Server cabinets and data centers
By using a liquid-air heat exchanger combined with IT equipment units and fans to form a closed-loop airflow system in the data center, the problems of high noise, high temperature and difficult operation and maintenance in data center cooling methods are solved, achieving efficient and low-cost cooling effect and reducing the energy consumption and carbon emissions of the data center.
Patent Information
- Application Number
- CN202210239586.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-03-11
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2042-03-11
AI Technical Summary
Existing data center cooling methods suffer from problems such as high noise, high temperature, inconvenient operation and maintenance, and high cost. In particular, immersion liquid cooling requires high waterproof sealing performance and is difficult to maintain.
A liquid-air heat exchanger is connected in series or parallel with the IT equipment unit on the coolant pipeline. Combined with the airflow blown by the fan, a circulating airflow is formed in the closed cabinet. The cooling and heat dissipation are achieved by combining liquid cooling and air cooling, and the cooling capacity is provided by the cooling tower.
It effectively reduces noise and excessive temperature in the data center, lowers the difficulty and cost of operation and maintenance, improves the working environment and efficiency of operation and maintenance personnel, and at the same time reduces the energy consumption and carbon emissions of the data center.
Smart Images

Figure CN114828549B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to the technical field of data centers, in particular, to a server cabinet and a data center. BACKGROUND
[0002] With the wide application of the Internet, cloud computing and the like, data centers are growing explosively. At present, in order to cool and dissipate heat of the data center, an air conditioning unit for blowing cold air into the machine room is usually arranged in the machine room, an air inlet and an air outlet are arranged on the server cabinet, and a fan is arranged in the server cabinet. The fan is used to make the air flow into the server cabinet from the air inlet, and the air flowing into the server cabinet is made to flow out of the air outlet after cooling the equipment in the server cabinet. In the process of dissipating heat of the data center by using the above-mentioned scheme, large environmental noise, airflow and other interferences are generated in the machine room, and the temperature in the machine room may reach 35-40 degrees in summer, which will affect the working environment of the operation and maintenance personnel.
[0003] In addition, there is also a submerged liquid cooling cooling method, that is, the server cabinet is completely submerged in the cooling liquid, but the submerged liquid cooling cooling method has high cost and high requirements for waterproof sealing performance of the server cabinet, and it is not convenient for the operation and maintenance personnel to daily operate and maintain the data center. SUMMARY
[0004] The purpose of the present disclosure is to provide a server cabinet and a data center to solve the technical problems existing in the related art.
[0005] In order to achieve the above-mentioned purpose, according to a first aspect of the present disclosure, a server cabinet is provided, comprising:
[0006] a closed cabinet body;
[0007] an IT equipment unit arranged in the closed cabinet body;
[0008] a liquid-air heat exchanger arranged in the closed cabinet body and connected in series or in parallel with the IT equipment unit on a cooling liquid pipeline, the liquid-air heat exchanger being arranged at a windward side of the IT equipment unit or a leeward side of the IT equipment unit,
[0009] a fan arranged in the closed cabinet body, the fan being used to generate an airflow in the closed cabinet body towards the IT equipment unit, and the airflow flowing through the IT equipment unit is cooled by the liquid-air heat exchanger before being blown to the IT equipment unit.
[0010] Optionally, the server cabinet further comprises a shell, the IT device unit and the fan are both mounted in the shell, the shell is provided with an air inlet and an air outlet, the IT device unit is located between the air inlet and the air outlet, and the outer wall of the shell and the inner wall of the closed cabinet body have an air duct for airflow to flow through, the air inlet and the air outlet are both in communication with the air duct.
[0011] The liquid-air heat exchanger is located in the shell and is arranged close to the air inlet, or the liquid-air heat exchanger is located in the shell and is arranged close to the air outlet, or the liquid-air heat exchanger is located outside the shell and is arranged close to the air inlet, or the liquid-air heat exchanger is located outside the shell and is arranged close to the air outlet.
[0012] Optionally, the gap between the outer wall of the shell and the inner wall of the closed cabinet body is the air duct.
[0013] The server cabinet further comprises a duct, the duct is arranged between the inner wall of the closed cabinet body and the outer wall of the shell, and the air duct is formed in the inside of the duct.
[0014] Optionally, the IT device unit comprises a central processing unit, a hard disk drive, a network interface controller, a dual in-line memory module and a power supply.
[0015] The hard disk drive and the network interface controller are both arranged close to the windward side, the power supply is arranged close to the leeward side, and the central processing unit and the dual in-line memory module are located between the hard disk drive and the network interface controller and the power supply.
[0016] Optionally, the liquid-air heat exchanger is arranged adjacent to the power supply, and the fan is located between the hard disk drive and the network interface controller and the central processing unit and the dual in-line memory module.
[0017] Optionally, the central processing unit is provided with a cold plate, the central processing unit and the cold plate are both multiple, multiple cold plates are arranged one-to-one corresponding to multiple central processing units, multiple cold plates are connected in series or in parallel with each other to form a cold plate group, and the cold plate group and the liquid-air heat exchanger are connected in series or in parallel with each other.
[0018] Optionally, the server cabinet further comprises a temperature sensor, the temperature sensor is arranged on the windward side of the IT device unit and is used for detecting the temperature of the airflow cooled by the liquid-air heat exchanger, and the temperature sensor is electrically connected with the fan, so that the rotating speed of the fan can be adjusted according to the temperature value detected by the temperature sensor.
[0019] Optionally, the water inlet of the cooling liquid pipeline is configured to be connected with the water outlet of the cooling tower, and the water outlet of the cooling liquid pipeline is configured to be connected with the water inlet of the cooling tower.
