Light-receiving element, light-emitting device

Abstract

The present invention provides a light-receiving element and a light-emitting device, and realizes a light-receiving element (40) in which the length in a direction perpendicular to the direction in which the light-receiving regions (43) are arranged can be suppressed. The light-receiving element (40) has a light-receiving surface (42) provided with a plurality of light-receiving regions (43) arranged and configured in a first direction, and a plurality of wiring regions (44) electrically connected to the plurality of light-receiving regions (43), and among the plurality of wiring regions (44), the plurality of wiring regions (44) electrically connected to the plurality of light-receiving regions (43) are provided in an end region, which is a region other than the central region, on the light-receiving surface (42).

Description

Technical Field

[0001] The present disclosure relates to a light-receiving element and a light-emitting device. Background Art

[0002] Conventionally, an optical unit is known in which a light-receiving element receives a part of light emitted from a light-emitting element and performs optical control based on the light-receiving result. In addition, Patent Document 1 has disclosed a light-receiving element in which three light-receiving portions are arranged and a metal electrode is provided for each light-receiving portion.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2007-311664 Summary of the Invention

[0006] Technical Problem to be Solved by the Invention

[0007] When a light-receiving element is provided with a plurality of light-receiving regions, there is room for improvement in the arrangement relationship between the plurality of light-receiving regions and the wiring regions of the plurality of light-receiving regions.

[0008] Technical Solution for Solving the Technical Problem

[0009] The light-receiving element of the present disclosure is a light-receiving element having a light-receiving surface provided with a plurality of light-receiving regions arranged in a first direction and a plurality of wiring regions electrically connected to the plurality of light-receiving regions. Among the plurality of wiring regions, the plurality of wiring regions electrically connected to two adjacent light-receiving regions are arranged in an end region other than a central region on the light-receiving surface. The central region on the light-receiving surface includes a region sandwiched between a straight line extending in a second direction passing through the midpoint of the width in the first direction of the light-receiving region arranged at one end of the light-receiving regions arranged at both ends and a straight line extending in the second direction passing through the midpoint of the width in the first direction of the light-receiving region arranged at the other end.

[0010] In addition, the light-receiving element of the present disclosure is a light-receiving element having a light-receiving surface provided with a plurality of light-receiving regions arranged in a first direction and a plurality of wiring regions electrically connected to the plurality of light-receiving regions. Among the plurality of wiring regions, the plurality of wiring regions electrically connected to two light-receiving regions arranged at both ends are provided in an end region, which is a region other than a central region, on the light-receiving surface and are not provided in the central region. The central region on the light-receiving surface includes a region sandwiched by a straight line extending in a second direction perpendicular to the first direction and passing through an end point located at the farthest position from the light-receiving region at the other end among the light-receiving regions arranged at one end among the light-receiving regions arranged at both ends, and a straight line extending in the second direction and passing through an end point located at the farthest position from the light-receiving region at one end among the light-receiving regions arranged at the other end.

[0011] The light-emitting device of the present disclosure includes: a plurality of light-emitting elements each having an upper surface, a lower surface, and a side surface including a light-emitting end surface from which light is emitted, arranged and configured in a first direction; a light-receiving element having a light-receiving surface provided with a plurality of light-receiving regions arranged in the first direction and irradiated with light emitted from the plurality of light-emitting elements, and a plurality of first wiring regions; a base having a plurality of second wiring regions and configured with the plurality of light-emitting elements and the light-receiving element; and a plurality of wirings each having one end among both ends joined to an arbitrary region of the plurality of first wiring regions and the other end joined to an arbitrary region of the plurality of second wiring regions. The plurality of first wiring regions are provided in an end region, which is a region other than a central region, on the light-receiving surface. The central region, in a plan view, on the light-receiving surface includes a region sandwiched by a straight line extending in a direction perpendicular to the first direction, that is, the second direction, and passing through an irradiation point of light passing through the optical axis among the light irradiated to the light-receiving region arranged at one end among the light-receiving regions arranged at both ends, and a straight line extending in the second direction and passing through an irradiation point of light passing through the optical axis among the light irradiated to the light-receiving region arranged at the other end.

[0012] Effects of the Invention

[0013] According to an embodiment of the present disclosure, a light-receiving element capable of suppressing the length in a direction perpendicular to the direction in which the light-receiving regions are arranged can be realized. In addition, by using this light-receiving element, a light-emitting device capable of suppressing the height can be realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a perspective view of the light-emitting device of the first embodiment.

[0015] Figure 2 is a perspective view of the light-emitting device of the first embodiment with the cover member removed.

[0016] Figure 3 It is a top view of the light-emitting device after removing the cover member from the first embodiment.

[0017] Figure 4 It is Figure 3 an enlarged view of part X of the top view.

[0018] Figure 5 It is Figure 1 a cross-sectional view of the light-emitting device taken along the V-V section line.

[0019] Figure 6 It is a perspective view of the light-receiving element of the embodiment.

[0020] Figure 7 It is a top view of the light-receiving element of the embodiment.

[0021] Figure 8 It is a perspective view of the light-emitting device of the second embodiment.

[0022] Figure 9 It is a perspective view of the light-emitting device after removing the cover member from the second embodiment. Detailed Embodiments

[0023] In this specification or the scope of the technical solution, for polygons such as triangles and quadrilaterals, it also includes shapes obtained by performing processes such as rounding, chamfering, beveling, and filleting on the corners of the polygon, and is called a polygon. In addition, not limited to the corners (ends of the sides), shapes obtained by performing processes on the middle parts of the sides are also called polygons in the same way. That is to say, shapes based on polygons and with partial processing are included in the interpretation of "polygon" described in this specification and the scope of the technical solution.

[0024] In addition, not limited to polygons, the same applies to terms indicating specified shapes such as trapezoids, circles, and concavoconvex. The same also applies to the cases of each side to form the shape. That is to say, even if a process is performed on the corner or the middle part of a certain side, the processed part is included in the interpretation of "side". It should be noted that when distinguishing between an "unprocessed" "polygon" or "side" and a processed shape, "strict" is used, for example, denoted as "strict quadrilateral", etc.

[0025] In addition, in this specification or the scope of the technical solution, for a certain main structural component, there are multiple corresponding main structural components. When expressing them separately, sometimes "first" and "second" are marked in front of the main structural component for distinction. In addition, when the objects and viewpoints for distinction in this specification and the scope of the technical solution are different, the same markings sometimes do not refer to the same object between this specification and the scope of the technical solution.

[0026] For example, in this specification, for objects distinguished by being labeled "first", "second", and "third", when only the "first" and "third" in this specification are taken as objects and described in the scope of the technical solution, the objects labeled "first" and "second" in the scope of the technical solution may sometimes refer to the objects labeled "first" and "third" in this specification.

[0027] Next, with reference to the accompanying drawings, embodiments of the present disclosure will be described. However, although the illustrated embodiments are for embodying the technical idea of the present invention, they are not limited to the present invention. In addition, in the following description, for the same names and reference signs, the same or homogeneous components are sometimes appropriately omitted from repeated descriptions. It should be noted that the sizes, positional relationships, etc. of the components shown in the respective drawings are sometimes exaggerated for ease of understanding.

[0028] <First Embodiment>

[0029] The light-emitting device 1 of the first embodiment will be described. Figures 1 to 7 This is a drawing for illustrating an exemplary embodiment of the light-emitting device 1. Figure 1 This is a perspective view of the light-emitting device 1. Figure 2 This is a perspective view of the state after removing the cover member 80 from the light-emitting device 1. Figure 3 This is the same as Figure 2 This is a top view of the same state. Figure 4 This is to Figure 3 This is an enlarged view of a part X of the light-receiving surface 42 of the light-receiving element 40 in the top view of Figure 5 This is Figure 1 This is a cross-sectional view taken along the V-V cutting line of Figure 6 This is a perspective view of the light-receiving element 40. Figure 7 This is a top view of the light-receiving element 40.

[0030] It should be noted that in the top view of Figure 3 the wiring area 14 provided in the stepped portion 13 of the base 10 is indicated by hatching. In addition, the dashed line indicating part X is a virtual line. In addition, in the enlarged view of Figure 4 the elliptical area indicated by a dotted line on the light-receiving surface 42 represents the light irradiation area. In addition, in the enlarged view of Figure 4 an example of the third central area 463 is indicated by hatching with a larger width, and the end area 47 based on the third central area 463 is indicated by hatching with a smaller width. In addition, the dash-dot line used to assist in indicating the third central area 463 and the width Y is a virtual line. In addition, in Figure 7In [the figure], the second central region 462 is represented by hatched lines with a larger width, and the end region 47 based on the second central region 462 is represented by hatched lines with a smaller width. In addition, a dash-dotted line that is additionally marked to represent the first central region 461, the second central region 462, the width S, the width T, and the center line P is a virtual line.

[0031] The light-emitting device 1 has a plurality of main structural components including a base 10, a semiconductor laser element 20, a pedestal 30, a light-receiving element 40, a support table 50, a protection element 60, a plurality of wirings 70, and a cover member 80 (for the support table 50, specifically refer to Figure 5 ).

