Positive and negative pressure die bonding furnace

Abstract

The application discloses a positive and negative pressure die bonding furnace and relates to the technical field of semiconductor chip manufacturing and processing. The positive and negative pressure die bonding furnace comprises a box body, a processing chamber arranged in the box body, a mechanical sealing door hinged to one side of the box body, an air extraction mechanism installed in the box body and connected with the inside of the processing chamber, a pressurized air charging mechanism arranged on one side of the box body and connected with the inside of the processing chamber, an electrical control cabinet arranged on one side of the box body and electrically connected with the air extraction mechanism and the pressurized air charging mechanism, and a temperature control mechanism arranged in the box body and used for controlling the temperature of the processing chamber. The application can effectively avoid the generation of air bubbles in the packaging process of semiconductor chips and guarantees the quality of semiconductor parts.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor chip manufacturing process, in particular to a positive and negative pressure die bonder. BACKGROUND

[0002] The semiconductor chip is a kind of semiconductor device that can realize certain functions by etching, wiring on semiconductor sheet material.

[0003] In the packaging process of the semiconductor chip, encapsulating material (silver glue) is used, and the encapsulating material can absorb water vapor or produce volatile substances, which can easily produce cavities (bubbles) in the packaging process of the semiconductor chip; and in the reflow process, the water vapor and the cavities will instantaneously expand due to the sudden boiling caused by heating, which will cause great stress on the semiconductor chip and the packaging body itself, and the great stress will affect the quality of the product, and even cause IC component failure in severe cases.

[0004] Therefore, it is necessary to provide a positive and negative pressure die bonder to avoid bubble generation and improve the packaging quality of the semiconductor chip. SUMMARY

[0005] To solve the above technical problems, the present application adopts the following technical solutions:

[0006] A positive and negative pressure die bonder, comprising:

[0007] A box body, the box body is internally provided with a treatment chamber, and a mechanical sealing door is hingedly connected to one side of the box body;

[0008] An air extraction mechanism, which is installed in the box body and is in communication with the inside of the treatment chamber;

[0009] A pressurized air charging mechanism, which is arranged on one side of the box body and is in communication with the inside of the treatment chamber;

[0010] An electrical control cabinet, which is arranged on one side of the box body and is electrically connected to the air extraction mechanism and the pressurized air charging mechanism;

[0011] A temperature control mechanism, which is arranged in the box body and is used to control the temperature of the treatment chamber.

[0012] Further, the air extraction mechanism comprises a vacuum pump and a buffer tank, the vacuum pump and the buffer tank are installed in the box body, and the vacuum pump is connected to the buffer tank and the inside of the treatment chamber in sequence.

[0013] Further, the pressurized inflation mechanism comprises an air compressor, a nitrogen machine and a pressure regulating valve, the air compressor is installed inside the box body, the nitrogen machine is arranged on one side of the box body, an air inlet of the air compressor is connected with an electrically-controlled three-way valve, one port of the electrically-controlled three-way valve is connected with a pipeline of the nitrogen machine, and the other port is connected with the external environment, one end of the pressure regulating valve is connected with a gas outlet pipeline of the air compressor, and the other end is connected with the inside of the treatment chamber.

[0014] Further, the temperature control mechanism comprises a temperature sensing wire, a heating mechanism, a water cooling mechanism and a temperature control device, the heating mechanism is installed inside the box body and located on the side of the treatment chamber away from the mechanical sealing door, the water cooling mechanism is installed inside the box body and located on both sides of the treatment chamber, the temperature sensing wire is arranged in the treatment chamber and used for monitoring the temperature in the treatment chamber, and the temperature control device is installed in the box body and electrically connected with the temperature sensing wire, the heating mechanism and the water cooling mechanism.

[0015] Further, the heating mechanism comprises a heater, a driving motor and an air wheel, the driving motor is installed in the box body and located on the side of the treatment chamber away from the mechanical sealing door, the air wheel is connected to the power output end of the driving motor, and the heater is installed in the box body and arranged in cooperation with the air wheel, and the heater and the driving motor are electrically connected with the temperature control device.

