the first lens barrel 10 and the second lens barrel 20.

[0031] By using the relative movement of the first lens barrel 10 and the second lens barrel 20, the lens assembly 50 can be driven to move to achieve zooming. The relative movement of the first lens barrel 10 and the second lens barrel 20 can be manually controlled. For example, the user can manually rotate the first lens barrel 10, thereby driving the second lens barrel 20 to extend or retract relative to the first lens barrel 10. It can also be driven by the cooperation of a stepper motor and a planetary gear to drive the relative movement of the first lens barrel 10 and the second lens barrel 20. The embodiment of the present invention does not limit this.

[0032] When the first lens barrel 10 and the second lens barrel 20 move relative to each other, the flexible circuit board 30 will also be deformed accordingly. The first portion 301 of the flexible circuit board 30 can be installed in the first gap 101 for storage. Among them, the first portion 301 is the part of the flexible circuit board 30 close to the first lens barrel 10. When the first portion 301 of the flexible circuit board 30 is located in the first gap 101, the inner sidewall of the first lens barrel 10 and the outer sidewall of the second lens barrel 20 will play a limiting role on the first portion 301, avoiding the flexible circuit board 30 from being deformed randomly or even extending into the lens barrel to block light.

[0033] In an embodiment of the present invention, by accommodating the first part 301 of the flexible circuit board 30 into the first gap 101, the position of the flexible circuit board 30 inside the lens barrel is relatively fixed, and the bending deformation of the flexible circuit board 30 is controllable, which can reduce the occlusion of the internal space of the lens barrel, thereby facilitating the improvement of the light input of the lens and the arrangement of a larger-sized photosensitive chip 60, and enhancing the shooting quality.

[0034] Optionally, as shown in Figures 1 to 2 the figure, the imaging module further includes a driving component 40 and a lens component 50. One end of the flexible circuit board 30 is electrically connected to the driving component 40, and the other end of the flexible circuit board 30 passes through the first gap 101 and is electrically connected to the lens component 50.

[0035] Specifically, as shown in Figures 1 to 2 the figure, the lens component 50 is disposed in the second lens barrel 20. A VCM (Voice Coil Motor) is provided in the lens component 50, and the VCM can be used to drive the lens to move to achieve the functions of focusing and zooming. One side of the first lens barrel 10 away from the second lens barrel 20 is fixed to the driving component 40, and the driving component 40 is used to output an electrical signal to the lens component 50. One end of the flexible circuit board 30 is electrically connected to the driving component 40, and the other end of the flexible circuit board 30 passes through the first gap 101 and is electrically connected to the lens component 50, transmitting the electrical signal of the driving component 40 to the VCM to control the focusing and zooming functions of the lens component 50. With the cooperation of the VCM, the first lens barrel 10 and the second lens barrel 20, a larger range of focal length adjustment can be achieved.

[0036] When arranging the flexible circuit board 30, the other end of the flexible circuit board 30 passes through the first gap 101 and is electrically connected to the lens component 50, so that the first part 301 of the flexible circuit board 30 is located in the first gap 101, thereby achieving the accommodation of the flexible circuit board 30. Under the restrictive action of the inner side wall of the first lens barrel 10 and the outer side wall of the second lens barrel 20, the flexible circuit board 30 will not deform randomly or even extend into the lens barrel to block light.

[0037] Optionally, as shown in Figures 1 to 2 the figure, the imaging module further includes a photosensitive chip 60. When the second lens barrel 20 is located at the first position close to the photosensitive chip 60, the second lens barrel 20 is located inside the first lens barrel 10, and the first part 301 is located in the first gap 101; when the second lens barrel 20 is located at the second position away from the photosensitive chip 60, one end of the second lens barrel 20 extends out of the first lens barrel 10, and the first part 301 is located between the inner side wall of the first lens barrel 10 and the outer side wall of the second lens barrel 20.

[0038] Specifically, as shown in Figures 1 to 2As shown in the figure, a photosensitive chip 60 is disposed on a side of the first lens barrel 10 away from the second lens barrel 20. The photosensitive chip 60 can be a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor). The photosensitive chip 60 is disposed opposite to the lens assembly 50. Ambient light enters the first lens barrel 10 and the second lens barrel 20 through the lens assembly 50, and finally reaches the photosensitive chip 60 to achieve imaging.

