A semiconductor chip packaging component

Abstract

The present invention discloses a semiconductor chip packaging component, comprising: a semiconductor chip, a metal lead frame, a flexible high-temperature resistant insulating flexible board, a metal lead line, and a plastic package body. The metal lead frame includes a base island and metal pins, and the metal pins are located outside the base island. The semiconductor chip is fixedly connected to the base island, and a plurality of pads are provided on the semiconductor chip. A number of non-intersecting grooves are formed inside the flexible high-temperature resistant insulating flexible board. The metal lead line is installed in the groove. Each end of the metal lead line has an exposed connecting portion, and the connecting portion includes a first connecting portion and a second connecting portion. The first connecting portion is connected to the semiconductor chip, and the second connecting portion is connected to the metal pin. During the subsequent bonding process, only one connection is required to simultaneously connect all the metal lead lines, and it can also prevent the generation of arcs due to the metal lead lines being too close or short circuits caused by the metal lead lines touching each other, so as to achieve the bonding of higher-density metal lead lines.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, and particularly relates to a semiconductor chip packaging component. Background Art

[0002] As Figure 21 、 22 shown, in the traditional semiconductor chip packaging process, the semiconductor chip is generally first fixedly placed above the chip carrier area (commonly known as the base island) of the metal lead frame or the organic substrate through conductive glue or non-conductive glue, and then the semiconductor chip is bonded to the corresponding pins of the metal lead frame or the organic substrate by wire bonding of metal wires. After that, through the process of encapsulation with encapsulant, a component that can protect the semiconductor chip is formed. For the encapsulation structure of each object and interface of the semiconductor chip, the metal pins extended from the encapsulant are interconnected and soldered to the PCB (printed circuit board) outside the encapsulant.

[0003] In the entire packaging process of the semiconductor chip, wire bonding of metal wires plays the function of transmitting power supply and signals between the chip inside the encapsulant and the outside of the encapsulant. Whether it is a digital chip, a memory chip, a power management chip, a control and drive chip, or a power electronics power stage chip, in the traditional chip packaging technology, the bare chip is bonded and interconnected with the metal pins outside the bare chip through metal wires. However, wire bonding of metal wires requires one metal wire at a time, and is bonded successively under the conditions of temperature, time, and pressure. Especially for digital function or memory chips, there are often hundreds or even hundreds of metal wires that need to be bonded. As a result, the following common defects will occur, which are also the difficulties that need to be overcome in the global traditional semiconductor chip packaging industry:

[0004] 1. The large number of metal wires leads to low production efficiency and invisibly increases the production cost.

[0005] 2. When the metal wire density is high and the length is long, if the distance is slightly close, it is easy to cause interference between the signals or electrical properties of different metal wires, and the distance between metal wires is determined according to the magnitude of the voltage.

[0006] The more and longer the metal wires are, the weaker the structural support force carried by the metal wires will be, and in the process of plastic packaging, it is easy to cause poor wire arcs, collapse, or short circuits due to mutual contact between wires.

[0007] A flexible and high-temperature-resistant printed circuit board (FPC) is a printed circuit made of a flexible and high-temperature-resistant insulating substrate. The flexible and high-temperature-resistant printed circuit board provides excellent electrical capabilities, can meet the design requirements of smaller and higher-density installations, and also helps to reduce assembly processes and enhance reliability. The flexible and high-temperature-resistant printed circuit board is a better solution to meet the requirements of thin and highly malleable electronic products. The flexible and high-temperature-resistant printed circuit board can be freely bent, wound, and folded, can withstand millions of dynamic bends without damaging the wires, can be arranged arbitrarily according to the spatial layout requirements, and can move and stretch arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection; the flexible and high-temperature-resistant printed circuit board can greatly reduce the volume and weight of electronic products, meet the needs of the development of electronic products towards high density, thinness, and high reliability. The flexible and high-temperature-resistant printed circuit board (FPC) also has the advantages of good heat dissipation, solderability, easy assembly, and relatively low comprehensive cost. Summary of the Invention

[0008] The purpose of the present invention is to provide a semiconductor chip packaging component to solve the following technical problems:

[0009] 1. In the prior art, each time only the bonding of a single metal lead wire can be achieved, and when there are many lead wires for connecting the semiconductor chip and the metal pins, the bonding time will be very long;

[0010] 2. During the bonding of metal lead wires, due to the large number and long length of the metal lead wires, it is easy for the distances between the metal lead wires to be too close. When the semiconductor chip is operating, an arc will be generated due to the too-close distance between the metal lead wires, or the lead wires will come into contact with each other to cause a short circuit, making it difficult to achieve high-density lead wire bonding.

