A high-power module heat dissipation structure

Abstract

The application provides a high-power module heat dissipation structure, which comprises an aluminum substrate, a first high-power module group is placed on the upper layer of the aluminum substrate, a second high-power module group is placed on the lower layer of the aluminum substrate, a first heat conduction patch group is arranged between the first high-power module group and the aluminum substrate and is used for transferring the heat of the first high-power module group to the aluminum substrate, a second heat conduction patch group is arranged between the second high-power module group and the aluminum substrate and is used for transferring the heat of the second high-power module group to the aluminum substrate, a high-density radiator is installed below the aluminum substrate and is in contact with the aluminum substrate, and a center substrate is installed in the aluminum substrate. The high-power module heat dissipation structure is used for concentrating and dispersing heat by means of space layout, and the heat of each module on the aluminum substrate is transferred to the high-density radiator by means of the high-conduction heat performance of the heat pipe and the high-density radiator, and meanwhile, a centrifugal fan is added to the middle of the high-density radiator, so that the heat of the radiator can be effectively taken out by the centrifugal fan and effectively dissipated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation devices, in particular to a high-power module heat dissipation structure. BACKGROUND

[0002] The existing power control module for underground mining areas has a large number of power modules with high density, and the environment is harsh. The device space is limited, the high-temperature environment is above 40 degrees, the module heat dissipation is difficult, the total power consumption of the module is about 800W, and the overall temperature needs to be controlled below 75 degrees. Therefore, a corresponding heat dissipation structure needs to be designed to dissipate heat and control temperature. SUMMARY

[0003] The purpose of the present application is to provide a high-power module heat dissipation structure to solve the technical problems in the background art.

[0004] To achieve the foregoing purpose, the present application provides the following technical solutions:

[0005] A high-power module heat dissipation structure includes an aluminum substrate. A first high-power module group is placed on the upper layer of the aluminum substrate. A second high-power module group is placed on the lower layer of the aluminum substrate. A first heat-conducting patch group is provided between the first high-power module group and the aluminum substrate to transfer heat from the first high-power module group to the aluminum substrate. A second heat-conducting patch group is provided between the second high-power module group and the aluminum substrate to transfer heat from the second high-power module group to the aluminum substrate. A high-density heat sink is installed below the aluminum substrate and in contact with the aluminum substrate. A center substrate is installed in the aluminum substrate.

[0006] A centrifugal fan is installed below the aluminum substrate and penetrates into the high-density heat sink.

[0007] The first high-power module group and the second high-power module group have the same structure. The first high-power module group is connected by a plurality of chip modules to form a ring structure. The aluminum substrate includes a support platform and a bottom disc. The bottom disc is below the support platform and is fixedly connected to the support platform by a plurality of support connecting rods. The support platform is a circular ring structure, and the bottom disc is a circular disc structure. The support platform and the bottom disc are coaxially arranged. The center substrate is installed on the bottom disc and coaxially arranged with the bottom disc. The first heat-conducting patch group and the second heat-conducting patch group have the same structure. The first heat-conducting patch group is above the support platform, and the second heat-conducting patch group is below the support platform. The first heat-conducting patch group includes a plurality of heat-conducting patches with the same structure. The heat-conducting patches are uniformly distributed above the support platform along the axis of the support platform. A plurality of heat pipe assemblies with the same structure are arranged between the support platform and the bottom disc along the circumferential direction of the axis of the support platform. The two ends of the heat pipe assembly are in contact with the support platform and the bottom disc, respectively.

[0008] The support platform is provided with a first placing groove for placing the heat pipe assembly, and the second placing groove extending from the first placing groove on the bottom plate is in communication with the first placing groove for placing the heat pipe assembly.

[0009] The heat pipe assembly comprises a first heat pipe and a second heat pipe, and the first heat pipe and the second heat pipe are symmetrically arranged, with the top ends of the first heat pipe and the second heat pipe being below the first heat conduction patch group of the support platform, and the bottom ends of the first heat pipe and the second heat pipe being below the center base plate.

