Wafer temporary storage device and chemical mechanical polishing equipment

Abstract

The present invention provides a wafer temporary storage device and chemical mechanical polishing equipment, which belong to the technical field of wafer polishing. The wafer temporary storage device includes: a water barrier, a positioning column and a position detection mechanism. At least three positioning columns are provided, which are distributed along a circle on the water barrier. The top of the positioning column is provided with a positioning surface for positioning the side of the wafer. All the positioning surfaces locate a positioning circle with a diameter the same as the diameter of the wafer on the water barrier. At least three position detection mechanisms are also provided, which are distributed along the positioning circle on the water barrier. The position detection mechanism forms a detection point on the water barrier for judging whether there is a wafer at the current position, and the detection point is located on the inner side of the positioning circle. Through the setting of the positioning column, the wafer can be positioned on the water barrier, and by judging whether the wafer is detected at each detection point, it can be accurately judged whether the placement posture of the wafer is accurate, ensuring that the robot can accurately grab the wafer.

Description

Technical Field

[0001] The invention relates to the technical field of wafer polishing, and in particular to a wafer temporary storage device and chemical mechanical polishing equipment. Background Art

[0002] A wafer temporary storage device is set up in the chemical mechanical polishing equipment for wafers to temporarily store wafers waiting to be processed. The wafers on the temporary storage device are automatically picked up and placed by a robot.

[0003] At present, the wafer temporary storage device only positions the wafer by setting positioning posts, but it is impossible to determine whether the position of the wafer is accurately positioned. If the position of the wafer on the positioning posts is offset, the subsequent robot arm may easily fail to grasp the wafer or damage the wafer when grasping it. Summary of the invention

[0004] Therefore, in order to solve the defect that the wafer status cannot be determined in the prior art, the present invention provides a wafer temporary storage device and a chemical mechanical polishing equipment.

[0005] In a first aspect, the present invention provides a wafer temporary storage device, comprising:

[0006] Water tray;

[0007] There are at least three positioning posts, which are spaced apart in a circle on the water-isolating plate, and the tops of the positioning posts are provided with positioning surfaces for positioning the sides of the wafers, and all the positioning surfaces are used to position a positioning circle on the water-isolating plate, the diameter of which matches the diameter of the wafers; and

[0008] There are at least three position detection mechanisms, which are spaced apart on the water-isolating plate along the positioning circle. The position detection mechanisms form detection points on the water-isolating plate for determining whether there is a wafer at the current position, and the detection points are located inside the positioning circle.

[0009] Optionally, the position detection mechanism includes:

[0010] A wafer measuring nozzle connected to the water-isolating plate, the wafer measuring nozzle is provided with a contact surface for supporting the bottom of the wafer, a detection nozzle hole penetrating the contact surface is provided in the wafer measuring nozzle, and the detection nozzle hole is located on the inner side of the positioning circle;

[0011] a delivery pipeline connected to the test piece nozzle and used for delivering fluid into the test piece nozzle; and

[0012] The fluid pressure sensor is arranged on the delivery pipeline to detect the change of fluid pressure in the delivery pipeline.

[0013] Optionally, at least two detection nozzles are provided on each of the wafer testing nozzles, and a hole distance between two adjacent detection nozzles is greater than a notch width of the wafer.

[0014] Optionally, the position detection mechanism further includes a pressure-stabilizing valve, the pressure-stabilizing valve is connected to the delivery pipeline, and the fluid pressure sensor is located between the pressure-stabilizing valve and the measuring piece nozzle.

[0015] Optionally, the positioning surface is a conical surface with a radius gradually decreasing from bottom to top;

[0016] And / or, a positioning plane connected to the lower end of the positioning surface is formed on the positioning column, and the contact surface is higher than the positioning plane and lower than the top end of the positioning column.

[0017] Optionally, the temporary storage device further includes side support plates, and at least two water-blocking trays are provided and are spaced apart and connected to the side support plates.

