Core boards and printed circuit boards

Abstract

The present application provides a core board and a printed circuit board. The core board includes a substrate and a conductive layer laid on the substrate. The conductive layer includes at least one positioning area, which includes an indicator area and a circular punching area. The indicator area is arranged around the outside of the punching area and is provided with multiple indicator slots. Each indicator slot includes an indicator portion that points to the center of the punching area. The punching area is used to form positioning holes. This application can solve the problem of substrate damage or positioning hole offset when punching holes in the core board.

Description

Technical Field

[0001] The present application relates to the field of electronic products, and in particular to core boards and printed circuit boards. Background Art

[0002] A printed circuit board (PCB) is an electronic component that replaces complex wiring to achieve electrical connections between components in a circuit. The use of PCBs not only simplifies the assembly and soldering of electronic equipment, reducing the wiring workload compared to traditional methods and significantly reducing worker labor, but also reduces the overall size of the equipment, lowering equipment costs and improving the quality and reliability of electronic equipment.

[0003] Common multilayer printed circuit boards are typically formed by laminating multiple core boards together. The core boards include a substrate and a conductive layer laid on the substrate. The core boards also have positioning holes formed on them. When the multiple core boards are laminated together to form the printed circuit board, the multiple positioning holes on the multiple core boards are aligned, thereby providing positioning during the lamination process. When punching holes in the core boards to form the positioning holes, it is usually necessary to remove a portion of the copper sheet on the core boards to expose the substrate, which serves as a guide. Holes are then punched in the exposed substrate to form the positioning holes.

[0004] When drilling holes in the core board to form positioning holes, uneven force will be applied to the substrate after the conductive layer is removed, which may cause damage to the core board substrate or displacement of the positioning holes. Summary of the Invention

[0005] The embodiments of the present application provide a core board and a printed circuit board to solve the problem of base material damage or positioning hole offset in the core board when punching holes in the core board.

[0006] The core board provided in the embodiment of the present application includes a substrate and a conductive layer laid on the substrate;

[0007] The conductive layer includes at least one positioning area, which includes an indication area and a circular punching area; the indication area is arranged on the outside of the punching area, and a plurality of indication grooves are arranged in the indication area, each of the indication grooves includes an indication portion, and the indication portion points to the center of the punching area; the punching area is used to form a positioning hole.

[0008] By adopting the above technical solution, when the core board is punched to form a positioning hole on the core board, the indicating portion of the multiple indicating grooves arranged in the indicating area plays a certain positioning role, so that the position of the center of the punching area is more accurate, and it is possible to punch holes on the substrate covered with a conductive layer corresponding to the punching area, so that the force on the substrate is more uniform, reducing the possibility of damage to the substrate at the edge of the positioning hole or offset of the positioning hole.

[0009] It is further configured that the indicator groove further includes a positioning portion, and the positioning portion is connected to the indicator portion;

[0010] Taking the parallel plane of the plane where the substrate is located as the cross-section, the cross-section of the indicating portion and the cross-section of the positioning portion are both rectangular, and the indicating portion extends radially along the punching area; the positioning portion is arranged on the side of the indicating portion away from the punching area, and the extension direction of the positioning portion is perpendicular to the extension direction of the indicating portion.

[0011] It is further configured that the length of the indicator portion is greater than or equal to 0.4 mm and less than or equal to 0.6 mm, and the width of the indicator portion is greater than or equal to 0.16 mm and less than or equal to 0.24 mm;

[0012] And / or, the length of the positioning portion is greater than or equal to 0.4 mm and less than or equal to 0.6 mm, and the width of the positioning portion is greater than or equal to 0.16 mm and less than or equal to 0.24 mm.

[0013] It is further configured that a preset distance is provided between a side of each indicating portion away from the positioning portion and the punching area.

[0014] It is further configured that the preset distance is greater than or equal to 0.16 mm.