[0039] Figure 1 FIG. 4 is a schematic structural diagram of the imaging module when the second lens barrel 20 is in the first position in an embodiment of the present invention. The first lens barrel 10 and the second lens barrel 20 are relatively movable. When the second lens barrel 20 moves to the first position close to the photosensitive chip 60, the second lens barrel 20 contracts to the inside of the first lens barrel 10, and the overall telescopic lens barrel formed by the first lens barrel 10 and the second lens barrel 20 is shortened. A part of the inner sidewall of the first lens barrel 10 overlaps with the outer sidewall of the second lens barrel 20 to form a first gap 101. Driven by the first lens barrel 10 and the second lens barrel 20, the first part 301 of the flexible circuit board 30 is received in the first gap 101. Under the restricting action of the inner sidewall of the first lens barrel 10 and the outer sidewall of the second lens barrel 20, the flexible circuit board 30 will not be deformed randomly or even extend into the lens barrel to block light.

[0040] Figure 2 FIG. 8 is a schematic structural diagram of the imaging module when the second lens barrel 20 is in the second position in an embodiment of the present invention. When the second lens barrel 20 moves to the second position away from the photosensitive chip 60, that is, the second lens barrel 20 extends out of the first lens barrel 10, the overall telescopic lens barrel formed by the first lens barrel 10 and the second lens barrel 20 is elongated. At this time, supported by the first lens barrel 10 and the second lens barrel 20, the first part 301 of the flexible circuit board 30 is located between the inner sidewall of the first lens barrel 10 and the outer sidewall of the second lens barrel 20. It can be understood that the inner sidewall of the first lens barrel 10 and the outer sidewall of the second lens barrel 20 project in the direction of the photosensitive chip 60, and the area formed between the two projections is the area between the inner sidewall of the first lens barrel 10 and the outer sidewall of the second lens barrel 20, and this area is actually an extension of the first gap 101.

[0041] Since the second lens barrel 20 extends out of the first lens barrel 10, the inner side wall of the first lens barrel 10 and the outer side wall of the second lens barrel 20 are not in a relative state. However, as the overall telescopic lens barrel formed by the first lens barrel 10 and the second lens barrel 20 extends, the required length of the flexible circuit board 30 also increases. Under the pulling of the first lens barrel 10 and the second lens barrel 20, the first portion 301 of the flexible circuit board 30 still remains between the inner side wall of the first lens barrel 10 and the outer side wall of the second lens barrel 20, that is, the first portion 301 does not exceed the actual range of the first gap 101. Thus, the flexible circuit board 30 will not be deformed randomly or even extend into the lens barrel to block light.

[0042] Optionally, as shown in Figure 1 and Figures 5 to 9 , the imaging module further includes a photosensitive chip 60. The flexible circuit board 30 is fixedly connected to the second lens barrel 20. When the second lens barrel 20 is located at the first position close to the photosensitive chip 60, the first portion 301 of the flexible circuit board 30 located in the first gap 101 has a first bending section 3011.

[0043] Specifically, as shown in Figure 1 and Figures 5 to 9 , a photosensitive chip 60 is provided on the side of the first lens barrel 10 away from the second lens barrel 20. The first lens barrel 10 and the second lens barrel 20 can move relative to each other. When the second lens barrel 20 moves to the first position close to the photosensitive chip 60, the second lens barrel 20 contracts to the inside of the first lens barrel 10. Since the overall telescopic lens barrel formed by the first lens barrel 10 and the second lens barrel 20 shortens, the required flexible circuit board 30 also becomes shorter, and it is necessary to accommodate the redundant flexible circuit board 30.

[0044] The flexible circuit board 30 is fixedly connected to the surface of the second lens barrel 20 facing the photosensitive chip 60, so that during the process of the second lens barrel 20 moving to the first position close to the photosensitive chip 60, both sides of the first portion 301 are fixed, and the first portion 301 of the flexible circuit board 30 can be bent in the first gap 101 along with the movement of the second lens barrel 20 to form a first bending section 3011. By bending, the first portion 301 of the flexible circuit board 30 is accommodated in the first gap 101. Under the limiting action of the inner side wall of the first lens barrel 10 and the outer side wall of the second lens barrel 20, the flexible circuit board 30 will not be deformed randomly or even extend into the lens barrel to block light.

[0045] To avoid damage to the flexible circuit board 30 caused by repeated bending, the first bending section 3011 can be thickened or strengthened to improve the bending resistance of the flexible circuit board 30, thereby improving the service durability of the imaging module.

[0046] Optionally, as shown in Figure 8 and Figure 9As shown, the camera module further includes a first guiding member 70, and the first guiding member 70 is attached to the first bending section 3011; when the second lens barrel 20 is in the first position, the first guiding member 70 bends along with the first bending section 3011 and supports the first bending section 3011.

