Component carrier and method for producing a component carrier

Abstract

The present invention provides a component carrier (100) and a method for manufacturing the component carrier (100), wherein the component carrier (100) comprises: a stack (102) comprising at least one electrically conductive layer structure (104) and / or at least one electrically insulating layer structure (106); a component (108) embedded in the stack (102); and a heat removal body (110) configured to remove heat from the component (108), and the heat removal body is connected to the stack (102) and preferably to the component (108), the heat removal body (110) comprising a component-side first heat removal structure (112) thermally coupled to the component (108) and a second heat removal structure (114) thermally coupled to the first heat removal structure (112) and facing away from the component (108).

Description

Technical Field

[0001] The invention relates to a method for producing a component carrier and to a component carrier. Background Art

[0002] Against the background of the ever-increasing product functionality of component carriers equipped with one or more electronic components and the increasing miniaturization of such components and the ever-increasing number of components to be connected to component carriers, such as printed circuit boards, increasingly powerful array-like components or packages with a plurality of components having a plurality of contacts or connections, wherein the spacings between these contacts are increasingly smaller, are being used. In particular, component carriers should be mechanically robust and electrically reliable in order to be able to operate even under harsh conditions.

[0003] For complex electronic tasks, one or more components, such as silicon wafers, may be embedded in a laminate stack of a component carrier, such as a printed circuit board. During operation of the component carrier, at least one embedded component may generate a large amount of heat, for example due to ohmic losses. However, the heat dissipation of one or more embedded components may become a real challenge. In conventional methods, heat dissipation or management may be inappropriate, which may introduce disadvantages during operation. Due to excessive heating during operation, the performance and reliability of the component carrier may deteriorate. Summary of the invention

[0004] There may be a need for a component carrier that can be manufactured in a compact manner and that can operate with high performance and reliability.

[0005] According to an exemplary embodiment of the present invention, a component carrier is provided, wherein the component carrier comprises: a stack including at least one electrically conductive layer structure and / or at least one electrically insulating layer structure; a component embedded in the stack; and a heat removal body, which is configured to remove heat from the component (especially during operation of the component carrier) and is connected to the stack (and optionally to the component), the heat removal body comprising: a first heat removal structure on the component side (i.e. facing the embedded component), the first heat removal structure being thermally coupled to the component; and a second heat removal structure, which is thermally coupled to the first heat removal structure and facing away from the component (and preferably facing the outer main surface of the component carrier).

[0006] According to another exemplary embodiment of the present invention, a method for manufacturing a component carrier is provided, wherein the method comprises: embedding a component into a stack, the stack comprising at least one electrically conductive layer structure and / or at least one electrically insulating layer structure; and connecting a heat removal body to the stack (and optionally to the component), the heat removal body being configured to remove heat from the component, and the heat removal body comprising: a first heat removal structure on the component side, the first heat removal structure being thermally coupled to the component; and a second heat removal structure, the second heat removal structure being thermally coupled to the first heat removal structure and facing away from the component.

[0007] In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components on and / or in the component carrier to provide mechanical support and / or electrical connection. In other words, the component carrier may be configured as a mechanical carrier and / or an electronic carrier for the components. In particular, the component carrier may be one of a printed circuit board, an organic interposer and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different types of component carriers of the above-mentioned types.

[0008] In the context of the present application, the term "stack" may particularly denote an arrangement of a plurality of planar layer structures, which are mounted parallel to each other. The layer structures of the stack may be connected by lamination, ie by application of heat and / or pressure.

[0009] In the context of the present application, the term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of non-continuous islands in a common plane.

[0010] In the context of the present application, the term "component" may particularly denote an inlay-type component. Such a component may be arranged in the interior of a stack. The component may particularly have an electronic function and may therefore be a heat source taking into account ohmic losses etc. For example, such a component may be a semiconductor wafer. Embedding a component may result in the component being completely buried in the stack material. However, embedding a component in a stack may also be achieved by inserting the component into a cavity in the stack such that the component still has surface contact, i.e. extends up to the surface of the stack.

[0011] In the context of the present application, the term "heat removal body" may particularly denote a physical structure that is constructed and arranged to remove heat from an embedded component along a predetermined thermal path up to an outer main surface of the component carrier and from which this heat reaches the environment. More specifically, such a heat removal body may be constructed such that the embedded component can be thermally coupled to the heat removal body and preferably also mechanically connected to the heat removal body, i.e. in close physical contact and thus thermal contact.

[0012] In the context of the present application, the term "component-side first heat removal structure of the heat removal body" may particularly refer to a structure with high thermal conductivity (particularly having a thermal conductivity of at least 10 W / mK, more particularly having a thermal conductivity of at least 50 W / mK, preferably having a thermal conductivity of at least 100 W / mK) arranged on the side of the heat removal body facing the embedded component.

[0013] In the context of the present application, the term "second heat removal structure of the heat removal body facing away from the component" may particularly denote a highly thermally conductive (particularly having a thermal conductivity of at least 10 W / mK, more particularly having a thermal conductivity of at least 50 W / mK, preferably having a thermal conductivity of at least 100 W / mK) structure which is arranged on the side of the heat removal body opposite to the embedded component and is therefore closer to the outer main surface of the component carrier and further away from the embedded component than the first heat removal structure. Although the second heat removal structure may be located at or very close to the main surface of the component carrier, the second heat removal structure may also be separated from the main surface of the component carrier by one or more further layer structures, wherein a thermally conductive connection of the second heat removal structure to the outer surface of the component carrier is preferably ensured.

[0014] According to an exemplary embodiment of the present invention, there is provided a component carrier that includes one or more embedded components in a (preferably laminated) stack, and that provides excellent thermal performance and reliability due to the provision of a heat removal body that is in direct physical contact with the stack and optionally but preferably in direct physical contact with the components. The heat removal body includes at least two opposite heat removal structures, one of which faces the component and the other faces the outer side of the component carrier. The heat removal structure facing the component can be directly thermally coupled with the embedded component to effectively remove heat from the embedded component during operation. The other heat removal structure can conduct the heat received from the embedded component via the component-side heat removal structure to direct the heat to the outside of the component carrier. Therefore, an embedded component type and therefore compact component carrier can be provided, which has excellent heat removal or heat dissipation performance and strong mechanical properties, thereby ensuring excellent thermal performance and reliability. The heat removal body can be advantageously used for heat dissipation and cooling of the component carrier.

[0015] Detailed Description of Exemplary Embodiments

[0016] In the following, further exemplary embodiments of the method and the component carrier are described.

