A reinforcing method and structure suitable for large-size, multi-pin QFP devices

Abstract

The application relates to the technical field of electronic packaging, and particularly relates to a reinforcing method and structure suitable for large-size and multi-pin QFP devices, which designs a limiting stud reinforcing structure for reinforcement, and the method specifically comprises the following steps: S1-starting; S2-preparing a limiting stud structure; S3-pressing the limiting stud structure and a metallized hole; S4-installing a flat gasket on the limiting stud structure; S5-continuously installing an elastic gasket; S6-installing a loosening nut; and S7-pointing and gluing four corners of the QFP device. The application provides a reliable process scheme for reinforcing the large-size and multi-pin QFP devices by designing the limiting stud structure and adopting necessary reinforcing methods, and effectively improves the reliability of the electronic packaging structure of the devices in a complex service environment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sub-assembly technology, and in particular to a reinforcing method and structure suitable for large-size, multi-pin QFP devices. BACKGROUND

[0002] At present, the independent controllability and localization of core high-end chips have become a trend of the times. Some large-size, multi-pin QFP devices have the characteristics of heavy weight, and cannot meet the stringent requirements of device electronic assembly reliability in complex service environments such as aerospace and automotive electronics. Specifically, they cannot pass strict qualification tests such as large-scale random vibration tests and impact tests. SUMMARY

[0003] In view of the deficiencies of the prior art, the present application provides a reinforcing method and structure suitable for large-size, multi-pin QFP devices. The present application provides a reliable process solution for the reinforcement of large-size, multi-pin QFP devices by designing a limiting stud structure and adopting necessary reinforcement methods, thereby effectively improving the reliability of device electronic assembly structures in complex service environments.

[0004] The present application is implemented by the following technical solutions:

[0005] A reinforcing method suitable for large-size, multi-pin QFP devices, which designs a limiting stud reinforcing structure for reinforcement, specifically including the following steps:

[0006] Step 1: Adopting a locknut structure: designing and adopting a locknut to realize the fastening function of the limiting stud structure;

[0007] Step 2: Adopting a spring pad structure: designing and adopting a spring pad to prevent the locknut structure in step 1 from loosening;

[0008] Step 3: Adopting a flat pad structure: designing and adopting a special flat pad to increase the stress area and reduce stress, and to prevent the spring pad structure in step 2 from damaging the metalized hole mounting surface;

[0009] Step 4: Adopting a pin structure: designing and adopting a pin structure to realize interference fit with the metalized hole of the printed circuit board, prevent the limiting stud structure from loosening radially under impact, and enhance the shear resistance of the structure;

[0010] Step 5: Adopting a threaded structure: designing and adopting a threaded structure to increase the contact area between the limiting stud reinforcing structure and the glue, enhance the overall shear resistance of the structure, and realize axial stress sharing;

[0011] Step 6: Adopting a glue application process: applying glue to the screw corresponding part of the limiting stud reinforcing structure to realize the connection between the limiting stud reinforcing structure and the QFP device.

[0012] Preferably, the anti-loose nut structure in step 1 adopts a '1 type hexagonal nut' (GB / T6170-2000), and the size specification is M3.

[0013] Preferably, the elastic washer structure in step 2 adopts a light spring washer (GB / T 859-1987), and the size specification is φ3mm.

[0014] Preferably, the flat washer structure in step 3 adopts a chamfered type A flat washer (GB / T97.2-1985), and the size specification is φ3mm.

[0015] Preferably, the pin structure in step 4 is made of copper-tin alloy material.

[0016] Preferably, the pin structure in step 4 includes a screw cap, a threaded column one, a transition column and a threaded column two; the bottom axis of the screw cap is sequentially provided from top to bottom with the threaded column one, the transition column and the threaded column two, and the screw cap, the threaded column one, the transition column and the threaded column two are integrally formed.

[0017] Preferably, the diameters of the screw cap, the threaded column one, the transition column and the threaded column two distributed from top to bottom gradually decrease.

