Leak protection for cold plate liquid cooling

Abstract

A frame for a liquid-cooled chassis in an IT rack can include a fluid supply line housed within one or more walls of the frame and a fluid return line housed within one or more walls of the frame. Fluid distribution functionality and hardware are integrated into the frame. One or more contact pads can be located on an outer surface of the frame for transferring thermal energy with IT equipment.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application generally relate to leak protection for cold plates used with information technology (IT) racks. In particular, a leak-proof frame can house a cold plate used in a chassis for liquid-cooling IT equipment such as servers. BACKGROUND

[0002] Information technology (IT) includes technology such as computers accessible through the Internet or a local network that provides storage or access to data, websites, computer programs, algorithms, services, and the like. Equipment such as servers and other electronic devices (e.g., peripherals) can be installed in a chassis. These chassis can then be installed in an IT rack. As a way to manage the power and heat demands of IT equipment, an IT rack can be filled with multiple chassis, each housing IT equipment.

[0003] Liquid cooling systems can transport and deliver liquid between an IT rack and a chassis, and between a chassis and IT equipment installed on the chassis. Such systems can provide high operational and cooling efficiency of IT equipment. Liquid cooling for high power density electronic equipment has increased in popularity as air cooling can be insufficient in terms of thermal energy in some cases. By being able to absorb more thermal energy from electronic equipment, liquid cooling allows for higher packaging density and increased computing load of electronic equipment.

[0004] Liquid cooling systems can be susceptible to fluid leaks, which can damage IT equipment. Within a chassis, fluid can flow through a cold plate, which can be physically and thermally connected with IT equipment to keep the IT equipment cool. Fluid can flow in and out of the cold plate through various connectors, conduits, adapters, and other hardware, each component introducing additional points of failure, which can cause damage to IT equipment in close proximity between the cold plate and the IT equipment. Additionally, IT racks can house various computing hardware groups, which can employ different form factors. SUMMARY

[0005] According to an aspect of the present application, a frame for a liquid-cooled chassis in an information technology (IT) rack can include: a fluid supply line housed within one or more walls of the frame;

[0006] a fluid return line housed within the one or more walls of the frame; and

[0007] one or more contact pads arranged on an outer surface of the frame for transferring thermal energy with IT equipment.

[0008] According to another aspect of the present application, there is provided a liquid-cooled chassis in an information technology (IT) rack, the liquid-cooled chassis in an information technology (IT) rack can include:

[0009] IT equipment housed in the liquid-cooled chassis; and

[0010] a frame including:

[0011] a fluid supply line housed within one or more walls of the frame;

[0012] a fluid return line housed within the one or more walls of the frame; and

[0013] one or more contact pads arranged on an outer surface of the frame for transferring thermal energy with IT equipment.

[0014] According to yet another aspect of the present application, there is provided an electronic rack, the electronic rack can include:

[0015] a plurality of server chassis arranged in a stack, wherein each of the server chassis includes:

[0016] information technology (IT) equipment housed within the chassis; and

[0017] a frame including:

[0018] a fluid supply line housed within one or more walls of the frame;

[0019] a fluid return line housed within the one or more walls of the frame; and

[0020] one or more contact pads arranged on an outer surface of the frame for transferring thermal energy with IT equipment. BRIEF DESCRIPTION OF DRAWINGS

[0021] These aspects are illustrated by way of example, and not by way of limitation, in the drawings const figures, in which like reference numerals refer to similar elements. It should be noted that "a" or "an" aspect as referred to herein does not necessarily mean the same aspect, and that a plurality of aspects can be meant. Additionally, for the sake of brevity and clarity, some elements of the figures can be used in multiple occurrences of a single aspect. Furthermore, the purpose of the drawings is to present examples of the aspects and not as a definition of the limits of the aspects.

[0022] Figure 1 A frame for a liquid-cooled chassis is shown in accordance with some embodiments.

[0023] Figure 2 A frame for a liquid-cooled chassis with cold plates is shown in accordance with some embodiments.

