Testing device, testing method and system for electronic components

Abstract

The present invention relates to a testing device, a testing method and a system for electronic components, the device comprising: a support component for supporting the electronic components to be tested; a central control unit for setting standard specifications and constructing test instruction information and issuing test instruction information according to the types of the electronic components to be tested; a detection component connected to the central control unit, for adjusting the working state of the detection component according to the test instruction information and obtaining test results under the corresponding working state; a spring component for supporting the support component and providing elastic force; the central control unit is also used to determine whether the electronic components to be tested are qualified according to the test results. The present invention utilizes the reflection characteristics of light, uses a light spot array detection disk as a detection device, detects the shape and weight of the electronic components according to whether the light is reflected and the reflection time of the light, realizes the accurate testing of the specifications of the electronic components, and improves the accuracy of the results of the specification testing of the electronic components.

Description

Technical Field

[0001] The present invention relates to the field of electronic component testing, and in particular to a testing device, a testing method and a system for electronic components. Background Art

[0002] With the improvement of modern industrial level and the rapid development of information technology, various electronic products are widely used in people's daily life, and the specifications of most electronic products are becoming increasingly simple. Even some precision electronic instruments used in the aerospace field are becoming highly integrated in order to reduce their own volume. As the most basic component of electronic products, the quality of electronic components directly affects the performance of electronic products. Therefore, in order to ensure the normal operation of electronic components, manufacturers often conduct a series of tests after their production is completed. The most basic measurements include specification measurement, electrical performance measurement, etc.

[0003] The traditional electronic component specification measurement method is to measure manually, but the measurement accuracy of this method is difficult to guarantee, and the measurement efficiency is low, which seriously restricts the production scale. In the prior art, there are some devices for measuring electronic components. For example, Chinese patent ZL201210040777.1 discloses an electronic component test fixture, which is provided with a light transceiver as an optical positioning device. According to the reflection of the light of the light transceiver, it is judged whether the electronic component under test is in the correct detection position, so that the electronic component under test is correctly placed and the accuracy of the measurement result is improved. However, this technical solution only solves the positioning problem of the electronic component under test in the test device, and cannot ensure the accuracy of the electronic component specification test. Summary of the invention

[0004] To this end, the present invention provides a testing device, a testing method and a system for electronic components, which can solve the problem that the prior art cannot guarantee the accuracy of the test results of the electronic component specification test.

[0005] To achieve the above object, the present invention provides an electronic component testing device, comprising:

[0006] A receiving component, used for receiving the electronic components to be tested;

[0007] The central control unit is used to set standard specifications and construct test instruction information and issue test instruction information according to the types of electronic components to be tested;

[0008] A detection component connected to the central control unit, used to adjust the working state of the detection component according to the test instruction information, and obtain the test result under the corresponding working state;

[0009] A spring assembly, comprising a plurality of groups of supporting springs, one end of each supporting spring being connected to the bottom of the object-carrying assembly and each connection point being evenly distributed on the object-carrying assembly, and the other end being connected to the top of the detection assembly and each connection point being evenly distributed on the detection assembly, the spring assembly being used to support the object-carrying assembly and provide elastic force;

[0010] The central control unit is also used to determine whether the electronic component to be tested is qualified according to the test result.

[0011] Furthermore, the detection component includes a light spot array detection disk and a detection disk fixing bracket, the outer edge of the light spot array detection disk is fixed by the detection disk fixing bracket, and is used to receive test instruction information and test the specifications of the electronic components to be tested and obtain test results. The light spot array detection disk includes a light spot array composed of a plurality of light spots, and the light spot array detection disk is used to receive test instruction information, emit a light beam, receive a reflected light beam, detect the real-time light reflection period of the light beam and obtain test results.

[0012] Furthermore, when the central control unit sets standard specifications and constructs test instruction information and issues test instruction information according to the type of electronic components to be tested, the standard specifications include standard shapes and standard weights, and the test instruction information includes weight test instructions or shape test instructions.

[0013] Furthermore, when the central control unit sets the standard shape according to the type of electronic component to be tested, constructs a shape test instruction according to the standard shape, and issues a shape test instruction, the light spot array detection disk adjusts the on and off state of the light spots according to the standard shape, so that the light spots inside the corresponding standard shape are in an off state, and the light spots outside the corresponding standard shape are in a bright state. The light spot array detection disk obtains the test result according to the presence or absence of the received reflected light beam, and the central control unit determines the shape qualification of the electronic component to be tested according to the test result.

[0014] Further, when the light spot array detection disk obtains the test result according to the presence or absence of the received reflected light beam,

[0015] When the light spot array detection disk does not receive the reflected light beam, the light spot array detection disk obtains a test result that the shape of the electronic component to be tested is normal, and the central control unit determines that the shape of the electronic component to be tested is qualified according to the test result;

[0016] When the light spot array detection disk receives the reflected light beam, the light spot array detection disk obtains a test result indicating that the shape of the electronic component to be tested is abnormal, and the central control unit determines that the shape of the electronic component to be tested is unqualified based on the test result.

[0017] Further, when the central control unit sets a standard shape and a standard weight according to the type of the electronic component to be tested, constructs a weight test instruction based on the standard shape and the standard weight, and issues the weight test instruction, the central control unit sets a standard light reflection period T0 according to the standard weight. The light spot array detection disk adjusts the on / off states of the light spots according to the standard shape, so that the light spots inside the corresponding standard shape are in the bright state, and the light spots outside the corresponding standard shape are in the extinguished state. The light spot array detects the real-time light reflection period of the beam and transmits the real-time light reflection period T to the central control unit. The central control unit compares the real-time light reflection period T with the standard light reflection period T0 and determines the weight qualification of the electronic component to be tested according to the comparison result.

[0018] When T≧T0, the central control unit determines that the weight of the electronic component to be tested is qualified;

[0019] When T<T0, the central control unit determines that the weight of the electronic component to be tested is overweight.

[0020] On the other hand, the present invention also provides an electronic component testing method, which includes:

[0021] Placing the electronic component to be tested on the object-carrying component;

[0022] According to the type of the electronic component to be tested, setting a standard shape and a standard weight, and constructing and issuing test instruction information according to the standard shape and the standard weight;

[0023] According to the test instruction information, performing a specification test on the electronic component to be tested to obtain a test result;

[0024] According to the test result, determining the specification qualification of the electronic component to be tested.