[0017] In a preferred embodiment, the heat removal body comprises a patterned adhesive sheet (in particular a structured adhesive layer located between the first heat removal structure and the second heat removal structure), which adhesively bonds and thermally couples the first heat removal structure to the second heat removal structure. In the context of the present application, the term "patterned adhesive sheet of the heat removal body" may particularly refer to a structured (preferably planar) layer with adhesiveness or viscosity to be sandwiched between two opposite heat removal structures of the heat removal body. Thus, the adhesive sheet can hold the two opposite heat removal structures together, and due to the thermally conductive material of the adhesive sheet itself and / or due to the thermally conductive material in the holes or recesses of the patterned adhesive sheet, the adhesive sheet can simultaneously ensure appropriate thermal coupling between the heat removal structures.

[0018] Adhesive sheet can effectively suppress undesirable delamination and can thus increase the overall mechanical integrity of component carrier, while due to the inherent thermal conductivity characteristics of adhesive sheet and / or due to the thermally conductive material that can be inserted into one or more through holes of patterned adhesive sheet, heat removal structure is thermally coupled to each other. The pattern of adhesive sheet can set up thermal path between component, first heat removal structure, second heat removal structure and environment. However, for example, compared with copper, the thermal capacity of thermal conductive prepreg may be quite low. Therefore, it may be advantageous to drill holes in adhesive sheet and fill adhesive sheet with high thermal conductivity material. Therefore, this sheet is not necessarily a thermal prepreg, and any other adhesive sheet may also be used. Additionally, glue can be applied locally, or photosensitive resin can be used. Through this process, additional drilling (for example laser drilling) to prepreg can be avoided. However, if thermal prepreg is used and it helps thermal management, this may be advantageous.

[0019] In an embodiment, the first heat removal structure is a continuous heat conducting sheet. For example, such a continuous heat conducting sheet may be planar and have no through holes. The continuous heat conducting sheet may ensure two-dimensional heat removal performance over the entire area of ​​the component, as well as lateral diffusion and distribution of heat over the component. For example, the continuous heat conducting sheet may be a sufficiently thick copper foil that may be simply laminated on a stack with embedded components. However, one or more through holes may also be formed in the heat conducting sheet, while the heat conducting sheet may still remain continuous, i.e., a common structure rather than separate islands.

[0020] Alternatively, the first heat removal structure comprises a plurality of individual thermally conductive pads arranged in a coplanar manner. Thus, the first heat removal structure may also consist of a plurality of individual pads of the island type in a common plane, which pads may be specifically provided at the area for conducting heat out of the component to the outer surface of the component carrier. Configuring the first heat removal structure as individual thermally conductive pads or islands may allow precisely defining the heat removal path in the component carrier to obtain a directional and accurately definable heat removal performance.

[0021] In an embodiment, the first heat removing structure comprises metal (particularly copper) and / or ceramic. Thus, the first heat removing structure may be thermally conductive, electrically conductive or electrically insulating.

[0022] In an embodiment, the second heat removal structure comprises a patterned heat conducting sheet or plate comprising a plurality of through holes. Configuring the second heat removal structure as a patterned sheet with through holes allows the use of the second heat removal structure as a mask to pattern a deeper (e.g. dielectric) adhesive sheet in the layer stack obtained during the manufacture of the component carrier. The through holes of the second heat removal structure and the through holes of the adhesive sheet can then be partially or fully filled with a heat conducting material to further increase the thermal conductivity of the heat removal body as a whole.

[0023] In an embodiment, the second heat removing structure comprises metal (particularly copper) and / or ceramic. Thus, the second heat removing structure may be thermally conductive, electrically conductive or electrically insulating.

[0024] In an embodiment, the through-holes of the second heat removal structure and / or the adhesive sheet are at least partially filled with a thermally conductive filling medium (such as a plated metal or a metal paste) and / or filled with a phase change material. In the context of the present application, the term "phase change material" can refer to a substance that can absorb energy during a phase transition to provide useful cooling of a component carrier, in particular its embedded components. In particular, this transition can be from one of the two most basic states of matter, solid and liquid, to another state. The phase transition can also be between non-classical states of matter, such as the consistency of a crystal, where the phase change material can be transformed from one crystal structure to another crystal structure that can be a higher or lower energy state. Examples of phase change materials are organic materials (which can be derived from, for example, petroleum, plants or animals) and salt hydrates. Advantageously, the formed holes can be filled with a phase change material, i.e., a material that changes its microstructure when heated. By taking this measure, the thermal energy generated by at least one embedded component during the operation of the component carrier can be converted into mechanical energy. This can reduce the burden on the copper material of the heat removal body in terms of heat dissipation. When the component carrier is subsequently cooled (e.g. after switching off the component carrier), the phase change material can return to its initial state, so that the operation can be reversible or cyclic. Thus, such a phase change material can absorb energy from at least one embedded component and / or from the remaining material of the heat removal body during operation. For example, the phase change material can be inserted into the through hole in the form of a phase change film and / or a phase change paste.

[0025] Advantageously, the phase change material may be arranged to only partially fill the corresponding through hole or recess of the second heat removal structure and / or the patterned adhesive sheet, rather than completely. Thus, a portion of the volume of the corresponding through hole may be left unfilled, so that the phase change material can change its volume and expand during its phase change without generating excessive stress inside the component carrier.

[0026] In an embodiment, the patterned adhesive sheet is electrically insulating and thermally conductive. By constructing the adhesive sheet of an electrically insulating material, the formation of undesirable electrical paths in the component carrier can be reliably prevented. By using a thermally conductive material (particularly having a thermal conductivity of at least 1 W / mK, more particularly having a thermal conductivity of at least 5 W / mK, preferably having a thermal conductivity of at least 10 W / mK) for the patterned adhesive sheet, thermal coupling between the heat removal structures on opposite sides of the patterned adhesive sheet can be promoted.

[0027] In an embodiment, the patterned adhesive sheet is an adjoining or continuous structure with a plurality of through holes, particularly an adjoining or continuous structure with a two-dimensional array of through holes. In particular, the adhesive sheet can be a perforated sheet or layer with a plurality of through holes. Preferably, the through hole can be filled with a thermally conductive material, particularly copper. The through hole can be partially or completely filled with a material (such as copper) having better thermal conductivity compared with the material of the adhesive sheet itself, to further improve the thermal coupling between the heat removal structures on both sides of the adhesive sheet.

[0028] Preferably, in the plan view of the patterned adhesive sheet, the ratio between the partial area of ​​the through hole and the remaining part area of ​​the adhesive material of the sheet can be at least 20% (or at least 0.2), particularly at least 30% (or at least 0.3). For example, the ratio can be no more than 80% (or no more than 0.8). A sufficiently large ratio can promote the appropriate thermal coupling between the two opposite heat removal structures separated by the patterned adhesive sheet, because the through-hole filling medium can be selected to have high thermal conductivity so that the opposite heat removal structure of the heat removal body is appropriately thermally coupled. A sufficiently small ratio can ensure the appropriate bonding between the two opposite heat removal structures by the viscous material of the adhesive sheet. The ratio in the range of from 20% (or 30%) to 80% can be advantageous.

