Transfer substrate, transfer method, display substrate and display device

Abstract

The present invention discloses a transfer substrate, a transfer method, a display substrate, and a display device. The transfer substrate includes: a carrier substrate; a plurality of component fixing areas, and a component limiting area surrounding each component fixing area; the component fixing area is used to fix the component to be transferred when the component to be transferred is transferred; at least one telescopic structure is located in the component limiting area; the telescopic structure is configured to extend at least toward a side away from the carrier substrate before picking up or releasing the component to be transferred. The above technical solution can be used to confine the component to be transferred within the component fixing area when it is picked up or released, thereby ensuring that the component to be transferred does not have positional and angular deviations, thereby improving the transfer accuracy of the component to be transferred; it can also avoid the influence of external air disturbances on the transfer accuracy, reduce the uniformity requirements of the transfer material, thereby expanding the selection range of transfer materials and light sources, and reducing transfer costs.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a transfer substrate, a transfer method, a display substrate, and a display device. Background Art

[0002] With the continuous development of display technology, a new generation of display technology, Micro-LED, has emerged. Compared with other display technologies, Micro-LED has the advantages of low power consumption, high brightness, high color saturation, fast response speed, thin thickness and long life.

[0003] Currently, the main process flow for Micro-LEDs includes LED chip fabrication, mass transfer of LED chips, and bonding of the LED chips to the display substrate. Micro-LEDs typically grow on a sapphire substrate and then need to be transferred to the target substrate. The two main transfer methods are stamp transfer and laser transfer. Compared to stamp transfer, laser transfer offers advantages in transfer speed, accuracy, and selectivity, making it considered the most promising transfer method. However, laser mass transfer faces numerous technical challenges, including transfer speed, accuracy, and the risk of LED shifting or flipping after transfer. Summary of the Invention

[0004] The present invention provides a transfer substrate, a transfer method, a display substrate and a display device, so as to solve the problems of transfer speed, transfer accuracy and offset or flipping in the transfer process of LED chips.

[0005] In a first aspect, an embodiment of the present invention provides a transfer substrate for transferring a component to be transferred, comprising:

[0006] A carrier substrate comprising a plurality of component fixing areas and a component defining area surrounding each of the component fixing areas; the component fixing area being used to fix the component to be transferred when transferring the component to be transferred;

[0007] At least one telescopic structure is located in the component limiting area; the telescopic structure is configured to extend at least toward a side away from the carrier substrate before picking up or releasing the component to be transferred.

[0008] In a second aspect, an embodiment of the present invention further provides a transfer method, which uses the above-mentioned transfer substrate to transfer the component to be transferred, comprising:

[0009] Fixing the component to be transferred on the component fixing area of ​​the carrier substrate in the transfer substrate;

[0010] After the transfer substrate and the target substrate are aligned, controlling the telescopic structure of the transfer substrate to extend at least toward a side away from the carrier substrate;

[0011] The component to be transferred from the component fixing area is released to a target substrate.

[0012] In a third aspect, an embodiment of the present invention further provides a display substrate, comprising: an array substrate and an element to be transferred; the element to be transferred is a light-emitting element;

[0013] Wherein, the element to be transferred is transferred to the array substrate by using the above-mentioned transfer method.

[0014] In a fourth aspect, an embodiment of the present invention further provides a display device, comprising: the above-mentioned display substrate.

[0015] The transfer substrate provided by the embodiment of the present invention provides a telescopic structure in the component limiting area surrounding the component fixing area on the carrier substrate, so that before picking up or releasing the component to be transferred, the telescopic structure extends at least toward the side away from the carrier substrate, so that the component to be transferred can be confined in the component fixing area when it is picked up or released, so as to ensure that the component to be transferred will not have position and angle deviations, thereby improving the transfer accuracy of the component to be transferred; and, by configuring the telescopic structure to extend at least toward the side away from the carrier substrate before picking up or releasing the component to be transferred, the influence of external air disturbance on the transfer accuracy can be avoided; at the same time, by providing the telescopic structure, the distance requirements between the carrier substrate and the target substrate, the flatness requirements of the carrier substrate and the target substrate, and the parallelism requirements between the carrier substrate and the target substrate can be appropriately relaxed, and the requirements for the structural accuracy of the transfer equipment and the target substrate are greatly reduced; in addition, by limiting the position of the component to be transferred when it is picked up or released by the telescopic structure, the uniformity requirements of the transfer material can be reduced, thereby expanding the selection range of the transfer material and the light source, and reducing the transfer cost.