[0020] Optionally, the server cabinet further comprises a water inlet connecting structure and a water outlet connecting structure, the water inlet connecting structure is connected with a first water inlet interface and a first water outlet interface, the water outlet connecting structure is connected with a second water inlet interface and a second water outlet interface, the first water inlet interface is configured to be connected with the water outlet of the cooling tower, the first water outlet interface is configured to be connected with the water inlet of the cooling liquid pipeline, the second water inlet interface is configured to be connected with the water outlet of the cooling liquid pipeline, and the second water outlet interface is configured to be connected with the water inlet of the cooling tower.
[0021] The first through hole and the second through hole are formed on the closed cabinet body, the water inlet connecting structure is arranged in the first through hole, and the first water inlet interface is located outside the closed cabinet body, the water outlet connecting structure is arranged in the second through hole, and the second water outlet interface is located outside the closed cabinet body, a first sealing element is arranged between the water inlet connecting structure and the first through hole, and a second sealing element is arranged between the water outlet connecting structure and the second through hole.
[0022] Optionally, the IT equipment unit and the cooling liquid pipeline are multiple, and the multiple cooling liquid pipelines and the multiple IT equipment units are one-to-one corresponding.
[0023] The water inlet connecting structure is a water distributor, the first water outlet interface is multiple, and the multiple first water outlet interfaces are one-to-one corresponding to the water inlets of the multiple cooling liquid pipelines.
[0024] The water outlet connecting structure is a water collector, the second water inlet interface is multiple, and the multiple second water inlet interfaces are one-to-one corresponding to the water outlets of the multiple cooling liquid pipelines.
[0025] Optionally, the liquid-air heat exchanger is a surface air cooler.
[0026] According to a second aspect of the present disclosure, a data center comprises the server cabinet as described above.
[0027] Optionally, the data center further comprises a cooling tower, the water inlet of the cooling liquid pipeline of the server cabinet is connected with the water outlet of the cooling tower, and the water outlet of the cooling liquid pipeline of the server cabinet is connected with the water inlet of the cooling tower.
[0028] By the technical solution, the liquid-air heat exchanger and the IT equipment unit are connected in series or connected in parallel on the cooling liquid pipeline. In this way, on the one hand, the cooling liquid can exchange heat with the IT equipment unit during the flow in the cooling liquid pipeline, and the heat generated by the IT equipment unit is taken out of the closed cabinet, and on the other hand, the fan blows air flow to the IT equipment unit, and the air flow exchanges heat with the IT equipment unit to take away the heat generated by the IT equipment, which can further cool and dissipate heat for the IT equipment unit. Moreover, after the air flow blown by the fan exchanges heat with the IT equipment unit and becomes high-temperature air flow, the high-temperature air flow exchanges heat with the liquid-air heat exchanger when flowing through the liquid-air heat exchanger, so that the high-temperature air flow is cooled to become low-temperature air flow and is blown to the IT equipment unit again, realizing the cyclic blowing of the IT equipment to improve the heat dissipation effect of the IT equipment unit.
[0029] By the technical solution, the liquid-air heat exchanger and the IT equipment unit are connected in series or connected in parallel on the cooling liquid pipeline. In this way, on the one hand, the cooling liquid can exchange heat with the IT equipment unit during the flow in the cooling liquid pipeline, and the heat generated by the IT equipment unit is taken out of the closed cabinet, and on the other hand, the fan blows air flow to the IT equipment unit, and the air flow exchanges heat with the IT equipment unit to take away the heat generated by the IT equipment, which can further cool and dissipate heat for the IT equipment unit. Moreover, after the air flow blown by the fan exchanges heat with the IT equipment unit and becomes high-temperature air flow, the high-temperature air flow exchanges heat with the liquid-air heat exchanger when flowing through the liquid-air heat exchanger, so that the high-temperature air flow is cooled to become low-temperature air flow and is blown to the IT equipment unit again, realizing the cyclic blowing of the IT equipment to improve the heat dissipation effect of the IT equipment unit.
[0030] Moreover, due to the sealing effect of the closed cabinet, the cooling air flow for cooling the IT equipment unit always circulates in the closed cabinet and cannot flow out of the closed cabinet, and the closed cabinet can also have a certain sound insulation capacity, so as to effectively reduce the problems of excessively high temperature and excessively loud noise in the computer room, and improve the working environment experience and operation and maintenance efficiency of the operation and maintenance personnel.
[0031] In addition, compared with the technical solution of cooling the server cabinet by the immersion liquid cooling method, the present disclosure does not need to immerse the server cabinet in the cooling liquid, and the cooling cost is lower, and it is more convenient for the daily operation and maintenance of the operation and maintenance personnel.
