Light-emitting device

Abstract

An object of the present invention is to provide a light-emitting device capable of miniaturizing the size of a wave plate. The light-emitting device includes: one or more light-emitting elements that emit a plurality of lights including a first light and a second light; a package having a placement surface for placing one or more light-emitting elements and a light extraction surface from which the first light and the second light are emitted; a wave plate that is joined to the light extraction surface of the package at a position where a main part of the first light emitted from the light extraction surface is incident and a main part of the second light is not incident; a lens member having an incident surface for the first light that is emitted from the light extraction surface and has passed through the wave plate and the second light that is emitted from the light extraction surface to be incident thereon; one or more adhesion parts that are provided between the package and the lens member and join the package and the lens member; the wave plate is sandwiched between the package and the lens member and is arranged without contacting the lens member.

Description

Technical Field

[0001] The present invention relates to a light-emitting device. Background Art

[0002] A light-emitting device is disclosed in Patent Document 1, which includes a package forming a sealed space, a plurality of semiconductor laser elements disposed in the sealed space, a lens member, and a wave plate that changes the polarization direction of light emitted from at least one of the plurality of semiconductor laser elements. Further, in Patent Document 1, a light-emitting device is illustrated in which light that has passed through the lens member is incident on the wave plate.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2020-43326 Summary of the Invention

[0006] Technical Problem to be Solved by the Invention

[0007] To provide a light-emitting device capable of miniaturizing the size of a wave plate.

[0008] Technical Solution for Solving the Technical Problem

[0009] The disclosed light-emitting device includes: one or more light-emitting elements that emit a variety of lights including first light and second light; a package having a placement surface for disposing the one or more light-emitting elements and a light extraction surface from which the first light and the second light are emitted; a wave plate that is joined to the light extraction surface of the package at a position where a main part of the first light emitted from the light extraction surface is incident and a main part of the second light is not incident; a lens member having an incident surface for the first light that is emitted from the light extraction surface and has passed through the wave plate and the second light that is emitted from the light extraction surface; one or more adhesion parts that are provided between the package and the lens member and join the package and the lens member; the wave plate is sandwiched between the package and the lens member and is disposed without contacting the lens member.

[0010] Effects of the Invention

[0011] According to the present invention, since the light emitted from the light-emitting element passes through the wave plate before passing through the lens member, the size of the wave plate can be reduced. Brief Description of the Drawings

[0012] Figure 1 It is a perspective view of the light-emitting device of the embodiment.

[0013] Figure 2Is a perspective view of the package of the embodiment.

[0014] Figure 3 Is a perspective view after removing the cover member from the package of the embodiment.

[0015] Figure 4 Is a perspective view of the package of the embodiment with a wave plate provided.

[0016] Figure 5 Is a top view of the light-emitting device of the embodiment.

[0017] Figure 6 Is a top view of the light-emitting device with the lens member not joined in the embodiment.

[0018] Figure 7 Is a top view after removing the cover member from the package of the embodiment.

[0019] Figure 8 Is Figure 5 A cross-sectional view of the light-emitting device taken along line VIII-VIII of

[0020] Explanation of reference numerals

[0021] 1 Light-emitting device; 10 Package; 11A Top surface; 11B Bottom surface; 11C Outer side surface; 11D Arrangement surface; 12A Substrate member; 12B Heat dissipation member; 12C Wiring member; 12D Wiring area; 12E Cover member; 13A Upper part; 13B Lower part; 13C Side part; 20 Light-emitting element; 21 First light-emitting element; 22 Second light-emitting element; 23 Third light-emitting element; 30 Base; 40 Reflection member; 50 Protection element; 60 Wave plate; 70 Lens member; 70A Lens surface; 70B Top surface; 70C Bottom surface; 75A Lens part; 75B Non-lens part; 80 Adhesive part; 81 First adhesive part; 82 Second adhesive part. Detailed description of the embodiment

[0022] In the specification or claims, polygons such as triangles or quadrilaterals include shapes obtained by performing operations such as rounding the corners of the polygon, chamfering at 45°, chamfering at non-45°, and rounding. In addition, not limited to the corners (ends of the sides), shapes obtained by performing operations on the middle part of the sides are also referred to as polygons. That is, shapes that have a polygon as the base and have undergone partial processing are also covered by the interpretation of "polygon" described in this specification and the claims.

[0023] Moreover, not limited to polygons, the same applies to terms representing specific shapes such as trapezoids, circles, or concavities and convexities. The same also applies to each side forming the shape. That is, on a certain side, even if the diagonal or the middle part is processed, the processed part is included in the interpretation of "side". It should be noted that when distinguishing between an unprocessed "polygon" or "side" and a processed shape, "strict" is marked. For example, it is described as "strict quadrilateral", etc.

[0024] Moreover, in this specification or claims, descriptions such as up and down, left and right, inside and outside, front and back, near and far, and depth are only for describing relative positional, orientational, directional, etc. relationships, and may also be inconsistent with the relationships during use.

[0025] Moreover, in this specification, for example, when explaining components, etc., there are descriptions of "component" or "part". A "component" refers to an object physically regarded as a single entity. An object physically regarded as a single entity may also be an object regarded as a single part in the manufacturing process. On the other hand, a "part" refers to an object that may not be physically regarded as a single entity. For example, "part" is used when partially grasping a part of a component.

[0026] It should be noted that the above description difference between "component" and "part" is not an intentional indication for limiting the scope of rights in the interpretation of the doctrine of equivalents. That is, even if there is a component described as "component" in the claims, based on this description alone, it does not indicate that the applicant believes that physically regarding the component as a single entity is indispensable for the application of the present invention.

[0027] Moreover, in this specification or claims, when there are multiple of a certain component and they are distinguished and expressed respectively, there are cases where "first", "second", etc. are marked at the beginning of the component for distinction. And there may be cases where the objects of distinction in the specification and claims are different. Therefore, even if there is a component in the claims marked in the same way as in the specification, the object determined by the component may be inconsistent between the specification and the claims.

[0028] For example, in this specification, there are constituent elements distinguished by labels such as "first", "second", and "third". When recording the constituent elements labeled "first" and "third" in this specification in the claims, there may be a case where the constituent elements are distinguished by labeling "first" and "second" in the claims for the sake of readability. In this case, the constituent elements labeled "first" and "second" in the claims respectively refer to the constituent elements labeled "first" and "third" in this specification. It should be noted that the application object of this rule is not limited to constituent elements, and for other objects, it is also possible to make reasonable and flexible correspondences.

