Multi-functional traceless wafer handling end effector

Abstract

The application provides a multifunctional traceless wafer carrying end effector, wherein: the wafer finger side is provided with an air flow groove, a plurality of connecting hole positions are arranged on the air flow groove, an adsorption device is fixedly connected on the wafer finger through the connecting hole positions, and a vacuum suction hole is arranged at the terminal of the air flow groove; the adsorption device comprises an elastic suction cup and a traceless contact pad, wherein: the top of the elastic suction cup is fixedly connected on the wafer finger through the connecting hole positions; the traceless contact pad is detachably connected at the bottom of the elastic suction cup; the inside of the elastic suction cup is communicated with the air flow groove; the vacuum suction hole is connected with a vacuum pump; the vacuum pump is used for forming a vacuum environment in the inside of the elastic suction cup, so that the bottom contact surface of the traceless contact pad is tightly contacted with the surface of a wafer to be carried, and the traceless carrying of the wafer is realized. The multifunctional traceless wafer carrying end effector provided by the application realizes the compatibility of multiple transmission modes of the same end effector.

Description

Technical Field

[0001] This invention relates to the field of semiconductor industry technology, and in particular to a multifunctional non-marking wafer end effector. Background Technology

[0002] In the semiconductor industry, mechanical fingers are commonly used to transport wafers and perform subsequent processing and inspection. During wafer transport, the wafer needs to be secured. Common end effectors employ methods such as mechanical clamping, vacuum adsorption, and Bernoulli adsorption to move the wafer to the workstation or chamber. Mechanical clamping end effectors use a motor-driven reciprocating motion of the clamping mechanism's gears to grasp the wafer, but due to the clamping force, they are prone to damaging the wafer and have low transport efficiency. Bernoulli adsorption end effectors are suitable for thin wafers but have limitations. Vacuum adsorption wafer end effectors offer high transport efficiency and are widely used, but they tend to leave adsorption marks on the wafer.

[0003] Therefore, the semiconductor industry today requires end effectors to have the ability to pick up warped and bonded wafers. However, when facing various wafer transport requirements, in addition to the limitations of existing mechanical clamping and Bernoulli end effectors, there are also problems such as vacuum adsorption end effectors being unable to pick up wafers with warped properties, and end effectors being incompatible with the pick up of wafers of multiple sizes. The usual solution to these problems is to replace the corresponding end effector and readjust it, which is cumbersome and time-consuming, greatly affecting work efficiency. Summary of the Invention

[0004] The present invention aims to provide a multifunctional, non-marking wafer end effector to solve the above-mentioned technical problems, and to achieve simple replacement operation while meeting various wafer handling needs.

[0005] To address the aforementioned technical problems, this invention provides a multifunctional, non-marking wafer handling end effector, comprising a wafer finger and a robotic arm detachably connected to the wafer finger, and further comprising: several adsorption devices and a vacuum pump, wherein:

[0006] The wafer finger is provided with an airflow groove on one side, and a number of connection holes are provided on the airflow groove. The adsorption device is fixedly connected to the wafer finger through the connection holes. The airflow groove is provided with a vacuum extraction hole at its end.

[0007] The adsorption device includes an elastic suction cup and a non-marking contact pad, wherein: the top of the elastic suction cup is fixedly connected to the wafer finger through a connection hole; the non-marking contact pad is detachably connected to the bottom of the elastic suction cup; the interior of the elastic suction cup communicates with the airflow groove;

[0008] The vacuum extraction hole is connected to a vacuum pump, which is used to create a vacuum environment inside the elastic suction cup so that the bottom contact surface of the non-marking contact pad can be in close contact with the surface of the wafer to be transported, thereby achieving non-marking transport of the wafer.

[0009] The above solution uses a suction device consisting of a detachable elastic suction cup and a non-marking contact pad. The suction cup is fixed to the wafer fingers, and the internal structure of the suction device communicates with the airflow channels on the wafer fingers. A vacuum pump is connected to the vacuum extraction port at the end of the airflow channels, allowing for wafer suction during transport. This simplifies the wafer transport device structure. The non-marking contact pad prevents the use of suction marks on the wafer surface during transport. Furthermore, the detachable structure of several suction devices allows for changes in the suction principle or the number of wafers suctioned by replacing different types of non-marking contact pads, thus altering the wafer finger suction and transport method. This enables compatibility with multiple wafer sizes and transport methods on the same end effector, meeting diverse production needs and facilitating rapid switching operations, significantly improving work efficiency.

