Circulating cleaning device

Abstract

The present application relates to a kind of circulating cleaning device, including reaction tank and circulating pump, wherein reaction tank has main tank and auxiliary tank, main tank is used to accommodate the piece to be cleaned, main tank has main tank liquid inlet, auxiliary tank has auxiliary tank liquid outlet, auxiliary tank liquid outlet is set higher than main tank liquid inlet height, auxiliary tank liquid outlet is communicated main tank liquid inlet;Circulating pump is connected to main tank at one end, and is connected to auxiliary tank at the other end, and circulating pump is configured to be able to extract cleaning fluid in main tank to auxiliary tank, until cleaning fluid in auxiliary tank overflows back to main tank, to circulate cleaning piece to be cleaned.Make that in the circulation process, bubble is more generated in auxiliary tank, to eliminate the adverse effects of bubble on piece to be cleaned.At the same time, since the volume of main tank is greater than the volume of auxiliary tank, main tank does not need to flow too much cleaning fluid to fill auxiliary tank, auxiliary tank does not need to overflow too much cleaning fluid to fill main tank, so that the volume of auxiliary tank can be greatly reduced, and the volume of the entire circulating cleaning device is reduced, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of wet processing, in particular to a circulating cleaning device. Background Art

[0002] Photovoltaic power generation has become a technology that can replace fossil energy, thanks to the continuous decline in production costs and the improvement in photoelectric conversion efficiency in recent years. Based on the material of the photovoltaic cell, solar cells can be roughly divided into crystalline silicon solar cells and thin-film solar cells. Currently, crystalline silicon solar cells, which use high-purity silicon as the main raw material, are the mainstream product, accounting for over 80%. The production process of crystalline silicon solar cells requires multiple steps such as silicon wafer surface coating, diffusion, and printing. Before coating, the silicon wafer must first be cleaned and textured. The purpose of cleaning is to remove various contaminants adsorbed on the surface of the silicon wafer and to create a textured surface structure that can reduce the reflection of sunlight from the surface. An effective textured surface structure causes incident light to be reflected and refracted multiple times on the silicon wafer surface, increasing light absorption, reducing reflectivity, and helping to improve cell performance.

[0003] Existing cleaning and texturing equipment often uses a tank container to hold water or proportioned chemicals to clean or chemically corrode the target object. When adding liquid medicine to the tank container, it is necessary to ensure that the liquid medicine is evenly distributed in the tank under various process conditions such as concentration and temperature. The tank container currently used in the industry usually consists of a main reaction tank and a sub-tank. When the equipment is running, the solution in the main reaction tank flows into the sub-tank by overflow, and the solution in the sub-tank returns to the main reaction tank through a circulation pump to complete a cycle, thereby realizing the timed circulation of the solution in the tank body. However, during this circulation process, the liquid medicine in the main reaction tank flows from bottom to top. Due to the uncontrollable nature of the wet method, circulating bubbles may be generated. At this time, the silicon wafer is above the bubbles. Excessive bubbles lead to an increase in defective silicon wafers, greatly limiting the equipment production capacity and product yield. Moreover, this circulation method has certain requirements for the volume of the sub-tank. After the liquid medicine in the sub-tank is pumped into the main reaction tank, it must at least be able to fill the main reaction tank, so that the liquid level rises to the upper edge of the main tank wall and overflows. However, since the silicon wafers are placed in the main reaction tank, the volume of the main reaction tank is larger. In order to enable the overflow to circulate, the sub-tank also needs to have a larger volume, which makes the volume of the entire equipment larger. Summary of the Invention

[0004] Based on this, it is necessary to provide a circulating cleaning device that is not affected by bubbles and has a smaller size, so that the silicon wafers to be cleaned are not affected by bubbles and have a smaller size, in order to address the problems that there are many bubbles in the main tank of the existing circulating cleaning device, which leads to an increase in defective silicon wafers, and the volume of the sub-tank is large, which leads to a larger size of the entire equipment.

[0005] According to one aspect of the present application, there is provided a circulating cleaning device, comprising:

[0006] A reaction tank having a main tank and a sub-tank, wherein the main tank is used to accommodate the parts to be cleaned and has a main tank liquid inlet, and the sub-tank has a sub-tank liquid outlet arranged at a height higher than the main tank liquid inlet, and the sub-tank liquid outlet is connected to the main tank liquid inlet;

[0007] A circulation pump has one end connected to the main tank and the other end connected to the auxiliary tank. The circulation pump is configured to pump the cleaning liquid in the main tank from the main tank to the auxiliary tank.