[0015] It is further configured that the plurality of indicator grooves are evenly arranged along the circumference of the punching area.

[0016] It is further configured that, within the plane where the substrate is located, the positioning area is square, and the side length of the positioning area is greater than or equal to 3.2 mm and less than or equal to 4.8 mm.

[0017] It is further configured that the positioning hole is provided in the punching area, and in the plane where the substrate is located, the center of the positioning hole is set as the center of the punching area.

[0018] It is further configured that the conductive layer is provided on both the first surface and the second surface of the substrate, and the positioning area provided on the first surface of the substrate is provided corresponding to the positioning area provided on the second surface of the substrate.

[0019] An embodiment of the present application further provides a printed circuit board, comprising a plurality of the core boards described above, wherein the plurality of core boards are spaced apart along a first direction, and the plurality of positioning areas arranged on the plurality of core boards are arranged relative to each other.

[0020] By adopting the above technical solution, when the core board is punched to form a positioning hole on the core board, the indicating portion of the multiple indicating grooves arranged in the indicating area plays a certain positioning role, so that the position of the center of the punching area is more accurate, and it is possible to punch holes on the substrate covered with a conductive layer corresponding to the punching area, so that the force on the substrate is more uniform, reducing the possibility of damage to the substrate at the edge of the positioning hole or offset of the positioning hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0022] Figure 1 A schematic diagram of the structure of the core plate provided in an embodiment of the present application;

[0023] Figure 2 A cross-sectional view of a core plate provided in an embodiment of the present application;

[0024] Figure 3 A cross-sectional view of a printed circuit board provided in an embodiment of the present application.

[0025] Description of reference numerals:

[0026] 1. Base material; 2. Conductive layer; 21. Positioning area; 211. Indicating area; 2111. Indicating groove; 21111. Indicating portion; 21112. Positioning portion; 212. Punching area; 2121. Positioning hole; 3. Prepreg.

[0027] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0028] As described in the background, when drilling holes in a core board, it is usually necessary to remove a portion of the copper sheet on the core board to expose the substrate, which can then serve as a guide. Then, holes are drilled in the substrate after the copper sheet has been removed to form the positioning holes. However, when drilling holes in the substrate to form positioning holes in the core board, the exposed substrate may experience uneven force. In particular, when the substrate is thin, the substrate at the edge of the positioning hole may be damaged, or the positioning hole may be offset.

[0029] In order to solve the above technical problems, the embodiments of the present application provide a core board and a printed circuit board, wherein a positioning area including an indication area and a punching area is provided on the core board, and a plurality of indication grooves are provided in the indication area, so that when the core board is punched and positioning holes are formed on the core board, the indication parts of the plurality of indication grooves provided in the indication area can play a certain positioning role in the position of the punching area, thereby making the position of the center of the punching area more accurate, and being able to punch holes on the substrate covered with a conductive layer corresponding to the punching area, so that the force on the substrate is more uniform, reducing the possibility of damage to the substrate at the edge of the positioning hole or displacement of the positioning hole.

[0030] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0031] The following specific embodiments describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0032] Reference Figure 1 and Figure 2 , an embodiment of the present application provides a core board, including a substrate 1 and a conductive layer 2 laid on the substrate 1; the conductive layer 2 includes at least one positioning area 21, the positioning area 21 includes an indication area 211 and a circular punching area 212; a plurality of indication grooves 2111 are provided in the indication area 211, and each indication groove 2111 includes an indication portion 21111 and a positioning portion 21112, the indication portion 21111 is connected to the positioning portion 21112, and the indication portion 21111 points to the center of the punching area 212; the punching area 212 is used to form a positioning hole 2121.

[0033] It is easy to understand that the structure of the conductive layer 2 can be adjusted according to actual conditions, so that the core board can be suitable for printed circuit boards with different requirements. For example, the conductive layer 2 can be arranged on the first and second surfaces of the substrate 1 at the same time, that is, on both sides of the substrate 1, or it can be arranged only on the first or second surface of the substrate 1, that is, on one of the two sides of the substrate 1. This application does not impose further restrictions on this.