[0016] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic top view of a transfer substrate provided by an embodiment of the present invention;

[0019] Figure 2A schematic cross-sectional view of a transfer substrate in an extended state of a telescopic structure provided by an embodiment of the present invention;

[0020] Figure 3 A schematic cross-sectional view of a transfer substrate in a retracted state of a telescopic structure provided by an embodiment of the present invention;

[0021] Figure 4 A schematic cross-sectional view of a transfer substrate in an extended state of another telescopic structure provided by an embodiment of the present invention;

[0022] Figure 5 A schematic cross-sectional view of a transfer substrate in an extended state of another telescopic structure provided by an embodiment of the present invention;

[0023] Figure 6 A schematic cross-sectional view of a transfer substrate in an extended state of another telescopic structure provided by an embodiment of the present invention;

[0024] Figure 7 A schematic top view of another transfer substrate provided by an embodiment of the present invention;

[0025] Figure 8 A schematic top view of another transfer substrate provided by an embodiment of the present invention;

[0026] Figure 9 A schematic top view of another transfer substrate provided by an embodiment of the present invention;

[0027] Figure 10 A schematic top view of another transfer substrate provided by an embodiment of the present invention;

[0028] Figure 11 A schematic top view of another transfer substrate provided by an embodiment of the present invention;

[0029] Figure 12 A schematic top view of another transfer substrate provided by an embodiment of the present invention;

[0030] Figure 13 A schematic top view of another transfer substrate provided by an embodiment of the present invention;

[0031] Figure 14 A schematic cross-sectional view of a transfer substrate in a retracted state of another telescopic structure provided by an embodiment of the present invention;

[0032] Figure 15 A schematic cross-sectional view of a transfer substrate in an extended state of another telescopic structure provided by an embodiment of the present invention;

[0033] Figure 16A flowchart of a transfer method provided by an embodiment of the present invention;

[0034] Figure 17 A flowchart of another transfer method provided by an embodiment of the present invention;

[0035] Figure 18 is a schematic structural diagram of a display substrate provided by an embodiment of the present invention;

[0036] Figure 19 It is a structural schematic diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0038] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0039] In the prior art, in order to solve the problems of transfer speed, transfer accuracy, and offset or flipping caused by the precision error of position alignment and the uniformity of the transferred material during the transfer process of the LED chip, the distance between the carrier substrate and the target substrate is generally reduced to reduce the risk of position deflection or flipping of the LED chip when it is released in mid-air. However, due to the small size of the LED chip, reducing the distance between the carrier substrate and the target substrate will place excessively high requirements on the flatness of the carrier substrate and the target substrate, as well as the parallelism between the carrier substrate and the target substrate, and will also place high requirements on the transfer equipment. Any slight failure in these requirements will easily cause the LED chip to warp. When the display substrate includes LED chips of three luminous colors, the LED chips need to be transferred on the display substrate at least three times. Reducing the distance between the carrier substrate and the target substrate will cause the carrier substrate to interfere with the LED chips that have been transferred to the display substrate, which also brings many challenges to the subsequent repair process, making it difficult to implement and the cost of transfer is high.

[0040] In order to solve the above technical problems, an embodiment of the present invention provides a transfer substrate for transferring components to be transferred, and the transfer substrate includes: a carrier substrate; a plurality of component fixing areas, and a component defining area surrounding each component fixing area; the component fixing area is used to fix the component to be transferred when transferring the component to be transferred; at least one telescopic structure is located in the component defining area; the telescopic structure is configured to extend at least toward one side away from the carrier substrate before picking up or releasing the component to be transferred.

[0041] By adopting the above technical solution, a telescopic structure is set up in the component limiting area surrounding the component fixing area on the carrier substrate, so that before picking up or releasing the component to be transferred, the telescopic structure is extended at least toward the side away from the carrier substrate, so that the component to be transferred can be confined in the component fixing area when it is picked up or released, so as to ensure that the component to be transferred will not have position and angle deviation, thereby improving the transfer accuracy of the component to be transferred; and, by configuring the telescopic structure to extend at least toward the side away from the carrier substrate before picking up or releasing the component to be transferred, the influence of external air disturbance on the transfer accuracy can be avoided; at the same time, by setting up the telescopic structure, the distance requirements between the carrier substrate and the target substrate, the flatness requirements of the carrier substrate and the target substrate, and the parallelism requirements between the carrier substrate and the target substrate can be appropriately relaxed, and the requirements for the structural accuracy of the transfer equipment and the target substrate are greatly reduced; in addition, by limiting the position of the component to be transferred when it is picked up or released by the telescopic structure, the uniformity requirements of the transfer material can be reduced, thereby expanding the selection range of the transfer material and the light source, and reducing the transfer cost.

[0042] The above is the core concept of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without inventive effort are within the scope of protection of the present invention. The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings.

[0043] Figure 1 A schematic top view of a transfer substrate provided by an embodiment of the present invention is shown. Figure 2 A schematic cross-sectional view of a transfer substrate in an extended state of a telescopic structure provided by an embodiment of the present invention. Figure 1 and Figure 2 The transfer substrate 10 includes a carrier substrate 110 and at least one telescopic structure 120; the carrier substrate 110 includes a plurality of component fixing areas 101 and a component defining area 102 surrounding each component fixing area 101, wherein the component fixing area 101 is used to fix the component to be transferred 130 when transferring the component to be transferred; the telescopic structure 120 is located in the component defining area 102, and the telescopic structure 120 is configured to extend at least toward one side away from the carrier substrate 110 before picking up or releasing the component to be transferred 130.