[0018] Optionally, at least one of the water-isolating trays is provided with a moisturizing spray hole and a channel, the moisturizing spray hole is communicated with the channel, and the channel is connected to a liquid supply pipeline for conveying moisturizing liquid into the channel;

[0019] And / or, the water-blocking trays are arranged in groups of two, the two water-blocking trays in each group are spaced apart in the vertical direction, and the water-blocking tray at the bottom is provided with the moisturizing spray holes.

[0020] Optionally, a plurality of the moisturizing spray holes are provided and are distributed along the circle at intervals, and all of the moisturizing spray holes are connected to the channel.

[0021] Optionally, a drainage groove is provided on the water-isolating tray, the surface of the water-isolating tray is inclined toward one side of the drainage groove, and the drainage groove is connected to a drainage pipe.

[0022] On the other hand, the present invention further provides a chemical mechanical polishing device, which has the temporary storage device, and the wafers in the processing process are temporarily stored by the temporary storage device.

[0023] The technical solution of the present invention has the following advantages:

[0024] 1. The temporary storage device provided by the present invention has positioning posts and position detection mechanisms arranged on the water-isolating tray along a circular interval. At least three positioning posts can position the wafer on the water-isolating tray and enable the edge of the wafer to accurately fall on each positioning point. At least three positioning points can also form a detection circle on the water-isolating tray. That is, it is possible to determine whether the wafer is correctly placed by judging whether there is a wafer at the detection point, thereby ensuring that the robot arm can accurately grab the wafer.

[0025] 2. The temporary storage device provided by the present invention, after the wafer is pressed on the contact surface of the measuring piece nozzle, will cover the detection nozzle hole, so that the fluid pressure in the conveying pipeline will change. By judging the value change of the fluid pressure sensor, it can be determined whether there is a wafer at the detection point. Moreover, when detecting the polished wafer, it is not easy to make a misjudgment due to the polishing liquid attached to the wafer, and the detection accuracy is high.

[0026] 3. The temporary storage device provided by the present invention has at least two detection nozzles on the measuring nozzle. When the notch on the edge of the wafer is facing the measuring nozzle, the presence of the notch will not cause the two detection nozzles to be completely within the notch, thereby ensuring that the wafer can block at least one detection nozzle on the measuring nozzle, so that pressure changes can be generated in the conveying pipeline, thereby improving the accuracy of wafer position detection.

[0027] 4. The temporary storage device provided by the present invention has moisturizing spray holes on the water-isolating tray, which can continuously spray water to the wafers temporarily stored on the water-isolating tray, so that the polished surface of the wafers remains moist, reducing the time that uncleaned wafers are exposed to the air, and improving the quality and yield of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 Schematic diagram of the structure of the wafer temporary storage device in this embodiment;

[0030] Figure 2 It is a structural schematic diagram of the position arrangement of the positioning column and the position detection mechanism in this embodiment;

[0031] Figure 3 It is a cross-sectional view of the connection relationship between the measuring piece nozzle, the conveying pipeline, the fluid pressure sensor and the pressure regulating valve in the position detection mechanism;

[0032] Figure 4 It is a schematic diagram of the structure of the test piece nozzle and the top surface detection nozzle hole;

[0033] Figure 5 A local schematic diagram showing a notch structure on a wafer;

[0034] Figure 6 A schematic diagram of the state of a wafer notch corresponding to one of the detection nozzles;

[0035] Figure 7 It is a structural schematic diagram of the positioning surface and the supporting surface on the positioning column;

[0036] Figure 8 A partial cross-sectional view showing the height relationship between the contact surface on the measuring nozzle and the support surface on the positioning column;

[0037] Fig. 9 for Figure 8 A magnified view of part A;

[0038] Fig.10 A partial cross-sectional view of the moisturizing spray holes, channels, liquid supply pipelines and control valve structures on the water-blocking plate.

