Method for making high temperature resistant electronic tag

Abstract

The present invention relates to the technical field of electronic tags and discloses a method for producing high-temperature-resistant electronic tags. A first sealant layer, a second sealant layer, and a third sealant layer having successively decreasing melting points are provided above a radio frequency chip of the electronic tag produced by the present invention, and the melting point of the lowest sealant layer is not less than 230 degrees. When the electronic tag produced by the present invention is continuously used in a high-temperature environment of 230 degrees or above, even if the third sealant layer and the second sealant layer melt and flow, the first sealant layer does not melt, thereby preventing damage and impact to the radio frequency chip caused by heat conduction and high temperature. Furthermore, because the first sealant layer remains in a solid state, the radio frequency chip can be prevented from falling off, thereby preventing the problem of failure or severe weakening of the tag performance due to high temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic tags, and in particular to a method for manufacturing a high-temperature resistant electronic tag. Background Art

[0002] At present, electronic tags have been widely used in various fields such as product anti-counterfeiting, product production line management, warehouse management, asset management, electricity, railways, transportation, logistics and medical care. Product traceability is achieved by obtaining data from electronic tags.

[0003] Most commonly used electronic tags have an antenna and an RFID chip soldered onto the surface of a substrate. If the RFID chip is a surface-mount package, surface-mount pads are placed on the substrate. Glue is then used to seal the substrate, giving the resulting electronic tag a certain degree of high-temperature resistance. However, when this type of electronic tag is continuously exposed to high temperatures, such as in harsh environments like logistics warehousing, industrial production line asset management, production processes, and product lifecycle tracking found in heavy industries like automotive, high-speed rail, shipbuilding, and aircraft manufacturing, the encapsulation glue can easily become liquid due to temperatures exceeding 200 degrees Celsius, melting the pads on the substrate where the RFID chip is soldered. Furthermore, the RFID chip is soldered only to the surface of the substrate, lacking any positioning or limiting measures. Ultimately, the fluidity of the liquid glue can cause the RFID chip to move away from its initial soldering position, affecting the performance of the electronic tag. Summary of the Invention

[0004] In view of the shortcomings of the background technology, the present invention provides a method for manufacturing high-temperature resistant electronic tags. The technical problem to be solved is that the existing electronic tags have poor high-temperature resistance. When the existing electronic tags are continuously used in a high-temperature environment above 200 degrees, the radio frequency chip of the electronic tag is easy to deviate from the original welding position, affecting the performance of the electronic tag.

[0005] To solve the above technical problems, the present invention provides the following technical solution: a method for manufacturing a high-temperature resistant electronic tag, comprising the following steps:

[0006] S1: providing a substrate plate, wherein a groove is formed inwardly on the top of the substrate plate;

[0007] S2: Printing a first antenna on the top surface of the substrate plate in a partial area on the left side of the groove, on the left side wall of the groove, and on the left area on the bottom surface of the groove; printing a second antenna on the bottom surface of the substrate plate, in a partial area on the right side of the substrate plate, and on the top surface of the substrate plate in a partial area on the right side of the groove, on the right side wall of the groove, and on the right area on the bottom surface of the groove; the first antenna and the second antenna on the bottom surface of the groove form a feeding port;

[0008] S3: Welding the RF chip to the feeding port through a welding process, so that the first antenna and the second antenna are electrically connected to the RF chip;

[0009] S4: First fill the groove with a first sealant, and then solidify the first sealant to form a first sealant layer, wherein the first sealant layer covers the RF chip, the first antenna on the bottom of the groove, and the second antenna on the bottom of the groove, and the height of the first sealant layer is higher than the RF chip.

[0010] As a further technical solution, the present invention further comprises the following steps:

[0011] S5: Providing a bottom cover, wherein a first groove is formed inwardly on a top surface of the bottom cover, and a second groove is formed inwardly on a bottom surface of the first groove;

[0012] S6: first placing the substrate plate with the first sealant layer formed thereon into the second groove, then filling the second groove with a second sealant, and finally curing the second sealant to form a second sealant layer;

[0013] S7: first filling the first groove with a third sealant, and then curing the third sealant to form a third sealant layer;

[0014] S8: Provide a top cover and seal the top cover to the bottom cover.

[0015] Furthermore, the melting point of the first sealant layer is greater than the melting point of the second sealant layer, and the melting point of the second sealant layer is greater than the melting point of the third sealant layer.

[0016] Furthermore, the melting point of the third sealant layer is greater than 230 degrees.

[0017] Furthermore, in step S8, the bottom cover and the top cover are sealed and connected by ultrasonic or integrated injection molding process.