[0008] In one embodiment, the main tank also has a main tank liquid outlet, and the auxiliary tank also has a auxiliary tank liquid inlet, and the auxiliary tank liquid inlet is connected to the main tank liquid outlet; the circulating pump has an input end and an output end, the input end is connected to the main tank liquid outlet through a first pipe, and the output end is connected to the auxiliary tank liquid inlet through a second pipe.

[0009] In one embodiment, a first on-off valve is provided on the first pipeline, and the first on-off valve is used to control the connection or isolation between the liquid outlet of the main tank and the input end of the circulation pump; a second on-off valve is provided on the second pipeline, and the second on-off valve is used to control the connection or isolation between the liquid inlet of the auxiliary tank and the output end of the circulation pump.

[0010] In one embodiment, the reaction tank includes a reaction tank body and a partition, the reaction tank body has a accommodating cavity, the partition is arranged in the accommodating cavity, and the partition divides the accommodating cavity into the main tank and the sub-tank.

[0011] In one embodiment, the partition is provided with a plurality of overflow ports penetrating opposite sides of the partition, and each overflow port is connected to the main tank and the auxiliary tank.

[0012] In one embodiment, the distance from the top of the partition to the bottom wall of the accommodating cavity is less than the depth of the accommodating cavity, so that the liquid outlet of the auxiliary tank is connected to the liquid inlet of the main tank.

[0013] In one embodiment, the reaction tank further includes a carrier for placing the parts to be cleaned, the carrier is arranged in the main tank, and a bottom wall of the carrier is provided with a plurality of flow-uniform holes arranged at intervals.

[0014] In one embodiment, the volume of the secondary groove is smaller than the volume of the main groove.

[0015] In one embodiment, the circulating cleaning device further includes a tray, a waste liquid tank, and a third pipe connecting the tray and the waste liquid tank, and the orthographic projection of the reaction tank on the plane where the tray is located falls within the tray.

[0016] In one embodiment, the circulating cleaning device further includes a liquid level monitor, which is disposed in the main tank and is used to monitor the liquid level of the cleaning liquid.

[0017] The above-mentioned circulating cleaning device is provided in a reaction tank, wherein the main tank is used to accommodate the workpieces to be cleaned and has a main tank liquid inlet, and the sub-tank has a sub-tank liquid outlet arranged at a height higher than the main tank liquid inlet, and the sub-tank liquid outlet is connected to the main tank liquid inlet. At the same time, a circulating pump is provided with one end connected to the main tank and the other end connected to the sub-tank. The circulating pump is configured to pump the cleaning liquid in the main tank from the main tank liquid outlet to the sub-tank until the cleaning liquid in the sub-tank overflows back into the main tank from the main tank liquid inlet, completing a circulating cleaning process. During this circulating process, the liquid in the main tank flows from top to bottom, and the liquid in the sub-tank flows from bottom to top. Bubbles are more likely to be generated in the sub-tank and discharged from the sub-tank. Since the workpieces to be cleaned are accommodated in the main tank rather than the sub-tank, the generation of bubbles will not affect the workpieces to be cleaned. Compared with the prior art in which the cleaning liquid flows from the sub-tank to the main tank, the above-mentioned circulating cleaning device can avoid the introduction of bubbles into the main tank, thereby eliminating the adverse effects of bubbles on silicon wafers in the main tank. At the same time, since the circulating pump introduces the cleaning liquid from the auxiliary tank into the main tank, the volume of the main tank is larger than that of the auxiliary tank. Not much cleaning liquid needs to flow out of the main tank to fill the auxiliary tank, and the auxiliary tank does not need to overflow back with too much cleaning liquid to fill the main tank. As a result, the volume of the auxiliary tank can be greatly reduced, thereby reducing the volume of the entire circulating cleaning device and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only one embodiment of the present invention. For ordinary technicians in this field, without paying any creative work, they can also obtain drawings of other embodiments based on these drawings.

[0019] Figure 1 This is a schematic diagram of the operation of a circulating cleaning device according to a conventional embodiment;

[0020] Figure 2 A schematic diagram of the operation of a circulating cleaning device according to an improved embodiment of the present invention;

[0021] Figure 3 A three-dimensional schematic diagram of a reaction tank in a circulating cleaning device provided by the present invention;

[0022] Figure 4 This is a three-dimensional schematic diagram of a carrier in the circulating cleaning device provided by the present invention.