[0044] Exemplarily, the element to be transferred 130 includes but is not limited to elements such as Micro LEDs; the carrier substrate 110 is a temporary supporting substrate before transferring the element to be transferred 130 to the target substrate. The carrier substrate 110 may include, for example, a glass substrate. The laser may be irradiated through the glass substrate to the element fixing area 101, causing the element to be transferred 130 in the element fixing area 101 to detach from the carrier substrate 110 and fall to the target substrate; alternatively, the carrier substrate 100 may also be a temporary supporting substrate for obtaining the element to be transferred 130 from the target substrate. In this case, the target substrate may be an LED wafer or other substrate substrate, including an array-arranged Micro LED. The carrier substrate 100 may use principles such as electrostatic force and stamp transfer to pick up the Micro LED from the target substrate to the element fixing area 101.

[0045] The telescopic structure 120 of the component limiting area 102 can be made of a deformable material such as a photosensitive or thermosensitive material. The telescopic structure 120 can shrink or stretch, and this structural deformation can be reversible. When the telescopic structure 120 is made of a photosensitive material, such as a liquid crystal polymer, the orientation of the liquid crystal molecules in the liquid crystal polymer can change under illumination of different wavelengths, causing the liquid crystal polymer to shrink or stretch macroscopically. Before the carrier substrate 110 picks up or releases the component 130 to be transferred, the telescopic structure 120 can stretch only toward the side away from the carrier substrate 110, or it can stretch simultaneously toward the side away from the carrier substrate 110 and the side near the component fixing area 101. Specifically, when the telescopic structure 120 stretches simultaneously toward the side away from the carrier substrate 110 and the side near the component fixing area 101, the extension length of the telescopic structure 120 toward the side away from the carrier substrate 110 can be greater than the extension length of the telescopic structure 120 toward the side near the component fixing area 101.

[0046] In an embodiment of the present invention, a telescopic structure is provided in a component limiting area surrounding the component fixing area on the carrier substrate, so that before picking up or releasing the component to be transferred, the telescopic structure is extended at least toward a side away from the carrier substrate, so that the component to be transferred is confined within the component fixing area when being picked up or released, so as to ensure that the component to be transferred does not have position and angle deviations, thereby improving the transfer accuracy of the component to be transferred; in addition, when the telescopic structure can also be extended toward a side close to the component fixing area, the confined space of the component to be transferred can be reduced, and the position accuracy of the component to be transferred can be further improved; and by providing the telescopic structure, the transfer accuracy can still be guaranteed to be high when the distance between the carrier substrate and the target substrate is large, and the flatness requirements of the carrier substrate and the target substrate and the parallelism requirements between the carrier substrate and the target substrate can be appropriately reduced, and the requirements for the structural accuracy of the transfer equipment and the target substrate are also reduced.

[0047] Optional, continue to refer to Figure 2 Under light within the first wavelength range, the telescopic structure 120 extends at least toward the side away from the carrier substrate 110; or, within the first temperature range, the telescopic structure 120 extends at least toward the side away from the carrier substrate 110.

[0048] Illustratively, before picking up or releasing the element to be transferred 130, the transfer substrate 10 can be irradiated with light having a wavelength within a first wavelength range. The light can pass through the supporting substrate 110 and reach the telescopic structure 120 of the element limiting area 102, so that the telescopic structure 120 is affected by the illumination of the light and stretches at least toward the side away from the supporting substrate 110; or, before picking up or releasing the element to be transferred 130, the temperature of the transfer substrate 10 is made to reach the first temperature range, that is, the temperature of the supporting substrate 110 and the telescopic structure 120 can also reach the first temperature range. Under the influence of the temperature, the telescopic structure 120 is deformed and stretches at least toward the side away from the supporting substrate 110. Before picking up or releasing the element to be transferred 130, the transfer substrate 10 is irradiated with light maintained within the first wavelength range or the temperature of the transfer substrate 10 is made to reach the first temperature range. This allows the telescopic structure 120 to remain in an extended state when the process of picking up or releasing the element to be transferred 130 is performed, so as to fix the element to be transferred 130 in a fixed space formed by the telescopic structure 120, so that the element to be transferred 130 can be picked up or released at a fixed position, thereby improving the transfer accuracy; when the process of picking up or releasing the element to be transferred 130 is performed, the telescopic structure 120 remains in an extended state, and can also block airflow to prevent air disturbance from affecting the picking up or releasing of the element to be transferred.

[0049] Optional, Figure 3 A schematic diagram of a cross-sectional structure of a transfer substrate in a retracted state of a telescopic structure provided by an embodiment of the present invention, with reference to Figure 3 , under light within the second wavelength range, the telescopic structure 120 contracts at least toward the side close to the supporting substrate 110, wherein the wavelength within the first wavelength range is different from the wavelength within the second wavelength range; or, within the second temperature range, the telescopic structure 120 contracts at least toward the side close to the supporting substrate 110, wherein the temperature within the first temperature range is different from the temperature within the second temperature range.