[0029] In an embodiment, the second heat removal structure is located at the outer main surface of the component carrier, or the second heat removal structure is directly adjacent to the outer main surface of the component carrier. Such an outer second heat removal structure of the heat removal body can be located at the main surface of the component carrier or very close to the main surface of the component carrier. This can ensure that the heat generated by the embedded component can be directed to the outside of the component carrier.

[0030] In an embodiment, the method comprises: preforming at least a portion of the heat removal body; and thereafter connecting the preformed at least a portion of the heat removal body to the stack. By preforming and processing a portion of the heat removal body separately from the stack, the stack and its embedded components can be reliably protected from damage or undesired impacts during processing of the portion of the heat removal body (e.g. mechanically or by laser).

[0031] In an embodiment, the method includes: pre-forming at least a portion of a second heat removal structure (e.g., patterning a sheet of the second heat removal structure); and thereafter connecting the pre-formed at least a portion of the second heat removal structure to the first heat removal structure (already connected to the stack and preferably to the component) via an adhesive sheet. For example, the first heat removal structure can be a thick copper foil or the like, which can be attached to the stack and the embedded component without the need for special processing. Therefore, neither the stack nor the component will be negatively affected by the connection to the first heat removal structure. However, the second heat removal structure may require more extensive processing, in particular patterning, to be able to be used as a mask to simplify the patterning of the adhesive sheet between the heat removal structures after the heat removal structures are interconnected. Therefore, processing the second heat removal structure before connecting to the first heat removal structure that is already connected to the stack and the component can include forming a plurality of through holes in a thermally conductive sheet such as a copper plate.

[0032] In an embodiment, the method comprises preforming at least a portion of the second heat removal structure by inserting an inlay into a through hole of the base sheet and thereafter patterning the inlay, in particular by drilling. In particular, the inlay may be a copper plate or block. Preferably, the base sheet may be a core made of fully cured printed circuit board (PCB) material, such as FR4. Inserting the inlay into the annular base sheet of PCB material involves only little labor and simplifies the handling of the inlay during processing, in particular drilling.

[0033] In an embodiment, the method includes: connecting at least a portion of the second heat removal structure to the first heat removal structure by squeezing an adhesive sheet between at least a portion of the second heat removal structure and the first heat removal structure. By applying mechanical pressure, particularly accompanied by the supply of thermal energy, the opposite heat removal structures can be reliably connected by the adhesive force of the adhesive sheet therebetween. For example, the adhesive sheet can be made of an at least partially uncured material (e.g., a prepreg) that is cured during pressing. During curing, the sheet material can become flowable, can be cross-linked, or can be polymerized, and can then resolidify to permanently connect the two opposite heat removal structures by adhesive force.

[0034] In an embodiment, the method comprises: after connecting the at least a portion of the preform of the second heat removal structure to the first heat removal structure, patterning the adhesive sheet. Advantageously, the entire surface of the adhesive sheet can be used to interconnect the opposite heat removal structures by pressing or laminating. Thereafter, the thermal coupling between the opposite heat removal structures can be improved by patterning the adhesive sheet to thereby form through holes that can subsequently be filled with a thermally conductive material or a phase change material.

[0035] In an embodiment, the method includes: the adhesive sheet is patterned so that the through hole of the patterned adhesive sheet is aligned with the through hole of the second heat removal structure. During the patterning process, the second heat removal structure that has been patterned (and at least located outside at this stage) can be used as a mask. Therefore, the patterns of the through holes extending through the adhesive sheet and extending through the second heat removal structure can correspond to each other. This simplifies the patterning process.

[0036] In an embodiment, the method includes: patterning the adhesive sheet by laser processing. Descriptively speaking, the laser beam will only propagate through the through holes in the external heat removal structure (preferably made of copper) and will selectively remove the exposed material of the adhesive sheet. However, the hidden material of the adhesive sheet located behind the (preferably copper) material of the external heat removal structure will be reliably prevented from being removed by the laser processing, so that proper bonding between the two opposing heat removal structures can continue to be ensured.

[0037] Alternatively, the method may include patterning the adhesive sheet by mechanical drilling, etching (particularly plasma etching), photoirradiation of the photosensitive medium and / or local application of glue. The pattern may also be produced by mechanical drilling or plasma etching. In particular, a photosensitive resin may be used. The photosensitive resin may also be removed by exposure and development treatment. Additionally, any glue capable of holding the two structures together may be applied locally.

[0038] In an embodiment, the method includes at least partially filling the through-holes of the preform of the second heat removal structure and / or the through-holes of the patterned adhesive sheet with a thermally conductive filling medium and / or a phase change material. By taking this measure, the thermal coupling between the three components of the heat removal body, namely the two opposing heat removal structures and the adhesive sheet located between the opposing heat removal structures, can be significantly improved.

[0039] In the following, several processes for embedding a component in a layer stack (without or with access to a surface of the layer stack) according to different embodiments of the invention will be described:

[0040] In an embedding embodiment, the method includes: embedding the component in an opening (e.g., a through hole) of a stack, wherein, during embedding, the opening is temporarily closed by an adhesive layer at least on the bottom side. In the context of the present application, the term "sticky layer" can particularly represent a tape, film, foil, sheet, or plate with an adhesive surface. In use, the sticky layer can be used to adhere to the main surface of the stack to close the opening extending through the stack. The component can be adhered to the sticky layer for defining the position of the component in the opening and thus defining the position of the component relative to the stack. When the sticky layer is removed from the stack before completing the manufacture of the component carrier, the sticky layer can be represented as a temporary carrier. However, in other embodiments, the sticky layer can form a part of a component carrier that is easy to manufacture. By adhering the component to the adhesive tape during the embedding process, the spatial accuracy of the component embedding can be excellent. Therefore, a compact component carrier with high alignment accuracy can be obtained.

[0041] In another embedding embodiment, the method comprises: mounting the component on at least one of the layer structures; and thereafter covering the assembled component with another of the layer structures, wherein at least one of the other layer structures is provided with an opening for accommodating the component. For example, the opening of the respective layer structure can be cut into the respective layer structure as a through hole.

[0042] In yet another embedding embodiment, the method comprises: embedding a release layer in a stack; thereafter forming an opening in the stack by removing a section of the stack that is bounded on the bottom side by the release layer; and thereafter accommodating the component in the opening. For example, such a release layer can be made of a material that exhibits poor adhesion properties relative to the surrounding stack material. For example, a suitable material for the release layer is polytetrafluoroethylene (PTFE, Teflon) or a waxy compound. For example, the method comprises forming a circumferential cutting groove in the stack that extends up to the release layer to thereby separate the section from the rest of the stack. Cutting the groove can be accomplished, for example, by laser drilling or mechanical drilling.