[0029] The embodiments of the present invention will be described below. Further, with reference to the accompanying drawings, the specific embodiments of the present invention will be described. Among them, the embodiments of the present invention are not limited to this specific embodiment. That is, the illustrated embodiment is not the only way to implement the present invention. In addition, there are cases where the size or positional relationship of the components shown in each drawing is exaggerated for ease of understanding.

[0030] <Embodiment>

[0031] The light-emitting device 1 of the embodiment will be described. Figures 1 to 8 This is a diagram for explaining an exemplary solution of the light-emitting device 1. Figure 1 This is a perspective view of the light-emitting device 1. Figure 2 This is a perspective view of the package 10 in the light-emitting device 1. Figure 3 This is a perspective view of the state where the cover member 12E is removed from the package 10. Figure 4 This is a perspective view of the state where the wave plate 60 is provided in the package 10. Figure 5 This is a top view of the light-emitting device 1. Figure 6 This is a top view of the light-emitting device 1 without the lens member 70 being joined. Figure 7 This is the same as Figure 3 This is a top view of the same state. Figure 8 This is Figure 5 This is a cross-sectional view taken along the VIII-VIII section line of

[0032] It should be noted that, in Figure 5 the region shaded with hatching represents the second adhesive portion 82. And the overlapping portion of the wave plate 60 and the lens member of the first adhesive portion 81 is shown by a dotted line. In Figure 6 the dotted line drawn represents the outer edge of the internal space of the package 10.

[0033] The light-emitting device 1 includes a plurality of constituent elements. The plurality of constituent elements include a package 10, one or more light-emitting elements 20, one or more bases 30, one or more reflection members 40, a protection element 50, a wave plate 60, a lens member 70, and an adhesive portion 80.

[0034] It should be noted that the light-emitting device 1 may include other components. For example, the light-emitting device 1 may further include a light-emitting element such as a light-emitting diode or a semiconductor laser element. Also, the light-emitting device 1 may not include a part of the components listed here.

[0035] First, each component of the light-emitting device 1 will be described.

[0036] (Encapsulation body 10)

[0037] The encapsulation body 10 has a top surface 11A, a bottom surface 11B, and one or more outer side surfaces 11C. The shape of the encapsulation body 10 is a cuboid. The top surface 11A, the bottom surface 11B, and one or more outer side surfaces 11C respectively form a part of the outer shape of the cuboid. The encapsulation body 10 has a rectangular outer shape in which the opposite sides in one direction are longer than the opposite sides in the other direction when viewed from above. In other words, it has a rectangular outer shape with the opposite sides in one direction as the long sides and the opposite sides in the other direction as the short sides. It should be noted that the shape of the encapsulation body 10 may not be a cuboid.

[0038] A space is formed inside the encapsulation body 10. This internal space is sealed, and there is actually no inflow or outflow of gas inside and outside. Additionally, this internal space may also be hermetically sealed.

[0039] Based on the internal space of the encapsulation body 10, the encapsulation body 10 has an upper part 13A, a lower part 13B, and a side part 13C. The upper part 13A includes the top surface 11A, the lower part 13B includes the bottom surface 11B, and the side part 13C includes one or more outer side surfaces 11C. Among them, the upper part 13A, the lower part 13B, and the side part 13C are referred to as orientation parts. That is, the upper part 13A, the lower part 13B, and the side part 13C can all be orientation parts. The so-called orientation part refers to a part of the encapsulation body 10 that is in a specific orientation such as up, down, left, or right based on the internal space.

[0040] The internal space of the encapsulation body 10 is delimited by multiple surfaces. These multiple surfaces include the bottom surface of the upper part 13A, the top surface of the lower part 13B, and one or more inner side surfaces of the side part 13C. And these multiple surfaces include a placement surface 11D on which other components are placed. For example, the top surface of the lower part 13B can be used as the placement surface 11D. It should be noted that the placement surface 11D can also be other surfaces.

[0041] The encapsulation body 10 has a light-transmitting part. The light-transmitting part is a part with high light transmittance. Among them, having high light transmittance means that the light transmittance for light is 80% or more. In addition, it may not have a light transmittance of 80% or more for all wavelengths of light. Any one of the orientation parts of the upper part 13A, the lower part 13B, or the side part 13C can be used as the light-transmitting part.

[0042] The package body 10 has a light-shielding portion. The light-shielding portion is a portion with high light-shielding property. Here, having a high light-shielding property means that the light transmittance is 10% or less. The orientation portion that is not the light-transmitting portion can be used as the light-shielding portion.

[0043] The orientation portion of the package body 10 including the placement surface 11D is the light-shielding portion. The orientation portion of the package body 10 including the surface opposite to the placement surface 11D is the light-transmitting portion. For example, the lower portion 13B of the package body 10 is the light-shielding portion, and the upper portion 13A of the package body 10 is the light-transmitting portion.

[0044] The package body 10 has a base member 12A and a lid member 12E. By joining the lid member 12E to the base member 12A, the package body 10 with an internal space is formed. Part or all of one or more surfaces of the base member 12A that define the internal space have high light-shielding property. Part or all of one or more surfaces of the lid member 12E that define the internal space have high light-transmitting property.

[0045] The base member 12A has a lower portion 13B. The base member 12A further has a side portion 13C. The lid member 12E has an upper portion 13A. The lid member 12E may have a side portion 13C. When viewed from above, the outer shape of the base member 12A is rectangular. When viewed from above, the outer shape of the placement surface 11D is rectangular. In addition, the outer shapes of the base member 12A and the placement surface 11D may not be rectangular.

[0046] The package body 10 may be composed of a concave base member 12A and a flat lid member 12E. The concave recess portion of the base member 12A is blocked by the lid member 12E. It should be noted that the shapes of the base member 12A and the lid member 12E are not limited to this. For example, the package body 10 may be composed of a flat base member 12A and a cap-shaped lid member 12E.

[0047] The base member 12A may be formed by joining a heat dissipation member 12B constituting a heat dissipation portion and a wiring member 12C constituting a wiring portion. The heat dissipation member 12B includes the lower portion 13B of the base member 12A, and the wiring member 12C includes the side portion 13C of the base member 12A. The base member 12A may be composed of a flat heat dissipation member 12B and a frame-shaped wiring member 12C.

[0048] The wiring member 12C has a plurality of wiring regions 12D on its surface. In the wiring member 12C, a current path is formed to electrically connect two wiring regions through its interior. The wiring region 12D can be electrically connected to a wiring region other than the wiring region 12D. In the heat dissipation member 12B, no current path passing through its interior is formed. When viewed from above and below, the heat dissipation member 12B is surrounded by the wiring member 12C.