[0010] Furthermore, a retaining ring is provided on the upper part of the non-marking contact pad; the non-marking contact pad is detachably snapped into the elastic suction cup cavity by the retaining ring.

[0011] In the above solution, by setting a retaining ring structure on the upper part of the non-marking contact pad, the retaining ring structure is inserted into the elastic chuck from the bottom, which can easily and quickly achieve a detachable connection with the elastic chuck, and it is not easy to fall off. This makes it convenient to quickly replace the corresponding type of non-marking contact pad when dealing with different wafers to be transported.

[0012] Furthermore, the non-marking contact pad includes a vacuum suction cup pad, wherein: the vacuum suction cup pad is used to create a vacuum environment inside the elastic suction cup when the vacuum pump is started, thereby causing the surface of the wafer to be transported to be adsorbed onto the bottom contact surface of the vacuum suction cup pad, thus realizing non-marking transport of the wafer.

[0013] In the above solution, by setting up a vacuum suction cup pad, a vacuum environment is created inside the elastic suction cup when the vacuum pump is used for evacuation. This creates negative pressure inside the non-marking contact pad, generating an adsorption force that causes the surface of the wafer to be transported to be adsorbed onto the bottom contact surface of the vacuum suction cup pad, thereby achieving non-marking transport of the wafer.

[0014] Furthermore, the non-marking contact pad includes a cyclone suction cup pad, wherein: the cyclone suction cup pad is provided with a cyclone nozzle on its side; when the cyclone suction cup pad is detachably connected to the bottom of the elastic suction cup, the cyclone nozzle communicates with the airflow channel; the cyclone suction cup pad is used to supply gas to the airflow channel from the vacuum extraction hole, the supply gas flows through the airflow channel and is ejected at high speed through the cyclone nozzle, and forms a rotating airflow inside the cyclone suction cup pad, so that a pressure difference is formed on both sides of the surface of the wafer to be transported based on the rotating airflow, and then the surface of the wafer to be transported is adsorbed onto the bottom contact surface of the cyclone suction cup pad based on the pressure difference.

[0015] In the above scheme, by setting up a cyclone suction cup pad with a cyclone nozzle on the side, the adsorption device combined with the elastic suction cup can realize the adsorption method of Bernoulli adsorption principle, that is, the high-speed airflow generated by the supply gas forms a low-pressure area on the surface of the suction cup, thereby generating adsorption force: when the supply gas flows through the airflow groove and is ejected at high speed from the cyclone nozzle, the ejected airflow forms a stable laminar flow in the space between the cyclone suction cup pad and the wafer, thereby creating a pressure difference between the upper and lower surfaces of the wafer, and finally forming an adsorption force on the wafer on the contact surface.

[0016] Furthermore, the traceless contact pad includes a solid suction cup pad, wherein: when any adsorption device is composed of a flexible suction cup and a solid suction cup pad that are detachably connected, the adsorption device cannot adsorb the wafer to be transported.

[0017] In the above solution, the useless adsorption device that blocks the finger can be realized by simply replacing it with a solid contact pad. By using a solid contact pad and an elastic suction cup to form any adsorption device, the number of adsorption devices that can generate adsorption force can be controlled, thereby meeting the adsorption needs of wafers of different specifications. The wafer transfer needs of various sizes can be met without changing the end effector, reducing the increase in finger teaching time due to frequent finger changes, which is conducive to improving production efficiency.

[0018] Furthermore, the lower part of the elastic suction cup is set as an upward-opening trumpet-shaped structure according to the preset suction cup angle, and the bottom of the trumpet-shaped structure is detachably connected to the retaining ring on the upper part of the traceless contact pad.

[0019] In the above scheme, by setting the lower part of the elastic suction cup to be an upward-opening trumpet-shaped structure, it is possible to grasp and adsorb the contact surface of the wafer to be transported at a certain arc or tilt angle.

[0020] Furthermore, the lower part of the traceless contact pad is set as a downward-opening trumpet-shaped structure according to the preset contact pad angle; the preset contact pad angle matches the preset suction cup angle.

