A miniaturized test system and method for radio frequency switch chip life

Abstract

The present invention belongs to the technical field of chip life test systems, and specifically relates to a miniaturized test system and method for the life of a radio frequency switch chip, wherein a drive signal generating module is electrically connected to a radio frequency switch chip, and the radio frequency switch chip is electrically connected to a radio frequency signal generating module and a radio frequency detection module respectively, and the drive signal generating module and the radio frequency detection module are both electrically connected to a data processing module via a signal line, and the data processing module is electrically connected to a host computer. When performing a radio frequency switch chip life test, the present invention integrates various functional modules into one to replace the use of expensive and bulky test instruments such as a voltage source, a radio frequency signal source, a voltage amplifier, a probe station, and an oscilloscope in a traditional laboratory environment for testing, thereby greatly saving testing costs, solving complex on-site wiring, and removing the limitation that test tasks must be performed in a laboratory environment.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip life test systems, and in particular relates to a miniaturized test system and method for the life of a radio frequency switch chip. Background Art

[0002] The lifespan of an RF switch is a key indicator of an RF switch chip. It measures the total number of switching cycles it can complete before failure while meeting RF and repeatability requirements. RF switch lifespan testing is primarily divided into two categories: cold switching lifespan, measured by applying a DC signal to the RF switch chip, and hot switching lifespan, measured by applying an RF signal to the RF switch chip. Both tests examine the power amplitude (envelope) of the RF switch drive signal and the input and output RF signals to characterize the switch's on and off states.

[0003] There are two main methods for testing the lifespan of RF switch chips. One is to measure the DC resistance of the RF switch chip in both the on (ON) and off (OFF) states. Ideally, the DC resistance in the OFF state should be infinite, and in the ON state it should be less than its characteristic DC resistance, typically a few ohms. If the DC resistance of the RF switch chip is too small in the OFF state or too large in the ON state, it can be inferred that the RF switch chip has failed, thereby determining the switch lifespan. The other method uses an envelope detector to convert the RF signal power into a voltage signal, which is then detected and analyzed. Based on these two methods, current systems for testing the lifespan of RF switch chips are also mainly divided into two types. One relies entirely on various test instruments, such as voltage sources, RF signal sources, voltage amplifiers, probe stations, oscilloscopes, and other expensive and bulky traditional laboratory test instruments. The RF switch lifespan is calculated manually by manually recording test data, and the tester then writes a handwritten test report. The other is that with the emergence of computers, various irreplaceable advantages of virtual instruments are utilized to write control programs, and the test instruments are assisted in controlling through serial ports or remote programs. The host computer calculates the life, outputs the test results, and prints the test report.

[0004] The problem with life testing methods that rely entirely on various test instruments is the cost of testing. Various instruments are expensive, the test wiring is complex, and the requirements for testers are high.

[0005] Although the system built with virtual instruments to assist testing has improved testing efficiency to a certain extent, it still cannot solve the problem of high testing costs. At the same time, both methods cannot get rid of the limitation of only being able to test in a laboratory environment. Summary of the Invention

[0006] In response to the technical problems in the above-mentioned prior art that RF switch chip life testing is expensive, inefficient, and testing is limited to the laboratory, the present invention provides a miniaturized test system and method for the life of RF switch chips with high testing efficiency, low cost, and a wide range of applications.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0008] A miniaturized test system for the life of a radio frequency switch chip includes a system power module, a drive signal generating module, a radio frequency switch chip, a radio frequency signal generating module, a radio frequency detection module, a data processing module, and a host computer. The drive signal generating module is electrically connected to the radio frequency switch chip, and the radio frequency switch chip is electrically connected to the radio frequency signal generating module and the radio frequency detection module respectively. The drive signal generating module and the radio frequency detection module are both electrically connected to the data processing module via signal lines, and the data processing module is electrically connected to the host computer. The system power module is electrically connected to the drive signal generating module, the radio frequency signal generating module, the radio frequency detection module, the data processing module, and the host computer respectively.

[0009] It also includes a DC signal generating module and a current limiting protection resistor. The radio frequency switch chip is connected to the radio frequency signal generating module and the DC signal generating module through a first single-pole double-throw switch. The radio frequency switch chip is connected to the radio frequency detection module and the current limiting protection resistor through a second single-pole double-throw switch. The current limiting protection resistor is electrically connected to the data processing module through a signal line.

