A highly integrated motor controller power unit assembly, a three-phase full-bridge motor controller and a new energy vehicle

Abstract

The application relates to a highly integrated motor controller power unit assembly, a three-phase full-bridge motor controller and a new energy automobile, and relates to the technical fields of power module packaging and motor controller. The application arranges multiple circuits and sensors in a plastic packaging module, uniformly dissipates heat, uniformly connects, and finally uniformly packages, has the advantages of small volume and high heat dissipation efficiency, and effectively solves the problems of large volume and poor heat dissipation effect in the prior art. The application comprises a motor control power circuit, positive power terminals, negative power terminals, signal terminals, three-phase output power terminals, a double-sided copper-clad ceramic substrate, a radiator and a plastic packaging shell; the motor control power circuit, the positive power terminals, the negative power terminals, the signal terminals and the three-phase output power terminals are arranged on the front surface of the double-sided copper-clad ceramic substrate, and the back surface of the double-sided copper-clad ceramic substrate is fixedly connected with the radiator; the plastic packaging shell is arranged on the radiator, and the two form a pouring cavity and are integrally molded. The application is suitable for motor controller technology.

Description

Technical Field

[0001] This invention relates to the field of power module packaging and motor controller technology. Background Technology

[0002] The demand for electric drive systems in new energy vehicles is the core driving force behind their technological innovation, with research mainly focusing on high efficiency, high power density, low noise, high EMC rating, high functional safety rating, high reliability and durability, and low cost. The power unit is the core assembly for energy conversion in the electric drive system, determining key attributes such as vehicle power, economy, comfort, and reliability, and its cost exceeds that of the electric drive system by 40%. Deep integration, material and process innovation upgrades, and lean design and superior manufacturing are current technological development trends for power units in electric drive systems, and also key technological paths for improving system performance in the future.

[0003] Existing automotive motor controller power unit assemblies are generally divided into two categories according to the packaging form of power semiconductor switching devices: power units based on standard module form and power units based on discrete device form.

[0004] The power unit layout structure based on standard modules is affected by the module shape, making it difficult to achieve irregular structures and compact miniaturization. It also results in discrete power levels with large redundancy, large stray parameters in the power circuit, and high cost.

[0005] Furthermore, existing power unit assemblies mechanically connect multiple independently packaged components using bolts, welding, and other methods. This post-assembly manual method suffers from problems such as improper installation, poor electrical connections, and poor vibration resistance. Moreover, this secondary or multiple packaging method results in poor heat dissipation, leading to large heat sinks and a bulky system. This post-assembly arrangement of multiple components inevitably results in long and hot electrical traces, and the limited device placement leads to a large power loop area, increasing stray parameters in the power loop and affecting system performance.

[0006] In summary, existing technologies suffer from problems such as large size, poor heat dissipation, high cost, large stray parameters in power circuits, complex processing technology, and difficulty in ensuring production consistency. These are technical problems that have been sought to be solved in this field, but no effective solution has yet been found. Summary of the Invention

[0007] The purpose of this invention is to provide a highly integrated motor controller power unit assembly that arranges various circuits and sensors inside a plastic-encapsulated module, unifies heat dissipation and connection, and ultimately unifies plastic encapsulation. It has the advantages of small size and high heat dissipation efficiency, and can effectively solve the problems of large size and poor heat dissipation in the prior art.

[0008] To achieve the above objectives, the present invention provides the following solution:

[0009] A highly integrated motor controller power unit assembly, the power unit assembly including a motor control power circuit, a positive power terminal, a negative power terminal, a signal terminal, a three-phase output power terminal, a double-sided copper-clad ceramic substrate, a heat sink, and a plastic-encapsulated housing;

[0010] The motor control power circuit, the positive power terminal, the negative power terminal, the signal terminal, and the three-phase output power terminal are all arranged on the front side of the double-sided copper-clad ceramic substrate, and the back side of the double-sided copper-clad ceramic substrate is fixedly connected to the heat sink.

[0011] The heat sink is provided with the plastic encapsulation shell, and the two together form a potting cavity. The double-sided copper-clad ceramic substrate, the motor control power circuit, the positive power terminal, the negative power terminal, the signal terminal and the three-phase output power terminal are all disposed in the potting cavity.