[0043] In yet another embedding embodiment, the method comprises: forming an opening in the stack by routing, preferably deep routing; and thereafter accommodating the component on the bottom surface of the routing stack and in the opening. Routing is a suitable and simple mechanism for precisely defining a blind hole type opening for subsequent accommodation of the component.

[0044] In an embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of the mentioned electrically insulating layer structure and the electrically conductive layer structure, which is formed, in particular, by applying mechanical pressure and / or thermal energy. The mentioned stack may provide a plate-like component carrier which is able to provide a large mounting surface for further components and which is still very thin and compact. The term "layer structure" may in particular denote a continuous layer, a patterned layer or a plurality of non-continuous islands in a common plane.

[0045] In an embodiment, the component carrier is formed as a plate. This contributes to a compact design, wherein the component carrier nevertheless provides a large base for mounting components on the component carrier. Furthermore, in particular a bare die as an example of an embedded electronic component can be easily embedded in a thin plate, such as a printed circuit board, due to the small thickness of the bare die.

[0046] In an embodiment, the component carrier is configured as one of a printed circuit board, a substrate (in particular an IC substrate) and an interposer.

[0047] In the context of the present application, the term "printed circuit board" (PCB) may particularly refer to a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example, by applying pressure and / or by the supply of thermal energy. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, and the electrically insulating layer structure may include resin and / or glass fiber, so-called prepreg, or FR4 material. Through holes can be formed through the laminate, for example, by laser drilling or mechanical drilling, and through holes can be formed as through-hole connections by filling these through holes with electrically conductive materials (particularly copper), so that each electrically conductive layer structure can be connected to each other in a desired manner. In addition to one or more components that can be embedded in the printed circuit board, the printed circuit board is generally configured to accommodate one or more components on one surface or two opposite surfaces of the plate-like printed circuit board. The one or more components can be connected to the corresponding main surface by welding. The dielectric part of the PCB can be composed of a resin with reinforcing fibers (such as glass fibers).

[0048] In the context of the present application, the term "substrate" can particularly refer to a small component carrier. Relative to a PCB, a substrate can be a relatively small component carrier on which one or more components can be mounted and which can be used as a connection medium between one or more chips and another PCB. For example, a substrate can have a size roughly the same as that of a component (particularly an electronic component) to be mounted on the substrate (for example, in the case of a chip-scale package (CSP)). More specifically, a substrate can be understood as a carrier: a carrier for electrical connectors or power grids, and a component carrier for connectors that are comparable to a printed circuit board (PCB) but have a relatively high density of lateral and / or vertical arrangements. The lateral connectors are, for example, conductive channels, and the vertical connectors can be, for example, drill holes. These lateral connectors and / or vertical connectors are arranged in the substrate and can be used to provide electrical, thermal and / or mechanical connections between accommodated components or unaccommodated components (such as bare wafers), particularly IC chips and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes "IC substrates". The dielectric portion of the substrate may be composed of a resin with reinforcing particles, such as reinforcing spheres, particularly glass spheres.

[0049] The substrate or interposer may include or be composed of at least one layer of: glass; silicon (Si); or a photosensitive or dry-etchable organic material, such as an epoxy-based stack material (e.g., an epoxy-based stack film); or a polymer compound, such as polyimide, polybenzoxazole or benzocyclobutene functional polymer.

[0050] In an embodiment, the at least one electrically insulating layer structure comprises at least one of the following: a resin (e.g., a reinforced resin or a non-reinforced resin, such as an epoxy resin or a bismaleimide-triazine resin), a cyanate resin, a polyphenylene derivative, a glass (particularly glass fiber, multilayer glass, a glass-like material), a prepreg material (e.g., FR-4 or FR-5), a polyimide, a polyamide, a liquid crystal polymer (LCP), an epoxy stacked film, polytetrafluoroethylene (PTFE, Teflon), a ceramic, and a metal oxide. Reinforcement structures such as meshes, fibers, or spherical pieces made of, for example, glass (multilayer glass) may also be used. Although prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy stacked films or photosensitive dielectric materials may also be used. For high-frequency applications, high-frequency materials, such as polytetrafluoroethylene, liquid crystal polymers and / or cyanate resins, low-temperature co-fired ceramics (LTCC) or other low, very low, or ultra-low DK materials may be implemented as an electrically insulating layer structure in a component carrier.

[0051] In an embodiment, the at least one electrically conductive layer structure comprises at least one of: copper, aluminum, nickel, silver, gold, palladium and tungsten. Although copper is generally preferred, other materials or coated variants thereof, in particular coated with superconducting materials such as graphene, are also possible.

[0052] At least one component that can be embedded in the stack can be selected from the following: a non-electrically conductive inlay, an electrically conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (such as a heat pipe), a light guiding element (such as an optical waveguide or optical conductor connection), an optical element (such as a lens), an electronic component or a combination thereof. For example, the component can be an active electronic component, a passive electronic component, an electronic chip, a storage device (such as a DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light emitting diode, an optical coupler, a voltage converter (such as a DC / DC converter or an AC / DC converter), a cryptographic component, a transmitter and / or a receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, a battery, a switch, a camera, an antenna, a logic chip and an energy harvesting unit. However, other components can also be embedded in the component carrier. For example, a magnetic element can be used as a component. Such a magnetic element may be a permanent magnetic element (e.g. a ferromagnetic element, an antiferromagnetic element, a multiferroic element or a ferrimagnetic element, such as a ferrite core) or may be a paramagnetic element. However, the component may also be a substrate, an interposer or other component carrier, such as a plate-in-plate configuration. The component may be surface mounted on the component carrier and / or may be embedded in the interior of the component carrier. In addition, other components may also be used as the component.

[0053] In an embodiment, the component carrier is a laminated component carrier. In such an embodiment, the component carrier is a composite of multiple layers that are stacked and connected together by applying compression force and / or heat.

[0054] After processing the internal layer structure of the component carrier, one or both main surfaces of the processed layer structure can be covered symmetrically or asymmetrically with one or more further electrically insulating layer structures and / or electrically conductive layer structures (in particular by lamination). In other words, stacking can be continued until the desired number of layers is obtained.

[0055] After the formation of the stack of electrically insulating layer structures and electrically conductive layer structures has been completed, the resulting layer structure or component carrier can be subjected to a surface treatment.

[0056] In particular, in terms of surface treatment, an electrically insulating solder mask may be applied to one or both of the major surfaces of a layer stack or component carrier. For example, such a solder mask may be formed over the entire major surface and the layer of the solder mask may be subsequently patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to an electronic peripheral. Surface portions of the component carrier that remain covered with the solder mask, in particular those containing copper, may be effectively protected from oxidation or corrosion.