[0032] Other features and advantages of the present disclosure will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0033] The accompanying drawings are included to provide a further understanding of the present disclosure and constitute a part of the specification, illustrate embodiments of the present disclosure and are included to provide a further understanding of the present disclosure, and together with the specific embodiments described below, serve to explain the present disclosure but do not constitute a limitation of the present disclosure. In the drawings:
[0034] Figure 1 is a top view schematic diagram of a server cabinet provided by an exemplary embodiment of the present disclosure, wherein the top of the shell is not shown, and the direction indicated by the arrow is the flow direction of the air flow;
[0035] Figure 2 is a top view schematic diagram of a server cabinet provided by an exemplary embodiment of the present disclosure, wherein the top of the shell and the air duct are not shown, and the liquid-air heat exchanger is arranged inside the shell;
[0036] Figure 3 is a top view schematic diagram of a server cabinet provided by another exemplary embodiment of the present disclosure, wherein the top of the shell and the air duct are not shown, and the liquid-air heat exchanger is arranged outside the shell;
[0037] Figure 4 is an assembly schematic diagram of a liquid-air heat exchanger and a cold plate of a server cabinet provided by an exemplary embodiment of the present disclosure;
[0038] Figure 5 is a layout schematic diagram of an IT equipment unit, a shell, a fan and a liquid-air heat exchanger of a server cabinet provided by an exemplary embodiment of the present disclosure, wherein the direction indicated by the arrow is the flow direction of the air flow;
[0039] Figure 6 is a connection schematic diagram between the water inlet connection structure and the water outlet connection structure of the cooling tower and the server cabinet of a data center provided by an exemplary embodiment of the present disclosure;
[0040] Figure 7 is a connection schematic diagram of a liquid-air heat exchanger, a cold plate of a server cabinet and a cooling tower of a data center provided by a first exemplary embodiment of the present disclosure;
[0041] Figure 8 is a connection schematic diagram of a liquid-air heat exchanger, a cold plate of a server cabinet and a cooling tower of a data center provided by a second exemplary embodiment of the present disclosure;
[0042] Figure 9 is a connection schematic diagram of a liquid-air heat exchanger, a cold plate of a server cabinet and a cooling tower of a data center provided by a third exemplary embodiment of the present disclosure;
[0043] Figure 10is a connection schematic diagram of a liquid-air heat exchanger, a cold plate of a server cabinet and a cooling tower of a data center provided by a fourth exemplary embodiment of the present disclosure.
[0044] Figure 11 is a perspective schematic diagram of a server cabinet provided by an exemplary embodiment of the present disclosure.
[0045] Legend of Reference Signs
[0046] 2-cooling liquid pipeline; 10-closed cabinet body; 11-first through hole; 12-second through hole; 20-IT equipment unit; 201-central processing unit; 202-hard disk drive; 203-network interface controller; 205-power supply; 206-dual in-line memory module; 30-liquid-air heat exchanger; 40-fan; 50-housing; 51-air inlet; 52-air outlet; 53-air duct; 60-cold plate; 70-temperature sensor; 80-water inlet connection structure; 81-water distributor; 810-first water inlet interface; 820-first water outlet interface; 90-water outlet connection structure; 91-water collector; 910-second water inlet interface; 920-second water outlet interface; 100-cooling tower. DETAILED DESCRIPTION
[0047] The specific embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.
[0048] In the present disclosure, unless otherwise stated, "inner, outer" refers to the inner, outer of the outline of the corresponding structure, and "far, near" refers to the far, near from the corresponding structure. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0049] Reference Figures 1-11 As shown, according to a first aspect of the present disclosure, a server cabinet is provided, comprising: a closed cabinet body 10, an IT equipment unit 20, a liquid-air heat exchanger 30 and a fan 40, the IT equipment unit 20, the liquid-air heat exchanger 30 and the fan 40 are all arranged in the closed cabinet body 10, and the liquid-air heat exchanger 30 and the IT equipment unit 20 are connected in series or in parallel on the cooling liquid pipeline 2, the liquid-air heat exchanger 30 is arranged on the windward side of the IT equipment unit 20 or the leeward side of the IT equipment unit 20, and the fan 40 is used to generate an air flow in the closed cabinet body 10 towards the IT equipment unit 20, and the air flow flowing through the IT equipment unit 20 is cooled by the liquid-air heat exchanger 30 before being blown to the IT equipment unit 20.
[0050] By the technical solution, the server cabinet can cool the IT equipment unit 20 through liquid cooling combined with air cooling. For the liquid cooling, the liquid-air heat exchanger 30 and the IT equipment unit 20 are connected in series or in parallel on the cooling liquid pipeline 2. When the cooling liquid in the cooling liquid pipeline flows through the IT equipment unit 20, the cooling liquid can exchange heat with the IT equipment unit 20 and absorb the heat of the IT equipment unit 20, thereby realizing the liquid cooling of the IT equipment unit 20. For the air cooling, the fan 40 blows air flow to the IT equipment unit 20. The air flow exchanges heat with the IT equipment unit 20 and carries away the heat generated by the IT equipment unit 20, thereby further cooling the IT equipment unit 20. The air flow with high temperature after absorbing the heat of the IT equipment unit 20 exchanges heat with the cooling liquid in the liquid-air heat exchanger 30 when flowing through the liquid-air heat exchanger 30, thereby cooling the air flow with high temperature. The air flow with low temperature after being cooled is blown to the IT equipment unit 20 again. That is, under the action of the fan 40, the circulating air flow flowing through the IT equipment unit and the liquid-air heat exchanger 30 is generated in the closed cabinet 10, thereby realizing the continuous air cooling of the IT equipment unit 20.
[0051] In addition, due to the closed effect of the closed cabinet 10, the cooling air flow for cooling the IT equipment unit 20 always circulates in the closed cabinet 10 and cannot flow out of the closed cabinet 10. The closed cabinet 10 also has a certain sound insulation effect, thereby effectively reducing the problems of excessively high temperature and excessively loud noise in the computer room and improving the work environment experience and operation and maintenance efficiency of the operation and maintenance personnel.
[0052] In addition, compared with the technical solution of cooling the server cabinet through immersion liquid cooling, the present disclosure does not need to immerse the server cabinet in the cooling liquid, thereby reducing the cooling cost and being more convenient for daily operation and maintenance of the operation and maintenance personnel.