[0024] Figure 3 A frame with a cold plate is shown in accordance with some embodiments.

[0025] Figure 4 A frame with a built-in evaporative unit is shown in accordance with some embodiments.

[0026] Figure 5 A frame with a thermoelectric cooling unit is shown in accordance with some embodiments.

[0027] Figure 6 A frame with shared fluid is shown in accordance with some embodiments.

[0028] Figure 7 is a block diagram showing an IT rack in accordance with one embodiment. DETAILED DESCRIPTION

[0029] Several aspects of the disclosure are now described in detail with reference to the figures. Whenever the shapes, relative positions and other aspects of the components described in a given aspect are not explicitly identified as being critical, the scope of the disclosure disclosed herein is not limited only to the components shown, which are for illustrative purposes only. Additionally, although a number of details are set forth in the description, it is understood that some aspects can be practiced without these details. In other instances, well-known circuits, structures and techniques have not been shown in detail in order not to obscure the understanding of this description. Also, unless expressly specified otherwise, all ranges described herein are to be construed as including each end point of the range.

[0030] Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the disclosure. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.

[0031] Liquid cooling systems can circulate fluid back and forth through IT electronics within an IT rack. The IT rack can include various IT equipment, such as servers, peripherals, and other electronic computing components. The IT rack can include a manifold that distributes liquid back and forth through different racks in the IT rack. Each rack can include mounting hardware, trays, cooling, power, wire management, and other infrastructure for the IT equipment. Within the racks, leaks can occur due to various tubing, connectors, fittings, adapters, and other components through which the cooling fluid passes in order to transfer thermal energy to and from the IT equipment.

[0032] In the present disclosure, a frame can separate components of a liquid cooling system from the electronics of IT equipment at the rack level. A frame for a liquid-cooled chassis in an IT rack can include a fluid supply line housed within one or more walls of the frame, and a fluid return line housed within one or more walls of the frame. One or more contact pads can be located on an outer surface of the frame for transferring thermal energy with IT equipment. Such a frame can distribute fluid to and from one or more cold plates housed in an interior region of the frame. The frame can provide a water barrier between a) cold plates, connectors, conduits, or other components that house cooling fluid, and b) IT equipment. In this way, if a leak occurs from such components, the frame can contain the fluid, while the IT equipment can remain dry by keeping the leaked fluid completely separate from the IT equipment.

[0033] The reliability of liquid cooling of IT racks can be improved in a way that provides predictable and flexible protection for IT equipment. Various cold plates can be arranged to use such a frame to fit different arrangements of IT equipment with various form factors. Cooling can be distributed to IT equipment, such as processors with high power density that require high power density thermal management. Additionally, such a frame can provide universal protection for single-phase or two-phase fluid cooling solutions.

[0034] Figure 1 A frame for a liquid-cooled chassis is shown in accordance with some embodiments. A frame 112 for a liquid-cooled chassis within an IT rack can include a fluid supply line 120 housed within one or more walls of the frame, and a fluid return line 130 housed within one or more walls of the frame. Although the fluid supply line and the fluid return line refer to the same area in this figure, they are separate fluid lines housed in the frame walls. The fluid supply line 120 transports fluid from the IT rack to one or more cold plates, such as 102, 104, 106, and 108. The fluid return line 130 collects fluid from the one or more cold plates and returns the fluid to the IT rack.

[0035] In some embodiments, the fluid supply line and / or the fluid return line can be a channel carved from a wall of the frame. For example, a side wall 116 can be a solid wall with a fluid channel carved from it. Alternatively or additionally, the fluid supply line and / or the fluid return line can be a pipe within a wall of the frame. For example, a side wall can be hollowed out internally to house a pipe that forms the fluid supply line and / or the fluid return line. The side wall can be a vertical wall that stands upright relative to a bottom wall 132 of the frame. In some embodiments, as shown in FIG. 1, the frame can include a bottom wall 132, a top wall 134, a first side wall 116, and a second side wall 118. The frame can be a rectangular frame, although other shapes are possible. The frame can be a single piece of material, or it can be assembled from multiple pieces of material. Figure 1As shown, if the contact pads extend from the bottom wall, the bottom wall 132 of the frame can be shaped to follow the contact pads. For example, as shown, where one or more contact pads extend downward and away from the bottom wall, the inner surface 124 at the bottom wall is also stepped downward into the contact pads, reducing the thickness of the one or more contact pads 118, which in turn can reduce the thermal resistance of the one or more contact pads.

