An automatic production line for semiconductor wafer lamination and polishing

Abstract

The present invention discloses an automated production line for semiconductor wafer lamination and polishing, including a ceramic disc wax lamination system, a wafer polishing system, a dewaxing and film-taking system and a master control system; the ceramic disc wax lamination system includes a wax lamination machine, a film-taking manipulator and a wax lamination manipulator, the film-taking manipulator is used to transfer the wafer to the wax lamination machine, and stack the ceramic discs on the ceramic disc conveying track in a movable ceramic disc storage rack through a ceramic disc stacking mechanism; the wafer polishing system includes a polishing machine and a ceramic disc manipulator, the polishing manipulator is used to grab and place the ceramic disc with polished wafers in the ceramic disc storage rack; the dewaxing and film-taking system includes a dewaxing and film-taking machine and a dewaxing manipulator, the dewaxing manipulator is used to peel off the wafers attached to the surface of the ceramic disc, and grab the separated ceramic discs through the dewaxing manipulator and place them in the ceramic disc storage rack. The present invention can effectively improve the production efficiency of the overall process of wafer lamination and polishing through the coordination of various systems.

Description

Technical Field

[0001] The invention relates to the technical field of chip manufacturing, and in particular to an automated production line for semiconductor wafer lamination and polishing. Background Art

[0002] At present, the manufacturing industry is transforming towards industrial automation and flexible manufacturing technology, with the aim of improving efficiency, reducing manpower input and lowering costs. The field of semiconductor chip substrate manufacturing is also developing towards large-scale, high-tech and high-quality directions. At present, chip substrate materials are mainly sapphire wafers or silicon wafers. The surface of the wafer must have extremely high flatness, smoothness and cleanliness. Chemical mechanical polishing is currently the most effective wafer flattening technology. It uses a combination of mechanical polishing and alkaline solution chemical polishing. It can make the wafer surface relatively flat, laying the foundation for the product's post-process wafer processing. The common practice in the industry is to put the wafers that have undergone wire cutting, grinding, and annealing into a cleaning machine for cleaning, then use a wax applicator to stick the wafers to the surface of a flat round ceramic disc, and then move the ceramic disc with the wafers to a polishing machine for polishing. The polished ceramic disc is then moved to a cleaning machine for cleaning, and then the wafers are dewaxed and taken out. The waxing, polishing, dewaxing and ceramic disc cleaning equipment commonly used in the industry are all independent equipment with low levels of automation and incomplete equipment functions. Many processes require manual operation, and the moving distances between machines are long, and the operations require round trips. In addition, the weight of the ceramic disc is relatively large, and the workload of personnel moving back and forth is high, the safety risks are high, the operating efficiency is low, and the overall production costs are high. Summary of the invention

[0003] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a semiconductor wafer lamination and polishing automated production line, aiming to solve the shortcomings of the prior art.

[0004] To achieve the above object, the present invention is implemented through the following technical solutions: an automated production line for semiconductor wafer lamination and polishing, the production line comprising a ceramic disc wax lamination system, a wafer polishing system, a dewaxing and wafer fetching system and a master control system;

[0005] The ceramic disc waxing system comprises a waxing machine, a wafer taking robot and a waxing robot. The wafer taking robot is used to transfer the wafers stored in the wafer storage device to the waxing machine. The waxing robot is used to transfer the wafers in the waxing machine that have been waxed to a preset position. The wafer placed at the preset position is bonded to a ceramic disc that can move along a ceramic disc conveying track by the wafer bonding robot, and the ceramic discs on the ceramic disc conveying track are stacked in a movable ceramic disc storage rack by a ceramic disc stacking mechanism.