[0010] The high-density radiator comprises a support plate and a plurality of heat dissipation fins mounted on the support plate, the support plate is in a disc structure, the support plate is coaxially arranged with the aluminum base plate, an installation through hole is arranged at the center of the support plate, the centrifugal fan is arranged in the installation through hole, the heat dissipation fins are arranged in a radial manner along the center of the support plate, the heat dissipation fins are in a U-shaped structure, the heat dissipation fins comprise a vertical plate, a first horizontal plate vertically mounted on one side above the vertical plate, and a second horizontal plate vertically mounted on one side below the vertical plate, the first horizontal plate and the second horizontal plate are symmetrically arranged, the first horizontal plate is in contact with the aluminum base plate, and the second horizontal plate is fixed on the support plate.

[0011] The aluminum base plate is covered with a protective cover, and the aluminum base plate, the first high-power module group and the second high-power module group are wrapped in the protective cover.

[0012] Compared with the prior art, the high-power module heat dissipation structure provided by the application utilizes space design layout to concentrate and disperse heat, and cooperates with the high-density radiator to utilize the high conduction performance of the heat pipe to transmit the heat of each module on the aluminum plate to the high-density radiator, and simultaneously adds the centrifugal fan in the middle of the high-density radiator, so that the heat of the radiator can be effectively taken out by the centrifugal fan to be effectively dissipated. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1 : the explosion diagram of the application;

[0014] Fig. 2 : the installation structure diagram of the aluminum base plate and the heat pipe assembly;

[0015] Fig. 3 : the structure schematic diagram of the high-density radiator;

[0016] Fig. 4 : the assembly structure schematic diagram of the application. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application.

[0018] Specific embodiment 1: please refer to Figs. 1 to 4The application discloses a high-power module heat dissipation structure, which comprises an aluminum substrate 6, a first high-power module group 2 is arranged on the upper layer of the aluminum substrate 6, a second high-power module group 8 is arranged on the lower layer of the aluminum substrate 6, a first heat conduction fin group 3 is arranged between the first high-power module group 2 and the aluminum substrate 6 and is used for transferring the heat of the first high-power module group 2 to the aluminum substrate 6, a second heat conduction fin group 7 is arranged between the second high-power module group 8 and the aluminum substrate 6 and is used for transferring the heat of the second high-power module group 8 to the aluminum substrate 6, a high-density radiator 10 is arranged below the aluminum substrate 6 and is in contact with the aluminum substrate 6, a center substrate 4 is arranged in the aluminum substrate 6, a centrifugal fan 9 is arranged below the aluminum substrate 6, the centrifugal fan 9 penetrates into the high-density radiator 10, the heat of the high-density radiator 10 is effectively dissipated through the centrifugal fan 9, and the centrifugal fan 9 is electrically connected with the aluminum substrate 6 and provides power driving for the centrifugal fan 9 through the aluminum substrate 6.

[0019] The first high-power module group 2 and the second high-power module group 8 are of the same structure, the first high-power module group 2 is connected by a plurality of chip modules to form a ring structure, the aluminum substrate 6 comprises a support platform 601 and a bottom disc 602, the bottom disc 602 is below the support platform 601 and is fixedly connected with the support platform 601 through a plurality of support connecting rods 603, the support platform 601 is a circular ring structure, the bottom disc 602 is a circular disc structure, the support platform 601 and the bottom disc 602 are coaxially arranged, in the embodiment, the outer diameter of the bottom disc 602 is less than or equal to the inner diameter of the support platform 601, the center substrate 4 is arranged on the bottom disc 602 and is coaxially arranged with the bottom disc 602, the first heat conduction fin group 3 and the second heat conduction fin group 7 are of the same structure, the first heat conduction fin group 3 is above the support platform 601, the second heat conduction fin group 7 is below the support platform 601, the first heat conduction fin group 3 comprises a plurality of heat conduction fins of the same structure, the heat conduction fins are uniformly distributed above the support platform 601 along the axis of the support platform 601, a plurality of heat pipe assemblies 5 of the same structure are arranged between the support platform 601 and the center substrate 4 along the circumferential direction of the axis of the support platform 601, and the two ends of the heat pipe assembly 5 are in contact with the support platform 601 and the bottom disc 602 respectively.