[0010] The driving signal generating module includes a boost circuit, a power field effect tube driving circuit, a power field effect tube and a voltage regulating circuit. The boost circuit is electrically connected to the system power supply module, the boost circuit is electrically connected to the voltage regulating circuit, the power field effect tube driving circuit is electrically connected to the gate of the power field effect tube, the power field effect tube driving circuit is electrically connected to the system power supply module, the voltage regulating circuit is electrically connected to the drain of the power field effect tube, and the voltage regulating circuit is electrically connected to the radio frequency switch chip.

[0011] The system power supply module includes a boost circuit power supply, a power field effect tube drive circuit power supply, a radio frequency signal generating module power supply, a radio frequency detection module power supply, a data processing module power supply and a host computer power supply. The boost circuit power supply is electrically connected to the boost circuit, the power field effect tube drive circuit power supply is electrically connected to the power field effect tube drive circuit, the radio frequency signal generating module power supply is electrically connected to the radio frequency signal generating module, the radio frequency detection module power supply is electrically connected to the radio frequency detection module, the data processing module power supply is electrically connected to the data processing module, and the host computer power supply is electrically connected to the host computer.

[0012] The data processing module includes a high-pass filtering circuit, a low-pass filtering circuit, a data acquisition circuit and a detection and calculation circuit. The high-pass filtering circuit and the low-pass filtering circuit are electrically connected to the radio frequency detection module and the current limiting protection resistor. The high-pass filtering circuit and the low-pass filtering circuit are electrically connected to the data acquisition circuit, and the data acquisition circuit is electrically connected to the detection and calculation circuit.

[0013] The radio frequency switch chip is fixedly placed in the radio frequency switch chip fixture, and the radio frequency switch chip is respectively connected to the drive signal generating module, the first single-pole double-throw switch, and the second single-pole double-throw switch through the radio frequency switch chip fixture.

[0014] A method for testing a miniaturized test system for the life of a radio frequency switch chip comprises the following steps:

[0015] S101, the driving signal generating module outputs a control signal with a preset voltage and frequency to the RF switch chip to be tested to control the on / off state of the RF switch chip;

[0016] S102. If the hot switching life of the RF switch chip is to be tested, the RF signal generating module outputs a transmission signal at a preset frequency and power to the RF switch chip to be tested; if the cold switching life of the RF switch chip is to be tested, the DC signal generating module outputs a transmission signal at a preset amplitude to the RF switch chip to be tested;

[0017] S103, the RF detection module performs envelope detection on the RF signal passing through the RF switch chip, and outputs the envelope signal to the data processing module;

[0018] S104: The data processing module processes the envelope signal, tests the hot switching life and the cold switching life of the RF switch chip, and outputs the processed signal and the detection calculation result to the host computer;

[0019] S105. The host computer displays the signal processed by the data processing module in real time, outputs the test results and prints a test report.

[0020] The method for driving the signal generating module in S101 to control the on / off state of the RF switch chip includes the following steps:

[0021] S201, the boost circuit power supply supplies power to the boost circuit;

[0022] S202, the boost circuit boosts the DC voltage signal output by the boost circuit power supply;

[0023] S203, inputting the DC voltage signal pumped up by the boost circuit into the drain of the power field effect transistor via the voltage regulating circuit;

[0024] S204, the power field effect transistor driving circuit power supply supplies power to the power field effect transistor driving circuit;

[0025] S205, the power field effect tube driving circuit outputs a frequency-adjustable square wave signal to the gate of the power field effect tube;

[0026] S206 , the voltage regulating circuit outputs a high-voltage square wave signal with adjustable frequency and amplitude, namely, a driving signal for the RF switch chip.

