Charging pile and its power distribution unit

Abstract

The present invention provides a charging pile and a power distribution unit thereof. The power distribution unit includes: a substrate on which a switching circuit is provided. The switching circuit includes an input port, multiple output ports, and multiple switching units connected between the input port and each output port. The switching unit is used to connect a power module to any one of the charging guns, and the switching unit includes a solid-state switch; a function board fixedly connected to the substrate. A driving circuit is provided on the function board, and the driving circuit is connected to the solid-state switch. The driving circuit is used to drive the solid-state switch; the substrate and the function board are packaged into an independent module using packaging technology. The present invention uses packaging technology to package each functional unit in the power distribution unit into an independent module, which not only greatly reduces the complexity of the peripheral circuit of the power distribution unit, but also has a high anti-fog and dustproof level. The switching circuit uses an all-solid-state switch to achieve power distribution, which has high safety, long life, and fast response speed.

Description

Technical Field

[0001] The present invention relates to the field of electrical technology, and in particular to a power distribution unit of a charging pile and a charging pile. Background Art

[0002] In multi-charger DC charging equipment for electric vehicles, power distribution is required between the power module and the charging head. Currently, most power distribution units use mechanical switches such as relays for combined distribution. This approach has the following problems:

[0003] 1. Low lifespan. The load switching lifespan of a mechanical switch is usually only a few hundred times, and its lifespan decreases significantly as the switching current increases.

[0004] 2. Poor safety performance. In addition to significantly reducing the life of the mechanical switch, live switching also generates arcs during the switching process, posing a fire risk. In addition, the mechanical switch only provides mechanical contacts to provide a path for current and does not limit the direction of current flow. Therefore, in special circumstances, reverse current may flow, which may damage the charging system.

[0005] 3. High cost. For high-power charging systems, a large number of mechanical switches are required, so the power required to drive these switches may reach hundreds of watts, which is not economical from both the electrical energy and material perspectives.

[0006] 4. Slow response speed. The action time of a mechanical switch usually takes tens of milliseconds, and the fast breaking capability is poor.

[0007] 5. Large size. In order to meet the high voltage and high current requirements of the multi-charging terminal charging system, the mechanical switch units that need to be used are large in size and large in number, which occupies a large amount of volume and weight of the charging power cabinet. Summary of the Invention

[0008] In order to solve the above technical problems, the present invention provides a power distribution unit for a charging pile in a first aspect.

[0009] A second embodiment of the present invention provides a charging pile.

[0010] The technical solution adopted in the present invention is as follows:

[0011] The first aspect of the present invention provides a power distribution unit for a charging pile, comprising: a substrate, a switching circuit is arranged on the substrate, the switching circuit comprises an input port, multiple output ports and multiple switching units connected between the input port and each output port, the input port is connected to the power module, each of the output ports is connected one-to-one with the charging gun, the switching unit is used to connect the power module to any one of the charging guns, the switching unit comprises a solid-state switch; a functional board, the functional board is fixedly connected to the substrate, a driving circuit is arranged on the functional board, the driving circuit is connected to the solid-state switch in the switching unit, and the driving circuit is used to drive the solid-state switch; the substrate and the functional board are packaged as an independent module using packaging technology.

[0012] The power distribution unit of the charging pile of the present invention also has the following additional technical features:

[0013] According to one embodiment of the present invention, an absorption circuit is further provided on the substrate. The absorption circuit is provided at both ends of the solid-state switch in the switching unit. The absorption circuit is used to absorb the voltage and current spikes generated when the solid-state switch is turned on / off, so as to reduce the voltage stress and current stress of the solid-state switch.

[0014] According to an embodiment of the present invention, the temperature acquisition circuit is further provided on the substrate. The temperature acquisition circuit is provided close to the solid-state switch in the switch unit and is used to acquire the temperature of the solid-state switch.

[0015] According to one embodiment of the present invention, a sampling circuit is further provided on the functional board, which is used to collect the input voltage and input current of the input port, the output voltage and output current of each output port, and the terminal voltage of the solid-state switch in the switch unit.