[0025] On the other hand, the present invention also provides an electronic component testing system, which includes:

[0026] The above-mentioned electronic component testing device is used to receive the test command information of the control module and perform a specification test on the electronic component to be tested. The electronic component testing device includes an object-carrying component for carrying the electronic component to be tested, a central control unit for setting a standard specification according to the type of the electronic component to be tested, constructing and issuing test instruction information, a detection component connected to the central control unit for adjusting the working state of the detection component according to the test instruction information and obtaining a test result in the corresponding working state, and a spring component including a plurality of groups of supporting springs. One end of each supporting spring is connected to the lower part of the object-carrying component and the connection points are evenly distributed on the object-carrying component, and the other end is connected to the upper part of the detection component and the connection points are evenly distributed on the detection component. The spring component is used to support the object-carrying component and provide elastic force. The central control unit is further used to determine whether the electronic component to be tested is qualified according to the test result;

[0027] A positioning base is arranged below the electronic component testing device, and is used to carry the electronic component testing device and emit a positioning laser. The positioning base includes a positioning laser emitter, and the positioning laser emitter is arranged at the center of the positioning base and is aligned with the center of the light-transmitting object-carrying plate, and is used to emit a positioning laser.

[0028] The vacuum adsorption assembly moves along an external track arranged above the electronic component testing device and can be extended and retracted up and down, and is used to transfer the electronic component to be tested to the light-transmitting support plate;

[0029] The control module is connected to the vacuum adsorption component, the positioning base and the electronic component testing device respectively, and is used to construct a moving instruction according to the position of the vacuum adsorption component, monitor the positioning process according to the laser reception status of the vacuum adsorption component, and send test command information according to the test process of the electronic component testing device.

[0030] Furthermore, the vacuum adsorption component includes a real-time position detector, a telescopic arm, a base, a plurality of vacuum suction cups and a positioning laser receiver. The upper end of the telescopic arm is connected to the external track through a pulley, and the lower end is connected to the base. The real-time position detector is arranged on the telescopic arm, which is used to monitor the real-time position information of the vacuum adsorption component and upload the real-time position information to the control module. The telescopic arm moves on the external track and extends up and down according to the moving instructions of the control module. The plurality of vacuum suction cups are evenly distributed on the bottom surface of the base, which are used to adsorb the electronic components to be tested and transfer the electronic components to be tested to the light-transmitting support plate. The positioning laser receiver is arranged at the center of the bottom surface of the base, which is used to receive the emitted positioning laser and place the electronic components to be tested according to the positioning laser.

[0031] Further, when the control module constructs the moving part instruction information according to the position of the vacuum adsorption component, monitors the positioning process according to the laser reception status of the vacuum adsorption component, and sends the test command information, the control module receives the real-time position information and transmits the moving part instruction information to the vacuum adsorption component according to the real-time position information, the moving part instruction information includes the suction part instruction, the forward movement instruction along the track, the backward movement instruction along the track, the ascending instruction, the descending instruction and the placing part instruction, and the test command information includes the start test command and the end test command;

[0032] When the control module monitors the positioning process and sends the test command information according to the laser reception of the vacuum adsorption component, the control module detects that the positioning laser receiver receives the positioning laser, and the control module transmits a descending instruction to the vacuum adsorption component, and the vacuum adsorption component descends to contact the buffer sponge pad. The control module transmits a placement instruction to the vacuum adsorption component, and the vacuum suction cup places the electronic component to be tested on the light-transmitting support plate according to the instruction of the positioning laser, and the control module sends a start test command to the electronic component testing device;

[0033] When the control module detects that the electronic component testing device has completed the specification test, the control module sends a test end command to the electronic component testing device.

[0034] Compared with the prior art, the beneficial effect of the present invention lies in that, by using a light spot array detection disk as a detection device, assisted by a spring assembly, and utilizing the reflection characteristics of light, the shape and weight of the electronic component are detected according to whether the light is reflected and the reflection time of the light. Not only is the test efficiency improved by using one machine for multiple tests, but also the precise testing of the specifications of the electronic components is achieved, thereby improving the accuracy of the results of the specification testing of the electronic components.

[0035] In particular, by using the light spot array detection disk as a detection device and utilizing the reflection characteristics of light, the shape and weight of electronic components can be detected based on whether the light is reflected and the reflection time of the light. This not only improves the test efficiency, but also improves the accuracy of the results of the specification test of the electronic components, thereby achieving precise testing of the specifications of the electronic components.

[0036] In particular, by having the central control unit set standard specifications and construct test instruction information according to the types of electronic components to be tested, standard specifications can be set according to the types of electronic components to be tested. Not only can different specification tests be performed for different specification contents, but specification tests can also be performed on different types of electronic components, thereby realizing the multifunctional use of the electronic component detection device and ensuring the accuracy of the test results.

[0037] In particular, the light spot array detection disk adjusts the on and off state of the light spot according to the standard shape and obtains the test result according to the presence or absence of the received reflected light beam. The shape of the electronic component to be tested is tested using the principle of light reflection, ensuring a more precise test, thereby achieving precise shape testing of the electronic component to be tested and ensuring the accuracy of the test results of the shape test of the electronic component.

[0038] In particular, the test results are obtained by the light spot array detection disk based on the presence or absence of the received reflected light beam, and the shape of the electronic component to be tested is tested using the principle of light reflection, ensuring a more precise test, thereby achieving precise shape testing of the electronic component to be tested and ensuring the accuracy of the test results of the shape test of the electronic component.

[0039] In particular, the central control unit sets the standard shape and standard weight according to the type of electronic component to be tested and constructs a weight test instruction according to the standard shape and standard weight, the central control unit sets the standard light reflection period T0 according to the standard weight, the light spot array detection disk adjusts the on and off state of the light spot according to the standard shape, the light spot array detects the real-time light reflection period of the light beam and transmits the real-time light reflection period T to the central control unit, the central control unit compares the real-time light reflection period T with the standard light reflection period T0 and determines the weight qualification of the electronic component to be tested according to the comparison result, and uses the principle of light reflection to test the weight of the electronic component to be tested, which not only enables the electronic component testing device to perform both shape testing and weight testing, but also improves the test accuracy of the weight test of the electronic component testing device, and ensures the accuracy of the specification test results of the electronic component testing device.