[0012] The terminals of the positive power terminal, the negative power terminal, the signal terminal, and the three-phase output power terminal all extend outside the potting cavity.

[0013] Furthermore, in a preferred embodiment, the internal signals of the aforementioned motor control power circuit are interconnected through copper-clad circuitry and bonding wires on the ceramic substrate.

[0014] Furthermore, in a preferred embodiment, the motor control power circuit includes power semiconductor switching devices, bus capacitors, filter absorption units, and internal stacked copper busbars.

[0015] The power semiconductor switching device and the bus capacitor are connected through the internal stacked copper busbar, and the filter absorption unit is arranged near the power semiconductor switching device.

[0016] Furthermore, in a preferred embodiment, the above-mentioned motor control power circuit further includes a current detection unit;

[0017] The current detection unit is arranged on the double-sided copper-clad ceramic substrate and is connected to the copper busbar of the three-phase output power terminal through the copper pattern on the ceramic substrate. The current detection result is led out through the signal terminal.

[0018] Furthermore, in a preferred embodiment, the above-mentioned motor control power circuit further includes a temperature detection unit;

[0019] The temperature detection unit is arranged near the power semiconductor switching device, on the ceramic substrate, and connected through the copper cladding pattern on the ceramic substrate, and is used to detect the temperature of the power unit assembly.

[0020] Furthermore, in a preferred embodiment, the above-mentioned motor control power circuit further includes a passive discharge unit;

[0021] The passive discharge unit is arranged near the bus capacitor and on the ceramic substrate, and is connected through the copper cladding pattern on the ceramic substrate, for passive discharge of the power unit assembly.

[0022] Furthermore, in a preferred embodiment, the power semiconductor switching device includes an upper bridge arm power switching device chip and a lower bridge arm power unit switching device chip; the filtering and absorption unit includes an upper bridge arm filtering and absorption unit and a lower bridge arm filtering and absorption unit.

[0023] The upper bridge arm filter absorption unit is arranged near the lower bridge arm power switching device chip, and the lower bridge arm filter absorption unit is arranged near the upper bridge arm power switching device chip. The power semiconductor switching device is arranged on the ceramic substrate and connected by a copper cladding pattern on the ceramic substrate.

[0024] Furthermore, in a preferred embodiment, the bus capacitor is composed of multiple capacitor cores connected in series via the stacked copper busbars.

[0025] The present invention also provides a three-phase full-bridge motor controller, wherein the three-phase full-bridge motor controller is composed of any of the above-mentioned motor controller power unit assemblies.

[0026] The present invention also provides a new energy vehicle, wherein the electric drive system of the new energy vehicle includes any of the three-phase full-bridge motor controllers described in the present invention.

[0027] Technical effect

[0028] The purpose of this invention is to solve the problems of large size, high cost, large stray parameters, and difficulty in ensuring production consistency in the existing technology, and it has the following beneficial effects:

[0029] 1. Existing technologies mechanically connect multiple independently packaged components using bolts, welding, or other methods. Each component has its own inherent package, and there are design requirements regarding electrical safety distances, heat dissipation, and proximity, which are difficult to balance, resulting in a large assembly size, poor heat dissipation, and high cost. This invention replaces Hall effect current sensors with power semiconductor switching chips and resistive current sensors, and places the bus capacitor core and temperature detection unit inside the plastic-encapsulated module housing, sharing a single heat sink and package, thus achieving a compact design. Simultaneously, surface-mount resistors and capacitors are integrated for filtering, and surface-mount passive discharge units replace external independent lead resistors. By arranging various circuits and sensors inside the plastic-encapsulated module, with all circuits and sensors sharing a single heat sink and unified connection, it offers advantages such as strong heat dissipation, small size, and low cost.

[0030] 2. Existing motor controller power units suffer from complex manufacturing processes and difficulties in ensuring production consistency. This invention arranges various circuits and sensors on a double-sided copper-clad ceramic substrate. The circuit components soldered on the copper-clad substrate all adopt silver sintering, resulting in lower thermal resistance and higher reliability. Finally, the double-sided copper-clad ceramic substrate is fixed to a heat sink, and a plastic-encapsulated shell is placed on the heat sink. Together, they form a potting cavity, appearing as a single plastic-encapsulated unit. This eliminates the need for post-processing techniques such as bolts and other mechanical connections, reducing process steps, lowering process complexity, improving production consistency, and facilitating subsequent installation.

