A method and system for detecting heat resistance strength defects of a waterproof film tape

Abstract

The present invention relates to the technical field of digital data processing, and specifically relates to a method and system for detecting heat resistance strength defects of a waterproof thin film tape. This method uses emerging software and new information technology services to complete the detection of thin film defects and the evaluation of the production process. First, the elastic modulus, thin film stress, thin film thickness, and thin film uniformity of the thin film are obtained by means of computer assistance and sensors, and then the practical performance of the thin film is obtained; based on the practical performance, multiple thin films are clustered to obtain an abnormal cluster group and the first proportion of the first abnormal thin film within the cluster group, the heat resistance performance of the thin film is determined, and the second abnormal thin film and the corresponding second proportion are obtained; according to the first proportion and the second proportion, the production process of the thin film tape is evaluated, and by analyzing various data of the thin film, abnormal thin films and the evaluation of the production process are obtained. Moreover, the evaluation results can also be generated into an evaluation report file in a computer-aided design manner for computer visualization.

Description

Technical Field

[0001] The present invention relates to the technical field of digital data processing, and particularly to a method and system for detecting heat resistance strength defects of a waterproof thin film tape. Background Art

[0002] Thin films are widely used in fields such as machinery, microelectronics, optics, and medicine. Preparing a thin film on a substrate is beneficial to extending the service life of the substrate, improving the hardness, wear resistance, and friction performance of the substrate, and enhancing the corrosion resistance and oxidation resistance of the substrate. A tape is a form of thin film. In waterproof projects, the presence of a thin film can effectively improve the problem of the intrusion of flowing liquids. However, in building materials, due to being in a harsh environment for a long time, the performance of the thin film will be affected, thereby affecting the final waterproof effect.

[0003] Currently, in the production field, a common method for detecting defects in thin films is to detect the temperature change of the thin film. However, detecting the temperature change will cause damage to the performance of the thin film, resulting in the thin film not being able to be used continuously after detection. If a large number of temperature change detections are carried out, the corresponding detection cost will be very high. Summary of the Invention

[0004] In order to solve the above technical problems, an object of the present invention is to provide a method and system for detecting heat resistance strength defects of a waterproof thin film tape, and the specific technical solutions adopted are as follows:

[0005] In a first aspect, an embodiment of the present invention provides a method for detecting heat resistance strength defects of a waterproof thin film tape, and the method includes the following steps:

[0006] Obtain the initial unloading stiffness of the film indenter, and obtain the elastic modulus of the thin film according to the initial unloading stiffness; obtain the thin film stress, the thin film thickness, and the thin film uniformity;

[0007] Stretch the thin film, and obtain the warping degree of the edge of the stretched thin film; obtain the practical performance of the thin film according to the warping degree, the elastic modulus, and the thin film stress;

[0008] Based on the practical performance, cluster multiple thin films to obtain an abnormal cluster group; obtain the first proportion of the first abnormal thin film in the abnormal cluster group;

[0009] Based on the first abnormal thin film, determine the heat resistance performance of the thin film according to the change situation of the practical performance of the thin film and the change situation of the thin film uniformity; compare the heat resistance performance of the thin film with the preset standard heat resistance performance to obtain a plurality of second abnormal thin films; the ratio of the number of the first abnormal thin films to the number of the second abnormal thin films is the second proportion;

[0010] Obtain the heat resistance performance credibility based on the first proportion and the second proportion, and evaluate the production process of the film according to the magnitudes of the first proportion, the second proportion, and the heat resistance performance credibility.

[0011] Preferably, the method for detecting the heat resistance strength defect of a waterproof film tape further includes: generating and outputting an evaluation report file based on the evaluation result of evaluating the production process of the film for computer visualization.

[0012] Preferably, the obtaining the warping degree of the edge of the stretched film includes:

[0013] Stretch the film in two stretching manners, including stretching the film at fixed points on the wide side and stretching the film as a whole on the wide side;

[0014] Based on stretching the film at fixed points on the wide side, place the stretched film on a plane, calculate the first warping distance between each pixel point on the film edge and the plane, and construct a first warping sequence; obtain the standard deviation, the maximum range, and the sequence mean of the first warping sequence;

[0015] Based on stretching the film as a whole on the wide side, place the stretched film on a plane, calculate the second warping distance between each pixel point on the film edge and the plane, and construct a second warping sequence; obtain the variance of the second warping sequence;

[0016] The calculation formula for the warping degree is:

[0017]

[0018] where Q is the warping degree; STD(d) is the standard deviation of the first warping sequence; Range(d) is the maximum range of the first warping sequence; mean(d) is the sequence mean of the first warping sequence; tanh(mean(d)) is the hyperbolic tangent function with the sequence mean of the first warping sequence as the independent variable; Var(d′) is the variance of the second warping sequence.