[0050] Illustratively, after picking up or releasing the element to be transferred 130, the telescopic structure 120 of the transfer substrate 10 can be irradiated with light having a wavelength within the second wavelength range, so that when the telescopic structure 120 is affected by the illumination of the light, it shrinks at least toward the side close to the carrier substrate 110, so that the telescopic structure 120 returns to its initial state; or, after picking up or releasing the element to be transferred 130, the temperature of the transfer substrate 10 is made to reach the second temperature range, that is, the temperature of the carrier substrate 110 and the telescopic structure 120 can also reach the second temperature range, and under the influence of the temperature, the telescopic structure 120 is deformed and shrinks at least toward the side close to the carrier substrate 110, so that the telescopic structure 120 returns to its initial state. After picking up or releasing the element to be transferred 130, the transfer substrate 10 is irradiated with light having a wavelength within the second wavelength range or the temperature of the transfer substrate 10 is brought to the second temperature range, so that the telescopic structure 120 can be transformed from an extended state to a contracted state, so as to avoid the extended telescopic structure 120 interfering with the transferred element on the target substrate (suitable for releasing the element to be transferred) or the untransferred element on the target substrate (suitable for picking up the element to be transferred) when the transfer substrate 10 is removed, thereby improving the transfer quality and avoiding excessive subsequent repair work.

[0051] Optional, Figure 4 A schematic cross-sectional structure diagram of a transfer substrate in an extended state of another telescopic structure provided by an embodiment of the present invention is shown in FIG. Figure 4 As shown, the carrier substrate 110 includes a transfer carrier 111 and an adsorption layer 112 located on one side of the transfer carrier; the telescopic structure 120 is located on the side of the adsorption layer 112 away from the transfer carrier 111; after the element to be transferred 130 is picked up or before it is released, the element to be transferred 130 is fixed to the surface of the adsorption layer 112 on the side away from the transfer carrier 111; when the element to be transferred 130 is released, the element to be transferred 130 is peeled off from the surface of the adsorption layer 112 on the side away from the transfer carrier 111.

[0052] For example, taking the process of releasing the element to be transferred 130 as an example, since the transfer carrier 111 can be a glass substrate, the laser can penetrate the glass substrate and irradiate the adsorption layer 112, causing the adsorption layer 112 to change, causing the element to be transferred 130 to detach from the side surface of the adsorption layer 112 away from the transfer carrier 111, and thus be transferred to the target substrate. Figure 5 A schematic diagram of the cross-sectional structure of another telescopic structure of a transfer substrate in an extended state provided in an embodiment of the present invention, wherein at this time, the element to be transferred 130 has been peeled off from the adsorption layer 112 and is falling to the target substrate. When the element to be transferred 130 is released to the target substrate, the telescopic structure 120 is in an extended state, and due to the spatial restriction of the telescopic structure 120 on the element to be transferred 130, the element to be transferred 130 can be accurately transferred to a fixed position on the target substrate, thereby improving the transfer accuracy.

[0053] It can be understood that when a telescopic structure 120 is provided in the transfer substrate 10, the requirements for the uniformity of the adsorption of the adsorption layer 112 or the glass element to be transferred 130 are relatively low. Even if the uniformity is poor, causing the element to be transferred 130 to fall off partially first, it will not affect the precise transfer of the element to be transferred 130 to a fixed position on the target substrate, so that the material selection of the adsorption layer 112 has a larger range, thereby reducing the transfer cost.

[0054] Exemplarily, the adsorption layer 112 can be a heat-releasing film or a vaporized film. When the adsorption layer 112 is a heat-releasing film, the viscosity of the heat-releasing film can be reduced within a certain temperature range, so that the element to be transferred 130 can be debonded from the adsorption layer 112 and fall onto the target substrate; when the adsorption layer 112 is a vaporized film, the vaporized film can be changed from solid to gaseous and evaporated by irradiation within a certain wavelength range or temperature range, so that the element to be transferred 130 can fall off and fall onto the target substrate.

[0055] It can be understood that when releasing the component 130 to be transferred, only the component fixing area 101 of the transfer substrate 10 can be laser processed, so that the adsorption layer 112 in the component fixing area 101 is debonded or vaporized, and the component 130 to be transferred in the component fixing area 101 is detached from the adsorption layer 112, while the telescopic structure 120 in the component limiting area 102 will not be detached from the adsorption layer 112 and can be reused; or, when releasing the component 130 to be transferred, both the component fixing area 101 and the component limiting area 102 of the transfer substrate 10 can be laser processed, so that the adsorption layer 112 in the component fixing area 101 and the component limiting area 102 is debonded or vaporized, and the component 130 to be transferred and the telescopic structure 120 are both detached from the adsorption layer 112. The embodiment of the present invention does not make specific limitations on this.

[0056] Optional, Figure 6 A schematic cross-sectional structure diagram of a transfer substrate in an extended state of another telescopic structure provided by an embodiment of the present invention is shown in FIG. Figure 6 As shown, the carrier substrate 110 includes a transfer carrier 111 and an adsorption layer 112 located on one side of the transfer carrier; the telescopic structure 120 is located on the side of the transfer carrier 111 close to the adsorption layer 112; after the component to be transferred 130 is picked up or before it is released, the component to be transferred 130 is fixed to the surface of the adsorption layer 112 on the side away from the transfer carrier 111; when the component to be transferred 130 is released, the component to be transferred 130 is peeled off from the surface of the adsorption layer 112 on the side away from the transfer carrier 111.