[0011] To achieve the above purpose, the present invention provides a semiconductor chip packaging component, including:

[0012] A metal lead frame, the metal lead frame includes a base island and metal pins, and the metal pins are located outside the base island;

[0013] A semiconductor chip, the semiconductor chip is fixedly connected to the base island, and a plurality of pads for connecting the semiconductor chip to the outside are provided on the semiconductor chip;

[0014] A flexible high-temperature-resistant insulating flexible board, and a number of non-intersecting grooves are provided inside the flexible high-temperature-resistant insulating flexible board;

[0015] A metal lead line, which is made of a conductive material and is installed in the groove; both ends of the metal lead line have a connecting portion exposed from one side of the flexible high-temperature resistant insulating flexible board. The connecting portion includes a first connecting portion and a second connecting portion. The first connecting portion is used to connect the semiconductor chip, and the second connecting portion is used to connect the metal pin;

[0016] And a plastic package body, which covers the semiconductor chip, the metal lead frame, the flexible high-temperature resistant insulating flexible board, and the metal lead line, and at least exposes the end of the metal pin that is not connected to the metal lead line outside the plastic package body.

[0017] Furthermore, a first bump is provided on the pad of the semiconductor chip or the first connecting portion of the metal lead line;

[0018] A second bump is provided on the portion of the metal pin that needs to be bonded or the second connecting portion of the metal lead line.

[0019] As a further solution of the present invention, a first bump is provided on one of the portions where the semiconductor chip needs to be bonded and the connecting portion of the conductive metal lead line for connection;

[0020] A second bump is provided at one of the portions where the metal pin needs to be bonded and the connecting portion of the conductive metal lead line for connection to the metal pin.

[0021] Furthermore, the metal lead line is equal in length to the flexible high-temperature resistant insulating flexible board. The end faces of the first connecting portion and the second connecting portion are not surrounded and sealed by the flexible high-temperature resistant insulating flexible board. A notch is respectively opened directly below the connecting portion on the same side of the flexible high-temperature resistant insulating flexible board. The first connecting portion and the second connecting portion are bonded to the semiconductor chip and the metal pin through the notch.

[0022] Furthermore, a third bump is respectively provided on the connecting portion at the notch.

[0023] Furthermore, the metal lead line is equal in length to the flexible high-temperature resistant insulating flexible board. The end faces of the first connecting portion and the second connecting portion are surrounded and sealed by the flexible high-temperature resistant insulating flexible board. A window is respectively opened directly below the connecting portion on the same side of the flexible high-temperature resistant insulating flexible board. The first connecting portion and the second connecting portion are bonded to the semiconductor chip and the metal pin through the window.

[0024] Furthermore, a fourth bump is respectively provided on the connecting portion at the window.

[0025] Further, a plurality of the flexible high-temperature resistant insulating flexible boards are stacked on top of each other, and a plurality of the first connecting portions and the second connecting portions are exposed from the sides of the plurality of flexible high-temperature resistant insulating flexible boards.

[0026] Further, a vacancy portion is formed in the middle of the flexible high-temperature resistant insulating flexible board, and the vacancy portion is used for placing the semiconductor chip that needs to be bonded on multiple sides. A plurality of non-intersecting grooves are formed inside the flexible high-temperature resistant insulating flexible board around the vacancy portion.

[0027] Further, a plurality of material guiding holes are formed in the flexible high-temperature resistant insulating flexible board, avoiding the metal lead wire circuit portions. The encapsulant can enter the lower part covered by the flexible high-temperature resistant insulating flexible board through the material guiding holes.