[0006] The wafer polishing system includes a polishing machine and a ceramic disc manipulator, wherein the polishing manipulator is used to grab the ceramic disc in the ceramic disc storage rack, transfer the ceramic disc to the polishing disc of the polishing machine so as to polish the wafer through the polishing machine, and grab the ceramic disc with the polished wafer attached and place it in the ceramic disc storage rack;

[0007] The dewaxing film retrieval system includes a dewaxing film retrieval machine and a dewaxing robot. The dewaxing robot is used to grab the ceramic disc in the ceramic disc storage rack and move the ceramic disc to the dewaxing film retrieval machine so that the wafer attached to the surface of the ceramic disc can be peeled off by the dewaxing film retrieval machine, and the separated ceramic disc can be grabbed by the dewaxing robot and placed in the ceramic disc storage rack.

[0008] Compared with the prior art, the semiconductor wafer lamination and polishing automated production line shown in the present invention has the following beneficial effects:

[0009] A ceramic disc conveying track is set up throughout the production line. The ceramic disc conveying track is used to convey the ceramic discs involved in the system processing. First, the ceramic disc waxing system can take, wax and attach the preset stored wafers, so that the waxed wafers can adhere to the surface of the ceramic disc. Then, the wafer polishing system is used to grab the wafers stored in the ceramic disc storage rack and polish the wafers on the ceramic disc. After the wafers on the ceramic disc are polished, the dewaxing and wafer taking system peels off the wafers on the ceramic disc, so as to facilitate the next processing step of the wafer and the storage or recycling of the ceramic disc. Therefore, in this embodiment, the wafers and ceramic discs that run through the front and rear processes of the production line do not need to be manually transported. At the same time, the coordinated operation of various systems in the production line can also be beneficial to improving production efficiency.

[0010] According to one aspect of the above technical solution, the wafer storage device includes a wafer box for storing wafers and a material box rack for storing the wafer box, the wafer retrieval robot is arranged between the material box rack and the feeding position of the wax applicator, and the wafer box is circulated between the material box rack and the feeding position by the wafer retrieval robot.

[0011] According to one aspect of the above technical solution, the number of the wafer storage devices is equal to the number of the wax applicators, and when the number of the wax applicators is multiple, the position of each wafer storage device is opposite to that of each wax applicator, and the wafer retrieval robot moves between the multiple wafer storage devices and the multiple wax applicators through a reciprocating mechanism, so as to drive the wafer retrieval robot to reciprocate between the multiple wafer storage devices and the multiple wax applicators through the reciprocating mechanism.

[0012] According to one aspect of the above technical solution, a heating component is provided at the front end of the ceramic disk conveying track close to the wafer mounting station, so as to preheat the ceramic disk that needs to be mounted through the heating component.

[0013] According to one aspect of the above technical solution, the ceramic disk conveying track is provided with a refrigeration component at the rear end close to the wafer mounting station, so as to cool the ceramic disk with the wafer mounted thereon through the refrigeration component.

[0014] According to one aspect of the above technical solution, the polishing robot is arranged on a column, and the polishing robot can move and rotate in multiple degrees of freedom, so that the polishing robot can grab the ceramic discs stored at different heights on the ceramic disc storage rack.

[0015] According to one aspect of the above technical solution, the wafer polishing system further includes a first liquid preparation device for automatically preparing a polishing mixed liquid and supplying it to the polishing machine.

[0016] According to one aspect of the above technical solution, the production line also includes a ceramic disc cleaning system for cleaning the recycled ceramic discs and conveying them to the ceramic disc conveying track at the front end of the ceramic disc waxing system.

[0017] According to one aspect of the above technical solution, the ceramic disc cleaning system includes multiple cleaning tanks and a cleaning robot, wherein the multiple cleaning tanks are respectively used to accommodate different types of cleaning liquids, and the cleaning robot is used to grab the ceramic discs on the ceramic disc storage rack and place them in each of the cleaning tanks in turn according to preset cleaning rules, and place the ceramic discs on the ceramic disc conveying track at the front end of the ceramic disc waxing system after cleaning.