[0016] According to one embodiment of the present invention, the drive circuit includes: a plurality of isolation drive units, each isolation drive unit being connected one-to-one with each solid-state switch in the switch unit; and a plurality of first isolation power supplies, each first isolation power supply being arranged one-to-one with each isolation drive unit.

[0017] According to one embodiment of the present invention, the sampling circuit includes: a voltage sampling unit, which is used to collect the input voltage of the input port and the output voltage of the output port; a current sampling unit, which is used to collect the input current of the input port and the output current of the output port; a second isolated power supply and a third isolated power supply, and the second isolated power supply and the third isolated power supply are respectively set corresponding to the voltage sampling unit and the current sampling unit.

[0018] According to one embodiment of the present invention, the switching circuit specifically includes: a first switch group, the first switch group includes a switch unit, and one end of the switch unit of the first switch group is connected to the input port; a second switch group, the second switch group includes multiple switch units, one end of each switch unit in the second switch group is connected to the other end of the switch unit of the first switch group, and the other end of each switch unit in the second switch group is connected to the output port one-to-one.

[0019] According to one embodiment of the present invention, the switch unit in the first switch group or the second switch group specifically includes: a positive path, wherein the two ends of the positive path are respectively the positive input end and the positive output end of the switch unit, and a solid-state switch that conducts unidirectionally from the positive input end to the positive output end is arranged between the two ends of the positive path, or a solid-state switch that conducts bidirectionally and cannot be reversed when there is no opening signal, or a composite switch composed of multiple solid-state switches that conduct bidirectionally and cannot be reversed when there is no opening signal; a negative path, wherein the two ends of the negative path are respectively the negative input end and the negative output end of the switch unit, and a solid-state switch that conducts unidirectionally from the negative output end to the negative input end is arranged between the two ends of the negative path, or a solid-state switch that conducts bidirectionally and cannot be reversed when there is no opening signal, or a composite switch composed of multiple solid-state switches that conduct bidirectionally and cannot be reversed when there is no opening signal, wherein the solid-state switch in at least one of the positive path and the negative path is a controllable solid-state switch.

[0020] According to one embodiment of the present invention, a group of IGBTs (Insulated Gate Bipolar Transistors) is provided between the two ends of the positive path, and a group of IGBTs is provided between the two ends of the negative path.

[0021] According to one embodiment of the present invention, a group of IGBTs is provided between the two ends of the positive path, and a group of diodes is provided between the two ends of the negative path.

[0022] According to one embodiment of the present invention, a composite switch consisting of two source-connected MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors) is provided between the two ends of the positive path, and a group of diodes is provided between the two ends of the negative path.

[0023] According to an embodiment of the present invention, the first switch group further includes a sampling resistor connected to a negative path of the first switch group.

[0024] A second embodiment of the present invention provides a charging pile, which includes the power distribution unit of the charging pile described in the first embodiment of the present invention.

[0025] Beneficial effects of the present invention:

[0026] 1. The present invention uses packaging technology to encapsulate each functional unit in the power distribution unit into an independent module, which greatly reduces the complexity of the peripheral circuit of the power distribution unit, significantly reduces the size, simplifies the structural layout, reduces the use cost, and significantly reduces the parasitic parameters in the drive circuit. At the same time, the overall package is a closed structure with a high level of fog and dustproofness, which can significantly improve the life and reliability of the power distribution unit. The switching circuit uses an all-solid-state switch to achieve power distribution, which is not only highly safe, long-lasting, highly reliable, and fast in response, but also has low driving power, small size, and light weight.

[0027] 2. The present invention provides an absorption circuit at both ends of the solid-state switch, thereby reducing the voltage stress and current stress when the solid-state switch is turned on / off.