[0027] The method for testing the hot switching life of the RF switch chip in S102 is as follows: the high-pass filter circuit filters out the DC signal in the RF signal output by the RF detection module, retains the high-frequency signal, obtains a first filtered signal, and outputs the filtered signal to the data acquisition circuit; the low-pass filter circuit filters out the high-frequency signal in the drive signal output by the drive signal generation module, retains the DC low-frequency signal, obtains a second filtered signal, and outputs the filtered signal to the data acquisition circuit; the data acquisition circuit for real-time signal acquisition is divided into two channels, namely the first channel and the second channel; the first channel acquires the first filtered signal in real time, and the collected analog signal is processed. The voltage signal is converted into a first digital signal, and the digital signal is output to the signal detection and calculation circuit; the second channel collects the second filtered signal in real time, converts the collected analog voltage signal into a second digital signal, and outputs the digital signal to the signal detection and calculation circuit, and the detection and calculation circuit detects and calculates the input first digital signal and the second digital signal. According to the preset parameters of the driving signal and the transmitting signal, when it is detected that the first digital signal and the second digital signal change from a low level to a high level and from a high level to a low level in sequence, it is determined that the RF switch chip has experienced a hot switch, that is, the counter is incremented by one each time the RF switch chip is hot switched.

[0028] The method for testing the cold switching life of the RF switch chip in S102 is as follows: a DC low-voltage signal passes through the RF switch chip and then through the current limiting protection resistor and is output to a data acquisition circuit; the high-pass filter circuit is turned off; the low-pass filter circuit filters out the high-frequency signal in the drive signal output by the drive signal generating module, retains the DC low-frequency signal output by the DC signal generating module, obtains a third filtered signal, and outputs the filtered signal to the data acquisition circuit; the data acquisition circuit for real-time signal acquisition is divided into two channels, namely a first channel and a second channel; the first channel real-time acquires the DC low-voltage signal output by the current limiting protection resistor; signal, converts the collected analog voltage signal into a third digital signal, and outputs the digital signal to the signal detection and calculation circuit; the second channel collects the third filtered signal in real time, converts the collected analog voltage signal into a fourth digital signal, and outputs the digital signal to the signal detection and calculation circuit, the detection and calculation circuit detects and calculates the two input digital signals, and according to the parameters of the preset signal, when it is detected that the third digital signal and the fourth digital signal change from a low level to a high level and from a high level to a low level in sequence, it is determined that the RF switch chip has experienced a cold switching, that is, the counter is incremented by one after each cold switching of the RF switch chip.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] When performing a life test on a radio frequency switch chip, the present invention integrates various functional modules into one to replace the use of expensive and bulky testing instruments such as a voltage source, a radio frequency signal source, a voltage amplifier, a probe station, and an oscilloscope in a traditional laboratory environment for testing, thereby greatly saving testing costs, solving complex on-site wiring problems, and removing the restriction that testing tasks must be performed in a laboratory environment; the present invention utilizes a host computer to complete complex signal acquisition, analysis, calculation, and printing of test reports, thereby reducing manual measurement errors and improving testing efficiency. Therefore, the present invention integrates various functional modules while improving test accuracy, thereby achieving the purpose of a miniaturized testing system. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are merely exemplary, and those skilled in the art can, without inventive effort, derive other implementation drawings based on the provided drawings.

[0032] The structures, proportions, sizes, etc. illustrated in this specification are intended solely to complement the contents disclosed herein and to facilitate understanding and reading by persons skilled in the art. They are not intended to limit the conditions under which the present invention may be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportions, or adjustments in sizes, without affecting the efficacy and objectives of the present invention, shall remain within the scope of the technical contents disclosed herein.

[0033] Figure 1 It is the overall circuit connection diagram of the present invention;

[0034] Figure 2 Schematic diagram of the power supply module of the system of the present invention;

[0035] Figure 3 Schematic diagram of a driving signal generating module of the present invention;

[0036] Figure 4 is a schematic diagram of a data processing module of the present invention;

[0037] Figure 5 is a flow chart of the steps of the present invention;

[0038] Figure 6 This is a flow chart of the steps of driving the signal generating module of the present invention.

[0039] Among them: 1 is the system power supply module, 2 is the drive signal generation module, 3 is the RF switch chip, 4 is the RF switch chip fixture, 5 is the RF signal generation module, 6 is the RF detection module, 7 is the data processing module, 8 is the host computer, 9 is the DC signal generation module, 10 is the current limiting protection resistor, 11 is the first single-pole double-throw switch, 12 is the second single-pole double-throw switch, 101 is the boost circuit power supply, 102 is the power field effect tube drive circuit power supply, 103 is the RF signal generation module power supply, 104 is the RF detection module power supply, 105 is the data processing module power supply, 106 is the host computer power supply, 201 is the boost circuit, 202 is the power field effect tube drive circuit, 203 is the power field effect tube, 204 is the voltage regulation circuit, 301 is the high-pass filter circuit, 302 is the low-pass filter circuit, 303 is the data acquisition circuit, and 304 is the detection calculation circuit. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of this application, not all the embodiments. These descriptions are only to further illustrate the features and advantages of the present invention, rather than to limit the claims of the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0041] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following embodiments are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0042] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout this application, unless otherwise specified, "plurality" means two or more.