[0036] The one or more contact pads 118 can be disposed on the outer surface of the frame for transferring thermal energy with the IT equipment. The one or more contact pads can be connected with the frame by a waterproof seal. In some examples, the one or more contact pads are formed as a monolithic structure with the frame (e.g., formed from a single piece), reducing the risk of leaks through poorly joined components. For example, a single piece of metal (e.g., aluminum, steel, etc.) can be shaped to form the bottom wall 132 and the side walls 116 of the frame. The one or more contact pads can be formed from one or more regions of the bottom wall, eliminating the need for connections. In some examples, the frame and contact pads are formed from a common piece of metal, e.g., by machining, and thus the contact pads can be formed as thin layers (e.g., less than 5 mm, less than 2 mm, or less than 1 mm). This can further enhance thermal performance while still fully isolating fluids leaked from the IT equipment.

[0037] In some examples, as shown, each contact pad can be distanced from or protrude from the frame. In other examples, each contact pad can be flush with the frame, providing a smooth bottom surface of the frame. Each of the one or more contact pads can be disposed on a bottom outer surface of the frame on the bottom wall 132 of the frame. The bottom outer surface can be perpendicular to one or more vertical walls in which the fluid supply line and the fluid return line are held. Thus, the side walls 116 and the bottom wall 132 can form a cup shape, with the interior region 122 serving as a reservoir that can contain fluids in the event of a leak.

[0038] The chassis 114, not fully shown, can include electronic components 126, which can include high-power processors or other integrated circuits, embedded on a PCB 128. The PCB can be mounted on a tray 134 of the chassis. The frame can be integrated with and / or secured to the chassis such that the one or more contact pads are physically pressed against the respective electronic devices. In this way, each contact pad can be thermally coupled to the respective electronic device. The contact pads can be flat to provide a large and uniform surface area to transfer thermal energy to and from the electronic devices.

[0039] One or more cold plates, such as 102, 104, 106, and 108, can be disposed in the interior region 122 of the frame. The interior region of the frame can be a negative space of the frame, enclosed by the side walls 116 and a bottom wall on which the one or more contact pads are located. The one or more cold plates can be thermally connected to the interior surface 124 of the frame at respective locations on the interior surface opposite the one or more contact pads.

[0040] For example, the first cold plate 102 can be fitted to the interior surface of the frame directly on top of a first contact pad of the one or more contact pads. The second cold plate 104 can be secured to the interior surface of the frame directly on top of a second contact pad of the one or more contact pads, and so on. The cold plates can provide localized cooling by transferring heat from the device to a liquid that flows through the cold plate. The cold plates can be metallic structures (e.g., flat plates) that have a flow path through the structure. The path of the fluid within the cold plate can have various shapes and geometries, such as zigzag, meandering, or back-and-forth flow paths. The cold plates can be fitted to the frame by fastening hardware such as screws, bolts, clips, glue, welding, or other fastening techniques.

[0041] The cold plates can include supply lines, return lines, and connectors, which are collectively represented here as assembly 110. The supply and return lines of the assembly 110 can include flexible hoses or rigid to semi-rigid conduits. The connectors 110 can be connected to one or more fluid supply line connectors and one or more fluid return line connectors of the frame. These fluid supply and return line connectors can be disposed and integrated within the interior region of the frame in a sealed manner. In this way, these fluid supply and return line connectors can distribute fluid from the fluid supply line 120 to the one or more cold plates and collect fluid from the cold plates and return the fluid to the fluid return line 130. Leakage resulting from the assembly of distributing and collecting fluid from and to the cold plates can be contained within the interior region 122 of the frame, thereby keeping the IT equipment dry.