[0028] 3. The present invention encapsulates each functional unit in the power distribution unit into an independent module, which can concentrate all heat sources on the same radiator, greatly improving the flexibility of installation and facilitating heat dissipation layout. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 1 is a schematic diagram of a circuit topology of a power distribution unit of a charging pile according to an embodiment of the present invention;

[0030] Figure 2 1 is a schematic structural diagram of a power distribution unit of a charging pile according to an embodiment of the present invention;

[0031] Figure 3 yes Figure 2 The schematic diagram of the arrangement of power devices of the power distribution unit shown;

[0032] Figure 4 is a schematic diagram of a circuit topology of a power distribution unit of a charging pile according to another embodiment of the present invention;

[0033] Figure 5 is a schematic diagram of the circuit structure of a switch unit according to a first example of the present invention;

[0034] Figure 6 is a schematic diagram of the circuit structure of a switch unit according to a second example of the present invention;

[0035] Figure 7 is a schematic diagram of the circuit structure of a switch unit according to a third example of the present invention;

[0036] Figure 81 is a simulation waveform of a power distribution unit according to an embodiment of the present invention under 1000 VDC and 4 nH parasitic inductance;

[0037] Figure 9 yes Figure 8 Enlarged schematic diagram of the middle ellipse;

[0038] Figure 10 1 is a simulation waveform of a power distribution unit according to one embodiment of the present invention under 1000 VDC and 40 nH parasitic inductance;

[0039] Figure 11 yes Figure 10 Enlarged schematic diagram of the ellipse part in the middle. DETAILED DESCRIPTION

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0041] Figure 1 : is a schematic diagram of the circuit topology of the power distribution unit of the charging pile according to one embodiment of the present invention. Figure 2 1 is a schematic structural diagram of a power distribution unit of a charging pile according to an embodiment of the present invention. Figure 3 yes Figure 2 The power device layout diagram of the power distribution unit is shown in FIG. Figure 1-3 As shown, the power distribution unit includes: a base plate 100 and a functional board 200 .

[0042] Among them, a switching circuit 1 is set on the substrate 100, and the switching circuit 1 includes an input port in, multiple output ports out, and multiple switching units connected between the input port in and each output port out. The input port in is connected to the power module, and each output port out is connected one-to-one with the charging gun. The switching unit is used to connect the power module to any one or more of the charging guns, and the switching unit includes a solid-state switch; the functional board 200 is fixedly connected to the substrate 100, and a driving circuit 2 is set on the functional board 200. The driving circuit 2 is connected to the solid-state switch in the switching unit, and the driving circuit 2 is used to drive the solid-state switch; the substrate 100 and the functional board 200 are packaged as an independent module using packaging technology.

[0043] Specifically, the switch circuit 1 uses a switch unit composed of solid-state switches for power distribution. The solid-state switches include but are not limited to thyristors (SCRs), IGBTs, IGCTs (Integrated Gate-Commutated Thyristors), MOSFETs, SiC-MOSFETs (Silicon Carbide-Metal-Oxide Semiconductor Field-Effect Transistors), composite SiC-MOSFETs, and GaN (Gallium Nitride). The switch circuit 1 can connect the power module to any one of the n charging guns. For example, Figure 1 If there are 12 charging guns, 13 switch units can be provided. The solid-state switches are K1, K11, K12, K21, K22, K31, K32, K41, K42, K51, K52, K61, K62, K71, K72, K81, K82, K91, K92, K101, K102, K111, K112, K121, K122. K1 constitutes a switch unit, K11 and K12 constitute a switch unit, K21 and K22 constitute a switch unit, ... K121 and K122 constitute a switch unit.

[0044] The switch circuits are arranged on substrate 100 in an optimized layout and connected via copper foil, bonding wires, or other reliable means. Each switch's control signal and power output are derived via pins. These pins can be either pin-type or bolt-type, with the number of pins determined by the current and voltage levels. Driver circuit 2 is provided on function board 200 to drive the solid-state switches.