[0018] According to one aspect of the above technical solution, the ceramic disc cleaning system also includes a second liquid dispensing device and a third liquid dispensing device, the second liquid dispensing device is used to automatically prepare the first cleaning liquid and supply it to one of the multiple cleaning tanks, and the second liquid dispensing device is used to prepare the second cleaning liquid and supply it to another one of the multiple cleaning tanks.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 It is a structural schematic diagram of an automatic production line for laminating and polishing semiconductor wafers according to an embodiment of the present invention;

[0022] Figure 2 It is a structural schematic diagram of a ceramic plate waxing system and a ceramic plate conveying track in an automatic production line for semiconductor wafer lamination and polishing in one embodiment of the present invention;

[0023] Figure 3 It is a schematic diagram of the structure of a wafer polishing system in an automatic production line for laminating and polishing semiconductor wafers according to an embodiment of the present invention;

[0024] Figure 4 It is a schematic diagram of the structure of a dewaxing and wafer taking system and a ceramic disc conveying track in an automatic production line for laminating and polishing semiconductor wafers according to an embodiment of the present invention;

[0025] Figure 5 It is a structural schematic diagram of a ceramic disc cleaning system and a ceramic disc conveying track in an automatic production line for semiconductor wafer lamination and polishing in one embodiment of the present invention;

[0026] Description of reference numerals:

[0027] Wafer 100, ceramic disc waxing system 10, waxing machine 11, waxing robot 12, wafer storage device 13, material box rack 131, wafer box 132, reciprocating mechanism 14, wafer taking robot 15, wafer placement robot 16, wafer temporary storage platform 17, preheating component 18, refrigeration component 19, wafer polishing system 20, polishing machine rack 21, polishing disc 22, column 23, polishing robot 24, first liquid dispensing device 25, dewaxing wafer taking system 30, dewaxing wafer taking machine 31, dewaxing wafer taking system controller 32, general control system 40, ceramic disc conveying track 50, ceramic disc 51, ceramic disc storage rack 52, ceramic disc cleaning system 60, first cleaning tank 61, second cleaning tank 62, third cleaning tank 63, fourth cleaning tank 64, second liquid dispensing device 65, third liquid dispensing device 66, ceramic disc cleaning system controller 67. DETAILED DESCRIPTION

[0028] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings. Several embodiments of the present invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right", "upper", "lower" and similar expressions used herein are for illustrative purposes only and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0030] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0031] Embodiment 1

[0032] Please combine Figure 1-5 The first embodiment of the present invention provides a semiconductor wafer lamination and polishing automated production line, the production line comprising a ceramic plate waxing system 10 for lamination of a wafer 100, a wafer polishing system 20 for polishing the wafer 100, a dewaxing and wafer-taking system 30 for peeling the wafer 100 off the ceramic plate 51, and a master control system 40;

[0033] In this embodiment, the ceramic disc waxing system 10 includes a waxing machine 11, a wafer taking robot 15 and a waxing robot 12. The wafer taking robot 15 is used to transfer the wafer 100 stored in the wafer storage device 13 to the waxing machine 11. The waxing robot 12 is used to transfer the wafer 100 in the waxing machine 11 that has been waxed to a preset position. The wafer 100 placed at the preset position is bonded to a ceramic disc 51 that can move along a ceramic disc conveying track 50 by the wafer bonding robot 16, and the ceramic disc 51 on the ceramic disc conveying track 50 is stacked in a movable ceramic disc storage rack 52 by a ceramic disc stacking mechanism.

[0034] Specifically, the waxing machine 11 includes a machine platform and a waxing table arranged on the machine platform, a waxing robot 12 is arranged on the waxing table, and a wafer picking robot 15 is arranged on the outside of the waxing table. The wafer picking robot 15 is used to clamp the wafer 100 stored in a preset manner and transfer it to the waxing table of the waxing machine 11, and the wafer 100 is waxed by the operation of the waxing robot 12; after the wafer 100 is waxed, the waxed wafer 100 temporarily stored in a preset position is clamped and transferred to the ceramic tray 51 for carrying the wafer 100 by the wafer placement robot 16 arranged on the outside of the waxing table. The ceramic tray 51 is driven by the ceramic tray conveying track 50 and can move along the arrangement path of the ceramic tray conveying track 50 to connect all systems of the production line in series to form a closed loop.