[0053] It should be noted that the windward side of the IT equipment unit 20 mentioned above refers to the side of the IT equipment unit 20 facing the air flow flowing therethrough. The leeward side of the IT equipment unit 20 refers to the side of the IT equipment unit 20 from which the air flow flowing through the IT equipment unit 20 flows out.
[0054] In addition, as Figures 7-10As shown, the liquid-air heat exchanger 30 and the IT equipment unit 20 can be connected in series or in parallel with each other on the cooling liquid pipeline 2. For the liquid-air heat exchanger 30 and the IT equipment unit 20 being connected in series on the cooling pipeline, the liquid-air heat exchanger 30 can be located upstream of the IT equipment unit 20, or the IT equipment unit 20 can be located upstream of the liquid-air heat exchanger 30, which is not limited in the present disclosure. For the liquid-air heat exchanger 30 and the IT equipment unit 20 being connected in parallel on the cooling pipeline, the cooling liquid pipeline 2 can be divided into two branches, one branch flows to the liquid-air heat exchanger 30, and the other branch flows to the IT equipment unit 20. In addition, the present disclosure does not limit the cooling liquid providing device for providing low-temperature cooling liquid to the cooling liquid pipeline 2, which can be a cooling tower 100, an air conditioning unit, etc.
[0055] Optionally, the number of the liquid-air heat exchanger 30 and the fan 40 can be one or more, which is not limited in the present disclosure.
[0056] Optionally, in an embodiment provided by the present disclosure, as shown in Figure 1 、 Figure 2 、 Figure 3 and Figure 5 As shown, the server cabinet can further include a housing 50, the IT equipment unit 20 and the fan 40 are both installed in the housing 50, the housing 50 is provided with an air inlet 51 and an air outlet 52, the IT equipment unit 20 is located between the air inlet 51 and the air outlet 52, the outer wall of the housing 50 and the inner wall of the closed cabinet body 10 have an air duct 53 for airflow, and the air inlet 51 and the air outlet 52 are both in communication with the air duct 53. It can be understood that the windward side of the IT equipment unit 20 mentioned above is the side close to the air inlet 51, and the leeward side of the IT equipment unit is the side close to the air outlet 52.
[0057] Since the IT equipment unit 20 is arranged between the air inlet 51 and the air outlet 52 of the casing 50, when the fan 40 rotates, the air flow in the closed cabinet 10 flows into the casing 50 from the air inlet 51, flows from the air inlet 51 to the air outlet 52 in the casing 50, and then flows out of the casing 50 from the air outlet 52 and returns to the position close to the air inlet 51 through the air duct 53. That is, the casing 50 can divide the space in the closed cabinet 10, the air flow in the casing 50 is cooled during the process of flowing from the air inlet 51 to the air outlet 52 and does not mix with the air flow outside the casing 50, and the air flow outside the casing 50 flows in the air duct 52 and does not mix with the air flow in the casing 50, thereby facilitating the cooling of the IT equipment unit 20, ensuring that the temperature of the air flow blown to the IT equipment unit is not too high, and also facilitating the guidance of the flow direction of the air flow in the closed cabinet 10, so that the air flow circulates in the closed cabinet 10.
[0058] It should be noted that since the inside of the closed cabinet 10 is a closed space, when the fan 40 blows air flow to the IT equipment unit 20, the windward side of the IT equipment unit 20 is under negative pressure and the leeward side is under positive pressure, so the air flow flowing out of the air outlet 52 of the casing 50 will return to the air inlet 51 of the casing 50 along the air duct 53 between the outer wall of the casing 50 and the inner wall of the closed cabinet 10 under the action of the pressure difference, thereby forming the circulation of the air flow in the closed cabinet 10, and any power equipment can be provided, thereby further reducing the energy consumption during the cooling of the IT equipment unit 20.
[0059] In the present disclosure, the specific arrangement position of the liquid-air heat exchanger 30 can have various embodiments, for example, the liquid-air heat exchanger 30 can be arranged inside the casing 50 or outside the casing 50. For the case that the liquid-air heat exchanger 30 is arranged inside the casing 50, in one embodiment provided by the present disclosure, the liquid-air heat exchanger 30 can be arranged inside the casing 50 and close to the air inlet 51, so that the air flow entering the casing 50 from the air inlet 51 first flows through the liquid-air heat exchanger 30 for cooling and then flows to the IT equipment unit 20. In another embodiment provided by the present disclosure, as shown in Figure 1 、 Figure 2 、 Figure 3 and Figure 5 , the liquid-air heat exchanger 30 can be arranged inside the casing 50 and close to the air outlet 52, so that the air flow flowing through the IT equipment unit 20 for heat exchange first flows through the liquid-air heat exchanger 30 for cooling, then flows out of the casing 50 from the air outlet 52, and finally returns to the air inlet 51.
[0060] For the case that the liquid-air heat exchanger 30 is arranged outside the casing 50, as shown inFigure 3 As shown, in one embodiment provided by the present disclosure, the liquid-air heat exchanger 30 can be located outside the shell 50 and arranged close to the air inlet 51; in another embodiment provided by the present disclosure, the liquid-air heat exchanger 30 can be located outside the shell 50 and arranged close to the air outlet 52.
[0061] Optionally, in one embodiment provided by the present disclosure, as shown in Figure 1 As shown, the outer wall of the shell 50 and the inner wall of the closed cabinet 10 can have a gap therebetween, which is the air duct 53. In this way, after the air flow blown by the fan 40 from the air inlet 51 of the shell 50 to the IT equipment unit 20, it can flow out from the air outlet 52 of the shell 50 and reflow to the air inlet 51 through the gap between the outer wall of the shell 50 and the inner wall of the closed cabinet 10 (i.e. the air duct 53), thereby achieving the circulating blowing of the IT equipment unit 20.