[0057] In terms of surface treatment, the surface treatment part can also be selectively applied to the exposed electrically conductive surface part of the component carrier. Such a surface treatment part can be an electrically conductive covering material on the exposed electrically conductive layer structure (such as a pad, a conductive trace, etc., especially including or consisting of copper) on the surface of the component carrier. If such an exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (especially copper) will be oxidized, thereby making the reliability of the component carrier low. The surface treatment part can then be formed as, for example, a joint between a surface mounted component and a component carrier. The surface treatment part has the function of protecting the exposed electrically conductive layer structure (especially the copper circuit), and the surface treatment part can realize a connection process with one or more components, for example, by welding. Examples of suitable materials for the surface treatment part are organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), gold (especially hard gold), chemical tin, nickel gold, nickel palladium, electroless nickel immersion palladium immersion gold (ENIPIG), etc.

[0058] The aspects defined above and further aspects of the present invention are apparent from the examples of embodiment described hereinafter and are explained with reference to these examples of embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figures 1 to 6 The process of manufacturing according to an exemplary embodiment of the present invention is shown. Figure 6 A cross-sectional view of the structure obtained during the method of component carrier is shown.

[0060] Figure 7 Shows Figure 6 A plan view of a layer of a component carrier.

[0061] Figure 8 A cross-sectional view of a component carrier according to a further exemplary embodiment of the present invention is shown.

[0062] Fig. 9 A cross-sectional view of a component carrier according to a further exemplary embodiment of the present invention is shown. DETAILED DESCRIPTION

[0063] The illustrations in the drawings are schematic. In different drawings, similar or identical components are provided with the same reference numerals.

[0064] Before describing the exemplary embodiments in more detail with reference to the drawings, some basic considerations on which the exemplary embodiments of the invention were developed will be summarized.

[0065] According to an exemplary embodiment of the present invention, a method for manufacturing a component carrier with an embedded component is provided, wherein the construction of the component carrier ensures that heat is effectively removed from the component carrier. For this purpose, a laminate with an embedded component is connected to a heat removal body with a very advantageous construction. In particular, a heat-conducting inlay preferably made of copper can be inserted into a core including a fully cured dielectric material such as FR4, and can be patterned by drilling to thereby construct a preform of an external removal structure of a heat removal body. Then a laminated laminate with one or more embedded components (acting as a heat source during operation) can be connected to a heat-conducting sheet of a component-side heat removal structure as a heat removal body. Then, the preform of the external heat removal structure can be connected to the component-side heat removal structure by sandwiching and squeezing an adhesive sheet between the heat removal structures. A mask in the form of a patterned preform of the external heat removal structure can then be used to pattern the adhesive sheet accordingly, so that the surface portion of the component-side heat removal structure is exposed. Then the formed holes can be filled with a heat-conducting material (e.g., by plating or filling paste) to thereby complete the formation of the heat removal body.

[0066] Thus, the heat removal body embedded below the component may specifically include a copper layer facing the component, a thermoelectric dielectric for improving adhesion and inhibiting delamination, and a thick copper or ceramic structure below. The thinner copper layer may also be a layer structure, such as a patterned layer or a pad array. The thicker copper or ceramic structure and / or the thermoelectric dielectric may be partially filled with a phase change material to further improve the heat removal performance. Furthermore, the thermoelectric dielectric may include an array of drilled holes filled with an electrically conductive material such as copper or a phase change material.

[0067] According to an exemplary embodiment of the present invention, a thermally conductive frame (preferably made of copper) can be implemented as a heat removal structure for dissipating heat from embedded components such as semiconductor chips. This can allow the production of highly reliable embedded packages with flexible designs and high yields.

[0068] One challenge when embedding components in component carriers is heat dissipation to avoid reliability failures. There are a variety of methods that allow achieving this goal, such as copper inlays, heat pipes, heat sinks, special heat dissipation materials, thermal vias, etc. However, the thermal capabilities, manufacturing effort, and manufacturability of these methods still depend on the product design. In many cases, conventional heat removal structures cannot provide sufficient thermal performance.

[0069] To overcome this and / or other conventional disadvantages, exemplary embodiments of the present invention provide a powerful heat removal concept: using a copper frame for heat dissipation. As a result, simple processing of the component carrier can be combined with high heat dissipation capabilities.

[0070] In an exemplary embodiment of the present invention, a copper frame can be constructed within a component carrier (such as a printed circuit board, PCB) that allows heat to be dissipated from embedded components to the outer surface of the component carrier. This method can advantageously include using a dielectric or electrically conductive bonding layer in the form of an adhesive sheet to press a drilled copper inlay (as an external heat removal or dissipation structure) onto an embedded core or package having a thermally conductive layer (as a component-side heat removal or dissipation structure). The drilled holes in the copper sheet can then be subsequently decontaminated or cleaned using a laser process or the like to allow connection to the components. Filling the through-holes can be accomplished, for example, by using a copper plating process or by dispensing or printing a thermally conductive paste into the through-holes. Descriptively speaking, the copper frame can be used in combination with a structured adhesive sheet and a component-side heat removal layer to achieve effective thermal management of a component carrier with embedded active components.

[0071] Figures 1 to 6 The process of manufacturing according to an exemplary embodiment of the present invention is shown. Figure 6 A cross-sectional view of the structure obtained during the method of the component carrier 100 is shown.

[0072] Reference Figure 1 , shows a cross-sectional view of a laminated layer stack 102 in which an electronic component 108, such as a semiconductor chip (eg, MOSFET, Metal Oxide Semiconductor Field Effect Transistor), is embedded. Figure 1 The result of embedding a component 108 in a stack 102 comprising a plurality of electrically conductive layer structures 104 and a plurality of electrically insulating layer structures 106 is shown.

[0073] For example, the electrically conductive layer structure 104 may include patterned copper foil and vertical through connections, such as copper-filled laser vias. The electrically insulating layer structure 106 may include a resin, such as an epoxy resin, optionally including reinforcing particles, such as glass fibers or glass spheres. For example, the electrically insulating layer structure 106 may be made of prepreg or FR4 or a stacked film such as ABF. The layer structures 104, 106 may be connected by lamination, i.e., by applying pressure and / or heat.