[0049] The heat dissipation component 12B can be formed mainly of metal. Here, the main material refers to the material that accounts for the largest proportion by weight or volume in the formation being targeted. Additionally, in the case where the formation being targeted is formed of one material, that material is the main material. In other words, the case where a certain material is the main material can include the case where the proportion of that material is 100%. As the metal used in the main material, for example, copper, aluminum, iron, etc. can be used, or as composites, molybdenum-copper alloy, copper-diamond composite material, tungsten-copper alloy, etc. can be used.

[0050] The wiring component 12C can be formed using ceramic as the main material. And the wiring area 12D can be formed by depositing a metal film. As the ceramic used in the main material of the wiring component 12C, for example, aluminum nitride, silicon nitride, alumina, silicon carbide, etc. can be cited.

[0051] The base component 12A can be formed only by the wiring component 12C. For example, the entire illustrated base component 12A can be formed using the wiring component 12C mainly composed of ceramic.

[0052] The cover component 12E is formed using glass as the main material. The main material forming the cover component 12E is a material with high light transmittance. The cover component 12E is not limited to glass. For example, it can also be formed using sapphire as the main material.

[0053] (Light-emitting element 20)

[0054] The light-emitting element 20 has a light-emitting surface for emitting light. The light-emitting element 20 emits light from one or more emission points on the light-emitting surface. As an example of the light-emitting element 20, a semiconductor laser element can be cited. It should be noted that it is not limited to a semiconductor laser element. The light-emitting element can be, for example, a light-emitting element that emits p-polarized light from the light-emitting surface or a light-emitting element that emits s-polarized light from the light-emitting surface.

[0055] The light-emitting element 20 can be, for example, a light-emitting element that emits blue light, a light-emitting element that emits green light, or a light-emitting element that emits red light. It should be noted that the light-emitting element 20 can also be a light-emitting element that emits light of other colors.

[0056] Here, blue light refers to light whose emission peak wavelength is in the range of 420 nm to 494 nm. Green light refers to light whose emission peak wavelength is in the range of 495 nm to 570 nm. Red light refers to light whose emission peak wavelength is in the range of 605 nm to 750 nm.

[0057] Here, a semiconductor laser element that can be used for the light-emitting element 20 will be described. When viewed from above, the semiconductor laser element has a rectangular outer shape with the opposite sides in one direction being the long sides and the opposite sides in the other direction being the short sides. The semiconductor laser element is formed by laminating a plurality of semiconductor layers including an active layer in the direction from the bottom surface to the top surface. One of the sides including one of the two short sides of the rectangle becomes the light-emitting end face from which light is emitted. Here, the light-emitting end face of the semiconductor laser element may also be the light-emitting surface of the light-emitting element 20. The top surface area and the bottom surface area of the semiconductor laser element are larger than the area of the light-emitting end face.

[0058] The light (laser) emitted from the semiconductor laser element is diffused. The diverging light is emitted from the light-emitting surface of the semiconductor laser element. On a plane parallel to the light-emitting end face of the semiconductor laser element, the light emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP"). The FFP is the shape or light intensity distribution of the emitted light at a position far from the light-emitting end face.

[0059] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the light intensity distribution of the FFP, is called the light propagating along the optical axis or the light passing through the optical axis. And, in the light intensity distribution of the FFP, the light with an intensity value of 1 / e 2 or more of the peak intensity value is called the light of the main part.

[0060] The shape of the FFP of the light emitted from the semiconductor laser element is an elliptical shape in which the stacking direction of the semiconductor laser element is longer than the direction perpendicular to the stacking direction. The direction perpendicular to the stacking direction may also be referred to as the plane direction of the plurality of semiconductor layers including the active layer. And, the major axis direction of the elliptical shape of the FFP is called the fast axis direction of the semiconductor laser element, and the minor axis direction is called the slow axis direction of the semiconductor laser element.

[0061] Here, based on the light intensity distribution of the FFP of the light emitted from the semiconductor laser element, the angle by which the light with an intensity of 1 / e 2 of the peak light intensity is diffused is the diffusion angle of the light of the semiconductor laser element. The diffusion angle of the light can be obtained, for example, by the light intensity at half the peak of the peak light intensity in addition to the light intensity of 1 / e 2 of the peak light intensity. In the description of this specification, when only referred to as the "diffusion angle of the light", it means the diffusion angle of the light at the light intensity of 1 / e 2 of the peak light intensity.

[0062] As a semiconductor laser element that emits blue light or a semiconductor laser element that emits green light, semiconductor laser elements including nitride semiconductors can be cited. As the nitride semiconductor, for example, GaN, InGaN, and AlGaN can be used. As a semiconductor laser element that emits red light, semiconductors including InAlGaP-based, GaInP-based, GaAs-based, or AlGaAs-based can be cited.

[0063] (Base 30)

[0064] The base 30 has two joint surfaces and is formed in a rectangular parallelepiped shape. When viewed from above, the base 30 has a rectangular outer shape in which the opposite sides in one direction are longer than those in the other direction. The surface on the opposite side of one joint surface is the other joint surface. The distance between the two joint surfaces is smaller than the distance between the other two opposite surfaces. The shape of the base 30 is not limited to a rectangular parallelepiped. The base 30 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide.

[0065] (Reflection member 40)

[0066] The reflection member 40 has a light reflection surface that reflects light. And, the light reflection surface is inclined with respect to the bottom surface of the reflection member 40. The light reflection surface is neither perpendicular nor parallel to the bottom surface of the reflection member 40. The straight line connecting the lower end and the upper end of the light reflection surface is inclined with respect to the bottom surface of the reflection member 40. The angle of the light reflection surface with respect to the bottom surface or the angle of the straight line connecting the lower end and the upper end of the light reflection surface with respect to the bottom surface is called the inclination angle of the light reflection surface.

[0067] In the illustrated reflection member 40, the light reflection surface is a plane and has an inclination angle of 45 degrees with respect to the bottom surface of the reflection member 40. It should be noted that the light reflection surface may not be a plane. For example, it may be a curved surface. And, the inclination angle of the light reflection surface may not be 45 degrees.

[0068] The reflection member 40 has a rectangular outer shape when viewed from above. The light reflection surface has a rectangular outer shape when viewed from above. When viewed from above, the light reflection surface occupies more than 70% of the area of the reflection member 40.

[0069] The reflection member 40 can use glass or metal as the main material. The main material is preferably a material with strong heat resistance. For example, glass such as quartz or BK7 (borosilicate glass), or metal such as aluminum can be used. In addition, the reflection member 40 can be formed using Si as the main material. If the main material is a reflective material, the light reflection surface can be formed by the main material. If a material different from the main material is used to form the light reflection surface, for example, the light reflection surface can be formed by the deposition of a metal film such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0070] For a light reflecting surface, the reflectance with respect to the peak wavelength of the light irradiated on the light reflecting surface is 90% or more. Further, the reflectance may be 95% or more. Here, the reflectance is 100% or less or less than 100%.