[0035] In some other embodiments, the wax-treated wafer 100 on the waxing table can be clamped by the waxing robot 12 and transferred to the ceramic plate 51 for wafer 100 bonding. Compared with the previous processing method, it requires higher coordination between the waxing processing of the waxing machine 11 and the transfer processing of the waxing robot 12, while the previous processing method can temporarily store the wax-treated wafer 100 on the waxing platform at a preset position, such as a wafer temporary storage platform 17, by the waxing robot 12, and then the wafer 100 temporarily stored on the wafer temporary storage platform 17 can be clamped by the waxing robot 12 and transferred to the ceramic plate 51 for bonding.

[0036] Among them, the wax applying machine 11 and its corresponding film taking robot 15, wax applying robot 12, and film applying robot 16 can form a group of wax applying units, and in order to improve the production efficiency of the production line, multiple groups of wax applying units can be set and evenly arranged on both sides of the ceramic disc conveying track 50, but it should be ensured that the various robots of the two groups of wax applying units will not collide during work, and the issue of floor space should also be considered. Therefore, the spacing between adjacent wax applying units should be reasonably set.

[0037] In order to facilitate the transportation of ceramic trays, in this embodiment, the ceramic tray 51 with the wax-treated wafer 100 is transported through the ceramic tray conveying track 50, and the ceramic tray is stacked in a preset manner at a preset position through a ceramic tray stacking mechanism. After the stacking reaches a certain number, the batch of stacked ceramic trays 51 are transported together.

[0038] Specifically, a ceramic disc stacking mechanism is provided at the output intersection of the ceramic disc 51 on the ceramic disc conveying track 50 between the multiple groups of waxing units, through which the ceramic discs 51 output by the multiple groups of waxing units are stacked in a ceramic disc storage rack 52, and the ceramic disc storage rack 52 is provided with a plurality of storage grids, each for storing ceramic discs, so as to avoid collision between the ceramic disc 51 and the wafer 100 attached to the ceramic disc 51. In the present embodiment, the ceramic disc storage rack 52 is provided on the ceramic disc conveying track 50, and is driven by the ceramic disc conveying track 50 to move along the arrangement path.

[0039] After the wafer 100 is waxed and chipped, it is necessary to polish the waxed wafer 100 attached to the ceramic disk 51. Therefore, in this embodiment, a wafer polishing system 20 for polishing the wafer 100 is provided at the rear end of the ceramic disk waxing system 10, that is, the wafer polishing system 20 is provided in the downstream process of the ceramic disk waxing system 10, and in order to improve the transportation efficiency of the wafer 100 before and after polishing, the wafer polishing system 20 is provided on the outer side of the ceramic disk conveying track 50.

[0040] In this embodiment, the wafer polishing system 20 includes a polishing machine and a ceramic disk manipulator, wherein the polishing manipulator 24 is used to grab the ceramic disk 51 in the ceramic disk storage rack 52, transfer the ceramic disk 51 to the polishing disk 22 of the polishing machine so as to polish the wafer 100 through the polishing machine, and grab the ceramic disk 51 with the polished wafer 100 and place it in the ceramic disk storage rack 52;

[0041] Specifically, the polishing machine is provided with a polishing machine frame 21 and a clamping assembly arranged on the frame for clamping the ceramic disk 51, and a polishing assembly for polishing the wafer 100 on the ceramic disk, wherein the clamping assembly can be provided in multiple groups, each for clamping a ceramic disk 51, and the polishing assembly can be provided in one group for polishing the wafer 100 on the ceramic disk 51 clamped by the clamping assembly, or multiple groups of polishing assemblies can be provided accordingly; preferably, multiple groups of clamping assemblies are provided, and only one group of polishing assemblies is provided.

[0042] After the wafer 100 on the ceramic disk 51 is polished by the polishing machine, the ceramic disk on the clamping assembly is grabbed by the ceramic disk robot, and the ceramic disk 51 is placed in the ceramic disk storage rack 52 again according to preset rules.