[0039] Description of reference numerals:

[0040] 1. Water-blocking tray; 11. Moisturizing spray hole; 12. Channel; 13. Drainage trough; 14. Water retaining edge; 2. Positioning column; 21. Positioning surface; 22. Support surface; 3. Position detection mechanism; 31. Test piece nozzle; 311. Contact surface; 312. Detection spray hole; 313. Connection hole; 314. Sealing ring; 315. Interface; 316. Conversion joint; 32. Delivery pipeline; 33. Fluid pressure sensor; 34. Pressure regulating valve; 4. Liquid supply pipeline; 41. Control valve; 5. Side support plate; 6. Drainage pipe; 7. Wafer; 71. Notch. DETAILED DESCRIPTION

[0041] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0045] Example 1

[0046] This embodiment provides a wafer temporary storage device, referring to Figure 1 and Figure 2 , which includes a water-blocking plate 1, a positioning column 2 and a position detection mechanism 3.

[0047] The water-blocking tray 1 is a horizontally arranged flat plate, and the positioning columns 2 and the position detection mechanism 3 are both installed on the water-blocking tray 1. There are at least three positioning columns 2, which are distributed on the water-blocking tray 1 along a circular interval. The top of the positioning columns 2 is provided with a positioning surface 21. Through the positioning surfaces 21 on all the positioning columns 2, a positioning circle with a diameter that matches the wafer 7 can be positioned above the water-blocking tray 1, thereby positioning the wafer 7. There are also at least three position detection mechanisms 3, which are also distributed on the water-blocking tray 1 along the circular intervals where the positioning columns 2 are distributed. The position detection mechanism 3 forms a detection point on the water-blocking tray 1 for determining whether there is a wafer 7 at the current position, and the detection point is located on the inner side of the positioning circle.

[0048] When the temporary storage device mentioned above temporarily stores wafer 7, the robot places wafer 7 between the positioning columns 2, and uses the positioning surface 21 to position wafer 7 on the water-blocking tray 1. The edge position of wafer 7 will fall at each detection point, and whether the position of wafer 7 is accurate can be determined by whether the detection point senses wafer 7, thereby achieving the purpose of detecting whether the placement position of wafer 7 is accurate, ensuring that the robot can accurately grasp wafer 7.

[0049] In this embodiment, the position detection mechanism 3 includes a measuring nozzle 31 , a delivery pipeline 32 , a fluid pressure sensor 33 and a pressure regulating valve 34 .

[0050] Reference Figure 3 and Figure 4The interior of the film measuring nozzle 31 is hollow, and a contact surface 311 is provided on the top of the film measuring nozzle 31. The contact surface 311 is a plane. The contact surfaces 311 of all the film measuring nozzles 31 are located on the same horizontal plane. The contact surface 311 is used to contact the bottom of the edge of the wafer 7, and can support the wafer 7. A detection nozzle 312 is provided on the film measuring nozzle 31. The detection nozzle 312 is connected to the interior of the film measuring nozzle 31 and penetrates the contact surface 311, and the detection nozzle 312 is located on the inner side of the positioning circle. The delivery pipeline 32 is connected to the film measuring nozzle 31, and is used to deliver fluid to the interior of the film measuring nozzle 31. The fluid can be liquid or gas. In this embodiment, liquid is used. The fluid pressure sensor 33 and the pressure regulating valve 34 are both installed on the delivery pipeline 32. The fluid pressure sensor 33 is located between the pressure regulating valve 34 and the film measuring nozzle 31. The fluid pressure sensor 33 is used to detect the pressure change of the fluid inside the delivery pipeline 32, and the pressure regulating valve 34 is used to adjust the fluid pressure provided by the factory.

[0051] The position detection mechanism 3 described above, the position of the detection nozzle 312 is the detection point. After the wafer 7 is placed between all the positioning columns 2, the bottom of the edge of the wafer 7 will fit with the contact surface 311, and block the detection nozzle 312, resulting in the fluid being unable to be smoothly ejected from the detection nozzle 312, which will cause the fluid pressure in the delivery pipeline 32 to change, thereby judging whether the wafer 7 is sensed by judging the pressure change detected by the fluid pressure sensor 33. The setting of the pressure regulating valve 34 can adjust the fluid pressure passing through the pressure regulating valve 34, so that the fluid pressure sensor 33 will not be affected by the pressure change on the side of the fluid delivery source, thereby improving the accuracy of the detection.