[0071] (Protection element 50)

[0072] The protection element 50 is an element for preventing an excessive current from flowing into a specific element (for example, the light emitting element 20) and damaging it. As the protection element 50, for example, a Zener diode can be cited. Further, as the Zener diode, a Zener diode formed of Si can be adopted.

[0073] (Wave plate 60)

[0074] The wave plate 60 changes the polarization state of the emitted light with respect to the incident light. In the wave plate 60, for example, there are a 1 / 2 wave plate that rotates the polarization direction of linearly polarized light or a 1 / 4 wave plate that converts linearly polarized light into circularly polarized light. The wave plate 60 can adopt, for example, a 1 / 2 wave plate.

[0075] The wave plate 60 is formed in a flat plate shape. Further, the shape of the wave plate 60 observed in a plan view is a rectangle. It should be noted that it may not be a rectangle. For example, it may be a shape that is longer in one direction than the other, such as an ellipse. The direction of the straight line that becomes the maximum length in a plan view is the length direction of the wave plate 60, and the direction perpendicular to the length direction in a plan view is the width direction of the wave plate 60. In the example of a rectangular shape, the long side direction is the length direction, and the short side direction is the width direction.

[0076] The thickness of the wave plate 60 is 100 μm or more and 400 μm or less. Here, the thickness refers to the thickness in the up and down direction. The maximum length in the length direction and the maximum width in the width direction of the wave plate 60 are both larger than the thickness of the wave plate 60.

[0077] (Lens unit 70)

[0078] The lens unit 70 has a top surface 70B, a bottom surface 70C, side surfaces, and one or more lens surfaces 70A.

[0079] One or more lens surfaces 70A are provided on the top surface 70B side. Further, they may also be provided on the bottom surface 70C side. The top surface 70B and the bottom surface 70C are flat surfaces. One or more lens surfaces 70A intersect with the top surface 70B. One or more lens surfaces 70A are surrounded by the top surface 70B in a plan view. In a plan view, the lens unit 70 has a rectangular outer shape. The bottom surface of the lens unit 70 is rectangular.

[0080] Here, in the lens member 70, the portion that overlaps with one or more lens surfaces 70A in a plan view is the lens portion 75A. In the lens member 70, the portion that overlaps with the top surface 70B in a plan view is the non-lens portion 75B. When the lens portion 75A is bisected by an imaginary plane including the top surface 70B, the side of the lens surface 70A is the lens-shaped portion, and the side of the bottom surface 70C is the flat-plate-shaped portion. The bottom surface of the lens portion 75A is a part of the bottom surface 70C. In the lens member 70, the bottom surface 70C is composed of the bottom surface of the lens portion 75A and the bottom surface of the non-lens portion 75B.

[0081] The illustrated lens member 70 has a plurality of lens surfaces 70A. Moreover, the plurality of lens surfaces 70A are formed continuously in one direction. The lens member 70 has three lens surfaces 70A and is formed such that the vertices of the three lens surfaces 70A are arranged on a straight line.

[0082] Here, in a plan view, the arrangement direction of the plurality of lens surfaces 70A is the connection direction. In a plan view, the length ratio of the connection direction of the plurality of lens surfaces 70A is larger than the length in the direction perpendicular to this direction. It should be noted that, in a plan view, the length of the connection direction of the plurality of lens surfaces 70A may also be smaller than the length in the direction perpendicular to this direction. In the illustrated lens member 70, in the case of observing through the plurality of lens surfaces 70A composed of three lens surfaces 70A, the former size relationship is satisfied, and in the case of observing through the plurality of lens surfaces 70A composed of two lens surfaces 70A, the latter size relationship is satisfied.

[0083] The lens member 70 has high light transmittance. The lens member 70 has high light transmittance both in the lens portion 75A and the non-lens portion 75B. Moreover, the lens member 70 has high light transmittance as a whole. The lens member 70 can be formed using glass such as BK7, for example.

[0084] (Adhesive portion 80)

[0085] The adhesive portion 80 is the adhesive in a solidified state after the bonding process. As the adhesive of the adhesive portion 80, an adhesive containing resin can be used. Such adhesives include, for example, ultraviolet curable resin and thermosetting resin. The adhesive can be applied at multiple positions. Therefore, a plurality of adhesive portions 80 can be formed by the bonding process. The adhesive used for the bonding process is not limited to one type. For example, a plurality of adhesives are applied at different positions.

[0086] (Light-emitting device 1)

[0087] Next, the light-emitting device 1 including the above-described respective components will be described.

[0088] One or more light-emitting elements 20 included in the light-emitting device 1 may be composed of a plurality of light-emitting elements 20 including a first light-emitting element 21 that emits first light and a second light-emitting element 22 that emits second light. Further, one or more light-emitting elements 20 may be composed of a plurality of light-emitting elements 20 further including a third light-emitting element 23 that emits third light.

[0089] One or more light-emitting elements 20 are disposed in the internal space of the package 10. One or more light-emitting elements 20 are disposed on the disposed surface 11D. By disposing the light-emitting elements 20 in the hermetically sealed internal space, deterioration in quality due to dust collection of the light-emitting elements 20 can be suppressed.

[0090] One or more light-emitting elements 20 are each disposed such that its light-emitting surface faces laterally. One or more light-emitting elements 20 are each disposed such that its light-emitting surface faces one inner side surface of the package 10. Hereinafter, the inner side surface opposite to the light-emitting surface of the light-emitting element 20 is referred to as the inner side surface on the light-emitting side. One or more light-emitting elements 20 are each disposed such that its light-emitting surface faces the side portion 13C associated with the long side of the package 10.

[0091] The light-emitting surface faces the side portion 13C associated with one of the pair of long sides of the package 10, and the surface on the side opposite to the light-emitting surface faces the side portion 13C associated with the other long side. The two side surfaces of the light-emitting element 20 that intersect the light-emitting surface are disposed in a manner associated with the side portions 13C of the pair of short sides of the package 10.

[0092] In a plan view, one or more light-emitting elements 20 include at least one light-emitting element 20 whose light-emitting surface is parallel to the long side of the package 10. One or more light-emitting elements 20 include at least one light-emitting element 20 whose light-emitting surface is perpendicular to the disposed surface 11D. One or more light-emitting elements 20 include at least one light-emitting element 20 that satisfies both of these conditions.