[0047] Specifically, as Figure 8 and Figure 9 shown, the flexible circuit board 30 uses the first bending section 3011 to achieve bending and accommodation in the first gap 101. A first guiding member 70 is further provided on the flexible circuit board 30, and the first guiding member 70 is attached to the first bending section 3011. Specifically, the first guiding member 70 and the first bending section 3011 can be fixed by bonding or clamping. The first guiding member 70 can be provided on the inner side of the first bending section 3011 or on the outer side of the first bending section 3011. The inner side of the first bending section 3011 is the side close to the center of curvature of the first bending section 3011, and the outer side of the first bending section 3011 is the side far from the center of curvature of the first bending section 3011. The first guiding member 70 can also be provided on both the inner side and the outer side of the first bending section 3011.

[0048] The first guiding member 70 can be a flexible plate or a bendable hinge, etc. When the second lens barrel 20 moves to the first position close to the photosensitive chip 60, the first part 301 bends at the first bending section 3011 and is accommodated in the first gap 101. The first guiding member 70 will bend along with the first bending section 3011, and the bending direction of the first guiding member 70 is the same as that of the first bending section 3011.

[0049] By providing the first guiding member 70, the first bending section 3011 of the flexible circuit board 30 can be supported and strengthened, the bending direction and bending size of the first bending section 3011 can be restricted, and the flexible circuit board 30 can be prevented from bending randomly, so as to avoid problems such as jamming between the first lens barrel 10 and the second lens barrel 20 and blocking of the photosensitive chip 60.

[0050] Optionally, referring to Figure 7 and Figure 10 shown, the first guiding member 70 includes a hinge 80; the hinge 80 includes a connecting shaft 801 and a plurality of support plates 802, and adjacent support plates 802 are connected by the connecting shaft 801; the extending direction of the support plates 802 is parallel to the extending direction of the bending axis of the first bending section 3011.

[0051] Specifically, as Figure 7 and Figure 10As shown, the first guiding member 70 can adopt a hinge 80. The hinge 80 includes a connecting shaft 801 and a plurality of support plates 802. The support plates 802 can be made of metal or plastic. The plurality of support plates 802 are arranged in parallel, and there is a gap between adjacent support plates 802. The plurality of support plates 802 are connected in series by the connecting shaft 801. The connecting shaft 801 can be a metal wire or a fiber structure, having certain bendable properties and can bend together with the plurality of support plates 802. As Figure 7 shown, point O is the bending axis of the first bending section 3011. The extending direction of the bending axis is perpendicular to the paper surface and into the paper. The extending direction of the support plate 802, that is, the length direction of the support plate 802, is parallel to the extending direction of the bending axis.

[0052] The number of the connecting shafts 801 can be one, two or more, and can be selected according to the length of the support plate 802. When the length of the support plate 802 is relatively long, in order to ensure the stability of the series connection of the support plates 802, a plurality of connecting shafts 801 can be arranged at intervals along the length direction of the support plate 802.

[0053] The hinge 80 is attached to the first bending section 3011 of the flexible circuit board 30. The support plate 802 can play a good role in supporting and limiting the first bending section 3011, and will bend together with the first bending section 3011. Moreover, the bending direction of the hinge 80 is the same as that of the first bending section 3011, which can limit the bending direction and bending size of the first bending section 3011, and prevent the flexible circuit board 30 from bending randomly, resulting in problems such as jamming between the first lens barrel 10 and the second lens barrel 20 and blocking the photosensitive chip 60.

[0054] Optionally, referring to Figure 6 and Figure 7 shown, when the second lens barrel 20 is in the first position, the first guiding member 70 bends along with the first bending section 3011 and limits the bending radius of the first bending section 3011 to be greater than or equal to 0.2 mm.

[0055] Specifically, as Figure 6 and Figure 7 shown, when the second lens barrel 20 moves to the first position close to the photosensitive chip 60, the first part 301 bends at the first bending section 3011 and is received in the first gap 101. The first guiding member 70 will bend together with the first bending section 3011. Under the support of the first guiding member 70, the first bending section 3011 is bent into a U shape, with an arc transition at the bending part, and the bending radius of the first bending section 3011 is greater than or equal to 0.2 mm, avoiding the phenomenon of stress concentration in the first bending section 3011 of the flexible circuit board 30 and improving the anti-bending ability of the flexible circuit board 30.

[0056] Optionally, referring to Figures 3 to 4As shown, the camera module further includes a third lens barrel 90; the third lens barrel 90 is movably disposed inside the second lens barrel 20, and there is a second gap 102 between the inner sidewall of the second lens barrel 20 and the outer sidewall of the third lens barrel 90; the second portion 302 of the flexible circuit board 30 is located within the second gap 102.