[0052] The closer the position of the detection nozzle 312 is to the edge of the wafer 7, the closer the circle that the detection nozzle 312 can locate will be to the wafer 7, and the higher the detection accuracy will be. In this embodiment, the diameter of the detection circle located by the detection nozzle 312 and the positioning circle located by the positioning surface 21 differ by 2 mm, that is, the detection nozzle 312 contacts the area of ​​the edge of the wafer 7 with a width of 2 mm, and this area belongs to the non-processing area of ​​the wafer 7, and the processing quality of the wafer 7 will not be affected by the contact with the wafer 7.

[0053] In this embodiment, the delivery pipeline 32 is provided with one and is connected to all the detection nozzles 31. Only one fluid pressure sensor 33 is also provided, so that the fluid pressure sensor 33 detects the pressure change of the entire pipeline. A preset value is set in the fluid pressure sensor 33. When the wafer 7 blocks all the detection nozzles 312, the pressure change of the entire pipeline reaches the preset value, and it can be determined that the wafer 7 exists on the water-blocking tray 1 and is in the correct position. If the pressure change of the pipeline does not reach the preset value, it indicates that the wafer 7 is placed in the wrong position.

[0054] Further, refer to Figure 5Due to the processing technology of the wafer 7, there is a notch 71 on the edge of the wafer 7, and when the robot places the wafer 7, the position of the notch 71 is also random. If the notch 71 corresponds exactly to the detection nozzle 312 of one of the measuring nozzles 31, the wafer 7 will not be able to block the detection nozzle 312, resulting in a smaller pressure difference in the conveying pipeline 32, which cannot meet the preset value requirement, causing the position detection mechanism 3 to make a wrong judgment.

[0055] Therefore, in order to solve the defect that the notch 71 may cause the position detection mechanism 3 to make a wrong judgment, refer to Figure 4 and Figure 6 In this embodiment, at least two detection nozzles 312 are provided on each wafer measuring nozzle 31, and the detection nozzles 312 are arranged in a circular pattern on the wafer measuring nozzle 31, and the hole distance between two adjacent detection nozzles 312 is greater than the maximum width of the notch 71. By providing at least two detection nozzles 312, when the notch 71 is directly opposite to the wafer measuring nozzle 31, all the detection nozzles 312 will not be in the notch 71, ensuring that the wafer 7 covers at least one of the detection nozzles 312, so that the fluid pressure sensor 33 can also sense the pressure change in the conveying pipeline 32, thereby achieving the purpose of accurately determining the position of the wafer 7.

[0056] In this embodiment, three detection nozzles 312 are provided on each wafer nozzle 31, so that the wafer 7 can block at least two detection nozzles 312, making the pressure change in the conveying pipeline 32 more obvious and the detection effect better. Of course, more detection nozzles 312 can also be provided. The more detection nozzles 312 that can be blocked by the wafer 7, the greater the pressure change in the conveying pipeline 32 will be, and the higher the detection accuracy will be.

[0057] Further, refer to Figure 3 and Figure 4 Two connecting holes 313 are provided at the bottom of the measuring film nozzle 31. The measuring film nozzle 31 is fixed to the surface of the water-isolating tray 1 by screws passing through the connecting holes 313, and a sealing ring 314 is installed in the connecting gap between the measuring film nozzle 31 and the water-isolating tray 1 to ensure the sealing of the connecting gap between the measuring film nozzle 31 and the water-isolating tray 1. An interface 315 is provided on the side of the measuring film nozzle 31 facing away from the center of the positioning circle. A conversion joint 316 is connected to the interface 315, and the conveying pipeline 32 is connected to the measuring film nozzle 31 through the conversion joint 316. The end of the conveying pipeline 32 away from the measuring film nozzle 31 is bent downward, and is fixed on the side support plate 5 after penetrating the water-isolating tray 1. The conveying pipeline 32 extends to the bottom of the water-isolating tray 1 to connect the fluid pressure sensor 33 and the pressure regulating valve 34, which will not interfere with the positioning and detection of the wafer 7.