[0016] Further, the water cooling mechanism comprises a water cooling pipe and a circulating water pipeline, the water cooling pipe is wound outside the treatment chamber, one end of the circulating water pipeline is connected with the water cooling pipe, and the other end is connected with an external water source.

[0017] Further, the electric control cabinet comprises a vacuum release controller and a nitrogen filling controller, the vacuum release controller is electrically connected with the air extraction mechanism, the vacuum release controller is used for controlling the vacuum release operation of the box body, and the nitrogen filling controller is electrically connected with the pressurized inflation mechanism, and the nitrogen filling controller is used for controlling the nitrogen filling operation in the box body.

[0018] Further, one side of the box body is provided with a control panel, and the control panel is electrically connected with the air extraction mechanism, the pressurized inflation mechanism and the temperature control mechanism.

[0019] Further, a three-color lamp is arranged at the top end of the box body, the three-color lamp is electrically connected with the control panel, and the three-color lamp is used for displaying the working state of the device.

[0020] Further, a carrying wheel is arranged at the bottom of the box body.

[0021] The beneficial effects of the present application are as follows:

[0022] The positive and negative pressure die bonding furnace provided by this invention effectively prevents chip oxidation during the processing of semiconductor chips. Furthermore, during the packaging process, a pressurized gas filling mechanism removes air bubbles from the silver paste, preventing the formation of air bubbles. This ensures that the semiconductor chip and semiconductor wafer are not subjected to excessive stress during subsequent reflow soldering, thus avoiding damage to the chip and wafer and improving the quality of the semiconductor chip. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the internal structure of a positive and negative pressure crystal bonding furnace according to the present invention.

[0024] Figure 2 This is a three-dimensional schematic diagram of a positive and negative pressure crystal bonding furnace according to the present invention.

[0025] Figure 3 This is a front view of a positive and negative pressure crystal bonding furnace according to the present invention.

[0026] Figure 4 This is a side view of a positive and negative pressure crystal bonding furnace according to the present invention.

[0027] In the figure:

[0028] 1-Enclosure; 11-Processing chamber; 12-Mechanical sealed door; 2-Evacuation mechanism; 21-Vacuum pump; 22-Buffer tank; 3-Pressure charging mechanism; 31-Air compressor; 4-Electrical control cabinet; 41-Vacuum release controller; 411-Manual vacuum release knob; 412-Automatic vacuum release knob; 42-Nitrogen charging controller; 5-Temperature control mechanism; 51-Temperature sensing wire; 52-Heating mechanism; 521-Heater; 522-Drive motor; 523-Impeller; 53-Water cooling mechanism; 531-Water cooling pipe; 6-Control panel; 7-Tricolor light; 8-Heavy-duty hinge. Detailed Implementation

[0029] The following will refer to the appendices in the embodiments of the present invention. Figures 1-4 The technical solutions in the embodiments of the present invention are clearly and completely described herein. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0030] Example

[0031] Combination Figures 1-4The embodiment provides a positive and negative pressure die bonding furnace, which comprises a box body 1, an air extraction mechanism 2, a pressurized air charging mechanism 3, an electrical control cabinet 4 and a temperature control mechanism 5, the box body 1 is internally provided with a processing chamber 11, the air extraction mechanism 2 is installed in the box body 1 and is connected with the inside of the processing chamber 11, the pressurized air charging mechanism 3 is arranged on one side of the box body 1 and is connected with the inside of the processing chamber 11, the electrical control cabinet 4 is arranged on one side of the box body 1 and is electrically connected with the air extraction mechanism 2 and the pressurized air charging mechanism 3 respectively, and the temperature control mechanism 5 is arranged in the box body 1 and is used for controlling the temperature of the processing chamber 11.