[0057] Specifically, as Figures 3 to 4 shown, the camera module further includes a third lens barrel 90. The inner diameter of the second lens barrel 20 is slightly larger than the outer diameter of the third lens barrel 90. The second lens barrel 20 is sleeved on the third lens barrel 90 for installation. The inner sidewall of the second lens barrel 20 faces the outer sidewall of the third lens barrel 90, and there is a second gap 102 between the inner sidewall of the second lens barrel 20 and the outer sidewall of the third lens barrel 90. The second gap 102 is about 0.5 mm.

[0058] A lens assembly 50 is installed inside the third lens barrel 90, and the flexible circuit board 30 is used to supply power to the lens assembly 50. Along the optical axis direction of the camera module, the second lens barrel 20 and the third lens barrel 90 can move relative to each other. Specifically, slide rails can be provided on the inner sidewall of the second lens barrel 20 or the outer sidewall of the third lens barrel 90 to achieve the relative movement of the second lens barrel 20 and the third lens barrel 90.

[0059] When the second lens barrel 20 and the third lens barrel 90 move relative to each other, it will drive the flexible circuit board 30 to deform accordingly. The second portion 302 of the flexible circuit board 30 can be installed in the second gap 102 for storage. Here, the second portion 302 is the part of the flexible circuit board 30 close to the third lens barrel 90. When the second portion 302 of the flexible circuit board 30 is located in the second gap 102, the inner sidewall of the second lens barrel 20 and the outer sidewall of the third lens barrel 90 will restrict the second portion 302, preventing the flexible circuit board 30 from deforming randomly or even extending into the lens barrel to block light.

[0060] In the embodiment of the present invention, by storing the first portion 301 of the flexible circuit board 30 in the first gap 101 and the second portion 302 of the flexible circuit board 30 in the second gap 102, the position of the flexible circuit board 30 inside the lens barrel is relatively fixed, the bending deformation of the flexible circuit board 30 is controllable, and the occlusion of the internal space of the lens barrel can be reduced, which is beneficial to increasing the light input of the lens and arranging a larger-sized photosensitive chip 60, thereby improving the shooting quality.

[0061] Optionally, referring to Figures 3 to 4 shown, the camera module further includes a driving component 40 and a lens assembly 50. The lens assembly 50 is disposed inside the third lens barrel 90. One end of the flexible circuit board 30 is electrically connected to the driving component 40, and the other end of the flexible circuit board 30 passes through the first gap 101 and the second gap 102 and is electrically connected to the lens assembly 50.

[0062] Specifically, asFigures 3 to 4 As shown, the lens assembly 50 is disposed within the third lens barrel 90. One end of the flexible circuit board 30 is electrically connected to the driving assembly 40, and the other end of the flexible circuit board 30 passes through the first gap 101 and the second gap 102 and is electrically connected to the lens assembly 50, transmitting the electrical signal of the driving assembly 40 to the VCM to control the focusing and zooming functions of the lens assembly 50. By utilizing the cooperation of the VCM with the first lens barrel 10, the second lens barrel 20, and the third lens barrel 90, a larger range of focal length adjustment can be achieved.

[0063] When arranging the flexible circuit board 30, the other end of the flexible circuit board 30 passes through the first gap 101 and the second gap 102 and is electrically connected to the lens assembly 50, such that the first portion 301 of the flexible circuit board 30 is located within the first gap 101 and the second portion 302 of the flexible circuit board 30 is located within the second gap 102, thereby achieving the accommodation of the flexible circuit board 30. Under the restrictive action of the inner sidewall of the first lens barrel 10 and the outer sidewall of the second lens barrel 20, as well as the inner sidewall of the second lens barrel 20 and the outer sidewall of the third lens barrel 90, the flexible circuit board 30 will not be deformed randomly or even extend into the lens barrel to block light.

[0064] Optionally, as shown in Figures 3 to 4 When the third lens barrel 90 is in the retracted position close to the photosensitive chip 60, the third lens barrel 90 is located inside the second lens barrel 20, and the second portion 302 of the flexible circuit board 30 is located within the second gap 102; when the third lens barrel 90 is in the extended position away from the photosensitive chip 60, one end of the third lens barrel 90 extends out of the second lens barrel 20, and the second portion 302 is located between the inner sidewall of the second lens barrel 20 and the outer sidewall of the third lens barrel 90.