[0018] Furthermore, the top surface of the first sealant layer produced in step S4 is flush with the inlet surface of the groove, or the top surface of the first sealant layer produced in step S4 is lower than the inlet surface of the groove;

[0019] The top surface of the second sealing adhesive layer is flush with the inlet surface of the second groove, and the top surface of the third sealing adhesive layer is flush with the inlet surface of the first groove.

[0020] When the top surface of the first sealant layer produced in step S4 is lower than the inlet surface of the groove, a second sealant is further filled into the area above the first sealant layer in the groove in step S6.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. The radio frequency chip of the electronic tag produced by the present invention is provided with a first sealant layer, a second sealant layer, and a third sealant layer with successively decreasing melting points, and the melting point of the lowest sealant layer is not less than 230 degrees. When the electronic tag produced by the present invention is continuously used in a high temperature environment of 230 degrees or above, even if the third and second sealant layers melt and flow, the first sealant layer does not melt, thereby preventing damage and impact to the radio frequency chip caused by heat conduction and high temperature. Moreover, because the first sealant layer remains solid, it can prevent the radio frequency chip from falling off, avoiding the problem of failure or severe weakening of the tag performance due to high temperature.

[0023] 2. Even under extremely high temperatures, the first sealant layer melts and the flowing first sealant layer causes the RF chip to begin to move. However, due to the restriction of the groove, the RF chip is still connected to the feeding port at the bottom of the groove, that is, electrically connected to the first antenna and the second antenna, ensuring the normal RF performance of the electronic tag.

[0024] 3. The bottom cover and top cover of the electronic tag manufactured by the method of the present invention are sealed and connected, which can achieve waterproof and dustproof properties of the electronic tag;

[0025] 4. The substrate plate of the electronic tag manufactured by the method of the present invention is covered and protected by the second sealant layer and the third sealant layer, and the electronic tag has good shock resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a flow chart of the present invention;

[0027] Figure 2 Schematic diagram of the structure of the substrate plate of the present invention;

[0028] Figure 3 A schematic structural diagram of the first antenna and the second antenna of the invention;

[0029] Figure 4 This is a schematic diagram of the connection between the first antenna, the second antenna and the radio frequency chip of the present invention;

[0030] Figure 5 It is a schematic diagram of the structure of the bottom cover and the bottom cover separated from each other according to the present invention;

[0031] Figure 6 This is a schematic structural diagram of the substrate plate of the present invention being placed in the third groove of the bottom cover;

[0032] Figure 7 Schematic diagram of the structure after the bottom cover and the top cover are sealed and connected in the embodiment;

[0033] Figure 8 This is a schematic diagram of a first arrangement of the first sealant layer, the second sealant layer, and the third sealant layer in the embodiment;

[0034] Figure 9 Schematic diagram of a second arrangement of the first sealant layer, the second sealant layer and the third sealant layer in the embodiment;

[0035] Figure 10 This is a simulation diagram of S11 of the RFID electronic tag of the present invention placed on a metal carrier;

[0036] Figure 11 This is a schematic diagram of a simulation of the standing wave ratio of the RFID electronic tag of the present invention placed on a metal carrier;

[0037] Figure 12 This is a schematic diagram of impedance simulation of the RFID electronic tag of the present invention placed on a metal carrier;

[0038] Figure 13 This is a simulation diagram of S11 of the RFID electronic tag of the present invention placed on a non-metallic carrier;

[0039] Figure 14 This is a schematic diagram of VSWR simulation when the RFID electronic tag of the present invention is placed on a non-metallic carrier. DETAILED DESCRIPTION

[0040] The present invention will now be described in further detail with reference to the accompanying drawings, which are simplified schematic diagrams that illustrate the basic structure of the present invention in a schematic manner.

[0041] like Figure 1 As shown, the method for making a high temperature resistant electronic tag includes the following steps:

[0042] S1: Provide a substrate plate 1, wherein a groove 2 is formed inwardly on the top of the substrate plate 1;

[0043] The structural diagram of the substrate plate 1 is as follows Figure 2 As shown, Figure 2 The top of the substrate plate has a groove 2 defined inwardly. The length, width, and height of the groove 2 are 2.5 mm, 2.5 mm, and 1.0 mm, respectively. The substrate plate 1 is made of ceramic. In certain embodiments, the substrate plate 1 can be made of other materials, such as Teflon or Rogers FR4, depending on the requirements of the electronic tag or circuit board being manufactured. In certain embodiments, multiple grooves 2 can be defined inwardly on the top surface of the substrate plate 1 to accommodate different IC chips.