[0032] The bottom of the box body 1 is provided with a carrying wheel, so that the device can be conveniently moved.

[0033] One side of the box body 1 is hinged with a mechanical sealing door 12 through a heavy hinge 8, the mechanical sealing door 12 is provided with a handle to assist opening and closing, and the mechanical sealing door is provided with a pressure sensing device, so that the door cannot be pressurized if it is not tightly closed, and the door cannot be opened when the pressure is very high.

[0034] The air extraction mechanism 2 comprises a vacuum pump 21 and a buffer tank 22, the vacuum pump 21 and the buffer tank 22 are installed in the box body 1, and the vacuum pump 21 is sequentially connected with the buffer tank 22 and the pipeline in the processing chamber 11; when it is necessary to extract vacuum in the box body, the vacuum pump works under the steady flow of the buffer tank to create a vacuum environment in the processing chamber.

[0035] The pressurized air charging mechanism 3 comprises an air compressor 31, a nitrogen machine (not shown in the figure) and a pressure regulating valve (not shown in the figure), the air compressor 31 is installed in the box body 1, the nitrogen machine is arranged on one side of the box body 1, an air inlet of the air compressor 31 is connected with an electrically controlled three-way valve, one port of the electrically controlled three-way valve is connected with the pipeline of the nitrogen machine, and the other port is connected with the external environment, one end of the pressure regulating valve is connected with the air outlet pipeline of the air compressor 31, and the other end is connected with the inside of the processing chamber 11; the air compressor is used for pressurizing the inside of the box body, when the air compressor works, air or nitrogen is sucked in and blown into the inside of the box body through the electrically controlled three-way valve, and the pressure value is adjusted through the pressure regulating valve.

[0036] As optimization, the pressurized air charging mechanism further comprises a pressure relief valve, a digital pressure gauge and a pressure early warning protection device, the pressure relief valve is arranged on the pipeline connected between the pressure regulating valve and the processing chamber, the pressure relief valve is used for relieving pressure when the pressure in the box body reaches a set value to avoid that the pressure in the box body is too large; the inside of the processing chamber is provided with a pressure sensor, the digital pressure gauge is used for monitoring and displaying the pressure in the processing chamber in real time, and the pressure early warning protection device issues an alarm when the pressure value monitored by the pressure sensor is higher than the set value.

[0037] The temperature control mechanism 5 comprises a temperature sensing wire 51, a heating mechanism 52, a water cooling mechanism 53 and a temperature control device. The heating mechanism 52 is installed inside the box body 1 and located at a side of the processing chamber 11 away from the mechanical sealing door. The water cooling mechanism 53 is installed inside the box body 1 and located at both sides of the processing chamber 11. The temperature sensing wire 51 is arranged in the processing chamber 11. The temperature control device is installed in the box body 1 and electrically connected with the temperature sensing wire 51, the heating mechanism 52 and the water cooling mechanism 53 respectively. The temperature sensing wire is used for monitoring the temperature in the processing chamber 11 and transmitting the detected temperature signal to the temperature control device.

[0038] The heating mechanism 52 comprises a heater 521, a driving motor 522 and a fan wheel 523. The driving motor 522 is installed in the box body 1 and located at a side of the processing chamber 11 away from the mechanical sealing door. The fan wheel 523 is connected to the power output end of the driving motor 522. The heater 521 is installed in the box body 1 and arranged in cooperation with the fan wheel 523. The temperature control device is electrically connected with the heater 521 and the driving motor 522 respectively. In this embodiment, the heater 521 is a sheathed electric heater. The fan wheel 523 is a strong stainless steel fan wheel. The driving motor 522 is a long shaft motor special for hot air ovens. When heating is needed, the heater is powered to heat. The driving motor drives the fan wheel to rotate to blow the hot air around the heater into the processing chamber for heating. The heating effect is uniform and rapid.