[0018] Preferably, the length of the screw cap is 1.5mm, the length of the threaded column one is 4.5mm, the length of the transition column is 1.9mm, and the length of the threaded column two is 4.1mm.

[0019] The application also provides the following technical scheme: a reinforcing structure suitable for large-size, multi-pin QFP devices, which is reinforced by the above-mentioned reinforcing method and includes a pin structure, an anti-loose nut structure, an elastic washer structure, a flat washer structure and a glue application layer.

[0020] The application has the following beneficial effects:

[0021] The application provides a reliable process scheme for reinforcing large-size, multi-pin QFP devices by designing a limiting screw column structure and adopting necessary reinforcing methods, and effectively improves the reliability of device electronic connection structures in complex service environments. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only constitute some embodiments of the application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0023] Figure 1 is a flow chart of the method of the present application;

[0024] Figure 2 is a top view of the QFP device of the present application;

[0025] Figure 3 is a structural diagram of the QFP device of the present application reinforced with the limiting stud structure;

[0026] Figure 4 is a structural diagram of the pin structure of the present application.

[0027] In the figure: 1-QFP device, 2-metallized hole, 3-pin structure, 31-screw cap, 32-threaded column one, 33-transition column, 34-threaded column two, 4-flat pad structure, 5-spring pad structure, 6-lock nut structure. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme of the embodiments of the present application will be described clearly and completely below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0029] Embodiment 1:

[0030] Please refer to Figures 1-4 The embodiments of the present application provide a technical scheme of a reinforcing method suitable for large-size, multi-pin QFP devices, which designs a limiting stud reinforcing structure for reinforcement, and specifically includes the following steps:

[0031] Step 1: Adopting a lock nut structure: designing and adopting a lock nut to realize the fastening effect of the limiting stud structure;

[0032] Step 2: Adopting a spring pad structure: designing and adopting a spring pad to prevent the lock nut structure in step 1 from loosening;

[0033] Step 3: Adopting a flat pad structure: designing and adopting a special flat pad to increase the stress area and reduce stress, and at the same time, to prevent the spring pad structure in step 2 from causing damage to the installation surface of the metallized hole;

[0034] Step 4: Adopting a pin structure: designing and adopting a pin structure to realize interference fit with the metallized hole of the printed circuit board, prevent the limiting stud structure from loosening radially under the impact effect, and enhance the shear resistance of the structure;

[0035] Step 5: adopt a threaded structure: design and adopt a threaded structure, use the threaded structure to increase the contact area of the limiting stud reinforcing structure and the glue, enhance the overall shear resistance of the structure, and realize the axial force sharing;

[0036] Step 6: adopt a gluing process: glue the corresponding part of the limiting stud reinforcing structure screw to realize the connection of the limiting stud reinforcing structure and the QFP device.

[0037] The above method specifically includes the following flow: S1-start; S2-make a limiting stud structure; S3-press the limiting stud structure and the metalized hole; S4-install a flat pad on the limiting stud structure; S5-continue to install a spring pad; S6-install a loosening nut; S7-QFP device four corner dispensing.

[0038] In the embodiment of the application, the loosening nut structure in step 1 adopts a "1 type hexagonal nut" (GB / T6170-2000), and the size specification is M3.

[0039] The spring pad structure in step 2 adopts a light spring washer (GB / T 859-1987), and the size specification is φ3mm.

[0040] The flat pad structure in step 3 adopts a chamfer type A flat pad (GB / T 97.2-1985), and the size specification is φ3mm.

[0041] The pin structure in step 4 is made of copper-tin alloy material.

[0042] The pin structure in step 4 includes a screw cap, a threaded column one, a transition column and a threaded column two; the bottom axis of the screw cap is sequentially provided with the threaded column one, the transition column and the threaded column two from top to bottom, and the screw cap, the threaded column one, the transition column and the threaded column two are integrally formed.