[0093] The plurality of light-emitting elements 20 are arranged and disposed such that their respective light-emitting surfaces face the same direction. It should be noted that the same direction here includes the case where the rotational offset of the light-emitting surfaces of adjacent light-emitting elements 20 in a plane parallel to the disposed surface 11D in a plan view is within the range of ±10 degrees. In a plan view, the plurality of light-emitting elements 20 are arranged and disposed in the length direction or the long side direction of the package 10. Adjacent light-emitting elements 20 are disposed with a distance of 0.2 mm or more and 2 mm or less.

[0094] In a plan view, the maximum length of the length in the long side direction of one or more light-emitting elements 20 is 30% or more and 70% or less of the length of the disposed surface 11D in the direction parallel to the long side direction. By satisfying this condition, it contributes to miniaturization of the size of the package 10.

[0095] In one of the regions obtained by equally dividing the arrangement plane 11D by a straight line perpendicular to the light-emitting surface, a light-emitting element 20 at one end among the two ends of a plurality of light-emitting elements 20 arranged side by side is arranged, and in the other region, a light-emitting element 20 at the other end is arranged. In each region obtained by equally dividing the arrangement plane 11D by the number of arranged light-emitting elements 20 with a straight line perpendicular to the light-emitting surface, one light-emitting element 20 is arranged. By arranging in this way, a plurality of light-emitting elements 20 can be efficiently arranged on the arrangement plane 11D.

[0096] The light-emitting surfaces of the plurality of light-emitting elements 20 can be arranged on one plane. That is, the plurality of light-emitting elements 20 are arranged with their light-emitting surfaces aligned. A straight line parallel to the light-emitting surface, that is, a straight line that equally divides the area of the package 10 in a plan view, passes through the plurality of light-emitting elements 20 in a plan view.

[0097] One or more light-emitting elements 20 emit a plurality of types of light. In other words, it can be said that one or more light-emitting elements 20 emit a plurality of types of light. The plurality of types of light are emitted from one or more light-emitting surfaces of one or more light-emitting elements 20. The plurality of types of light enter laterally from one or more light-emitting surfaces. The plurality of types of light are emitted from different emission points respectively. The plurality of types of light can be configured to include red light, green light, and blue light.

[0098] The optical axes of the plurality of types of light emitted from one or more light-emitting surfaces are parallel to each other. The light of the FFP with the direction perpendicular to the arrangement plane 11D as the fast axis direction is emitted laterally from the light-emitting surface. The diffusion angle in the slow axis direction of each light-emitting element 20 is 20 degrees or less. It should be noted that the diffusion angle is an angle greater than 0 degrees.

[0099] The plurality of types of light include two types of light with different polarization directions. The plurality of types of light include p-polarized light and s-polarized light. Light with a polarization direction of either p-polarized light or s-polarized light is emitted from the light-emitting surface of the first light-emitting element 21, and light with the other polarization direction is emitted from the light-emitting surface of the second light-emitting element 22. The plurality of types of light include two types of light with different emission peak wavelengths. The plurality of types of light include two types of light with different emission colors and polarization directions. The plurality of types of light include at least blue or red light.

[0100] Among the plurality of light-emitting elements 20, the light-emitting element 20 with the largest decrease in light amount accompanying temperature rise is arranged at one end. And the light-emitting element 20 with the second largest decrease in light amount accompanying temperature rise can be arranged at the other end. By arranging in this way, compared with the case where a light-emitting element 20 that is sandwiched between two light-emitting elements 20 and has a larger decrease in light amount accompanying temperature rise than these light-emitting elements 20 is arranged, the heat dissipation performance with respect to the light-emitting element 20 with a large decrease in light amount accompanying temperature rise can be further improved.

[0101] The illustrated light-emitting device 1 is an example of a light-emitting device 1 in which one or more light-emitting elements 20 are constituted by three light-emitting elements 20. Each light-emitting element 20 is a semiconductor laser element. The three light-emitting elements 20 are constituted by a first light-emitting element 21 that emits red light, a second light-emitting element 22 that emits green light, and a third light-emitting element 23 that emits blue light. The second light-emitting element 22 is arranged and disposed so as to be located between the first light-emitting element 21 and the third light-emitting element 23. The first light-emitting element 21 emits s-polarized light from the light-emitting surface, and the second light-emitting element 22 and the third light-emitting element 23 emit p-polarized light from the light-emitting surface. The first light-emitting element 21 corresponds to the light-emitting element 20 with the worst temperature characteristic of the light quantity.

[0102] One or more light-emitting elements 20 are joined to one or more bases 30. The base 30 joins the light-emitting element 20 on one joining surface and is joined to the arrangement surface 11D on the other joining surface. In this way, the light-emitting element 20 can be arranged on the arrangement surface 11D via the base 30.

[0103] The base 30 and the light-emitting element 20 are provided one-to-one. That is, the same number of bases 30 as the number of light-emitting elements 20 are arranged. It should be noted that multiple light-emitting elements 20 can be arranged on one base 30.

[0104] When viewed from above, the multiple bases 30 include two or more bases 30 having different sizes from each other. Among the two bases 30 having different sizes, the base 30 with a larger area joins the first light-emitting element 21. Therefore, the heat dissipation property with respect to the first light-emitting element 21 can be improved.

[0105] One or more reflection members 40 are arranged in the internal space of the package 10. One or more reflection members 40 are arranged on the arrangement surface 11D. One or more reflection members 40 have one or more light-reflecting surfaces. Multiple kinds of light are reflected by the one or more light-reflecting surfaces. The light-reflecting surface is inclined at an angle of 45 degrees with respect to the propagation direction of the light passing through the optical axis. The multiple kinds of reflected light advance upward from the one or more light-reflecting surfaces. The main part of the multiple kinds of light is irradiated on the one or more light-reflecting surfaces.

[0106] The reflection member 40 and the light-emitting element 20 are provided one-to-one. That is, the same number of reflection members 40 as the number of light-emitting elements 20 are arranged. The size and shape of each reflection member 40 are the same. The main part of the light from one light-emitting element 20 is irradiated on the light-reflecting surface of one reflection member 40. In addition, the main part of the light from multiple light-emitting elements 20 can also be irradiated on the light-reflecting surface of one reflection member 40.

[0107] When viewed from above, the length of the reflection member 40 in the direction parallel to the long side of the corresponding light-emitting element 20 is 15% or more and 40% or less of the length of the arrangement surface 11D in the direction parallel to the long side direction. By satisfying this condition, it contributes to the miniaturization of the size of the package 10.

[0108] When viewed from above, the sum of the maximum length of the length in the long side direction of one or more light-emitting elements 20 and the length of the reflection member corresponding to the light-emitting element 20 having the maximum length in the direction parallel to the long side direction is 65% or more and 95% or less of the length of the arrangement surface 11D in the direction parallel to the long side direction. By satisfying this condition, it contributes to the miniaturization of the size of the package 10.

