A slot plugging part, a manufacturing method of a PCB side wall circuit, and a PCB

Abstract

The present invention relates to the technical field of PCBs, and discloses a slot plugging member, a method for manufacturing a PCB sidewall circuit, and a PCB. The slot plugging member is used to plug into a through slot where a sidewall circuit is to be manufactured, and the slot plugging member includes an electroplating body that is hollow inside and made of a copper-platable material; the outer structure of the electroplating body is the same as the inner structure of the through slot, and the outer dimensions are the same as the inner dimensions of the through slot; the inner wall of the electroplating body is provided with an anti-plating film, and the anti-plating film is provided with a gap, and the shape, size, and position of the gap and the sidewall circuit are the same. In an embodiment of the present invention, a slot plugging member with a partial plating resistance function is used to plug into the through slot, and then the through slot is subjected to conventional copper electroplating to manufacture a refined sidewall circuit on the side wall of the through slot, and the sidewall circuit is used to replace conventional metallized vias for signal transmission, which greatly reduces the circuit width compared to metallized vias, thereby effectively improving the signal transmission quality.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB (Printed Circuit Boards), and in particular to a slot plugging member, a manufacturing method of a PCB side wall circuit, and a PCB. Background Art

[0002] With the rapid development of electronic communication technology, the requirements for the anti-interference ability of signal lines in PCB boards are becoming higher and higher. PCBs usually use vias with metalized inner walls to transmit signals, but from line to hole, due to the parasitic capacitance of the conductive hole, the via has a greater impact on impedance and signal. Summary of the invention

[0003] The object of the present invention is to provide a slot plugging member, a method for manufacturing a PCB side wall circuit and a PCB, so as to solve the problem of parasitic capacitance when using vias to realize signal transmission in the prior art.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] A slot plugging member is used to plug into a through slot where a side wall circuit is to be made, the slot plugging member comprises an electroplating body which is hollow inside and made of a copper-platable material;

[0006] The outer structure of the electroplating body is the same as the inner structure of the through slot, and the outer dimensions are the same as the inner dimensions of the through slot;

[0007] The inner wall of the electroplating body is provided with an anti-plating film, and the anti-plating film is provided with a gap, and the shape, size and position of the gap and the side wall circuit are the same.

[0008] Optionally, the anti-plating film is only provided on a local area of ​​the inner wall of the electroplating body, and the local area covers the area where the side wall circuit is to be manufactured and its peripheral area.

[0009] Optionally, the anti-plating film is made of an anti-electroplating material.

[0010] Optionally, the outer side wall of the electroplated body is also coated with an adhesive for bonding with the inner wall of the through groove.

[0011] A method for manufacturing a PCB sidewall circuit comprises the following steps:

[0012] Providing a printed circuit board, processing a through groove in a circuit pre-grooving area on the printed circuit board;

[0013] Inserting the slot plugging member described in any one of the above items into the through slot;

[0014] The through slots that have been plugged with the slot plugging member are subjected to copper electroplating to form the sidewall circuits in the gaps on the anti-plating film.

[0015] Optionally, the anti-plating film is only provided on a local area of ​​the inner wall of the electroplating body, and the local area covers the area where the side wall circuit is to be produced and its peripheral area, so that while the side wall circuit is formed by the copper plating, a plating layer for realizing the electromagnetic shielding function is also formed on the area of ​​the inner wall of the electroplating body that is not covered by the anti-plating film.

[0016] Optionally, the manufacturing method also includes: after the sidewall circuit is formed, performing copper electroplating on the entire printed circuit board; plating a protective layer on the inner wall of the plug hole structure; etching and removing part of the surface copper on the outer layer surface of the printed circuit board to form an outer layer circuit connected to the sidewall circuit; and removing the protective layer.

[0017] Optionally, the protective layer is tin.

[0018] Optionally, the sidewall line is a differential signal line.

[0019] A PCB comprises a through slot having a side wall circuit, wherein the side wall circuit is manufactured according to the manufacturing method of the PCB side wall circuit as described above.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] In an embodiment of the present invention, a slot plugging member with a partial plating resistance function is inserted into the through slot, and then conventional copper electroplating is performed on the through slot to produce a refined sidewall circuit on the sidewall of the through slot. The sidewall circuit is used to replace conventional metallized vias for signal transmission. Compared with metallized vias, the circuit width and parasitic capacitance are greatly reduced, thereby effectively improving the signal transmission quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A schematic diagram of a slot plugging member and its slot plugging effect provided in an embodiment of the present invention.

[0024] Figure 2 A flow chart of a method for manufacturing a PCB sidewall circuit provided in an embodiment of the present invention.

[0025] Figure 3A schematic structural diagram of a PCB having sidewall circuits and outer layer circuits provided in an embodiment of the present invention.