[0057] For example, the telescopic structure 120 can be bonded to the side of the transfer carrier 111 close to the adsorption layer 112. When the adsorption layer 112 is debonded or vaporized, the transfer element 130 falls off, but it does not affect the bonding between the telescopic structure 120 and the transfer carrier 111. The telescopic structure 120 can be reused, reducing the transfer cost.

[0058] Optionally, Figure 7 FIG. is a top view structural schematic diagram of another transfer substrate provided by an embodiment of the present invention. As Figure 7 shown, the size of the component fixing area 101 in the first direction X is a + δ; a is the size of the to-be-transferred component 130 fixed to the component fixing area 101 in the first direction X; the size of the to-be-transferred component 130 in the second direction Y is b; wherein, δ < b; both the first direction X and the second direction Y are parallel to the plane where the carrier substrate 110 is located, and the first direction X is perpendicular to the second direction Y.

[0059] Specifically, the size a + δ of the component fixing area 101 in the first direction X differs from the size a of the to-be-transferred component 130 fixed to the component fixing area 101 in the first direction X by δ, and δ is less than the size b of the to-be-transferred component 130 in the second direction Y. Thus, it is possible to avoid the deflection of the to-be-transferred component 130 in the component fixing area 101 in the direction parallel to the plane of the substrate, and further improve the transfer accuracy.

[0060] It can be understood that Figure 8 FIG. is a top view structural schematic diagram of another transfer substrate provided by an embodiment of the present invention. Referring to Figure 8 , the size b + δ' of the component fixing area 101 in the second direction Y differs from the size b of the to-be-transferred component 130 fixed to the component fixing area 101 in the second direction Y by δ', and δ' is less than the size a of the to-be-transferred component 130 in the first direction X. Similarly, it is possible to avoid the deflection of the to-be-transferred component 130 in the component fixing area 101 in the direction parallel to the plane of the substrate, and further improve the transfer accuracy.

[0061] Optionally, Figure 9 FIG. is a top view structural schematic diagram of another transfer substrate provided by an embodiment of the present invention. As Figure 9 shown, the transfer substrate 10 includes a plurality of telescopic structures 120; at least telescopic structures 120 are respectively provided on opposite sides of each component fixing area 101. Exemplarily, telescopic structures 120 can be provided only on both sides of the component fixing area 101 in the first direction X, or telescopic structures 120 can also be provided on both sides of the component fixing area 101 in the first direction X and both sides in the second direction Y. As Figure 10 shown, the embodiment of the present invention does not make specific limitations on this.

[0062] Exemplarily, when the telescopic structure 120 is only provided on both sides of the component fixing area 101 in the first direction X, the telescopic structures 120 on both sides of each component fixing area 101 can prevent the component to be transferred 130 in the component fixing area 101 from shifting in the first direction X, thereby preventing the component to be transferred 130 from deflecting in a direction parallel to the plane of the substrate; and when the telescopic structure 120 is provided on both sides of the component fixing area 101 in the first direction X and both sides in the second direction Y, the telescopic structure 120 is provided all around each component fixing area 101, which can prevent the component to be transferred 130 in the component fixing area 101 from shifting in the first direction X and / or the second direction Y.

[0063] Optional, Figure 11 A schematic diagram of a top view of another transfer substrate provided in an embodiment of the present invention is shown as follows: Figure 11 As shown, the telescopic structure 120 located on one side of the component fixing area 101 at least partially surrounds the component fixing area 101 .

[0064] For example, a telescopic structure 120 may be provided on both sides of the component fixing area 101 in the first direction X, with each telescopic structure 120 at least partially surrounding the component fixing area 101. In this case, taking the component fixing area 101 as a rectangular structure, each telescopic structure 120 may include three parts, which are connected at the front and located on three sides of the component fixing area 101. Thus, by providing the telescopic structures 120 on opposite sides of the component fixing area 101, the telescopic structures 120 can be configured to deflect the component 130 to be transferred in the component fixing area 101 in the first direction X and the second direction Y.

[0065] Optional, Figure 12 A schematic diagram of a top view of another transfer substrate provided in an embodiment of the present invention is shown as follows: Figure 12 As shown, a telescopic structure 120 is provided between every two adjacent component fixing areas 101 .

[0066] In this way, by setting a telescopic structure 120 between each two adjacent component fixing areas 101, each two adjacent component fixing areas 101 share one telescopic structure 120, the number of telescopic structures 120 set can be reduced, the structure of the transfer substrate 10 can be simplified, and the preparation cost and transfer cost of the transfer substrate 10 can be reduced.

[0067] Optional, Figure 13 A schematic diagram of a top view of another transfer substrate provided in an embodiment of the present invention is shown as follows: Figure 13 As shown, the transfer substrate 10 includes a telescopic structure 120; the telescopic structure 120 is in a grid shape.