[0032] In the illustrated example of the light-emitting device 1, three semiconductor laser elements 20, a pedestal 30, a light-receiving element 40, a support table 50, and a plurality of wirings 70 are arranged in the space surrounded by the base 10 and the cover member 80. In addition, the light emitted from the three semiconductor laser elements 20 arranged in the space is emitted to the outside of the light-emitting device 1.

[0033] First, each main structural component will be described.

[0034] (Base 10)

[0035] The base 10 has: a region for arranging other main structural components, that is, an arrangement region, and a side wall surrounding the arrangement region. In addition, the base 10 has a recess, and the recess is composed of the arrangement region and the side wall. The recess is recessed from the upper surface of the base 10 toward the lower surface. Here, the surface that becomes the bottom of the recess of the recess is called the bottom surface. The bottom surface becomes the main part of the arrangement region.

[0036] In a plan view, the outer shape of the base 10 is rectangular. In addition, in a plan view, the outer shape of the recessed portion of the recess is rectangular. In addition, in a plan view, the outer shape of the bottom surface of the base 10 is rectangular. The outer shape of the bottom surface is smaller than the outer shape of the recessed portion. It should be noted that the above outer shapes may not be rectangular either.

[0037] The base 10 has a bottom surface portion 11 and a side surface portion 12. The bottom surface portion 11 is the portion that constitutes the bottom surface of the base 10. In addition, the bottom surface portion 11 includes the bottom surface of the base 10 and the lower surface. The side surface portion 12 is the portion that constitutes the side wall of the base 10. Therefore, the side surface portion 12 surrounds the bottom surface of the base 10 and extends upward from the bottom surface. The side surface portion 12 includes one or more outer side surfaces, one or more inner side surfaces, and an upper surface that intersects the outer side surface and the inner side surface of the base 10.

[0038] Here, the number of surfaces on the inner or outer side of the base 10 depends on the shape surrounding the bottom surface. For example, when the shape surrounding the bottom surface is rectangular, inner surfaces corresponding to the four sides of the rectangle are formed, and the number of inner surfaces is multiple. Additionally, for example, when the shape surrounding the bottom surface is circular, an inner surface corresponding to one circle is formed, and the number of inner surfaces is one. The same applies to the outer side.

[0039] The base 10 has one or more stepped portions 13. The stepped portion 13 is formed in the recessed portion of the base 10. Here, the stepped portion 13 refers to a portion composed only of the upper surface and the inner surface that intersects with the upper surface and extends downward. The stepped portion 13 is included in the side surface portion 12 of the base 10. Additionally, the stepped portion 13 is provided below the upper surface of the base 10. Further, in a plan view, it is formed between the outer shape of the recessed portion in the base 10 and the outer shape of the bottom surface.

[0040] The stepped portion 13 is formed along the inner surface of the base 10 that intersects with the upper surface. Therefore, the inner surface of the base 10 that intersects with the upper surface and the upper surface of the stepped portion 13 intersect. Additionally, the stepped portion 13 is formed along a part of the inner surface of the base 10 that intersects with the upper surface. In other words, the stepped portion 13 is not provided along the entire circumference of the inner surface of the base 10 that intersects with the upper surface. It should be noted that it can also be provided along the entire circumference.

[0041] In the example of the illustrated light-emitting device 1, in a plan view, the outer shape of the inner surface of the base 10 that intersects with the upper surface is rectangular, and the stepped portion 13 is provided across three sides of the rectangle. Additionally, except for the intersecting portions with other sides, the stepped portion 13 is not provided on one side of the rectangle. It should be noted that the number of sides along which the stepped portion 13 extends can also be other than three.

[0042] The stepped portion 13 is preferably provided along more than 50% of the entire circumference of the inner surface of the base 10 that intersects with the upper surface. Thereby, a sufficient area for arranging the wiring area can be ensured in the stepped portion 13. Additionally, it is preferably 90% or less. By not providing the stepped portion 13 in the area where it is not suitable to arrange the wiring area, the base 10 can be designed to be small-sized. It should be noted that it can also be provided along the entire circumference.

[0043] One or more wiring areas 14 are provided on the upper surface of the stepped portion 13. In the example of the illustrated light-emitting device 1, a plurality of wiring areas 14 are provided. The wiring area 14 is electrically connected to the wiring area provided inside the base 10 and on the lower surface of the base 10. It should be noted that the wiring area electrically connected to the wiring area 14 is not limited to the lower surface of the base 10 and can be provided on the outer surface (upper surface, outer side surface, and lower surface) of the base 10.

[0044] The base 10 can be formed using ceramics as the main material. Examples of the ceramics used for the base 10 include aluminum nitride, silicon nitride, alumina, silicon carbide, etc.

[0045] The base 10 can be formed by integrating the bottom surface portion 11 and the side surface portion 12. Alternatively, it can be formed by joining the bottom surface portion 11 and the side surface portion 12, which are separately formed using different materials as the main material. In this case, for example, the bottom surface portion 11 can use metal and the side surface portion 12 can use ceramics as the main material respectively.

[0046] In addition, in this case, the heat dissipation property (high thermal conductivity) of the metal used for the bottom surface portion 11 is preferably better than that of the ceramics used for the side surface portion 12. For example, copper, aluminum, iron, etc. can be used, or as composites, copper molybdenum, copper-diamond composite materials, copper tungsten, etc. can be used.

[0047] Metal films are provided at the wiring area 14 of the base 10 and at positions corresponding to the wiring areas electrically connected thereto. In addition, for electrical connection, metal is also provided at positions passing through the interior, thereby achieving electrical connection.

[0048] (Semiconductor laser element 20)

[0049] The semiconductor laser element 20 has a rectangular outer shape in a top view. In addition, one of the sides intersecting with one of the two short sides of the rectangle is the light emitting end face from which the light emitted from the semiconductor laser element 20 exits. In addition, the areas of the upper surface and the lower surface of the semiconductor laser element 20 are larger than the light emitting end face.

[0050] In addition, the semiconductor laser element 20 is a multi-emitter having two or more emitters. It should be noted that it can also be a single emitter having one emitter. In the example of the illustrated light emitting device 1, the semiconductor laser element 20 has two emitters. In addition, one electrode common to the two emitters is provided on one of the upper surface or the lower surface of the semiconductor laser element 20, and two electrodes corresponding to each emitter are provided on the other.

[0051] The light (laser beam) emitted from each emitter of the semiconductor laser element 20 has diffusibility, and forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emitting end face. The FFP is the shape and light intensity distribution of the emitted light at a position far from the light emitting end face.

[0052] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the light intensity distribution of the FFP, is called the light traveling on the optical axis. In addition, in the light intensity distribution of the FFP, the light having a strength of 1 / e 2 or more of the peak intensity value is called the light of the main part.

[0053] The shape of the FFP of the light emitted from the semiconductor laser element 20 is an elliptical shape in which the lamination direction perpendicular to the layer direction of the plurality of semiconductor layers including the active layer is longer. It should be noted that the layer direction is referred to as the horizontal direction of the FFP, and the lamination direction is referred to as the vertical direction of the FFP.

[0054] In addition, based on the light intensity distribution of the FFP, the angle with respect to the full width at half maximum of the light intensity distribution is defined as the divergence angle of the light of the semiconductor laser element. The divergence angle of the light in the vertical direction of the FFP is defined as the vertical divergence angle, and the divergence angle of the light in the horizontal direction of the FFP is defined as the horizontal divergence angle.

[0055] As the semiconductor laser element 20, for example, a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, or a semiconductor laser element that emits red light can be used. In addition, a semiconductor laser element that emits light other than the above can also be used.

[0056] Here, blue light refers to light whose emission peak wavelength is in the range of 420 nm to 494 nm. Green light refers to light whose emission peak wavelength is in the range of 495 nm to 570 nm. Red light refers to light whose emission peak wavelength is in the range of 605 nm to 750 nm.

[0057] As the semiconductor laser element that emits blue light or the semiconductor laser element that emits green light, a semiconductor laser element including a nitride semiconductor can be exemplified. As the nitride semiconductor, for example, GaN, InGaN, and AlGaN can be used. As the semiconductor laser element that emits red light, a semiconductor laser element including a semiconductor of InAlGaP-based, GaInP-based, GaAs-based, or AlGaAs-based can be exemplified.

[0058] (Base 30)

[0059] The base 30 has two joint surfaces and is formed in a rectangular parallelepiped shape. In addition, the other joint surface is provided on the opposite side of one joint surface. In addition, the distance between the two joint surfaces is smaller than the distance between the other two opposed surfaces. It should be noted that the shape of the base 30 is not limited to a rectangular parallelepiped. The base 30 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. In addition, a metal film for joining is provided on the joint surface.