[0040] In particular, by instructing the central control unit to set standard specifications and construct test instruction information according to the types of electronic components to be tested, operating the light spot array detection disk to adjust its operating state according to the standard specifications and the construction of test instruction information, and utilizing the principle of light reflection to perform specification tests on the electronic components to be tested, not only can different specifications of electronic components of different types be tested, thereby improving test efficiency, but also precise measurement of the specifications of the electronic components to be tested is achieved, thereby ensuring the accuracy of the specification test results.

[0041] In particular, by providing a positioning base and a vacuum adsorption assembly, the placement position of the electronic component to be tested can be positioned to assist the electronic component testing device in testing, and the control module controls the test process, so that the placement position of the electronic component to be tested can be accurately controlled, and the detection function of the electronic component testing device can be better exerted and realized, thereby ensuring the accuracy of the test results of the electronic component specification test.

[0042] In particular, by providing a vacuum adsorption component and providing a positioning laser receiver on the vacuum adsorption component, the vacuum adsorption component receives the emitted positioning laser and places the electronic component to be tested according to the positioning laser, thereby achieving precise positioning of the placement position of the electronic component to be tested, so as to assist the electronic component testing device in testing, so that the detection function of the electronic component testing device can be better exerted, and precise testing of the electronic component testing system is achieved, thereby ensuring the accuracy of the test results of the electronic component specification test.

[0043] In particular, by setting up a control module to monitor and control the test process of the electronic component testing system in real time, the operation process of the electronic component testing system is made precise and controllable, thereby achieving precise testing of the electronic component testing system and ensuring the accuracy of the test results of the electronic component specification test. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1A schematic diagram of the structure of an electronic component testing device provided by an embodiment of the present invention;

[0045] Figure 2 A schematic diagram of the top view of the structure of the object support assembly in the electronic component testing device provided in an embodiment of the present invention;

[0046] Figure 3 A schematic diagram of the top view of the detection assembly in the electronic component testing device provided in an embodiment of the present invention;

[0047] Figure 4 A schematic diagram of the structure of an electronic component testing system provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0048] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0049] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0050] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0051] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] See also Figure 1 , Figure 2 and Figure 3 As shown, an embodiment of the present invention provides an electronic component testing device, the electronic component testing device comprising:

[0053] The object receiving component 1 is used for receiving the electronic component to be tested;

[0054] The central control unit is used to set standard specifications and construct test instruction information and issue test instruction information according to the types of electronic components to be tested;

[0055] A detection component 3, connected to the central control unit, is used to adjust the working state of the detection component according to the test instruction information and obtain the test result under the corresponding working state;

[0056] The spring assembly 2 includes a plurality of groups of supporting springs 201, one end of each supporting spring is connected to the bottom of the object-carrying assembly and each connection point is evenly distributed on the object-carrying assembly, and the other end is connected to the top of the detection assembly and each connection point is evenly distributed on the detection assembly. The spring assembly is used to support the object-carrying assembly and provide elastic force;

[0057] The central control unit is also used to determine whether the electronic component to be tested is qualified according to the test result.

[0058] When the electronic component testing device tests the electronic component 4 to be tested, the electronic component to be tested is placed on the upper plane of the light-transmitting support plate 103 fixed by the light-transmitting support plate fixing frame 102. The weight of the electronic component to be tested compresses the spring assembly under the support assembly, and the support assembly descends. The central control unit sets standard specifications and constructs test instruction information according to the type of the electronic component to be tested. The light spot array detection disk 301 receives the test instruction information and adjusts the operating state according to the test instruction information, tests the specifications of the electronic component to be tested and obtains the test results. The central control unit determines the qualified condition of the electronic component to be tested according to the test results. When the electronic component testing device performs a shape test on the electronic component to be tested, the central control unit sets the standard shape according to the type of the electronic component to be tested. The shape and shape test instructions are constructed, the light spot array detection disk receives the shape test instructions and adjusts the operating state according to the shape test instructions, the light spot array detection disk adjusts the on and off state of the light spot 303 according to the standard shape, so that the light spot inside the corresponding standard shape is in an off state, and the light spot outside the corresponding standard shape is in a bright state, the light spot array detection disk obtains the test result according to the presence or absence of the received reflected light beam, and the central control unit determines the shape qualification of the electronic component to be tested according to the test result; when the electronic component testing device performs a weight test on the electronic component to be tested, the central control unit sets the standard shape and standard weight according to the type of the electronic component to be tested and constructs a weight test instruction according to the standard shape and standard weight, and the central control unit sets the standard light reflection period T0 according to the standard weight. , the light spot array detection disk adjusts the on and off state of the light spot according to the standard shape, so that the light spot inside the corresponding standard shape is in a bright state, and the light spot outside the corresponding standard shape is in an off state. The light spot array detects the real-time light reflection period of the light beam and transmits the real-time light reflection period T to the central control unit. Since the compression force on each supporting spring in the spring assembly relative to the initial state is F=k×Δx, where k is the elastic coefficient of the supporting spring, and Δx is the deformation of the supporting spring, the total compression force Fz=nF on the spring assembly can be calculated based on the deformation of the supporting spring, where n is the number of supporting spring groups, and the total compression force Fz=the gravity of the electronic device to be tested G=mg, where m is the weight of the electronic device to be tested, and g is the acceleration of gravity, so it can be obtained through The weight of the electronic device to be tested is deduced from the deformation of each group of supporting springs in the spring assembly, and the deformation of the supporting spring Δx can be calculated from the real-time light reflection period T of the light beam, Δx=x0-v×T, wherein x0 is the initial supporting spring length, and v is the speed of light. When the mass of the electronic component to be tested is greater than the standard mass, the deformation of the supporting spring Δx is greater than the deformation of the supporting spring under the standard mass, and the real-time light reflection period T is less than the standard light reflection period T0, the central control unit determines that the weight of the electronic component to be tested is unqualified. When the mass of the electronic component to be tested is ≦the standard mass, the deformation of the supporting spring Δx is ≦the deformation of the supporting spring under the standard mass, and the real-time light reflection period T is ≧the standard light reflection period T0, the central control unit determines that the weight of the electronic component to be tested is qualified.