[0068] Illustratively, the grid of telescopic structures 120 defines the component fixing area 101, thereby defining the position of the components 130 to be transferred within the component fixing area 101. Compared to a single telescopic structure 120 surrounding the component fixing area 101, the grid-like telescopic structure 120 is simpler to prepare. Furthermore, the grid-like telescopic structure 120 eliminates the need for arranging the telescopic structures, simplifying the preparation process of the transfer substrate 10 and avoiding inaccurate arrangement of the telescopic structures 120, thereby improving transfer accuracy. Furthermore, the grid-like telescopic structure 120 surrounds each component fixing area 101, further defining the position of the components 130 to be transferred within the component fixing area 101.

[0069] Optional, reference Figure 12 and Figure 13 The dimension L of the telescopic structure 120 in the first direction X has a value range of 5 μm≤L≤10 μm; wherein the first direction X is a direction parallel to the plane where the supporting substrate 110 is located.

[0070] In this way, the minimum size L of the telescopic structure 120 in the first direction X is 5 μm, which can improve the space utilization rate of the component limiting area 102. The maximum size L of the telescopic structure 120 in the first direction X is 10 μm, which can reduce the distance between adjacent component fixing areas 101, increase the number of components 130 to be transferred per unit area, and improve transfer efficiency.

[0071] Optional, Figure 14 A schematic cross-sectional view of a transfer substrate in a retracted state of another telescopic structure provided by an embodiment of the present invention, with reference to Figure 14 The distance between the surface of the telescopic structure 120 facing away from the carrier substrate 110 and the carrier substrate 110 is H; H≥T; T is the thickness of the component 130 to be transferred.

[0072] For example, when the telescopic structure 120 is in the contracted state, the minimum distance between the surface of the telescopic structure 120 facing away from the carrier substrate 110 and the carrier substrate 110 is the thickness T of the element 130 to be transferred. When the telescopic structure 120 is in the extended state, the distance between the surface of the telescopic structure 120 facing away from the carrier substrate 110 and the carrier substrate 110 is always greater than the thickness T of the element 130 to be transferred. In this way, during the process of picking up the element 130 to be transferred, the extended telescopic structure 120 can define the attachment position of the element 130 to be transferred before it is attached to the carrier substrate 110, thereby improving the positional accuracy of the element 130 attached to the carrier substrate 110. During the process of releasing the element 130 to be transferred, the extended telescopic structure 120 can define the release position of the element 130 to be transferred after it detaches from the carrier substrate 110, thereby improving the positional accuracy of the element 130 released onto the target substrate.

[0073] Optional, Figure 15 A schematic cross-sectional view of a transfer substrate in an extended state of another telescopic structure provided by an embodiment of the present invention, with reference to Figure 15 , the extension length ΔH of the telescopic structure 120 toward the side away from the supporting substrate 110 is ≥ T; wherein T is the thickness of the component to be transferred 130 .

[0074] The extended length ΔH of the telescopic structure 120 toward the side away from the carrier substrate 110 refers to the change in distance between the side surface of the telescopic structure 120 facing away from the carrier substrate 110 when in the contracted state and the side surface of the telescopic structure 120 facing away from the carrier substrate 110 when in the extended state.

[0075] Specifically, the extended length ΔH of the telescopic structure 120 toward the side away from the carrier substrate 110 is greater than or equal to the thickness T of the element 130 to be transferred. This ensures that when the telescopic structure 120 is in the extended state, the distance between the surface of the telescopic structure 120 facing away from the carrier substrate 110 and the carrier substrate 110 is always greater than the thickness T of the element 130 to be transferred. This improves the positional accuracy of the element 130 to be transferred when it is being picked up or released. Furthermore, the greater the distance between the surface of the telescopic structure 120 facing away from the carrier substrate 110 in the extended state and the carrier substrate 110, the greater the distance between the carrier substrate 110 and the target substrate when picking up or releasing the element to be transferred. This reduces the requirements for the transfer equipment and the target substrate, as well as the uniformity requirements for the transferred material, thereby reducing transfer costs.

[0076] Based on the same inventive concept, an embodiment of the present invention further provides a transfer method, which uses the transfer substrate provided by any embodiment of the present invention to achieve the transfer of the component to be transferred. Figure 16 A flowchart of a transfer method provided by an embodiment of the present invention is shown in FIG. Figure 16 As shown, the transfer method includes:

[0077] S110 , fixing the component to be transferred in the component fixing area of ​​the carrier substrate in the transfer substrate.

[0078] S120 , after the transfer substrate and the target substrate are aligned, controlling the telescopic structure of the transfer substrate to extend at least toward a side away from the carrier substrate.

[0079] S130 , releasing the component to be transferred from the component fixing area to the target substrate.

[0080] Exemplarily, the element to be transferred can be peeled off from the sapphire epitaxial wafer or other substrate by laser lift-off (LLO) and transferred to the element fixing area of ​​the carrier substrate, or the element to be transferred can be transferred to the element fixing area of ​​the carrier substrate by principles such as electrostatic force or van der Waals force. After the element to be transferred is fixed, the transfer substrate carrying the element to be transferred is aligned with the target substrate so that the electrode pins of each element to be transferred correspond to the binding pins of the target substrate one by one. At this time, the transfer substrate can be irradiated with light with a wavelength within the first wavelength range or the temperature of the transfer substrate reaches the first temperature range, so that the telescopic structure is extended at least toward the side away from the carrier substrate or toward the side of the target substrate, and the element to be transferred can be confined to a limited space; finally, the element fixing area is irradiated by laser irradiation or other means, so that the element to be transferred in the element fixing area falls off and falls to the corresponding position of the target substrate within the space limited by the telescopic structure, completing the transfer process of the element to be transferred.

