A multi-stage ladder PCB pressing jig and a preparation process thereof

Abstract

The application discloses a kind of multistage ladder PCB pressing fixtures and preparation process thereof, wherein a kind of multistage ladder PCB pressing fixture includes resin plate A, the lower surface of resin plate A is provided with first ladder part and second ladder part;The first ladder part and second ladder part include PP sheet and resin plate B, the upper surface of the PP sheet is fixedly connected with the lower surface of the resin plate A, and the lower surface of the PP sheet is fixedly connected with the resin plate B;A kind of multistage ladder PCB pressing fixture and preparation process thereof provided by the application can realize the one-time pressing of multistage ladder of different depth, without manually placing gasket one by one at ladder position, improve production efficiency while also guarantee the precision consistency of batch multistage ladder PCB production to the greatest extent.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB boards, and in particular to a multi-step PCB board pressing jig and a preparation process thereof. Background Art

[0002] As electronic products become increasingly miniaturized and lightweight, PCB boards need to continue to shrink in size while also having the ability to carry more components. To increase the wiring density of components on PCB boards, electronic products can be designed as multi-level stepped high-frequency PCB boards. High-frequency PCB boards are made by gluing two or more high-frequency Core boards together through high-frequency PP sheets. Stepped windows can be designed on different Core boards, and component pads can be designed inside the stepped windows, thereby improving the current limitation that component pad wiring design can only be performed on the surface of the outermost Core board on PCB boards. Since there are multiple hollowed-out window areas in the stepped board, and the pads in the hollowed-out areas need to be punched, it is necessary to ensure that the pads in the hollowed-out areas are not contaminated during the PCB production process. Traditional PCB stepped boards require manual placement of gaskets in the stepped area. Manual placement of gaskets has disadvantages such as poor placement accuracy and consistency, and low placement efficiency, which limits the large-scale production of products.

[0003] Based on the above situation, the present invention proposes a multi-step PCB board pressing fixture and its preparation process, which can effectively solve the above problems. Summary of the Invention

[0004] The present invention aims to provide a multi-step PCB lamination jig and its manufacturing process. The jig and its manufacturing process can simultaneously press multiple steps of varying depths, eliminating the need for manual placement of gaskets at each step. This improves production efficiency while also ensuring maximum precision and consistency during batch production of multi-step PCBs.

[0005] The present invention is achieved through the following technical solutions:

[0006] A multi-step stepped PCB pressing jig includes a resin plate A, the lower surface of which is provided with a first stepped portion and a second stepped portion; the first stepped portion and the second stepped portion both include a PP sheet and a resin plate B, the upper surface of the PP sheet is fixedly connected to the lower surface of the resin plate A, and the lower surface of the PP sheet is fixedly connected to the resin plate B.

[0007] According to the above technical solution, as a further preferred technical solution of the above technical solution, the resin plate A, the PP sheet and the resin plate B are fixedly connected by pressing.

[0008] According to the above technical solution, as a further preferred technical solution of the above technical solution, the thickness of the resin plate B of the first stepped portion is greater than the thickness of the resin plate B of the second stepped portion.

[0009] According to the above technical solution, as a further preferred technical solution of the above technical solution, the width of the first stepped portion is greater than the width of the second stepped portion.

[0010] According to the above technical solution, as a further preferred technical solution of the above technical solution, alignment pin holes are respectively provided on both sides of the resin plate A.

[0011] The preparation process for manufacturing the above-mentioned multi-step PCB board pressing fixture includes the following steps:

[0012] S1. Selection of mold plate and production of alignment pin holes: Select resin plate A with a thickness greater than 2 mm as the mold plate material, and use a precision drilling machine with depth control function to drill the alignment pin holes according to the preset program;

[0013] S2. Cut the release film and PP sheet, adhere the PP sheet to the release film, use a UV laser machine to cut a stepped position pattern on the release film according to a preset program, and cut a stepped position PP pattern on the PP sheet according to a preset program; tear off the unnecessary waste PP sheet and release film after cutting, and slightly bond the remaining PP sheet to the release film;

[0014] S3, pressing, pressing the resin plate A, PP sheet and resin plate B;

[0015] S4, hollowing out the jig after pressing in step 3, using a precision molding machine to remove the resin plate B outside the stepped position to form the required first and second stepped parts;

[0016] S5, step finishing, using a depth-controlled gong machine to mill and finish the second step, and at the same time, fine-tune the length and width of each first step and second step;

[0017] S6. Cleaning and inspection: Use water to clean the completed fixture. After cleaning, use a micrometer or vernier caliper to measure the length, width and height of each first step and second step in turn. After passing the inspection, the fixture will be released for production use.