[0021] In the above solution, by matching the angle of the trumpet-shaped structure at the bottom of the traceless contact pad with the angle of the trumpet-shaped structure at the bottom of the elastic chuck, the bottom contact surface fits more closely to the wafer surface, enabling the gripping and adsorption of the wafer contact surface with a certain arc or tilt angle during the elastic deformation of the elastic chuck.

[0022] Furthermore, the outer wall of the upper retaining ring of the traceless contact pad is set with an optimized outer wall curvature, and the lower inner wall of the elastic suction cup is set with an optimized inner wall curvature that matches the optimized outer wall curvature.

[0023] In the above solution, by setting the curvature of the outer wall of the matching retaining ring and the curvature of the lower inner wall of the elastic suction cup, the elastic suction cup and the traceless contact pad can be completely and tightly attached together, ensuring the stability of the adsorption device structure and thus ensuring the normal and stable adsorption function.

[0024] Furthermore, the upper part of the elastic chuck is configured as a corrugated structure that can be elastically compressed. The top of the corrugated structure is fixedly connected to the wafer fingers through connection holes. The corrugated structure is used to change the adsorption angle and adsorption height of the adsorption device through elastic compression to meet the different adsorption requirements of the wafers to be transported.

[0025] In the above scheme, by setting the upper part of the elastic suction cup to be an elastically compressible corrugated tube structure, the elastic suction cup can be elastically compressed, thereby changing the adsorption angle and adsorption height of the adsorption device, so as to meet the contact surface of wafers to be transported with different heights and warpage, and realize the gripping, adsorption and transport of wafers with different shapes and thicknesses.

[0026] Furthermore, the bottom contact surface of the traceless contact pad is provided with grooves.

[0027] In the above solution, grooves are set on the bottom contact surface of the non-marking contact pad to increase the friction between the non-marking contact pad and the surface of the wafer to be transported, thereby preventing the wafer to be transported from moving on the adsorption device and causing transportation hazards.

[0028] This invention provides a multifunctional, non-marking wafer handling end effector, addressing the wafer handling needs in the semiconductor technology field. It features an adsorption device composed of a detachably connected elastic chuck and a non-marking contact pad, which is fixedly attached to the wafer finger by the elastic chuck. The adsorption device's interior communicates with airflow channels on the wafer finger, and a vacuum pump is connected through a vacuum extraction port at the end of the airflow channels. This allows for wafer adsorption through vacuum operation, simplifying the wafer transport device structure. The use of a non-marking contact pad prevents the leaving of adsorption marks on the wafer surface during handling. The design incorporates a corrugated and flared structure for the elastic chuck, and a flared structure for the non-marking contact pad, enabling the adsorption of wafers with a certain degree of warpage, meeting various requirements. The device features an adsorption contact surface with the same curvature and height; and based on a detachable structure of several adsorption devices, it allows for changes in the adsorption principle or the number of adsorption units by replacing different types of non-marking contact pads. This satisfies both vacuum adsorption and Bernoulli adsorption principles for wafer transport, enabling rapid switching between various wafer thicknesses and specifications. Ultimately, it achieves a simple and compact structure that solves the adsorption marks during wafer handling, is compatible with the handling of warped wafers, bonded wafers, and Bernoulli adsorption methods, and simplifies the wafer transport device structure while avoiding contamination and damage to the wafer and reducing wafer manufacturing costs. This multi-functional non-marking end effector enables the transport of wafers of various specifications, significantly improving production efficiency. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of a multifunctional non-marking wafer handling end effector provided in an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of an adsorption device provided in an embodiment of the present invention;

[0031] Figure 3 This is a schematic diagram of a wafer finger plane provided in an embodiment of the present invention;

[0032] Figure 4 This is a schematic diagram of different shapes of wafer fingers provided in an embodiment of the present invention;

[0033] Figure 5 This is a schematic diagram of an adsorption device provided in an embodiment of the present invention, used for adsorbing warped wafers;

[0034] Figure 6 This is a schematic diagram of a solid contact pad provided in an embodiment of the present invention;

[0035] Figure 7 This is a schematic diagram of a cyclone suction cup pad provided in an embodiment of the present invention;

[0036] Figure 8This is a schematic diagram of a multifunctional non-marking wafer handling end effector adsorbing wafers of different sizes, provided in an embodiment of the present invention.