[0062] In another embodiment provided by the present disclosure, the server cabinet can further include an air duct arranged between the inner wall of the closed cabinet 10 and the outer wall of the shell 50, and the air duct 53 is formed inside the air duct. After the air flow blown by the fan 40 from the air inlet 51 of the shell 50 to the IT equipment unit 20, it can directly enter the air duct after flowing out from the air outlet 52 of the shell 50, and reflow to the air inlet 51 of the shell 50 through the guidance of the air duct, thereby standardizing the flow path of the air flow and avoiding the turbulence of the air flow during the flow process, which affects the cooling and heat dissipation effect of the IT equipment unit 20.
[0063] Of course, the two ends of the air duct described above can be connected with the air inlet 51 and the air outlet 52 respectively, or can be connected with the air inlet 51 and the air outlet 52, as long as it can communicate with the air inlet 51 and the air outlet 52 and can guide the air flow from the air outlet 52 towards the air inlet 51, which is not limited by the present disclosure.
[0064] Optionally, as shown in Figure 1 , Figure 2 , Figure 3 and Figure 5As shown, the IT equipment unit 20 includes a central processor 201, a hard disk drive 202, a network interface controller 203, a dual in-line memory module 206, and a power supply 205; the hard disk drive 202 and the network interface controller 203 are arranged close to the windward side, the power supply 205 is arranged close to the leeward side, and the central processor 201 and the dual in-line memory module 206 are located between the hard disk drive 202 and the network interface controller 203 and the power supply 205. Since the hard disk drive 202 and the network interface controller 203 have weak temperature resistance, and the wind temperature at the windward side is low, the hard disk drive 202 and the network interface controller 203 are arranged close to the windward side of the IT equipment unit 20 to ensure cooling of the hard disk drive 202 and the network interface controller 203, and the power supply 205 has strong resistance to medium or high temperature, so the power supply 205 is arranged close to the leeward side of the IT equipment unit 20.
[0065] Through the above arrangement, after the air flow enters the IT equipment unit 20 from the windward side of the IT equipment unit 20, it will sequentially blow through the hard disk drive 202, the network interface controller 203, the dual in-line memory module 206, the central processor 201, and the power supply 205, and then flow out from the leeward side of the IT equipment unit 20, so that the cooling requirements of the hard disk drive 202, the network interface controller 203, the dual in-line memory module 206, the central processor 201, and the power supply 205 of the IT equipment unit 20 can be met.
[0066] Optionally, the liquid-air heat exchanger 30 can be arranged adjacent to the power supply 205. Specifically, the liquid-air heat exchanger 30 can be arranged adjacent to the power supply 205 in the length direction of the IT equipment unit 20, or the liquid-air heat exchanger 30 can be arranged adjacent to the power supply 205 in the width direction of the IT equipment unit 20.
[0067] Optionally, as shown in FIGS. 1 to 3, the liquid-air heat exchanger 30 can be arranged adjacent to the power supply 205 in the length direction of the IT equipment unit 20. Figure 1 、 Figure 2 、 Figure 3 and Figure 5 As shown in an embodiment provided by the present disclosure, the fan 40 is located between the hard disk drive 202 and the network interface controller 203 and the central processor 201 and the dual in-line memory module 206.
[0068] In other embodiments provided by the present disclosure, the fan 40 can also be arranged at the windward side of the IT equipment unit 20, or the fan 40 can be arranged at the leeward side of the IT equipment unit 20, and the present disclosure does not limit the specific position of the fan 40, as long as it can generate an air flow blowing to the IT equipment unit 20, and the air flow flowing through the IT equipment unit 20 is cooled by the liquid-air heat exchanger 30 before blowing to the IT equipment unit 20.
[0069] Optionally, the central processor 201 is provided with a cold plate 60, as shown in Figures 1-5 The central processor 201 and the cold plate 60 are both multiple, and the multiple cold plates 60 are provided in one-to-one correspondence with the multiple central processors 201, as shown in Figures 7 to 10 The multiple cold plates 60 are connected in series or in parallel with each other to form a cold plate group, and the cold plate group is connected in series or in parallel with the liquid-air heat exchanger 30.
[0070] In the process of cooling and dissipating heat of the IT equipment unit 20, the central processor 201 can be liquid-cooled by the cold plate 60, so that the temperature of the central processor 201 can be effectively reduced, and the situation that the heat of the central processor 201 is taken out to cause the temperature near the central processor 201 to be too high in the process that the air flow flows from the windward side of the IT equipment unit 20 to the leeward side of the IT equipment unit 20, thereby reversely heating the hard disk drive 202, the network interface controller 203, the dual in-line memory module 206 and the power supply 205, or affecting the heat dissipation of the air flow to the hard disk drive 202, the network interface controller 203, the dual in-line memory module 206 and the power supply 205, thereby ensuring the cooling effect and the cooling efficiency.