[0031] 3. Existing motor controller power units suffer from large stray parameters in the power loop. This invention arranges multiple devices on a double-sided copper-clad ceramic substrate, which can effectively shorten the transmission path and reduce stray parameters. At the same time, it adds a filter absorption unit and places it near the power semiconductor switching device, integrates surface-mount resistors and capacitors to replace filters, and integrates surface-mount passive discharge units to replace independent lead resistors. This will also effectively reduce the power loop area, reduce stray parameters, and improve the system's EMC performance.

[0032] 4. The highly integrated motor controller power unit assembly described in this invention adds a temperature detection unit inside the plastic-encapsulated module and places it near the power semiconductor switching device to detect the temperature of the hottest component of the power unit assembly, preventing damage to the power chip due to excessive temperature and improving product reliability.

[0033] 5. The highly integrated motor controller power unit assembly of the present invention adds a passive discharge unit inside the plastic-encapsulated module. The passive discharge unit is arranged around the bus capacitor to discharge the residual voltage in the bus capacitor and ensure that there is no high voltage residue in the capacitor after a certain period of time after power failure.

[0034] 6. The highly integrated motor controller power unit assembly described in this invention has a power semiconductor switching device whose number can be set according to actual needs. Multiple power switching devices are arranged in rows on a double-sided copper-clad ceramic substrate, thereby achieving good power scalability.

[0035] 7. The highly integrated motor controller power unit assembly described in this invention provides a motor controller layout method that allows for flexible selection of the power unit arrangement based on the electric drive system's layout structure. The system is miniaturized, high-power, integrated, efficient, and has high EMC performance. Simultaneously, the arrangement of multiple sensors ensures safe and reliable system operation.

[0036] This invention is applicable to electric motor controller technology for new energy vehicles. Attached Figure Description

[0037] Figure 1This is a schematic diagram of the external structure of a highly integrated motor controller power unit assembly as described in Embodiment 1.

[0038] Figure 2 This is a schematic diagram of the internal layout of a highly integrated motor controller power unit assembly as described in embodiments one through nine.

[0039] Figure 3 This is a three-phase full-bridge motor controller arrangement as described in Implementation Method 10.

[0040] Figure 4 This is an electrical schematic diagram of a highly integrated motor controller power unit assembly as described in Embodiment Eleven.

[0041] Wherein: 1 is the positive power terminal, 2 is the negative power terminal, 3 is the heat sink, 4 is the plastic-encapsulated housing, 5-13 are signal terminals, 14 is the three-phase output power terminal, 15 is the bus capacitor, 101 is the internal stacked copper busbar, 102 is the passive discharge unit, 103 is the upper bridge arm power switching device chip, 104 is the lower bridge arm power switching device chip, 105 is the double-sided copper-clad ceramic substrate, 106 is the upper bridge arm filter absorption unit, 107 is the temperature detection unit, 108 is the current detection unit, 109 is the lower bridge arm filter absorption unit, 110 is the bonding wire, 111 is other signal terminals, 201 is the positive copper busbar, 202 is the negative copper busbar, 203 is the power unit, 204 is the drive and control unit, and 205 is the three-phase output copper busbar. Detailed Implementation

[0042] The technical solution described in this application is explained below with reference to the accompanying drawings:

[0043] Implementation Method 1. See [link / reference] Figure 1 and 2 This embodiment describes a highly integrated motor controller power unit assembly, which includes a motor control power circuit, a positive power terminal 1, a negative power terminal 2, signal terminals 5-13, a three-phase output power terminal 14, a double-sided copper-clad ceramic substrate 105, a heat sink 3, and a plastic-encapsulated housing 4.

[0044] The motor control power circuit, the positive power terminal 1, the negative power terminal 2, the signal terminals 5-13 and the three-phase output power terminal 14 are all arranged on the front side of the double-sided copper-clad ceramic substrate 105, and the back side of the double-sided copper-clad ceramic substrate 105 is fixedly connected to the heat sink 3.