[0074] Likewise Figure 1 As shown, the component-side first heat removal structure 112 is attached to the lower major surface of the laminate layer stack 102 and the exposed lower major surface of the embedded component 108. Figure 1, the pads of the chip-type semiconductor component 108 are arranged only on the upper surface of the component 108 and are electrically contacted by the copper-filled laser vias of the electrically conductive layer structure 104 located directly above the component 108 and electrically coupled to the component 108. Descriptively speaking, according to Figure 1 The component 108 is thus arranged in a face-up configuration. In other embodiments, the embedded component can have a face-down configuration with pads only on the underside, or a combination of face-up and face-down configurations with pads on opposite sides. Figure 1 , electrical coupling of component 108 is achieved above the top side of component 108, while thermal coupling of component 108 for removing heat is achieved below the bottom side of component 108, as described in more detail below.

[0075] In the embodiment shown, the component-side first heat removal structure 112 is a copper foil or a copper sheet and extends over the entire width of the component carrier 100 to be produced (see, for example, Figure 6 ). The first heat removal structure 112 forms the heat removal body 110 (see, for example Figure 6 ) for effectively removing or dissipating heat generated by the embedded component 108 during operation.

[0076] Reference Figure 2 , showing a preform of the second heat removal structure 114 of the heat removal body 110 (see again Figure 6 ).

[0077] The preform of the second heat removal structure 114 can be constructed by inserting an inlay 128 into a through hole 130 of a base sheet 132. The inlay 128 can be a copper block or sheet or any other body of high thermal conductivity material, such as a ceramic plate. In the example shown, the base sheet 132 can be a fully cured core consisting of a resin (particularly an epoxy resin) with reinforcing particles (such as glass fibers of glass spheres), such as FR4 material. The dielectric core that can constitute the further electrically insulating layer structure 106 can be covered with a patterned copper foil on two opposite main surfaces, thereby constituting the further electrically conductive layer structure 104.

[0078] To connect the base sheet 132 to the inlay 128, the lateral gap between the base sheet 132 and the inlay 128 may be partially or fully filled with a liquid or viscous adhesive 150 that may solidify by curing.

[0079] For example, the core shown with the inlay 128 may be used as a power layer of a component carrier 100 that is easy to manufacture.

[0080] Now refer to Figure 3 , Figure 2The preform of the second heat removal structure 114 shown in the figure can be further processed by patterning the inlay 128. This patterning can be performed by drilling, such as mechanical drilling or laser drilling, or by plasma etching. Alternatively, a photosensitive resin can be used, or a glue can be applied locally. As a result, through holes 120 can be formed in the inlay 128. More generally, the preform of the second heat removal structure 114 shown can be obtained by forming a plurality of through holes 120 in a high thermal conductivity sheet implemented here as a copper inlay 128.

[0081] Reference Figure 4 ,according to Figure 3 The obtained preform of the second heat removal structure 114 can be connected to the Figure 1 The structures shown (i.e., the first heat removal structure 112 attached to the stack 102 and the component 108) are connected, and the adhesive sheet 116 is sandwiched between the preform of the second heat removal structure 114 and the first heat removal structure 112. More specifically, connecting the mentioned preform of the second heat removal structure 114 to the first heat removal structure 112 can be achieved by compressing the adhesive sheet 116 between the preform of the second heat removal structure 114 and the first heat removal structure 112, preferably accompanied by thermal energy.

[0082] The adhesive sheet 116 can be used to adhesively bond and thermally couple the first heat removal structure 112 and the second heat removal structure 114. Figure 4 The adhesive sheet 116 sandwiched between the heat removal structures 112 and 114 can be a continuous layer of adhesive material. For example, the adhesive material can be Figure 4 The described pressing process is at least partially uncured before. By providing mechanical pressure and / or thermal heat, the material of the adhesive sheet 116 can be cured to thereby connect the heat removal structures 112, 114 in an adhesive manner. In order to promote thermal coupling between the heat removal structures 112, 114 through the material of the adhesive sheet 116, thermally conductive filler particles (such as aluminum oxide particles) can also be embedded in the resin matrix of the adhesive sheet 116.

[0083] The adhesive sheet 116 located between the two heat removal structures 112, 114 can be any adhesive sheet, such as a prepreg. The main thermal path is obtained by drilling holes through the adhesive sheet 116 and then filling the holes with a thermally conductive material, such as copper or a thermally conductive paste. The holes through the prepreg can be obtained by, for example, drilling (mechanical drilling or laser drilling) or by plasma etching. An alternative solution is to distribute the adhesive material locally. The thermal conductivity of metals is much higher than the thermal conductivity of these thermal prepregs. Therefore, it is advantageous to pattern the adhesive sheet 116 to obtain an area with locally increased thermal conductivity. Therefore, the adhesive sheet 116 can be any material that can hold the two heat removal structures 112, 114 together.

[0084] When together and still refer to Figure 4 When the first heat removal structure 112 on the component side, the preform of the second heat removal structure 114 on the outside, and the preform of the adhesive sheet 116 therebetween constitute a preform of the heat removal body 110, which is thermally conductively connected to the stack 102 and the component 108. Figure 6 The easily manufactured heat removal body 110 is then able to remove the heat from the component 108 to the outside of the stack 102. However, in order to further improve the thermal performance of the heat removal body 110 and its effect on the thermal reliability of the component carrier 100 to be manufactured, the performance of the heat removal body 110 can be further improved, as will be described below with reference to Figure 5 and Figure 6 Described.

[0085] Reference Figure 5 , Figure 4 The structure shown may be fabricated to undergo a desmear or cleaning process that acts upon the drilled through-holes 120 in the patterned inlay 128 .

[0086] More specifically, Figure 5 The process shown includes treating the substrate with a laser beam 152 from the bottom side. Figure 4 The structure of the second heat removal structure 114 is patterned after the preform of the second heat removal structure 114 is connected to the first heat removal structure 112. The laser beam 152 can be configured to remove the exposed material of the adhesive sheet 116, while the copper material of the patterned inlay 128 covering the portion of the adhesive sheet 116 will be protected from being removed by the laser beam 152. Descriptively speaking, the patterned inlay 128 is used as a mask for patterning the adhesive sheet 116 by laser processing. Therefore, referring to Figure 5 The illustrated process patterns the adhesive sheet 116 such that the through holes 124 of the patterned adhesive sheet 116 are aligned with the through holes 120 of the second heat removal structure 114 .

[0087] For example, the connections between the different parts of the illustrated structure may be accomplished by mechanical or laser drilling (eg, using a conformal mask, drilling holes through the core and sheet by laser, etc.).

[0088] Reference Figure 6 , the illustrated component carrier 100 according to an exemplary embodiment of the present invention can be obtained by filling the through-holes 120 of the preform of the second heat removal structure 114 and the aligned through-holes 124 of the patterned adhesive sheet 116 with a high thermal conductivity filling medium 126, for example, a high thermal conductivity filling medium 126 having a thermal conductivity of at least 50 W / mK. This can be done, for example, by plating (especially copper plating) or by printing a thermally conductive paste (especially copper paste or silver paste) to fill the through-holes 120, 124 and thermally connect the embedded component 108 to the bottom outer surface of the component carrier 100.