[0071] Optionally, in order to adjust the cooling effect of the IT equipment unit 20, in the present disclosure, as shown in Figure 5 The server cabinet can further include a temperature sensor 70, the temperature sensor 70 is arranged on the windward side of the IT equipment unit 20 and is used for detecting the temperature of the air flow cooled by the liquid-air heat exchanger 30, and the temperature sensor 70 is electrically connected with the fan 40, so that the rotating speed of the fan 40 can be adjusted according to the temperature value detected by the temperature sensor 70. The temperature sensor 70 is arranged on the windward side of the IT equipment unit 20, so that the temperature sensor 70 can detect the temperature of the air flow about to flow through the IT equipment unit 20, when the temperature of the air flow flowing through the windward side detected by the temperature sensor 70 is high, it indicates that the temperature of the cooling air about to blow to the IT equipment unit 20 is high, at this time, the rotating speed of the fan 40 can be adaptively increased, so that the air flow generated by the fan 40 can flow through the IT equipment unit 20 faster, and the cooling and heat exchange effect of the IT equipment unit 20 is improved; when the temperature of the air flow flowing through the windward side detected by the temperature sensor 70 is low, it indicates that the temperature of the cooling air about to blow to the IT equipment unit 20 is low, at this time, the rotating speed of the fan 40 can be adaptively reduced, so that the cooling and heat dissipation effect of the IT equipment unit 20 can be achieved, and unnecessary cold waste is avoided, and the energy consumption in the cooling process of the IT equipment unit 20 is saved.
[0072] As shown in Figure 5As shown, in the embodiment in which the server cabinet comprises the shell 50, and the air inlet 51 and the air outlet 52 are formed on the shell 50, the temperature sensor 70 can be arranged at the air inlet 51 of the shell 50.
[0073] Optionally, as shown, Figures 6-10 As shown, the water inlet of the cooling liquid pipeline 2 is connected with the water outlet of the cooling tower 100, and the water outlet of the cooling liquid pipeline 2 is connected with the water inlet of the cooling tower 100. Compared with the embodiment in which the cold quantity is provided by a plurality of devices (such as a compressor, an expansion valve, an evaporator, and a condenser) in an air conditioning cooling unit, the embodiment in which the cooling tower 100 is connected with the cooling liquid pipeline 2 does not need to use the air conditioning cooling unit, so that the energy consumption required by the present disclosure to cool the IT equipment unit 20 is lower, and it is more conducive to reducing the total energy consumption of the data center, thereby reducing the PUE (Power Usage Effectiveness, power usage efficiency) of the data center, and further reducing the carbon emission, helping to achieve the goal of “carbon peak and carbon neutral”.
[0074] Optionally, as shown, Figure 6 As shown, the server cabinet further comprises a water inlet connecting structure 80 and a water outlet connecting structure 90, the water inlet connecting structure 80 is connected with the first water inlet interface 810 and the first water outlet interface 820, the water outlet connecting structure 90 is connected with the second water inlet interface 910 and the second water outlet interface 920, the first water inlet interface 810 is connected with the water outlet of the cooling tower 100, the first water outlet interface 820 is connected with the water inlet of the cooling liquid pipeline 2, the second water inlet interface 910 is connected with the water outlet of the cooling liquid pipeline 2, and the second water outlet interface 920 is connected with the water inlet of the cooling tower 100. During the cooling process of the IT equipment unit 20, the cooling liquid flows out of the water outlet of the cooling tower 100, and flows into the water inlet connecting structure 80 through the first water inlet interface 810. The cooling liquid in the water inlet connecting structure 80 enters the cooling liquid pipeline 2 through the first water outlet interface 820. After the liquid in the cooling liquid pipeline 2 exchanges heat with the liquid-air heat exchanger 30 and the fan 40, it becomes high-temperature cooling liquid and flows into the water outlet connecting structure 90 through the second water inlet interface 910. The high-temperature cooling liquid in the water outlet connecting structure 90 flows back to the cooling tower 100 through the second water outlet interface 920 of the water outlet connecting structure 90. After the high-temperature cooling liquid in the cooling tower 100 exchanges heat with the outside air, it becomes low-temperature cooling liquid and flows into the water inlet connecting structure 80 from the water outlet of the cooling tower 100. The low-temperature cooling liquid in the water inlet connecting structure 80 flows into the cooling liquid pipeline 2 through the first water inlet interface 810, and the above process is repeated to continuously supply cooling liquid to the cooling liquid pipeline 2, thereby continuously cooling the IT equipment unit 20.
[0075] In addition, as shown in Figure 11 The first through hole 11 and the second through hole 12 can be formed on the closed cabinet 10, the water inlet connecting structure 80 passes through the first through hole 11, and the first water inlet interface 810 is located outside the closed cabinet 10; the water outlet connecting structure 90 passes through the second through hole 12, and the second water outlet interface 920 is located outside the closed cabinet 10; the first sealing element is arranged between the water inlet connecting structure 80 and the first through hole 11, and the second sealing element is arranged between the water outlet connecting structure 90 and the second through hole 12. The first through hole 11 is used for the water inlet connecting structure 80 to pass through, the second through hole is used for the water outlet connecting structure 90 to pass through, and the first sealing element is arranged between the water inlet connecting structure 80 and the first through hole 11, and the second sealing element is arranged between the water outlet connecting structure 90 and the second through hole 12, so that the sealing performance of the closed cabinet 10 at the first through hole 11 and the second through hole 12 can be ensured, and heat or noise in the closed cabinet 10 can be prevented from leaking from the gap between the first through hole 11 and the water inlet connecting structure 80 or the gap between the second through hole 12 and the water outlet connecting structure 90, so that the sealing performance of the closed cabinet 10 is further improved, and the work of the maintenance personnel is not affected.