[0060] (Light receiving element 40)

[0061] The light-receiving element 40 has a bonding surface 41 and a light-receiving surface 42. Additionally, the bonding surface 41 is the surface on the opposite side of the light-receiving surface 42. It should be noted that it may not necessarily be the opposite side. Further, the light-receiving element 40 has an upper surface, a lower surface, and one or more side surfaces. Here, the surface having the light-receiving surface 42 is defined as the upper surface. It should be noted that although the outer shape of the light-receiving element 40 is a rectangular parallelepiped, it is not limited to a rectangular parallelepiped.

[0062] A plurality of light-receiving regions 43 are provided on the light-receiving surface 42. In the example of the illustrated light-receiving element 40, three light-receiving regions 43 are provided. It should be noted that the number of light-receiving regions 43 is not limited to three. The plurality of light-receiving regions 43 are arranged at a predetermined interval. Here, the direction in which the plurality of light-receiving regions 43 are arranged is referred to as the first direction. Figure 7 The arrow direction in 1D indicates the first direction based on the example of the illustrated light-receiving element 40.

[0063] The light-receiving surface 42 has a rectangular outer shape. Additionally, the length of the light-receiving surface 42 in the first direction is greater than the length in the second direction. The second direction is perpendicular to the first direction in a top view. Figure 7 The arrow direction in 2D indicates the second direction based on the example of the illustrated light-receiving element 40. It should be noted that the length in the first direction and the length in the second direction may also be the same. Additionally, the length in the second direction may also be greater than the length in the first direction.

[0064] The plurality of light-receiving regions 43 are arranged at a constant interval while being close to each other. That is, each light-receiving region 43 is separated and does not overlap. It should be noted that the interval may not be constant. The interval between adjacent light-receiving regions 43 is smaller than the width of any one of the light-receiving regions 43 in the first direction. Thereby, the intervals of the light irradiated to each light-receiving region 43 can be made close.

[0065] Each light-receiving region 43 is formed on the light-receiving surface 42 with a rectangular outer shape. It should be noted that it is not limited to a rectangle and can be appropriately designed according to the shape of the irradiated light. In the example of the illustrated light-receiving element 40, each light-receiving region 43 is formed with a rectangular outer shape. One set of two opposite sides (the short sides in the case of a rectangle) of the two sets of opposite sides forming the rectangle is parallel to the first direction. It should be noted that the parallelism here includes an error within ±5 degrees.

[0066] The length of the light-receiving region 43 in the second direction is greater than the length in the first direction. In the example of the illustrated light-emitting device 1, all the light-receiving regions 43 satisfy this condition. It should be noted that light-receiving regions 43 with the same length in the first direction and the second direction may also be included. Additionally, light-receiving regions 43 with a length in the first direction greater than the length in the second direction may also be included.

[0067] In addition, the plurality of light-receiving regions 43 include two light-receiving regions 43 having different lengths in the second direction on the light-receiving surface 42. In addition, the length of at least one of the light-receiving surfaces 42 of the light-receiving regions 43 arranged at both ends in the second direction is smaller than that of the adjacent light-receiving regions 43. In addition, the lengths of the light-receiving regions 43 arranged at both ends in the second direction are different from each other.

[0068] By arranging the light-receiving regions 43 with shorter lengths and the light-receiving regions 43 with longer lengths, a space is generated on the light-receiving surface 42 due to the length difference. By effectively utilizing this space, miniaturization of the light-receiving element 40 can be achieved.

[0069] In the example of the illustrated light-receiving element 40, three light-receiving regions 43 are arranged in the first direction. In addition, the length of the light-receiving region 43 arranged at one of the both ends in the second direction is shorter than that of the other light-receiving regions 43. Moreover, by providing a conduction region 45, which will be described later, in the space generated due to the length difference, miniaturization of the light-receiving element 40 can be achieved.

[0070] It should be noted that the lengths of all the light-receiving regions 43 in the second direction may be the same. In addition, the lengths of the light-receiving surfaces 42 of the light-receiving regions 43 arranged at both ends in the second direction may both be smaller than those of the adjacent light-receiving regions 43. In addition, the lengths of the light-receiving regions 43 arranged at both ends in the second direction may be the same as each other.

[0071] In addition, the plurality of light-receiving regions 43 are arranged with one of the ends of the light-receiving regions 43 in the second direction aligned. In other words, the straight line connecting one of the end points of both ends of each light-receiving region 43 in the second direction is parallel to the first direction. It should be noted that the parallelism here includes a difference within ±5 degrees.

[0072] In addition, the plurality of light-receiving regions 43 include two adjacent light-receiving regions 43. In addition, the plurality of light-receiving regions 43 include two light-receiving regions 43 arranged at both ends. In addition, the plurality of light-receiving regions 43 include two light-receiving regions 43 having different lengths in the second direction. In addition, the plurality of light-receiving regions 43 may be all the light-receiving regions 43. By aligning the positions of one of the ends, miniaturization of the light-receiving element 40 can be facilitated.

[0073] In the case where the light-receiving element 40 has two light-receiving regions 43 having different lengths in the second direction, when one of the ends is aligned, the other ends are not aligned. At this time, the distance in the second direction between the other ends of one light-receiving region 43 and the other ends of the other light-receiving region 43 is equal to the difference in the lengths of the two light-receiving regions 43 in the second direction.

[0074] Note that the light-receiving element 40 may also have a plurality of light-receiving regions 43 where both ends in the second direction are not aligned. In other words, it has a plurality of light-receiving regions 43 where the straight line connecting the ends of the plurality of light-receiving regions 43 at any one of the two ends is not parallel to the first direction.

[0075] Here, in the case of having two light-receiving regions 43 with different lengths in the second direction and both ends of the two light-receiving regions 43 not being aligned, on the premise of miniaturizing the design of the light-receiving element 40, it is preferable that the light-receiving region 43 with the shorter length in the second direction is arranged between a straight line passing through one end point of the two end points in the second direction of the light-receiving region 43 with the longer length and parallel to the first direction, and a straight line passing through the other end point and parallel to the first direction.

[0076] A plurality of wiring regions 44 are provided on the light-receiving surface 42 of the light-receiving element 40. Note that the number of wiring regions 44 is preferably one or more. In addition, not only on the light-receiving surface 42, but also on surfaces other than the light-receiving surface 42, wiring regions may be provided. Each wiring region is electrically connected to the light-receiving region 43.

[0077] A plurality of wiring regions 44 electrically connected to the plurality of light-receiving regions 43 are provided on the light-receiving surface 42. In addition, the plurality of light-receiving regions 43 includes two adjacent light-receiving regions 43. In addition, the plurality of light-receiving regions 43 includes two light-receiving regions 43 arranged at both ends. In addition, the plurality of light-receiving regions 43 includes two light-receiving regions 43 with different lengths in the second direction. In addition, the plurality of light-receiving regions 43 includes all the light-receiving regions 43 provided on the light-receiving surface 42.

[0078] In the illustrated example of the light-receiving element 40, a plurality of wiring regions 44 electrically connected to all the light-receiving regions 43 arranged on the light-receiving surface 42 are provided. Specifically, there are four wiring regions 44 electrically connected to three light-receiving regions 43. That is, on the light-receiving surface 42, there are more wiring regions 44 than the number of light-receiving regions 43.

[0079] Among the four wiring regions 44, three do not overlap with each other and are electrically connected to the anode electrodes of any of the three light-receiving regions 43. The remaining one is electrically connected to the common cathode electrode of the three light-receiving regions 43.

[0080] The plurality of wiring regions 44 are arranged in the end region 47 ( Figure 7 as shown) on the light-receiving surface 42. The end region 47 is the region on the light-receiving surface 42 other than the central region 46. By arranging in the end region 47, it is possible to suppress the increase of the light-receiving element 40 in the second direction. In addition, it is easy to connect the wiring extending in the first direction and joined to the light-receiving element 40.

[0081] Herein, the first central region 461 and the second central region 462 are defined as the central region 46. The first central region 461 on the light-receiving surface 42 is a region sandwiched by a straight line passing through the midpoint in the first direction of the width of one of the light-receiving regions 43 arranged at both ends and extending in the second direction, and a straight line passing through the midpoint in the first direction of the width of the other light-receiving region 43 arranged at the other end and extending in the second direction.

[0082] The second central region 462 on the light-receiving surface 42 is a region sandwiched by a straight line passing through the end point at the farthest position from the light-receiving region 43 at the other end among the light-receiving regions 43 arranged at one end and extending in the second direction, and a straight line passing through the end point at the farthest position from the light-receiving region 43 at one end among the light-receiving regions 43 arranged at the other end and extending in the second direction.

[0083] The first central region 461 is included in the second central region 462. Therefore, the end region 47 when the second central region 462 is taken as the central region 46 is included in the end region 47 when the first central region 461 is taken as the central region 46. It should be noted that the central region 46 may also be a region including at least the first central region 461 or the second central region 462.

[0084] Among the plurality of wiring regions 44, a plurality of wiring regions 44 electrically connected to two adjacent light-receiving regions 43 are provided in the end region 47. Additionally, no such wiring regions are provided in the central region 46. Here, the central region 46 may also be either the first central region 461 or the second central region 462.