[0109] The light reflection surface of the reflection member 40 reflects 90% or more of the main part of the irradiated light. In addition, the light-emitting device 1 may not have the reflection member 40. In this case, for example, the light-emitting end surface of the light-emitting element 20 faces the top surface.

[0110] When viewed from above, the plurality of reflection members 40 are arranged in the long side direction of the package 10. The irradiation points of the light of the plurality of optical axes on the light reflection surface are located on a straight line when viewed from above. This straight line is parallel to the long side direction of the package 10. The optical axes of the various lights reflected by one or more light reflection surfaces are parallel to each other.

[0111] In the example of the illustrated light-emitting device 1, when viewed from above, with respect to the length in the direction parallel to the light-emitting surface, the base 30 to which the first light-emitting element 21 is joined is larger than the reflection member 40 corresponding to the first light-emitting element 21. In addition, with respect to the length in the direction parallel to the light-emitting surface, the base 30 to which the second light-emitting element 22 or the third light-emitting element 23 is joined is smaller than the reflection member 40 corresponding to the second light-emitting element 22 or the third light-emitting element 23. Furthermore, the lengths of the three reflection members in the direction parallel to the light-emitting surface are the same. By satisfying such conditions, both heat dissipation can be taken into account and the miniaturization of the light-emitting device 1 can be achieved.

[0112] One or more protection elements 50 are arranged in the internal space of the package 10. One or more protection elements 50 are arranged where the wiring component 12C is arranged. One or more protection elements 50 are electrically connected to the wiring area 12D.

[0113] The protection elements 50 are provided one-to-one with the light-emitting elements 20. The protection elements 50 are provided to protect the corresponding light-emitting elements 20. One or more protection elements 50 are arranged outside the corresponding light-emitting elements 20 when viewed from above.

[0114] In the example of the illustrated light-emitting device 1, a plurality of protection elements 50 are provided. Two protection elements 50 corresponding to the first light-emitting element 21 and the third light-emitting element 23 are arranged at the side portion 13C related to a pair of short sides of the package 10. A protection element 50 corresponding to the second light-emitting element 22 is arranged at the side portion 13C related to the long side of the package 10, that is, the side portion 13C on the side opposite to the light-emitting side. By arranging in this way, the corresponding protection elements 50 can be arranged at positions close to the respective light-emitting elements 20.

[0115] Multiple kinds of light are emitted to the outside of the package 10 through the light-transmitting portion. Multiple kinds of light reflected by one or more reflection members 40 are emitted from the light extraction surface. More than 90% of the main part of the light emitted from the light-emitting element 20 is emitted to the outside from the light extraction surface of the package 10. The multiple kinds of light emitted to the outside of the package 10 include two kinds of light with different polarization directions in the light extraction surface of the package 10. In the light extraction surface of the package 10 where multiple kinds of light are emitted, the main parts of the multiple kinds of light do not overlap with each other.

[0116] In the illustrated light-emitting device 1, multiple kinds of light are emitted to the outside of the package 10 through the upper portion 13A of the package 10. That is, the top surface of the upper portion 13A becomes the light extraction surface of the package 10. In the light extraction surface of the package 10 where multiple kinds of light are emitted, the slow axis directions of the multiple kinds of light are the same, and the fast axis directions are also the same. The slow axis direction of the light extraction surface of the package 10 is the same as the long side direction of the package 10. The passing points of the light passing through the light extraction surface of the package 10 along multiple optical axes are located on a straight line in a top view. This straight line is parallel to the long side direction of the package 10. In the light extraction surface of the package 10, the polarization directions of the first light and the second light are different from each other. In the light extraction surface of the package 10, the polarization directions of the second light and the third light are the same as each other.

[0117] It should be noted that the polarization directions being the same as each other means a state where the polarization directions can actually be aligned. And the polarization directions being different from each other means a state where the polarization directions are different to such an extent that they cannot be said to be consistent. For example, in the illustrated light-emitting device 1, the relative angular difference between the polarization directions of the second light and the third light is within 10 degrees, which becomes a condition indicating a state where the polarization directions are actually aligned.

[0118] The wave plate 60 is arranged on the light extraction surface of the package 10. The wave plate 60 is joined to the light extraction surface of the package 10. The wave plate 60 is arranged such that the thickness direction thereof is perpendicular to the light extraction surface of the package 10. The wave plate 60 is joined to the top surface of the cover member 12E. The wave plate 60 is joined to the package 10 through an adhesive. Through this joining process, an adhesive portion 80 in contact with the wave plate 60 and the package 10 is formed.

[0119] The light emitted from the light extraction surface of the package 10 is incident on the surface of the wave plate 60 facing the light extraction surface of the package 10. The light incident on the incident surface of the wave plate 60 exits from the exit surface on the opposite side of the incident surface. In addition, the main part of at least one or more types of light is not incident on the wave plate 60. The wave plate 60 is disposed at a position where the main part of the first light emitted from the light extraction surface of the package 10 is incident and the main part of the second light is not incident. The light passing through the wave plate 60 has the same polarization direction as the light emitted from the light extraction surface of the package 10 without passing through the wave plate 60 and exits from the wave plate 60.

[0120] The wave plate 60 is disposed such that the main part of one or more types of light passes through the wave plate 60. The wave plate 60 is disposed such that the main part of the light of one color passes through the wave plate 60. The wave plate 60 is provided corresponding to one or more specific light emitting elements 20 among one or more light emitting elements 20. The one or more specific light emitting elements 20 are composed of light emitting elements 20 that are less than half the number of light emitting elements 20 included in the light emitting device 1.

[0121] When viewed from above, the wave plate 60 is disposed at a position where a virtual line passing through the midpoint of the long side of the package 10 and parallel to the short side direction does not pass. The wave plate 60 is provided corresponding to the light emitting element 20 disposed at the end. Thus, considering heat dissipation, the polarization direction of the light emitting element 20 disposed at the end can be changed. The wave plate 60 is disposed such that the main part of the light emitted from one light emitting element 20 passes through the wave plate 60.

[0122] In a plan view parallel to the light extraction surface of the package 10, the wave plate 60 is disposed at a position overlapping with the light emitting element 20 that emits the main part of the light passing through the wave plate 60. The wave plate 60 is disposed such that its length direction matches the major axis direction of the FFP of the light incident on the wave plate 60.

[0123] Among two adjacent light emitting elements 20 that emit light with different polarization directions, the main part of the light emitted from one light emitting element 20 is incident on the wave plate 60, and the main part of the light emitted from the other light emitting element 20 is not incident on the wave plate 60. When viewed from above parallel to the light extraction surface of the package 10, the wave plate 6 is disposed at a position overlapping with only one light emitting element 20 among the plurality of light emitting elements 20.

