A radiator

Abstract

The embodiment of the present application discloses a heat sink, including: a blowing plate, the blowing plate including a first plate body and a second plate body; a refrigeration pipeline formed on the blowing plate by circuitous bending, the refrigeration pipeline half surrounds the outer periphery of the first plate body; the first plate body and the second plate body are both provided with mutually connected blowing channels, the blowing channels are filled with superconducting medium; a heat conduction block is fitted on the first plate body, the refrigeration pipeline and the second plate body; a heat sink is provided on the side surface of the blowing plate away from the heat conduction block. The heat sink greatly improves the heat dissipation efficiency through the coordinated use of the first plate body, the second plate body, the refrigeration pipeline and the heat sink, and the heat sink has a simple structure and a small size, and can meet the large amount of heat generated by the high-power chip to be cooled in a limited heat dissipation space, and has fast cooling and high heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more specifically, this application relates to a radiator. Background Art

[0002] With the rapid development and application of 5G technology, it has been widely used in the electronics industry and communication technology, greatly improving the quality of life of the general public. For example, in the home appliance industry, through the iterative design of combining intelligent hardware technology with home appliances, the rapid development of home appliance intelligence has been qualitatively improved.

[0003] Taking the variable-frequency air conditioner as an example, as we all know, the smaller and more intelligent the air conditioner is, the higher the degree of integration of its chips and electronic circuits is required. This will cause a large amount of heat to be generated during the operation of the variable-frequency air conditioner. If the air conditioner wants to start quickly and stably and maintain a constant temperature for a long time, it needs to quickly dissipate the heat of the chips. Otherwise, it will directly cause the variable-frequency air conditioner to be unable to operate at high frequencies, or even the temperature is too high, resulting in the outdoor unit being unable to start or the chips being burned. Therefore, heat dissipation for the control system chips of variable-frequency air conditioners is very important.

[0004] Currently, the heat dissipation method for variable-frequency air conditioner chips mainly uses aluminum profiles for heat dissipation, and the fan of the air conditioner outdoor unit is used to increase the heat dissipation effect. Although heat dissipation can be achieved, the overall heat dissipation effect is not ideal. Although there are also technologies such as heat pipes, air cooling, water cooling, and liquid cooling for heat dissipation now. However, with the rapid intelligent development of the home appliance industry, air conditioners are becoming more and more highly integrated, intelligent, and delicate in structure, which places restrictions on the volume of the air conditioner while meeting the heat dissipation requirements.

[0005] The above methods are mainly for heat dissipation of circuit chips in variable-frequency air conditioners with relatively small power or chips with small heat generation power. Although the above heat dissipation technologies can all achieve heat dissipation, for the heat dissipation of variable-frequency air conditioners with a small space and a large power, it cannot fully meet the heat dissipation requirements of the air conditioner in the limited heat dissipation space. Summary of the Invention

[0006] The purpose of the present invention is to provide a radiator to solve the problem that the prior art cannot meet the heat dissipation requirements of the chips inside the product.

[0007] To achieve at least one of the above purposes, this application adopts the following technical solutions:

[0008] This application provides a radiator, including:

[0009] An extruded plate, the extruded plate includes a first plate body part and a second plate body part;

[0010] A refrigeration pipeline formed by meandering and bending on the extruded plate, the refrigeration pipeline semi-surrounds the outer periphery of the first plate body part;

[0011] Both the first plate portion and the second plate portion are provided with interconnected blowing channels filled with a superconducting working fluid.

[0012] The radiator further includes:

[0013] A heat conducting block that is adhesively disposed on the first plate portion, the refrigeration pipeline, and the second plate portion;

[0014] On the side surface of the blowing plate facing away from the side with the heat conducting block, there are heat dissipation fins.

[0015] Optionally, the first plate portion includes: a first filling port formed by extending outward from the side edge of the first plate portion; the first filling port is used to fill the blowing channel of the first plate portion with a superconducting working fluid;

[0016] The second plate portion includes: a second filling port formed by extending outward from the side edge of the second plate portion; the second filling port is used to fill the blowing channel of the second plate portion with a superconducting working fluid.

[0017] Optionally, the refrigeration pipeline includes: a first pipe portion extending along the outer side edge of the first plate portion away from the second plate portion; and

[0018] A second pipe portion formed by meandering and bending from the outer side edge of the first plate portion away from the side with the first filling port toward the side with the first filling port;

[0019] The first pipe portion and the second pipe portion are connected.

[0020] Optionally, the heat conducting block is adhesively disposed on the first pipe portion, the first plate portion, the second pipe portion, and the second plate portion in sequence.

[0021] Optionally, the first pipe portion includes a first pipe orifice;

[0022] The second pipe portion includes a second pipe orifice located between the first plate portion and the second plate portion;

[0023] The first pipe orifice, the first filling port, and the second pipe orifice are all located on the same side edge of the blowing plate.

[0024] Optionally, both the first pipe orifice and the second pipe orifice include connecting pipes connected to a refrigeration system with a compressor.

[0025] Optionally, the refrigeration pipeline is filled with a refrigerant.

[0026] Optionally, the first filling port and the second filling port are located on the same side edge of the blowing plate.

[0027] Optionally, a plurality of rolling points arranged in sequence are included on both the first plate body portion and the second plate body portion;

[0028] The gaps between adjacent rolling points communicate with each other to form the inflation channel.

[0029] Optionally, the side of the inflation plate with the heat conducting block is the inflation surface, and the surface on the opposite side is the non-inflation surface.