[0043] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0044] like Figure 1 As shown, the miniaturized test system for the life of the RF switch chip in this embodiment includes: a system power supply module 1 connected to each functional module through a signal line; a drive signal generating module 2 for outputting a control signal to the RF switch chip 3 to be tested at a preset voltage and frequency; a RF switch chip fixture 4 for fixing the RF switch chip 3; a RF signal generating module 5 for outputting a transmission signal to the RF switch chip 3 to be tested at a preset frequency and power; a RF detection module 6 for performing envelope detection on the RF signal passing through the RF switch chip 3; a data processing module 7 connected to the drive signal generating module 2 and the RF detection module 6 through a signal line; a host computer 8 for displaying the signal and count value processed by the data processing module 7 in real time, outputting the test results and printing a test report; a DC signal generating module 9 for providing a DC low-voltage signal when testing the cold switching life of the RF switch chip 3; and a current limiting protection resistor 10 for limiting the DC current in the circuit when testing the cold switching life of the RF switch chip.

[0045] In this embodiment, in order to realize the test, the RF switch chip 3 is placed on the RF switch fixture 4, the output end of the RF signal generating module 5 is connected to the signal input end of the RF switch chip 3 through the RF switch fixture 4, the driving signal generating module 2 is connected to the data processing module 7, the output end of the driving signal generating module 2 is connected to the driving input end of the RF switch chip 3 through the RF switch fixture 4, the output end of the RF switch chip 3 is connected to the input end of the RF detection module 6 through the RF switch fixture 4, the output end of the RF detection module 6 is connected to the data processing module 7, and the output end of the data processing module 7 is connected to the host computer 8.

[0046] Furthermore, in this embodiment, the drive signal generation module 2 is required to output a control signal at an adjustable voltage and frequency to the RF switch chip 3 under test to control its on / off state. In the on state, the RF signal generation module 5 is required to output a transmission signal at an adjustable frequency and power to the RF switch chip 3 under test. The RF detection module 6 performs envelope detection on the transmission signal passing through the RF switch chip 3 and outputs the envelope signal to the data processing module 7. The host computer 8 displays the signal processed by the data processing module 7 in real time, outputs the test results, and prints a test report.

[0047] Further, if Figure 2 As shown, in this embodiment, the system power supply module 1 includes a boost circuit power supply 101 for supplying power to the boost circuit 201; a power field effect transistor drive circuit power supply 102 for supplying power to the power field effect transistor drive circuit 202; a radio frequency signal generating module power supply 103 for supplying power to the radio frequency signal generating module 5; a radio frequency detection module power supply 104 for supplying power to the radio frequency detection module 6; a data processing module power supply 105 for supplying power to the data processing module 7; and a host computer power supply 106 for supplying power to the host computer 8.

[0048] Further, if Figure 3 As shown, in this embodiment, boost circuit 201 pumps the DC voltage output by boost circuit power supply 101 into a DC high voltage and outputs it to voltage regulator circuit 204. Power field effect transistor driver circuit 202 outputs a frequency-adjustable square wave signal that is input to the gate of power field effect transistor 203 to drive it into operation, utilizing the switching characteristics between the source and drain to perform waveform modulation. Voltage regulator circuit 204 stabilizes and regulates the amplitude of the DC high voltage signal output by boost circuit 201 and outputs it to power field effect transistor 203. Voltage regulator circuit 204 then outputs a drive signal with adjustable voltage and frequency that is input to the RF switch chip under test.