[0044] S2: Printing a first antenna 3 on the top surface of the substrate plate 1 in a partial area on the left side of the groove 2, on the left side wall of the groove 2, and on the left area of the bottom surface of the groove 2; printing a second antenna 3 on the bottom surface of the substrate plate 1, on a partial area on the right side of the substrate plate 1, on a partial area on the right side of the groove 2 on the top surface of the substrate plate 1, on the right side wall of the groove 2, and on the right area of the bottom surface of the groove 2; the first antenna 3 and the second antenna 4 on the bottom surface of the groove 2 form a feeding port;

[0045] Specifically, if Figure 3 and 4 As shown, the first antenna 3 includes a first horizontal portion 30, a first vertical portion 31, and a second horizontal portion 32. The first horizontal portion 30 is printed on the top surface of the substrate plate 1 in a partial area on the left side of the groove 2, and the width of the first horizontal portion 30 is the same as the width of the substrate plate 1; the first vertical portion 31 is printed on the left side wall of the groove 2, and the first vertical portion 31 covers the entire left side wall of the groove 2; the second horizontal portion 32 is printed on the bottom surface of the groove 2 in a partial area on the left side of the RF chip 5, and the width of the second horizontal portion 32 is less than the width of the groove 2;

[0046] The second antenna 4 includes a third horizontal portion 40, a second vertical portion 41, a fourth horizontal portion 42, a third vertical portion 43 and a fifth horizontal portion 44. The third horizontal portion 40 is printed on the bottom surface of the substrate plate 1 and covers the entire bottom surface of the substrate plate 1. The second vertical portion 41 is printed on a partial area of the right side of the substrate plate 1. The fourth horizontal portion 42 is printed on a partial area of the top surface of the substrate plate 1 on the right side of the groove 2. The third vertical portion 43 is printed on the right side wall of the groove 2 and covers the entire right side wall of the groove 2. The fifth horizontal portion 44 is printed on a partial area of the bottom surface of the groove 2 on the right side of the RF chip 5, and the width of the fifth horizontal portion 44 is smaller than the width of the groove 2.

[0047] S3: Welding the RF chip 5 to the feeding port through a welding process, so that the first antenna 3 and the second antenna 4 are electrically connected to the RF chip 5;

[0048] S4: First fill the first sealant into the groove 2, and then cure the first sealant to form a first sealant layer 100. The first sealant layer 100 covers the RF chip 5, the first antenna 3 on the bottom of the groove 2, and the second antenna 4 on the bottom of the groove 2. The height of the first sealant layer 100 is higher than the RF chip 5.

[0049] During actual production, the first sealing adhesive layer 100 can be formed in the entire groove 2, in which case the top surface of the first sealing adhesive layer 100 is flush with the inlet surface of the groove 2; or the first sealing adhesive layer 100 can be formed in a portion of the space above the RF chip 5 in the groove 2, in which case the top surface of the first sealing adhesive layer 100 is lower than the inlet surface of the groove 2;

[0050] In actual use, since the length, width and height of the mainstream RF chip 5 are 2.0 mm, 2.0 mm and 0.5 mm respectively, the electronic tag manufactured by steps S1 to S4 of the present invention is manufactured by welding the RF chip 5 inside the groove 2. When the electronic tag manufactured by the method of the present invention is in a high-temperature environment, even if the first sealant layer 100 melts and flows, the groove 2 limits the position of the RF chip 5, and the RF chip 5 can still be connected to the feeding port, thereby ensuring that the electronic tag can work normally.

[0051] Furthermore, in order to enhance the shock resistance of the electronic tag manufactured by the method of the present invention, reduce production costs and increase the yield of finished products, the method of the present invention further includes the following steps:

[0052] S5: providing a bottom cover 6, wherein a first groove 60 is formed inwardly on the top surface of the bottom cover 6, and a second groove 61 is formed inwardly on the bottom surface of the first groove 60;

[0053] The structural diagram of the bottom cover 6 is as follows Figure 5 As shown, in addition Figure 6 The structural diagram in also includes the top cover 7 used in step S8;

[0054] S6: firstly, placing the substrate plate 1 with the first sealant layer 100 formed thereon into the second groove 61, then filling the second sealant into the second groove 61, and finally curing the second sealant to form a second sealant layer;

[0055] Specifically, after the first sealant layer 100 is formed in the entire space within the groove 2, step S6 forms the second sealant layer 101 only in the second groove 61; when the first sealant layer 100 is formed in the partial space above the RF chip 5 in the groove 2, step S6 also fills the second sealant into the area of the groove 2 where the first sealant layer 100 is not formed, and then forms the second sealant layer in the area of the groove 2 where the first sealant layer 100 is not formed; the top surface of the second sealant layer 101 is flush with the inlet surface of the second groove 61;