[0065] Specifically, as shown in Figures 3 to 4 A photosensitive chip 60 is provided on the side close to the first lens barrel 10, and the second lens barrel 20 and the third lens barrel 90 can move relative to each other. Figure 3 FIG. is a schematic structural diagram of the camera module when the second lens barrel 20 is in the first position and the third lens barrel 90 is in the retracted position in an embodiment of the present invention. When the third lens barrel 90 moves to the retracted position close to the photosensitive chip 60, the third lens barrel 90 contracts inside the second lens barrel 20, and the overall telescopic lens barrel formed by the second lens barrel 20 and the third lens barrel 90 shortens. The inner sidewall of the second lens barrel 20 partially overlaps with the outer sidewall of the third lens barrel 90 to form the second gap 102. Driven by the second lens barrel 20 and the third lens barrel 90, the second portion 302 of the flexible circuit board 30 is accommodated in the second gap 102. Under the restrictive action of the inner sidewall of the second lens barrel 20 and the outer sidewall of the third lens barrel 90, the flexible circuit board 30 will not be deformed randomly or even extend into the lens barrel to block light.

[0066] Figure 4FIG. 0 is a schematic structural diagram of the camera module when the second lens barrel 20 is in the second position and the third lens barrel 90 is in the extended position in the embodiments of the present invention. When the third lens barrel 90 moves to the extended position away from the photosensitive chip 60, that is, the third lens barrel 90 extends out of the second lens barrel 20, the overall telescopic lens barrel formed by the second lens barrel 20 and the third lens barrel 90 elongates. At this time, supported by the second lens barrel 20 and the third lens barrel 90, the second part 302 of the flexible circuit board 30 is located between the inner side wall of the second lens barrel 20 and the outer side wall of the third lens barrel 90. It can be understood that the inner side wall of the second lens barrel 20 and the outer side wall of the third lens barrel 90 project in the direction of the photosensitive chip 60, and the area formed between the two projections is the area between the inner side wall of the second lens barrel 20 and the outer side wall of the third lens barrel 90, and this area is actually an extension of the second gap 102.

[0067] Since the third lens barrel 90 extends out of the second lens barrel 20, the inner side wall of the second lens barrel 20 and the outer side wall of the third lens barrel 90 are not in a relative state. However, since the overall telescopic lens barrel formed by the second lens barrel 20 and the third lens barrel 90 elongates, the required length of the flexible circuit board 30 also increases accordingly. Under the pulling of the second lens barrel 20 and the third lens barrel 90, the second part 302 of the flexible circuit board 30 still remains between the inner side wall of the second lens barrel 20 and the outer side wall of the third lens barrel 90, that is, the second part 302 does not exceed the actual range of the second gap 102. Thus, the flexible circuit board 30 will not be deformed randomly or even extend into the lens barrel to block light.

[0068] Optionally, as shown in Figure 3 、 Figures 5 to 9 FIG. 10, the camera module further includes a photosensitive chip 60. A connecting part 303 is provided between the first part 301 and the second part 302 of the flexible circuit board 30. The connecting part 303 is fixedly connected to the second lens barrel 20. When the third lens barrel 90 is in the retracted position, the second part 302 of the flexible circuit board 30 located in the second gap 102 has a second bending section 3021.

[0069] Specifically, as shown in Figure 3 、 Figures 5 to 9 FIG. 17, the second lens barrel 20 and the third lens barrel 90 can move relative to each other. When the third lens barrel 90 moves to the retracted position close to the photosensitive chip 60, the third lens barrel 90 contracts to the inside of the second lens barrel 20. Since the overall telescopic lens barrel formed by the second lens barrel 20 and the third lens barrel 90 shortens, the required flexible circuit board 30 also becomes shorter, and it is necessary to accommodate the redundant flexible circuit board 30.

[0070] The flexible circuit board 30 includes a first part 301, a second part 302, and a connecting part 303, and the connecting part 303 is located between the first part 301 and the second part 302. During the process of the third lens barrel 90 moving to the retracted position close to the photosensitive chip 60, the second part 302 of the flexible circuit board 30 bends in the second gap 102 as the third lens barrel 90 moves to form a second bending section 3021. By bending, the second part 302 of the flexible circuit board 30 is received into the second gap 102. Under the restricting action of the inner side wall of the second lens barrel 20 and the outer side wall of the third lens barrel 90, the flexible circuit board 30 will not deform randomly or even extend into the lens barrel to block light.

[0071] To avoid damage to the flexible circuit board 30 due to repeated bending, the second bending section 3021 can be thickened or strengthened to improve the bending resistance of the flexible circuit board 30, thereby enhancing the service durability of the imaging module.