[0124] When viewed from above parallel to the light extraction surface of the package 10, the wave plate 60 is disposed at a position overlapping with the reflection member 40 that reflects the main part of the light passing through the wave plate 60. When viewed from above parallel to the light extraction surface of the package 10, the wave plate 60 is disposed at a position overlapping with only one reflection member 40 among the plurality of reflection members 40.

[0125] When viewed from above, one end of the two ends in the length direction of the wave plate 60 overlaps with the side portion 13C of the package body 10, and the other end does not overlap. When viewed from above, the midpoints of the two ends in the length direction of the wave plate 60 coincide with the reflection member 40. By adopting the shape of the wave plate 60 that satisfies at least any one condition, the size of the wave plate 60 can be suppressed.

[0126] The adhesive portion 80 that bonds the wave plate 60 is in contact with a partial area of the bottom surface of the wave plate 60. In addition, the adhesive may be provided in such a manner that the adhesive portion 80 is in contact with the entire bottom surface of the wave plate 60. One or more adhesive portions 80 that bond the wave plate 60 are formed on the light extraction surface of the package body 10. In the illustrated light-emitting device 1, the adhesive portions 80 that bond the wave plate 60 are respectively formed at one place in each of the two end portions in the length direction of the wave plate 60.

[0127] Regarding the length direction of the wave plate 60, the total length of the regions where the adhesive portions 80 at the two end portions are respectively in contact with the wave plate 60 is 10% or more and 50% or less of the length in the length direction of the wave plate 60. By satisfying this condition, the wave plate 60 can be stably bonded, and the adhesive portion 80 is formed while avoiding the optical path of the light passing through the main portion of the wave plate 60.

[0128] When viewed from above, the length in the width direction of the wave plate 60 is smaller than the distance between the light-emitting points of the adjacent arranged light-emitting elements 20. Regarding the length of the short diameter of the FFP of the light-emitting surface of the wave plate 60, the length in the width direction of the wave plate 60 is preferably in the range of 1.1 times or more and 2 times or less thereof. Thereby, the wave plate 60 can be mounted in such a manner that it does not contact the adhesive portion 80 related to the lens member described later, and thus the quality of the light-emitting device 1 can be made more stable. In addition, the adhesive portion 80 for bonding the wave plate 60 is referred to as the first adhesive portion 81, and the adhesive portion 80 for bonding the lens member 70 is referred to as the second adhesive portion 82.

[0129] When viewed from above, in the short diameter direction of the FFP of the light-emitting surface of the wave plate 60, the length of the wave plate 60 is larger than the length of the light-emitting element 20 corresponding to the wave plate 60 and smaller than the length of the base 30 to which the light-emitting element 20 is bonded. In addition, in the same direction, the length of the wave plate 60 is preferably three times or less the length of the base 30. Thereby, it is possible to adopt the shape of the base 30 that ensures the heat dissipation property with respect to the light-emitting element 20, and these components can be made into dimensions suitable for miniaturization of the light-emitting device 1.

[0130] In the example of the illustrated light-emitting device 1, the wave plate 60 is disposed at a position where the main part of the first light emitted from the first light-emitting element 21 is incident. The wave plate 60 is disposed at a position where the main part of the second light emitted from the second light-emitting element 22 is not incident. The wave plate 60 is disposed at a position where the main part of the third light emitted from the third light-emitting element 23 is not incident. When viewed from above, the wave plate 60 does not overlap with the side portion 13C along the short side of the package 10. When viewed from above, a part of the wave plate 60 overlaps with the side portion 13C along the long side of the package 10.

[0131] The lens member 70 is disposed above the light extraction surface of the package 10. The lens member 70 is joined to the package 10. The lens member 70 is joined to the cover member 12E. A plurality of lights emitted from the light extraction surface of the package 10 are incident on the incident surface of the lens member 70. The plurality of lights incident on the incident surface of the lens member 70 are emitted from one or more lens surfaces 70A.

[0132] When viewed from above, one or more lens surfaces 70A of the lens member 70 are respectively disposed so as to overlap with different light-emitting elements 20. Lights that are the main parts of the lights emitted from different light-emitting elements 20 are respectively emitted from one or more lens surfaces 70A. One light-emitting element 20 corresponds to one lens surface 70A, and light from the corresponding light-emitting element 20 is emitted from each lens surface 70A.

[0133] When viewed from above, the lens member 70 is disposed such that the wave plate 60 overlaps with one lens surface 70A. When viewed from above, the lens member 70 can be disposed such that the wave plate 60 does not overlap with two or more lens surfaces 70A. Therefore, most of the light that has passed through the wave plate 60 can be emitted from the lens surface 70A. When viewed from above, the lens member 70 can be disposed such that the wave plate 60 does not overlap with the non-lens portion 75B. Thereby, the size of the wave plate 60 can be reduced.

[0134] When viewed from above, the first adhesive portion 81 is formed in a region overlapping with the lens portion 75A and the non-lens portion 75B of the lens member 70. When viewed from above, the first adhesive portions 81 respectively formed at both end portions of the wave plate 60 are both formed in a region overlapping with the lens portion 75A and the non-lens portion 75B of the lens member 70. By defining the shapes of the wave plate 60 and the lens member 70 in such a manner as to satisfy such conditions, it contributes to the miniaturization of the light-emitting device 1.

[0135] The light that passes through the main part of the wave plate 60 and the light that does not pass through the main part of the wave plate 60 are incident on the incident surface of the lens member 70. Multiple lights with different polarization directions on the light extraction surface of the package 10 become lights with the same polarization direction and are incident on the incident surface of the lens member 70. In the illustrated light-emitting device 1, the polarization directions of the first light and the second light on the incident surface of the lens member 70 are the same as each other. The polarization directions of the first light, the second light, and the third light on the incident surface of the lens member 70 are the same as each other.

[0136] The first light that exits from the light extraction surface of the package 10 and passes through the wave plate 60 and the second light that exits from the light extraction surface of the package 10 are incident on the incident surface of the lens member 70. At least the main part of the second light does not pass through the wave plate 60. Compared with the case where the light that has passed through the lens member passes through the wave plate again, by making the light pass through the wave plate 60 before passing through the lens member 70, the irradiation area of the light passing through the wave plate 60 can be reduced, and thus the size of the wave plate 60 can be reduced.

[0137] The light that exits from the light extraction surface of the package 10 to the outside is incident on the incident surface of the lens member 70 and exits from the exit surface of the lens member 70. And, the adhesion part 80 is joined to the lens member 70 between the light extraction surface of the package 10 and the incident surface of the lens member 70.