[0056] S7: first filling the first groove 60 with a third sealant, and then curing the third sealant to form a third sealant layer 102;

[0057] Specifically, the top surface of the third sealant layer 102 is flush with the inlet surface of the first groove 60;

[0058] The two structural schematic diagrams of the first sealant layer 100, the second sealant layer 101 and the third sealant layer 102 of the electronic tag manufactured in the present invention are shown in FIG. Figure 8 and Figure 9 shown; in Figure 8 In the embodiment, a first sealing adhesive layer 100 is formed in the entire groove 2. Figure 9In the embodiment, a first sealing adhesive layer 100 is formed in a partial area above the RF chip 5 in the groove 2, and a second sealing adhesive layer 101 is formed in the second groove 61 and in the space in the groove 2 where the first sealing adhesive layer 100 is not formed;

[0059] In this embodiment, the melting point of the first sealant layer 100 is greater than the melting point of the second sealant layer 101, and the melting point of the second sealant layer 101 is greater than the melting point of the third sealant layer 102. The melting point of the third sealant layer 102 is not less than 230 degrees. In actual use, the first sealant layer 100, the second sealant layer 101, and the third sealant layer 102 can all be made of epoxy resins with different melting points;

[0060] In actual production, since the higher the melting point of the sealant layer, the higher the corresponding price cost, the higher the curing temperature required for the sealant and the longer the curing time, and the higher the curing temperature and the longer the curing time, the higher the curing temperature and the longer the curing time will affect the shape and structure of the bottom cover, and it is easy to cause problems such as bulging on the bottom cover; and by manufacturing the first sealant layer 100, the second sealant layer 101 and the third sealant layer 102 with successively lower melting points, the invention can reduce the production cost of manufacturing the electronic tag, and on the other hand, the melting point of the sealant is reduced, and the curing temperature and time are both reduced, which can reduce the impact of the curing of the sealant on the bottom cover 6; in addition, by placing the substrate plate 1 in the second groove 61 and then curing and protecting it with the second sealant layer 101 and the third sealant layer 102, the shock resistance of the electronic tag manufactured by the method of the present invention can be increased;

[0061] S8: Provide the top cover 7 and seal the top cover 6 to the bottom cover 7;

[0062] Specifically, in step S8 , the bottom cover 6 and the top cover 7 are sealed and connected by ultrasonic or integrated injection molding process.

[0063] In summary, the electronic tag manufactured by the present invention uses a first sealant layer 100, a second sealant layer 101, and a third sealant layer 102 with different melting points to solidify and protect the RF chip 5, and the melting point of the lowest sealant layer is not lower than 230 degrees. When the electronic tag manufactured by the present invention is continuously used in a high-temperature environment of 230 degrees or above, even if the third sealant layer 102 and the second sealant layer 101 melt and flow, the first sealant layer 100 does not melt, thereby avoiding damage and impact to the RF chip 5 due to heat conduction and high temperature. Moreover, since the first sealant layer 100 is still in a solid state, the RF chip 5 can be prevented from falling off, thereby avoiding the problem of failure or severe weakening of the tag performance due to high temperature.

[0064] Secondly, the groove 2 restricts the position of the RF chip 5. Even under extremely high temperatures, the first sealant layer 100 melts and the flowing first sealant layer 100 causes the RF chip 5 to begin to move. However, due to the restriction of the groove 2, the RF chip 5 is still connected to the bottom of the groove 2, that is, the feeding area, ensuring the normal RF performance of the electronic tag.

[0065] In addition, the bottom cover 6 and the top cover 7 are sealed and connected, which can make the electronic tag waterproof and dustproof;

[0066] Finally, the substrate plate 1 is covered and protected by the first sealant layer 100 , the second sealant layer 101 and the third sealant layer 102 . The electronic tag manufactured by the present invention has good shock resistance.