[0034] As for the material of the conductive layer 2, illustratively, the conductive layer 2 is made of a metal material, such as copper, and the thickness of the conductive layer 2 can be adjusted according to actual conditions. For example, in an embodiment of the present application, the thickness of the substrate 1 is 2 mil, and the thickness of the conductive layer 2 is 3 OZ, or the thickness of the substrate 1 is set to 3 mil, and the thickness of the conductive layer 2 is set to 2 OZ, and the conductive layer 2 is simultaneously arranged on the first and second surfaces of the substrate 1, that is, on both sides of the substrate 1.

[0035] Reference Figure 1 and Figure 2 In an embodiment of the present application, a plurality of positioning areas 21 are provided on both the first and second surfaces of the substrate 1, and illustratively, within the plane where the substrate 1 is located, the positioning areas 21 can be set to various shapes and sizes, as long as the normal use of the positioning areas 21 can be met. For example, the positioning area 21 is set to be circular, or in an embodiment of the present application, the positioning area 21 is square, and the side length of the positioning area 21 is greater than or equal to 3.2 mm, thereby ensuring that the punching device can more easily identify the position of the positioning area 21, and the side length of the positioning area 21 is less than or equal to 4.8 mm, thereby avoiding the positioning area 21 from affecting the conductive pattern on the core board, for example, the side length of the positioning area 21 is 4 mm.

[0036] By adopting the above technical solution, the side length of the positioning area 21 is set to 4mm, which makes it easier for the punching device to identify the position of the positioning area 21, thereby improving the punching efficiency of the punching device in punching the core board; and the positioning area 21 will not affect the normal operation of the conductive pattern on the core board, thereby ensuring the normal use of the core board.

[0037] It is easy to understand that when the conductive layer 2 is simultaneously arranged on the first surface and the second surface of the substrate 1, the multiple positioning areas 21 arranged on the first surface of the substrate 1 correspond one-to-one to the multiple positioning areas 21 arranged on the second surface of the substrate 1, and are arranged relative to each other, and the multiple indicator grooves 2111 located on the first surface correspond one-to-one to the multiple indicator grooves 2111 located on the second surface, so that when punching in the punching area 212, the force on the first surface and the second surface of the substrate 1 can be ensured to be more uniform, further reducing the possibility of damage to the substrate 1 at the edge of the positioning hole 2121 or displacement of the positioning hole 2121.

[0038] By adopting the above-mentioned technical solution, when punching in the punching area 212 of the core board to form the positioning hole 2121, the core board is fixed by using a fixing device, and the punching device punches in the punching area 212 of the core board, and the indicating portion 21111 of the multiple indicating grooves 2111 arranged in the indicating area 211 can play a certain positioning role in the position of the punching area 212, so that the position of the center of the punching area 212 is more accurate, and the punching device can punch holes on the substrate 1 covered with the conductive layer 2 corresponding to the punching area 212. The multiple indicating grooves 2111 located on the first surface and the multiple indicating grooves 2111 located on the second surface are arranged one by one, so that the force on the substrate 1 is more uniform.

[0039] It is easy to understand that referring to Figure 1 and Figure 2 In the embodiment of the present application, the indicator groove 2111 can be formed on the conductive layer 2 in a variety of ways. For example, a portion of the conductive layer 2 can be removed using a cutting device to form the indicator groove 2111 in the indicator area 211. Alternatively, an etching solution can be reacted with the conductive layer 2 to remove a portion of the conductive layer 2, thereby forming the indicator groove 2111. The embodiment of the present application does not limit the formation process of the indicator groove 2111. Furthermore, for example, when forming the indicator groove 2111 on the conductive layer 2, the conductive layer 2 corresponding to the indicator groove 2111 can be completely removed, thereby exposing the substrate 1 at the indicator groove 2111.