[0138] The lens member 70 is fixed to the package 10 via the second adhesion part 82. The second adhesion part 82 is formed on the top surface of the package 10, and the lens member 70 is disposed above it. The second adhesion part 82 is joined to the package 10 and the lens member 70. The second adhesion part 82 is joined to the light extraction surface of the package 10 and the incident surface of the lens member 70.

[0139] The wave plate 60 is sandwiched between the package 10 and the lens member 70. The wave plate 60 does not contact the lens member 70. That is, the lens member 70 is not mounted in a manner of being placed on the wave plate 60, but is joined to the package 10 via the second adhesion part 82 in a manner of not contacting the wave plate 60. In addition, although the lens member 70 may contact the wave plate 60, considering the manufacturing accuracy, a design of the light-emitting device 1 in which the lens member 70 does not contact the wave plate 60 is preferred.

[0140] The thickness of the second adhesive portion 82 in the vertical direction is 200 μm or more and 600 μm or less. The distance between the top surface of the package 10 and the bottom surface of the lens component 70 is 200 μm or more and 600 μm or less. The light extraction surface of the package 10 and the incident surface of the lens component 70 are flat surfaces. The thickness of the second adhesive portion 82 is larger than the thickness of the wave plate 60. In this way, the thickness of the second adhesive portion 82 formed by the adhesive can ensure the corresponding interval for arranging the wave plate 60, thereby enabling the shapes of the package 10 or the lens component 70 to be simplified. For example, in order to ensure the corresponding interval for arranging the wave plate 60, it is not necessary to form a convex portion on the package 10 or a concave portion on the lens component 70. However, such a convex portion or a concave portion can be formed on the package 10 or the lens component 70.

[0141] The distance from the top surface of the wave plate 60 to the incident surface of the lens component 70 is 30 μm or more and 200 μm or less. The lower limit value of 30 μm is an example value set to avoid contact with the wave plate 60, and it can also be less than 30 μm. If the distance between the wave plate 60 and the lens component 70 becomes larger, the irradiation shape of the main part of the light becomes correspondingly larger. Therefore, from this perspective, it is desirable to set the upper limit value to 200 μm.

[0142] When viewed from above, the optical axis of the lens surface 70A overlaps with the optical axis of the light reflected by the reflection component 40. It should be noted that the overlap here is at least a condition that the optical axis of the lens surface 70A is within the range of the shape of 1 / 10 of the FFP from the point on the optical axis of the light irradiated on the lens surface 70A.

[0143] The distance from the light-emitting element 20 with the largest length in the long side direction to the inner side surface on the side opposite to the light-emitting side is shorter than the distance from the reflection component 40 corresponding to the light-emitting element 20 to the inner side surface on the light-emitting side. By arranging in this way, the optical axis of the reflected light can be set at a position sufficiently far from the side portion 13C, so that the lens component 70 can be easily mounted on the package 10.

[0144] The second adhesive portion 82 is provided at the peripheral portion of the light extraction surface of the package 10. The second adhesive portion 82 is formed at a plurality of positions. The second adhesive portion 82 is formed at the four corners of the rectangular light extraction surface of the package 10. The second adhesive portion 82 is formed at the four corners of the rectangular bottom surface of the lens component 70. The second adhesive portion 82 does not contact the first adhesive portion 81. In this way, by providing the second adhesive portion 82 at a plurality of partial positions instead of the entire periphery and avoiding the contact between the second adhesive portion 82 and the first adhesive portion 81, the lens component 70 can be stably joined.

[0145] The embodiments of the present invention have been described above, but the light-emitting device of the present invention is not strictly limited to the light-emitting device of the embodiment. That is to say, the present invention can be realized not only by being limited to the external shape or structure of the light-emitting device disclosed in the embodiment. Moreover, the present invention does not necessarily have to have all the constituent elements in order to be applicable. For example, in the claims, when a constituent element of the light-emitting device disclosed in a part of the embodiments is not described, for this part of the constituent elements, the design freedom of those skilled in the art such as substitution, omission, deformation of the shape, and change of the material is allowed, and the situation to which the invention described in the claims is applicable is determined.

[0146] Industrial Applicability

[0147] The light-emitting devices described in each embodiment can be used for projectors, automotive headlights, head-mounted displays, lighting, displays, etc.

Claims

1. A light-emitting device, characterized in that, Comprising: One or more light-emitting elements that emit a plurality of lights including first light and second light; A package having a configuration surface for disposing the one or more light-emitting elements and a light extraction surface from which the first light and the second light are emitted, and forming a sealed internal space in which the one or more light-emitting elements are disposed; A wave plate that is joined to the light extraction surface of the package at a position where a main portion of the first light emitted from the light extraction surface is incident and a main portion of the second light is not incident; A lens member having an incident surface for the first light that is emitted from the light extraction surface and passes through the wave plate and the second light that is emitted from the light extraction surface; One or more adhesive portions that are provided between the package and the lens member and join the package and the lens member; The wave plate is sandwiched between the package and the lens member and is disposed without contacting the lens member; In the thickness direction between the package and the lens member, the thickness of the one or more adhesive portions is greater than the thickness of the wave plate.

2. The light-emitting device according to claim 1, wherein the one or more light-emitting elements include a first light-emitting element that emits first light and a second light-emitting element that emits second light.

3. The light-emitting device according to claim 1, wherein the one or more adhesive portions are joined to the light extraction surface of the package and the incident surface of the lens member.

4. The light-emitting device according to claim 1, wherein the light extraction surface and the incident surface are flat surfaces.

5. The light-emitting device according to claim 1, wherein the thickness of the one or more adhesive portions in the vertical direction is 200 μm or more and 600 μm or less.

6. The light-emitting device according to claim 1, wherein the thickness of the wave plate in the vertical direction is 100 μm or more and 400 μm or less.

7. The light-emitting device according to claim 1, wherein the distance from the top surface of the wave plate to the incident surface of the lens member is 30 μm or more and 200 μm or less.

8. The light-emitting device according to claim 1, further comprising one or more reflection members that are disposed in the internal space of the package and reflect the light emitted from the one or more light-emitting elements; The first light and the second light reflected by the one or more reflection members are emitted from the light extraction surface.

9. The light-emitting device according to claim 1, wherein the first light and the second light have different polarization directions at the light extraction surface and the same polarization directions at the incident surface of the lens member.

10. The light-emitting device according to any one of claims 1 to 9, further comprising a third light-emitting element that is disposed inside the package and emits third light; The third light emitted from the light extraction surface is incident on the incident surface of the lens member; The wave plate is disposed at a position where a main portion of the third light is not incident.

Images