[0089] When the thermally conductive filling medium 126 is formed by plating and the structured inlay 128 is made of copper, the thermally conductive filling medium 126 may be formed in the through holes 120, 124, and the thermally conductive filling medium 126 may also be formed in the through holes 120, 124. Figure 5 The bottom side of the structure, the outside of the through holes 120, 124, such as Figure 6 It is schematically shown with reference numeral 158 in FIG.

[0090] Figure 6 Dashed line 154 in FIG. 1 shows the material interface between the material of the component-side first heat removal structure 112 (eg, copper) and the patterned inlay 128 (eg, copper) of the external second heat removal structure 114 on the one hand and the thermally conductive fill medium 126 (eg, plated copper) on the other hand.

[0091] As a result of the described production process, the illustrated cross section of a component carrier 100 according to an exemplary embodiment of the invention is obtained.

[0092] In the illustrated embodiment, the component carrier 100 is configured as a printed circuit board (PCB). The component carrier 100 includes a laminated layer stack 102, which includes an electrically conductive layer structure 104 and an electrically insulating layer structure 106. A semiconductor component 108 is embedded in the stack 102, wherein the surface contacts a component-side first heat removal structure 112 of a heat removal body 110. The heat removal body 110, which also forms a part of the component carrier 100, is configured to remove heat from the component 108 toward the lower main surface 160 of the component carrier 100 and the outside of the component carrier 100. The heat removal body 110 is connected to both the stack 102 and the component 108 by direct physical contact to thereby establish a high thermal conductivity connection. In addition to the component-side first heat removal structure 112 that is directly thermally coupled to the component 108, the heat removal body 110 also includes an external second heat removal structure 114. The second heat removal structure 114 is thermally coupled to the first heat removal structure 112 primarily through the thermally conductive filling medium 126 located in the through hole 124 of the adhesive sheet 116. Therefore, the thermally conductive filling medium 126 is inserted into a recess of the patterned adhesive sheet 116 configured to adhesively bond and thermally couple the first heat removal structure 112 to the second heat removal structure 114. When the material of the patterned adhesive sheet 116 itself also has thermal conductivity, for example, by providing the adhesive sheet 116 with high thermal conductivity filler particles (e.g., made of aluminum oxide), the material of the adhesive sheet 116 can also significantly promote the thermal coupling between the heat removal structures 112, 114.

[0093] In the illustrated embodiment, the first heat removal structure 112 is a continuous heat conductive sheet made of copper. The vertical thickness d of the first heat removal structure 112 can be, for example, at least 50 μm, in particular at least 100 μm, more particularly at least 200 μm. However, the first heat removal structure 112 can also be thinner. In contrast, the second heat removal structure 114 is a patterned heat conductive copper sheet comprising a plurality of through holes 120 and located at the outer main surface 160 of the component carrier 100. The through holes 120 are filled with a heat conductive filling medium 126 that can be implemented as plated copper. Merely by way of example, the vertical thickness D of the heat conductive material of the second heat removal structure 114 can be, for example, at least 100 μm, in particular at least 200 μm, more particularly at least 500 μm. More generally, the vertical thickness D of the heat conductive material of the second heat removal structure 114 can be greater than the vertical thickness d of the first heat removal structure 112. However, the thickness D depends primarily on the requirements of the specific application. If a thin stack is desired, the thickness D of the thermally conductive material of the second heat removal structure 114 may be selected according to these requirements.

[0094] Figure 7 Shows Figure 61 is a plan view of a layer of patterned adhesive sheet 116 of component carrier 100.

[0095] The patterned adhesive sheet 116 may be electrically insulating and thermally conductive. For example, the adhesive sheet 116 may be a cured prepreg with high thermal conductivity filler particles. The adhesive sheet 116 may also be an adhesive resin without reinforcing particles and / or without high thermal conductivity filler particles. Figure 7 As shown, the patterned adhesive sheet 116 may be a continuous planar structure having a plurality of through holes 124 arranged in rows and columns. In other words, the through holes 124 may be arranged in a matrix-like pattern to form a regular (or optionally irregular) two-dimensional array of through holes 124. Figure 7 As shown, the through hole 124 of the patterned adhesive sheet 116 is filled with a thermally conductive filling medium 126, such as plated metal or metal paste.

[0096] In the illustrated plan view of the patterned adhesive sheet 116, the ratio between the partial area A1 of all through holes 124 together and the remaining partial area A2 of the adhesive material of the sheet 116 can be at least 20% or 0.2. Figure 7 As shown, the sum of A1 and A2 may be the entire surface area of ​​the patterned adhesive sheet 116 having filled vias 124. Due to the described design rules, the copper-filled adhesive sheet 116 may significantly contribute to the heat removal performance of the heat remover 110 while simultaneously suppressing delamination and improving the overall mechanical stability of the component carrier 100 as a whole.

[0097] In particular, the size of the plated through holes 124 may be selected based on the size of the component 108, the aspect ratio of the fill, the minimum via density or spacing, etc. For example, a 50% via molding density may be an appropriate choice.

[0098] Proper configuration of the heat removal body 110 can achieve advantageous two-dimensional heat dissipation through the copper layer, three-dimensional heat dissipation through the heat slab, and radial exchange between the plated through-holes and the heat slab.

[0099] Furthermore, when the phase change material 122 is inserted into the through holes 120, 124, the thermal conversion can further improve the heat removal capability, heat dissipation or cooling efficiency, as described below with reference to Figure 8 Described in more detail.

[0100] Figure 8 A cross-sectional view of a component carrier 100 according to another exemplary embodiment of the present invention is shown.

[0101] Figure 8 The implementation method and Figure 6 The embodiments differ in particular in that according to Figure 8, the through holes 120, 124 are filled with phase change material 122 instead of being filled with plated copper or paste copper. Figure 8 , the horizontal bottom surface of the component carrier 100 may remain free of additional material such that the patterned base sheet 132 is exposed.

[0102] The phase change material 122 may be a material that changes its microstructure when heated, so that thermal energy generated by the embedded component 108 during operation of the component carrier 100 may be converted into mechanical energy by the phase change material 122. This may further increase the heat removal capability of the heat removal body 110. The phase change may be reversible, so that subsequent cooling of the component carrier 100 (after operation) may switch the phase change material 122 back to the initial state of the phase change material 122. Although not in Figure 8 , but the phase change material 122 may be provided to only partially fill the corresponding through-holes 120, 124, because the phase change material 122 may change the volume of the phase change material 122 during the phase transition. The remaining empty space after the through-holes 120, 124 are partially filled with the phase change material 122 may accommodate the expanded phase change material 122 in the event of a phase transition. Providing the phase change material 122 in addition to providing the copper cooling structure may further improve the heat removal efficiency.