[0045] Semiconductor packaging technology is used to package the substrate 100 and the functional board 200 into a sealed whole, namely an independent module. The connection wiring, switching circuit 1, driving circuit 2 and other modules are all integrated inside the module, which greatly reduces the complexity of the peripheral circuit, greatly reduces the size, and simplifies the structural layout. At the same time, compared with the discrete device circuit, the packaged module is a sealed structure, and the anti-fog and dustproof level is much higher than the discrete device, and the life and reliability are further improved. In addition, external connection copper bars, wires, etc. can be reduced, which reduces the cost of use. The switching circuit uses an all-solid-state switch to achieve power distribution, which is not only highly safe, long-lasting, highly reliable, and fast in response, but also has low driving power, small size, and light weight.

[0046] In the present invention, substrate 100 is used for the connection layout of power devices. The substrate has a multi-layer structure, including a heat dissipation layer, an insulation layer, and a power wiring layer (conductive layer). The heat dissipation layer is generally aluminum metal or copper metal, the insulation layer is generally AlN (aluminum nitride) ceramic, and the conductive layer is a copper foil layer formed by copper metal and a bonding wire interconnected combination. Functional board 200 is used for the layout of functional circuits. Functional board 200 can be made of a printed circuit board. The specific material can be glass fiber board, aluminum substrate, phenolic paperboard, etc., which meet the insulation and dielectric constant requirements. It can be a single-layer board or a multi-layer board structure. In actual application, there is no restriction on the above points. The signal between the functional board and the substrate can be fixed using functional pins, or can be fixed using fixing bolts or housing brackets.

[0047] According to one embodiment of the present invention, Figure 4 As shown, an absorption circuit 3 is also provided on the substrate 100. The absorption circuit 3 is provided at both ends of the solid-state switch in the switch unit 1. The absorption circuit 3 is used to absorb the voltage and current spikes generated when the solid-state switch is turned on / off to reduce voltage stress and current stress.

[0048] Specifically, the absorption circuit 3 is placed near the solid-state switch and laid out on the substrate together with the solid-state switch. It is used to absorb the voltage and current spikes during the solid-state switch's on and off process, while also suppressing switch oscillations and reducing EMI (Electromagnetic Interference). Similarly, the absorption circuit 3 is connected to the main solid-state switch via copper foil, bonding wires, or other reliable means.

[0049] Furthermore, according to one embodiment of the present invention, the drive circuit 2 includes: a plurality of isolated drive units and a plurality of first isolated power supplies. Each isolated drive unit is connected to each solid-state switch in the switch unit in a one-to-one correspondence; and each first isolated power supply is provided in a one-to-one correspondence with each isolated drive unit.

[0050] Specifically, the isolated driving unit can be a driving chip, the first isolated power supply can be integrated inside the driving chip, or configured separately, the outputs of each isolated power supply are independent of each other, the isolated power supply can realize isolated power supply of the isolated driving unit, and appear in pairs with the isolated driving unit. The number of driving circuit configurations is generally determined according to the number of charging guns, for example: driving circuit configuration = n*2+1, where n is the number of charging guns, and n≥2.

[0051] According to one embodiment of the present invention, Figure 4 As shown, a temperature acquisition circuit 4 is further provided on the substrate 100 . The temperature acquisition circuit 4 is provided close to the solid-state switch in the switch unit 1 . The temperature acquisition circuit 4 is used to acquire the temperature of the solid-state switch.

[0052] Specifically, the temperature acquisition circuit 4 may use an NTC (Negative Temperature Coefficient) thermistor to realize temperature acquisition, thereby realizing functions such as temperature control, temperature alarm, and temperature protection of the power distribution unit. Figure 3 The number and location of the temperature collection units are only for illustration purposes only and do not represent the actual location and number.

[0053] According to one embodiment of the present invention, Figure 4 As shown, the function board 200 is further provided with a sampling circuit 5, which is used to collect the input voltage and input current of the input port in, the output voltage and output current of each output port out, and the terminal voltage of the solid-state switch in the switch unit.