[0019] Preferably, the obtaining the practical performance of the film according to the warping degree, the elastic modulus, and the film stress includes:

[0020] Obtain an exponential function with the base of the natural constant and the negative warping degree as the exponent; the product of the exponential function, the elastic modulus, and the film stress is the practical performance of the film.

[0021] Preferably, the clustering of multiple films based on the practical performance to obtain an abnormal cluster group includes:

[0022] Based on the practical performance, use the K-Means clustering algorithm to cluster multiple films to obtain multiple cluster groups;

[0023] Obtain the cluster centroids of each of the said clusters, and calculate the average distance from each point within the cluster to the said cluster centroid; the cluster corresponding to the maximum average distance is the said abnormal cluster.

[0024] Preferably, determining the heat resistance of the thin film according to the change in the practical performance of the thin film and the change in the uniformity of the thin film includes:

[0025] Obtain the thin film temperature of the thin film;

[0026] The calculation formula for the said heat resistance is:

[0027]

[0028] where U is the said heat resistance; e is the natural constant; is the derivative of the practical performance of the thin film with respect to the thin film temperature; H is the said practical performance; T is the thin film temperature; K m is the said thin film thickness; Min(K m ) is the minimum thin film thickness; Max(K m ) is the maximum thin film thickness; is the absolute value function of; is the custom activation window function.

[0029] Preferably, comparing the heat resistance of the thin film with the preset standard heat resistance to obtain a plurality of second abnormal thin films includes:

[0030] Subtract the preset standard heat resistance from the heat resistance of the thin film to obtain a first difference; the thin film corresponding to the first difference less than the preset difference threshold is the second abnormal thin film.

[0031] Preferably, obtaining the heat resistance credibility according to the first ratio and the second ratio includes:

[0032] The calculation formula for the said heat resistance credibility is:

[0033] C = (1 - YTP1) 2 *(1 - YTP2)

[0034] where C is the said heat resistance credibility; YTP1 is the first ratio; YTP2 is the second ratio.

[0035] Preferably, evaluating the production process of the thin film according to the magnitudes of the first ratio, the second ratio, and the heat resistance credibility includes:

[0036] When the reliability of the heat resistance performance is less than a preset reliability threshold, each production process is detected; when the reliability of the heat resistance performance is greater than the preset reliability threshold, the production process is evaluated;

[0037] When the first proportion is greater than a preset first threshold and the second proportion is less than a preset second threshold, each production process is detected; when the first proportion is greater than the preset first threshold and the second proportion is greater than the preset second threshold, each production process is detected; when the first proportion is less than the preset first threshold and the second proportion is greater than the preset second threshold, each production process is normal.

[0038] In a second aspect, an embodiment of the present invention provides a waterproof film tape heat resistance strength defect detection system, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the above-mentioned waterproof film tape heat resistance strength defect detection method is implemented.

[0039] The embodiments of the present invention have at least the following beneficial effects:

[0040] Embodiments of the present invention utilize digital data processing technology. This method uses emerging software and new information technology services to complete the evaluation of film defect detection and production processes. First, computer-aided and sensor methods are used to obtain the initial unloading stiffness of the film indenter, and the elastic modulus of the film is obtained based on the initial unloading stiffness; the film stress, film thickness, and film uniformity are obtained; the film is stretched, and the warping degree of the film edge after stretching is obtained; the practical performance of the film is obtained based on the warping degree, elastic modulus, and film stress; based on the practical performance, multiple films are clustered to obtain an abnormal cluster; the first proportion of the first abnormal film in the abnormal cluster is obtained; based on the first abnormal film, the heat resistance of the film is determined according to the change in the practical performance of the film and the change in the film uniformity; the heat resistance of the film is compared with the preset standard heat resistance, and multiple second abnormal films are obtained; the ratio of the number of the first abnormal films to the number of the second abnormal films is the second proportion; the heat resistance credibility is obtained based on the first proportion and the second proportion, and the defect detection process and production process of the film tape are evaluated according to the magnitudes of the first proportion, the second proportion, and the heat resistance credibility. Embodiments of the present invention measure various conventional data of the film to determine the practical performance of the current film. According to the differences in practical performance, the films within the batch are classified to distinguish normal films and suspected defective films, and the first proportion of the first abnormal films is obtained. The temperature of the first abnormal films is detected to further determine the heat resistance of the film. If the heat resistance does not meet the standard, it is a second abnormal film, and at the same time, the second proportion of the second time is obtained. By comparing the first proportion and the second proportion, the problems in the current production or detection process are determined. The purpose of determining film abnormalities and judging whether there are problems in the production process is achieved. Moreover, the evaluation results can be generated into an evaluation report file in a computer-aided design manner for computer visualization. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0042] Figure 1 FIG. is a flowchart of a method for detecting heat resistance strength defects of a waterproof film tape provided by an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0043] In order to further elaborate on the technical means and effects adopted by the present invention to achieve the intended invention purpose, the following, in combination with the accompanying drawings and preferred embodiments, details a method and system for detecting heat resistance strength defects of a waterproof thin film tape according to the present invention, including its specific implementation manner, structure, features, and effects. In the following description, different "one embodiment" or "another embodiment" do not necessarily refer to the same embodiment. In addition, the specific features, structures, or characteristics in one or more embodiments can be combined in any suitable form.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs.

[0045] The embodiment of the present invention provides a specific implementation method for a method and system for detecting heat resistance strength defects of a waterproof thin film tape. This method is applicable to thin film abnormality detection and thin film production scenarios. In this scenario, the waterproof thin film is placed on a cube substrate, and cameras are placed on both sides of the cube substrate to measure the warping degree of the stretched thin film. In order to solve the problem that directly detecting temperature changes in a large number of thin films will cause performance damage to the thin films, resulting in too high detection costs. The embodiment of the present invention uses emerging software and new information technology services to complete the evaluation of thin film defects and production processes, and uses computer-aided and sensor methods to obtain various conventional data of the thin film for measurement to determine the practical performance of the current thin film. According to the difference in practical performance, the thin films within the batch are classified to distinguish normal and suspected defective thin films, obtaining the first proportion of the first abnormal thin films. Temperature detection is performed on the first abnormal thin films to further determine the heat resistance performance of the thin films. If the heat resistance performance does not meet the standard, it is the second abnormal thin film, and at the same time, the second proportion of the second time is obtained. By comparing the first proportion and the second proportion, the problems in the current production or detection process are determined. The purpose of determining thin film abnormalities and judging whether there are problems in the production process is achieved. Moreover, the evaluation results can also be generated into an evaluation report file in a computer-aided design manner for computer visualization.

[0046] The following specifically describes the specific solution of a method and system for detecting heat resistance strength defects of a waterproof thin film tape provided by the present invention in combination with the accompanying drawings.

[0047] Please refer to Figure 1 , which shows a flowchart of the steps of a method for detecting heat resistance strength defects of a waterproof thin film tape provided by an embodiment of the present invention. The method includes the following steps:

[0048] Step S100, obtain the initial unloading stiffness of the thin film indenter, and obtain the elastic modulus of the thin film according to the initial unloading stiffness; obtain the thin film stress, thin film thickness, and thin film uniformity.

[0049] Obtain the elastic modulus, film stress, film thickness, and film uniformity of the film by means of computer-aided and sensor methods. First, sample and test the waterproof film tape within the production batch to determine the film stress, elastic modulus, and warping degree of the film after stretching within this batch. Specifically:

[0050] Use a substrate, a film, and a film indenter to conduct an indentation experiment to determine the elastic modulus of the current film.

[0051] Arbitrarily select a section of the film and cut the film into rectangular blocks. In the embodiment of the present invention, the rectangular block is a rectangular block of 100mm * 30mm. In other embodiments, the implementer can adjust the size of this rectangular block according to the actual situation.

[0052] Place the film on a cube-shaped substrate, select a cylindrical indenter as the load, and use the bottom circular surface of the cylinder as the contact surface for indentation to apply an indentation load to the film. Obtain the indentation depth, where the indentation depth is the distance that the film indenter presses into the film during the indentation experiment. During the process of applying the indentation load to the film using the film indenter, the indentation depth is detected and recorded in real time to determine the unloading curve of the indentation load and indentation depth of the film indenter. It should be noted that in order to reduce measurement errors, multiple measurement groups can be designed to determine this unloading curve. Further, determine the initial unloading stiffness of the film corresponding to each film indenter according to the relationship curve between the indentation load and indentation depth of the film corresponding to each film indenter. The initial unloading stiffness is the slope of the unloading curve when the indentation load is at its maximum value.