[0039] The water cooling mechanism 53 comprises a water cooling pipe 531 and a circulating water path. The water cooling pipe 531 is wound outside the processing chamber 11. One end of the circulating water path is connected with the water cooling pipe 531, and the other end is connected with an external water source. The circulating water in the circulating water path is pumped into the water cooling pipe. The temperature control device is electrically connected with the water pump to intelligently cool the inside of the box body in cooperation with the temperature sensing wire.

[0040] The electrical control cabinet 4 comprises a vacuum release controller 41 and a nitrogen filling controller 42. The vacuum release controller 41 is electrically connected with the air exhaust mechanism 2. The vacuum release controller 41 is used for controlling the vacuum release operation of the box body 1. The nitrogen filling controller 42 is electrically connected with the pressurized air filling mechanism 3. The nitrogen filling controller 42 is used for controlling the nitrogen filling operation in the box body 1. In this embodiment, the vacuum release controller comprises a manual vacuum release knob 411 and an automatic vacuum release knob 412, which realize manual operation and automatic operation of vacuum release respectively. The manual vacuum release knob 411 and the automatic vacuum release knob 412 are electrically connected with the vacuum pump.

[0041] The box 1 side is provided with a control panel 6, the control panel 6 is respectively connected with the air extraction mechanism 2, pressurized inflation mechanism 3 and temperature control mechanism 5, respectively for controlling the operation of each stage.

[0042] The box 1 top end is provided with a three-color lamp 7, the three-color lamp 7 is connected with the control panel 6, the three-color lamp 7 is used to show the working state of the device, when the three-color lamp shows red, it is in working state, indicating that the mechanical seal door can not be opened, when it shows green, it means that the device is in static state, the box door can be opened, when it shows yellow, it means that the device is in pressure relief state.

[0043] As optimization, the box interior is made of SUS304 type 5.0mm thick stainless steel plate with concave iron reinforcement, the box exterior is made of SUS41 type cold rolled steel plate, the outer wall is provided with anti-static powder baking finish to protect the box.

[0044] As optimization, the box interior is also provided with a heat preservation structure (not shown in the figure), the heat preservation structure includes heat preservation cotton and heat insulation plate, the heat preservation cotton is arranged on the box inner wall, the heat insulation plate is arranged on the side of the heat preservation cotton close to the box inner wall and is fixed in the box interior by high temperature resistant silicone, the thickness of the heat preservation cotton is 90mm.

[0045] The positive and negative pressure die bonding furnace of the embodiment is used for placing semiconductor chips and semiconductor sheet materials in the processing chamber when working normally, the control panel controls the vacuum pump to work, and a vacuum environment is created in the processing chamber under the stable flow effect of the buffer tank, the vacuum environment can avoid the oxidation of the semiconductor chips, then the air compressor is controlled to work, the control panel controls the air compressor and the nitrogen machine to work, and controls the electrically controlled three-way valve to connect the nitrogen machine and the air compressor, the air compressor fills nitrogen into the box, and the volume of the filled nitrogen is controlled to be 60%-70% of the volume of the box; then the heater is controlled to heat to make the internal environment temperature be 80℃, the power output end of the driving motor drives the wind wheel to rotate to blow the hot air around the heater to the semiconductor chips to prevent the silver glue for bonding the semiconductor chips and semiconductor sheet materials from solidifying; then the air compressor is controlled to work again to pass high pressure nitrogen into the box, the high pressure nitrogen removes the bubbles in the silver glue to complete the bubble removal work; after the silver glue is solidified, the internal environment is heated to 150℃, and the time is kept for 2h to make the bonding of the silver glue more stable and the quality of the semiconductor chips better; finally, the temperature in the box is reduced to 60℃ by the water cooling mechanism, and the work is completed after pressure relief.

[0046] The positive and negative pressure die bonding furnace effectively prevents the oxidation of the semiconductor chip in the processing process, and the air bubbles in the silver glue are pressed out through the pressurized air charging mechanism in the packaging process, so that the semiconductor chip and the semiconductor sheet are not subjected to large stress in the subsequent reflow process, the chip and the sheet are prevented from being damaged, and the quality of the semiconductor chip is improved.