[0054] Furthermore, the sampling circuit 5 specifically includes: a voltage sampling unit, a current sampling unit, a second isolated power supply, and a third isolated power supply. The voltage sampling unit is used to collect the input voltage of the input port and the output voltage of the output port; the current sampling unit is used to collect the input current of the input port and the output current of the output port; and the second isolated power supply and the third isolated power supply are respectively configured to correspond to the voltage sampling unit and the current sampling unit.

[0055] Specifically, the isolated power supply can be integrated within the sampling chip or separately configured on the function board 200. The power supply output of each sampling unit is independent and paired with the sampling unit. Depending on the actual application requirements, selectable sampling points and sampling parameters include, but are not limited to: input voltage and current at the input port, output voltage and current at the output port, and terminal voltage of the solid-state switch. In other words, the sampling locations and types can be flexibly combined and selected based on requirements and are not specifically limited here.

[0056] As a result, the driving circuit, sampling circuit and absorption circuit are integrated and packaged into an independent module, which greatly reduces the parasitic parameters in the switching circuit loop and the driving circuit, simplifies the peripheral circuit, and facilitates the main circuit layout. At the same time, all heat sources can be concentrated on the same heat sink, which facilitates the heat dissipation layout.

[0057] It is understandable that, Figure 1 and Figure 4 As shown, after the power distribution unit of the charging pile mentioned above is encapsulated, other auxiliary input and output ports such as a driving input port, a sampling output port and a temperature acquisition port can be reserved to output the collected related signals to the outside or receive external related signals. The driving input port is connected to the driving circuit 2, the temperature acquisition port is connected to the temperature acquisition circuit 4, and the sampling output port is connected to the sampling circuit 5.

[0058] According to one embodiment of the present invention, Figure 1 and Figure 4 As shown, the switch circuit 1 specifically includes: a first switch group S and a second switch group K. The first switch group S includes a switch unit, one end of which is connected to the input port in; the second switch group K includes multiple switch units, one end of each switch unit in the second switch group K is connected to the other end of the switch unit in the first switch group S, and the other end of each switch unit in the second switch group K is connected to the output port out in a one-to-one correspondence.

[0059] Specifically, if Figure 1 and Figure 4 As shown, the first switch group S includes 1 switch unit, and the second switch group K includes n switch units, where n is the number of output ports (the number of charging guns). By controlling the switch units in the first switch group S to be closed and the switch units in the second switch group K to be closed, the power module can be connected to the charging gun corresponding to the closed switch unit in the second switch group K.

[0060] like Figure 5-7 As shown, according to one embodiment of the present invention, the switch unit in the first switch group S or the second switch group K includes: a positive path and a negative path, the two ends of the positive path are respectively the positive input terminal +Vin and the positive output terminal +Out of the switch unit, and a solid-state switch that conducts unidirectionally from the positive input terminal +Vin to the positive output terminal +Out is set between the two ends of the positive path, or a solid-state switch that conducts bidirectionally and cannot be reversed when there is no opening signal, or a composite switch composed of multiple solid-state switches that conduct bidirectionally and cannot be reversed when there is no opening signal; the two ends of the negative path are respectively the negative input terminal -Vin and the negative output terminal -Out of the switch unit, and a solid-state switch that conducts unidirectionally from the negative output terminal -Out to the negative input terminal -Vin is set between the two ends of the negative path, or a solid-state switch that conducts bidirectionally and cannot be reversed when there is no opening signal, or a composite switch composed of multiple solid-state switches that conduct bidirectionally and cannot be reversed when there is no opening signal.

[0061] It should be noted that, in the embodiment of the present invention, the solid-state switch in at least one of the positive path and the negative path is a controllable solid-state switch.