[0040] During the core board manufacturing process, it is typically necessary to use an etching solution to etch a conductive pattern on the conductive layer 2 on both sides of the core board, thereby utilizing the conductive pattern to perform a conductive function and further realizing the function of the core board. In the embodiment of the present application, when etching the conductive pattern, the conductive layer 2 corresponding to the multiple indicator grooves 2111 can be etched together, thereby reducing the processing steps for removing the conductive layer 2 corresponding to the indicator grooves 2111 and making the removal process of the conductive layer 2 corresponding to the indicator grooves 2111 more convenient. As for the process of removing the conductive layer 2 corresponding to the indicator grooves 2111 using the etching solution, the embodiment of the present application will not be further described here.

[0041] Reference Figure 1 and Figure 2 The specific composition of the positioning area 21 is described below. The indicator area 211 is arranged outside the circular perforated area 212, thereby indicating the center of the perforated area 212. The number of indicator slots 2111 in the indicator area 211 can be adjusted according to actual conditions. For example, the indicator slots 2111 can be set to four or six. This application does not impose any further restrictions on this, as long as the indicator slots 2111 can accurately indicate the center of the perforated area 212.

[0042] It is also easy to understand that in the embodiment of the present application, the indicator groove 2111 can be set to a variety of shapes, for example, the indicator groove 2111 can be set to a triangle or a rectangle. For example, in the indicator area 211, with the plane where the substrate 1 is located as a cross-section, the indicator portion 21111 and the positioning portion 21112 are both set to be rectangular. Specifically, the indicator portion 21111 extends radially along the perforated area 212, and the positioning portion 21112 is set on the side of the indicator portion 21111 away from the perforated area 212 and is connected to the indicator portion 21111, and the extension direction of the positioning portion 21112 is perpendicular to the extension direction of the indicator portion 21111.

[0043] It is worth mentioning that, within the plane of the substrate 1, when the indicator groove 2111 is configured as a triangle, for example, an isosceles triangle, the vertex of the indicator groove 2111 points to the center of the punching area 212, thereby indicating the center of the punching area 212. However, when the indicator groove 2111 is formed on the conductive layer 2, since the indicator groove 2111 is triangular, the indicating portion 21111 of the indicator groove 2111 has a pointed end. When an etching solution or a cutting device is used to remove part of the conductive layer 2 to form the indicator groove 2111, the etching solution or the cutting device is often unable to remove the conductive layer 2 at the indicating portion 21111, and the conductive layer 2 corresponding to the indicator groove 2111 needs to be removed multiple times, making the formation process of the indicator groove 2111 more complicated.

[0044] By adopting the above technical solution, in the indication area 211, the indicating portion 21111 and the positioning portion 21112 are both set to be rectangular with the plane where the substrate 1 is located as the cross-section. When the etching solution or cutting device is used to remove part of the conductive layer 2 to form the indicating groove 2111, the etching solution or cutting device can remove the conductive layer 2 corresponding to the indicating groove 2111, so that the shape and size of the indicating portion 21111 and the positioning portion 21112 are more accurate, thereby ensuring the accuracy of the indicating groove 2111, and avoiding the need to remove the conductive layer 2 multiple times due to the inaccurate shape and size of the indicating portion 21111 and the positioning portion 21112, making the formation process of the indicating groove 2111 more convenient.

[0045] And when the punching device is used to punch the core board, thereby forming a positioning hole 2121 on the core board, the indicating groove 2111 composed of the positioning part 21112 and the indicating part 21111 can play a certain positioning role for the punching device, which can make the identification process of the punching device more convenient, thereby improving the accuracy of the punching device in punching holes on the core board, making the position of the positioning hole 2121 more accurate, and enabling the punching device to identify the position of the indicating groove 2111 more quickly, thereby improving the punching efficiency of the punching device.