[0023] Description of reference numerals:

[0024] 10. Circulating cleaning device; 100. Reaction tank; 110. Reaction tank body; 111. Main tank; 1111. Main tank liquid inlet; 1112. Main tank liquid outlet; 112. Auxiliary tank; 1121. Auxiliary tank liquid inlet; 1122. Auxiliary tank liquid outlet; 120. Partition; 121. Overflow port; 130. Carrier; 131. Crossbar; 132. Flow-uniforming plate; 140. Reinforcement plate; 200. Circulating pump; 300. First pipeline; 400. Second pipeline; 500. Tray; 600. Third pipeline; 700. First on-off valve; 800. Second on-off valve. DETAILED DESCRIPTION

[0025] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "liquid level", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0028] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0029] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature has a higher liquid level than the second feature. A first feature being "below," "below," or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower liquid level than the second feature.

[0030] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "liquid horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0031] One embodiment of the present invention provides a circulating cleaning device, which is used to place the workpiece to be cleaned therein and to pass a cleaning liquid into it. The cleaning liquid can flow evenly and circulate in the circulating cleaning device, so that the concentration, temperature and other process conditions of the liquid in the circulating cleaning device are evenly distributed, so that the cleaning liquid and the workpiece to be cleaned can circulate and react fully to achieve a good cleaning effect.

[0032] The following describes the structure of the circulating cleaning device of the present application using a circulating cleaning structure for cleaning silicon wafers used in the production of solar cells as an example. This embodiment is provided merely as an example and does not limit the technical scope of the present application. It is understood that in other embodiments, the circulating cleaning device is not limited to cleaning silicon wafers, but can also be used for circulating cleaning of any other parts to be cleaned, and for performing cyclic chemical etching on various workpieces, etc., without limitation herein.

[0033] like Figure 1The figure shows an existing embodiment of a circulating cleaning device 10, which includes a reaction tank 100 and a circulating pump 200. The reaction tank 100 has a main tank 111 and a sub-tank 112. The main tank 111 is used to accommodate the parts to be cleaned, and the opposite ends of the main tank 111 are respectively connected to the opposite ends of the sub-tank 112. The main tank 111 and the sub-tank 112 are both filled with cleaning liquid for cleaning the parts to be cleaned. One end of the circulating pump 200 is connected to the main tank 111, and the other end is connected to the sub-tank 112. The main tank 111, the circulating pump 200 and the sub-tank 112 together form a circulating flow channel. The circulating pump 200 is used to allow the cleaning liquid in the main tank 111 and the sub-tank 112 to circulate in the above-mentioned circulating flow channel to achieve the purpose of circulating cleaning of the parts to be cleaned.

[0034] Specifically, the main tank 111 has a main tank liquid inlet 1111 at the bottom and a main tank liquid outlet 1112 at the top; the top of the sub-tank 112 is a sub-tank liquid inlet 1121, and the bottom is a sub-tank liquid outlet 1122, wherein the main tank liquid inlet 1111 and the sub-tank liquid outlet 1122 are interconnected, and the main tank liquid outlet 1112 and the sub-tank liquid inlet 1121 are interconnected. The circulation pump 200 is arranged at the bottom of the reaction tank 100 and has an input end and an output end. The output end of the circulation pump 200 is connected to the main tank liquid inlet 1111 through the first pipe 300, and the input end is connected to the auxiliary tank liquid outlet 1122 through the second pipe 400. In this embodiment, the circulation pump 200 is configured to be able to extract the cleaning liquid in the auxiliary tank 112 from the auxiliary tank liquid outlet 1122 into the main tank 111. The arrow in the figure indicates the flow direction of the cleaning liquid. At this time, the height of the main tank liquid outlet 1112 is higher than the height of the auxiliary tank liquid inlet 1121. When the liquid level of the auxiliary tank 112 decreases, the liquid level of the main tank 111 increases, and the cleaning liquid in the main tank 111 can overflow from the main tank liquid outlet 1112 back to the auxiliary tank 112 to circulate and clean the parts to be cleaned.