[0062] In a specific embodiment of the present invention, Figure 5As shown, if a bidirectionally conductive solid-state switch that cannot be reverse-conducted when there is no turn-on signal is set between the two ends of the positive path, and a bidirectionally conductive solid-state switch that cannot be reverse-conducted when there is no turn-on signal is set between the two ends of the negative path, then a group of IGBTs can be set between the two ends of the positive path, and a group of IGBTs can be set between the two ends of the negative path, the positive input end of the positive path is connected to the collector of the IGBT, the positive output end +Out of the positive path is connected to the emitter of the IGBT, the negative input end -Vin of the negative path is connected to the emitter of the IGBT, and the negative output end -Out of the negative path is connected to the collector of the IGBT.

[0063] It is understandable that when the battery voltages of two vehicles connected to different charging terminals differ, the bus voltage of the charging terminal corresponding to the vehicle with the higher battery voltage will be applied to the bus voltage of the charging terminal corresponding to the vehicle with the lower battery voltage through the other set of anti-parallel diodes with closed switches. This will cause the vehicle with the higher battery voltage to discharge to the vehicle with the lower battery voltage and the charging module connected to it, seriously affecting the charging safety of the vehicles and the charging facilities. Furthermore, if the vehicle experiences current backflow during the charging process, it will also seriously affect charging safety.

[0064] To this end, the present invention adopts a unidirectional conductive solid-state switch in the switch unit. Specifically, as an example, Figure 6 As shown, if the switch unit uses a unidirectional conductive solid-state switch, its circuit structure can be: a bidirectional conductive solid-state switch that cannot conduct in the reverse direction when there is no open signal is set between the two ends of the positive path, and a unidirectional conductive solid-state switch from the negative output terminal -Out to the negative input terminal -Vin is set between the two ends of the negative path. Specifically, a group of IGBTs can be set between the two ends of the positive path, and a group of diodes can be set between the two ends of the negative path. The positive input terminal +Vin of the positive path is connected to the collector of the IGBT, the positive output terminal +Out of the positive path is connected to the emitter of the IGBT, the negative input terminal -Vin of the negative path is connected to the cathode of the diode, and the negative output terminal -Out of the negative path is connected to the anode of the diode.

[0065] As another example, Figure 7As shown, if the switch unit uses a unidirectional conductive solid-state switch, its circuit structure can also be: a bidirectional conductive composite switch composed of multiple solid-state switches that cannot conduct in the reverse direction when there is no open signal is set between the two ends of the positive path, and a solid-state switch that conducts unidirectionally from the negative output terminal -Out to the negative input terminal -Vin is set between the two ends of the negative path. Specifically, a composite switch composed of two MOSFETs with connected sources can be set between the two ends of the positive path, and a diode is set between the two ends of the negative path. The positive input terminal +Vin of the positive path is connected to one drain of the composite switch, the positive output terminal +Out of the positive path is connected to the other drain of the composite switch, the negative input terminal -Vin of the negative path is connected to the cathode of the diode, and the negative output terminal -Out of the negative path is connected to the anode of the diode.

[0066] I understand. Figure 6-7 The solid-state switches in the positive and negative paths can be interchanged, and the purpose of the device connection method remains unchanged.

[0067] Therefore, the switch unit in the first switch group S uses a unidirectional conductive solid-state switch to limit the direction of the current, which can prevent reverse current from the electric vehicle through the charging terminal to the charging module, thereby preventing the reverse current from damaging the charging module; the switch unit in the second switch group K uses a unidirectional conductive solid-state switch to limit the direction of the current, thereby preventing a circulating current from being generated between the two charging vehicles due to inconsistent battery voltages, thereby avoiding threats to the safety of the charging vehicles.

[0068] According to one embodiment of the present invention, Figure 1 and Figure 4 As shown, the first switch group S may further include: a sampling resistor R, and the sampling resistor R is connected in the negative path of the first switch group S.

[0069] Specifically, a sampling resistor is integrated in the power distribution unit. When there is an external sampling requirement, it can be directly connected to the negative end - of the input port in to achieve current sampling without the need to set up related peripheral circuits separately.