[0045] The heat sink 3 is provided with the plastic encapsulation shell 4, and the two together form a potting cavity. The double-sided copper-clad ceramic substrate 105, the motor control power circuit, the positive power terminal 1, the negative power terminal 2, the signal terminals 5-13 and the three-phase output power terminal 14 are all disposed in the potting cavity.

[0046] The terminals of the positive power terminal 1, the negative power terminal 2, the signal terminals 5-13 and the three-phase output power terminal 14 all extend out of the potting cavity.

[0047] Existing technologies mechanically connect multiple independently packaged components using bolts, welding, and other methods. Each component has its own inherent packaging, and there are design requirements regarding electrical safety distances, heat dissipation, and proximity, making it difficult to balance these factors. This results in a large assembly size, poor heat dissipation, and high cost. The highly integrated motor controller power unit assembly described in this embodiment arranges multiple circuits on the front side of a double-sided copper-clad ceramic substrate, making the design compact and offering the advantage of small size. The compact arrangement of components shortens the transmission path, effectively reducing stray parameters and improving system electrical stress, efficiency, and electromagnetic compatibility performance. The circuit components soldered on the copper-clad substrate are all silver-sintered, resulting in lower thermal resistance and higher reliability. Positive power terminals, negative power terminals, signal terminals, and three-phase output power terminals are all laser-welded to the front side of the double-sided copper-clad ceramic substrate, ensuring reliability and low stray emissions. Meanwhile, the back of the double-sided copper-clad ceramic substrate is fixedly connected to the heat sink, allowing all circuits to share a single heat sink, which has the advantage of strong heat dissipation capacity. A plastic encapsulation shell is placed on the heat sink, and the two together form a potting cavity. The terminals for positive power, negative power, signal, and three-phase output power all extend out of the potting cavity and connect to the corresponding circuits on the external drive circuit board of the module. The potting cavity appears as a single plastic encapsulation unit, eliminating the need for post-processing techniques such as bolts and other mechanical connections, reducing process steps, lowering process complexity, improving production consistency, and facilitating subsequent installation.

[0048] Implementation Method 2. See also Figure 2 This embodiment describes a highly integrated motor controller power unit assembly as described in Embodiment 1, in which the internal signals of the motor control power circuit are interconnected via a bonding wire 110.

[0049] This embodiment further defines the motor control power circuit in Embodiment 1, explaining that the internal signals of the motor control power circuit are interconnected through the copper-clad circuit on the ceramic substrate and the bonding wire 110, and the connection method of the bonding wire is more flexible.

[0050] This embodiment further defines the motor control power circuit in Embodiment 1, explaining that the internal signals of the motor control power circuit are interconnected through the copper-clad pattern circuit on the ceramic substrate and the bonding line 110. The connection method of the bonding line is more flexible, and the copper-clad pattern circuit on the ceramic substrate can carry a large current.

[0051] Implementation Method 3. See also Figure 2 This embodiment describes a highly integrated motor controller power unit assembly as described in Embodiment 1, in which the motor control power circuit includes power semiconductor switching devices, bus capacitor 15, filter absorption unit, and stacked copper busbar 101.

[0052] The power semiconductor switching device and the bus capacitor 15 are connected through the stacked copper bus 101, and the filter absorption unit is arranged near the power semiconductor switching device.

[0053] The motor control power circuit described in this embodiment includes power semiconductor switching devices, bus capacitors, filter absorption units, and internal stacked copper busbars. Existing technology connects independently packaged bus capacitors and independently packaged power modules via external long copper busbars and bolts, resulting in large size and poor heat dissipation. The highly integrated motor controller power unit assembly described in this embodiment places the bus capacitor core inside the power module package and arranges it on the front side of a double-sided copper-clad ceramic substrate. The back side of the double-sided copper-clad ceramic substrate is fixedly connected to a heat sink. The bus capacitors and power semiconductor switching devices are connected via internal stacked copper busbars, offering advantages such as high heat dissipation efficiency and small size. Existing technologies cannot add effective filtering and absorption units to power modules. External filters, connected by heavy copper busbars, are not only bulky but also have poor filtering performance. The highly integrated motor controller power unit assembly described in this embodiment uses integrated surface-mount resistors and capacitors to replace external filters and is arranged near the power semiconductor switching devices. The surface-mount resistors and capacitors are arranged on a double-sided copper-clad ceramic substrate, which has a high heat dissipation effect and further reduces the size. Moreover, the circuit does not require leads and is directly soldered to the copper foil of the double-sided copper-clad substrate, which minimizes stray inductance caused by connections and has a better absorption effect. It can also be arranged in both the upper and lower half-bridges, with no pins and no wasted copper substrate area.