[0049] Further, if Figure 4As shown, in this embodiment, the high-pass filter circuit 301 of the data processing module 7 filters out the DC signal in the RF signal output by the RF detection module 6, filters the signal output by the RF detection module 6, retains the high-frequency signal, and filters out the DC signal to obtain a first filtered signal, which is then output to the data acquisition circuit; the low-pass filter circuit 302 filters out the high-frequency signal in the driving signal output by the driving signal generating module 2, and the low-pass filter circuit 301 filters the driving signal, retains the DC low-frequency signal, and filters out the high-frequency signal to obtain a second filtered signal, which is then output to the data acquisition circuit 303. The data acquisition circuit 303 is used to collect signals in real time. The data acquisition circuit 303 is divided into two channels. The first channel collects the first filtered signal in real time, converts the collected analog voltage signal into a first digital signal, and outputs the first digital signal to the signal detection and calculation circuit 304; the second channel collects the second filtered signal in real time, converts the collected analog voltage signal into a second digital signal, and outputs the second digital signal to the signal detection and calculation circuit 304. The detection and calculation circuit 304 is used to detect and calculate the two digital signals. The detection and calculation circuit 304 performs detection and calculation on the two input digital signals. According to the preset parameters of the drive signal and the transmission signal, when it is detected that the first digital signal and the second digital signal change from low level to high level and from high level to low level respectively, it is determined that the RF switch chip 3 has experienced a hot switch. The counter is incremented by one each time the RF switch chip 3 undergoes a hot switch.

[0050] Furthermore, if the cold switching life of the RF switch chip 3 is tested, the DC low-voltage signal passes through the RF switch chip 3 and then passes through the current limiting protection resistor 10 and is output to the data acquisition circuit, the high-pass filter circuit is turned off, and the low-pass filter circuit 302 filters out the high-frequency signal in the drive signal output by the drive signal generating module 2, retains the DC low-frequency signal of the DC signal generating module 9, obtains a third filtered signal, and outputs the filtered signal to the data acquisition circuit 303. The data acquisition circuit for real-time acquisition of the signal 303 is divided into two channels, namely the first channel and the second channel. The first channel collects the DC low-frequency signal output by the current limiting protection resistor 10 in real time. The second channel collects the third filtered signal in real time, converts the collected analog voltage signal into a fourth digital signal, and outputs the digital signal to the signal detection and calculation circuit 304. The detection and calculation circuit detects and calculates the two input digital signals. According to the parameters of the preset signal, when it is detected that the third digital signal and the fourth digital signal change from a low level to a high level and from a high level to a low level in sequence, it is determined that the RF switch chip 3 has experienced a cold switching, that is, the counter is incremented by one after each cold switching of the RF switch chip 3.

[0051] Furthermore, in this embodiment, the host computer 8 displays the signal processed by the data processing module 7 in real time, outputs the test results and prints a test report.

[0052] like Figure 5 As shown, in this embodiment, the test method of the miniaturized test system for the life of the RF switch chip is:

[0053] S101: A driving signal generating module outputs a control signal with a preset voltage and frequency to a radio frequency switch chip to be tested, so as to control the on / off state of the radio frequency switch chip.

[0054] S102, the RF signal generating module transmits a signal at a preset frequency and power to the RF switch chip to be tested: Figure 6 As shown, the boost circuit power supply supplies power to the boost circuit; the boost circuit boosts the DC voltage signal output by the boost circuit power supply; the DC voltage signal pumped up by the boost circuit is input to the drain of the power field effect transistor through the voltage regulating circuit; the power field effect transistor drive circuit power supply supplies power to the power field effect transistor drive circuit; the power field effect transistor drive circuit outputs a frequency-adjustable square wave signal to the gate of the power field effect transistor; the voltage regulating circuit outputs a high-voltage square wave signal with adjustable frequency and amplitude, which is the RF switch chip drive signal.

[0055] S103: The RF detection module performs envelope detection on the RF signal passing through the RF switch chip, and outputs the envelope signal to the data processing module.

[0056] S104: The data processing module processes the envelope signal and outputs the processed signal and the detection calculation result to the host computer.

[0057] S105. The host computer displays the signal processed by the data processing module in real time, outputs the test results and prints a test report.

[0058] The above only describes in detail the preferred embodiments of the present invention, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in this field without departing from the purpose of the present invention, and various changes should be included in the scope of protection of the present invention.