[0028] Advantages of the present invention:

[0029] The grooves are pre-formed in the flexible high-temperature resistant insulating flexible board, and the conductive metal lead wire circuits are placed in the grooves, so that the middle part of the conductive metal lead wire circuits is inside the flexible high-temperature resistant insulating flexible board, and a small part of each end is exposed to be connected to the semiconductor chip and the metal pins. The metal lead wire circuits can be pre-formed inside the flexible high-temperature resistant insulating flexible board, and the number can be adjusted according to actual needs; during the subsequent bonding process, only one connection is required to achieve the simultaneous connection of all metal lead wire circuits, improving the bonding efficiency; the flexible high-temperature resistant insulating flexible board itself uses polyimide or polyester film as the base material, having good insulation effect, which can effectively avoid the situation that due to the large number of metal lead wire circuits, the distance between the metal lead wire circuits is too close to generate arc, or the metal lead wire circuits contact each other to generate short circuit, and high-density metal lead wire circuit bonding can be realized. Description of the drawings

[0030] Figure 1 It is a top view schematic diagram of the metal lead wire circuit bonding structure of the present invention;

[0031] Figure 2 It is a front view schematic diagram of the metal lead wire circuit bonding structure of the present invention;

[0032] Figure 3 It is a top view schematic diagram of the structure with an extension portion provided on the metal lead wire circuit of the present invention;

[0033] Figure 4 It is a top view schematic diagram of the metal lead bonding structure with bumps formed on the semiconductor chip and the metal pins of the present invention;

[0034] Figure 5 It is a top view schematic diagram of the metal lead bonding structure with bumps formed on the connection portion of the metal lead wire circuit of the present invention;

[0035] Figure 6Front view schematic diagram of the metal wire bonding structure with bumps formed on the semiconductor chip and the second connection part of the present invention;

[0036] Figure 7 Front view schematic diagram of the metal wire bonding structure with bumps formed on the metal pin and the first connection part of the present invention;

[0037] Figure 8 Front view cross-sectional schematic diagram of the structure of the single-layer flexible high-temperature resistant insulating flexible board with a notch formed in the present invention;

[0038] Figure 9 Front view cross-sectional schematic diagram of the structure with bumps formed at the notch in the present invention;

[0039] Figure 10 Front view cross-sectional schematic diagram of the structure of the single-layer flexible high-temperature resistant insulating flexible board with a window formed in the present invention;

[0040] Figure 11 Front view cross-sectional schematic diagram of the structure with bumps formed at the window in the present invention;

[0041] Figure 12 Three-dimensional schematic diagram of the structure of the multi-layer flexible high-temperature resistant insulating flexible board stacked up and down in the present invention;

[0042] Figure 13 Top view cross-sectional schematic diagram of the cross-line bonding structure in the present invention;

[0043] Figure 14 Front view schematic diagram of the structure with a height difference at the part where the metal wire lines are connected in the present invention;

[0044] Figure 15 Top view schematic diagram of the structure where the periphery of the vacant part can be encapsulated in the present invention;

[0045] Figure 16 Top view schematic diagram of the structure where both sides of the vacant part can be encapsulated in the present invention;

[0046] Figure 17 Top view schematic diagram of the structure where three sides of the vacant part can be encapsulated in the present invention;

[0047] Figure 18 Front view cross-sectional schematic diagram of the semiconductor chip stacking structure in the present invention;

[0048] Figure 19 Front view cross-sectional schematic diagram of the structure with a heat dissipation plate arranged on the flexible high-temperature resistant insulating flexible board in the present invention;

[0049] Figure 20 Top view schematic diagram of the structure of the flexible high-temperature resistant insulating flexible board with a material guiding hole opened in the present invention;

[0050] Figure 21 Front view cross-sectional schematic diagram of the prior art mosfet packaging structure;

[0051] Figure 22 It is a schematic top-down sectional view of an existing MOSFET package structure.