[0037] Figure 9 A schematic diagram of an adsorption device for adsorbing a wafer with a certain curvature, provided in an embodiment of the present invention;

[0038] In the diagram: 1. Wafer finger; 2. Adsorption device; 3. Sealing strip; 4. Rotating robotic arm; 5. Auxiliary mounting parts; 6. Airflow channel; 7. Vacuum extraction hole; 8. Mounting hole; 9. Connection hole; 10. Shaft hole; 11. 6-inch wafer; 12. 8-inch wafer; 13. 12-inch wafer; 14. Vacuum suction cup pad; 15. Solid suction cup pad; 21. Flexible suction cup; 22. Non-marking contact pad; 23. Suction hole; 24. Snap ring; 25. Suction cup inner cavity; 26. Cyclone nozzle. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] This embodiment provides a multifunctional, non-marking wafer handling end effector, including a wafer finger and a robotic arm detachably connected to the wafer finger, and further including: several adsorption devices and a vacuum pump, wherein:

[0041] The wafer finger is provided with an airflow groove on one side, and a number of connection holes are provided on the airflow groove. The adsorption device is fixedly connected to the wafer finger through the connection holes. The airflow groove is provided with a vacuum extraction hole at its end.

[0042] The adsorption device includes an elastic suction cup and a non-marking contact pad, wherein: the top of the elastic suction cup is fixedly connected to the wafer finger through a connection hole; the non-marking contact pad is detachably connected to the bottom of the elastic suction cup; the interior of the elastic suction cup communicates with the airflow groove;

[0043] The vacuum extraction hole is connected to a vacuum pump, which is used to create a vacuum environment inside the elastic suction cup so that the bottom contact surface of the non-marking contact pad can be in close contact with the surface of the wafer to be transported, thereby achieving non-marking transport of the wafer.

[0044] The above solution uses a suction device consisting of a detachable elastic suction cup and a non-marking contact pad. The suction cup is fixed to the wafer fingers, and the internal structure of the suction device communicates with the airflow channels on the wafer fingers. A vacuum pump is connected to the vacuum extraction port at the end of the airflow channels, allowing for wafer suction during transport. This simplifies the wafer transport device structure. The non-marking contact pad prevents the use of suction marks on the wafer surface during transport. Furthermore, the detachable structure of several suction devices allows for changes in the suction principle or the number of wafers suctioned by replacing different types of non-marking contact pads, thus altering the wafer finger suction and transport method. This enables compatibility with multiple wafer sizes and transport methods on the same end effector, meeting diverse production needs and facilitating rapid switching operations, significantly improving work efficiency.

[0045] In practical implementation, a multifunctional end effector structure for semiconductor wafer handling refers to a material-carrying structure installed on the end arm of a handling robot to carry wafers. The end effector structure of this invention utilizes a vacuum pump to extract air from the space within the elastic suction cup, creating a vacuum environment that allows for tight contact between the wafer surface and the bottom contact surface of the non-marking contact pad, thereby achieving wafer handling. Simultaneously, all components in contact with the wafer are made of non-stick materials, thus leaving no adsorption marks on the wafer's adsorption surface. The adsorption device formed by the combination of the non-marking contact pad and the elastic suction cup enables the adsorption of warped wafers, and the compression of the elastic suction cup satisfies the adsorption of wafers with different degrees and directions of warpage.

[0046] In the specific implementation process, such as Figure 1 The multifunctional, non-marking wafer handling end effector shown comprises a wafer finger 1, an adsorption device 2, a sealing strip 3, a rotating robotic arm (4), and auxiliary mounting components 5. An airflow groove 6 is provided on one side of the wafer finger 1, and the end of the airflow groove 6 is a vacuum extraction hole 7, which communicates with a vacuum pump. The wafer finger 1 is detachably connected to the rotating robotic arm 4 through mounting holes 8. The adsorption device 2, as shown... Figure 2 As shown, it is detachably composed of an elastic suction cup 21 and a non-marking contact pad 22; as Figure 3 The schematic diagram of the wafer finger 1 shown shows that the airflow groove 6 is provided with a number of connection holes 9. The connection holes 9 are located on the surface of the wafer finger 1 and are fixedly connected to the adsorption device 2. The center of the connection hole 9 is provided with a shaft hole 10, which communicates with the airflow groove 6.