[0042] Figure 2 A frame 202 with cold plates for a liquid-cooled chassis is shown, which can also be referred to as a cooling unit, in accordance with some embodiments. In this figure, the entire cooling device, which can include one or more cold plates, as well as the circuitry and connecting devices for the cold plates, is included within the frame 202. The cold plates shown are attached and secured to the frame within the interior region 208 of the frame. As described above, each cold plate can have a first line 204, which can include a hose, a conduit, and / or a connector. The connector of the first line 204 can be connected to one or more fluid supply line connectors in the interior region of the frame. Each of the one or more fluid supply line connectors is fluidically connected to a fluid supply line in a wall of the frame.

[0043] Similarly, each cooling unit can have a second line 206, which can include a hose, conduit, and / or connector. The connector of the second line 206 can connect to one or more fluid return line connectors in the interior region of the frame. Each of the one or more fluid return line connectors is fluidly connected to a fluid return line in the frame wall. In some examples, the connectors 204 and / or 206 can include blind mate connectors or quick disconnect connectors to allow for simple installation or maintenance of the chassis. If a leak occurs from the cold plate or any of the connectors, the frame can contain the leak and keep the electronic device cool. If the leak or otherwise damaged, the cold plate assembly (including the cold plate and its corresponding lines 204 and 206) can be replaced.

[0044] Figure 3 A frame 302 with one or more cold plates is shown in accordance with some embodiments. The frame shown here is a top view of a frame, such as similar to or equivalent to Figure 1 or Figure 2 the frame shown. One or more cold plates, such as cold plates 308, 310, 312, and 314, are mounted to the interior bottom surface of the frame and are positioned directly above the corresponding contact pads. As described above, the cold plates can have connectors and lines that connect to one or more fluid supply line connectors 318 and one or more fluid return line connectors 316. These connectors can be dripless blind mate connectors and manual mate connectors. In some examples, even a medium or low quality dripless flow connector can be used with such a frame, which can contain a small fluid leak. Thus, such a solution can be used with lower quality connectors, if desired. The fluid supply line connectors 318 are fluidly connected to the fluid supply line 304 located in the side wall 324 of the frame. Similarly, the fluid return line 316 is fluidly connected to the fluid return line 306 located in the side wall 324 of the frame. The lines 306 and 304 can also be understood as fluid distribution units.

[0045] Additionally, although shown as non-overlapping in Figure 3 , the fluid return line and the fluid supply line can be arranged in different regions (such as at different heights) along the common portion of the side wall. Additionally, or alternatively, the fluid return line and the fluid supply line can occupy different portions of the side wall, as shown in the example in Figure 3 .

[0046] The frame can include an external fluid supply line connector 320 that is also fluidly connected to the supply line 304. The external fluid supply line connector 320 can be disposed at an outer surface of the frame. Similarly, the frame can include an external fluid return line connector 322 that is fluidly connected to the fluid return line 306. The external fluid return line connector 322 can be located at an outer surface of the frame. In this way, the connectors 320 and 322 can be accessed externally of the frame for receiving fluid from and returning fluid to an IT rack in which the frame is installed. In some examples, the connectors 320 and / or 322 can be fluidly connected to a manifold of the IT rack. In this way, multiple such frames can be deployed within an IT rack in a flexible manner.

[0047] Figure 4 A frame with a built-in evaporation unit is shown in accordance with some embodiments. The frame 408 can include one or more contact pads 406 disposed on an outer surface on a bottom wall of the frame, as described elsewhere. The one or more contact pads 406 can include a built-in evaporation fluid 404. For example, the evaporation fluid 404 can be present in one or more evaporation chambers 402. When the evaporation fluid absorbs a certain amount of thermal energy, some of the fluid can change state (e.g., evaporate) from liquid to gas. When a fluid undergoes a phase change, the fluid can absorb latent heat energy with little or no change in temperature. The latent heat energy of a substance is greater than the specific heat of the same substance. Thus, a contact pad with a built-in evaporation unit is able to absorb more thermal energy from an IT device in a reduced volume. When the evaporated fluid rises to a top region of the evaporation chamber 402, the fluid can be cooled by a cold plate, causing a change back to liquid form. In some embodiments, the evaporation chamber 402 can be used and assembled underneath the contact pad 406, rather than inside the contact pad.