[0085] Among the plurality of wiring regions 44, a plurality of wiring regions 44 electrically connected to the two light-receiving regions 43 arranged at both ends are provided in the end region 47. Additionally, no such wiring regions are provided in the central region 46. Here, the central region 46 may also be either the first central region 461 or the second central region 462.

[0086] Among the plurality of wiring regions 44, a plurality of wiring regions 44 electrically connected to two light-receiving regions 43 having different lengths in the second direction are provided in the end region 47. Additionally, no such wiring regions are provided in the central region 46. Here, the central region 46 may also be either the first central region 461 or the second central region 462.

[0087] Furthermore, all the wiring regions 44 are provided in the end region 47. Additionally, no such wiring regions are provided in the central region 46. Here, the central region 46 may also be either the first central region 461 or the second central region 462.

[0088] The end region 47 is divided into two regions with the central region 46 in between. One of the regions separated by the central region 46 is referred to as the first part of the end region 47, and the other region is referred to as the second part of the end region 47.

[0089] One or more wiring regions 44 are provided in the first part of the end region 47, and one or more wiring regions 44 are provided in the second part of the end region 47. By providing the wiring regions 44 on both sides, the wiring does not concentrate on one side, so the interval between the wirings can be widened, and the wiring can be easily performed. It should be noted that multiple wiring regions 44 can be provided in either one of the first part and the second part, and no wiring region 44 is provided in the other part.

[0090] The number of the wiring regions 44 provided in the first part of the end region 47 is preferably the same as or different by one from the number of the wiring regions 44 provided in the second part of the end region 47. In this way, by making the number of the provided wiring regions 44 equal, the interval between the wirings can be widened, and the wiring can be easily performed. In the example of the illustrated light-emitting device 1, two wiring regions 44 are provided in each of the first part and the second part of the end region 47.

[0091] The light-receiving element 40 has a plurality of conduction regions 45 on the light-receiving surface 42. It should be noted that the conduction region 45 can be one, or there can be no conduction region 45. The conduction region 45 connects the light-receiving region 43 and the wiring region 44. Thereby, the light-receiving region 43 and the wiring region 44 are electrically connected.

[0092] Here, the wiring region 44 and the conduction region 45 will be described. The wiring region 44 and the conduction region 45 can be provided with different materials, or can also be provided with the same material. In the case of being provided with the same material, there is sometimes no apparent boundary between the wiring region 44 and the conduction region 45. In the above case, the wiring region 44 is defined as follows, and the boundary between the wiring region 44 and the conduction region 45 can also be specified.

[0093] The multiple wiring regions 44 are regions for joining the wirings for electrically connecting the light-receiving region 43. For example, the position of the wiring region 44 is designated at the welding position to join the wirings. Therefore, based on the joining relationship with the wirings, the wiring region 44 can be defined as the region where the wirings are actually joined.

[0094] In addition, from the perspective of the design of the light-receiving element 40, wiring regions 44 are provided in a prescribed shape as the target of the bonding positions of the wirings. When multiple wiring regions 44 are provided, it is effective to provide them in the same shape. Therefore, the so-called wiring region 44 can be defined as a region that is common among multiple regions provided on the light-receiving surface 42 for electrically connecting the light-receiving regions 43 and has an outer shape in the same shape and size.

[0095] It should be noted that, in the example of the light-receiving element 40 shown in the figure, as multiple regions provided on the light-receiving surface 42 for electrically connecting the light-receiving regions 43, there are four regions. In addition, one of them is a wiring region 44 that is electrically connected to the cathode electrode of the light-receiving region 43. In addition, the remaining three are regions that are electrically connected to the anode electrode of the light-receiving region 43 and are a combination of interconnected wiring regions 44 and conduction regions 45. In addition, each light-receiving region 44 has a rectangular outer shape in the same shape and size.

[0096] It should be noted that the shapes of the regions provided as the targets of the bonding positions of the wirings do not have to be common. In this case, it is also necessary to ensure the minimum region that must be ensured for bonding the wirings. Therefore, when the outer shapes are not common, when overlapping multiple regions provided on the light-receiving surface 42 for electrically connecting the light-receiving regions 43, the maximum range where all the regions overlap can be defined as the wiring region 44. It should be noted that, in the example of the light-receiving element 40 shown in the figure, the maximum range obtained by overlapping all four regions is the wiring region 44.

[0097] Based on the wiring region 44 defined in this way, regions other than the wiring region 44 among the regions provided on the light-receiving surface 42 for electrically connecting the light-receiving regions 43 can be defined as conduction regions 45.

[0098] It should be noted that the boundary between the wiring region 44 and the conduction region 45 is not limited to the methods exemplified here. It can be determined by methods that can be reasonably explained, such as cases where it can be clearly distinguished from the perspective of appearance and material, cases where it can be clearly distinguished according to the manufacturing process of the light-receiving element 40, etc.

[0099] The length of any conduction region 45 in the second direction is shorter than the length of the light-receiving region 43 in the second direction. In addition, it is shorter than the length of the wiring region 44 in the second direction. In addition, among the multiple conduction regions 45, there is a conduction region 45 whose length in the first direction is longer than the length of one light-receiving region 43 in the first direction. In addition, among the multiple conduction regions 45, there is a conduction region 45 whose length in the first direction is shorter than the length of one light-receiving region 43 in the first direction.

[0100] On the light-receiving surface 42, a plurality of conduction regions 45 are provided that connect a plurality of light-receiving regions 43 and a plurality of wiring regions 44. In addition, the plurality of light-receiving regions 43 include two adjacent light-receiving regions 43. In addition, the plurality of light-receiving regions 43 include two light-receiving regions 43 disposed at both ends. In addition, the plurality of light-receiving regions 43 include two light-receiving regions 43 having different lengths in the second direction.

[0101] In addition, the plurality of light-receiving regions 43 include all the light-receiving regions 43 provided on the light-receiving surface 42. In addition, the plurality of wiring regions 44 do not include more than one wiring region 44 among all the wiring regions 44 provided on the light-receiving surface 42. It should be noted that it may also include all the wiring regions 44 provided on the light-receiving surface 42.

[0102] In the example of the illustrated light-receiving element 40, a plurality of conduction regions 45 are provided that are respectively connected to all the light-receiving regions 43 arranged on the light-receiving surface 42. Specifically, there are three conduction regions 45 connected to three light-receiving regions 43. That is, the number of light-receiving regions 43 arranged on the light-receiving surface 42 is the same as the number of conduction regions 45.

[0103] In addition, the conduction region 45 connects the light-receiving region 43 and the wiring region 44 that electrically connects the anode electrode of the light-receiving region 43. On the other hand, the wiring region 44 that electrically connects the cathode electrode of the light-receiving region 43 is not connected to the conduction region 45. This wiring region 44 is electrically connected to the cathode electrode of the light-receiving region 43 inside the light-receiving element 40.

[0104] By electrically connecting a part of the wiring region 44 to the light-receiving region 43 inside the light-receiving element 40, the number of conduction regions 45 provided on the light-receiving surface 42 can be reduced, which contributes to the miniaturized design of the light-receiving element 40. It should be noted that there may also be a conduction region 45 that connects the cathode electrode of the light-receiving region 43 and the wiring region 44.

[0105] In addition, the plurality of conduction regions 45 include a conduction region 45 provided across the end region 47 from the central region 46. In addition, the plurality of conduction regions 45 include a conduction region 45 provided in the end region 47 and not provided in the central region 46. It should be noted that the central region 46 here may be either the first central region 461 or the second central region 462.

[0106] In addition, the plurality of conduction regions 45 include: a conduction region 45 that is connected to one of the two adjacent light-receiving regions 43 and is disposed across the end region 47 from the central region 46, and a conduction region 45 that is connected to the other light-receiving region 43 and is disposed in the end region 47 without being disposed in the central region 46. In addition, the other light-receiving region 43 is a light-receiving region disposed at an end among the plurality of light-receiving regions 43 arranged and configured in the first direction.

[0107] Among the two conduction regions 45 connected to the two adjacent light-receiving regions 43, the conduction region 45 disposed across the end region 47 from the central region 46 and the conduction region 45 disposed in the end region 47 without being disposed in the central region 46 both extend in the first direction from the position connected to the light-receiving region 43 and are connected to the wiring region 44. Any wiring region 44 is also disposed in one of the first part and the second part of the end region 47 that is closer to the light-receiving region 43 disposed at the end.

[0108] In addition, the conduction region 45 disposed across the end region 47 from the central region 46 is connected to an edge of one of the two opposed sides of the two adjacent light-receiving regions 43. In addition, it extends in the first direction parallel to the first direction from the position connected to the edge and is connected to the wiring region 44.

[0109] In addition, the light-receiving element 40 has a light-receiving region 43 sandwiched between a straight line parallel to the second direction passing through one end portion connected to the light-receiving region 43 among the two end portions of the conduction region 45 disposed across the end region 47 from the central region 46 and a straight line parallel to the second direction passing through the other end portion connected to the wiring region 44. In Figure 7 this example, the light-receiving region 43 with the shorter length in the second direction is provided within the range of the width S shown in the drawing.