[0072] The connecting part 303 is used to be fixed to the second lens barrel 20. The specific fixing method can be bonding or snap - fitting, etc. For example, an adhesive can be coated or an adhesive layer can be provided on the side of the connecting part 303 close to the second lens barrel 20, and the flexible circuit board 30 is bonded to the second lens barrel 20 through the connecting part 303. Specifically, it can be bonded to the inner wall of the second lens barrel 20 or to the bottom surface of the second lens barrel 20 close to the first lens barrel 10. During the telescoping process of the lens barrel, the flexible circuit board 30 only bends on the first part 301 and the second part 302, and the rest does not displace or deform, greatly improving the installation stability of the flexible circuit board 30.

[0073] In addition, referring to Figures 8 to 9 as shown, pads 304 need to be provided at both ends of the flexible circuit board 30. One end of the pad 304 is used to connect the lens assembly 50, and the other end of the pad 304 is used to connect the driving assembly 40. Bending sections are respectively provided at the pads 304 near both ends to facilitate the connection at the pads 304.

[0074] Optionally, referring to Figure 8 and Figure 9 as shown, the imaging module further includes a second guiding member 100, and the second guiding member 100 is attached to the second bending section 3021; when the third lens barrel 90 is in the retracted position, the second guiding member 100 bends with the second bending section 2021 and supports the second bending section 3021.

[0075] Specifically, as Figure 8 and Figure 9As shown, the flexible circuit board 30 uses the second bending section 3021 to achieve bending and accommodation in the second gap 102. A second guiding member 100 is also provided on the flexible circuit board 30. The second guiding member 100 is attached to the second bending section 3021, and can be fixed to the second bending section 3021 by bonding or clamping. The second guiding member 100 can be disposed on the inner side of the second bending section 3021 or on the outer side of the second bending section 3021. The inner side of the second bending section 3021 is the side close to the center of curvature of the second bending section 3021, and the outer side of the second bending section 3021 is the side far from the center of curvature of the second bending section 3021. The second guiding member 100 can also be disposed on both the inner side and the outer side of the second bending section 3021.

[0076] The second guiding member 100 can be a flexible plate or a bendable hinge, etc. When the third lens barrel 90 moves to the retracted position close to the photosensitive chip 60, the second part 302 bends at the second bending section 3021 and is accommodated in the second gap 102. The second guiding member 100 will bend together with the second bending section 3021, and the bending direction of the second guiding member 100 is the same as the bending direction of the second bending section 3021.

[0077] By providing the second guiding member 100, the second bending section 3021 of the flexible circuit board 30 can be supported and strengthened. The bending direction and bending size of the second bending section 3021 are restricted to prevent the flexible circuit board 30 from bending randomly, and problems such as jamming of the second lens barrel 20 and the third lens barrel 90 and blocking of the photosensitive chip 60 are avoided.

[0078] Optionally, referring to Figure 7 and Figure 10 As shown, the second guiding member 100 includes a hinge 80; the hinge 80 includes a connecting shaft 801 and a plurality of support plates 802, and adjacent support plates 802 are connected by the connecting shaft 801; the extending direction of the support plates 802 is parallel to the extending direction of the bending axis of the second bending section 3021.

[0079] Specifically, as Figure 7 and Figure 10 shown, the second guiding member 100 can also adopt a hinge 80. The hinge 80 includes a connecting shaft 801 and a plurality of support plates 802. The support plates 802 can be made of metal or plastic. The plurality of support plates 802 are arranged in parallel, and there is a gap between adjacent support plates 802. The plurality of support plates 802 are connected in series by the connecting shaft 801. The connecting shaft 801 can be a metal wire or a fiber structure, and has certain bendable performance and can bend together with the plurality of support plates 802.

[0080] The number of connecting shafts 801 can be one, two, or more, which can be selected according to the length of the support plate 802. When the length of the support plate 802 is relatively long, in order to ensure the stability of the series connection of the support plate 802, a plurality of connecting shafts 801 can be arranged at intervals along the length direction of the support plate 802.

[0081] The hinge 80 is attached to the second bending section 3021 of the flexible circuit board 30. The support plate 802 can play a good role in supporting and limiting the second bending section 3021, and will bend together with the second bending section 3021. Moreover, the bending direction of the hinge 80 is the same as that of the second bending section 3021, which can limit the bending direction and bending size of the second bending section 3021, avoiding the problem that the flexible circuit board 30 bends randomly, resulting in jamming between the second lens barrel 20 and the third lens barrel 90 and blocking the photosensitive chip 60.