[0048] In some examples, although not shown, the evaporation chamber can include a wicking structure. In some examples, the wicking structure can be positioned along a floor of the evaporation chamber to more evenly distribute fluid along the floor of the evaporation chamber.

[0049] With respect to Figure 4 The illustrated examples can be applicable to the embodiments described in other sections. For example, the frames described in this disclosure with respect to Figure 1 、 Figure 2 、 Figure 3 、 Figure 5 and / or Figure 6 may include one or more contact pads with a built-in evaporation unit.

[0050] Figure 5A frame with a thermoelectric cooling unit is shown in accordance with some embodiments. The frame 508 can include one or more contact pads 504 disposed on an outer surface on a bottom wall of the frame, as described elsewhere. The one or more contact pads can include a thermoelectric cooler 506 (TEC). The TEC can include semiconductor regions (shown by N and P junctions) that can be sandwiched between a hot side and a cold side. The P and N junctions can be electrically connected in series and / or parallel to each other, and can be electrically connected to a power source 502. Each of the hot side 512 and the cold side 510 can be formed by a respective plate (planar shape) that sandwiches the semiconductor regions on opposite sides, with the cold side facing the outer surface of the frame. The TEC, also known as a Peltier module, can have a semiconductor assembly arranged to generate electricity by the Peltier effect, the Seebeck effect, and / or the Thomson effect. In some embodiments, the TEC 506 can be disposed under the contact pads 504 instead of inside the contact pads.

[0051] The power source 502 can provide a voltage (e.g., a DC voltage) to the TEC, which causes thermal energy to actively flow from the cold side to the hot side 512. The cold plate mounted on the inner surface of the frame can absorb thermal energy from the hot side. Thus, if a boost is needed, thermal energy can be actively transferred from the IT equipment. The power source 502 can be activated by processing logic, which can be implemented as hardware (e.g., a processor or programmable logic), software, or a combination thereof.

[0052] In some instances, the processing logic can activate the power source to actively cool the one or more contact pads based on a sensed temperature. The temperature of the frame and / or the IT equipment can be sensed, and the power source can be activated if a threshold is met. In some instances, the voltage output of the power source can be proportionally controlled based on the temperature. For example, the higher the temperature, the higher the processing logic drives the voltage source within a certain temperature or voltage limit.

[0053] According to some aspects, the frame can introduce an additional thickness of material between the cold plate and each IT equipment compared to direct contact between the cold plate and the respective IT equipment. For example, based on the thickness of the bottom wall of the frame and / or the height of the contact pads from the frame, the distance that thermal energy has to travel from the IT equipment to the cold plate can increase. However, this effect can be balanced against the advantages of a more reliable and leak-proof system. Additionally, some instances such as those shown in Figure 4 or Figure 5 may reduce the thermal resistance caused by the thickness of the frame and enhance the heat transfer from the source to the cooling unit.

[0054] Figure 6A frame with shared fluid is shown in accordance with some embodiments. Frame 602 can have an external fluid supply line connector 610 and an external fluid return line connector 608 for receiving fluid from and returning fluid to an IT rack. This can be referred to as rack level fluid. In some instances, as described in other sections, external fluid supply line connector 610 and external fluid return line connector 608 can be fluidly connected to a manifold of an IT rack. External fluid supply line connector 610 can be fluidly connected to a supply line 612 located within a side wall of frame 602. External fluid return line 608 can be fluidly connected to a return line 614 within a side wall of frame 602.