[0043] When polishing the wafer 100, in order to improve the polishing efficiency and polishing quality, in this embodiment, the wafer polishing system 20 also includes a first liquid dispensing device 25 for automatically preparing a polishing mixed liquid and supplying it to the polishing machine. The first liquid dispensing device 25 is fixedly placed in the upper and lower positions of the polishing assembly in the polishing machine. The first liquid dispensing device 25 is mainly used to mix the polishing liquid and the alkaline solution in a certain proportion to produce a polishing mixed liquid that meets the requirements, and pump it to the corresponding polishing machine through a delivery pipe. The waste liquid that has lost its polishing effect is discharged into the drainage ditch on the ground through an automatic switching valve and enters the sewage pipe for environmental protection treatment.

[0044] After polishing the wafer 100, it is necessary to peel off the wafer 100 attached to the ceramic disk 51 so as to separate the wafer 100 from the ceramic disk 51, so as to facilitate the processing of the wafer 100 in subsequent processes (such as dewaxing the wafer 100) and the storage or reuse of the ceramic disk 51. Therefore, in this embodiment, a dewaxing and wafer picking system 30 for peeling the wafer 100 on the ceramic disk is provided at the rear end of the wafer polishing system 20, that is, the dewaxing and wafer picking system 30 is provided in the downstream process of the wafer polishing system 20, and in order to improve the transportation efficiency before and after dewaxing and wafer picking, the dewaxing and wafer picking system 30 is provided on the outer side of the ceramic disk conveying track 50.

[0045] In this embodiment, the dewaxing film extraction system 30 includes a dewaxing film extraction machine 31 and a dewaxing robot. The dewaxing robot is used to grab the ceramic disc 51 in the ceramic disc storage rack 52, move the ceramic disc 51 to the dewaxing film extraction machine 31, so that the wafer 100 attached to the surface of the ceramic disc 51 can be peeled off by the dewaxing film extraction machine 31, and the separated ceramic disc 51 is grabbed by the dewaxing robot and placed in the ceramic disc storage rack 52.

[0046] Specifically, the dewaxing robot is used to grab the ceramic tray 51 with the wafer 100 stored in the ceramic tray storage rack 52, and transfer it to the dewaxing film retrieval machine 31, and the dewaxing film retrieval component of the dewaxing film retrieval machine 31 peels off the wafer 100 on the ceramic tray 51, thereby separating the ceramic tray 51 from the wafer 100; and after the ceramic tray 51 is separated from the wafer 100, the wafer 100 is automatically loaded into the wafer box 132, and the ceramic tray 51 is loaded into the ceramic tray storage rack 52; specifically, the dewaxing film retrieval system 30 is controlled by the dewaxing film retrieval system controller 32.

[0047] In summary, the semiconductor wafer lamination and polishing automated production line shown in this embodiment has the following beneficial effects:

[0048] A ceramic disc conveying track 50 is set up throughout the production line. The ceramic disc conveying track 50 is used to convey the ceramic disc 51 involved in the system processing. First, the ceramic disc waxing system 10 can take, wax and attach the preset wafer 100, so that the waxed wafer 100 can be attached to the surface of the ceramic disc 51, and then the wafer polishing system 20 is used to grab the wafer 100 stored in the ceramic disc storage rack 52 and polish the wafer 100 on the ceramic disc 51. After the wafer 100 on the ceramic disc 51 is polished, the dewaxing and film taking system 30 will peel off the wafer 100 on the ceramic disc 51, so as to facilitate the next processing step of the wafer 100 and the storage or recycling of the ceramic disc 51. Therefore, in this embodiment, the wafers 100 and ceramic discs 51 that run through the front and rear processes of the production line do not need to be manually transported. At the same time, the coordinated operation of various systems in the production line can also be beneficial to the improvement of production efficiency.