[0082] Optionally, referring to Figure 6 and Figure 7 As shown, when the third lens barrel 90 is in the retracted position, the second guiding member 100 bends along with the second bending section 3021 and defines that the bending radius of the second bending section 3021 is greater than or equal to 0.2 mm.

[0083] Specifically, as shown in Figure 6 and Figure 7 When the third lens barrel 90 moves to the retracted position close to the photosensitive chip 60, the second part 302 bends at the second bending section 3021 and is received in the second gap 102. The second guiding member 100 will bend together with the second bending section 3021. Under the support of the second guiding member 100, the second bending section 3021 is bent in a U shape, with an arc transition at the bending part, and the bending radius of the second bending section 3021 is greater than or equal to 0.2 mm, avoiding the phenomenon of stress concentration in the second bending section 3021 of the flexible circuit board 30 and improving the bending resistance of the flexible circuit board 30.

[0084] Optionally, referring to Figures 3 to 4 As shown, the second lens barrel 20 is movably arranged inside the first lens barrel 10, and there is a first gap 101 between the inner side wall of the first lens barrel 10 and the outer side wall of the second lens barrel 20; the first part 301 of the flexible circuit board 30 is located in the first gap 101; the third lens barrel 90 is movably arranged inside the second lens barrel 20, and there is a second gap 102 between the inner side wall of the second lens barrel 20 and the outer side wall of the third lens barrel 90; the second part 302 of the flexible circuit board 30 is located in the second gap 102.

[0085] Specifically, as shown in Figures 3 to 4As shown in the figure, the camera module adopts a three-stage lens barrel structure, further enhancing the zoom ability. The camera module includes a first lens barrel 10, a second lens barrel 20, and a third lens barrel 90. The first lens barrel 10 is sleeved on the second lens barrel 20, and the inner side wall of the first lens barrel 10 faces the outer side wall of the second lens barrel 20, forming a first gap 101. The second lens barrel 20 is sleeved on the third lens barrel 90, and the inner side wall of the second lens barrel 20 faces the outer side wall of the third lens barrel 90, forming a second gap 102. Light enters the third lens barrel 90, the second lens barrel 20, and the first lens barrel 10 through the lens, and finally is transmitted to the photosensitive chip 60 to achieve imaging. The relative movement between the first lens barrel 10 and the second lens barrel 20 and the relative movement between the second lens barrel 20 and the third lens barrel 90 can be controlled separately or uniformly.

[0086] A lens assembly 50 is installed in the third lens barrel 90, and a flexible circuit board 30 is used to supply power to the lens assembly 50. The flexible circuit board 30 includes a first part 301 and a second part 302. Among them, the first part 301 is the part of the flexible circuit board 30 close to the first lens barrel 10, and the second part 302 is the part of the flexible circuit board 30 close to the third lens barrel 90.

[0087] When the second lens barrel 20 moves to the first position close to the photosensitive chip 60 and the third lens barrel 90 moves to the retracted position close to the photosensitive chip 60, the first part 301 of the flexible circuit board 30 is received into the first gap 101, and the second part 302 of the flexible circuit board 30 is received into the second gap 102, and the flexible circuit board 30 is distributed in an M shape as a whole.

[0088] In the embodiment of the present invention, by receiving the first part 301 of the flexible circuit board 30 into the first gap 101 and receiving the second part 302 of the flexible circuit board 30 into the second gap 102, the position of the flexible circuit board 30 inside the lens barrel is relatively fixed, the bending deformation of the flexible circuit board 30 is controllable, the shielding of the internal space of the lens barrel can be reduced, which is beneficial to increasing the light input of the lens and arranging a photosensitive chip 60 with a larger size, and improving the shooting quality.

[0089] The embodiment of the present invention also provides an electronic device, including the above camera module. The electronic device may include, but is not limited to, at least one of a mobile phone, a tablet computer, and a wearable device. The specific type of the electronic device in the embodiment of the present invention may not be limited.

[0090] In an embodiment of the present invention, the electronic device includes the above-described camera module. The camera module includes a first lens barrel 10, a second lens barrel 20, a third lens barrel 90, and a flexible circuit board 30. The second lens barrel 20 is movably disposed inside the first lens barrel 10, and there is a first gap 101 between the inner sidewall of the first lens barrel 10 and the outer sidewall of the second lens barrel 20. The first portion 301 of the flexible circuit board 30 is located in the first gap 101. The third lens barrel 90 is movably disposed inside the second lens barrel 20, and there is a second gap 102 between the inner sidewall of the second lens barrel 20 and the outer sidewall of the third lens barrel 90. The second portion 302 of the flexible circuit board 30 is located in the second gap 102. By accommodating the first portion 301 of the flexible circuit board 30 into the first gap 101 and the second portion 302 of the flexible circuit board 30 into the second gap 102, the position of the flexible circuit board 30 inside the lens barrel is relatively fixed, the bending deformation of the flexible circuit board 30 is controllable, the shielding of the internal space of the lens barrel can be reduced, which is beneficial to increasing the light incident amount of the lens and arranging a photosensitive chip 60 with a larger size, and improving the shooting quality.