[0053] The calculation formula for the initial unloading stiffness S is:

[0054]

[0055] Among them, F max is the maximum indentation load of the film indenter; h max is the maximum indentation depth of the film; h c is the indentation depth at the intersection of the tangent of the unloading curve and the horizontal axis.

[0056] Further, calculate the elastic modulus of the film according to the initial unloading stiffness and the radius of the contact surface of the indenter.

[0057] The relationship between the elastic modulus of the film, the initial unloading stiffness of the film indenter, and the radius of the contact surface of the indenter is:

[0058]

[0059] Among them, E is the elastic modulus of the film; S is the initial unloading stiffness of the film indenter; R is the radius of the contact surface of the indenter.

[0060] The film stress is obtained by using a film stress detector. It should be noted that using this instrument to determine the stress magnitude is common knowledge for those skilled in the art. The film thickness is obtained by using a film thickness detector. It should be noted that using this instrument to determine the film thickness is common knowledge for those skilled in the art.

[0061] Determine the uniformity of the current film. Specifically: perform multi-point measurements on the sampled film to obtain the film thickness at multiple points, form a multi-point data set, and calculate the corresponding standard deviation for the film thickness data in the obtained multi-point data set. This standard deviation is the uniformity of the film. In the embodiment of the present invention, the number of data in the multi-point data set obtained during multi-point measurement is 25. In other embodiments, the implementer can determine the number of data according to the actual situation.

[0062] Step S200, stretch the film to obtain the warping degree of the edge of the stretched film; obtain the practical performance of the film based on the warping degree, elastic modulus, and film stress.

[0063] Perform a tensile test on the selected rectangular film to further obtain the warping degree of the edge of the stretched film. The warping degree of the film edge will affect the practical performance of the film.

[0064] The film is stretched in two stretching methods, including stretching the film with fixed points on the wide side and stretching the film as a whole on the wide side.

[0065] Based on stretching the film with fixed points on the wide side, the stretching direction is the long side direction. The two fixed points on the wide side are at the center of the wide side, and the stretching length is 10% of the current film length. In the embodiment of the present invention, the original long side of the film is 100 mm, so the long side becomes 110 mm after stretching. Place the stretched film on a plane and determine the first warping distance between each pixel point on the film edge and the plane from the side to construct a first warping sequence. It should be noted that the process of determining the first warping distance is completed through image vision, which is common knowledge for those skilled in the art.

[0066] Obtain the standard deviation, maximum range, and sequence mean of the first warping sequence.

[0067] Based on stretching the film as a whole on the wide side, similarly, the stretching direction is the long side, but instead of stretching with fixed points on the wide side, the entire wide side is stretched, and the stretching length is 3% of the current film length, that is, the long side becomes 103 mm after stretching. Similarly, place the stretched film on a plane and determine the second warping distance between each pixel point on the film edge and the plane from the side to construct a second warping sequence. It should be noted that when stretching in two stretching methods, two small pieces of film cut from the same whole piece of film are respectively stretched in two ways, that is, the performance and various parameters of the two pieces of film are exactly the same.

[0068] Obtain the variance of the second warping sequence.

[0069] Furthermore, calculate the warping degree of the thin film. The calculation formula for the warping degree Q is:

[0070]

[0071] Wherein, STD(d) is the standard deviation of the first warping sequence; Range(d) is the maximum range of the first warping sequence; mean(d) is the sequence mean of the first warping sequence; tanh(mean(d)) is the hyperbolic tangent function with the sequence mean of the first warping sequence as the independent variable; Var(d′) is the variance of the second warping sequence.

[0072] The greater the first warping distance and the second warping distance between each pixel point on the thin film edge and the plane, the greater the warping degree of the corresponding thin film.

[0073] Furthermore, determine the current ambient temperature and the thin film temperature of the thin film itself to determine the current environment and thin film state. Among them, the ambient temperature is used to determine the external influencing factors of the experiment, and the magnitude of the thin film temperature affects the properties of the thin film. The ambient temperature can be directly measured with a thermometer, and the thin film temperature is determined using an infrared thermometer gun.