[0047] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to the above-described embodiments will be apparent to those of ordinary skill in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Therefore, the application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A positive and negative pressure die bonding furnace, characterized by, The utility model relates to a kind of vacuum nitrogen filling device, including: Box, processing chamber is arranged inside the box, mechanical seal door is hinged to one side of the box; Exhaust mechanism, the exhaust mechanism is installed in the box and is connected with the inside of the processing chamber; Pressurized inflation mechanism, the pressurized inflation mechanism is arranged in one side of the box, and the pressurized inflation mechanism is connected with the inside of the processing chamber; Electrical control cabinet, the electrical control cabinet is arranged in one side of the box, and the electrical control cabinet is electrically connected with the exhaust mechanism and the pressurized inflation mechanism respectively; Temperature control mechanism, the temperature control mechanism is arranged in the box, and the temperature control mechanism is used to control the temperature of processing chamber; The pressurized inflation mechanism includes air compressor, nitrogen machine and pressure regulating valve, the air compressor is installed in the box, the nitrogen machine is arranged in one side of the box, the air inlet of the air compressor is connected with electrically-controlled three-way valve, one port of the electrically-controlled three-way valve is connected with the nitrogen machine pipeline, another port is connected with external environment, one end of the pressure regulating valve is connected with the air outlet pipeline of the air compressor, and the other end is connected with the inside of the processing chamber; The electrical control cabinet includes vacuum release controller and nitrogen filling controller, the vacuum release controller is electrically connected with the exhaust mechanism, the vacuum release controller is used to control the vacuum release operation of box, and the nitrogen filling controller is electrically connected with the pressurized inflation mechanism, and the nitrogen filling controller is used to control the nitrogen filling operation in the box.

2. The positive and negative pressure die bonder according to claim 1, wherein, The exhaust mechanism includes vacuum pump and buffer tank, and the vacuum pump and the buffer tank are installed in the box, and the vacuum pump is connected with the buffer tank and the inside of the processing chamber in sequence.

3. The positive and negative pressure die bonder according to claim 1, wherein, The temperature control mechanism includes temperature sensing wire, heating mechanism, water cooling mechanism and temperature control device, the heating mechanism is installed in the box and is located at the side of the processing chamber away from the mechanical seal door, the water cooling mechanism is installed in the box and is located at both sides of the processing chamber, the temperature sensing wire is arranged in the processing chamber, and the temperature sensing wire is used to monitor the temperature in the processing chamber, and the temperature control device is installed in the box and is electrically connected with the temperature sensing wire, the heating mechanism and the water cooling mechanism respectively.

4. The positive and negative pressure die bonder according to claim 3, wherein, The heating mechanism includes heater, driving motor and wind wheel, the driving motor is installed in the box and is located at the side of the processing chamber away from the mechanical seal door, the wind wheel is connected to the power output end of the driving motor, the heater is installed in the box and is arranged in cooperation with the wind wheel, and the heater and the driving motor are electrically connected with the temperature control device respectively.

5. The positive and negative pressure die bonder according to claim 3, wherein, The water cooling mechanism includes water cooling pipe and circulating water path, the water cooling pipe is wound outside the processing chamber, one end of the circulating water path is connected with the water cooling pipe, and the other end is connected with external water source.

6. The positive and negative pressure die bonder according to claim 1, wherein, One side of the box is provided with control panel, and the control panel is electrically connected with the exhaust mechanism, the pressurized inflation mechanism and the temperature control mechanism respectively.

7. The positive and negative pressure die bonder according to claim 6, wherein, Three-color lamp is arranged at the top of the box, and the three-color lamp is electrically connected with the control panel, and the three-color lamp is used to show the working state of the device.

8. The positive and negative pressure die bonder of claim 1, wherein, Carrying wheel is arranged at the bottom of the box.

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