[0067] In this embodiment, the model of the RF chip 5 is ALIEN-HIGGS8, the typical value of its equivalent input parallel capacitance is 0.85Pf, the typical value of its equivalent input parallel resistance is 2500.00ohm, and its input impedance is calculated to be: 16-j202 ohm@920Mhz. Combined with the structure of the first antenna 3 and the second antenna 4, the above impedance values are input, the RFID electronic tag is placed in an engineering plastic box, and the box is placed on a 150*150mm metal plate. Through simulation, the schematic diagram is as follows Figure 9 、 Figure 10 and Figure 11 As shown, from Figure 9 、 Figure 10 As shown in Figure 11, the RFID tag's S11 value at around 920 MHz reaches -35 dB, its standing wave ratio is less than 1.1, and its impedance matching reaches 16.07 + j212.7 ohms (no further optimization will be performed without affecting mass production). Furthermore, its gain is approximately 3.7e + 000, achieving conjugate matching. In actual production and testing, the RFID chip 5 can be activated at distances up to 10 meters using professional IoT data exchange equipment, achieving long-distance identification and data collection interaction. The RFID tag was also subjected to a drop test, dropping from 1.5 meters above concrete at any angle. The tag's appearance and RF performance remained unchanged, demonstrating shock and drop resistance.

[0068] Furthermore, the 150X150 metal plate is removed so that the RFID electronic tag can be simulated in the air (non-metallic environment carrier). The simulation diagram is shown as follows: Figure 12 and Figure 13 As shown, from Figure 12 and Figure 13It can be seen that after removing the metal plate carrier, the RFID electronic tag still achieved a sensitivity value below -30dB in the frequency range of about 906Mhz (the frequency range of China and the United States is 902-928MHz), the standing wave ratio is much less than 1.5, and the gain value is about 1.5e+000, which has excellent non-metallic carrier reading characteristics.

[0069] According to the above simulation test results, the RFID electronic tag of the present invention can achieve excellent characteristics of reading and data interaction regardless of whether it is applied to a metal carrier or a non-metal carrier, breaking away from the limitations of its radio frequency characteristics on metal, non-metal and other carriers, and achieving multi-adaptability.

[0070] The above description is for inspiration. Based on the above description, relevant personnel can make various changes and modifications without departing from the technical concept of this invention. The technical scope of this invention is not limited to the content of the specification, but must be determined according to the scope of the claims.

Claims

1. A method for producing a high temperature resistant electronic tag, characterized in that: The steps include: S1: providing a substrate plate, wherein a groove is formed inwardly on the top of the substrate plate; S2: Printing a first antenna on the top surface of the substrate plate in a partial area on the left side of the groove, on the left side wall of the groove, and on the left area on the bottom surface of the groove; printing a second antenna on the bottom surface of the substrate plate, in a partial area on the right side of the substrate plate, and on the top surface of the substrate plate in a partial area on the right side of the groove, on the right side wall of the groove, and on the right area on the bottom surface of the groove; the first antenna and the second antenna on the bottom surface of the groove form a feeding port; S3: Welding the RF chip to the feeding port through a welding process, so that the first antenna and the second antenna are electrically connected to the RF chip; S4: First, fill the groove with a first sealant, and then cure the first sealant to form a first sealant layer. The first sealant layer completely covers the bottom surface of the groove. The first sealant layer covers the RF chip, the first antenna on the bottom surface of the groove, and the second antenna on the bottom surface of the groove. The height of the first sealant layer is higher than the RF chip. S5: Providing a bottom cover, wherein a first groove is formed inwardly on a top surface of the bottom cover, and a second groove is formed inwardly on a bottom surface of the first groove; S6: first placing the substrate plate with the first sealant layer formed thereon into the second groove, then filling the second groove with a second sealant, and finally curing the second sealant to form a second sealant layer; S7: first filling the first groove with a third sealant, and then curing the third sealant to form a third sealant layer; S8: providing a top cover and sealingly connecting the top cover to the bottom cover; The melting point of the first sealant layer is greater than that of the second sealant layer, and the melting point of the second sealant layer is greater than that of the third sealant layer.

2. The method for manufacturing a high temperature resistant electronic tag according to claim 1, characterized in that: The melting point of the third sealant layer is greater than 230 degrees.

3. The method for manufacturing a high temperature resistant electronic tag according to claim 1, characterized in that: In step S8 , the bottom cover and the top cover are sealed together by ultrasonic or integrated injection molding.

4. The method for manufacturing a high temperature resistant electronic tag according to claim 1, characterized in that: The top surface of the first sealant layer produced in step S4 is flush with the inlet surface of the groove, or the top surface of the first sealant layer produced in step S4 is lower than the inlet surface of the groove; The top surface of the second sealing adhesive layer is flush with the inlet surface of the second groove, and the top surface of the third sealing adhesive layer is flush with the inlet surface of the first groove.

5. The method for manufacturing a high temperature resistant electronic tag according to claim 4, characterized in that: When the top surface of the first sealant layer produced in step S4 is lower than the inlet surface of the groove, a second sealant is further filled into the area above the first sealant layer in the groove in step S6.

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