[0059] By using the light spot array detection disk as a detection device, assisted by a spring component, and utilizing the reflection characteristics of light, the shape and weight of the electronic component are detected according to whether the light is reflected and the reflection time of the light. Not only is the test efficiency improved by using one machine for multiple tests, but the precise test of the electronic component specifications is also achieved, thereby improving the accuracy of the results of the electronic component specification test.

[0060] Specifically, the detection component includes a light spot array detection disk and a detection disk fixing bracket 302. The outer edge of the light spot array detection disk is fixed by the detection disk fixing bracket, and is used to receive test instruction information and test the specifications of the electronic components to be tested and obtain test results. The light spot array detection disk includes a light spot array composed of a plurality of light spots. The light spot array detection disk is used to receive test instruction information, emit a light beam, receive a reflected light beam, detect the real-time light reflection period of the light beam and obtain test results.

[0061] When the electronic component testing device performs a shape test on the electronic component to be tested, the central control unit sets the standard shape and constructs a shape test instruction according to the type of the electronic component to be tested, the light spot array detection disk receives the shape test instruction and adjusts the operating state according to the shape test instruction, the light spot array detection disk adjusts the on and off state of the light spot according to the standard shape, so that the light spot inside the corresponding standard shape is in an off state, and the light spot outside the corresponding standard shape is in a bright state, and the light spot array detection disk obtains the test result according to the presence or absence of the received reflected light beam; when the electronic component testing device performs a weight test on the electronic component to be tested, the central control unit sets the standard shape and standard weight according to the type of the electronic component to be tested and constructs a weight test instruction according to the standard shape and standard weight, the central control unit sets the standard light reflection period T0 according to the standard weight, the light spot array detection disk adjusts the on and off state of the light spot according to the standard shape, so that the light spot inside the corresponding standard shape is in a bright state, and the light spot outside the corresponding standard shape is in an off state, and the light spot array detects the real-time light reflection period of the light beam.

[0062] By using the light spot array detection disk as a detection device and utilizing the reflection characteristics of light, the shape and weight of electronic components are detected based on whether the light is reflected and the reflection time of the light. This not only improves the test efficiency, but also improves the accuracy of the results of the specification test of the electronic components, thereby achieving precise testing of the specifications of the electronic components.

[0063] Specifically, when the central control unit sets standard specifications and constructs test instruction information and issues test instruction information according to the type of electronic components to be tested, the standard specifications include standard shape and standard weight, and the test instruction information includes weight test instructions or shape test instructions.

[0064] When the electronic component testing device performs a shape test on the electronic component to be tested, the central control unit sets a standard shape and constructs a shape test instruction according to the type of the electronic component to be tested; when the electronic component testing device performs a weight test on the electronic component to be tested, the central control unit sets a standard shape and a standard weight according to the type of the electronic component to be tested and constructs a weight test instruction according to the standard shape and the standard weight, and the central control unit sets a standard light reflection period T0 according to the standard weight.

[0065] By having the central control unit set standard specifications and construct test instruction information according to the types of electronic components to be tested, standard specifications can be set according to the types of electronic components to be tested. Not only can different specification tests be performed for different specification contents, but specification tests can also be performed on different types of electronic components, thereby realizing the multifunctional use of the electronic component detection device and ensuring the accuracy of the test results.

[0066] Specifically, when the central control unit sets the standard shape according to the type of electronic component to be tested, constructs a shape test instruction according to the standard shape, and issues a shape test instruction, the light spot array detection disk adjusts the on and off state of the light spots according to the standard shape, so that the light spots inside the corresponding standard shape are in an off state, and the light spots outside the corresponding standard shape are in a bright state. The light spot array detection disk obtains the test result according to the presence or absence of the received reflected light beam, and the central control unit determines the shape qualification of the electronic component to be tested according to the test result.

[0067] When the central control unit sends a shape test instruction, the light spot array detection disk adjusts the on and off state of the light spots according to the standard shape, so that the light spots inside the corresponding standard shape are in an off state, and the light spots outside the corresponding standard shape are in a bright state. The light spots in the bright state emit light beams. If there are no obstructions on the paths of each light beam, the light beams penetrate the light-transmitting support plate without reflection, and the light spot array detection disk does not sense. The light spot array detection disk obtains a test result that the shape of the electronic component to be tested is normal, and the central control unit determines that the shape of the electronic component to be tested is qualified; if there are obstructions on the path of a certain light beam, the light beam cannot penetrate the light-transmitting support plate, and reflection occurs. The reflected light is sensed by the light beam receiving sensor, and the light spot array detection disk obtains a test result that the shape of the electronic component to be tested is abnormal, and the central control unit determines that the shape of the electronic component to be tested is unqualified.

[0068] The light spot array detection disk adjusts the on and off state of the light spot according to the standard shape and obtains the test result according to the presence or absence of the received reflected light beam. The shape of the electronic component to be tested is tested using the principle of light reflection to ensure a more precise test, thereby achieving precise shape testing of the electronic component to be tested and ensuring the accuracy of the test results of the shape test of the electronic component.

[0069] Specifically, when the light spot array detection disk obtains the test result according to the presence or absence of the received reflected light beam,

[0070] When the light spot array detection disk does not receive the reflected light beam, the light spot array detection disk obtains a test result that the shape of the electronic component to be tested is normal, and the central control unit determines that the shape of the electronic component to be tested is qualified according to this test result;

[0071] When the light spot array detection disk receives the reflected light beam, the light spot array detection disk obtains a test result that the shape of the electronic component to be tested is abnormal, and the central control unit determines that the shape of the electronic component to be tested is unqualified according to this test result.