[0074] When the thin film temperature is close to the standard temperature, obtain the practical performance of the thin film according to the warping degree, elastic modulus and thin film stress. Specifically: obtain the exponential function with the natural constant as the base and the negative warping degree as the exponent. The product of this exponential function, elastic modulus and thin film stress is the practical performance of the thin film. In the embodiment of the present invention, the standard temperature is 15°, and in other embodiments, the implementer can adjust this value according to the actual situation.

[0075] That is, the smaller the warping degree of a thin film, the better the practical performance of the thin film. That is, when under the action of a certain force, when the warping degree is relatively small, the thin film is not easily deformed, that is, it does not curl or fall off when encountering an external force during actual use, and at this time the practical performance of the thin film is relatively high.

[0076] The higher the thin film stress and elastic modulus, the greater the range of forces that the current thin film can withstand, and it can cope with more complex mechanical environments.

[0077] In the building materials field, for safety considerations, the performance requirements for thin films are relatively high. Generally speaking, the higher the surface tension standard of the thin film, the better; at the same time, requirements are also made for the curling performance of the thin film, that is, it does not deform when under a force below the bearing capacity, and does not curl or edge when under a force above the bearing capacity.

[0078] Step S300, based on the practical performance, cluster multiple thin films to obtain an abnormal cluster group; obtain the first proportion of the first abnormal thin film in the abnormal cluster group.

[0079] Based on the obtained practical performance, the films produced in different batches are further discussed.

[0080] For films of the same type and the same production process, since there is more than one output device at the same time in the production workshop, samples of the films produced by each device are taken for testing to determine the difference degree of the current films.

[0081] Since directly determining the heat resistance performance requires destructive testing of the film, changing the temperature will affect the quality of the film and make the film no longer reusable. Therefore, a preliminary screening is first carried out to determine the first abnormal films that may be defective.

[0082] Compare multiple produced films pairwise to confirm the difference in the practical performance of the current films.

[0083] Based on the practical performance, use the K-Means clustering algorithm to cluster multiple films to obtain multiple clusters. Specifically: Obtain the absolute difference in the practical performance corresponding to any two films. To obtain the difference in the practical performance of two films, compare all the produced films pairwise to determine the absolute difference between pairwise films. According to the obtained absolute differences, use the K-Means clustering algorithm to cluster multiple films to obtain multiple clusters. In the embodiment of the present invention, the value of K is 2, and in other embodiments, the implementer adjusts this value according to the actual situation.

[0084] Use the K-Means clustering algorithm to cluster multiple films to obtain multiple clusters. Specifically:

[0085] Step 1, randomly select the first initial cluster centroid.

[0086] Step 2, calculate the distance from each point to the nearest selected cluster centroid.

[0087] Step 3, select the point with the largest distance as the next cluster centroid.

[0088] Step 4, if k cluster centroids have been selected, go to Step 5; otherwise, repeat Step 2.

[0089] Step 5, measure the distance from the remaining sample points to each cluster centroid and assign it to the cluster where the nearest cluster centroid is located.

[0090] Step 6, recalculate the cluster centroids of the obtained clusters.

[0091] Step 7, repeat Steps 1 to 6 until the k cluster centroids no longer change.

[0092] That is, the current multiple samples are divided into two categories, and the distance between each point is the absolute difference between the two samples.

[0093] After completing the classification, obtain the cluster centroids of each cluster, calculate the average distance from each point in the cluster to the cluster centroid, and the cluster with the largest average distance is the abnormal cluster. Count the number of the first abnormal thin films in the abnormal cluster, and then the current number of suspected abnormal samples is obtained. Obtain the first proportion of the first abnormal thin films in the abnormal cluster, and this first proportion is also the unqualified rate. The unqualified rate can characterize the overall production status and detection status of the current workshop. If the qualified rate is too low, it indicates that there is an abnormal production status or an error in the detection method.

[0094] Step S400: Based on the first abnormal thin films, determine the heat resistance of the thin films according to the change of the practical performance of the thin films and the change of the uniformity of the thin films; compare the heat resistance of the thin films with the preset standard heat resistance to obtain multiple second abnormal thin films; the ratio of the number of the first abnormal thin films to the number of the second abnormal thin films is the second proportion.

[0095] After comparing the practical performance between two thin films, take the abnormality of any two as the sample distance in K-Means. Through unsupervised learning, filter out the thin films judged to have good heat resistance, further determine the thin films that may have heat resistance strength defects in the current production, mark them, and make subsequent judgments.

[0096] When the temperature of the thin film changes, further determine the heat resistance of the thin film. The basic properties of the thin film are related to the temperature. The higher the temperature, the more the performance of the thin film will be affected. Determine the degree of change of each property of the thin film during the temperature change process, which will affect the heat resistance of the thin film.