[0026] Explanation of the reference numerals: slot plug 1, electroplating body 11, anti-plating film 12, gap 121, through slot 2, side wall circuit 3, electromagnetic shielding layer 4, outer layer circuit 5. DETAILED DESCRIPTION

[0027] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] In order to solve the problem of large signal loss when using existing metallized vias to transmit signals, the embodiment of the present invention provides a new solution, firstly a novel slot plug 1 with a partial plating resistance function is inserted into the through slot 2, and then the through slot 2 is subjected to conventional copper electroplating, so that a sidewall line 3 can be made on the side wall of the through slot 2, forming a through slot 2 with a sidewall line 3. The sidewall line 3 is used to replace conventional metallized vias for signal transmission, which greatly reduces the line width and parasitic capacitance compared with metallized vias, and thus can effectively reduce signal loss.

[0029] See also Figure 1 The embodiment of the present invention provides a slot plugging member 1, which is used to plug into a through slot 2 where a side wall circuit 3 is to be made. The slot plugging member 1 includes a plating body 11 which is hollow inside and made of a non-conductive material that can be copper plated;

[0030] The outer structure of the electroplating body 11 is the same as the internal structure of the through slot 2, and the outer dimensions are the same as the internal dimensions of the through slot 2; the inner wall of the electroplating body 11 is provided with an anti-plating film 12, and the anti-plating film 12 is provided with a gap 121, and the shape, size and position of the gap 121 and the side wall circuit 3 are the same.

[0031] The anti-plating film 12 can be made of any material that cannot be electroplated with copper, such as a non-polar material.

[0032] It can be understood that when plugging into the through slot 2, since the outer wall of the electroplated body 11 of the slot plug 1 can maintain a fit with the inner wall of the through slot 2, and the electroplated body 11 is made of a copper-platable material, and the inner wall of the electroplated body 11 is provided with an anti-plating film 12 with a gap 121, when the through slot 2 is completely immersed in the copper plating / electroplating solution, the corresponding position of the electroplated body 11 and the anti-plating film 12 can react with the copper plating / electroplating solution, and since the gap 121 is completely consistent with the side wall circuit 3 to be produced in shape, size, position, etc., a side wall circuit 3 can be formed on the electroplated body 11 at the position of the gap 121 after copper plating.

[0033] In practical applications, the processing parameters of the gap 121 can be determined in advance according to the shape, size and position of the sidewall circuit 3 to be manufactured. Since the gap 121 is provided on the anti-plating film 12, not only is the processing simple and the difficulty is low, but the processing accuracy can reach a relatively high standard, meeting the manufacturing requirements of high-precision circuits. Therefore, by using the slot plugging member 1 provided in the embodiment of the present invention, a high-precision sidewall circuit 3 can be manufactured.

[0034] In order to improve the signal transmission quality of the sidewall circuit 3, the anti-plating film 12 can be selected to be provided only in a local area of ​​the inner wall of the electroplating body 11, and the local area covers the area to be made of the sidewall circuit 3 and its peripheral area. In this way, except for the gap 121 position on the anti-plating film 12, other areas of the electroplating body 11 without the anti-plating film 12 can be copper plated to form an electroplating layer. The electroplating layer, because it is spaced apart from the sidewall circuit 3 and is provided in a large area, can be used as an electromagnetic shielding layer 4 to exert an electromagnetic shielding function.

[0035] In addition, the outer wall of the electroplated body 11 can also be coated with an adhesive for bonding with the inner wall of the through slot 2. In this way, after the slot plugging member 1 is inserted into the through slot 2, the slot plugging member 1 is bonded with the inner wall of the through slot 2 to further improve the stability of the slot plugging member 1.

[0036] See also Figure 2 The embodiment of the present invention further provides a method for manufacturing a PCB sidewall circuit, comprising the steps of:

[0037] Step 101: Provide a printed circuit board, and process a through groove 2 in a circuit pre-grooving area on the printed circuit board.

[0038] Specifically, the printed circuit board can be obtained by first stacking and pressing the boards according to conventional procedures, and then the through groove 2 can be processed on the printed circuit board.

[0039] Step 102 , insert the slot plugging member 1 into the through slot 2 , so that the slot plugging member 1 as a whole fits with the inner wall of the through slot 2 .

[0040] In this embodiment, since the external structure of the electroplating body 11 is the same as the internal structure of the through slot 2, and the external dimensions are the same as the internal dimensions of the through slot 2, in this step, after the slot plugging component 1 is completely inserted into the through slot 2, no other processing is required to achieve the outer wall of the slot plugging component 1 and the inner wall of the through slot 2 to fit together.

[0041] Step 103 , copper electroplating is performed on the through slot 2 that has been inserted into the slot plugging member 1 to form an electroplating layer on the inner wall of the electroplating body 11 of the slot plugging member 1 at a position corresponding to the gap 121 on the anti-plating film 12 , and the electroplating layer is the side wall circuit 3 of the through slot 2 .