[0055] In addition, frame 602 can have an additional fluid supply line connector 606 and an additional fluid return line connector 604. Additional fluid supply line connector 606 can also be fluidly connected to supply line 614. Similarly, additional fluid return line connector 604 can also be fluidly connected to return line 612. Connectors 608, 610, 604, and 606 can be located on the outer surface of the frame. Additional connectors 604 and 606 can be connected to a second frame 616, such as through an external fluid supply line connector and an external fluid return line connector of the second frame, for fluidly connecting frame 602 to second frame 616.

[0056] Frame 602 and second frame 616 can be fixed to and / or integrated with a common chassis. In this way, the frames can be flexibly arranged to accommodate different arrangements on different chassis. Sharing of fluid from one frame to another can reduce the number of hoses, pipes, and connections throughout the IT rack, thereby reducing potential sources of leaks.

[0057] Figure 7is a block diagram illustrating an IT rack, which can also be referred to as an electronics rack, in accordance with some embodiments. The IT rack 742 can be representative of any of the IT racks described throughout this application. In accordance with one embodiment, the IT rack 742 includes, but is not limited to, a coolant distribution unit (CDU) 714, a rack management unit (RMU) 710, and one or more server enclosures, such as server enclosures 720, 726, 730, 734, and 738. The one or more server enclosures can be inserted into an array of server slots (e.g., standard shelves) from either the front end 744 or the rear end 706 of the rack, respectively. Note that although five server enclosures are shown in this example, more or fewer server enclosures can be maintained within the IT rack. It should also be noted that the particular locations of the CDU, RMU, and / or one or more server enclosures are shown for illustrative purposes only; other arrangements or configurations of the CDU, RMU, and / or one or more server enclosures can also be implemented. In one embodiment, the IT rack can be open to the environment or partially contained by a rack container, so long as the cooling fans can generate an airflow from the front end to the rear end.

[0058] Any or all of the server enclosures can each include one or more frames that house respective cold plates, collectively shown here as 722, 728, 732, 736, and 740. Each of the one or more frames and respective cold plates can include embodiments described in other sections. In some examples, as described, a server enclosure can have more than one frame mounted on the IT device. One frame can provide fluid to another frame, and so on. In some instances, a frame can include a vapor unit or TEC, as described in other sections. A server enclosure can be populated with different frames based on the application.

[0059] Additionally, for at least some of the server enclosures, optional fan modules (not shown) are associated with the server enclosures. Each of the fan modules includes one or more cooling fans. The fan modules can be mounted on the rear end of the server enclosures or the electronics rack to generate an airflow that flows out of the front end, travels through the air space of the server enclosures, and exists at the rear end of the electronics rack.

[0060] In one embodiment, the CDU includes primarily a heat exchanger 716, a liquid pump 718 and a pump controller (not shown), and some other components such as a liquid reservoir, a power supply, monitoring sensors, etc. The heat exchanger 716 can be a liquid-to-liquid heat exchanger. The heat exchanger 716 can include a first circuit having an inlet port and an outlet port with a first pair of liquid connectors coupled to the external liquid supply / return lines 702, 704 to form a primary circuit. The connectors coupled to the external liquid supply / return lines 702, 704 can be provided or mounted on the back end of the electronic rack. The liquid supply / return lines can also be referred to as room liquid supply / return lines, which can be coupled to an external cooling system.

[0061] In addition, the heat exchanger 716 can further include a second circuit having two ports with a second pair of liquid connectors coupled to a liquid manifold 724 (also referred to as a rack manifold) to form a secondary circuit, which can include a supply manifold (also referred to as a rack liquid supply line or a rack supply manifold) for supplying cooling liquid to any of the one or more server enclosures and a return manifold (also referred to as a rack liquid return line or a rack return manifold) for returning warmer liquid to the CDU 714. Note that the CDU 714 can be any kind of commercially available or custom-made CDU. As such, the details of the CDU will not be described here.