[0018] According to the above technical solution, as a further preferred technical solution of the above technical solution, in step S3, the thickness of the resin board B after lamination is 0.2 mm smaller than the deepest step depth designed on the PCB board.

[0019] According to the above technical solution, as a further preferred technical solution of the above technical solution, in step S5, the height of the second step portion after milling is 0.2 mm smaller than the step depth designed on the PCB board; the length and width dimensions of the first step portion and the second step portion after fine-tuning are 0.1 mm smaller on one side than the step dimensions designed on the PCB board.

[0020] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0021] The present invention provides a multi-step PCB board pressing jig and its preparation process, which can realize the simultaneous pressing of multiple steps of different depths without the need to manually place gaskets at the step positions one by one. This improves production efficiency while also ensuring the precision consistency of batch multi-step PCB board production to the greatest extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a longitudinal cross-sectional view of the present invention;

[0023] Figure 2 It is a flow chart of the preparation process of the present invention. DETAILED DESCRIPTION

[0024] To help those skilled in the art better understand the technical solutions of the present invention, the preferred embodiments of the present invention are described below in conjunction with specific examples. However, it should be understood that the drawings are for illustrative purposes only and are not to be construed as limiting this patent. To better illustrate this embodiment, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the dimensions of actual products. For those skilled in the art, it is understandable that some well-known structures and their descriptions may be omitted in the drawings. The positional relationships described in the drawings are for illustrative purposes only and are not to be construed as limiting this patent.

[0025] The specific embodiments of the present invention are further described in detail below with reference to the schematic diagrams.

[0026] like Figure 1 As shown, a multi-step stepped PCB board pressing fixture includes a resin plate A1, the lower surface of which is provided with a first step portion 2 and a second step portion 3; the first step portion 2 and the second step portion 3 both include a PP sheet 4 and a resin plate B5, the upper surface of the PP sheet 4 is fixedly connected to the lower surface of the resin plate A1, and the lower surface of the PP sheet 4 is fixedly connected to the resin plate B5.

[0027] Furthermore, in another embodiment, the resin plate A1, the PP sheet 4 and the resin plate B5 are fixedly connected by pressing.

[0028] Furthermore, in another embodiment, the thickness of the resin plate B5 of the first stepped portion 2 is greater than the thickness of the resin plate B5 of the second stepped portion 3. The width of the first stepped portion 2 is greater than the width of the second stepped portion 3.

[0029] By adopting the above technical solution, a stepped layer structure with different widths and depths can be formed on the PCB board.

[0030] Furthermore, in another embodiment, alignment pin holes 6 are respectively provided on both sides of the resin plate A1.

[0031] By adopting the above technical solution and setting the alignment pin hole 6, the alignment accuracy between the jig and the PCB board during pressing is ensured, and misalignment caused by the slide plate is avoided.

[0032] like Figure 2 As shown, a preparation process of a multi-step PCB board pressing fixture includes the following steps:

[0033] S1. Selection of mold plate and production of alignment pin holes. Select a resin plate A1 with a thickness greater than 2 mm as the mold plate material. Use a precision drilling machine with a depth control function to drill alignment pin holes 6 according to a preset program. The purpose of the alignment pin holes 6 is to ensure the alignment accuracy between the jig and the PCB board during pressing and avoid misalignment caused by the slide.

[0034] S2, cutting the release film 7 and the PP sheet 4, adhering the PP sheet 4 to the release film 7, using a UV laser machine to cut a stepped position pattern on the release film 7 according to a preset program, and cutting a stepped position PP pattern on the PP sheet 4 according to a preset program; tearing off the unnecessary waste PP sheet 4 and release film 7 after cutting, and slightly adhering the remaining PP sheet 4 to the release film 7;

[0035] S3, pressing, pressing the resin plate A 1, the PP sheet 4 and the resin plate B 5;

[0036] S4, hollow molding, use a precision molding machine to remove the resin plate B5 outside the stepped position from the jig after lamination in step 3, and form the required first step portion 2 and second step portion 3; since the release film 7 is pre-padded during lamination, the resin plate B5 outside the stepped position can be easily removed after the molding edge.

[0037] S5, step finishing, using a depth-controlled gong machine to perform milling and finishing on the second step portion 3, and at the same time, fine-tune the length and width of each first step portion 2 and second step portion 3;

[0038] S6. Cleaning and inspection: Use water to clean the completed fixture. After cleaning, use a micrometer or vernier caliper to measure the length, width and height of each first step part 2 and second step part 3 in turn. After passing the inspection, the fixture will be released for production use.