[0046] Reference Figure 1 and Figure 2 In the embodiment of the present application, the indicating portion 21111 and the positioning portion 21112 can also be set to other positions, for example, the middle of the indicating portion 21111 is connected to the middle of the positioning portion 21112, or the end of the positioning portion 21112 is connected to the side of the indicating portion 21111 away from the punching area 212, so as to play a certain indicating role on the center of the punching area 212.

[0047] The following combination Figure 1 and Figure 2 The specific arrangement and positional relationship of the multiple indicating grooves 2111 in the indicating area 211 are described. For example, the multiple indicating grooves 2111 are evenly arranged along the circumference of the punching area 212, so that the position of the punching area 212 is more accurate; and in the embodiment of the present application, the number of indicating grooves 2111 can be adjusted according to actual conditions, and it is easy to understand that the more the number of indicating grooves 2111, the more accurate the position of the center of the punching area 212, and the higher the formation cost of the positioning area 21.

[0048] Exemplarily, the number of indicating grooves 2111 is set to four, and the four indicating grooves 2111 are evenly arranged in the indicating area 211 and evenly arranged on the outside of the punching area 212. The two indicating parts 21111 located on the two oppositely arranged indicating grooves 2111 extend in the same direction, and in the plane where the substrate is located, the positioning parts 21112 of the four indicating grooves 2111 are jointly arranged to form a square, thereby indicating the center of the punching area 212.

[0049] By adopting the above technical solution, when there are four indicator grooves 2111, and the four indicator grooves 2111 are evenly arranged along the circumference of the punching area 212, it can not only ensure that the indicator grooves 2111 can accurately indicate the position of the center of the punching area 212, but also make the cost of the indicator groove 2111 formation process more reasonable. When the core board is punched using the four indicator grooves 2111 to form the positioning hole 2121 on the core board, the indicator parts 21111 of the four indicator grooves 2111 set in the indicator area 211 play a certain positioning role, thereby making the position of the center of the punching area 212 more accurate, and being able to punch holes on the substrate 1 covered with the conductive layer 2 corresponding to the punching area 212, so that the force on the substrate 1 is more uniform, reducing the possibility of damage to the substrate 1 at the edge of the positioning hole 2121 or the displacement of the positioning hole 2121.

[0050] Reference Figure 1 and Figure 2It is easy to understand that in the embodiment of the present application, a preset distance is set between the side of each indicating portion 21111 away from the positioning portion 21112 and the punching area 212, and the preset distance is greater than or equal to 0.16 mm. For example, the preset distance can be set to 0.2 mm.

[0051] Reference Figure 1 and Figure 2 In the indicator groove 2111, a preset distance is set between the side of the indicator portion 21111 away from the positioning portion 21112 and the punching area 212, so as to avoid the indicator portion 21111 and the punching area 212 being too close. Therefore, when punching in the punching area 212, it will be affected by the indicator area 211, so that the exposed substrate 1 corresponding to the indicator portion 21111 will not be damaged or deformed, thereby ensuring the normal use of the core board.

[0052] Reference Figure 1 and Figure 2 , the specific dimensions of the indicator groove 2111 are described below, wherein the length of the indicating portion 21111 is greater than or equal to 0.4 mm and less than or equal to 0.6 mm, and the width of the indicating portion 21111 is greater than or equal to 0.16 mm and less than or equal to 0.24 mm; and / or, the length of the positioning portion 21112 is greater than or equal to 0.4 mm and less than or equal to 0.6 mm, and the width of the positioning portion 21112 is greater than or equal to 0.16 mm and less than or equal to 0.24 mm.