[0047] In the specific implementation process, the wafer fingers 1 are made of materials such as monolithic ceramic and alumina through mechanical processing. This ensures the fingers do not deform while allowing for variations in shape and form based on the actual size and shape of the wafer and carrier. This results in wafer fingers 1 with diverse shapes and sizes, such as two fingers, a single finger, a round finger, or a semi-circular finger. Figure 4 As shown, Figure 4 (a) shows the wafer finger 1 structure of a single finger. Figure 4 (b) is a wafer finger 1 structure with two fingers. Figure 4 (c) is the wafer finger 1 structure with circular fingers. Figure 4 (d) is a semi-circular wafer finger 1 structure. The mounting holes 8 of each wafer finger 1 are the same as the robot holes, which makes it easy to replace the wafer finger 1 according to different processes.

[0048] Optionally, a retaining ring is provided on the upper part of the non-marking contact pad 22; the non-marking contact pad 22 is detachably snapped into the cavity of the elastic suction cup 21 by the retaining ring.

[0049] In the specific implementation process, the diameter of the retaining ring on the upper part of the non-marking contact pad 22 is larger than the diameter of the inner cavity of the elastic suction cup 21. When the non-marking contact pad 22 is detachably snapped into the cavity of the elastic suction cup 21 by the retaining ring, the non-marking contact pad 22 and the elastic suction cup 21 are tightly combined, providing good structural support for the realization of the adsorption function. At the same time, because the elastic suction cup 21 is elastic, it is easy to install, easy to replace and not easy to fall off.

[0050] Optionally, the non-marking contact pad 22 includes a vacuum suction cup pad, wherein: the vacuum suction cup pad is used to create a vacuum environment inside the elastic suction cup 21 when the vacuum pump is started, thereby causing the surface of the wafer to be transported to be adsorbed onto the bottom contact surface of the vacuum suction cup pad, thus realizing non-marking transport of the wafer.

[0051] In practical implementation, the traceless contact pad 22 is machined from non-stick materials (such as PEEK, Teflon-coated alumina, etc.). Figure 5 As shown, the non-marking contact pad 22 has a suction hole 23. When the non-marking contact pad 22 is detachably connected to the bottom of the elastic chuck 21, the suction hole 23 communicates with the shaft hole 10, and a retaining ring 24 is provided at the top. When the non-marking contact pad 22 is a vacuum chuck pad, after the vacuum pump is started, a vacuum environment is formed inside the elastic chuck 21, and a negative pressure is formed in the inner cavity 25 of the vacuum chuck pad, thereby firmly adsorbing the wafer.

[0052] Optionally, the non-marking contact pad 22 includes a cyclone suction cup pad, wherein: the cyclone suction cup pad is provided with a cyclone nozzle on its side, and when the cyclone suction cup pad is detachably connected to the bottom of the elastic suction cup 21, the cyclone nozzle communicates with the airflow groove 6; the cyclone suction cup pad is used to supply gas to the airflow groove 6 from the vacuum extraction hole 7, the supply gas flows through the airflow groove 6 and is ejected at high speed through the cyclone nozzle, and forms a rotating airflow inside the cyclone suction cup pad, so that a pressure difference is formed on both sides of the surface of the wafer to be transported based on the rotating airflow, and then the surface of the wafer to be transported is adsorbed on the bottom contact surface of the cyclone suction cup pad based on the pressure difference.

[0053] In practical implementation, for the adsorption of extremely thin wafers, the Bernoulli adsorption principle is often used. This involves creating a low-pressure area on the adsorption surface using a high-speed airflow, thereby generating adsorption force. The high-speed airflow is eventually released into the external space through the gap between the adsorption device surface and the wafer surface, forming a stable laminar flow in the space between the cyclone suction cup pad and the wafer. This creates a pressure difference between the upper and lower surfaces of the wafer, ultimately forming an adsorption force on the wafer. In this embodiment, the non-marking contact pad 22 is replaced with a Bernoulli principle cyclone suction cup pad, transforming the vacuum suction cup into a Bernoulli suction cup. The specific implementation method of the cyclone suction cup pad is as follows... Figure 6 As shown, the retaining ring 24 on the upper part of the cyclone chuck pad has the same size as the retaining ring 24 of the vacuum chuck pad mentioned above. It is provided with a suction hole 23. The retaining ring 24 is locked in the elastic chuck 21. When the supplied gas passes through the airflow groove 6 of the wafer finger 1 into the elastic chuck 21, it is ejected at high speed through the side cyclone nozzle 26 on the side of the cyclone chuck pad and forms a rotating airflow in the cyclone chuck pad, and forms a negative pressure. Finally, a pressure difference is formed between the upper and lower surfaces of the wafer to be transported, so that the ultra-thin wafer to be transported is firmly attached to the cyclone chuck pad.