[0076] Optionally, as shown in Figure 6 In the closed cabinet 10, the IT equipment unit 20 and the cooling liquid pipeline 2 can be multiple, and the multiple cooling liquid pipelines 2 and the multiple IT equipment units 20 are one-to-one correspondingly arranged; the water inlet connecting structure 80 is a water distributor 81, the first water outlet interface 820 is multiple, and the multiple first water outlet interfaces 820 are one-to-one connected with the water inlets of the multiple cooling liquid pipelines 2; the water outlet connecting structure 90 is a water collector 91, the second water inlet interface 910 is multiple, and the multiple second water inlet interfaces 910 are one-to-one connected with the water outlets of the multiple cooling liquid pipelines 2. In this way, when the cooling liquid flowing out of the water outlet of the cooling tower 100 flows into the water inlet connecting structure 80, at this time, the cooling liquid in the water inlet connecting structure 80 can flow into the multiple cooling liquid pipelines 2 through the multiple first water outlet interfaces 820 respectively, and the cooling liquid flowing into each cooling liquid pipeline 2 can exchange heat with the corresponding IT equipment unit 20 and become high-temperature cooling liquid, and when the cooling and cooling of the IT equipment unit 20 are completed, the high-temperature cooling liquid flows out of the water outlet of the cooling liquid pipeline 2 and flows back to the water outlet connecting structure 90 through the multiple second water inlet interfaces 910 respectively, and the high-temperature cooling liquid in the water outlet connecting structure 90 enters the cooling tower 100 through the second water outlet interface 920, and the high-temperature cooling liquid flowing back to the cooling tower 100 becomes low-temperature cooling liquid again after exchanging heat with the outside atmosphere and flows into the water inlet connecting structure 80 from the water outlet of the cooling tower 100, so as to continuously flow into the cooling liquid pipeline 2, so as to realize uninterrupted cooling and heat dissipation of the multiple IT equipment units 20.
[0077] Optionally, in an embodiment provided in the present disclosure, asFigure 4 As shown, the liquid-air heat exchanger 30 can be a surface air cooler.
[0078] Of course, in other embodiments provided by the present disclosure, the liquid-air heat exchanger 30 can also be a plate-fin heat exchanger or any other liquid-air heat exchanger 30 that meets the requirements, and in general, the present disclosure does not limit the type or specific structure of the liquid-air heat exchanger 30.
[0079] According to a second aspect of the present disclosure, a data center is provided, comprising the server cabinet as described above. The data center has all the beneficial effects of the server cabinet described above, and the present disclosure does not repeat them here.
[0080] Optionally, as shown, the data center further comprises a cooling tower 100, the water inlet of the cooling liquid pipeline 2 of the server cabinet is connected to the water outlet of the cooling tower 100, and the water outlet of the cooling liquid pipeline 2 of the server cabinet is connected to the water inlet of the cooling tower 100. Figures 6-10
[0081] The present disclosure discharges the heat of the IT equipment unit 20 to the atmosphere through the cooling tower 100, that is, the cooling capacity of the liquid cooling and the air cooling of the IT equipment unit 20 all comes from the cooling tower 100. In this way, it can avoid providing low-temperature cooling liquid to the IT equipment unit 20 and the liquid-air heat exchanger 30 through the air conditioning cooling unit, so that the energy consumption required by the present disclosure to cool the IT equipment unit 20 is lower, which is conducive to reducing the total energy consumption of the data center, thereby reducing the PUE of the data center, and further reducing the carbon emissions, helping to achieve the goal of "carbon peak and carbon neutral".
[0082] And, since the data center cooling system provided by the present disclosure can be cooled without the air conditioning cooling unit, that is, Freon can be avoided as a refrigerant, on the one hand, it can avoid the situation that Freon leaks and pollutes the environment, on the other hand, it can also avoid the emission of fluorides. Since fluorine-containing gas is also a greenhouse gas, avoiding the emission of fluorine-containing gas can increase the greenhouse effect.
[0083] In addition, compared with the technical solution of cooling the data center by liquid cooling combined with air conditioning cooling, since the architecture of the data center provided by the present disclosure is simpler, the reliability is higher, the cost is lower, and when deploying the data center, the data center can be quickly deployed. And since the cooling temperature of the cooling tower 100 is related to the wet-bulb temperature of the environment where the cooling tower 100 is located, rather than the dry-bulb temperature (i.e. the ambient temperature) of the environment where the cooling tower 100 is located, and the wet-bulb temperature of most regions in the world can meet the requirement of the cooling liquid temperature of the cooling liquid flowing out of the outlet of the cooling tower 100, therefore, the data center cooling system provided by the present disclosure is not easily affected by the ambient temperature of the region, and can be applied to most regions in the world.
[0084] Optionally, the cooling tower 100 can be an open cooling tower, a closed cooling tower, a natural draft cooling tower, a mechanical draft cooling tower, a hybrid draft cooling tower, a wet cooling tower, a dry cooling tower, a dry-wet cooling tower, etc., and the specific type, number, size, shape, etc. of the cooling tower 100 are not limited in the present disclosure.
[0085] The preferred embodiments of the present disclosure are described in detail above in combination with the drawings, but the present disclosure is not limited to the specific details in the above-described embodiments. Within the technical concept range of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.
[0086] In addition, it should be noted that each specific technical feature described in the above specific embodiments can be combined in any appropriate manner without contradiction, and in order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.
[0087] In addition, various different embodiments of the present disclosure can also be combined in any manner, as long as they do not deviate from the idea of the present disclosure, and they should also be considered as disclosed in the present disclosure.