[0039] Furthermore, in another embodiment, in step S3, the thickness of the resin board B 5 after lamination is 0.2 mm less than the deepest step depth designed on the PCB. The height of the second step portion 3 after milling is 0.2 mm less than the designed step depth on the PCB. During the lamination process, a 0.2 mm gap is left between the bottom of each first step portion 2 and the second step portion 3 and the surface of the step position on the PCB, preventing deformation of the first step portion 2 and the second step portion 3 during the lamination process, thereby improving the service life of the jig. At the same time, the length and width dimensions of the first step portion 2 and the second step portion 3 after finishing are 0.1 mm smaller on one side than the designed step dimensions on the PCB. During the lamination process, each first step portion 2 and the second step portion 3 will have friction with the steps of the PCB. By providing a 0.1 mm single-sided gap, friction can be reduced, further improving the service life of the jig.

[0040] The present invention provides a multi-step PCB board pressing jig and its preparation process, which can realize the simultaneous pressing of multiple steps of different depths without the need to manually place gaskets at the step positions one by one. This improves production efficiency while also ensuring the precision consistency of batch multi-step PCB board production to the greatest extent.

[0041] Unless otherwise specified, in the present invention, if there are terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicating orientation or positional relationships, they are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the orientation or positional relationships in the present invention are only used for illustrative purposes and cannot be understood as limiting this patent. For ordinary technicians in this field, they can understand the specific meanings of the above terms in conjunction with the drawings and according to specific circumstances.

[0042] Unless otherwise specified or limited, the terms "disposed," "connected," and "connected" in this disclosure should be interpreted broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediary, or internal connections between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on the specific circumstances.

[0043] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any simple modification or equivalent change made to the above embodiment based on the technical essence of the present invention shall fall within the scope of protection of the present invention.

Claims

1. A multi-step PCB board pressing fixture, characterized by: The invention comprises a resin plate A (1), wherein the lower surface of the resin plate A (1) is provided with a first stepped portion (2) and a second stepped portion (3); the first stepped portion (2) and the second stepped portion (3) both comprise a PP sheet (4) and a resin plate B (5); the upper surface of the PP sheet (4) is fixedly connected to the lower surface of the resin plate A (1), and the lower surface of the PP sheet (4) is fixedly connected to the resin plate B (5); The preparation process of the multi-step PCB board pressing fixture includes the following steps: S1. Selection of mold plate and production of alignment pin holes: Select a resin plate A (1) with a thickness greater than 2 mm as the mold plate material, and use a precision drilling machine with a depth control function to drill the alignment pin holes (6) according to a preset program; S2, cutting the release film (7) and the PP sheet (4), adhering the PP sheet (4) to the release film (7), using a UV laser machine to cut a stepped position pattern on the release film (7) according to a preset program, and cutting a stepped position PP pattern on the PP sheet (4) according to a preset program; tearing off the unnecessary waste PP sheet (4) and the release film (7) after cutting, and slightly adhering the remaining PP sheet (4) to the release film (7); S3, pressing, pressing the resin plate A (1), the PP sheet (4) and the resin plate B (5); S4, hollowing out the jig after pressing in step 3, using a precision molding machine to remove the resin plate B (5) outside the stepped position to form the required first stepped portion (2) and second stepped portion (3); S5, step finishing, using a depth-controlled gong machine to perform milling and finishing on the second step portion (3), and at the same time, fine-tune the length and width of each first step portion (2) and second step portion (3); S6. Cleaning and inspection: Use water to clean the completed fixture. After cleaning, use a micrometer or vernier caliper to measure the length, width and height of each first step part (2) and second step part (3) in turn. After passing the inspection, the fixture will be released for production use.

2. The multi-step PCB pressing jig according to claim 1, characterized in that: The resin plate A (1), the PP sheet (4) and the resin plate B (5) are fixedly connected by pressing.

3. The multi-step PCB pressing jig according to claim 1, characterized in that: The thickness of the resin plate B (5) of the first stepped portion (2) is greater than the thickness of the resin plate B (5) of the second stepped portion (3).

4. The multi-step PCB pressing jig according to claim 1, characterized in that: The width of the first stepped portion (2) is greater than the width of the second stepped portion (3).

5. The multi-step PCB pressing jig according to claim 1, characterized in that: Alignment pin holes (6) are respectively provided on both sides of the resin plate A (1).

6. The multi-step PCB pressing jig according to claim 1, characterized in that: In step S3, the thickness of the resin board B (5) after lamination is 0.2 mm less than the deepest step depth designed on the PCB board.

7. The multi-step PCB pressing jig according to claim 1, characterized in that: In step S5, the height of the second step portion (3) after milling is 0.2 mm smaller than the step depth designed on the PCB board; and the length and width of the first step portion (2) and the second step portion (3) after finishing are 0.1 mm smaller than the step size designed on the PCB board.

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