[0052] In the figure: 1. Semiconductor chip; 2. Metal lead frame; 21. Base island; 22. Metal pin; 3. Metal lead line; 31. First connection part; 32. Second connection part; 33. Extension part; 4. Flexible high-temperature resistant insulating flexible board; 5. Plastic package; 6. First bump; 7. Second bump; 8. Notch; 9. Third bump; 10. Window opening; 11. Fourth bump; 12. Vacant part; 13. Feeding hole; 14. Heat sink. Specific embodiments

[0053] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0054] As Figures 1 - 20 shown, the present invention discloses a semiconductor chip packaging component, which includes: a semiconductor chip 1, a metal lead frame 2, a flexible high-temperature resistant insulating flexible board 4, a metal lead line 3, and a plastic package 5;

[0055] Multiple pads (not shown in the drawings) for connecting the semiconductor chip 1 to the outside are provided on the semiconductor chip 1. The pads are located on at least one side of the surface of the semiconductor chip 1. The metal lead frame 2 includes a base island 21 and metal pins 22. The base island 21 is used to fix the semiconductor chip 1, and the metal pins 22 are used to connect the semiconductor chip 1 fixed on the base island 21 to an external circuit. The metal pins 22 are located around the base island 21. The metal lead frame 2 serves as a carrier for the semiconductor chip 1 and acts as a bridge to connect the semiconductor chip 1 to an external circuit. The flexible high-temperature resistant insulating flexible board 4 has a number of non-intersecting grooves formed inside. A single-layer flexible high-temperature resistant insulating flexible board 4 with a thickness of 10 - 40 μm is made of materials such as polyimide and polyester film that have flexibility and good insulation performance. The grooves are formed by existing processes and will not be elaborated here. The metal lead lines 3 are made of materials with good electrical conductivity such as copper, palladium copper, silver, and gold. The metal lead lines 3 are pre-installed in the grooves of the flexible high-temperature resistant insulating flexible board 4 by existing processes. The flexible high-temperature resistant insulating flexible board 4 itself uses polyimide or polyester film as the base material and has a good insulation effect, which can effectively avoid problems such as arcing caused by the proximity of the metal lead lines 3 or short circuits caused by the contact of the metal lead lines 3 due to the large number of metal lead lines 3, and can achieve high-density bonding of the metal lead lines 3. Both ends of the metal lead lines 3 have a connecting portion exposed from one side of the flexible high-temperature resistant insulating flexible board 4. The connecting portion includes a first connecting portion 31 and a second connecting portion 32. The flexible high-temperature resistant insulating flexible board 4 with the metal lead lines 3 inside is placed between the semiconductor chip 1 and the metal pins 22. The first connecting portion 31 connects the pads on the semiconductor chip 1, and the second connecting portion 32 connects the metal pins 22. By the above method, only one connection is required to simultaneously connect all the metal lead lines 3, improving the bonding efficiency. As Figure 3 shown, when the connecting portion of the metal lead lines 3 is directly connected to the semiconductor chip 1 and the metal pins 22, an extension portion 33 can be pre-formed on the connecting portion of the metal lead lines 3 to increase the connection stability between the connecting portion and the semiconductor chip 1 and the metal pins 22.

[0056] Since each bonding area on the semiconductor chip 1 has a specific function, if a conventional semiconductor chip 1 is used for flip-chip mounting, the semiconductor chip needs to be flipped 180°, and the electrical performance is completely changed. Most conventional semiconductor chips 1 use face-up mounting, that is, the method used in the present invention, which can be adapted to the use of more semiconductor chip models 1.

[0057] After bonding, the semiconductor chip 1, the metal lead frame 2, the flexible high-temperature resistant insulating flexible board 4, and the metal lead lines 3 are encapsulated with a plastic package 5, and at least one end of the metal pins 22 that is not connected to the second connecting portion 32 is exposed outside the plastic package 5 for easy connection to an external circuit.