[0049] Embodiment 2

[0050] Please combine again Figure 1-5 The second embodiment of the present invention provides an automated production line for semiconductor wafer lamination and polishing. In the production line shown in this embodiment, the mechanical equipment of each system is mainly improved so that the coordinated operation of the system components can be smoother and more efficient.

[0051] In this embodiment, the wafer storage device 13 includes a wafer box 132 for storing wafers 100 and a material box rack 131 for storing the wafer box 132. The wafer picking robot 15 is arranged between the material box rack 131 and the feeding position of the wax applicator 11, and the wafer box 132 is cyclically placed between the material box rack 131 and the feeding position by the wafer picking robot 15. The number of the wafer storage devices 13 is equal to the number of the wax applicators 11, and when the number of the wax applicators 11 is multiple, that is, when there are multiple wax applicators 11, each of the wafer storage devices 13 is opposite to each of the wax applicators 11, and the wafer picking robot 15 moves between the multiple wafer storage devices 13 and the multiple wax applicators 11 through a reciprocating mechanism 14, so as to drive the wafer picking robot 15 to reciprocate between the multiple wafer storage devices 13 and the multiple wax applicators 11 through the reciprocating mechanism 14.

[0052] Specifically, the material box rack 131 is a frame structure with multiple layers, each layer is provided with multiple storage positions, and the wafer box 132 is stored in the storage position of the material box rack 131; when there are two wax sticking machines 11, that is, when there are two groups of wax sticking units, the film taking robot 15 is arranged on a reciprocating mechanism 14, which includes a track and a driving mechanism, and the film taking robot 15 is movably arranged on the track and driven by the driving mechanism to reciprocate, so that the film taking robot 15 can take films for two groups of wax sticking units at the same time, and of course, its film taking rhythm should be reasonably set; for example For example, when the wax applicator 11 in one group of wax applying units is applying wax to the wafer 100, the driving mechanism drives the film-taking robot 15 to move along the track to between the wax applicator 11 in another group of wax applying units and the wafer storage device 13, so that the wafer box 132 stored in the material box rack 131 can be clamped and transferred to the preparation station of the wax applicator 11 by the film-taking robot 15, and then the wafer 100 in the wafer box 132 can be taken out and placed on the wax applying table by the wax applicator 12 on the wax applying table, so as to facilitate the waxing treatment of the wafer 100.

[0053] In order to improve the wax sticking efficiency of the wafer 100 on the ceramic disc, the ceramic disc conveying track 50 is provided with a preheating component 18 at the front end close to the wafer 100 mounting station, so as to preheat the ceramic disc that needs to be mounted through the preheating component 18. After the ceramic disc reaches a certain temperature, the ceramic disc conveying track 50 drives the ceramic disc to move to the mounting station. At this time, the mounting robot 16 sticks the wafer 100 stored in the preset position on the surface of the preheated ceramic disc, so that the wafer 100 and the ceramic disc are combined to form a whole. In addition, the ceramic disc conveying track 50 is provided with a refrigeration component 19 at the rear end near the wafer 100 mounting station, so as to cool the ceramic disc with the wafer 100 mounted thereon through the refrigeration component 19. After the temperature of the wafer 100 and the ceramic disc drops to a certain temperature, the ceramic disc conveying track 50 can continue to convey the ceramic disc to the preparation station of the ceramic disc stacking mechanism, and the ceramic disc stacking mechanism will stack the cooled wafer 100 and the ceramic disc in the ceramic disc storage rack 52 according to preset stacking rules.

[0054] In the wafer polishing system 20, the polishing robot 24 is arranged on a column, and the polishing robot 24 can move and rotate in multiple degrees of freedom, that is, it can move horizontally on the horizontal plane, move on the vertical plane, and rotate 360° at any position, so that the polishing robot 24 can grab the ceramic discs stored at different heights on the ceramic disc storage rack 52.

[0055] In a preferred embodiment of the present invention, after the wafer 100 is separated from the ceramic disc, in order to facilitate the recycling of the ceramic disc, the production line also includes a ceramic disc cleaning system 60, which is used to clean the recycled ceramic disc and transport it to the ceramic disc conveying track 50 at the front end of the ceramic disc waxing system 10.