[0042] In this embodiment, since the electroplating body 11 of the slot plug 1 is made of a copper-platable material, the electroplating body 11 is provided with a plating-resistant film 12 with a gap 121 matching the intended sidewall circuit 3 (such as a differential signal line), and the position of the gap 121 can be plated with copper plating solution, so after copper plating, the inner wall of the electroplating body 11 will form a preset sidewall circuit 3 at the position corresponding to the gap 121. In the entire manufacturing process, it is only necessary to manufacture an adaptive slot plug 1 according to the through slot 2, and then perform copper plating after inserting the slot plug 1 into the through slot 2. It is not only simple to operate, low in processing difficulty, but also high in manufacturing precision, so that the finally obtained through slot 2 with high-precision sidewall circuit 3 can effectively replace the metallized via to realize the signal transmission function, and overcome the various defects existing in the metallized via when realizing signal transmission.

[0043] The anti-plating film 12 can be provided only in a local area of ​​the inner wall of the electroplating body 11, and the local area covers the area to be made of the sidewall circuit 3 and its peripheral area. In this way, in step 103, while the sidewall circuit 3 is formed by copper plating, a plating layer can also be formed in the area of ​​the inner wall of the electroplating body 11 not covered by the anti-plating film 12. Since the plating layer has a large area and is separated from the sidewall circuit 3 by the anti-plating film 12, it can realize the electromagnetic shielding function and serve as the electromagnetic shielding layer 4 to prevent other surrounding signal holes from generating electromagnetic wave interference to the sidewall circuit 3.

[0044] It should be noted that after copper electroplating, the electroplating layer on the inner wall of the electroplated body 11 of the slot plug 1 will serve as the side wall circuit 3 and the electromagnetic shielding layer 4 of the through slot 2 respectively. At the same time, the slot plug 1 is a hollow structure as a whole and has no other adverse effects or interference on the printed circuit board. Therefore, the slot plug 1 does not need to be removed after copper electroplating.

[0045] For practical applications, please refer to Figure 3 After the side wall circuit 3 is prepared, the outer layer circuit 5 can be prepared according to the following method: copper plating is performed on the entire printed circuit board; a protective layer (such as tin) is plated on the inner wall of the plug hole structure; a portion of the surface copper is etched away on the outer layer surface of the printed circuit board to form an outer layer circuit 5 connected to the side wall circuit 3; and the protective layer is removed.

[0046] In summary, the method for manufacturing the PCB side wall circuit 3 provided in the embodiment of the present invention only requires inserting an adaptive slot plugging member 1 into the through slot 2 and then performing copper electroplating to obtain the side wall circuit 3 in the through slot 2, thereby replacing the metallized via to realize signal transmission, thereby effectively improving the signal transmission quality.

[0047] The embodiment of the present invention also provides a PCB having a through slot 2 with a side wall circuit 3, wherein the side wall circuit 3 is made according to the manufacturing method of the PCB side wall circuit as described above. The PCB has a high signal transmission quality because it uses a high-precision side wall circuit 3 to realize signal transmission between inner and outer layers.

[0048] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a PCB sidewall circuit, characterized in that: Includes steps: Providing a printed circuit board, and processing a through groove in a circuit pre-grooved area on the printed circuit board; Insert a slot plug into the through slot, wherein the slot plug is used to plug into the through slot where the side wall circuit is to be made, and the slot plug includes a plating body which is hollow inside and is made of a copper-platable material; the outer structure of the plating body is the same as the inner structure of the through slot, and the outer dimensions are the same as the inner dimensions of the through slot; an anti-plating film is provided on the inner wall of the plating body, and a gap is provided on the anti-plating film, and the shape, size and position of the gap and the side wall circuit are the same; the anti-plating film is only provided on a local area of ​​the inner wall of the plating body, and the local area covers the area where the side wall circuit is to be made and its peripheral area, so that while the side wall circuit is formed by the copper plating, a plating layer for realizing electromagnetic shielding function is also formed on the area of ​​the inner wall of the plating body not covered by the anti-plating film; The through slots that have been plugged with the slot plugging member are subjected to copper electroplating to form the sidewall circuits in the gaps on the anti-plating film.

2. The method for manufacturing a PCB sidewall circuit according to claim 1, characterized in that: The anti-plating film is made of anti-electroplating material.

3. The method for manufacturing a PCB sidewall circuit according to claim 1, characterized in that: The outer side wall of the electroplating body is also coated with an adhesive for bonding with the inner wall of the through groove.

4. The method for manufacturing a PCB sidewall circuit according to claim 1, characterized in that: The manufacturing method also includes: after the side wall circuit is formed, the entire printed circuit board is copper plated; a protective layer is plated on the inner wall of the slot plug; a portion of the surface copper is removed by etching on the outer layer surface of the printed circuit board to form an outer layer circuit connected to the side wall circuit; and the protective layer is removed.

5. The method for manufacturing a PCB sidewall circuit according to claim 4, characterized in that: The protective layer is tin.

6. The method for manufacturing a PCB sidewall circuit according to claim 1, characterized in that: The sidewall lines are differential signal lines.

7. A PCB, comprising a through slot having sidewall circuits, characterized in that: The side wall circuit is manufactured according to the manufacturing method of the PCB side wall circuit according to any one of claims 1 to 6.

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