[0072] When the central control unit sends a shape test instruction, the light spot array detection disk adjusts the on / off state of the light spots according to the standard shape, so that the light spots inside the corresponding standard shape are in the off state, and the light spots outside the corresponding standard shape are in the bright state. The light spots in the bright state emit light beams. If there are no obstacles in the paths of the respective light beams, the light beams penetrate the light-transmitting carrier plate and no reflection occurs, and the light spot array detection disk does not sense. The light spot array detection disk obtains a test result that the shape of the electronic component to be tested is normal, and the central control unit determines that the shape of the electronic component to be tested is qualified; if there is an obstacle in the path of a certain light beam, the light beam cannot penetrate the light-transmitting carrier plate and reflection occurs, and the reflected light is sensed by the light beam receiving sensor. The light spot array detection disk obtains a test result that the shape of the electronic component to be tested is abnormal, and the central control unit determines that the shape of the electronic component to be tested is unqualified.

[0073] By the light spot array detection disk obtaining the test result according to the presence or absence of the received reflected light beam, and using the principle of light reflection to test the shape of the electronic component to be tested, it is ensured that the test is more precise, realizing the precise test of the shape of the electronic component to be tested, and ensuring the accuracy of the test result of the shape test of the electronic component.

[0074] Specifically, when the central control unit sets the standard shape and standard weight according to the type of the electronic component to be tested, constructs the weight test instruction according to the standard shape and standard weight, and issues the weight test instruction, the central control unit sets the standard light reflection period T0 according to the standard weight. The light spot array detection disk adjusts the on / off state of the light spots according to the standard shape, so that the light spots inside the corresponding standard shape are in the bright state, and the light spots outside the corresponding standard shape are in the off state. The light spot array detection beam's real-time light reflection period is measured and the real-time light reflection period T is transmitted to the central control unit. The central control unit compares the real-time light reflection period T with the standard light reflection period T0 and determines the weight qualification of the electronic component to be tested according to the comparison result.

[0075] When T≧T0, the central control unit determines that the weight of the electronic component to be tested is qualified;

[0076] When T<T0, the central control unit determines that the weight of the electronic component to be tested is overweight.

[0077] When the electronic component testing device performs a weight test on the electronic component to be tested, the central control unit sets the standard shape and standard weight according to the type of the electronic component to be tested and constructs a weight test instruction according to the standard shape and standard weight. The central control unit sets the standard light reflection period T0 according to the standard weight, and the light spot array detection disk adjusts the on and off state of the light spot according to the standard shape, so that the light spot inside the corresponding standard shape is in a bright state, and the light spot outside the corresponding standard shape is in an off state. The light spot array detects the real-time light reflection period of the light beam and transmits the real-time light reflection period T to the central control unit. Since the compressive force on each supporting spring in the spring assembly relative to the initial state is F=k×Δx, where k is the elastic coefficient of the supporting spring, and Δx is the deformation of the supporting spring, the total compressive force Fz=nF on the spring assembly can be calculated based on the deformation of the supporting spring, where n is the number of supporting spring groups and the total compression Force Fz = gravity of the electronic device to be tested G = mg, where m is the weight of the electronic device to be tested, and g is the acceleration of gravity. Therefore, the weight of the electronic device to be tested can be calculated by the deformation of each group of supporting springs in the spring assembly, and the deformation of the supporting spring Δx can be calculated by the real-time light reflection period T of the light beam, Δx = x0-v×T, where x0 is the initial supporting spring length, and v is the speed of light. When the mass of the electronic component to be tested is greater than the standard mass, the deformation of the supporting spring Δx is greater than the deformation of the supporting spring under the standard mass, and the real-time light reflection period T is less than the standard light reflection period T0, the central control unit determines that the weight of the electronic component to be tested is unqualified. When the mass of the electronic component to be tested is ≦the standard mass, the deformation of the supporting spring Δx is ≦the deformation of the supporting spring under the standard mass, and the real-time light reflection period T is ≧the standard light reflection period T0, the central control unit determines that the weight of the electronic component to be tested is qualified.

[0078] The central control unit sets the standard shape and standard weight according to the type of the electronic component to be tested and constructs a weight test instruction according to the standard shape and standard weight. The central control unit sets the standard light reflection period T0 according to the standard weight. The light spot array detection disk adjusts the on and off state of the light spot according to the standard shape. The light spot array detects the real-time light reflection period of the light beam and transmits the real-time light reflection period T to the central control unit. The central control unit compares the real-time light reflection period T with the standard light reflection period T0 and determines the weight qualification of the electronic component to be tested according to the comparison result. The weight of the electronic component to be tested is tested using the principle of light reflection. Not only does the electronic component testing device enable both shape testing and weight testing, but also the test accuracy of the weight test of the electronic component testing device is improved, ensuring the accuracy of the specification test results of the electronic component testing device.

[0079] An embodiment of the present invention further provides an electronic component testing method, the method comprising:

[0080] Place the electronic component to be tested on the support assembly;

[0081] According to the type of electronic components to be tested, a standard shape and a standard weight are set, and according to the standard shape and the standard weight, test instruction information is constructed and issued;

[0082] According to the test instruction information, the electronic components to be tested are subjected to specification tests to obtain test results;

[0083] Based on the test results, the specifications of the electronic components to be tested are determined.

[0084] In the actual testing process, the steps of the electronic component testing method are as follows:

[0085] Step S1: placing the electronic component to be tested on the support assembly;

[0086] Step S2: setting a standard shape and a standard weight according to the type of the electronic component to be tested, and constructing and issuing test instruction information according to the standard shape and the standard weight;

[0087] Step S3: Performing specification tests on the electronic components to be tested according to the test instruction information to obtain test results;

[0088] Step S4: judging whether the electronic component to be tested is qualified according to the test results.

[0089] Wherein, step S2 includes: step S21: setting standard specifications in the central control unit according to the type of the electronic component to be tested, constructing test instruction information according to the standard specifications set in the central control unit, and setting a standard light reflection period in the central control unit when performing the weight test;

[0090] Step S22: The central control unit sends the test instruction information to the light spot array detection disk.