[0053] It is easy to understand that when the length of the indicating portion 21111 is large, the indicating portion 21111 will affect the size of the punching area 212, thereby making the diameter of the punching area 212 smaller, which in turn affects the size of the positioning hole 2121. When the length of the indicating portion 21111 is small, the distance between the side of the indicating portion 21111 away from the positioning portion 21112 and the punching area 212 is large, that is, the reserved distance is large, thereby affecting the accuracy of the indicating portion 21111 in indicating the center of the punching area 212. Since the indicating portion 21111 is used to indicate the center of the punching area 212, when the width of the indicating portion 21111 is large, the indicating range of the indicating portion 21111 will be expanded, thereby affecting the accuracy of the indicating portion 21111. When the width of the indicating portion 21111 is small, it will affect the formation process of the indicating portion 21111, thereby affecting the formation quality of the indicating portion 21111.

[0054] Continue to refer to Figure 1 and Figure 2In the embodiment of the present application, the positioning portion 21112 is used to be combined with the indicating portion 21111, so that it can play a certain indicating role for the punching device, making the process of the punching device identifying the positioning area 21 more convenient. Therefore, when the length and width of the positioning portion 21112 are small, it will affect the process of the punching device identifying the positioning area 21, and when the length of the positioning portion 21112 is large, it will affect the number of indicating grooves 2111 in the indicating area 211, and affect the formation process of the indicating grooves 2111. Similar to the length of the indicating portion 21111, when the width of the positioning portion 21112 is large, it will affect the size of the punching area 212, thereby making the diameter of the punching area 212 smaller, and thus affecting the size of the positioning hole 2121.

[0055] Therefore, in the embodiment of the present application, the length of the indicating portion 21111 is set to 0.5 mm, and the width of the indicating portion 21111 is set to 0.2 mm; the length of the positioning portion 21112 is set to 0.5 mm, and the width of the positioning portion 21112 is set to 0.2 mm, so that the size of the indicating portion 21111 and the size of the positioning portion 21112 are more reasonable, ensuring the normal use of the indicating groove 2111.

[0056] In an embodiment of the present application, within the plane where the core board is located, the positioning area 21 is square, and the positioning portions 21112 of the four indicator grooves 2111 are jointly arranged to form a square. For example, the side of the positioning portion 21112 away from the indicator portion 21111 is flush with the edge of the positioning area 21, thereby ensuring that the preset distance is greater than or equal to 0.16 mm, and thus ensuring the size of the punching area 212.

[0057] It is easy to understand that in the embodiment of the present application, a positioning hole 2121 is formed in the punching area 212 , and in the plane where the substrate 1 is located, the center of the positioning hole 2121 is set as the center of the punching area 212 .

[0058] To sum up, when the punching device is used to punch the core board to form a positioning hole 2121 on the core board, the indicating portion 21111 of the four indicating grooves 2111 in the indicating area 211 can play a certain positioning role on the center of the punching area 212, so that the position of the center of the punching area 212 is more accurate, and a preset distance is set between the side of the indicating portion 21111 away from the positioning portion 21112 and the punching area 212, so as to avoid the position between the indicating portion 21111 and the punching area 212 being too close, so that when punching in the punching area 212, it will be affected by the indicating area 211, so that the exposed substrate 1 corresponding to the indicating portion 21111 will not be damaged or deformed; and punching is performed on the substrate 1 covered with the conductive layer 2 corresponding to the punching area 212 to form the positioning hole 2121, which also makes the force on the core board substrate 1 more uniform, reducing the possibility of damage to the substrate 1 at the edge of the positioning hole 2121 or displacement of the positioning hole 2121.

[0059] Reference Figure 1-Figure 3 An embodiment of the present application also provides a printed circuit board, comprising a plurality of the above-mentioned core boards, and the plurality of core boards are spaced apart along a first direction, wherein the first direction is the same as the thickness direction of the core boards, and the plurality of positioning areas 21 arranged on the plurality of core boards are all arranged relative to each other.