[0054] Optionally, the traceless contact pad 22 includes a solid suction cup pad, wherein: when any adsorption device 2 is composed of an elastic suction cup 21 and a solid suction cup pad that are detachably connected, the adsorption device 2 cannot adsorb the wafer to be transported.

[0055] In the specific implementation process, the non-stick contact pad 22 is replaced with a solid suction cup pad. The solid contact pad is exactly the same as the aforementioned vacuum suction cup pad in terms of material and size. Both are made of non-stick materials (such as PEEK, Teflon-coated alumina, etc.) and are machined. The only difference is that the solid contact pad does not have a suction hole 23 for achieving vacuum extraction. Figure 7 As shown, by simply replacing the contact pad, the useless adsorption device 2 of the wafer finger 1 can be blocked, realizing vacuum adsorption compatible with various wafer sizes. That is, the wafer transfer requirements of various sizes can be met without replacing the end effector, reducing the increase in working time due to frequent replacement of wafer finger 1, which is conducive to improving production efficiency.

[0056] In practical implementation, by increasing the number of adsorption devices 2 and replacing the traceless contact pads 22, the adsorption of bonded wafers of different sizes and weights can be achieved, for example as follows: Figure 8 As shown, Figure 8 (a) represents the adsorption on a 6-inch wafer 11. Figure 8 (b) represents the adsorption of 12 on an 8-inch wafer. Figure 8 (c) indicates the adsorption of a 12-inch wafer 13: For a 6-inch wafer 11, it can be composed of 3 elastic suction cups 21 and 3 vacuum suction cup pads 14. The contact pads of the remaining compression suction cups are replaced with solid suction cup pads 15 to block unnecessary vacuum suction ports and prevent air leakage when adsorbing small-sized wafers; For an 8-inch wafer 12, it is composed of 5 elastic suction cups 21 and 5 vacuum suction cup pads; The adsorption of a 12-inch wafer 13 is achieved by using 7 elastic suction cups 21 and 7 vacuum suction cup pads to achieve vacuum adsorption; That is, the load capacity of the end effector can be increased by increasing the number of suction cups.

[0057] In practical implementation, for wafers or bonded wafers of different weights to be transported, the number of wafer suction points is increased by adding non-marking contact pads 22 with suction holes 23 to achieve the required adsorption force, thus satisfying the adsorption of heavier wafers or bonded wafers to be transported. For example, for the adsorption of 12-inch wafers 13, a total of adsorption devices 2 are designed, and the specific calculations are as follows:

[0058] F=S*P / U=0.785*0.75 / 2.5=0.255kg;

[0059] S = 3.14 * 0.5 * 0.5 = 0.785 cm 2 ;

[0060] P=-75Kpa=75x0.01kg / cm2=0.75kg / cm 2 ;

[0061] G = 0.255 kg * 6 = 1.53 kg;

[0062] M = ρsh * 2 = 7.456 * 10 3 x0.15*0.15*3.14*0.75X10-3*2=0.79kg;

[0063] Where F represents the suction force of a single adsorption device 2, S represents the area of ​​the bottom contact surface of the non-marking contact pad 22, P represents the air pressure, U represents the safety factor (greater than the safety factor of 2.5), and G represents the total load of the wafer finger 1; the wafer finger 1 can withstand a maximum load of 1.785 kg; the LT wafer density is 7.456*10 3 kg / m 3M represents the weight of the LT wafer / the weight of the LT bond sheet, which is less than the total load of the wafer finger 1. That is, the end effector of this embodiment can meet the adsorption of 12-inch LT material wafer bond sheets with higher density. Therefore, the end effector of this embodiment can meet the transfer of most wafers.