[0020] The support platform 601 is provided with a first placing groove 601-1 for placing the heat pipe assembly 5, and the bottom disc 602 is provided with a second placing groove 602-1 corresponding to the position of the first placing groove 601-1 and in communication with the first placing groove 601-1 for placing the heat pipe assembly 5.

[0021] The heat pipe assembly 5 includes a first heat pipe 501 and a second heat pipe 502, which are symmetrically arranged in structure, the top ends of the first heat pipe 501 and the second heat pipe 502 are below the first heat conduction patch group 3 of the support platform 601, the bottom ends of the first heat pipe 501 and the second heat pipe 502 are below the center base plate 4, the first heat pipe 501 and the second heat pipe 502 are arranged side by side, and the first heat pipe 501 and the second heat pipe 502 form a Y-shaped structure on the support platform 601, so that the first heat pipe 501 and the second heat pipe 502 have a larger and more stable contact area with the support platform 601.

[0022] The high-density heat sink 10 includes a support plate 1001 and a plurality of heat dissipation fins 1002 mounted on the support plate 1001, the support plate 1001 has a disc structure, the support plate 1001 is coaxially arranged with the aluminum base plate 6, an installation through hole 1001-1 is arranged at the center of the support plate 1001, and the centrifugal fan 9 is arranged in the installation through hole 1001-1, the heat dissipation fins 1002 are arranged in a radial manner along the center of the support plate 1001, the heat dissipation fins 1002 have a U-shaped structure, the heat dissipation fins 1002 include a vertical plate 1002-1, a first horizontal plate 1002-2 vertically arranged on one side above the vertical plate 1002-1, and a second horizontal plate 1002-3 vertically arranged on one side below the vertical plate 1002-1, the first horizontal plate 1002-2 and the second horizontal plate 1002-3 are symmetrically arranged in structure, the first horizontal plate 1002-2 is in contact with the aluminum base plate 6, and the second horizontal plate 1002-3 is fixed on the support plate 1001.

[0023] The aluminum base plate 6 is covered by the protective cover 1, and the protective cover 1 protects the aluminum base plate 6, the first high-power module group 2 and the second high-power module group 8.

[0024] Working principle: The first high-power module and the second high-power module generate heat upward and downward on the support platform 601 of the aluminum base plate 6, the heat is transmitted to the aluminum base plate 6 through the first heat conduction patch group 3 and the second heat conduction patch group 7, and then the heat on the aluminum base plate 6 is uniformly transmitted to the center of the aluminum base plate 6 through the heat transfer performance of the heat pipe, the heat is then transmitted to the center of the aluminum base plate 6 through the high-density heat sink 10 and the centrifugal fan 9 arranged at the center of the aluminum base plate 6, the heat on the high-density heat sink 10 is further dissipated by the centrifugal fan 9 in the high-density heat sink 10, and the first high-power module group 2 and the second high-power module group 8 are efficiently cooled.

[0025] Compared with the prior art, the high-power module heat dissipation structure provided by the application utilizes space design layout to concentrate and disperse heat, and cooperates with a high-density radiator, utilizes the high conduction performance of a heat pipe to transmit the heat of each module on an aluminum plate to the high-density radiator, and simultaneously adds a centrifugal fan in the middle of the high-density radiator, so that the heat of the radiator can be effectively taken out by the centrifugal fan at the center to be effectively dissipated.

[0026] It is apparent to those skilled in the art that the application is not limited to the details of the foregoing exemplary embodiments, and that the application can be implemented in other specific forms without departing from the spirit or essential characteristics of the application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, and the scope of the application should be defined by the appended claims rather than by the foregoing description, and it is intended that all changes that come within the meaning and range of equivalency of the claims are embraced therein. Any reference signs in the claims should not be construed as limiting the claims to the figures in which the reference signs are used.