Claims

1. A miniaturized test system for the life of a radio frequency switch chip, characterized by: The invention comprises a system power supply module (1), a driving signal generating module (2), a radio frequency switch chip (3), a radio frequency signal generating module (5), a radio frequency detection module (6), a data processing module (7), a host computer (8) and a current limiting protection resistor (10), wherein the driving signal generating module (2) is electrically connected to the radio frequency switch chip (3), the radio frequency switch chip (3) is electrically connected to the radio frequency signal generating module (5) and the radio frequency detection module (6), the driving signal generating module (2) and the radio frequency detection module (6) are both electrically connected to the data processing module (7) via a signal line, the data processing module (7) is electrically connected to the host computer (8), and the system power supply module (1) is electrically connected to the driving signal generating module (2), the radio frequency signal generating module (5), the radio frequency detection module (6), the data processing module (7) and the host computer (8); The system power supply module (1) includes a boost circuit power supply (101), a power field effect transistor drive circuit power supply (102), a radio frequency signal generation module power supply (103), a radio frequency detection module power supply (104), a data processing module power supply (105) and a host computer power supply (106); the drive signal generation module (2) includes a boost circuit (201) and a power field effect transistor drive circuit (202); the boost circuit power supply (101) is electrically connected to the boost circuit (201); the power field effect transistor drive circuit power supply (102) is electrically connected to the power field effect transistor drive circuit (202); the radio frequency signal generation module power supply (103) is electrically connected to the radio frequency signal generation module (5); the radio frequency detection module power supply (104) is electrically connected to the radio frequency detection module (6); the data processing module power supply (105) is electrically connected to the data processing module (7); and the host computer power supply (106) is electrically connected to the host computer (8); The data processing module (7) comprises a high-pass filter circuit (301), a low-pass filter circuit (302), a data acquisition circuit (303) and a detection calculation circuit (304); the high-pass filter circuit (301) and the low-pass filter circuit (302) are both electrically connected to the radio frequency detection module (6) and the current limiting protection resistor (10); the high-pass filter circuit (301) and the low-pass filter circuit (302) are both electrically connected to the data acquisition circuit (303); and the data acquisition circuit (303) is electrically connected to the detection calculation circuit (304).

2. The miniaturized test system for the life of a radio frequency switch chip according to claim 1, characterized in that: The invention also includes a DC signal generating module (9), wherein the radio frequency switch chip (3) is connected to the radio frequency signal generating module (5) and the DC signal generating module (9) via a first single-pole double-throw switch (11), and the radio frequency switch chip (3) is connected to the radio frequency detection module (6) and the current limiting protection resistor (10) via a second single-pole double-throw switch (12), and the current limiting protection resistor (10) is electrically connected to the data processing module (7) via a signal line.

3. The miniaturized test system for the life of a radio frequency switch chip according to claim 1, characterized in that: The driving signal generating module (2) further comprises a power field effect tube (203) and a voltage regulating circuit (204); the boosting circuit (201) is electrically connected to the system power supply module (1); the boosting circuit (201) is electrically connected to the voltage regulating circuit (204); the power field effect tube driving circuit (202) is electrically connected to the gate of the power field effect tube (203); the power field effect tube driving circuit (202) is electrically connected to the system power supply module (1); the voltage regulating circuit (204) is electrically connected to the drain of the power field effect tube (203); and the voltage regulating circuit (204) is electrically connected to the radio frequency switch chip (3).

4. The miniaturized test system for the life of a radio frequency switch chip according to claim 2, characterized in that: The radio frequency switch chip (3) is fixedly placed in the radio frequency switch chip fixture (4), and the radio frequency switch chip (3) is respectively connected to the drive signal generating module (2), the first single-pole double-throw switch (11), and the second single-pole double-throw switch (12) through the radio frequency switch chip fixture (4).