[0035] However, as described in the background technology, in the circulation process of the above embodiment, the main tank liquid inlet 1111 is set at the bottom of the main tank 111. When the cleaning liquid is pumped into the main tank 111 from the auxiliary tank 112 by the circulation pump 200, the liquid to be cleaned in the main tank 111 flows from the main tank liquid inlet 1111 at the bottom of the main tank 111 to the main tank liquid outlet 1112 at the top of the main tank 111. Due to the uncontrollable wet method and the decomposition reaction of the liquid to be cleaned, a large number of circulating bubbles (such as Figure 1), at this time, the workpiece to be cleaned is just above the bubbles. Excessive bubbles will affect the cleaning process of the workpiece to be cleaned, thereby increasing defective products and greatly limiting the production capacity of the equipment and the yield rate of the product. In addition, in order to realize the above-mentioned circulation method, there are certain requirements for the volume of the auxiliary tank 112. After the cleaning liquid in the auxiliary tank 112 is pumped into the main tank 111, it is necessary to fill the main tank 111 so that the liquid level in the main tank 111 rises to the upper edge of the tank wall of the main tank 111 and overflow occurs. However, since the main tank 111 is used to accommodate the workpiece to be cleaned, the volume of the main tank 111 is larger. In order to fill the main tank 111 with cleaning liquid so that the cleaning liquid in the main tank 111 can overflow into the auxiliary tank 112, the auxiliary tank 112 also needs to have a larger volume so that it can fill the main tank 111, resulting in a larger volume of the entire circulation cleaning equipment.

[0036] In order to solve the above problems, the inventors of the present application have thought of making the bubbles mainly generated in the sub-tank 112, so that the parts to be cleaned placed in the main tank 111 are not affected by the bubbles, thereby eliminating the problem of poor process products caused by the introduction of circulating bubbles, and thus improving the product yield.

[0037] Based on the above considerations, in order to solve the problem that there are many bubbles in the main tank 111 of the existing circulating cleaning device 10, which leads to an increase in defective products of the parts to be cleaned, and the volume of the auxiliary tank 112 is large, which leads to a larger volume of the entire equipment, the inventor of the present application has designed a new cleaning liquid circulation method after in-depth research. Without changing the overall structural design of the circulating cleaning device 10, only by changing the circulation direction of the cleaning liquid, the circulating bubbles can be mainly generated in the auxiliary tank 112 and discharged from the auxiliary tank 112, without affecting the parts to be cleaned in the main tank 111.

[0038] like Figure 2As shown, it is an improved embodiment of the circulating cleaning device 10. Compared with the previous embodiment, the structure of the circulating cleaning device 10 in this embodiment is basically the same as the structure of the circulating cleaning device 10 in the previous embodiment. The difference is that, in this embodiment, the circulating pump 200 is configured to be able to extract the cleaning liquid in the main tank 111 from the bottom of the main tank 111 to the auxiliary tank 112. The arrows in the figure also indicate the flow direction of the cleaning liquid. At this time, the setting height of the auxiliary tank outlet 1122 is higher than the main tank inlet 1111. The liquid level of the main tank 111 decreases and the liquid level of the auxiliary tank 112 increases until the cleaning liquid in the auxiliary tank 112 overflows back to the main tank 111 to circulate and clean the parts to be cleaned. At this time, the main tank liquid outlet 1112 is set at the bottom of the main tank 111, the main tank liquid inlet 1111 is set at the top of the main tank 111, the auxiliary tank liquid inlet 1121 is set at the bottom of the auxiliary tank 112, and the auxiliary tank liquid outlet 1122 is set at the top of the auxiliary tank 112. The input end of the circulation pump 200 is connected to the main tank liquid outlet 1112 through the first pipe 300, and the output end is connected to the auxiliary tank liquid inlet 1121 through the second pipe 400.

[0039] In this way, the cleaning liquid in the main tank 111 is pumped from the bottom of the main tank 111 into the auxiliary tank 112, so that the cleaning liquid flows from bottom to top in the auxiliary tank 112, and bubbles are generated in the auxiliary tank 112 ( Figure 2 ), until the cleaning liquid in the auxiliary tank 112 overflows and flows into the main tank 111. The cleaning liquid in the main tank 111 flows from top to bottom, and will not generate many bubbles, so that the bubbles will not affect the parts to be cleaned in the main tank 111, solving the problem of a large number of bubbles in the existing circulating cleaning device 10, which leads to an increase in defective parts to be cleaned. At the same time, because the circulating pump 200 introduces the cleaning liquid from the auxiliary tank 112 into the main tank 111, the volume of the main tank 111 is larger than that of the auxiliary tank 112. The main tank 111 does not need to flow out too much cleaning liquid to fill the auxiliary tank 112, and the auxiliary tank 112 does not need to overflow too much cleaning liquid to fill the main tank 111. As a result, the volume of the auxiliary tank 112 can be greatly reduced, solving the problem of the large volume of the auxiliary tank 112 in the existing cleaning circulation device, which leads to a large volume of the entire device, and reducing the manufacturing cost of the circulating cleaning device 10.