[0070] It can be understood that the parasitic parameters of the power distribution unit in actual application include parasitic inductance and parasitic capacitance. The parasitic parameters have a great influence on the opening and closing actions of the solid-state switch. The power distribution unit of the charging pile mentioned above in the present invention can significantly reduce the parasitic inductance in the main circuit. Compared with the discrete device solution, the integrated power module can reduce the parasitic inductance in the main circuit from 20nH-50nH to 2nH-5nH. Reducing the power circuit, that is, the parasitic inductance, can greatly reduce the switch voltage stress. For details, refer to Figure 8-11 Simulation results: Under the working conditions of bus voltage 1000VDC and current 100ADC, LTspice simulation software is used to simulate, and the parasitic inductance is set to 40uH and 4uH respectively. Figure 8This is the simulated waveform of 1000VDC and 4nH parasitic inductance. Figure 10 The simulation waveforms of 1000VDC and 40nH parasitic inductance show that the voltage peak (overshoot) is reduced from 140V to 40V, a decrease of more than 70%. At the same time, the oscillation amplitudes are 240V and 70V respectively, and the oscillation time of the former is greater than 4uS and that of the latter is less than 1.5uS.

[0071] To sum up, according to the power distribution unit of the charging pile of the embodiment of the present invention, the packaging technology is used to encapsulate the functional units in the power distribution unit into an independent module, which greatly reduces the complexity of the peripheral circuit of the power distribution unit, greatly reduces the size, simplifies the structural layout, reduces the use cost, and greatly reduces the parasitic parameters in the drive circuit. At the same time, the overall package is a closed structure with a high level of fog and dustproofness, which can significantly improve the life and reliability of the power distribution unit. The switching circuit uses an all-solid-state switch to achieve power distribution, which is not only highly safe, long-lasting, highly reliable, and fast in response, but also has low driving power, small size, and light weight; an absorption circuit is set at both ends of the solid-state switch to reduce the voltage stress and current stress when the solid-state switch is turned on / off; the functional units in the power distribution unit are encapsulated into an independent module, so that all heat sources can be concentrated on the same radiator, which greatly improves the flexibility of installation and facilitates the heat dissipation layout.

[0072] The present invention further provides a charging pile, comprising the power distribution unit of the charging pile described above.

[0073] According to the charging pile of the embodiment of the present invention, through the power distribution unit of the above-mentioned charging pile, the packaging technology is used to encapsulate the functional units in the power distribution unit into an independent module, which greatly reduces the complexity of the peripheral circuit of the power distribution unit, greatly reduces the size, simplifies the structural layout, reduces the use cost, and greatly reduces the parasitic parameters in the drive circuit. At the same time, the overall package is a closed structure with a high level of fog and dustproofness, which can significantly improve the life and reliability of the power distribution unit. The switching circuit adopts an all-solid-state switch to achieve power distribution, which is not only highly safe, long-lasting, highly reliable, and fast in response, but also has low driving power, small size, and light weight; an absorption circuit is set at both ends of the solid-state switch to reduce the voltage stress and current stress when the solid-state switch is turned on / off; the functional units in the power distribution unit are encapsulated into an independent module, so that all heat sources can be concentrated on the same radiator, which greatly improves the flexibility of installation and facilitates the heat dissipation layout.

[0074] In the description of the present invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0075] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0076] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0077] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code comprising one or more executable instructions for implementing the steps of a custom logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may be performed out of the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present invention pertain.

[0078] The logic and / or steps represented in the flowcharts or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing the logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (e.g., a computer-based system, a system including a processor, or other system that can fetch and execute instructions from an instruction execution system, apparatus, or device). For purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include the following: an electrical connection with one or more wires (electronic devices), a portable computer disk cartridge (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and programmable read-only memory (EPROM or flash memory), fiber optic devices, and a portable compact disc read-only memory (CDROM). Furthermore, the computer-readable medium may even be paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium and then editing, interpreting or processing it in another suitable manner if necessary, and then storing it in a computer memory.