[0054] Implementation Method Four. See also Figure 2 This embodiment describes the motor control power circuit in a highly integrated motor controller power unit assembly as described in Embodiment 3. The motor control power circuit also includes a current detection unit 108.

[0055] The current detection unit 108 is used to detect the operating current of the three-phase output power terminals.

[0056] Existing technologies typically require Hall current sensors to be externally mounted and bolted together, resulting in large size and space consumption. The highly integrated motor controller power unit assembly described in this embodiment replaces the Hall current sensor with a resistive current sensor. Furthermore, the sensor is mounted on a double-sided copper-clad ceramic substrate, which has high heat dissipation efficiency and further reduces size. It can detect the working current of the three-phase output power terminals in real time, saving space and being easier to install compared to traditional Hall current sensors.

[0057] Implementation Method 5. See also Figure 2 This embodiment describes the motor control power circuit in a highly integrated motor controller power unit assembly as described in Embodiment 3. The motor control power circuit also includes a temperature detection unit 107.

[0058] The temperature detection unit 107 is arranged near the power semiconductor switching device and is used to detect the temperature near the power semiconductor switching device.

[0059] The highly integrated motor controller power unit assembly described in this embodiment places a temperature detection unit near the power semiconductor switching device to detect the temperature of the power semiconductor switching device and prevent damage to the power semiconductor switching device due to excessive temperature.

[0060] Implementation Method Six. See also Figure 2 This embodiment describes the motor control power circuit in a highly integrated motor controller power unit assembly as described in Embodiment 3. The motor control power circuit also includes a passive discharge unit 102.

[0061] The passive discharge unit is arranged near the bus capacitor and on the ceramic substrate, and is connected through the copper cladding pattern on the ceramic substrate, for passive discharge of the power unit assembly.

[0062] Existing technologies typically require externally mounted passive discharge units connected by bolts, which suffers from problems such as large size and difficult placement. The highly integrated motor controller power unit assembly described in this embodiment replaces external independent leaded resistors with integrated surface-mount passive discharge units. These surface-mount resistors, positioned on the front side of a double-sided copper-clad ceramic substrate, offer advantages such as high heat dissipation efficiency and small size. Furthermore, the circuit requires no leads, being directly soldered to the copper foil of the double-sided copper-clad substrate, minimizing stray inductance caused by connecting leads and eliminating wasted copper substrate area due to the absence of leads. The passive discharge unit is positioned near the bus capacitor to discharge residual voltage, ensuring that no high voltage remains in the capacitor after a certain period following power failure.

[0063] Implementation Method Seven. See also Figure 2This embodiment describes the power semiconductor switching device in a highly integrated motor controller power unit assembly as described in Embodiment 3. The power semiconductor switching device includes an upper bridge arm power switching device chip 103 and a lower bridge arm power unit switching device chip 104; the filtering and absorption unit includes an upper bridge arm filtering and absorption unit 106 and a lower bridge arm filtering and absorption unit 109.

[0064] The upper bridge arm filter absorption unit 106 is arranged near the lower bridge arm power switching device chip 104, and the lower bridge arm filter absorption unit 109 is arranged near the upper bridge arm power switching device chip 103. The power semiconductor switching devices are arranged on the ceramic substrate and connected by copper cladding on the ceramic substrate.

[0065] This embodiment describes a highly integrated motor controller power unit assembly, which further defines the power semiconductor switching devices and the filtering and absorption unit. The power semiconductor switching devices include an upper-arm power switching device chip and a lower-arm power unit switching device chip. Multiple power semiconductor switching device chips can be connected in parallel to meet power output requirements. The filtering and absorption unit includes an upper-arm filtering and absorption unit and a lower-arm filtering and absorption unit. The upper-arm filtering and absorption unit is positioned near the lower-arm power switching device chip, and vice versa. This effectively absorbs noise in the power circuit, ensures safe and reliable switching operation of the power semiconductor switching devices, and improves the system's EMC performance.