[0043] Moreover, the pin structure as a whole can be divided into four functional areas, as shown in the figure, wherein the threaded column two area cooperates with step 1 to realize fastening, the transition column area cooperates with the metalized hole of the printed circuit board to realize interference fit, the threaded column one area cooperates with the glue to increase the contact area, and the screw cap area bears external force, thereby realizing the cooperation between the transition column area and the metalized hole of the printed circuit board. Figure 1 The diameters of the screw cap, the threaded column one, the transition column and the threaded column two distributed from top to bottom gradually decrease. The length of the screw cap is 1.5mm, the length of the threaded column one is 4.5mm, the length of the transition column is 1.9mm, and the length of the threaded column two is 4.1mm.

[0044]

[0045] ​The embodiment of the present application also provides the technical scheme as follows: a reinforcing structure suitable for large-size and multi-pin QFP devices, which is reinforced by the reinforcing method, and comprises a pin structure, a lock nut structure, a spring washer structure, a flat washer structure and a glue layer. The present application provides a reliable process scheme for reinforcing the large-size and multi-pin QFP devices by designing the limiting stud structure and adopting the necessary reinforcing method, and effectively improves the reliability of the electronic connection structure of the devices in the complex service environment.

[0046] The above embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method of ruggedizing large size, multi-lead QFP devices, characterized by, The design of the limiting stud reinforcing structure is as follows: Step 1: adopt a lock nut structure: design and adopt a lock nut to realize the fastening of the limiting stud reinforcing structure; Step 2: adopt a spring washer structure: design and adopt a spring washer to prevent the lock nut structure in step 1 from loosening; Step 3: adopt a flat washer structure: design and adopt a special flat washer to increase the stress area and reduce stress, and prevent the spring washer structure in step 2 from damaging the metalized hole mounting surface; Step 4: adopt a pin structure: design and adopt a pin structure to realize interference fit with the metalized hole on the printed circuit board, prevent the limiting stud reinforcing structure from loosening radially under impact, and enhance the shear resistance of the structure; Step 5: adopt a threaded structure: design and adopt a threaded structure to increase the contact area between the limiting stud reinforcing structure and the adhesive, enhance the overall shear resistance of the limiting stud reinforcing structure, and realize axial stress sharing; Step 6: adopt a glue application process: apply glue to the part corresponding to the pin structure on the limiting stud reinforcing structure to realize the connection between the limiting stud reinforcing structure and the QFP device. The pin structure in step 4 includes a screw cap, a threaded column one, a transition column, and a threaded column two; the area thread on the threaded column one is in contact with the adhesive at the four corner dispensing points of the QFP device to increase the contact area between the limiting stud reinforcing structure and the QFP device.

2. The ruggedization method of claim 1, wherein, The lock nut structure in step 1 adopts a "1-type hexagonal nut" with a size specification of M3.

3. The ruggedization method of claim 1, wherein, The spring washer structure in step 2 adopts a light spring washer with a size specification of φ3mm.

4. The ruggedization method of claim 1, wherein, The flat washer structure in step 3 adopts a chamfered A-level flat washer with a size specification of φ3mm.

5. The ruggedization method of claim 1, wherein, The pin structure in step 4 is made of copper-tin alloy material.

6. The ruggedization method of claim 1, wherein, The bottom axis of the screw cap is sequentially provided with the threaded column one, the transition column, and the threaded column two from top to bottom, and the screw cap, the threaded column one, the transition column, and the threaded column two are integrally formed.

7. The ruggedization method of claim 6, wherein, The diameters of the screw cap, the threaded column one, the transition column, and the threaded column two distributed from top to bottom gradually decrease.

8. The ruggedization method of claim 7, wherein, The length of the screw cap is 1.5mm, the length of the threaded column one is 4.5mm, the length of the transition column is 1.9mm, and the length of the threaded column two is 4.1mm.

9. A ruggedized structure suitable for large size, multi-lead QFP devices, characterized by, Adopt the reinforcing method of any one of claims 1-8, including the pin structure, the lock nut structure, the spring washer structure, the flat washer structure, and the glue layer.

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