[0079] It should be understood that various parts of the present invention can be implemented using hardware, software, firmware, or a combination thereof. In the above-described embodiments, multiple steps or methods can be implemented using software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented using hardware, as in another embodiment, any one of the following technologies known in the art or a combination thereof can be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application-specific integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0080] Those skilled in the art will understand that all or part of the steps in the method of the above embodiment can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiment.

[0081] In addition, the functional units in the various embodiments of the present invention may be integrated into a single processing module, or each unit may exist physically separately, or two or more units may be integrated into a single module. The aforementioned integrated modules may be implemented in the form of hardware or in the form of software functional modules. If the integrated modules are implemented in the form of software functional modules and sold or used as independent products, they may also be stored in a computer-readable storage medium.

[0082] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A power distribution unit for a charging pile, characterized in that: include: A substrate, on which a switching circuit is provided. The switching circuit includes an input port, multiple output ports, and multiple switch units connected between the input port and each output port. The input port is connected to the power module, and each output port is connected to a charging gun in a one-to-one correspondence. The switch unit is used to connect the power module to any one of the charging guns, and the switch unit includes a solid-state switch. A function board, the function board is fixedly connected to the base plate, a driving circuit is provided on the function board, the driving circuit is connected to the solid-state switch in the switch unit, and the driving circuit is used to drive the solid-state switch; The base board and the functional board are packaged into an independent module using packaging technology; The switch circuit specifically includes: a first switch group, the first switch group including a switch unit, one end of the switch unit of the first switch group being connected to the input port; a second switch group, the second switch group including a plurality of switch units, one end of each switch unit in the second switch group being connected to the other end of the switch unit of the first switch group, and the other end of each switch unit in the second switch group being connected to the output port in a one-to-one correspondence; The switch unit in the first switch group or the second switch group specifically includes: a positive path, wherein the two ends are the positive input end and the positive output end of the switch unit respectively, and a bidirectional conductive solid-state switch that cannot be reversely conductive when there is no opening signal is set between the two ends, or a composite switch composed of multiple bidirectional conductive solid-state switches that cannot be reversely conductive when there is no opening signal; a negative path, wherein the two ends are the negative input end and the negative output end of the switch unit respectively, and a unidirectional conductive solid-state switch from the negative output end to the negative input end is set between the two ends.

2. The power distribution unit of the charging pile according to claim 1, characterized in that: An absorption circuit is also provided on the substrate. The absorption circuit is provided at both ends of the solid-state switch in the switch unit. The absorption circuit is used to absorb voltage stress and current stress generated when the solid-state switch is turned on / off.

3. The power distribution unit of the charging pile according to claim 1 or 2, characterized in that: A temperature acquisition circuit is also provided on the substrate. The temperature acquisition circuit is provided close to the solid-state switch in the switch unit and is used to acquire the temperature of the solid-state switch.

4. The power distribution unit of the charging pile according to claim 1, characterized in that: The functional board is further provided with a sampling circuit, which is used to collect the input voltage and input current of the input port, the output voltage and output current of each output port, and the terminal voltage of the solid-state switch in the switch unit.

5. The power distribution unit of the charging pile according to claim 1, characterized in that: The driving circuit includes: a plurality of isolation drive units, each isolation drive unit being connected to each solid-state switch in the switch unit in a one-to-one correspondence; A plurality of first isolated power supplies are provided, and each first isolated power supply is provided in a one-to-one correspondence with each isolated driving unit.

6. The power distribution unit of the charging pile according to claim 4, characterized in that: The sampling circuit comprises: a voltage sampling unit, configured to collect the input voltage of the input port and the output voltage of the output port; a current sampling unit, configured to collect the input current of the input port and the output current of the output port; A second isolated power supply and a third isolated power supply, wherein the second isolated power supply and the third isolated power supply are respectively arranged corresponding to the voltage sampling unit and the current sampling unit.

7. The power distribution unit of the charging pile according to claim 1, characterized in that: The first switch group further includes a sampling resistor connected to a negative path of the first switch group.

8. A charging pile, characterized in that: A power distribution unit comprising a charging pile according to any one of claims 1 to 7.

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