[0097] Set the thin film temperature change parameters, the parameter range is [15, 60], the step size is 5, and collect various dimensional data of the thin film. That is, analyze the thin films corresponding to each temperature within the range. There is a corresponding sample thin film at each temperature, which can better control a single variable and exclude the data differences caused by the influence of the previous test temperature. Generally, the thin film is more likely to undergo structural changes at a relatively high temperature, and the low-temperature environment has a relatively small impact on the internal structure of the thin film. Therefore, the temperature range in the present invention is progressive from the normal temperature state to the high temperature.

[0098] Based on the first abnormal thin films, determine the heat resistance of the thin films according to the change of the practical performance of the thin films and the change of the uniformity of the thin films.

[0099] The calculation formula for the heat resistance U is:

[0100]

[0101] where e is the natural constant; is the derivative of the practical performance of the thin film with respect to the thin film temperature; H is the practical performance; T is the thin film temperature; K m is the thickness of the thin film; Min(K m ) is the minimum thin film thickness; Max(K m ) is the maximum thin film thickness; is the absolute value function of; is a custom activation window function.

[0102] The function of this custom activation window is that when the obtained value is near 0, its size is close to 1, and the farther away from 0, the closer its size approaches zero. This activation window will take a value of 0 around 0.5 and -0.5.

[0103] Among them, in this heat resistance performance formula is the derivative of the practical performance of the thin film with respect to the thin film temperature, that is, the magnitude of the slope of the practical performance H changing with the thin film temperature T. When the slope is 0, it means that the current practical performance no longer changes with the change of the thin film temperature. When the practical performance H is not related to the temperature change, it means that the practical performance of the thin film is not affected by the temperature at this time, further indicating that the heat resistance of the thin film is relatively excellent. Use the ratio of the minimum value to the maximum value of the uniformity of the thin film to judge whether the thin film flows during all current temperature change processes, and whether the uniformity of the thin film thickness changes.

[0104] Furthermore, compare the heat resistance performance of the thin film with the preset standard heat resistance performance to obtain multiple second abnormal thin films.

[0105] Specifically:

[0106] Subtract the preset standard heat resistance performance from the heat resistance performance of the thin film to obtain a first difference; the thin film corresponding to the first difference less than the preset difference threshold is a second abnormal thin film, and multiple second abnormal thin films are obtained. In the embodiment of the present invention, the preset difference threshold is 0.8. In other embodiments, the implementer can adjust this value according to the actual situation. The second abnormal thin film is a defective product with a heat resistance defect. Consider downgrading the second abnormal thin film or remelting it for re-manufacture.

[0107] Count the number of second abnormal thin films after the heat resistance test to determine the unqualified rate of the second detection. That is, the ratio of the number of first abnormal thin films to the number of second abnormal thin films is the second proportion, and this second proportion is the unqualified rate of the second detection. The second proportion can reflect the detection accuracy and error during the first detection.

[0108] Step S500: Obtain the heat resistance credibility based on the first ratio and the second ratio, and evaluate the production process of the film according to the magnitudes of the first ratio, the second ratio, and the heat resistance credibility.

[0109] Obtain the reliability of the heat resistance detection of the entire batch of films based on the first ratio and the second ratio.

[0110] The calculation formula for the heat resistance credibility C is as follows:

[0111] C = (1 - YTP1) 2 * (1 - YTP2)

[0112] Wherein, YTP1 is the first ratio; YTP2 is the second ratio.

[0113] Multiply the pass rates of the two detections. The reason for strengthening the weight of the pass rate of the first detection is to further strengthen the error factor of the first detection. Therefore, the possibility of error in the second detection is lower, so different weights are assigned. When the reliability is higher, it indicates that the current detection is more credible, that is, the detection errors in the previous and subsequent detections are relatively small, and the influence by humans is relatively small.

[0114] Determine the credibility of the current detection according to the magnitude of the reliability of the current detection. When the credibility is less than the preset credibility threshold, detect each production process or detection process; when the credibility is greater than the preset credibility threshold, make a further judgment on the detection process. In the embodiment of the present invention, the preset credibility threshold is 0.7.