[0040] Specifically, the following is combined with Figures 1 to 4 , the specific structure of the circulating cleaning device 10 provided in this application is described.

[0041] like Figure 3As shown, the reaction tank 100 of the circulating cleaning device 10 includes a reaction tank body 110, a reaction tank cover (not shown), a partition 120 and a carrier 130 (not shown). The reaction tank 100 has a receiving cavity with one end open, and the partition 120 is fixedly arranged in the receiving cavity to separate the receiving cavity into a main tank 111 and a sub-tank 112; the reaction tank cover is covered on the open end of the reaction tank body 110 to play a protective role to prevent workers from being contaminated by chemically corrosive cleaning liquid; the carrier 130 is placed in the main tank 111 of the reaction tank body 110 and is used to fix a large number of parts to be cleaned at one time. After the parts to be cleaned are cleaned, the carrier 130 can be lifted to complete the cleaning of multiple parts to be cleaned at one time. The main tank 111 is not limited to placing only one carrier 130, and multiple carriers 130 can also be placed, which is not limited here.

[0042] exist Figure 3 In the embodiment shown in FIG, and in combination with Figure 2 As shown, the partition 120 surrounds the reaction tank 100 along its circumference, with one end thereof abutting against the bottom wall of the receiving chamber. The area enclosed by the partition 120 is the main tank 111, and the area formed between the outer wall of the partition 120 and the inner wall of the receiving chamber is the secondary tank 112, so that the secondary tank 112 surrounds the main tank 111 along the circumference of the reaction tank 100. The bottom of the main tank 111 is provided with a main tank liquid outlet 1112 and a secondary tank liquid inlet 1121, which are connected to the first pipeline 300. The bottom of the secondary tank 112 is provided with a secondary tank liquid outlet 1121, which is connected to the second pipeline 400. Correspondingly, the ends of the main tank 111 and the secondary tank 112, which are close to the open end of the receiving chamber, are the main tank liquid inlet 1111 and the secondary tank liquid outlet 1122, respectively.

[0043] Preferably, the distance between the top of the partition 120 and the bottom wall of the accommodating chamber (i.e., the height of the partition 120) is less than the depth of the accommodating chamber, so that the main tank liquid inlet 1111 is connected to the auxiliary tank liquid outlet 1122. When the cleaning liquid level in the auxiliary tank 112 rises to a height above the partition 120, it can naturally overflow into the main tank 111. In an alternative embodiment, the distance between the top of the partition 120 and the bottom wall of the accommodating chamber can be equal to the depth of the accommodating chamber. Overflow holes (not shown) are provided on opposite sides of the partition 120 near the open end of the accommodating chamber. In this case, the overflow holes are located at opposite ends of the main tank 111 and the auxiliary tank 112 (i.e., opposite ends along the axial direction of the overflow hole) as the main tank liquid inlet 1111 and the auxiliary tank liquid outlet 1122, respectively. When the cleaning liquid level in the auxiliary tank 112 reaches the height of the overflow holes, it can overflow into the main tank 111 through the overflow holes.

[0044] Better yet, please continue reading Figure 3A plurality of reinforcing plates 140 are arranged at intervals between the outer wall of the partition 120 and the inner wall of the reaction tank 100. The reinforcing plates 140 divide the auxiliary tank 112 into a plurality of adjacent sub-auxiliary tanks 112. Each reinforcing plate 140 is provided with through holes penetrating opposite sides of the reinforcing plate 140 in the thickness direction, thereby reinforcing the partition 120 without affecting the flow of the cleaning liquid between the plurality of sub-auxiliary tanks 112.