[0091] Wherein, step S3 includes: step S31: the light spot array detection disk receives the test instruction information;

[0092] Step S32: According to the test instruction information, the light spot array detection disk adjusts the on and off state of the light spots. When performing a shape test, the light spots inside the corresponding standard shape are in an off state, and the light spots outside the corresponding standard shape are in a bright state. If there are no obstructions on the paths of each light beam, the light beams penetrate the light-transmitting support plate without reflection, and the light spot array detection disk does not sense. The light spot array detection disk obtains a test result that the shape of the electronic component to be tested is normal. If there are obstructions on the path of a certain light beam, the light beam cannot penetrate the light-transmitting support plate, and reflection occurs. The reflected light is sensed by the light beam receiving sensor, and the light spot array detection disk obtains a test result that the shape of the electronic component to be tested is abnormal. When performing a weight test, the light spot array detection disk adjusts the on and off state of the light spots according to the standard shape, so that the light spots inside the corresponding standard shape are in a bright state, and the light spots outside the corresponding standard shape are in an off state. The light spots in the bright state emit light beams. If there are obstructions on the path of a certain light beam, the light beam cannot penetrate the light-transmitting support plate, and reflection occurs. The reflected light is sensed by the light beam receiving sensor, and the light spot array detection disk obtains the actual light reflection period.

[0093] Wherein, step S4 includes: step S41: transmitting the test result of the light spot array detection disk to the central control unit;

[0094] Step S42: The central control unit determines whether the specifications of the electronic component to be tested are qualified based on the test results. When performing a shape test, if the test result is that the shape is normal, the central control unit determines that the shape of the electronic component to be tested is qualified; if the test result is that the shape is abnormal, the central control unit determines that the shape of the electronic component to be tested is unqualified; when performing a weight test, if the real-time light reflection period ≧ the standard light reflection period, the central control unit determines that the weight of the electronic component to be tested is qualified; if the real-time light reflection period is less than the standard light reflection period, the central control unit determines that the weight of the electronic component to be tested is unqualified.

[0095] By instructing the central control unit to set standard specifications and construct test instruction information according to the types of electronic components to be tested, operating the light spot array detection disk to adjust its operating state according to the standard specifications and the constructed test instruction information, and utilizing the principle of light reflection to perform specification tests on the electronic components to be tested, not only can different specifications of electronic components of different types be tested, thus improving the test efficiency, but also precise measurement of the specifications of the electronic components to be tested is achieved, thus ensuring the accuracy of the specification test results.

[0096] See also Figure 4 As shown, an embodiment of the present invention further provides an electronic component testing system, the electronic component testing system comprising:

[0097] The electronic component testing device 5 is used to receive the test command information of the control module and perform specification tests on the electronic components to be tested. The electronic component testing device includes a support component 1, which is used to support the electronic components to be tested, a central control unit, which is used to set standard specifications and construct test instruction information and issue test instruction information according to the types of the electronic components to be tested, a detection component 3, which is connected to the central control unit and is used to adjust the working state of the detection component according to the test instruction information and obtain the test results under the corresponding working state, and a spring component 2, which includes a plurality of groups of supporting springs 201, one end of each of the supporting springs is connected to the bottom of the support component and each connection point is evenly distributed on the support component, and the other end is connected to the top of the detection component and each connection point is evenly distributed on the detection component. The spring component is used to support the support component and provide elastic force. The central control unit is also used to determine whether the electronic component to be tested is qualified according to the test results;

[0098] A positioning base 7 is arranged below the electronic component testing device, and is used to carry the electronic component testing device and emit a positioning laser. The positioning base includes a positioning laser emitter 701, and the positioning laser emitter is arranged at the center of the positioning base and is aligned with the center of the light-transmitting object-carrying plate, and is used to emit a positioning laser.

[0099] The vacuum adsorption assembly 6 moves along an external track disposed above the electronic component testing device and can be extended and retracted up and down, and is used to transfer the electronic component to be tested to the light-transmitting support plate 103;

[0100] The control module is connected to the vacuum adsorption component, the positioning base and the electronic component testing device respectively, and is used to construct a moving instruction according to the position of the vacuum adsorption component, monitor the positioning process according to the laser reception status of the vacuum adsorption component, and send test command information according to the test process of the electronic component testing device.

[0101] When performing specification testing, the control module sends a suction instruction and a forward movement instruction or a backward movement instruction along the track to the vacuum adsorption assembly. The vacuum suction cup 604 absorbs the electronic component 4 to be tested and carries the electronic component to be tested forward or backward along the external track to the top of the electronic component testing device. When the positioning laser receiver receives the positioning laser signal from the laser positioning transmitter, the control module sends a descending instruction to the vacuum adsorption assembly, and the vacuum adsorption assembly descends to contact the buffer sponge pad 101. The control module transmits a placement instruction to the vacuum adsorption assembly, and the vacuum suction cup places the electronic component to be tested on the light-transmitting support plate according to the instruction of the positioning laser. The control module sends a drop instruction to the electronic component testing device. The device sends a start test command, and the central control unit sets the standard specifications (shape and weight) according to the type of the component to be tested. The central control unit sends test instruction information (shape test instruction and weight test instruction). When the central control unit sends the shape test instruction, the light spot array detection disk 301 adjusts the on and off state of the light spot according to the standard shape. Specifically, the light spot inside the corresponding standard shape is in an off state, and the light spot outside the corresponding standard shape is in a bright state. The light spot in the bright state emits a light beam. If there is no obstruction on the path of each light beam, the light beam penetrates the light-transmitting support plate without reflection, and the light spot array detection disk is not induced. The light spot array detection disk obtains the shape of the electronic component to be tested. If the test result shows that the shape of the electronic component to be tested is normal, the central control unit determines that the shape of the electronic component to be tested is qualified; if there is an obstruction in the path of a certain light beam, the light beam cannot penetrate the light-transmitting support plate and is reflected. The reflected light is sensed by the light beam receiving sensor, and the light spot array detection disk obtains the test result that the shape of the electronic component to be tested is abnormal, and the central control unit determines that the shape of the electronic component to be tested is unqualified; when the central control unit sends a weight test instruction, the light spot array detection disk adjusts the on and off state of the light spot according to the standard shape and sets the standard light reflection period according to the standard weight. Specifically, the light spot corresponding to the inside of the standard shape is in a bright state, and the light spot corresponding to the outside of the standard shape is in an off state, and the light spot in the bright state is off. A light beam is emitted, and there is an obstruction on the path of a certain light beam, so the light beam cannot penetrate the light-transmitting support plate and is reflected. The reflected light is sensed by the light beam receiving sensor, and the light spot array detection disk obtains the actual light reflection period. When the weight of the electronic component to be tested is less than or equal to the standard weight, the actual light reflection period is greater than or equal to the standard light reflection period, and the central control unit determines that the weight of the electronic component to be tested is qualified; when the weight of the electronic component to be tested is greater than the standard weight, the actual light reflection period is less than the standard light reflection period, and the central control unit determines that the weight of the electronic component to be tested is unqualified; when the control module detects that the electronic component testing device has completed the specification test, the control module sends an end test command to the electronic component testing device.