[0103] For example, the phase change material 122 may be inserted as a paste or as a sheet into the through holes 120, 124. Thermal composites, ie, resin systems used to promote adhesion and processability, may also be used and may be filled with filler particles including the phase change material 122.

[0104] Fig. 9 A cross-sectional view of a component carrier 100 according to another exemplary embodiment of the present invention is shown.

[0105] Fig. 9 The implementation method and Figure 8 The implementation method of Fig. 9 , the component carrier 100 includes a dielectric thermal bonding material 180 located at the top and bottom sides of the second heat removal structure 114. Alternatively, the dielectric thermal bonding material 180 may be provided at only the top or bottom sides of the second heat removal structure 114 (not shown). Fig. 9 In the embodiment, the second heat removal structure 114 includes a phase change material 122 .

[0106] Advantageously, such a dielectric thermal bonding material 180 may be provided above and / or below the phase change material 122 to electrically separate the bottom side of the structure. This may be advantageous for high current applications to allow external cooling and to prevent electrical shock.

[0107] It should be noted that the term "comprising" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. Furthermore, elements described in connection with different embodiments may be combined.

[0108] It should also be noted that reference signs in the claims should not be construed as limiting the scope of the claims.

[0109] The implementation of the invention is not limited to the preferred embodiments shown in the figures and described above. Rather, multiple variations using the solutions shown and according to the principle of the invention are possible, even in the case of fundamentally different embodiments.

Claims

1. A component carrier (100), wherein: The component carrier (100) comprises: A stack (102), the stack (102) comprising at least one electrically conductive layer structure (104) and / or at least one electrically insulating layer structure (106); a component (108) embedded in the stack (102); and A heat removal body (110) configured to remove heat from the component (108) and connected to the stack (102), the heat removal body (110) comprising: a first heat removal structure (112) on the component side, the first heat removal structure (112) being thermally coupled to the component (108); and a second heat removal structure (114) thermally coupled to the first heat removal structure (112) and facing away from the component (108), wherein the first heat removal structure (112) has a thermal conductivity of at least 50 W / mK and extends over the entire width of the component carrier (100), The second heat removal structure (114) has a thermal conductivity of at least 50 W / mK and comprises a copper plate or a copper block.

2. The component carrier (100) according to claim 1, wherein: The first heat removal structure (112) is a continuous heat conduction sheet, or the first heat removal structure (112) includes a plurality of heat conduction pads.

3. The component carrier (100) according to claim 1, comprising at least one of the following features: in, The first heat removal structure (112) includes at least one of metal and ceramic; The second heat removal structure (114) comprises a patterned heat conduction sheet, and the patterned heat conduction sheet comprises a plurality of through holes (120).

4. The component carrier (100) according to claim 1, wherein: The second heat removing structure (114) includes ceramic.

5. The component carrier (100) according to claim 1, wherein: The heat removal body (110) includes a patterned adhesive sheet (116), and the patterned adhesive sheet (116) adhesively bonds and thermally couples the first heat removal structure (112) and the second heat removal structure (114).

6. The component carrier (100) according to claim 5, comprising at least one of the following features: in, The through holes (124) of the patterned adhesive sheet (116) are at least partially filled with at least one of a thermally conductive filling medium (126) and a phase change material (122); wherein the patterned adhesive sheet (116) is electrically insulating and thermally conductive; The patterned adhesive sheet (116) is a continuous structure having a plurality of through holes (124).

7. The component carrier (100) according to claim 1, wherein: The second heat removal structure (114) is located at the outer main surface (160) of the component carrier (100), or the second heat removal structure (114) is directly adjacent to the outer main surface (160) of the component carrier (100).

8. The component carrier (100) according to claim 1, wherein: The second heat removal structure (114) includes a dielectric thermal bonding material (180) located at a top side and / or a bottom side.

9. The component carrier (100) according to claim 1, wherein: The second heat removal structure (114) includes a phase change material (122), or the second heat removal structure (114) is composed of a phase change material (122).

10. A method for manufacturing a component carrier (100), wherein: The method comprises: embedding a component (108) in a stack (102), the stack (102) comprising at least one electrically conductive layer structure (104) and / or at least one electrically insulating layer structure (106); and A heat removal body (110) is connected to the stack (102), the heat removal body (110) being configured to remove heat from the component (108), and the heat removal body (110) comprising: a first heat removal structure (112) on the component side, the first heat removal structure (112) being thermally coupled to the component (108); and a second heat removal structure (114) thermally coupled to the first heat removal structure (112) and facing away from the component (108), wherein the first heat removal structure (112) has a thermal conductivity of at least 50 W / mK and extends over the entire width of the component carrier (100), The second heat removal structure (114) has a thermal conductivity of at least 50 W / mK and comprises a copper plate or a copper block.

11. The method according to claim 10, wherein: The method comprises: preforming at least a portion of the heat removal body (110); and Thereafter, the at least a portion of the preform of the heat removal body (110) is connected to the stack (102).

12. The method according to claim 10, wherein: The method includes providing the heat removal body (110) with a patterned adhesive sheet (116), wherein the adhesive sheet (116) adhesively bonds and thermally couples the first heat removal structure (112) and the second heat removal structure (114).

13. The method according to claim 12, wherein: The method comprises: preforming at least a portion of the second heat removal structure (114); and Thereafter, the at least a portion of the preform of the second heat removal structure (114) is connected to the first heat removal structure (112) already connected to the stack (102) through the adhesive sheet (116).

14. The method according to claim 13, comprising at least one of the following features: in, The method includes preforming at least a portion of the second heat removal structure (114) by inserting an inlay (128) into a through hole (130) of a base sheet (132) and thereafter patterning the inlay (128); The method comprises: connecting at least a portion of the second heat removal structure (114) to the first heat removal structure (112) by pressing the adhesive sheet (116) between at least a portion of the second heat removal structure (114) and the first heat removal structure (112); The method includes: after connecting the at least a portion of the preform of the second heat removal structure (114) to the first heat removal structure (112), patterning the adhesive sheet (116).

15. The method according to claim 12, wherein: The method includes patterning the adhesive sheet (116) so that the through holes (124) of the patterned adhesive sheet (116) are aligned with the through holes (120) of the second heat removal structure (114).

16. The method according to claim 12, wherein: The method includes patterning the adhesive sheet (116) by at least one of laser processing, mechanical drilling, etching, light irradiation of a photosensitive medium, and local application of glue.

17. The method according to claim 12, wherein: The method includes at least partially filling the through-holes (120) of the preform of the second heat removal structure (114) and / or the through-holes (124) of the patterned adhesive sheet (116) with at least one of a thermally conductive filling medium (126) and a phase change material (122).

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