5. The method for testing a miniaturized test system for the life of a radio frequency switch chip according to any one of claims 1 to 4, characterized in that: The following steps are involved: S101, the driving signal generating module outputs a control signal with a preset voltage and frequency to the RF switch chip to be tested to control the on / off state of the RF switch chip; S102. If the hot switching life of the RF switch chip is to be tested, the RF signal generating module outputs a transmission signal at a preset frequency and power to the RF switch chip to be tested; if the cold switching life of the RF switch chip is to be tested, the DC signal generating module outputs a transmission signal at a preset amplitude to the RF switch chip to be tested; S103, testing the hot switching life is that the RF detection module performs envelope detection on the RF signal passing through the RF switch chip and outputs the envelope signal to the data processing module; The cold switching life test is that the transmission signal of the DC signal generating module passes through the RF switch chip and then through the current limiting protection resistor and then output to the data processing module; S104: Testing the hot switching lifespan involves processing the envelope signal by the data processing module, and testing the cold switching lifespan involves processing the signal of the current limiting protection resistor by the data processing module, testing the hot switching lifespan and the cold switching lifespan of the RF switch chip, and outputting the processed signals and detection calculation results to the host computer; S105. The host computer displays the signal processed by the data processing module in real time, outputs the test results and prints a test report.

6. The method for testing a miniaturized test system for the life of a radio frequency switch chip according to claim 5, characterized in that: The method for driving the signal generating module in S101 to control the on / off state of the RF switch chip includes the following steps: S201, the boost circuit power supply supplies power to the boost circuit; S202, the boost circuit boosts the DC voltage signal output by the boost circuit power supply; S203, inputting the DC voltage signal pumped up by the boost circuit into the drain of the power field effect transistor via the voltage regulating circuit; S204, the power field effect transistor driving circuit power supply supplies power to the power field effect transistor driving circuit; S205, the power field effect tube driving circuit outputs a frequency-adjustable square wave signal to the gate of the power field effect tube; S206 , the voltage regulating circuit outputs a high-voltage square wave signal with adjustable frequency and amplitude, namely, a driving signal for the RF switch chip.

7. The method for testing a miniaturized test system for the life of a radio frequency switch chip according to claim 5, characterized in that: The method for testing the hot switching life of the RF switch chip in S102 is as follows: the high-pass filter circuit filters out the DC signal in the RF signal output by the RF detection module, retains the high-frequency signal, obtains a first filtered signal, and outputs the filtered signal to the data acquisition circuit; the low-pass filter circuit filters out the high-frequency signal in the drive signal output by the drive signal generation module, retains the DC low-frequency signal, obtains a second filtered signal, and outputs the filtered signal to the data acquisition circuit; the data acquisition circuit for real-time signal acquisition is divided into two channels, namely the first channel and the second channel; the first channel acquires the first filtered signal in real time, and the collected analog signal is processed. The voltage signal is converted into a first digital signal, and the digital signal is output to the signal detection and calculation circuit; the second channel collects the second filtered signal in real time, converts the collected analog voltage signal into a second digital signal, and outputs the digital signal to the signal detection and calculation circuit, and the detection and calculation circuit detects and calculates the input first digital signal and the second digital signal. According to the preset parameters of the driving signal and the transmitting signal, when it is detected that the first digital signal and the second digital signal change from a low level to a high level and from a high level to a low level in sequence, it is determined that the RF switch chip has experienced a hot switch, that is, the counter is incremented by one each time the RF switch chip is hot switched.

8. The method for testing a miniaturized test system for the life of a radio frequency switch chip according to claim 5, characterized in that: The method for testing the cold switching life of the RF switch chip in S102 is as follows: a DC low-voltage signal passes through the RF switch chip and then through the current limiting protection resistor and is output to a data acquisition circuit; the high-pass filter circuit is turned off; the low-pass filter circuit filters out the high-frequency signal in the drive signal output by the drive signal generating module, retains the DC low-frequency signal output by the DC signal generating module, obtains a third filtered signal, and outputs the filtered signal to the data acquisition circuit; the data acquisition circuit for real-time signal acquisition is divided into two channels, namely a first channel and a second channel; the first channel real-time acquires the DC low-voltage signal output by the current limiting protection resistor; signal, converts the collected analog voltage signal into a third digital signal, and outputs the digital signal to the signal detection and calculation circuit; the second channel collects the third filtered signal in real time, converts the collected analog voltage signal into a fourth digital signal, and outputs the digital signal to the signal detection and calculation circuit, the detection and calculation circuit detects and calculates the two input digital signals, and according to the parameters of the preset signal, when it is detected that the third digital signal and the fourth digital signal change from a low level to a high level and from a high level to a low level in sequence, it is determined that the RF switch chip has experienced a cold switching, that is, the counter is incremented by one after each cold switching of the RF switch chip.

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