[0102] By setting a positioning base and a vacuum adsorption component, the placement position of the electronic component to be tested can be positioned to assist the electronic component testing device in testing, and the control module controls the test process, so that the placement position of the electronic component to be tested can be accurately controlled, and the detection function of the electronic component testing device can be better exerted and realized, thereby ensuring the accuracy of the test results of the electronic component specification test.

[0103] Specifically, the vacuum adsorption component includes a real-time position detector 601, a telescopic arm 602, a base 603, a plurality of vacuum suction cups 604 and a positioning laser receiver 605. The upper end of the telescopic arm is connected to the external track through a pulley, and the lower end is connected to the base. The real-time position detector is arranged on the telescopic arm, which is used to monitor the real-time position information of the vacuum adsorption component and upload the real-time position information to the control module. The telescopic arm moves on the external track and extends and retracts up and down according to the moving instructions of the control module. The plurality of vacuum suction cups are evenly distributed on the bottom surface of the base, which are used to adsorb the electronic components to be tested and transfer the electronic components to be tested to the light-transmitting support plate. The positioning laser receiver is arranged at the center of the bottom surface of the base, which is used to receive the emitted positioning laser and place the electronic components to be tested according to the positioning laser.

[0104] When placing the electronic component to be tested, the control module sends a suction instruction and a forward movement instruction or a backward movement instruction along the track to the vacuum adsorption assembly. The vacuum suction cup absorbs the electronic component to be tested and carries the electronic component to be tested forward or backward along the external track to above the electronic component testing device. When the positioning laser receiver receives the positioning laser signal from the laser positioning transmitter, the control module sends a descending instruction to the vacuum adsorption assembly. The vacuum adsorption assembly descends to contact the buffer sponge pad. The control module transmits a placement instruction to the vacuum adsorption assembly, and the vacuum suction cup places the electronic component to be tested on the light-transmitting support plate according to the instructions of the positioning laser.

[0105] By providing a vacuum adsorption component and providing a positioning laser receiver on the vacuum adsorption component, the vacuum adsorption component receives and transmits the positioning laser and places the electronic component to be tested according to the positioning laser, thereby achieving precise positioning of the placement position of the electronic component to be tested, so as to assist the electronic component testing device in testing, so that the detection function of the electronic component testing device can be better exerted, and precise testing of the electronic component testing system is achieved, thereby ensuring the accuracy of the test results of the electronic component specification test.

[0106] Specifically, when the control module constructs the moving part instruction information according to the position of the vacuum adsorption component, monitors the positioning process according to the laser reception status of the vacuum adsorption component, and sends the test command information, the control module receives the real-time position information and transmits the moving part instruction information to the vacuum adsorption component according to the real-time position information, the moving part instruction information includes the suction part instruction, the forward movement instruction along the track, the backward movement instruction along the track, the rising instruction, the descending instruction and the placing part instruction, and the test command information includes the start test command and the end test command;

[0107] When the control module monitors the positioning process and sends the test command information according to the laser reception of the vacuum adsorption component, the control module detects that the positioning laser receiver receives the positioning laser, and the control module transmits a descending instruction to the vacuum adsorption component, and the vacuum adsorption component descends to contact the buffer sponge pad. The control module transmits a placement instruction to the vacuum adsorption component, and the vacuum suction cup places the electronic component to be tested on the light-transmitting support plate according to the instruction of the positioning laser, and the control module sends a start test command to the electronic component testing device;

[0108] When the control module detects that the electronic component testing device has completed the specification test, the control module sends a test end command to the electronic component testing device.

[0109] When performing specification testing, the control module sends a suction instruction and a forward movement along the track or a backward movement along the track to the vacuum adsorption assembly. The vacuum suction cup absorbs the electronic component to be tested and carries the electronic component to be tested forward or backward along the external track to above the electronic component testing device. When the positioning laser receiver receives the positioning laser signal from the laser positioning transmitter, the control module sends a descending instruction to the vacuum adsorption assembly. The vacuum adsorption assembly descends to contact the buffer sponge pad. The control module transmits a placement instruction to the vacuum adsorption assembly. The vacuum suction cup places the electronic component to be tested on the light-transmitting support plate according to the instructions of the positioning laser. The control module sends a start test command to the electronic component testing device. When the control module detects that the electronic component testing device has completed the specification test, the control module sends an end test command to the electronic component testing device.

[0110] By setting up a control module to monitor and control the test process of the electronic component test system in real time, the operation process of the electronic component test system is made precise and controllable, and the precise test of the electronic component test system is achieved, thereby ensuring the accuracy of the test results of the electronic component specification test.