[0045] Furthermore, a plurality of overflow ports 121 are provided at the upper edge of the partition 120 (i.e., the opening of the partition 120 close to the accommodating chamber), which are arranged at intervals and pass through both sides of the partition 120 in the thickness direction, so that each overflow port 121 is connected to the main tank 111 and the auxiliary tank 112. In this way, when the cleaning liquid overflows from the auxiliary tank outlet 1122 to the main tank 111 through the main tank inlet 1111, not all of the cleaning liquid can only overflow from the auxiliary tank outlet 1122 to the main tank 111 through the main tank inlet 1111. Some of the cleaning liquid can also overflow from the auxiliary tank 112 to the main tank 111 through the overflow port 121, thereby slowing down the flow rate of the cleaning liquid from the auxiliary tank 112 to the main tank 111, and avoiding excessive overflow and the generation of more bubbles, which has a more adverse effect on the quality of the parts to be cleaned.

[0046] In other optional embodiments, the partition 120 can be one or more separate flat plates, or one or more bent plates, with its outer periphery abutting against the side walls and bottom wall of the reaction tank body 110, thereby being able to separate the accommodating cavity of the reaction tank body 110 into one or more spaced-apart sub-slots 112. The arrangement of the sub-slots 112 is not limited and can be symmetrically spaced or randomly arranged. Preferably, the specific arrangement of the partition 120 can be used to evenly space the multiple sub-slots 112 around the main tank 111, or, as in the above embodiment, to surround the main tank 111, so as to better match the design of the reaction tank 100 cover and make the reaction tank 100 cover easier to process.

[0047] As described above, since the main tank 111 does not need to overflow much cleaning fluid to fill the auxiliary tank 112, and the auxiliary tank 112 does not need to overflow much cleaning fluid to fill the main tank 111, the volume of the auxiliary tank 112 can be significantly reduced. Specifically, by changing the arrangement of the partitions 120, providing only one auxiliary tank 112 on one side of the main tank 111 in its length or width, or reducing the length, width, or height of the auxiliary tank 112, the volume of the auxiliary tank 112 can be made much smaller than that of the main tank 111. For example, in the direction of the auxiliary tank 112 pointing to the main tank 111, the distance between the two opposite side walls of the auxiliary tank 112 (i.e., the width of the cross section of the auxiliary tank 112) is smaller than the distance between the two opposite side walls of the main tank 111 (i.e., the width of the cross section of the main tank 111), and / or in the height direction of the reaction tank 100, the bottom wall of the auxiliary tank 112 is higher than the bottom wall of the main tank 111, so as to achieve the purpose of reducing the volume of the auxiliary tank 112, thereby leaving more space for the circulating cleaning device 10 to install other pipes or components.

[0048] It is worth noting that in some other embodiments, the main tank 111 and the auxiliary tank 112 can also be a split structure, that is, the main tank 111 and the auxiliary tank 112 are separate tank bodies, and the input and output ends of the circulation pump 200 are still connected to the main tank liquid outlet 1112 and the auxiliary tank liquid inlet 1121 respectively through the first pipe 300 and the second pipe 400, while the main tank liquid inlet 1111 and the auxiliary tank liquid outlet 1122 are connected through another pipe. Preferably, the pipeline used to connect the main tank liquid inlet 1111 and the auxiliary tank liquid outlet 1122 can be designed to be bent or inclined, so that after the liquid level in the auxiliary tank 112 rises to a certain height, it can overflow into the main tank 111 through the pipeline under the action of gravity.

[0049] Furthermore, in a preferred embodiment, Figure 2 As shown, the reaction tank body 110 also includes a filter plate 150, which is arranged at the main tank liquid outlet 1112 and the auxiliary tank liquid inlet 1121, and covers the main tank liquid outlet 1112 and the auxiliary tank liquid inlet 1121. The filter plate 150 is provided with a plurality of filter holes arranged at intervals, which are used to prevent impurities in the reaction tank 100, such as preventing broken parts to be cleaned from flowing into the first pipe 300 or the second pipe 400 below the reaction tank 100, thereby avoiding blockage of the pipe.

[0050] like Figure 4As shown, in some embodiments, the carrier 130 includes a plurality of spaced-apart cross bars 131, each cross bar 131 being provided in a plurality of spaced-apart limiting grooves, and the limiting grooves of two adjacent cross bars 131 being arranged relative to each other, so that the edges of the opposite ends of the parts to be cleaned can be limited in the limiting grooves of the cross bars 131, thereby allowing the multiple parts to be cleaned to be fixedly mounted on the carrier 130. Preferably, a flow equalizer 132 is provided at the bottom of the carrier 130, and a plurality of spaced-apart flow equalizer holes are provided on the flow equalizer 132, each flow equalizer hole passing through the two opposite sides of the flow equalizer 132 in the thickness direction thereof. The purpose of providing the flow equalizer 132 is to enable the cleaning liquid to flow into the carrier 130 in a uniform and dispersed manner when the cleaning liquid circulates in the main tank 111, thereby improving the uniformity of the cleaning liquid, optimizing the cleaning process, and improving the process performance of the parts to be cleaned.