[0110] Here, the conduction region 45 that is electrically connected to one of the two adjacent light-receiving regions 43 and is disposed across the end region 47 from the central region 46 is not electrically connected to the other light-receiving region 43. As a method of avoiding electrical connection, there is a method of providing an insulating region in a part of the other light-receiving region 43 and providing the conduction region 45 above the insulating region. Since the insulating region is provided above the light-receiving region 43, the position where the insulating region is provided can be adjusted.

[0111] In addition, there is a method of providing the conduction region 45 at the misaligned portion of the two light-receiving regions 43 in the second direction. Since it is provided at a position where there is no light-receiving region 43, it is not necessary to additionally provide an insulating region above the light-receiving region 43 on the light-receiving surface 42.

[0112] In the case where an insulating region is provided, due to this insulating region, the light-receiving region 43 of the light-receiving surface 42 is reduced. As a result, actually, a deviation portion is generated in the arrangement of the two adjacent light-receiving regions 43 in the second direction. That is to say, in any method, the conduction region 45 is connected to one light-receiving region 43 at a portion protruding in the second direction from the other light-receiving region 43 and extends in a direction parallel to the first direction, so as to be connected to the wiring region 44.

[0113] In addition, the conduction region 45 provided in the end region 47 instead of the central region 46 is connected to the side opposite to the side facing the adjacent light-receiving region 43 on the light-receiving region 43 arranged at the end among the two adjacent light-receiving regions 43.

[0114] It should be noted that the conduction region 45 provided across the end region 47 from the central region 46 is preferably connected to the light-receiving region 43 near the upper end or the lower end of the light-receiving region 43. This is because the closer to the end, the more the reduction of the other light-receiving region 43 can be suppressed, and a wide light-receiving region can be ensured.

[0115] In addition, on the light-receiving surface 42, the wiring region 44 is preferably provided in a region sandwiched by a straight line passing through one end of the two ends located at the outermost ends in the second direction among the plurality of light-receiving regions 43 and extending in the first direction and a straight line passing through the other end and extending in the first direction. The increase of the light-receiving element 40 in the second direction can be suppressed. In Figure 7 the example, all the wiring regions 44 are accommodated within the range of the width T shown in the drawing. It should be noted that even if the wiring region 44 is replaced with the conduction region 45, it can be said to be the same.

[0116] In addition, on the light-receiving surface 42, the wiring region 44 is preferably provided not near the center of the light-receiving surface 42 but near any one end in the second direction.

[0117] For example, the wiring region 44 located at the position closest to one end of the two ends located at the outermost ends in the second direction among the plurality of light-receiving regions 43 and the wiring region 44 located at the position closest to the other end are both preferably located at a position closer to one end than the other end. In addition, it is preferably that even if the plurality of light-receiving regions 43 are replaced with the light-receiving surface 42, it can be said to be the same.

[0118] Further, for example, a wiring region 44 preferably located closest to one of the end portions at the outermost ends in the second direction among the plurality of light-receiving regions 43 is provided at a position closer to this one end portion than the center of the two end portions, and a wiring region 44 located closest to the other end portion is provided at a position closer to the center of the two end portions than the other end portion. Further, it is preferably the same even if the plurality of light-receiving regions 43 are replaced with a light-receiving surface 42.

[0119] In Figure 7 the example of, the virtual line P shown in the drawing represents the center line of the two end portions at the outermost ends in the second direction among the plurality of light-receiving regions 43. Further, the virtual line P represents the center line of the light-receiving surface 42. Further, it is satisfied that one of the two wiring regions 44 in the first part of the end region 47 is the wiring region 44 located closest to one of the end portions of the two end portions, and the other is the wiring region 44 located closest to the other end portion of the two end portions. It is preferably the same even if the first part is replaced with the second part.

[0120] As the light-receiving element 40, for example, a photodiode (hereinafter abbreviated as PD) can be used. Further, the light-receiving element 40 reflects 80% or more of the light irradiated to the light-receiving region 43.

[0121] (Supporting table 50)

[0122] The supporting table 50 has a lower surface and an inclined surface 51 inclined with respect to the lower surface. The inclined surface 51 is neither perpendicular nor parallel when viewed from the lower surface. For example, the inclined surface 51 is composed of a plane forming an inclination angle of 40 degrees or more and 50 degrees or less with respect to the lower surface. In the example of the illustrated light-emitting device 1, the inclined surface 51 is composed of a plane forming an inclination angle of 45 degrees with respect to the lower surface. It should be noted that the inclined surface 51 can also be formed within a range where the inclination angle is 10 degrees or more and 80 degrees or less.

[0123] The inclined surface 51 is one or more inclined surfaces inclined with respect to the lower surface on the supporting table 50, and is the inclined surface with the largest area in the case where there are a plurality of inclined surfaces. Further, when viewed from above, the inclined surface 51 occupies more than 60% of the area of the supporting table 50. Further, when viewed from above, the width from the upper end portion to the lower end portion of the inclined surface 51 is more than 60% of the width of the supporting table 50 in the same direction. That is to say, the main proportion on the supporting table 50 is the inclined surface 51.

[0124] The supporting table 50 can be formed, for example, using ceramics, glass, or metal, etc. For example, ceramics such as aluminum nitride, glass such as quartz or borosilicate glass, and metal such as aluminum can be used. Alternatively, it can also be formed using Si, etc.

[0125] (Protective element 60)

[0126] The protective element 60 is used to prevent excessive current from flowing to a specified element (such as the semiconductor laser element 20) and causing it to be damaged. As the protective element 60, for example, a Zener diode can be cited. In addition, as the Zener diode, a diode formed of Si can be used.

[0127] (Wiring 70)

[0128] The wiring 70 is formed in a linear shape with both end portions as joint portions. That is, joint portions for joining with other main structural components are provided at both end portions of the linear portion. The wiring 70 is, for example, a metal lead. As the metal, for example, gold, aluminum, silver, copper, etc. can be used.

[0129] (Cover member 80)

[0130] The cover member 80 has a lower surface and an upper surface, and is formed in a flat plate shape of a rectangular parallelepiped. It should be noted that it may not be a rectangular parallelepiped. In addition, the cover member 80 has light transmissibility for light to pass through. Here, the light transmissibility means that the light transmittance is 80% or more with respect to light. It should be noted that it may not have a light transmittance of 80% or more with respect to light of all wavelengths. In addition, the cover member 80 may also have a non-light-transmitting region (a region without light transmissibility) in a part.

[0131] The cover member 80 can be formed using sapphire. Sapphire has light transmissibility, and is also a material with a relatively high refractive index and high strength. It should be noted that in addition to sapphire, for example, glass, etc. can also be used.

[0132] (Light-emitting device 1)

[0133] Next, the light-emitting device 1 will be described.

[0134] The light-emitting device 1 includes: a base 10, a semiconductor laser element 20 disposed on the base 10, a light-receiving element 40 disposed on the base 10, a plurality of first wirings 71 among the plurality of wirings 70 for electrically connecting the semiconductor laser element 20, and a plurality of second wirings 72 among the plurality of wirings 70 for electrically connecting the light-receiving element 40. It should be noted that the semiconductor laser element 20 can be replaced, and other light-emitting elements such as an LED can be used.

[0135] In addition, in the light-emitting device 1, the semiconductor laser element 20 is disposed on the base 10 via a base 30. It should be noted that it may be directly disposed on the bottom surface of the base 10 without passing through the base 30. In the case of not passing through the base 30, in order to adjust the emission position (height) of the light from the emission end surface, the external shape of the semiconductor laser element 20 may sometimes be changed.

[0136] In addition, the light-receiving element 40 is disposed on the base 10 via the support table 50. It should be noted that it may also be directly disposed on the bottom surface of the base 10 without passing through the support table 50. In the case of not passing through the support table 50, in order to adjust the position (height) and direction (tilt) of the light-receiving surface 42, the outer shape of the light-receiving element 40 may sometimes be changed.

[0137] In addition, the light-emitting device 1 includes a protection element 60 that is disposed on the base 10 and protects the semiconductor laser element 20. In addition, the light-emitting device 1 includes a lid member 80 that is joined to the base 10 and seals the space in which the semiconductor laser element 20 is disposed.

[0138] The semiconductor laser element 20 is disposed on the bottom surface (disposal area) of the base 10. In addition, a plurality of semiconductor laser elements 20 may be provided. In addition, the plurality of semiconductor laser elements 20 are arranged such that their emission end faces face the same direction. In addition, between adjacent semiconductor laser elements 20, the side surfaces intersecting the respective emission end faces face each other.

[0139] Here, in the light-emitting device 1, the direction in which the plurality of semiconductor laser elements 20 are arranged in a plan view is referred to as the first direction. In addition, the direction perpendicular to the first direction in a plan view is referred to as the second direction. The first direction and the second direction based on the example of the illustrated light-emitting device 1 are respectively represented by 1D and 2D in Figure 3 It should be noted that in the case of providing one semiconductor laser element 20 having a plurality of emitters, the direction in which the plurality of emitters are arranged may also be referred to as the first direction.