[0081] Optional, Figure 17 A flow chart of another transfer method provided by an embodiment of the present invention is shown as follows: Figure 17 As shown, the transfer method includes:

[0082] S210 , after the transfer substrate and the target substrate are aligned, controlling the telescopic structure of the transfer substrate to extend at least toward a side away from the carrier substrate.

[0083] S220 , picking up the component to be transferred on the target substrate to the component fixing area.

[0084] Illustratively, before picking up the component to be transferred, there is no component to be transferred in the component fixing area of ​​the transfer substrate, and it is necessary to pick up the component to be transferred on the target substrate from the target substrate to the component fixing area. At this time, it is necessary to first align the transfer substrate and the target substrate so that the component fixing area of ​​the transfer substrate corresponds one-to-one to the component to be transferred on the target substrate; after aligning the transfer substrate and the target substrate, the transfer substrate can be irradiated with light with a wavelength within a first wavelength range or the temperature of the transfer substrate reaches a first temperature range, so that the telescopic structure is extended at least toward the side away from the carrier substrate or toward the side of the target substrate, and the component to be transferred can be confined within a limited space; after the telescopic structure is extended, the component to be transferred on the target substrate is picked up, so that the component to be transferred is picked up within the limited space and placed in the component fixing area of ​​the carrier substrate.

[0085] In an embodiment of the present invention, by controlling the telescopic structure of the transfer substrate to extend at least toward the side away from the carrier substrate before picking up or releasing the component to be transferred, the component to be transferred can be confined within the component fixing area when being picked up or released, thereby ensuring that the component to be transferred will not have position and angle deviations, thereby improving the transfer accuracy of the component to be transferred; and also avoiding the influence of external air disturbance on the transfer accuracy.

[0086] Optionally, after the carrier substrate picks up the component to be transferred, or after the target substrate receives the component to be transferred, the telescopic structure of the transfer substrate is controlled to shrink at least toward the side close to the carrier substrate. In this way, the telescopic structure can be prevented from interfering with the transferred component, the transfer quality can be improved, and excessive subsequent repair work can be avoided.

[0087] Optionally, after the transfer substrate and the target substrate are aligned, a distance D between the transfer substrate and the target substrate is ≥ 2*T; under light in a first wavelength range or within a first temperature range, an elongation length ΔH of the photostrictive structure toward a side away from the carrier substrate is ≥ T; wherein T is the thickness of the element to be transferred.

[0088] Specifically, the distance D between the transfer substrate and the target substrate is greater than twice the thickness T of the component to be transferred. This prevents the transfer substrate from interfering with the transferred component during the transfer process. The minimum value of ΔH is the thickness T of the component to be transferred 130. This ensures that when the telescopic structure 120 is in the extended state, the distance between the surface of the telescopic structure 120 facing away from the carrier substrate 110 and the carrier substrate 110 is less than the thickness T of the component to be transferred 130. This improves the positional accuracy of the component to be transferred 130 when it is being picked up or released, either when it is attached to the carrier substrate 110 or when it is released to the target substrate.

[0089] Based on the same inventive concept, an embodiment of the present invention further provides a display substrate. Figure 18 Schematic diagram of the structure of a display substrate provided by an embodiment of the present invention. Figure 18 As shown, the display panel 20 includes an array substrate 210 and a component 130 to be transferred, wherein the component 130 to be transferred is a light-emitting component. Using any transfer method provided in the embodiments of the present invention, the component 130 to be transferred is transferred from any transfer substrate provided in the embodiments of the present invention to the array substrate 210, thereby forming the display substrate 20 provided in the embodiments of the present invention. Therefore, the display substrate provided in the embodiments of the present invention includes the technical features of the transfer substrate and transfer method provided in the embodiments of the present invention, and can achieve the beneficial effects of the transfer substrate and transfer method provided in the embodiments of the present invention. For similarities, please refer to the above description of the shift register circuit provided in the embodiments of the present invention, and will not be repeated here.

[0090] Exemplarily, the display substrate 20 includes a plurality of elements to be transferred 130, each of the elements to be transferred 130 includes two electrode pins 131, and the array substrate 210 includes a binding terminal 211 corresponding to the electrode pin 131 and a driving circuit 212 for driving the elements to be transferred 130 to emit light (the driving circuit 212 is exemplarily shown as a transistor), and the binding terminal 211 is electrically connected to the electrode pin 131, so that the driving circuit 212 can drive the driving circuit 212 to emit light for display.

[0091] By using any transfer method provided in an embodiment of the present invention, the element to be transferred 130 is transferred from any transfer substrate provided in an embodiment of the present invention to the array substrate 210 to form the display substrate 20 of an embodiment of the present invention. In this way, the alignment error between the element to be transferred 130 in the display substrate 20 and the array substrate 210 is small, and a high transfer yield is achieved, thereby improving the display effect of the display substrate 20.