[0027] Furthermore, it should be understood that although the present specification describes only a single independent technical solution for each embodiment, the specification is described in this way only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

1. A high power module heat dissipation structure, characterized by: The application relates to an aluminum substrate, a first high-power module group is arranged on the upper layer of the aluminum substrate, a second high-power module group is arranged on the lower layer of the aluminum substrate, a first heat-conducting patch group is arranged between the first high-power module group and the aluminum substrate and is used for transferring heat of the first high-power module group to the aluminum substrate, a second heat-conducting patch group is arranged between the second high-power module group and the aluminum substrate and is used for transferring heat of the second high-power module group to the aluminum substrate, a high-density radiator is arranged below the aluminum substrate and is in contact with the aluminum substrate, a center substrate is arranged in the aluminum substrate, a centrifugal fan is arranged below the aluminum substrate and penetrates into the high-density radiator, the first high-power module group and the second high-power module group are of the same structure, the first high-power module group is connected by a plurality of chip modules and forms a ring structure, the aluminum substrate comprises a supporting platform and a bottom disc, the bottom disc is below the supporting platform and is fixedly connected with the supporting platform through a plurality of supporting connecting rods, the supporting platform is a circular ring structure, the bottom disc is a circular disc structure, the supporting platform and the bottom disc are coaxially arranged, the center substrate is arranged on the bottom disc and is coaxially arranged with the bottom disc, the first heat-conducting patch group and the second heat-conducting patch group are of the same structure, the first heat-conducting patch group is above the supporting platform, the second heat-conducting patch group is below the supporting platform, the first heat-conducting patch group comprises a plurality of heat-conducting patches of the same structure, the heat-conducting patches are uniformly distributed above the supporting platform along the axis of the supporting platform, a plurality of heat pipe assemblies of the same structure are arranged between the supporting platform and the bottom disc along the circumferential direction of the axis of the supporting platform, and the two ends of the heat pipe assembly are respectively in contact with the supporting platform and the bottom disc.

2. The heat dissipation structure of a high-power module according to claim 1, characterized in that: A first placing groove for placing the heat pipe assembly is arranged on the supporting platform, and a second placing groove extending from the bottom disc and communicating with the first placing groove is arranged at the position corresponding to the first placing groove and is used for placing the heat pipe assembly.

3. The heat dissipation structure of a high-power module according to claim 1, characterized in that: The heat pipe assembly comprises a first heat pipe and a second heat pipe, the first heat pipe and the second heat pipe are symmetrically arranged, the top ends of the first heat pipe and the second heat pipe are below the first heat-conducting patch group of the supporting platform, and the bottom ends of the first heat pipe and the second heat pipe are below the center substrate.

4. The heat dissipation structure of a high-power module according to claim 1, characterized in that: The high-density radiator comprises a supporting plate and a plurality of heat dissipation fins arranged on the supporting plate, the supporting plate is a circular disc structure, the supporting plate is coaxially arranged with the aluminum substrate, an installation through hole is arranged at the axis position of the supporting plate, the centrifugal fan is arranged in the installation through hole, the heat dissipation fins are arranged in a radial manner along the axis of the supporting plate, the heat dissipation fins are U-shaped structures, the heat dissipation fins comprise a vertical plate, a first horizontal plate vertically arranged on one side above the vertical plate and a second horizontal plate vertically arranged on one side below the vertical plate, the first horizontal plate and the second horizontal plate are symmetrically arranged, the first horizontal plate is in contact with the aluminum substrate, and the second horizontal plate is fixed on the supporting plate.

5. The heat dissipation structure of a high-power module according to claim 1, characterized in that: The aluminum substrate is covered by a protective cover, and the protective cover wraps the aluminum substrate, the first high-power module group and the second high-power module group.

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