[0056] Specifically, the ceramic disc cleaning system 60 includes a plurality of cleaning tanks and a cleaning robot. The plurality of cleaning tanks can be arranged side by side on a cleaning cabinet, including a first cleaning tank 61, a second cleaning tank 62, a third cleaning tank 63 and a fourth cleaning tank 64. The plurality of cleaning tanks are respectively used to accommodate different types of cleaning liquids, such as dewaxing agents, cleaning agents, etc., to remove wax scraps and impurities remaining on the surface of the ceramic disc; wherein the cleaning robot (not shown) is used to grab the ceramic disc on the ceramic disc storage rack 52 and place it in each of the cleaning tanks in turn according to a preset cleaning rule. For example, if the ceramic disc needs to be dewaxed first, the cleaning robot grabs the ceramic disc and places it in the first cleaning tank 61 storing the dewaxing agent. After the dewaxing is completed, the cleaning robot takes out the ceramic disc and places it in the next second cleaning tank 62 storing the cleaning agent. The remaining third cleaning tank 63 and fourth cleaning tank 64 are respectively used for solute pure water, and after cleaning, the ceramic disc is placed on the ceramic disc conveying track 50 at the front end of the ceramic disc waxing system 10.

[0057] Among them, the ceramic disc cleaning system 60 also includes a second liquid dispensing device 65 and a third liquid dispensing device 66, the second liquid dispensing device 65 is used to automatically prepare the first cleaning liquid and supply it to one of the multiple cleaning tanks, that is, Figure 64, the second liquid dispensing device 65 is used to prepare the second cleaning liquid and supply it to another one of the multiple cleaning tanks, that is, Figure 63; specifically, the ceramic disc cleaning system 60 is controlled by a ceramic disc cleaning system controller 67.

[0058] In some other feasible embodiments of the present invention, the ceramic disc cleaning system 60 also includes an air-drying component or a baking unit for removing residual cleaning agents on the surface of the ceramic disc. The cleaning robot clamps the ceramic disc and performs an air-drying or baking process to quickly remove the cleaning agent or pure water remaining on the surface of the ceramic disc, and after removal, the ceramic disc is placed back onto the ceramic disc conveying track 50 to participate in the next cycle of patch, polishing and retrieval.

[0059] In summary, the semiconductor wafer lamination and polishing automated production line shown in this embodiment has at least the following beneficial effects:

[0060] A ceramic disc conveying track 50 is set up throughout the production line. The ceramic disc conveying track 50 is used to convey the ceramic disc 51 involved in the system processing. First, the ceramic disc waxing system 10 can take, wax and attach the preset wafer 100, so that the waxed wafer 100 can be attached to the surface of the ceramic disc 51, and then the wafer polishing system 20 is used to grab the wafer 100 stored in the ceramic disc storage rack 52 and polish the wafer 100 on the ceramic disc 51. After the wafer 100 on the ceramic disc 51 is polished, the dewaxing and film taking system 30 will peel off the wafer 100 on the ceramic disc 51, so as to facilitate the next processing step of the wafer 100 and the storage or recycling of the ceramic disc 51. Therefore, in this embodiment, the wafers 100 and ceramic discs 51 that run through the front and rear processes of the production line do not need to be manually transported. At the same time, the coordinated operation of various systems in the production line can also be beneficial to the improvement of production efficiency.

[0061] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0062] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the attached claims.