[0058] As shown Figures 4 - 7 In an embodiment of the present invention, as shown, a first bump 6 is provided on the pad of the semiconductor chip 1 or the first connection portion 31 of the metal lead line 3, and at the same time, a second bump 7 is provided at the bonding portion of the metal pin 22 or the second connection portion 32 of the metal lead line 3, which can make the connection between the metal lead line 3, the semiconductor chip 1 and the metal pin 22 more convenient. The specific setting situations are as follows:

[0059] Form 1: A plurality of first bumps 6 are formed on the pads of the semiconductor chip 1, and a plurality of second bumps 7 are formed at the bonding portions of the metal pins 22 that need to be bonded;

[0060] Form 2: A plurality of first bumps 6 are formed on the first connection portion 31 of the metal lead line 3, and a plurality of second bumps 7 are formed on the second connection portion 32 of the metal lead line 3;

[0061] Form 3: A plurality of first bumps 6 are formed on the pads of the semiconductor chip 1, and a plurality of second bumps 7 are formed on the second connection portion 32 of the metal lead line 3,

[0062] Form 4: A plurality of first bumps 6 are formed on the first connection portion 31 of the metal lead line 3, and a plurality of second bumps 7 are formed at the bonding portions of the metal pins 22 that need to be bonded;

[0063] Taking Form 1 as an example, the formation method of the bumps is introduced:

[0064] The material of the bumps can be prepared from conductive materials such as tin, copper, palladium copper, silver, and gold. The bumps can be formed by means such as 3D printing, ball planting, and etching. The height of the bumps is selected according to actual needs.

[0065] During the selection of 3D printing, a micron-level 3D printing device is selected, and the printing material is selected as copper or palladium copper; when the ball planting process is selected, a wire bonding machine is used for ball planting, and by pre-adjusting the parameters, the material is selected as silver or gold; after the bumps are formed, a connection material (solder paste or conductive adhesive) can be applied to the bump portion and / or its surrounding portion as a connection medium layer; after the metal lead line 3 contacts the first bump 6 and the second bump 7, by pressing down, the first bump 6 and the second bump 7 are respectively connected to the metal lead line 3; when the medium layer uses solder paste, it is subsequently placed in a reflow soldering furnace for reflow soldering and curing, and when the medium layer uses conductive adhesive, it is cured by drying;

[0066] The method of forming bumps on the metal lead line 3 is similar to the above 3D printing and ball planting methods, and the formation height of the bumps is slightly greater than, equal to, or slightly less than the thickness of the single-layer flexible high-temperature resistant insulating soft board 4.

[0067] It should be emphasized that when forming bumps with materials such as tin and lead-tin, since their melting temperatures are lower than that of the single-layer flexible high-temperature resistant insulating soft board 4, after the bumps are connected and contacted with the metal lead lines 3, the tin bumps can be melted by direct heating to achieve connection. In this case, the height of the bumps should be slightly greater than or equal to that of the single-layer flexible high-temperature resistant insulating soft board 4.

[0068] As Figure 8 , 9 shown, as an embodiment of the present invention, the length of the metal lead lines 3 is equal to that of the flexible high-temperature resistant insulating soft board 4. The end faces of the first connection part 31 and the second connection part 32 are not surrounded and sealed by the flexible high-temperature resistant insulating soft board 4. A notch 8 is respectively opened directly below the connection parts on the same side of the flexible high-temperature resistant insulating soft board 4. The first connection part 31 and the second connection part 32 are bonded to the semiconductor chip 1 and the metal pin 22 through the notch 8. As Figure 9 shown, a third bump 9 can be further provided on the connection part at the notch 8. The third bump 9 is more convenient for the connection part to be bonded to the semiconductor chip 1 and the metal pin 22, improving the application range and practicability of the present invention.

[0069] As Figure 10 , 11 shown, as an embodiment of the present invention, the length of the metal lead lines 3 is equal to that of the flexible high-temperature resistant insulating soft board 4. The end faces of the first connection part 31 and the second connection part 32 are surrounded and sealed by the flexible high-temperature resistant insulating soft board 4. A window 10 is respectively opened directly below the connection parts on the same side of the flexible high-temperature resistant insulating soft board 4. The first connection part 31 and the second connection part 32 are bonded to the semiconductor chip 1 and the metal pin 22 through the window 10. As Figure 11 shown, a fourth bump 11 is respectively provided on the connection part at the window 10, improving the application range and practicability of the present invention.