[0064] Optionally, the lower part of the elastic suction cup 21 is set as an upward-opening trumpet-shaped structure according to a preset suction cup angle, and the bottom of the trumpet-shaped structure is detachably connected to the retaining ring 24 on the upper part of the traceless contact pad 22.

[0065] In practice, by setting the lower part of the elastic suction cup 21 to be an upward-opening trumpet-shaped structure, it is possible to grasp and adsorb the contact surface of the wafer to be transported at a certain arc or tilt angle.

[0066] Optionally, the lower part of the traceless contact pad 22 is set as a downward-opening trumpet-shaped structure according to the preset contact pad angle; the preset contact pad angle matches the preset suction cup angle.

[0067] In the specific implementation process, by setting the angle of the lower horn-shaped structure of the traceless contact pad 22 to match the angle of the lower horn-shaped structure of the elastic suction cup 21, the bottom contact surface is made to fit more closely with the wafer surface, so as to grasp and adsorb the contact surface of the wafer to be transported with a certain arc or tilt angle during the elastic deformation of the elastic suction cup 21.

[0068] Optionally, the outer wall of the upper retaining ring 24 of the traceless contact pad 22 is set with an optimized outer wall curvature, and the lower inner wall of the elastic suction cup 21 is set with an optimized inner wall curvature that matches the optimized outer wall curvature.

[0069] In the specific implementation process, by setting the curvature of the outer wall of the matching retaining ring 24 and the curvature of the lower inner wall of the elastic suction cup 21, the elastic suction cup 21 and the traceless contact pad 22 can be completely and tightly attached together, ensuring the stability of the structure of the adsorption device 2 and thus ensuring the normal and stable adsorption function.

[0070] Optionally, the upper part of the elastic suction cup 21 is configured as an elastically compressible bellows structure, and the top of the bellows structure is fixedly connected to the wafer finger 1 through the connection hole 9; the bellows structure is used to change the adsorption angle and adsorption height of the adsorption device 2 through elastic compression to meet the different adsorption requirements of the wafer to be transported.

[0071] In the specific implementation process, the elastic suction cup 21 is made of rubber through a molding process. The upper part of the elastic suction cup 21 is shaped like a corrugated pipe, and the lower part is flared, with its interior communicating with the airflow groove 6 of the wafer finger 1. Figure 4For the adsorption of warped wafers, the elastic compression of the corrugated tube structure at the top of the elastic chuck 21 can accommodate contact surfaces of varying heights. Furthermore, for contact surfaces with a certain curvature, the lower horn structure can be used to achieve tilted gripping. Figure 9 As shown, for the contact surface of the wafer 16 to be transported with a certain curvature, the elastic chuck 21 achieves changes in the angle and height of the contact surface by compressing the upper corrugated tube structure and changing the lower horn-shaped structure.

[0072] Optionally, the bottom contact surface of the traceless contact pad 22 is provided with grooves.

[0073] In the specific implementation process, by setting grooves on the bottom contact surface of the non-marking contact pad 22, the friction between the non-marking contact pad 22 and the surface of the wafer to be transported is increased, so as to prevent the wafer to be transported from sliding radially on the adsorption device 2 and causing transportation risks.

[0074] This embodiment provides a multifunctional, non-marking wafer handling end effector, addressing the wafer handling needs in the semiconductor technology field. By optimizing the wafer finger structure, it incorporates a detachable elastic chuck and a non-marking contact pad to form an adsorption device. The elastic chuck is fixedly connected to the wafer finger, and the adsorption device communicates with the airflow channels on the wafer finger. A vacuum pump is connected to the vacuum extraction port at the end of the airflow channels, allowing for wafer adsorption through vacuum operation, thus simplifying the wafer transport device structure. The use of a non-marking contact pad prevents the leaving of adsorption marks on the wafer surface during handling. The corrugated and horn-shaped structures of the elastic chuck and the horn-shaped structure of the non-marking contact pad enable handling of wafers with a certain degree of warpage. The device features adsorption capabilities that satisfy different curvatures and heights of adsorption contact surfaces. Based on a detachable structure of several adsorption devices, the adsorption principle or the number of adsorption units can be changed by replacing different types of traceless contact pads. This allows for both vacuum adsorption and Bernoulli adsorption principles in wafer transport, facilitating rapid switching between various wafer thicknesses and specifications. Ultimately, it achieves a multi-functional, traceless end effector that solves the adsorption marks problem during wafer handling, is compatible with handling warped wafers, bonded wafers, and Bernoulli adsorption methods, simplifies the wafer transport device structure, avoids contamination and damage to wafers, and reduces wafer manufacturing costs. This enables the transport of wafers of various specifications, significantly improving production efficiency.