Claims
1. A server cabinet, characterized in that, The server cabinet comprises: a closed cabinet body (10); an IT equipment unit (20) arranged in the closed cabinet body (10); a liquid-air heat exchanger (30) arranged in the closed cabinet body (10) and connected in series or in parallel with the IT equipment unit (20) on a cooling liquid pipeline (2), the liquid-air heat exchanger (30) being arranged on a windward side of the IT equipment unit (20) or a leeward side of the IT equipment unit (20), a fan (40) arranged in the closed cabinet body (10), the fan (40) being used to generate an air flow in the closed cabinet body (10) and blow the air flow through the IT equipment unit (20) to the liquid-air heat exchanger (30) to cool the air flow and then blow the cooled air flow to the IT equipment unit (20) to generate a circulating air flow in the closed cabinet body (10) through the IT equipment unit (20) and the liquid-air heat exchanger (30); the server cabinet further comprises a housing (50), the IT equipment unit (20) and the fan (40) being arranged in the housing (50), the housing (50) being provided with an air inlet (51) and an air outlet (52), the IT equipment unit (20) being located between the air inlet (51) and the air outlet (52), an air duct (53) being formed between an outer wall of the housing (50) and an inner wall of the closed cabinet body (10) for the air flow to pass through, and the air inlet (51) and the air outlet (52) being communicated with the air duct (53); the server cabinet further comprises an air pipe arranged between the inner wall of the closed cabinet body (10) and the outer wall of the housing (50), the air duct (53) being formed in the air pipe.
2. The server cabinet according to claim 1, wherein the liquid-air heat exchanger (30) is arranged in the housing (50) and close to the air inlet (51), or the liquid-air heat exchanger (30) is arranged in the housing (50) and close to the air outlet (52), or the liquid-air heat exchanger (30) is arranged outside the housing (50) and close to the air inlet (51), or the liquid-air heat exchanger (30) is arranged outside the housing (50) and close to the air outlet (52).
3. The server cabinet of claim 1, wherein, The IT equipment unit (20) comprises a central processing unit (201), a hard disk drive (202), a network interface controller (203), a dual in-line memory module (206) and a power supply (205); the hard disk drive (202) and the network interface controller (203) are arranged close to the windward side, the power supply (205) is arranged close to the leeward side, and the central processing unit (201) and the dual in-line memory module (206) are located between the hard disk drive (202), the network interface controller (203) and the power supply (205).
4. The server cabinet of claim 3, wherein, The liquid-air heat exchanger (30) is arranged adjacent to the power supply (205), and the fan (40) is located between the hard disk drive (202) and the network interface controller (203) and the central processing unit (201) and the dual in-line memory module (206).
5. The server cabinet of claim 3, wherein, The central processing unit (201) is provided with a cold plate (60), and the central processing unit (201) and the cold plate (60) are both multiple, multiple cold plates (60) are arranged one by one with multiple central processing units (201), multiple cold plates (60) are connected in series or connected in parallel with each other to form a cold plate group, and the cold plate group is connected in series or connected in parallel with the liquid-air heat exchanger (30).
6. The server cabinet of any of claims 1-5, wherein, The server cabinet further comprises a temperature sensor (70) arranged on the windward side of the IT equipment unit (20) and used for detecting the temperature of the airflow cooled by the liquid-air heat exchanger (30), and the temperature sensor (70) is electrically connected with the fan (40) to enable the rotating speed of the fan (40) to be adjusted according to the temperature value detected by the temperature sensor (70).
7. The server cabinet of any of claims 1-5, wherein, The water inlet of the cooling liquid pipeline (2) is connected with the water outlet of the cooling tower (100), and the water outlet of the cooling liquid pipeline (2) is connected with the water inlet of the cooling tower (100).
8. The server cabinet of claim 7, wherein, The server cabinet further comprises a water inlet connecting structure (80) and a water outlet connecting structure (90), the water inlet connecting structure (80) is connected with a first water inlet interface (810) and a first water outlet interface (820), the water outlet connecting structure (90) has a second water inlet interface (910) and a second water outlet interface (920), the first water inlet interface (810) is connected with the water outlet of the cooling tower (100), the first water outlet interface (820) is connected with the water inlet of the cooling liquid pipeline (2), the second water inlet interface (910) is connected with the water outlet of the cooling liquid pipeline (2), and the second water outlet interface (920) is connected with the water inlet of the cooling tower (100). The closed cabinet body (10) is formed with a first through hole (11) and a second through hole (12), the water inlet connecting structure (80) is arranged in the first through hole (11), and the first water inlet interface (810) is located outside the closed cabinet body (10); the water outlet connecting structure (90) is arranged in the second through hole (12), and the second water outlet interface (920) is located outside the closed cabinet body (10); a first sealing element is arranged between the water inlet connecting structure (80) and the first through hole (11), and a second sealing element is arranged between the water outlet connecting structure (90) and the second through hole (12).
9. The server cabinet of claim 8, wherein, The IT equipment unit (20) and the cooling liquid pipeline (2) are both multiple, and multiple cooling liquid pipelines (2) are arranged one by one with multiple IT equipment units (20). The water inlet connection structure (80) is a water distributor (81), and the first water outlet interface (820) is a plurality of first water outlet interfaces (820) which are connected to the water inlets of the plurality of cooling liquid pipelines (2) one by one. The water outlet connection structure (90) is a water collector (91), and the second water inlet interface (910) is a plurality of second water inlet interfaces (910) which are connected to the water outlets of the plurality of cooling liquid pipelines (2) one by one.
10. The server cabinet of any of claims 1-5, wherein, The liquid-air heat exchanger (30) is a surface air cooler.
11. A data center, characterized by, The server cabinet comprises the server cabinet according to any one of claims 1-10.
12. The data center of claim 11, wherein, The data center further comprises a cooling tower (100), the water inlets of the cooling liquid pipelines (2) of the server cabinet are connected to the water outlets of the cooling tower (100), and the water outlets of the cooling liquid pipelines (2) of the server cabinet are connected to the water inlets of the cooling tower (100).
Citation Information
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