[0070] As Figures 12 - 14 shown, as an embodiment of the present invention, multiple flexible high-temperature resistant insulating soft boards 4 are stacked up and down, and multiple first connection parts 31 and second connection parts 32 are exposed from the sides of the multiple flexible high-temperature resistant insulating soft boards 4. For some semiconductor chips 1, during the packaging process, there will be situations of cross-wiring and / or height differences. When encountering cross-wiring and / or height differences, the flexible high-temperature resistant insulating soft board 4 can be set in multiple layers, and metal lead lines 3 are arranged between different layers to separate the metal lead lines 3 from each other, so that cross-wiring and / or height difference bonding can be achieved simultaneously.

[0071] As Figures 15 - 19As shown, as an embodiment of the present invention, a void portion 12 is provided in the middle of the flexible high-temperature resistant insulating flexible board 4. The void portion 12 is used to place at least the semiconductor chips 1 that need to be bonded on both sides. Taking the semiconductor chip 1 or the digital semiconductor chip 1 as an example, generally, multiple parts of the semiconductor chip 1 need to be bonded to different metal pins 22. Many semiconductor chips 1 also need to bond metal lead lines 3 on the outer peripheral part of the semiconductor chip 1. The metal lead lines 3 adapted to the semiconductor chip 1 can be preset in the flexible high-temperature resistant insulating flexible board 4 around the void portion 12 to adapt to the situation where the semiconductor chip 1 needs to be connected to the metal pins 22 on all four sides, three sides or two sides; as Figure 18 shown, when forming the package body, the upper part of the flexible high-temperature resistant insulating flexible board 4 can be exposed. The exposed part can be connected to another semiconductor chip 1. When connecting another semiconductor chip 1, a stacked structure can be formed. And due to the good flexibility of the flexible high-temperature resistant insulating flexible board 4, different semiconductor chips 1 can be stacked and packaged; as Figure 19 shown, it can also be connected to the heat dissipation plate 14. When connecting the heat dissipation plate 14, the overall heat dissipation performance after packaging can be enhanced.

[0072] As Figure 20 shown, as an embodiment of the present invention, in order to enable the plastic package 5 to better enter the lower part covered by the flexible high-temperature resistant insulating flexible board 4, a plurality of material guiding holes 13 are provided in the part of the flexible high-temperature resistant insulating flexible board 4 that avoids the metal lead lines 3; for the flexible high-temperature resistant insulating flexible board 4 with raised bonding, it is preferably to form the material guiding holes 13 at the raised part. For the connection mode composed of double-layer or multi-layer flexible high-temperature resistant insulating flexible boards 4, the material guiding holes 13 can be formed by etching after overall forming, or the material guiding holes 13 can be formed on the prefabricated single-layer flexible high-temperature resistant insulating flexible board 4.

[0073] In all embodiments, the shape of the flexible high-temperature resistant insulating flexible board 4 can be designed according to requirements; each hole, groove, notch, bump, etc. can also be set into the required shape according to actual requirements.

[0074] The working principle of the present invention:

[0075] Referring to the accompanying drawings of the specification, a groove is pre-opened in the flexible high-temperature resistant insulating flexible board 4, and the metal lead line 3 is placed in the groove, so that the middle part of the metal lead line 3 is inside the flexible high-temperature resistant insulating flexible board 4. Each end of the metal lead line 3 has a connecting part exposed from one side of the flexible high-temperature resistant insulating flexible board 4. The connecting part includes a first connecting part 31 and a second connecting part 32. The semiconductor chip 1 is fixedly connected to the base island 21 of the metal lead frame 2. The pre-fabricated flexible high-temperature resistant insulating flexible board 4 is placed between the semiconductor chip 1 and the metal pin 22. The first connecting part 31 is connected to the pad on the semiconductor chip 1, and the second connecting part 32 is connected to the metal pin 22. By the above method, only one connection is required to simultaneously connect all the metal lead lines 3, improving the bonding efficiency. The flexible high-temperature resistant insulating flexible board 4 itself uses polyimide or polyester film as the base material, has good insulation effect, and can effectively avoid the situation that due to the large number of metal lead lines 3, the distance between the metal lead lines 3 is too close to generate an arc, or the metal lead lines 3 contact each other to generate a short circuit, and can achieve high-density metal lead line bonding.