[0051] Please continue reading Figure 1 and Figure 2 In a preferred embodiment, the circulating cleaning device 10 further includes a waste liquid tank (not shown), a tray 500, and a third pipe 600 connecting the waste liquid tank and the tray 500. The orthographic projection of the reaction tank 100 on the plane where the tray 500 is located falls within the tray 500. The tray 500 is used to hold the cleaning liquid that seeps out of the reaction tank 100, or to hold the cleaning liquid that drips from the carrier 130 when the carrier 130 is hoisted. The third pipe 600 is used to discharge the waste cleaning liquid contained in the tray 500 into the waste liquid tank. In this way, by providing the tray 500, the waste liquid tank, and the third pipe 600, it is possible to prevent the chemically corrosive cleaning liquid from spilling into the environment around the circulating cleaning device 10, thereby eliminating the occurrence of safety hazards. Preferably, a filter plate 150 can also be provided at the connection between the tray 500 and the third pipe 600 to prevent impurities in the tray 500 from flowing into the third pipe 600 and causing blockage of the third pipe 600.

[0052] In some embodiments, when the number of sub-tanks 112 is large, or the sub-tanks 112 surround the main tank 111, a circulation pump 200 with multiple output ends can be configured, so that the multiple output ends of the circulation pump 200 can be connected to a second pipe 400 respectively, so that the circulation pump 200 is simultaneously connected to the sub-tank liquid inlet 1121 of each sub-tank 112 through multiple second pipes 400, or the circulation pump 200 with one output end is still configured, so that the second pipe 400 includes a main pipe and multiple sub-pipes, the main pipe is connected to the output end of the circulation pump 200, and the multiple sub-pipes converge and are connected to the main pipe, and the end of each sub-pipe away from the main pipe is connected to the sub-tank liquid inlet 1121 of a sub-tank 112.

[0053] Preferably, a first on-off valve 700 may be provided on the first pipe 300, and a second on-off valve 800 may be provided on the second pipe 400. The first on-off valve 700 is used to control the connection or isolation between the main tank liquid outlet 1112 and the input end of the circulation pump 200, and the second on-off valve 800 is used to control the connection or isolation between the auxiliary tank liquid inlet 1121 and the output end of the circulation pump 200. When the circulating cleaning device 10 operates normally, the first on-off valve 700 and the second on-off valve 800 are both normally open. When the circulation pump 200 needs to be maintained or the liquid level of the cleaning liquid in the reaction tank 100 is abnormal, the first on-off valve 700 and the second on-off valve 800 are automatically closed to prevent the cleaning liquid from corroding the circulation pump 200 or workers during maintenance of the circulation pump 200, or to prevent the circulation pump 200 from still pumping liquid when the liquid level of the cleaning liquid is abnormal, thereby causing damage to the circulation pump 200.

[0054] Optionally, a flow control valve or a one-way valve can be installed on the first pipe 300 and the second pipe 400. Installing a flow control valve can adjust the flow of the cleaning liquid in the pipe, and installing a one-way valve can control the cleaning liquid to not flow in a direction opposite to the prescribed flow direction, thereby ensuring that a large number of bubbles are not generated in the main tank 111, ensuring the cleaning effect, and reducing the production of defective products.

[0055] In addition, in another optional embodiment, the circulating cleaning device 10 also includes a liquid level monitor (not shown in the figure), which is arranged in the main tank 111 and is used to monitor the liquid level of the cleaning liquid in the main tank 111 so that the parts to be cleaned are always immersed in the cleaning liquid. When the liquid level is abnormal, the system can automatically close the first on-off valve 700 and the second on-off valve 800.

[0056] The above-mentioned circulating cleaning device 10 has the following working steps:

[0057] First, the cleaning liquid is poured into the reaction tank 100. Then, the carrier 130 loaded with the items to be cleaned is placed in the main tank 111, so that the carrier 130 is completely immersed in the cleaning liquid. Finally, the circulation pump 200 is turned on, and the cleaning liquid flows out of the main tank outlet 1112 at the bottom of the main tank 111. The liquid level in the main tank 111 drops, and the cleaning liquid is pumped into the auxiliary tank 112 through the auxiliary tank inlet 1121 at the bottom of the auxiliary tank 112. The liquid level in the auxiliary tank 112 rises until it overflows into the auxiliary tank 112 and fills the main tank 111. This cycle completes the cyclic cleaning process of the items to be cleaned.