[0140] In the example of the illustrated light-emitting device 1, three semiconductor laser elements 20 are provided. In addition, in a plan view, the first direction is parallel to the emission end face of the semiconductor laser element 20. In addition, the side surfaces that intersect the respective emission end faces and face each other between adjacent semiconductor laser elements 20 are parallel to each other in a plan view.

[0141] The three semiconductor laser elements 20 are composed of a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, and a semiconductor laser element that emits red light. It should be noted that the structure is not limited to this, and it may be a structure having a plurality of semiconductor laser elements that emit the same color of light, or a structure having semiconductor laser elements that emit other colors of light.

[0142] The base 30 is joined to the semiconductor laser element 20 on one joining surface. In addition, on the other joining surface on the opposite side, it is joined to the bottom surface of the base 10. It should be noted that the light-emitting device 1 may also include a plurality of bases 30. The number of semiconductor laser elements 20 disposed on one base 30 may also be one.

[0143] The light-receiving element 40 is disposed on the bottom surface of the base 10. In addition, the light-receiving surface 42 is disposed in the direction in which the light emitted from the semiconductor laser element 20 is irradiated. In addition, the main part of the light emitted from the semiconductor laser element 20 is irradiated to a plurality of light-receiving regions 43 on the light-receiving surface 42. In addition, the main part of at least one laser beam is irradiated to one light-receiving region 43. That is, the main parts of two laser beams may also be irradiated.

[0144] In the example of the illustrated light-emitting device 1, the light emitted from a plurality of semiconductor laser elements 20 is irradiated to a plurality of light-receiving regions 43 provided on the light-receiving surface 42 of the light-receiving element 40. In addition, one light-receiving region 43 corresponds to one semiconductor laser element 20, and the main part of the light emitted from one semiconductor laser element 20 is irradiated to one light-receiving region 43.

[0145] Specifically, at least the main part of the light emitted from the three semiconductor laser elements 20 is irradiated to the three light-receiving regions 43. In addition, two laser beams respectively emitted from two emitters of one semiconductor laser element 20 are irradiated to one light-receiving region 43.

[0146] The light-receiving element 40 receives (absorbs) a part of the light irradiated to the light-receiving region 43 and reflects a part. The light-receiving region 43 receives more than 2% of the main part of the irradiated light. In addition, the light-receiving region 43 reflects more than 80% of the main part of the irradiated light. It should be noted that the sum of the received light and the reflected light is 100% or less.

[0147] In addition, the first direction of the light-emitting device 1 and the first direction of the light-receiving element 40 are the same direction and are parallel. In addition, in a plan view, the emission end face of the semiconductor laser element 20 is parallel to the edge of the lower end portion or the upper end portion of the light-receiving surface 42 of the light-receiving element 40. The parallel here includes a difference within 5 degrees. It should be noted that they may not be parallel.

[0148] The light-receiving region 43 reflects the light emitted laterally from the semiconductor laser element 20 upward. Therefore, the light-receiving surface 42 is inclined with respect to the emission end face and the optical axis. In addition, it is inclined with respect to the bottom surface of the base 10. The light-receiving surface 42 is inclined at an angle of 40 degrees or more and 50 degrees or less with respect to the traveling direction of the light passing through the optical axis. In the example of the illustrated light-emitting device 1, it is inclined at an angle of 45 degrees. It should be noted that it may also be inclined at an angle within the range of 10 degrees or more and 80 degrees or less.

[0149] The wiring region 44 of the light-receiving element 40 is disposed at a position where it does not intrude into the optical path of the main part of the light emitted from the semiconductor laser element 20. In addition, the second wiring 72 joined to the wiring region 44 is disposed at a position where it does not intrude into the optical path of the main part of the light.

[0150] Therefore, a plurality of wiring regions 44 are provided in the end region 47 on the light receiving surface 42. Here, the end region 47 is a region other than the central region 46. In addition, as the central region 46 here, a third central region 463 is defined.

[0151] In a plan view, the third central region 463 is a region sandwiched between a straight line passing through the irradiation point of the light passing through the optical axis among the lights irradiating the light receiving region 43 arranged at one end of the light receiving regions 43 arranged at both ends and extending in the second direction, and a straight line passing through the irradiation point of the light passing through the optical axis among the lights irradiating the light receiving region 43 arranged at the other end and extending in the second direction on the light receiving surface 42. It should be noted that it may also be a region including at least this region.

[0152] It should be noted that when a plurality of laser beams are irradiated to one light receiving region 43, the above-mentioned definition of the third central region 463 can be satisfied based on at least any one of the laser beams. In addition, preferably in the first direction, based on the laser beams irradiated to both ends, the above-mentioned definition of the third central region 463 is satisfied. In Figure 4 the example, the third central region 463 in the case of based on the laser beams irradiated to both ends is indicated by hatching.

[0153] In addition, when the plurality of light receiving regions 43 of the light receiving element 40 include two light receiving regions 43 having different lengths in the second direction, the light receiving region 43 to which the laser beam is irradiated can be determined according to the vertical diffusion angle of the plurality of laser beams emitted from the semiconductor laser element 20. This is because the laser beam with a larger vertical diffusion angle forms an irradiation region that is longer in the second direction on the light receiving region 43.

[0154] Therefore, the main part of the light of the laser beam with the largest vertical light diffusion angle among the plurality of laser beams can be irradiated to the longer light receiving region 43 among the two light receiving regions 43 having different lengths in the second direction. In other words, it is preferable that the main part of the light of the laser beam with the largest vertical light diffusion angle among the plurality of laser beams is not irradiated to the shorter light receiving region among the two light receiving regions 43 having different lengths in the second direction.

[0155] In the example of the illustrated light emitting device 1, the length in the second direction of the light receiving region 43 arranged at one end of the light receiving regions 43 arranged at both ends among the plurality of light receiving regions 43 arranged in the first direction is smaller than the length in the second direction of the adjacent light receiving region 43.

[0156] Therefore, with the semiconductor laser element 20 and the light-receiving element 40, the main part of the light emitted from the semiconductor laser element 20 having the largest light divergence angle in the vertical direction among the plurality of semiconductor laser elements 20 does not irradiate the light-receiving region 43 disposed at one of the two end portions and having a length in the second direction smaller than that of the adjacent light-receiving region 43, but irradiates another light-receiving region 43 having a length in the second direction larger than that of the light-receiving region 43.

[0157] Specifically, the main part of the light emitted from the semiconductor laser element 20 that emits red light and has the largest light divergence angle in the vertical direction among the three semiconductor laser elements 20 irradiates the light-receiving region 43 at the end portion on the side with the larger length in the second direction of the two end portions.

[0158] Although the light-receiving region 43 located between the two end portions also has a larger length in the second direction among the light-receiving regions 43, it is preferable to dispose the semiconductor laser element 20 that is easily affected by heat at the end portion compared with others. In the illustrated example of the light-emitting device 1, the semiconductor laser element 20 that emits red light has a light-emitting characteristic that is more easily affected by heat than the semiconductor laser element 20 that emits blue light and the semiconductor laser element 20 that emits green light.

[0159] In addition, the conduction region 45 provided across the end region 47 from the first central region 461 or the second central region 462 is provided across the end region 47 from the third central region 463. The conduction region 45 provided across the end region 47 from the central region 46 is provided near the upper end portion of the light-receiving region 43 disposed at the end portion in the light-emitting device 1. For this conduction region 45, it is also disposed at a position where it does not intrude into the optical path of the main part of the light emitted from the semiconductor laser element 20.

[0160] Therefore, the conduction region 45 provided across the end region 47 from the central region 46 is provided on the light-receiving surface 42, downward from the straight line extending in the first direction through the upper end portion of the adjacent light-receiving region 43 of the light-receiving region 43 disposed at the end portion and above the upper end portion of the main part of the light irradiated to the light-receiving region 43 disposed at the end portion, and connects the adjacent light-receiving region 43 and the wiring region 44.

[0161] Note that the conduction region 45, which is provided across the end region 47 from the central region 46, may also be provided near the lower end of the light-receiving region 43 disposed at the end in the light-emitting device 1. In this case, the conduction region 45 is provided upward from a straight line that extends in the first direction along the lower end of the adjacent light-receiving region 43 disposed at the end and is below the lower end of the light that irradiates the main portion of the light-receiving region 43 disposed at the end, connecting the adjacent light-receiving regions 43 to the wiring region 44.

[0162] The support table 50 engages with the light-receiving element 40 on the inclined surface 51. That is, the light-receiving element 40 is disposed above the inclined surface 51. Further, the support table 50 is disposed such that the inclined surface 51 faces the semiconductor laser element 20. By disposing the light-receiving element 40 via the support table 50, it is not necessary to form the light-receiving element 40 in a complex shape. Therefore, it is preferable to use a material for the support table 50 that is easier to process in shape than the light-receiving element 40.