[0115] Make a further judgment on the detection process. Specifically:

[0116] Case 1: If the error is too large, it will cause the unqualified rate detected in the first detection to be too high, that is, the first ratio is greater than the preset first threshold. Furthermore, when the second ratio is too low during the second detection, that is, the second ratio is less than the preset second threshold, it means that there are a large number of misjudgments in the first detection. In this case, the detection cost of the production party will increase, thereby affecting the final production efficiency. Therefore, detect the defect detection process and the production process. In the embodiment of the present invention, the value of the preset first threshold is 0.8, and the value of the preset second threshold is 0.2. In other embodiments, the implementer can adjust the value according to the actual situation.

[0117] Case 2: If the unqualified rate detected in the first detection is relatively large, that is, the first ratio is greater than the preset first threshold. At the same time, the unqualified rate detected in the second detection is also very large, that is, the second ratio is greater than the preset second threshold, it is considered that the implementer makes a wrong choice when selecting the lower limit of the heat resistance of the film, or there are problems with the production process and the defect detection process.

[0118] Case 3: If the unqualified rate detected for the first time is relatively small, that is, the first proportion is less than the preset first threshold, and at the same time, the unqualified rate detected for the second time is relatively large, that is, the second proportion is greater than the preset second threshold, then the current detection is relatively normal, and there is no need to check and evaluate the production process and the defect detection process.

[0119] Generate and output an evaluation report file based on the evaluation results of the production process of the thin film for computer visualization.

[0120] In summary, the embodiments of the present invention utilize digital data processing technology. This method uses emerging software and new information technology services to complete the evaluation of thin film defect detection and production processes. First, the initial unloading stiffness of the thin film indenter is obtained by means of computer assistance and sensors, and the elastic modulus of the thin film is obtained based on the initial unloading stiffness; the thin film stress, thin film thickness, and thin film uniformity are obtained; the thin film is stretched, and the warping degree of the edge of the stretched thin film is obtained; the practical performance of the thin film is obtained based on the warping degree, elastic modulus, and thin film stress; based on the practical performance, clustering is performed on multiple thin films to obtain an abnormal cluster group; the first proportion of the first abnormal thin film in the abnormal cluster group is obtained; based on the first abnormal thin film, the heat resistance of the thin film is determined according to the change in the practical performance of the thin film and the change in the thin film uniformity; the heat resistance of the thin film is compared with the preset standard heat resistance to obtain multiple second abnormal thin films; the ratio of the number of the first abnormal thin films to the number of the second abnormal thin films is the second proportion; the heat resistance credibility is obtained based on the first proportion and the second proportion, and the defect detection process and production process of the thin film tape are evaluated according to the magnitudes of the first proportion, the second proportion, and the heat resistance credibility. The embodiments of the present invention measure various conventional data of the thin film to determine the current practical performance of the thin film. According to the differences in the practical performance, the thin films within the batch are classified to distinguish normal and suspected defective thin films, and the first proportion of the first abnormal thin films is obtained. The first abnormal thin films are subjected to temperature detection to further determine the heat resistance of the thin film. If the heat resistance does not meet the standard, they are the second abnormal thin films, and at the same time, the second proportion of the second time is obtained. By comparing the first proportion and the second proportion, the problems in the current production or detection process are determined. The purpose of determining thin film anomalies and judging whether there are problems in the production process is achieved. Moreover, the evaluation results can also be generated into an evaluation report file in a computer-aided design manner for computer visualization.

[0121] The embodiments of the present invention also propose a heat resistance strength defect detection system for a waterproof thin film tape, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the above method are implemented. Since a heat resistance strength defect detection method for a waterproof thin film tape has been described in detail above, it will not be elaborated here.

[0122] It should be noted that: the above order of the embodiments of the present invention is only for description and does not represent the superiority or inferiority of the embodiments. And the above specific embodiments of this specification have been described. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve the desired result. Additionally, the processes depicted in the drawings do not necessarily require the particular order or sequential order shown to achieve the desired result. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0123] Each embodiment in this specification is described in a progressive manner. For the same or similar parts among the embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments.