[0058] As an alternative embodiment, the position detection mechanism 3 may also use a photosensitive sensor or a proximity sensor to detect whether there is a wafer 7 at the current position. However, since the polished wafer 7 will have polishing liquid on it, when the polished wafer 7 is stored, the polishing liquid can easily interfere with the photosensitive sensor and the proximity sensor, resulting in a poor detection effect.

[0059] In this embodiment, refer to Figure 7 The positioning surface 21 is a conical surface with a diameter that gradually decreases from bottom to top, so that the diameter of the inscribed circle formed at the top of the positioning surface 21 is larger than the diameter of the wafer 7, making it easier for the wafer 7 to be placed between all the positioning pillars 2, and the conical surface has a guiding function, so that the wafer 7 can fall more accurately on the contact surface 311 of the measuring nozzle 31, thereby improving the positioning effect.

[0060] As an alternative implementation, the positioning surface 21 may be a vertically arranged plane or cylinder, or a spherical surface or an inclined plane, both of which can achieve the positioning function of the wafer 7.

[0061] Further, refer to Figure 8 and Fig. 9 , the positioning column 2 is also connected to a support surface 22 at the lowest end of the positioning surface 21. The support surface 22 is a horizontal surface, and the support surface 22 can play the role of supporting the wafer 7. However, the support surface 22 needs to be flush with the contact surface 311 so that the wafer 7 can be supported on the support surface 22 and the contact surface 311 at the same time. Due to the factors of errors in processing and assembly, it is impossible to ensure that the support surface 22 and the contact surface 311 are absolutely flush. If the height of the support surface 22 is higher than the contact surface 311, the wafer 7 will not be able to fit with the contact surface 311, and the detection nozzle 312 will not be covered, which is prone to detection and judgment errors. Therefore, in this embodiment, the height of the contact surface 311 is higher than the support surface 22 and lower than the top of the positioning surface 21, so that the wafer 7 is only supported on the contact surface 311, which can ensure that the wafer 7 can accurately fit with the contact surface 311.

[0062] Furthermore, the diameter of the positioning circle formed by the positioning surface 21 may be consistent with the diameter of the wafer 7, but when the wafer falls, it is easy to be affected by the tilt of the positioning surface 21, resulting in the problem of the wafer 7 being tilted, so that the wafer 7 cannot accurately fall on the contact surface 311. Therefore, the diameter of the positioning circle formed by the positioning surface 21 needs to be larger than the diameter of the wafer 7. In this embodiment, the diameter of the positioning circle formed by the positioning surface 21 is larger than the diameter of the wafer 7 by 1 mm, so that the wafer 7 can be positioned and accurately fall on the contact surface 311, which is conducive to the stable fitting of the wafer 7 and the contact surface 311.

[0063] In this embodiment, refer to Figure 2There are five positioning posts 2, which are distributed on the water isolation plate 1 according to the structure of the clamp for grabbing the wafer 7, so that the positioning posts 2 do not interfere with the action of the clamp when grabbing the wafer 7. There are four position detection mechanisms 3, which are symmetrically distributed on both sides of the water isolation plate 1 in groups of two. When the wafer 7 is placed on the measuring nozzle 31, the symmetrically arranged measuring nozzle 31 can provide a more stable support effect for the wafer 7, and also provide enough space for the clamp to move when grabbing the wafer 7.

[0064] As an alternative embodiment, the number of position detection mechanisms 3 and positioning columns 2 can be only three or more. Under the premise of not interfering with the movement of the clamping jaws, the greater the number of wafer measuring nozzles 31, the more accurate the detection and judgment of the position of the wafer 7 will be.

[0065] In addition, the number of water-blocking trays 1 can be only one, and both the wafers 7 to be processed and the wafers 7 that have been polished and are waiting to be cleaned can be temporarily stored on the water-blocking tray 1. The number of water-blocking trays 1 can also be multiple, and each water-blocking tray 1 can store one wafer 7, and the wafers 7 to be processed and the polished wafers 7 are temporarily stored on different water-blocking trays 1, so that the robot can carry the wafers 7 in a more orderly manner.