[0163] In addition, the lower surface of the support table 50 engages with the bottom surface of the base 10. By the lower surface of the support table 50 engaging with the bottom surface of the base 10, the inclined surface 51 is inclined with respect to the bottom surface. Further, since the lower surface of the support table 50 and the bottom surface of the base 10 are in a parallel relationship, the inclination angle of the inclined surface 51 with respect to the bottom surface of the base 10 is the same as the inclination angle of the inclined surface 51 with respect to the lower surface of the support table 50.

[0164] Since the light diffused from the semiconductor laser element 20 is irradiated onto the light-receiving element 40, it is necessary to provide the light-receiving surface 42 from a position lower than the light-emitting point of the semiconductor laser element 20 to a higher position. Therefore, the height of the lower end of the light-receiving surface 42 of the light-receiving element 40 disposed in the light-emitting device 1 is lower than the light-emitting point of the semiconductor laser element 20, and the height of the upper end of the light-receiving surface 42 is higher than the light-emitting point of the semiconductor laser element 20.

[0165] With the semiconductor laser element 20 and the light-receiving element 40 disposed in the base 10, the step portion 13 is provided at a position away from the semiconductor laser element 20 or the light-receiving element 40 in the first direction. Further, it is provided at positions away from the semiconductor laser element 20 or the light-receiving element 40 in both directions of the first direction. The step portion 13 is provided so as to sandwich the semiconductor laser element 20 and the light-receiving element 40 in a plan view.

[0166] In addition, the step portion 13 is provided at a position away from the semiconductor laser element 20 or the light-receiving element 40 in the second direction. Further, it is provided at a position away from the light-receiving element 40 in the direction toward the semiconductor laser element 20 among the two directions of the second direction. Note that it may not be provided.

[0167] The stepped portion 13 provided at a position away from the semiconductor laser element 20 or the light receiving element 40 in both directions in the first direction and in one direction in the second direction is connected. It should be noted that it may not be connected. In addition, the stepped portion 13 is not provided at a position away from the semiconductor laser element 20 or the light receiving element 40 in the other direction in the second direction. It should be noted that it may also be provided.

[0168] In a state where the semiconductor laser element 20 and the light receiving element 40 are provided in the base 10, the wiring area 14 is provided at a position away from the semiconductor laser element 20 or the light receiving element 40 in the first direction. In addition, the wiring area 14 is provided at positions away from the semiconductor laser element 20 or the light receiving element 40 in both directions in the first direction.

[0169] In addition, the wiring area 14 is provided at a position away from the semiconductor laser element 20 or the light receiving element 40 in the second direction. In addition, it is provided at a position away from the light receiving element 40 in the direction toward the semiconductor laser element 20 among the two directions in the second direction. It should be noted that it may not be provided.

[0170] One end of the two end portions of the first wiring 71 is joined to the wiring area 14. In addition, the other end of the two end portions is joined to the upper surface of the semiconductor laser element 20 or the upper surface of the base 30. A joining area for joining with the first wiring 71 is provided on the upper surface of the semiconductor laser element 20 or the upper surface of the base 30.

[0171] Therefore, in a state where the semiconductor laser element 20 and the base 30 are arranged in the base 10, in the height direction (vertical direction), the upper surface of the stepped portion 13 of the base 10 is preferably above the upper surface of the base 30 and below the upper surface of the semiconductor laser element 20. In this way, it is easy to connect the first wiring 71. It should be noted that multiple first wirings 71 may not be joined to the wiring area 14 of the stepped portion 13. One end or more of the first wirings 71 are joined to the wiring area 14.

[0172] In addition, in a plan view, the first wiring 71 is joined to the wiring area 14 of the base 10 with a straight line parallel to the light emitting end face of the semiconductor laser element 20 as a boundary, on the side of the semiconductor laser element 20 (including the side of the semiconductor laser element 20 opposite to the light emitting end face). Thereby, it is easy to prevent the first wiring 71 from entering the optical path of the light.

[0173] One end of the two ends of the second wiring 72 is joined to the wiring region 14. Further, the other end of the two ends is joined to the wiring region 44 of the light receiving element 40. By providing the wiring region 44 in the end region 47, the distance between the wiring region 14 of the base 10 and the wiring region 44 of the light receiving element 40 can be shortened, and the length of the second wiring 72 can be shortened. Further, the height of the second wiring 72 can be suppressed, and a light emitting device with a suppressible height can be realized.

[0174] Further, a plurality of second wirings 72 are joined to the wiring region 14 of the base 10 and the wiring region 44 of the light receiving element 40. Further, all the wirings used for the electrical connection of the light receiving element 40 are joined to the wiring region 14. Note that all the wirings used for the electrical connection of the light receiving element 40 may not be joined to the wiring region 14. One end of one or more second wirings 72 is joined to the wiring region 14.

[0175] Further, in a plan view, the second wiring 72 is joined to the wiring region 14 of the base 10 on the light receiving element 40 side with a straight line parallel to the light emitting end face of the semiconductor laser element 20 as a boundary. Thereby, it is easy to prevent the second wiring 72 from entering the optical path of the light.

[0176] Further, in a plan view, at least one or more of the plurality of second wirings 72 are joined to the wiring region 14 of the base 10 within a region sandwiched by a straight line passing through one end of the two ends located at the outermost edge in the second direction of the light receiving element 40 and extending in the first direction and a straight line passing through the other end and extending in the first direction. Preferably, a plurality of second wirings 72, and more preferably all of the second wirings 72, are joined to the wiring region 14 within this region. Thereby, the length of the second wiring 72 can be suppressed.

[0177] Further, in a plan view, at least one or more of the plurality of second wirings 72 are joined to the wiring region 14 of the base 10 within a region sandwiched by a straight line passing through one end of the two ends located at the outermost edge in the second direction of the light receiving surface 42 and extending in the first direction and a straight line passing through the other end and extending in the first direction. Preferably, a plurality of second wirings 72, and more preferably all of the second wirings 72, are joined to the wiring region 14 within this region. Similarly, the length of the second wiring 72 can be suppressed.

[0178] In Figure 4 the example, the region of the width Y represents the region sandwiched by a straight line passing through one end of the two ends located at the outermost edge in the second direction of the light receiving surface 42 and extending in the first direction and a straight line passing through the other end and extending in the first direction. Further, within the region of the width Y, all the second wirings 72 are joined to the wiring region 14 of the base 10.

[0179] In addition, the position where any second wiring 72 is joined to the wiring region 44 of the light receiving element 40 is located at a position higher than the base 30. As shown in the cross-sectional view of Figure 5 , in the example of the light emitting device 1 shown in the figure, the height from the bottom surface of the base 10 to the joining position of the second wiring 72 in the wiring region 44 is larger than the height from the bottom surface of the base 10 to the upper surface of the base 30.

[0180] In the light receiving element 40, the wiring region 44 is made to approach either one of the ends rather than the center. Therefore, the second wiring 72 can be joined at a position above the light receiving element 40 and joined at a position higher than the upper surface of the base 30. Although it is necessary to arrange the welding position so as not to contact the semiconductor laser element 20 when joining the second wiring 72, by making the wiring region 44 approach above the light receiving element 40, the light receiving element 40 and the semiconductor laser element 20 can be arranged close to each other.

[0181] In addition, in the light emitting device 1, there is no wiring passing directly above the upper end portion of the light receiving element 40. That is, even if wirings are arranged in addition to the wiring 70, all the wirings arranged in the recessed portion of the base 10 do not pass directly above the upper end portion of the light receiving element 40. Therefore, the second wiring 72 is joined to the wiring region 14 and the wiring region 44 without passing directly above the upper end portion of the light receiving element 40. Thereby, the height of the wiring can be suppressed and the height of the light emitting device 1 can be reduced.

[0182] In addition, in the light emitting device 1, there is no wiring passing through the region directly above the light receiving surface 42. Therefore, the second wiring 72 is joined to the wiring region 14 and the wiring region 44 without passing through the region directly above the light receiving surface 42. Thereby, it is easy to prevent the second wiring 72 from entering the optical path of the light.

[0183] In the example of the light emitting device 1 shown in the figure, the number of first wirings 71 electrically connected to the semiconductor laser element 20 is larger than the number of second wirings 72 electrically connected to the light receiving element 40. By providing the wiring region 14 at a position away from the light receiving element 40 in the direction toward the semiconductor laser element 20 among the two directions in the second direction, a region for joining the first wiring 71 is ensured and the wiring can be easily joined.

[0184] The protection element 60 is arranged on the upper surface of the step portion 13. By arranging it on the step portion 13, the arrangement area can be reduced, which contributes to the miniaturization of the light emitting device 1. In addition, a plurality of protection elements 60 are arranged on the upper surface of the step portion 13.