[0092] Based on the same inventive concept, an embodiment of the present invention further provides a display device, Figure 19 is a structural diagram of a display device provided by an embodiment of the present invention, such as Figure 19 As shown, the display device 30 includes the display substrate 20 provided by any embodiment of the present invention. The display device 30 provided by the embodiment of the present invention can be Figure 19 The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop monitors, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiments of the present invention do not specifically limit this.

[0093] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0094] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A transfer substrate for transferring a component to be transferred, characterized in that: include: a carrier substrate; The device comprises a plurality of component fixing areas and a component limiting area surrounding each of the component fixing areas; The component fixing area is used to fix the component to be transferred when transferring the component to be transferred; at least one telescopic structure located in the element-defining area; The telescopic structure is configured to extend at least toward a side away from the carrier substrate before picking up or releasing the component to be transferred.

2. The transfer substrate according to claim 1, wherein The dimension of the component fixing area in the first direction is a+δ; a is the size of the element to be transferred fixed in the element fixing area in the first direction; the size of the element to be transferred in the second direction is b; wherein, δ <b; The first direction and the second direction are both parallel to the plane where the supporting substrate is located, and the first direction is perpendicular to the second direction.

3. The transfer substrate according to claim 1, wherein It comprises a plurality of the telescopic structures; at least the telescopic structures are respectively arranged on two opposite sides of each element fixing area.

4. The transfer substrate according to claim 3, wherein: The telescopic structure located on one side of the component fixing area at least partially surrounds the component fixing area.

5. The transfer substrate according to claim 3, wherein: One telescopic structure is provided between every two adjacent element fixing areas.

6. The transfer substrate according to claim 2, wherein: It comprises a telescopic structure; the telescopic structure is in a grid shape.

7. The transfer substrate according to claim 1, wherein: The carrier substrate includes a transfer carrier and an adsorption layer located on one side of the transfer carrier; The telescopic structure is located on a side of the adsorption layer away from the transfer carrier; After the component to be transferred is picked up or before it is released, the component to be transferred is fixed to the surface of the adsorption layer away from the transfer carrier; when the component to be transferred is released, the component to be transferred is peeled off from the surface of the adsorption layer away from the transfer carrier.

8. The transfer substrate according to claim 7, wherein: The adsorption layer includes a heat-releasing film or a vaporizing film.

9. The transfer substrate according to claim 1, wherein: The dimension L of the telescopic structure in the first direction is in the range of 5 μm ≤ L ≤ 10 μm; Wherein, the first direction is a direction parallel to the plane where the supporting substrate is located.

10. The transfer substrate according to claim 1, wherein: The distance between the surface of the telescopic structure facing away from the carrier substrate and the carrier substrate is H; H≥T; T is the thickness of the component to be transferred.

11. The transfer substrate according to claim 1, wherein The extension length ΔH of the telescopic structure toward the side away from the supporting substrate is ≥ T; Wherein, T is the thickness of the element to be transferred.

12. The transfer substrate according to claim 1, wherein: Under illumination of light within a first wavelength range, the telescopic structure extends at least toward a side away from the supporting substrate; Alternatively, within the first temperature range, the telescopic structure stretches at least toward a side away from the carrier substrate.

13. The transfer substrate according to claim 12, wherein: Under illumination of light in a second wavelength range, the telescopic structure contracts at least toward a side close to the carrier substrate; wherein the wavelength in the first wavelength range is different from the wavelength in the second wavelength range; Alternatively, within a second temperature range, the telescopic structure contracts at least toward a side close to the carrier substrate; wherein the temperature within the first temperature range is different from the temperature within the second temperature range.

14. The transfer substrate according to claim 1, wherein The telescopic structure includes a liquid crystal polymer.

15. A transfer method, using the transfer substrate according to any one of claims 1 to 14 to transfer the component to be transferred, characterized in that: include: Fixing the component to be transferred on the component fixing area of ​​the carrier substrate in the transfer substrate; After the transfer substrate and the target substrate are aligned, controlling the telescopic structure of the transfer substrate to extend at least toward a side away from the carrier substrate; The component to be transferred from the component fixing area is released to a target substrate.

16. A transfer method, using the transfer substrate according to any one of claims 1 to 14 to transfer a component to be transferred, characterized in that: include: After the transfer substrate and the target substrate are aligned, controlling the telescopic structure of the transfer substrate to extend at least toward a side away from the carrier substrate; The component to be transferred on the target substrate is picked up and placed in the component fixing area.

17. The transfer method according to claim 15 or 16, characterized in that: After the transfer substrate and the target substrate are aligned, a distance D between the transfer substrate and the target substrate is greater than or equal to 2*T; Under illumination within a first wavelength range or within a first temperature range, the telescopic structure has an elongation length ΔH ≥ T toward a side away from the carrier substrate; Wherein, T is the thickness of the element to be transferred.

18. A display substrate, characterized in that: include: An array substrate and an element to be transferred; the element to be transferred is a light-emitting element; Wherein, the element to be transferred is transferred to the array substrate by using the transfer method described in any one of claims 15 to 17.

19. A display device, characterized in that: include: The display substrate according to claim 18.

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