[0058] Thus, compared to the prior art, in which the cleaning liquid flows from the auxiliary tank 112 into the main tank 111, thereby generating a large number of bubbles in the main tank 111, the circulating cleaning device 10 provided by the present application can avoid the introduction of bubbles into the main tank 111, thereby eliminating the adverse effects of bubbles on the items to be cleaned in the main tank 111. At the same time, the volume of the auxiliary tank 112 can also be greatly reduced, thereby reducing the size of the entire circulating cleaning device 10 and reducing manufacturing costs.

[0059] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The above-described embodiment merely represents one embodiment of the present invention. While the description is relatively specific and detailed, it should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art may make various modifications and improvements without departing from the spirit of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A circulating cleaning device, characterized in that: include: The reaction tank has a main tank and a sub-tank, the main tank is used to accommodate the parts to be cleaned and has a main tank liquid inlet, the sub-tank has a sub-tank liquid outlet set at a height higher than the main tank liquid inlet, the sub-tank liquid outlet is connected to the main tank liquid inlet, the main tank also has a main tank liquid outlet, the sub-tank also has a sub-tank liquid inlet, the sub-tank liquid inlet is connected to the main tank liquid outlet; the main tank liquid outlet is arranged at the bottom of the main tank, the main tank liquid inlet is arranged at the top of the main tank, the sub-tank liquid inlet is arranged at the bottom of the sub-tank, and the sub-tank liquid outlet is arranged at the top of the sub-tank; the reaction tank includes a reaction tank body and a partition, the reaction tank body A container having a housing cavity, wherein the partition is arranged in the housing cavity, and the partition divides the housing cavity into the main tank and the sub-tank; the upper edge of the partition is provided with a plurality of overflow ports penetrating opposite sides of the partition, each of the overflow ports being connected to the main tank and the sub-tank; and the partition is provided with overflow holes penetrating opposite sides of the partition at a position close to the open end of the housing cavity; a plurality of reinforcing plates arranged at intervals are further provided between the outer wall of the partition and the inner wall of the reaction tank, the reinforcing plates dividing the sub-tank into a plurality of adjacent sub-sub-tanks, and each of the reinforcing plates is provided with a through hole penetrating opposite sides of the reinforcing plate in the thickness direction; A circulation pump, one end of which is connected to the main tank and the other end of which is connected to the auxiliary tank. The circulation pump is configured to extract the cleaning liquid in the main tank from the main tank to the auxiliary tank; the circulation pump has an input end and an output end, the input end is connected to the liquid outlet of the main tank through a first pipe, and the output end is connected to the liquid inlet of the auxiliary tank through a second pipe.

2. The circulating cleaning device according to claim 1, characterized in that: A first on-off valve is provided on the first pipeline, and the first on-off valve is used to control the connection or isolation between the liquid outlet of the main tank and the input end of the circulation pump; a second on-off valve is provided on the second pipeline, and the second on-off valve is used to control the connection or isolation between the liquid inlet of the auxiliary tank and the output end of the circulation pump.

3. The circulating cleaning device according to claim 1, characterized in that: The distance from the top of the partition to the bottom wall of the accommodating cavity is less than the depth of the accommodating cavity, so that the liquid outlet of the auxiliary tank is connected to the liquid inlet of the main tank.

4. The circulating cleaning device according to claim 1, characterized in that: The reaction tank further comprises a carrier for placing the parts to be cleaned. The carrier is arranged in the main tank, and a plurality of flow-uniform holes arranged at intervals are opened on the bottom wall of the carrier.

5. The circulating cleaning device according to any one of claims 1 to 4, characterized in that: The volume of the sub-tank is smaller than that of the main tank.

6. The circulating cleaning device according to claim 1, characterized in that: The circulating cleaning device further includes a tray, a waste liquid tank, and a third pipe connecting the tray and the waste liquid tank. The orthographic projection of the reaction tank on the plane where the tray is located falls within the tray.

7. The circulating cleaning device according to claim 1, characterized in that: The circulating cleaning device further comprises a liquid level monitor, which is arranged in the main tank and is used to monitor the liquid level of the cleaning liquid.

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