Claims

1. A semiconductor wafer lamination and polishing automated production line, characterized in that: The production line includes a ceramic disc waxing system, a wafer polishing system, a dewaxing wafer taking system and a master control system; The ceramic disc waxing system comprises a waxing machine, a wafer taking robot and a waxing robot. The wafer taking robot is used to transfer the wafers stored in the wafer storage device to the waxing machine. The waxing robot is used to transfer the wafers in the waxing machine that have been waxed to a preset position. The wafer placed at the preset position is bonded to a ceramic disc that can move along a ceramic disc conveying track by the wafer bonding robot, and the ceramic discs on the ceramic disc conveying track are stacked in a movable ceramic disc storage rack by a ceramic disc stacking mechanism. The wafer polishing system includes a polishing machine and a ceramic disc manipulator, wherein the polishing manipulator is used to grab the ceramic disc in the ceramic disc storage rack, transfer the ceramic disc to the polishing disc of the polishing machine so as to polish the wafer through the polishing machine, and grab the ceramic disc with the polished wafer attached and place it in the ceramic disc storage rack; The dewaxing wafer taking system comprises a dewaxing wafer taking machine and a dewaxing robot. The dewaxing robot is used to grab the ceramic disc in the ceramic disc storage rack and move the ceramic disc to the dewaxing wafer taking machine so as to peel off the wafer attached to the surface of the ceramic disc through the dewaxing wafer taking machine, and the separated ceramic disc is grabbed by the dewaxing robot and placed in the ceramic disc storage rack; The wafer storage device comprises a wafer box for storing wafers and a material box rack for storing the wafer box, the wafer taking robot is arranged between the material box rack and the feeding position of the wax sticking machine, and the wafer box is cyclically placed between the material box rack and the feeding position by the wafer taking robot; The number of the wafer storage devices is equal to the number of the wax applicators, and when there are multiple wax applicators, each of the wafer storage devices is located opposite to each of the wax applicators, and the wafer retrieval robot moves between the multiple wafer storage devices and the multiple wax applicators through a reciprocating mechanism, so as to drive the wafer retrieval robot to move back and forth between the multiple wafer storage devices and the multiple wax applicators through the reciprocating mechanism.

2. The semiconductor wafer lamination and polishing automated production line according to claim 1, characterized in that: The ceramic disk conveying track is provided with a heating component at the front end close to the wafer mounting station, so as to preheat the ceramic disk that needs to be mounted by the heating component.

3. The semiconductor wafer lamination and polishing automated production line according to claim 2, characterized in that: The ceramic disc conveying track is provided with a refrigeration component at the rear end close to the wafer mounting station, so as to cool the ceramic disc with the wafer mounted thereon through the refrigeration component.

4. The semiconductor wafer lamination and polishing automated production line according to claim 1, characterized in that: The polishing robot is arranged on a column, and the polishing robot can move and rotate in multiple degrees of freedom, so as to grab the ceramic discs stored at different heights on the ceramic disc storage rack through the polishing robot.

5. The semiconductor wafer lamination and polishing automated production line according to claim 1, characterized in that: The wafer polishing system also includes a first liquid preparation device for automatically preparing a polishing mixed liquid and supplying the mixed liquid to the polishing machine.

6. The semiconductor wafer lamination and polishing automated production line according to any one of claims 1 to 5, characterized in that: The production line also includes a ceramic disc cleaning system for cleaning the recycled ceramic discs and conveying them to the ceramic disc conveying track at the front end of the ceramic disc waxing system.

7. The semiconductor wafer lamination and polishing automated production line according to claim 6, characterized in that: The ceramic disc cleaning system includes multiple cleaning tanks and a cleaning robot. The multiple cleaning tanks are respectively used to accommodate different types of cleaning liquids. The cleaning robot is used to grab the ceramic discs on the ceramic disc storage rack and place them in each of the cleaning tanks in turn according to preset cleaning rules, and place the ceramic discs on the ceramic disc conveying track at the front end of the ceramic disc waxing system after cleaning.

8. The semiconductor wafer lamination and polishing automated production line according to claim 7, characterized in that: The ceramic disc cleaning system also includes a second liquid dispensing device and a third liquid dispensing device, wherein the second liquid dispensing device is used to automatically prepare a first cleaning liquid and supply it to one of the multiple cleaning tanks, and the second liquid dispensing device is used to prepare a second cleaning liquid and supply it to another of the multiple cleaning tanks.

Images