[0066] Further, refer to Figure 1 and Fig.10 The water-isolating tray 1 for temporarily storing the wafer 7 after polishing is also provided with a moisturizing spray hole 11, a channel 12, a liquid supply pipeline 4 and a control valve 41. There are multiple moisturizing spray holes 11 and they are evenly distributed on the surface of the water-isolating tray 1 along a circle. The channel 12 is opened inside the water-isolating tray 1 and is connected with all the moisturizing spray holes 11. The liquid supply pipeline 4 is connected with the channel 12 and is used for conveying moisturizing liquid into the channel 12. The control valve 41 is connected to the liquid supply pipeline 4. The control valve 41 can control the on / off and flow rate of the moisturizing liquid.

[0067] Polishing liquid will adhere to the polished surface of wafer 7. If the polishing liquid dries up during the temporary storage process, it will affect the quality and yield of wafer 7. The polished wafer 7 is placed on a water-blocking tray 1 provided with a moisturizing spray hole 11, and the polished side of wafer 7 is placed downward. The moisturizing liquid is transported to the channel 12 through the liquid supply pipeline 4. The moisturizing liquid is sprayed out from each moisturizing spray hole 11 through the channel 12 and sprayed onto wafer 7, providing a moist environment for wafer 7. This prevents the polished wafer 7 from drying out before brushing, thereby improving the quality and yield of wafer 7.

[0068] Further, refer to Figure 1Each water-isolating tray 1 is provided with drainage grooves 13 on both sides opposite to each other, and the middle part of the top of the water-isolating tray 1 is convex upward, so that its surface is in a state of being tilted downward on both sides. The drainage grooves 13 are located at the lower end of the surface of the water-isolating tray 1, so that the fluid sprayed from the detection nozzle 312 and the moisturizing liquid sprayed from the moisturizing nozzle 11 will flow and converge into the drainage grooves 13 on both sides. One end of the drainage groove 13 is also tilted downward, and the lowest end of the drainage groove 13 is connected to the drainage pipe 6. The liquid gathered in the flow channel will enter the drainage pipe 6 along the drainage groove 13, and the sprayed liquid will be recycled and reused through the transportation of the drainage pipe 6, forming a recycling of liquid, achieving the effect of energy saving and environmental protection. In addition, an upwardly protruding water retaining edge 14 is integrally formed at the edge of the top surface of the water-isolating tray 1 to prevent the accumulated water in the water-isolating tray 1 from flowing out from the edge.

[0069] In this embodiment, refer to Figure 1 , four water-blocking trays 1 are provided, and the four water-blocking trays 1 are mutually parallel and spaced apart in the vertical direction. The temporary storage device also includes a side support plate 5, and all the water-blocking trays 1 are connected to the side support plate 5. Moreover, every two water-blocking trays 1 are set as a group. In each group of water-blocking trays 1, the water-blocking tray 1 located at the top does not have a moisturizing spray hole 11, which is used to temporarily store the wafers 7 to be processed, and the water-blocking tray 1 located at the bottom has the moisturizing spray hole 11, which is used to temporarily store the polished wafers 7. After the polished wafer 7 is placed on the water-blocking tray 1 at the bottom, the water-blocking tray 1 located at the top can reduce the divergence of the moisturizing liquid to the outside world, so that the moisturizing effect of the environment where the polished wafer 7 is located is better, and the water output of the moisturizing spray hole 11 can be reduced accordingly, so as to achieve the effect of energy saving and environmental protection.

[0070] Example 2

[0071] The present embodiment also provides a chemical mechanical polishing device, including a polishing unit, a scrubbing unit and the temporary storage device mentioned above, wherein the polishing unit is used for grinding and polishing the wafer 7, and the scrubbing unit is used for scrubbing the ground wafer 7, and the temporary storage device is arranged between the polishing unit and the scrubbing unit. During the operation of the equipment, the wafer 7 is placed in the temporary storage device, and the positioning column 2 and the position detection mechanism 3 in the temporary storage device are used to accurately position the wafer 7 and accurately determine whether the placement position of the wafer 7 is accurate, thereby ensuring that the robot can accurately grasp the wafer 7, and providing a moist environment for the polished wafer 7, thereby improving the quality and yield rate of the wafer 7.