[0066] Implementation Method 8. See also Figure 2 This embodiment describes the bus capacitor in a highly integrated motor controller power unit assembly as described in Embodiment 3. The bus capacitor 15 is composed of multiple capacitor cores connected in series through the stacked copper busbar.

[0067] This embodiment further defines the bus capacitor, which consists of multiple capacitor cores connected in series via stacked copper busbars. This series connection of multiple capacitor cores allows for easy adjustment of the bus capacitor's capacity according to actual needs and also disperses the overall heat dissipation of the bus capacitor, thus improving heat dissipation.

[0068] The improvement of the highly integrated motor controller power unit assembly described in the above embodiments lies in the positional relationship between the components, thereby achieving the goal of reducing size and improving heat dissipation efficiency while ensuring electrical performance. There are no restrictions on the electrical structure of the motor controller power unit assembly; that is, any motor controller power unit assembly with any electrical structure can adopt the above structure.

[0069] Implementation Method Nine. See also... Figure 3 This embodiment describes a three-phase full-bridge motor controller, which comprises three motor controller power unit assemblies as described in any of the above embodiments. It includes a positive copper busbar 201 and a negative copper busbar 202 connected to a battery, a power unit 203, a drive and control unit 204, and a three-phase output copper busbar 205 connected to the motor. The positive and negative power terminals of the positive copper busbar 201, negative copper busbar 202, and power unit 203 are connected one-to-one, via laser welding or bolting. The three-phase output copper busbar 205 and the three-phase output terminals of power unit 203 are connected one-to-one, via laser welding or bolting. The signal terminals of drive and control unit 204 and power unit 203 are connected one-to-one, via welding or crimping.

[0070] The three-phase full-bridge motor controller described in this embodiment is one arrangement of the motor controller provided in this invention. Using the three power units provided in this embodiment, a three-phase full-bridge motor controller can be formed. The power unit arrangement can be flexibly selected according to the electric drive system layout.

[0071] Implementation Method 10. See also... Figure 4 This embodiment describes the electrical connection diagram of a highly integrated motor controller power unit assembly. In this electrical connection, the upper arm power switch chip and the lower arm power switch chip are connected in series; the filter absorption capacitor C1 is connected in parallel with the lower arm power switch chip Q1; the filter absorption capacitor C2 is connected in parallel with the upper arm power switch chip Q2; and the bus capacitor C is connected in parallel with the lower arm power switch chip Q1 and the upper arm power switch chip Q2, which are connected in series. The current sensor I is connected in the phase output line. Positive power terminal 1 is connected to the emitter of the upper bridge arm power switch chip, negative power terminal 2 is connected to the collector of the lower bridge arm power switch chip, signal terminal 5 is connected to the collector of the lower bridge arm power switch chip, signal terminal 6 is connected to the base of the upper bridge arm power switch chip, signal terminal 7 is connected to the base of the lower bridge arm power switch chip, signal terminal 8 is connected to the emitter of the upper bridge arm power switch chip, signal terminal 9 is connected to the emitter of the lower bridge arm power switch chip, signal terminals 10 and 11 are connected to the two ends of the temperature detection unit, and signal terminals 12 and 13 are connected to the two ends of the current sensor.