[0124] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for detecting heat resistance strength defects of a waterproof film tape, characterized in that, The method includes the following steps: Obtain the initial unloading stiffness of the film indenter, and obtain the elastic modulus of the film according to the initial unloading stiffness; obtain the film stress, film thickness, and film uniformity; Stretch the film, and obtain the warping degree of the edge of the stretched film; obtain the practical performance of the film according to the warping degree, the elastic modulus, and the film stress; Based on the practical performance, cluster multiple films to obtain an abnormal cluster group; obtain the first proportion of the first abnormal film in the abnormal cluster group; Based on the first abnormal film, determine the heat resistance of the film according to the change of the practical performance of the film and the change of the film uniformity; compare the heat resistance of the film with the preset standard heat resistance to obtain multiple second abnormal films; the ratio of the number of the first abnormal films to the number of the second abnormal films is the second proportion; Obtain the heat resistance credibility according to the first proportion and the second proportion, and evaluate the production process of the film according to the magnitudes of the first proportion, the second proportion, and the heat resistance credibility; The obtaining of the warping degree of the edge of the stretched film includes: Stretch the film by two stretching methods, including stretching the film at fixed points on the wide side and stretching the film as a whole on the wide side; Based on stretching the film at fixed points on the wide side, place the stretched film on a plane, calculate the first warping distance between each pixel point on the film edge and the plane, and construct a first warping sequence; obtain the standard deviation, maximum range, and sequence mean of the first warping sequence; Based on stretching the film as a whole on the wide side, place the stretched film on a plane, calculate the second warping distance between each pixel point on the film edge and the plane, and construct a second warping sequence; obtain the variance of the second warping sequence; The calculation formula of the warping degree is: Wherein, Q is the warping degree; STD(d) is the standard deviation of the first warping sequence; Range(d) is the maximum range of the first warping sequence; mean(d) is the sequence mean of the first warping sequence; tanh(mean(d)) is the hyperbolic tangent function with the sequence mean of the first warping sequence as the independent variable; Var(d ′ ) is the variance of the second warping sequence; The obtaining of the practical performance of the film according to the warping degree, the elastic modulus, and the film stress includes: Obtain an exponential function with the natural constant as the base and the negative of the warping degree as the exponent; the product of the exponential function, the elastic modulus, and the film stress is the practical performance of the film; The determining of the heat resistance of the film according to the change of the practical performance of the film and the change of the film uniformity includes: Set the film temperature change parameters, with the parameter range being [15, 60] and the step size being 5, and collect various dimensional data of the film; Obtain the film temperature of the film; The calculation formula of the heat resistance is: Wherein, U is the heat resistance; e is the natural constant; is the derivative of the practical performance of the thin film with respect to the thin film temperature; H is the practical performance; T is the thin film temperature; K m is the thickness of the thin film; Min(K m ) is the minimum thin film thickness; Max(K m ) is the maximum thin film thickness; is the absolute value function of; is the custom activation window function; The obtaining of the heat resistance credibility according to the first proportion and the second proportion includes: The calculation formula of the heat resistance credibility is: C = (1 - YTP1) 2 * (1 - YTP2) Where C is the heat resistance credibility; YTP1 is the first proportion; YTP2 is the second proportion; The evaluating of the production process of the film according to the magnitudes of the first proportion, the second proportion, and the heat resistance credibility includes: When the heat resistance credibility is less than the preset credibility threshold, detect each production process; when the heat resistance credibility is greater than the preset credibility threshold, evaluate the production process; When the first proportion is greater than the preset first threshold and the second proportion is less than the preset second threshold, each production process is detected; when the first proportion is greater than the preset first threshold and the second proportion is greater than the preset second threshold, each production process is detected; when the first proportion is less than the preset first threshold and the second proportion is greater than the preset second threshold, each production process is normal.

2. The method for detecting heat resistance strength defects of a waterproof film tape according to claim 1, characterized in that, The method for detecting heat resistance strength defects of a waterproof film tape further includes: generating and outputting an evaluation report file based on the evaluation results of the production process of the film for computer visualization.

3. The method for detecting heat resistance strength defects of a waterproof film tape according to claim 1, characterized in that, Based on the practical performance, clustering multiple films to obtain an abnormal cluster group, including: Based on the practical performance, using the K-Means clustering algorithm to cluster multiple films to obtain multiple cluster groups; Obtain the cluster centroids of each of the cluster groups, and calculate the average distance from each point in the cluster group to the cluster centroid; the cluster group corresponding to the maximum average distance is the abnormal cluster group.

4. The method for detecting heat resistance strength defects of a waterproof film tape according to claim 1, characterized in that, Comparing the heat resistance performance of the film with the preset standard heat resistance performance to obtain multiple second abnormal films, including: Subtracting the preset standard heat resistance performance from the heat resistance performance of the film to obtain a first difference; the film corresponding to the first difference less than the preset difference threshold is the second abnormal film.

5. A heat resistance strength defect detection system for a waterproof film tape, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 4.

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