[0072] Obviously, the above embodiments are merely examples for clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from them are still within the protection scope of the invention.

Claims

1. A wafer temporary storage device, characterized in that: include: Water trap (1); There are at least three positioning posts (2) which are spaced apart in a circle on the water barrier (1); a positioning surface (21) for positioning the side of the wafer (7) is provided on the top of the positioning post (2); the positioning surface (21) is a conical surface with a radius gradually decreasing from bottom to top; all the positioning surfaces (21) are positioned on the water barrier (1) to form a positioning circle with a diameter matching the diameter of the wafer (7); and There are at least three position detection mechanisms (3) which are spaced apart and distributed on the water-isolating plate (1) along the positioning circle. The position detection mechanisms (3) form detection points on the water-isolating plate (1) for determining whether a wafer (7) is present at a current position. The detection points are located inside the positioning circle, and the edge position of the wafer (7) falls at each detection point. The position monitoring mechanism (3) comprises a wafer measuring nozzle (31) connected to the water-isolating plate (1), the wafer measuring nozzle (31) being provided with a contact surface (311) for supporting the bottom of the wafer (7), a detection nozzle hole (312) penetrating the contact surface (311) being provided in the wafer measuring nozzle (31), and the detection nozzle hole (312) being located on the inner side of the positioning circle; At least two detection spray holes (312) are provided on each of the test piece nozzles (31), and the hole distance between two adjacent detection spray holes (312) is greater than the width of the notch (71) of the wafer (7); It also comprises a side support plate (5), at least two water-blocking plates (1) are provided and are connected to the side support plate (5) at intervals, at least one of the water-blocking plates (1) is provided with a moisturizing spray hole (11) and a channel (12), the moisturizing spray hole (11) is connected to the channel (12), and the channel (12) is connected to a liquid supply pipeline (4) for conveying moisturizing liquid into the channel; Wherein, the water-isolating trays (1) are arranged in groups of two each, and the two water-isolating trays (1) in each group are spaced apart in the vertical direction, and the water-isolating tray (1) located at the bottom is provided with the moisturizing spray hole (11).

2. The temporary storage device according to claim 1, characterized in that: The position detection mechanism (3) comprises: a delivery pipeline (32), connected to the measuring sheet nozzle (31), and used for delivering fluid into the measuring sheet nozzle (31); and A fluid pressure sensor (33) is arranged on the delivery pipeline (32) and detects changes in fluid pressure in the delivery pipeline (32).

3. The temporary storage device according to claim 2, characterized in that: The position detection mechanism (3) further comprises a pressure-stabilizing valve (34), wherein the pressure-stabilizing valve (34) is connected to the delivery pipeline (32), and the fluid pressure sensor (33) is located between the pressure-stabilizing valve (34) and the measuring piece nozzle (31).

4. The temporary storage device according to any one of claims 1 to 3, characterized in that: The positioning column (2) is formed with a support surface (22) connected to the lower end of the positioning surface (21), and the contact surface (311) is higher than the support surface (22) and lower than the top end of the positioning column (2).

5. The temporary storage device according to any one of claims 1 to 3, characterized in that: A plurality of the moisturizing spray holes (11) are provided and are distributed at intervals in a circular pattern, and all of the moisturizing spray holes (11) are connected to the channel (12).

6. The temporary storage device according to claim 1, characterized in that: The water-blocking tray (1) is provided with a drainage groove (13), the surface of the water-blocking tray (1) is inclined toward one side of the drainage groove (13), and the drainage groove (13) is connected to a drainage pipe (6).

7. A chemical mechanical polishing device, characterized in that: A temporary storage device according to any one of claims 1 to 6.

Images