[0185] In addition, in a plan view, with a straight line parallel to the light-emitting end face of the semiconductor laser element 20 as a boundary, one or more protective elements 60 are respectively arranged on both the semiconductor laser element 20 side and the light-receiving element 40 side. In addition, the number of protective elements 60 arranged on the semiconductor laser element 20 side is larger than the number of protective elements 60 arranged on the light-receiving element 40 side. Since a larger area of the wiring region 14 can be ensured on the semiconductor laser element 20 side, it is easy to join the wirings of the first wiring 71 and the second wiring 72.

[0186] In addition, in a plan view, with a straight line parallel to the light-emitting end face of the semiconductor laser element 20 as a boundary, in the direction toward the light-receiving element 40, in the order of the second wiring 72 and the protective element 60, they are arranged in the wiring region 14. By arranging them in this order, it is easy to perform joining that can suppress the length of the second wiring 72. It should be noted that the order can also be reversed.

[0187] The cover member 80 is arranged on the upper surface of the base 10. In addition, the cover member 80 is located above the step portion 13. In addition, by joining the cover member 8, a closed space surrounded by the base 10 and the cover member 80 is formed. This space is the space for arranging the semiconductor laser element 20. In the example of the light-emitting device 1 shown in the figure, the cover member 80 is joined to the base 10 to seal the plurality of semiconductor laser elements 20 arranged on the base 10.

[0188] In addition, by joining the cover member 80 and the base 10 in a prescribed ambient gas, a hermetically sealed closed space is formed. By hermetically sealing the space for arranging the semiconductor laser element 20, it is possible to suppress quality deterioration due to dust accumulation. In addition, the cover member 80 is transparent to the light emitted from the semiconductor laser element 20.

[0189] In the light-emitting device 1, more than 80% of the light of the main part emitted from all the semiconductor laser elements 20 arranged in the first direction in the light-emitting device 1 and irradiating the light of the main part to the light-receiving element 40 faces upward and is emitted to the outside

[0190] In the light-emitting device 1, based on the light-receiving result of the light by the light-receiving element 40, the output of the light emitted from the semiconductor laser element 20 can be controlled. Thereby, the output of the light emitted from the light-emitting device 1 can be controlled.

[0191] <Second Embodiment>

[0192] The light-emitting device 2 of the second embodiment will be described. Figure 8 And Figure 9 is a drawing for illustrating an example mode of the light-emitting device 2. Figure 8 is a perspective view of the light-emitting device 2. Figure 9It is a perspective view of the state after removing the cover member 280 from the light-emitting device 2.

[0193] The light-emitting device 2 includes a plurality of main structural components including a base 210, a semiconductor laser element 20, a base 30, a light-receiving element 40, a support table 50, a plurality of wirings 70, and a cover member 280. In addition, the light-emitting device 2 of the second embodiment is different from the light-emitting device 1 of the first embodiment in that the shapes of the base 210 and the cover member 280 are different.

[0194] The base 210 does not have a side surface portion 12. In addition, the base 210 is formed in a flat plate shape having an upper surface, a lower surface, and side surfaces. In addition, the surface on which the semiconductor laser element 20 is disposed and the surface provided with the wiring region 14 are in the same plane. It should be noted that they may not be in the same plane. For example, although there is a stepped portion 13, the base may be a base that does not have an upper surface above the stepped portion 13.

[0195] Since the base 210 does not have a side surface portion 12, when joining the wiring 70 to the wiring region 14, it is not necessary to consider ensuring a constant distance from the side surface portion 12 so that the joining device for joining the wiring 70 does not contact the side surface portion 12.

[0196] The cover member 280 is formed in a cover shape having side walls. In addition, the side walls surround the arrangement region and the wiring region 14. In addition, the side walls are formed to a position higher than the semiconductor laser element 20, the light-receiving element 40, and the wiring 70 arranged on the base 210. The cover member 280 is joined to the upper surface of the base 210 to form a closed space that hermetically seals the space in which the semiconductor laser element 20 is arranged.

[0197] Above, the embodiments of the present invention have been described, but the light-emitting device of the present invention is not strictly limited to the light-emitting device of the embodiment. That is, the present invention does not have to be limited to the external shape and structure of the light-emitting device disclosed by the embodiment in order to be realized. For example, a light-emitting device without a protection element may also be used. In addition, it is not necessary to fully include all the main structural components. For example, in the case where a part of the main structural components of the light-emitting device disclosed by the embodiment is not described in the scope of the technical solution, for that part of the main structural components, the degrees of freedom of design such as replacement, omission, shape deformation, and material change by those skilled in the art are allowed, and on this basis, the invention described in the scope of the applied technical solution is specified.

[0198] Industrial Applicability

[0199] The light-emitting devices described in each embodiment can be used in head-mounted displays, projectors, vehicle headlights, lighting, displays, etc.

[0200] Explanation of Reference Numerals

[0201] 1. Light emitting device; 10, 210 bases; 11 bottom surface portion; 12 side surface portion; 13 stepped portion; 14 wiring area; 20 semiconductor laser element; 30 base; 40 light receiving element; 41 bonding surface; 42 light receiving surface; 43 light receiving area; 44 wiring area; 45 conduction area; 46 central area; 461 first central area; 462 second central area; 463 third central area; 47 end area; 50 support table; 51 inclined surface; 60 protection element; 70 wiring; 71 first wiring; 72 second wiring; 80, 280 cover member.

Claims

1. A light-emitting device, characterized in that, comprising: a plurality of light-emitting elements, each having an upper surface, a lower surface, and side surfaces including an emission end face from which light is emitted, and arranged in a first direction; a light-receiving element having a light-receiving surface provided with a plurality of light-receiving regions arranged in the first direction and irradiated with light emitted from the plurality of light-emitting elements, and a plurality of first wiring regions; a base having a plurality of second wiring regions, on which the plurality of light-emitting elements and the light-receiving element are arranged; a plurality of wirings, one end of each of which is joined to any region of the plurality of first wiring regions, and the other end of which is joined to any region of the plurality of second wiring regions; the plurality of light-receiving regions have a length in a direction perpendicular to the first direction on the light-receiving surface that is longer than the length in the first direction; the plurality of first wiring regions are provided in an end region, which is a region other than a central region, on the light-receiving surface; the central region, in a plan view, on the light-receiving surface includes a straight line passing through the irradiation point of the light passing through the optical axis among the light irradiated to the light-receiving region arranged at one end portion of the light-receiving regions arranged at both end portions and extending in a second direction, which is a direction perpendicular to the first direction, and a straight line passing through the irradiation point of the light passing through the optical axis among the light irradiated to the light-receiving region arranged at the other end portion and extending in the second direction, and the region sandwiched therebetween; the light-receiving element reflects upward more than 80% of the main part of the light emitted from the plurality of light-emitting elements and irradiated to the light-receiving regions, and emits it to the outside.

2. The light-emitting device according to claim 1, wherein: the first direction is parallel to the emission end face of the light of the light-emitting element in a plan view.

3. The light-emitting device according to claim 1 or 2, wherein: the light-receiving element has the light-receiving surface inclined with respect to the traveling direction of the light passing through the optical axis among the light emitted from the light-emitting element.

4. The light-emitting device according to claim 3, wherein: the light-receiving surface is inclined at an angle of 40 degrees or more and 50 degrees or less with respect to the traveling direction of the light passing through the optical axis.

5. The light-emitting device according to claim 1 or 2, wherein: at least one of the plurality of wirings is joined to the second wiring region in a plan view, and the second wiring region is provided in a region sandwiched between a straight line passing through one end portion of the two end portions located at the outermost ends in the second direction of the light-receiving element and extending in the first direction, and a straight line passing through the other end portion and extending in the first direction.

6. The light-emitting device according to claim 1 or 2, wherein: the plurality of wirings are joined to the first wiring region and the second wiring region without passing directly above the upper end portion of the light-receiving element.

7. The light-emitting device according to claim 1 or 2, wherein: there is a cover member joined to the base and sealing the plurality of light-emitting elements arranged on the base.

8. The light-emitting device according to claim 1 or 2, wherein: The plurality of light-emitting elements are arranged on the base via a base.

9. The light-emitting device according to claim 1 or 2, wherein The light-receiving element is arranged on the base via a support table.

10. The light-emitting device according to claim 1 or 2, wherein The length in the second direction of the light-receiving area arranged at one end of the light-receiving area arranged at the two end portions is smaller than the length in the second direction of the light-receiving area arranged adjacent to the light-receiving area arranged at the one end. Most of the light emitted from the light-emitting element having the largest diffusion angle of light in the vertical direction among the plurality of light-emitting elements does not irradiate the light-receiving area having a length in the second direction smaller than that of the adjacent light-receiving area and arranged at one end of the two end portions, but irradiates another light-receiving area having a length in the second direction larger than that of the light-receiving area.

11. The light-emitting device according to claim 1 or 2, wherein The light-receiving element has a conduction area connecting the adjacent light-receiving area and the first wiring area on the light-receiving surface, below a straight line extending in the first direction through the upper end of the light-receiving area adjacent to the light-receiving area arranged at the end and above the upper end of the light that irradiates the main part of the light-receiving area arranged at the end.

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