[0062] Each of the server enclosures can include one or more IT components (e.g., central processing units or CPUs, general purpose / graphics processing units (GPUs), memories, and / or storage devices). Each IT component can perform data processing tasks, where the IT component can include software installed in a storage device, loaded into a memory, and executed by one or more processors to perform the data processing tasks. The server enclosures can include a host server (referred to as a host node) coupled to one or more compute servers (also referred to as compute nodes, such as CPU servers and GPU servers). The host server (with one or more CPUs) typically interfaces with clients over a network (e.g., the Internet) to receive requests for a particular service, such as a storage service (e.g., a cloud-based storage service, such as backup and / or restore), execution of an application to perform certain operations (e.g., image processing, deep data learning algorithms or modeling, etc., as part of a service software or SaaS platform). In response to the request, the host server allocates the task to one or more compute nodes or compute servers (with one or more GPUs) managed by the host server. The compute servers perform the actual tasks, which can generate heat during operation.

[0063] The IT rack can also include an optional RMU 710 configured to provide and manage power provided to the servers, as well as a CDU. The RMU can be coupled to a power supply unit (not shown) to manage power consumption of the power supply unit. The power supply unit can include necessary circuitry (e.g., alternating current (AC) to direct current (DC) power converters or DC to DC power converters, batteries, transformers, or regulators, etc.) to provide power to the remaining components of the electronic rack 1200.

[0064] The illustrated rack configuration is described for purposes of illustration only; other configurations or arrangements can also be applied. For example, the CDU can be an optional unit. The cold plates of the server sleds can be coupled to a rack manifold that can be directly coupled to an external liquid cooling system (e.g., through a room manifold) without using a CDU. Although not shown, a power supply unit can be provided within the electronic rack. The power supply unit can be implemented as a standard sled that is identical or similar to the server sleds, where the power supply sled can be plugged into any standard rack in place of any server sled. Additionally, the power supply sled can also include a backup battery unit (BBU) for providing battery power to one or more server sleds when the main power supply is not available. The BBU can include one or more battery packs, and each battery pack can include one or more battery units, as well as necessary charging and discharging circuitry for charging and discharging the battery units.

[0065] It will be appreciated that some features described and shown in the drawings can vary without departing from the scope of the present disclosure. For example, as described above, the contact pads can have varying heights of departure (e.g., 0 mm, 1 mm, 2 mm, 5 mm, or other heights). Additionally, although shown with four sidewalls that form a rectangular shape from a top view, the frame can have varying shapes or geometries without departing from the scope of the present disclosure.

[0066] Some embodiments can include a non-transitory machine-readable medium (such as a microelectronic memory) having instructions stored thereon that program one or more data processing components (collectively referred to herein as “processors”) to perform operations, such as controlling power for a TEC. In some embodiments, some of these operations can be performed by specific hardware components that house hardwired logic. Alternatively, these operations can be performed by any combination of programmed data processing components and fixed hardwired circuit components.

[0067] In the foregoing specification, embodiments of the disclosure have been described with reference to specific exemplary embodiments thereof. It will be evident that various modifications can be made thereto without departing from the broader spirit and scope of the disclosure as set forth in the appended claims. The specification and drawings are, accordingly, to be regarded in an illustrative sense rather than a restrictive sense.

[0068] While certain aspects have been described and shown with reference to the attached figures, it will be understood by those skilled in the art that various changes in form and detail can be made therein without departing from the broad disclosure. Accordingly, the specification is to be regarded as illustrative rather than restrictive, and the scope of the disclosure is indicated by the appended claims, along with the full scope of equivalents to which such claims are entitled.

[0069] In some aspects, the disclosure can include language such as “at least one of [element A] and [element B].” This language can mean that at least one of the element A or element B is included in the set of elements. For example, “at least one of A and B” can mean “A” alone, “B” alone, or “A and B” together. Specifically, “at least one of A and B” can mean “at least one of A and at least one of B” or “at least one of A or B.” In some aspects, the disclosure can include language such as “[element A], [element B], and / or [element C].” This language can mean that the element A, element B, or element C, or any combination thereof, is included in the set of elements. For example, “A, B, and / or C” can mean “A,” “B,” “C,” “A and B,” “A and C,” “B and C,” or “A, B, and C.”