[0072] The above-described embodiments are merely specific implementations of the present invention, used to illustrate the technical solutions of the present invention, and are not intended to limit it. The scope of protection of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments within the technical scope disclosed in the present invention, or make equivalent substitutions for some of the technical features; and these modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A highly integrated motor controller power unit assembly, characterized in that, The power unit assembly includes a motor control power circuit, positive power terminals, negative power terminals, signal terminals, three-phase output power terminals, a double-sided copper-clad ceramic substrate, a heat sink, and a plastic-encapsulated housing; The motor control power circuit, the positive power terminal, the negative power terminal, the signal terminal, and the three-phase output power terminal are all arranged on the front side of the double-sided copper-clad ceramic substrate, and the back side of the double-sided copper-clad ceramic substrate is fixedly connected to the heat sink. The heat sink is provided with the plastic encapsulation shell, and the two together form a potting cavity. The double-sided copper-clad ceramic substrate, the motor control power circuit, the positive power terminal, the negative power terminal, the signal terminal and the three-phase output power terminal are all disposed in the potting cavity. The terminals of the positive power terminal, the negative power terminal, the signal terminal, and the three-phase output power terminal all extend out of the potting cavity. The motor control power circuit includes a power semiconductor switching device, a bus capacitor, a filter absorption unit, and an internal stacked copper busbar; the power semiconductor switching device and the bus capacitor are connected through the internal stacked copper busbar, and the filter absorption unit is arranged near the power semiconductor switching device. The motor control power circuit also includes a current detection unit; the current detection unit is arranged on the double-sided copper-clad ceramic substrate, and is connected to the copper busbar of the three-phase output power terminal through the copper pattern on the ceramic substrate, and the current detection result is led out through the signal terminal. The motor control power circuit also includes a temperature detection unit; the temperature detection unit is arranged near the power semiconductor switching device, on the ceramic substrate, and connected through the copper cladding pattern on the ceramic substrate, and is used to detect the temperature of the power unit assembly. The motor control power circuit also includes a passive discharge unit; the passive discharge unit is arranged near the bus capacitor, on the ceramic substrate, and connected through the copper cladding pattern on the ceramic substrate, and is used for passive discharge of the power unit assembly. The power semiconductor switching device includes an upper bridge arm power switching device chip and a lower bridge arm power unit switching device chip; the filtering and absorption unit includes an upper bridge arm filtering and absorption unit and a lower bridge arm filtering and absorption unit. The upper bridge arm filter absorption unit is arranged near the lower bridge arm power switching device chip, and the lower bridge arm filter absorption unit is arranged near the upper bridge arm power switching device chip. The power semiconductor switching device is arranged on the ceramic substrate and connected by a copper-clad pattern on the ceramic substrate. The upper and lower bridge arm filter absorption units are implemented using integrated surface-mount resistors and capacitors, and the current detection unit is implemented using a current sensor. Specifically: the lower bridge arm filter absorption unit is filter absorption capacitor C1, and the upper bridge arm filter absorption unit is filter absorption capacitor C2; The upper arm power switch chip is connected in series with the lower arm power switch chip. The filter absorption capacitor C1 is connected in parallel with the lower arm power switch chip Q1, and the filter absorption capacitor C2 is connected in parallel with the upper arm power switch chip Q2. The bus capacitor C is connected in parallel with the lower arm power switch chip Q1 and the upper arm power switch chip Q2, which are connected in series. The current sensor I is connected in the phase output line. The positive power terminal (1) is connected to the emitter of the upper arm power switch chip, and the negative power terminal (2) is connected to the lower arm power switch chip. The collector of the chip, signal terminal (5) is connected to the collector of the lower bridge arm power switch chip, signal terminal (6) is connected to the base of the upper bridge arm power switch chip, signal terminal (7) is connected to the base of the lower bridge arm power switch chip, signal terminal (8) is connected to the emitter of the upper bridge arm power switch chip, signal terminal (9) is connected to the emitter of the lower bridge arm power switch chip, signal terminal (10) and signal terminal (11) are respectively connected to the two ends of the temperature detection unit, and signal terminal (12) and signal terminal (13) are respectively connected to the two ends of the current sensor.

2. The highly integrated motor controller power unit assembly according to claim 1, characterized in that, The internal signals of the motor control power circuit are interconnected through copper-clad circuitry and bonding wires on the ceramic substrate.

3. The highly integrated motor controller power unit assembly according to claim 1, characterized in that, The bus capacitor is composed of multiple capacitor cores connected in series through the stacked copper busbar.

4. A three-phase full-bridge motor controller, characterized in that, The three-phase full-bridge motor controller is composed of three motor controller power unit assemblies as described in any one of claims 1 to 3.

5. A new energy vehicle, characterized in that, The new energy vehicle includes the three-phase full-bridge motor controller as described in claim 4.

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