[0091] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0092] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. An imaging module, characterized in that, Comprising: A first lens barrel, a second lens barrel, and a flexible circuit board; The second lens barrel is movably disposed inside the first lens barrel, and there is a first gap between the inner side wall of the first lens barrel and the outer side wall of the second lens barrel. A first portion of the flexible circuit board is located in the first gap; the first portion of the flexible circuit board in the first gap has a first bending section; The imaging module further includes a first guiding member, and the first guiding member is attached to the first bending section; When the second lens barrel is in the first position, the first guiding member bends along with the first bending section and supports the first bending section; The first guiding member includes a hinge; The hinge includes a connecting shaft and a plurality of support plates, and adjacent support plates are connected by the connecting shaft; The extending direction of the support plate is parallel to the extending direction of the bending axis of the first bending section.

2. The camera module according to claim 1, wherein It further includes a driving assembly and a lens assembly. One end of the flexible circuit board is electrically connected to the driving assembly, and the other end of the flexible circuit board passes through the first gap and is electrically connected to the lens assembly.

3. The imaging module according to claim 1, wherein It further includes an image sensor chip. When the second lens barrel is in the first position close to the image sensor chip, the second lens barrel is inside the first lens barrel, and the first portion is located in the first gap; When the second lens barrel is in the second position far from the image sensor chip, one end of the second lens barrel extends out of the first lens barrel, and the first portion is located between the inner side wall of the first lens barrel and the outer side wall of the second lens barrel.

4. The camera module according to claim 1, wherein It further includes an image sensor chip. The flexible circuit board is fixedly connected to the second lens barrel. When the second lens barrel is in the first position close to the image sensor chip, the first portion of the flexible circuit board located in the first gap has a first bending section.

5. The camera module according to claim 1, wherein When the second lens barrel is in the first position, the first guiding member bends along with the first bending section and defines that the bending radius of the first bending section is greater than or equal to 0.2 mm.

6. The imaging module according to claim 1, wherein, It further includes a third lens barrel; The third lens barrel is movably disposed inside the second lens barrel, and there is a second gap between the inner side wall of the second lens barrel and the outer side wall of the third lens barrel; a second portion of the flexible circuit board is located in the second gap.

7. The camera module according to claim 6, wherein, It further includes a driving assembly and a lens assembly. The lens assembly is disposed inside the third lens barrel. One end of the flexible circuit board is electrically connected to the driving assembly, and the other end of the flexible circuit board passes through the first gap and the second gap and is electrically connected to the lens assembly.

8. The camera module according to claim 6, wherein It further includes an image sensor chip. When the third lens barrel is in the retracted position close to the image sensor chip, the third lens barrel is inside the second lens barrel, and the second portion of the flexible circuit board is located in the second gap; When the third lens barrel is in the extended position far from the image sensor chip, one end of the third lens barrel extends out of the second lens barrel, and the second portion is located between the inner side wall of the second lens barrel and the outer side wall of the third lens barrel.

9. The camera module according to claim 6, wherein It further includes an image sensor chip. A connection part is provided between the first part and the second part of the flexible circuit board. The connection part is fixedly connected to the second lens barrel. When the third lens barrel is in the retracted position of the image sensor chip, the second part of the flexible circuit board located in the second gap has a second bending section.

10. The camera module according to claim 9, wherein, It further includes a second guiding member, and the second guiding member is attached to the second bending section; When the third lens barrel is in the retracted position, the second guiding member bends along with the second bending section and supports the second bending section.

11. The imaging module according to claim 10, wherein The second guiding member includes a hinge; The hinge includes a connecting shaft and a plurality of support plates, and adjacent support plates are connected by the connecting shaft; The extending direction of the support plate is parallel to the extending direction of the bending axis of the second bending section.

12. The imaging module according to claim 10, wherein, When the third lens barrel is in the retracted position, the second guiding member bends along with the second bending section and defines that the bending radius of the second bending section is greater than or equal to 0.2 mm.

13. An electronic device, characterized in that, Comprising: The imaging module according to any one of claims 1-12.

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