Claims

1. A frame for a liquid-cooled chassis in an information technology rack, comprising: Fluid supply lines are housed within one or more vertical walls of the frame; The fluid return line is housed within one or more vertical walls of the frame; One or more cold plates are arranged in the internal area of ​​the frame; One or more fluid supply line connectors and one or more fluid return line connectors are arranged in the inner region of the frame, the inner region being in fluid connection with the one or more cold plates, the one or more fluid supply line connectors distributing fluid from the fluid supply line to the one or more cold plates, and the one or more fluid return line connectors returning fluid from the one or more cold plates to the fluid return line; as well as One or more contact pads are disposed on the outer surface of the bottom wall of the frame and thermally connected to the IT equipment for transferring heat energy with the IT equipment. Wherein, the one or more cold plates are thermally connected to the inner surface of the bottom wall at corresponding positions on the inner surface opposite to the one or more contact pads; The frame is a water-tight frame that contains leaked fluid in its internal region.

2. The framework according to claim 1, wherein, The thermoelectric cooler is built into or attached to one or more contact pads.

3. The framework according to claim 1, wherein, The evaporating fluid is contained within a chamber, which is constructed within or attached to one or more contact pads.

4. The framework according to claim 1, wherein, The frame has an external fluid supply line connector and an external fluid return line connector for receiving fluid from the manifold of the information technology rack and returning fluid to the manifold of the information technology rack.

5. The framework according to claim 1, wherein, The frame has additional fluid supply line connectors and additional fluid return line connectors for fluidly connecting the frame to a second frame within the liquid-cooled chassis.

6. A liquid-cooled chassis for an information technology rack, comprising: IT equipment is housed in the liquid-cooled chassis; as well as The framework includes: Fluid supply lines are housed within one or more vertical walls of the frame; The fluid return line is housed within one or more vertical walls of the frame; One or more cold plates are arranged in the internal area of ​​the frame; One or more fluid supply line connectors and one or more fluid return line connectors are arranged in the internal region of the frame, the internal region being in fluid connection with the one or more cold plates. The one or more fluid supply line connectors distribute fluid from the fluid supply line to the one or more cold plates, and the one or more fluid return line connectors return fluid from the one or more cold plates to the fluid return line; and One or more contact pads are disposed on the outer surface of the bottom wall of the frame and thermally connected to the IT device for transferring heat energy with the IT device. Wherein, the one or more cold plates are thermally connected to the inner surface of the bottom wall at corresponding positions on the inner surface opposite to the one or more contact pads; The frame is a water-tight frame that contains leaked fluid in its internal region.

7. The liquid-cooled chassis according to claim 6, wherein, The thermoelectric cooler is built into or attached to one or more contact pads.

8. The liquid-cooled chassis according to claim 6, wherein, The evaporating fluid is contained within a chamber, which is constructed within or attached to one or more contact pads.

9. The liquid-cooled chassis according to claim 6, wherein, The frame has an external fluid supply line connector and an external fluid return line connector for receiving fluid from the manifold of the information technology rack and returning fluid to the manifold of the information technology rack.

10. An electronic rack, comprising: Multiple server chassis are arranged in a stack, wherein each of the server chassis includes: IT equipment, housed within the chassis; and The framework includes: Fluid supply lines are housed within one or more vertical walls of the frame; The fluid return line is housed within one or more vertical walls of the frame; One or more cold plates are arranged in the internal area of ​​the frame; One or more fluid supply line connectors and one or more fluid return line connectors are arranged in the internal region of the frame, the internal region being in fluid connection with the one or more cold plates. The one or more fluid supply line connectors distribute fluid from the fluid supply line to the one or more cold plates, and the one or more fluid return line connectors return fluid from the one or more cold plates to the fluid return line; and One or more contact pads are disposed on the outer surface of the bottom wall of the frame and thermally connected to the IT device for transferring heat energy with the IT device. Wherein, the one or more cold plates are thermally connected to the inner surface of the bottom wall at corresponding positions on the inner surface opposite to the one or more contact pads; The frame is a water-tight frame that contains leaked fluid in its internal region.

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