[0060] When multiple core boards are pressed together to form a printed circuit board, the multiple core boards are spaced apart along a first direction, and the multiple positioning areas 21 provided on the multiple core boards are relatively arranged so that the positioning holes 2121 provided on the core boards can play a certain indicating role in the arrangement process of the core boards, thereby ensuring the corresponding accuracy during the arrangement process of the core boards. The prepreg 3 is then placed between adjacent core boards, and then the multiple core boards are pressed together to form a printed circuit board, and the prepreg 3 is filled in the indicating groove 2111, so that the position between the multiple core boards can be more accurate.

[0061] By adopting the above technical solution, when the punching device is used to punch the core board to form the positioning hole 2121 on the core board, the indicating portion 21111 of the four indicating grooves 2111 in the indicating area 211 can play a certain positioning role on the center of the punching area 212, so that the position of the center of the punching area 212 is more accurate. A preset distance is set between the side of the indicating portion 21111 away from the positioning portion 21112 and the punching area 212, so as to avoid the indicating portion 21111 and the punching area 212 from being in contact with each other. The positions of the areas 212 are close to each other, so when drilling in the drilling area 212, it will be affected by the indicator area 211, so that the exposed substrate 1 corresponding to the indicator portion 21111 will not be damaged or deformed. In addition, drilling on the substrate 1 covered with the conductive layer 2 corresponding to the drilling area 212 to form the positioning hole 2121 also makes the force on the core substrate 1 more uniform, reducing the possibility of damage to the substrate 1 at the edge of the positioning hole 2121 or the possibility of the positioning hole 2121 being offset. In this way, the quality of the core board can be guaranteed, that is, the normal use of the printed circuit board can be guaranteed.

[0062] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of the present application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0063] It should be understood that the present application is not limited to the exact structure described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A core board, characterized in that: comprising a substrate and a conductive layer laid on the substrate; The conductive layer includes at least one positioning area, the positioning area includes an indicator area and a circular punching area, the punching area is used to form a positioning hole; the indicator area is arranged in a ring on the outside of the punching area, and a plurality of indicator grooves are arranged in the indicator area at intervals and arranged on the outer periphery of the punching area, each of the indicator grooves includes an indicator portion and a positioning portion, the indicator portion extends radially along the punching area and points to the center of the punching area, the positioning portion is connected to the indicator portion, the positioning portion is arranged on the side of the indicator portion away from the punching area, and the extension direction of the positioning portion is perpendicular to the extension direction of the indicator portion so that the indicator groove is T-shaped, and a plurality of indicator grooves are evenly arranged along the circumference of the punching area; with the parallel plane of the plane where the substrate is located as the cross-section, the cross-section of the indicator portion and the cross-section of the positioning portion are both rectangular; a preset distance is set between the side of each indicator portion away from the positioning portion and the punching area; the positioning hole is provided in the punching area, and in the plane where the substrate is located, the center of the positioning hole is set as the center of the punching area.

2. The core plate according to claim 1, characterized in that The length of the indicator portion is greater than or equal to 0.4 mm and less than or equal to 0.6 mm, and the width of the indicator portion is greater than or equal to 0.16 mm and less than or equal to 0.24 mm; And / or, the length of the positioning portion is greater than or equal to 0.4 mm and less than or equal to 0.6 mm, and the width of the positioning portion is greater than or equal to 0.16 mm and less than or equal to 0.24 mm.

3. The core plate according to claim 1, characterized in that The preset distance is greater than or equal to 0.16 mm.

4. The core plate according to claim 1, wherein: In the plane where the substrate is located, the positioning area is square, and the side length of the positioning area is greater than or equal to 3.2 mm and less than or equal to 4.8 mm.

5. The core plate according to claim 1, characterized in that The conductive layer is provided on both the first surface and the second surface of the substrate, and the positioning area provided on the first surface of the substrate is provided corresponding to the positioning area provided on the second surface of the substrate.

6. A printed circuit board, characterized in that: It comprises a plurality of core plates according to any one of claims 1 to 5, wherein the plurality of core plates are spaced apart along a first direction, and the plurality of positioning areas arranged on the plurality of core plates are arranged relative to each other.

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