[0111] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

[0112] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electronic component testing device, characterized in that: Comprising: A component for holding objects, which is used to hold the electronic component to be tested; A central control unit, which is used to set standard specifications according to the type of the electronic component to be tested, construct test instruction information, and issue the test instruction information; A detection component, connected to the central control unit, which is used to adjust the working state of the detection component according to the test instruction information, and obtain a test result in the corresponding working state; A spring component, including several groups of supporting springs. One end of each supporting spring is connected below the component for holding objects and the connection points are evenly distributed on the component for holding objects, and the other end is connected above the detection component and the connection points are evenly distributed on the detection component. The spring component is used to support the component for holding objects and provide elastic force; The central control unit is further used to determine whether the electronic component to be tested is qualified according to the test result; When the central control unit sets a standard shape according to the type of the electronic component to be tested, constructs a shape test instruction according to the standard shape, and issues the shape test instruction, the light spot array detection disk adjusts the on-off state of the light spots according to the standard shape, so that the light spots inside the corresponding standard shape are in the off state, and the light spots outside the corresponding standard shape are in the bright state. The light spot array detection disk obtains a test result according to the presence or absence of the received reflected light beam, and the central control unit determines the qualification of the shape of the electronic component to be tested according to the test result; When the light spot array detection disk obtains a test result according to the presence or absence of the received reflected light beam, When the light spot array detection disk does not receive the reflected light beam, the light spot array detection disk obtains a test result that the shape of the electronic component to be tested is normal, and the central control unit determines that the shape of the electronic component to be tested is qualified according to the test result; When the light spot array detection disk receives the reflected light beam, the light spot array detection disk obtains a test result that the shape of the electronic component to be tested is abnormal, and the central control unit determines that the shape of the electronic component to be tested is unqualified according to the test result; When the central control unit sets a standard shape and a standard weight according to the type of the electronic component to be tested, constructs a weight test instruction according to the standard shape and the standard weight, and issues the weight test instruction, the central control unit sets a standard light reflection period T0 according to the standard weight. The light spot array detection disk adjusts the on-off state of the light spots according to the standard shape, so that the light spots inside the corresponding standard shape are in the bright state, and the light spots outside the corresponding standard shape are in the off state. The light spot array detection beam measures the real-time light reflection period and transmits the real-time light reflection period T to the central control unit. The central control unit compares the real-time light reflection period T with the standard light reflection period T0 and determines the qualification of the weight of the electronic component to be tested according to the comparison result. When T≧T0, the central control unit determines that the weight of the electronic component to be tested is qualified; When T<T0, the central control unit determines that the weight of the electronic component to be tested is overweight.

2. The electronic component testing device according to claim 1, characterized in that: The detection component includes a light spot array detection disk and a detection disk fixing bracket. The outer edge of the light spot array detection disk is fixed by the detection disk fixing bracket, and is used to receive test instruction information and test the specifications of the electronic components to be tested and obtain test results. The light spot array detection disk includes a light spot array composed of a plurality of light spots, and the light spot array detection disk is used to receive test instruction information, emit a light beam, receive a reflected light beam, detect the real-time light reflection period of the light beam and obtain test results.

3. The electronic component testing device according to claim 2, characterized in that: When the central control unit sets standard specifications and constructs test instruction information and issues test instruction information according to the type of electronic components to be tested, the standard specifications include standard shape and standard weight, and the test instruction information includes weight test instructions or shape test instructions.

4. An electronic component testing method using the electronic component testing device according to any one of claims 1 to 3, characterized in that: include: Place the electronic component to be tested on the support assembly; According to the type of electronic components to be tested, a standard shape and a standard weight are set, and according to the standard shape and the standard weight, test instruction information is constructed and issued; According to the test instruction information, the electronic components to be tested are subjected to specification tests to obtain test results; Based on the test results, the specifications of the electronic components to be tested are determined.

5. An electronic component testing system, characterized in that: include: The electronic component testing device according to any one of claims 1 to 3 is used to receive test command information of a control module and perform specification tests on electronic components to be tested, the electronic component testing device includes a support component for supporting the electronic components to be tested, a central control unit for setting standard specifications and constructing test instruction information and issuing test instruction information according to the types of the electronic components to be tested, a detection component connected to the central control unit, for adjusting the working state of the detection component according to the test instruction information, and obtaining test results under the corresponding working state, a spring component including a plurality of groups of supporting springs, one end of each of the supporting springs being connected to the bottom of the support component and each connection point being evenly distributed on the support component, and the other end being connected to the top of the detection component and each connection point being evenly distributed on the detection component, the spring component being used to support the support component and provide elastic force, and the central control unit being further used to determine whether the electronic component to be tested is qualified according to the test results; A positioning base is arranged below the electronic component testing device, and is used to carry the electronic component testing device and emit a positioning laser. The positioning base includes a positioning laser emitter, and the positioning laser emitter is arranged at the center of the positioning base and is aligned with the center of the light-transmitting object-carrying plate, and is used to emit a positioning laser. The vacuum adsorption assembly moves along an external track arranged above the electronic component testing device and can be extended and retracted up and down, and is used to transfer the electronic component to be tested to the light-transmitting support plate; The control module is connected to the vacuum adsorption component, the positioning base and the electronic component testing device respectively, and is used to construct a moving instruction according to the position of the vacuum adsorption component, monitor the positioning process according to the laser reception status of the vacuum adsorption component, and send test command information according to the test process of the electronic component testing device.

6. The electronic component testing system according to claim 5, characterized in that: The vacuum adsorption component includes a real-time position detector, a telescopic arm, a base, a plurality of vacuum suction cups and a positioning laser receiver. The upper end of the telescopic arm is connected to the external track through a pulley, and the lower end is connected to the base. The real-time position detector is arranged on the telescopic arm, which is used to monitor the real-time position information of the vacuum adsorption component and upload the real-time position information to the control module. The telescopic arm moves on the external track and extends up and down according to the moving instructions of the control module. The plurality of vacuum suction cups are evenly distributed on the bottom surface of the base, which are used to adsorb the electronic components to be tested and transfer the electronic components to be tested to the light-transmitting support plate. The positioning laser receiver is arranged at the center of the bottom surface of the base, which is used to receive the emitted positioning laser and place the electronic components to be tested according to the positioning laser.

7. The electronic component testing system according to claim 6, characterized in that: When the control module constructs the moving part instruction information according to the position of the vacuum adsorption component, monitors the positioning process according to the laser receiving situation of the vacuum adsorption component, and sends the test command information, the control module receives the real-time position information and transmits the moving part instruction information to the vacuum adsorption component according to the real-time position information, the moving part instruction information includes the suction part instruction, the forward movement instruction along the track, the backward movement instruction along the track, the rising instruction, the descending instruction and the placing part instruction, and the test command information includes the start test command and the end test command; When the control module monitors the positioning process and sends the test command information according to the laser reception of the vacuum adsorption component, the control module detects that the positioning laser receiver receives the positioning laser, and the control module transmits a descending instruction to the vacuum adsorption component, and the vacuum adsorption component descends to contact the buffer sponge pad. The control module transmits a placement instruction to the vacuum adsorption component, and the vacuum suction cup places the electronic component to be tested on the light-transmitting support plate according to the instruction of the positioning laser, and the control module sends a start test command to the electronic component testing device; When the control module detects that the electronic component testing device has completed the specification test, the control module sends a test end command to the electronic component testing device.

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