[0075] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A multifunctional, non-marking wafer handling end effector, comprising a wafer finger and a robotic arm detachably connected to the wafer finger, characterized in that, Based on a detachable structure of several adsorption devices, the adsorption principle or the number of adsorption units produced by the adsorption devices can be changed by replacing different types of non-marking contact pads. It also includes: several adsorption devices and a vacuum pump, wherein: The wafer finger is provided with an airflow groove on one side, and a number of connection holes are provided on the airflow groove. The adsorption device is fixedly connected to the wafer finger through the connection holes. The airflow groove is provided with a vacuum extraction hole at its end. The adsorption device includes an elastic suction cup and a non-marking contact pad, wherein: the top of the elastic suction cup is fixedly connected to the wafer finger through a connection hole; the non-marking contact pad is detachably connected to the bottom of the elastic suction cup; the interior of the elastic suction cup communicates with the airflow groove; The vacuum extraction hole is connected to a vacuum pump, which is used to create a vacuum environment inside the elastic suction cup so that the bottom contact surface of the non-marking contact pad can be in close contact with the surface of the wafer to be transported, thereby achieving non-marking transport of the wafer. The non-marking contact pad is provided with a retaining ring on its upper part; the non-marking contact pad is detachably snapped into the elastic suction cup cavity by the retaining ring; The non-marking contact pad includes a vacuum suction cup pad, wherein: the vacuum suction cup pad is used to create a vacuum environment inside the elastic suction cup when the vacuum pump is started, thereby causing the surface of the wafer to be transported to be adsorbed onto the bottom contact surface of the vacuum suction cup pad, thus realizing non-marking transport of the wafer; The non-marking contact pad includes a cyclone suction cup pad, wherein: the cyclone suction cup pad is provided with a cyclone nozzle on its side; when the cyclone suction cup pad is detachably connected to the bottom of the elastic suction cup, the cyclone nozzle communicates with the airflow groove; the cyclone suction cup pad is used to supply gas to the airflow groove from the vacuum extraction hole, the supply gas flows through the airflow groove and is ejected at high speed through the cyclone nozzle, and forms a rotating airflow inside the cyclone suction cup pad, so that a pressure difference is formed on both sides of the surface of the wafer to be transported based on the rotating airflow, and then the surface of the wafer to be transported is adsorbed onto the bottom contact surface of the cyclone suction cup pad based on the pressure difference; The traceless contact pad includes a solid suction cup pad, wherein: when any of the adsorption devices is detachably connected to the elastic suction cup and the solid suction cup pad, the adsorption device cannot adsorb the wafer to be transported.

2. The multifunctional non-marking wafer handling end effector according to claim 1, characterized in that: The lower part of the elastic suction cup is set as an upward-opening trumpet-shaped structure according to a preset suction cup angle, and the bottom of the trumpet-shaped structure is detachably connected to the retaining ring on the upper part of the traceless contact pad.

3. The multifunctional non-marking wafer handling end effector according to claim 2, characterized in that: The lower part of the traceless contact pad is set as a downward-opening trumpet-shaped structure according to a preset contact pad angle; the preset contact pad angle matches the preset suction cup angle.

4. The multifunctional non-marking wafer handling end effector according to claim 1, characterized in that: The outer wall of the upper retaining ring of the non-marking contact pad is configured with an optimized outer wall curvature, and the lower inner wall of the elastic suction cup is configured with an optimized inner wall curvature that matches the optimized outer wall curvature.

5. The multifunctional non-marking wafer handling end effector according to claim 1, characterized in that: The upper part of the elastic chuck is configured as an elastically compressible bellows structure, and the top of the bellows structure is fixedly connected to the wafer finger through a connection hole. The corrugated tube structure is used to change the adsorption angle and adsorption height of the adsorption device through elastic compression, so as to meet the different adsorption requirements of the wafers to be transported.

6. The multifunctional non-marking wafer handling end effector according to claim 1, characterized in that: The bottom contact surface of the traceless contact pad is provided with grooves.

Images