[0076] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, as well as a specific orientation structure and operation. Therefore, it cannot be understood as a limitation of the invention. In addition, "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0077] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor chip packaging component, characterized in that, Including: A metal lead frame (2), the metal lead frame (2) includes a base island (21) and metal pins (22), and the metal pins (22) are located outside the base island (21); A semiconductor chip (1), the semiconductor chip (1) is fixedly connected to the base island (21), and a plurality of pads for connecting the semiconductor chip (1) to the outside are provided on the semiconductor chip (1); A flexible high-temperature resistant insulating flexible board (4), and a number of non-intersecting grooves are formed inside the flexible high-temperature resistant insulating flexible board (4); A metal lead line (3), the metal lead line (3) is made of a conductive material, and the metal lead line (3) is installed in the groove; both ends of the metal lead line (3) have a section exposed from the side surface of the flexible high-temperature resistant insulating flexible board (4) to form a connection part, the connection part includes a first connection part (31) and a second connection part (32), the first connection part (31) is used to connect the semiconductor chip (1), and the second connection part (32) is used to connect the metal pin (22); And a plastic package body (5), the plastic package body (5) covers the semiconductor chip (1), the metal lead frame (2), the flexible high-temperature resistant insulating flexible board (4), and the metal lead line (3), and at least one end of the metal pin (22) that is not connected to the second connection part (32) is exposed outside the plastic package body (5).

2. The semiconductor chip packaging component according to claim 1, characterized in that A first bump (6) is provided on the pad of the semiconductor chip (1) or the first connection part (31) of the metal lead line (3); A second bump (7) is provided on the portion of the metal pin (22) that needs to be bonded or the second connection part (32) of the metal lead line (3).

3. The semiconductor chip packaging component according to claim 1, characterized in that The metal lead line (3) is equal in length to the flexible high-temperature resistant insulating flexible board (4), the end faces of the first connection part (31) and the second connection part (32) are not surrounded and sealed by the flexible high-temperature resistant insulating flexible board (4), and a notch (8) is respectively opened directly below the connection part on the same side of the flexible high-temperature resistant insulating flexible board (4), and the first connection part (31) and the second connection part (32) are bonded to the semiconductor chip (1) and the metal pin (22) through the notch (8).

4. A semiconductor chip packaging component according to claim 3, characterized in that, A third bump (9) is respectively provided on the connection part at the notch (8).

5. The semiconductor chip packaging component according to claim 1, characterized in that The metal lead line (3) has the same length as the flexible high-temperature resistant insulating flexible board (4). The end faces of the first connecting portion (31) and the second connecting portion (32) are surrounded and sealed by the flexible high-temperature resistant insulating flexible board (4). A window (10) is respectively opened directly below the connecting portion on the same side of the flexible high-temperature resistant insulating flexible board (4). The first connecting portion (31) and the second connecting portion (32) are bonded to the semiconductor chip (1) and the metal pin (22) through the window (10).

6. A semiconductor chip packaging component according to claim 5, characterized in that, A fourth bump (11) is respectively arranged on the connecting portion at the window (10).

7. A semiconductor chip packaging component according to claim 1, wherein A plurality of the flexible high-temperature resistant insulating flexible boards (4) are stacked up and down, and a plurality of the first connecting portions (31) and the second connecting portions (32) are exposed from the side surfaces of the plurality of flexible high-temperature resistant insulating flexible boards (4).

8. A semiconductor chip packaging component according to claim 1, wherein A vacancy portion (12) is opened in the middle of the flexible high-temperature resistant insulating flexible board (4), and the vacancy portion (12) is used for placing the semiconductor chips (1) that need to be bonded on at least two sides.

9. A semiconductor chip packaging component according to any one of claims 1-8, characterized in that, A plurality of material guiding holes (13) are opened on the flexible high-temperature resistant insulating flexible board (4) at a position avoiding the metal lead line (3). The plastic package (5) can enter the lower part covered by the flexible high-temperature resistant insulating flexible board (4) through the material guiding holes (13).

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