[0030] The beneficial effects of the present application are as follows:

[0031] Aiming at the problems existing in the current prior art, the present application provides a radiator. By arranging the refrigeration pipeline on the inflation plate, the radiator provided by the present application can achieve triple heat dissipation for the chip to be cooled; the refrigeration pipeline absorbs heat through the refrigerant therein; the inflation plate absorbs heat through the superconducting working fluid therein. The superconducting working fluid boils and vaporizes when heated and then floats to the tops of the first plate body portion and the second plate body portion. After the tops of the first plate body portion and the second plate body portion dissipate heat, the superconducting working fluid condenses and flows back to the bottoms of the first plate body portion and the second plate body portion under the action of gravity, thereby forming a circulating heat dissipation system; in addition, part of the heat in the inflation plate and the refrigeration pipeline will also be transferred to the heat sink, further improving the heat dissipation efficiency through the heat sink; the radiator provided by the present application greatly improves the heat dissipation efficiency through the combined use of the first plate body portion, the second plate body portion, the refrigeration pipeline and the heat sink, and the radiator has a simple structure and a small volume, and can meet the large amount of heat generated by the chip to be cooled with a relatively large power in a limited heat dissipation space, and has fast refrigeration and high heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The following further describes in detail the specific embodiments of the present invention with reference to the accompanying drawings.

[0033] Figure 1 Shows a schematic diagram of the overall structure of the radiator in an embodiment of the present application.

[0034] Figure 2 Shows a front view of the radiator in an embodiment of the present application.

[0035] Figure 3 Shows a front view of the radiator in an embodiment of the present application after removing the heat conducting block.

[0036] Figure 4 Shows a schematic diagram of the structure of the heat sink connected to the inflation plate in an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0037] In the following description, for purposes of explanation, in order to provide a thorough understanding of one or more embodiments, numerous specific details are set forth. It is apparent, however, that the embodiments may be practiced without these specific details.

[0038] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application. Unless otherwise clearly specified and defined, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0039] It should also be noted that in the description of the present application, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including", or any other variation thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or device. Without further limitation, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0040] To solve the problems existing in the prior art, an embodiment of the present application provides a radiator, as Figures 1-4 shown, comprising: an extruded plate 1, the extruded plate 1 including a first plate body portion 11 and a second plate body portion 12; a refrigeration pipeline 2 formed by meandering and bending on the extruded plate 1, the refrigeration pipeline 2 semi-surrounding the outer periphery of the first plate body portion 11; a refrigerant filled in the refrigeration pipeline 2; the refrigeration pipeline 2 is connected to a refrigeration system with a compressor, a condenser, etc.; mutually communicating blow-up channels 13 are provided in both the first plate body portion 11 and the second plate body portion 12, and a superconducting working medium is filled in the blow-up channels 13; the radiator further includes: a heat conducting block 3 attached to the first plate body portion 11, the refrigeration pipeline 2, and the second plate body portion 12; heat dissipation fins 4 are provided on a surface of the extruded plate 1 facing away from the side having the heat conducting block 3.

[0041] In the above embodiments, by arranging the refrigeration pipeline 2 on the expansion plate 1, the radiator provided by the present application can achieve triple heat dissipation for the chip to be cooled; the refrigeration pipeline 2 absorbs heat through the refrigerant therein; the expansion plate 1 absorbs heat through the superconducting working medium therein, and the superconducting working medium boils and vaporizes when heated and then floats to the tops of the first plate part 11 and the second plate part 12. After the tops of the first plate part 11 and the second plate part 12 dissipate heat, the superconducting working medium condenses and then flows back to the bottoms of the first plate part 11 and the second plate part 12 under the action of gravity, thus forming a circulating heat dissipation system; in addition, part of the heat in the expansion plate 1 and the refrigeration pipeline 2 will also be transferred to the heat sink 4 to further improve the heat dissipation efficiency through the heat sink 4; through the combined use of the first plate part 11, the second plate part 12, the refrigeration pipeline 2 and the heat sink 4, the radiator provided by the present application greatly improves the heat dissipation efficiency, and the radiator has a simple structure and a small volume, and can meet the large amount of heat generated by the chip to be cooled with a relatively large power in a limited heat dissipation space, and has fast refrigeration and high heat dissipation efficiency.

[0042] Specifically, the heat dissipation method adopted by the above-mentioned first plate part 11 and second plate part 12 is passive heat dissipation; the principle is that when the chip to be cooled generates heat, the superconducting working medium at the bottoms of the first plate part 11 and the second plate part 12 will boil and vaporize when heated and then float to the tops of the first plate part 11 and the second plate part 12. After the tops of the first plate part 11 and the second plate part 12 dissipate heat, the superconducting working medium condenses and then flows back to the bottoms of the first plate part 11 and the second plate part 12 under the action of gravity, thus forming a passive cycle of the whole heat absorption and heat dissipation process. This cycle method can achieve the passive heat dissipation of the radiator without any power. The heat dissipation method adopted by the above-mentioned refrigeration pipeline 2 is active heat dissipation; the principle is that when the chip to be cooled generates heat, the refrigerant in the refrigeration pipeline 2 absorbs heat and evaporates, and under the action of a refrigeration system with a compressor, the refrigerant in the refrigeration pipeline 2 is circulated to ensure that the temperature of the refrigeration pipeline 2 is in a relatively low state, thus realizing the active cycle of the whole refrigeration pipeline 2. This cycle method realizes the active heat dissipation of the radiator by using a refrigeration system with a compressor. The combination of passive heat dissipation and active heat dissipation enables the radiator provided by the present application to rapidly reduce the temperature of the chip to be cooled when dissipating heat from the chip to be cooled; and can rapidly cool the chip to be cooled in a limited space without increasing the cost.

[0043] Since the first plate part 11, the second plate part 12 and the refrigeration pipeline 2 belong to three independent heat dissipation systems, in practical applications, the heat dissipation method can be selected according to the actual situation.

[0044] In practical applications, if the first plate body portion 11, the second plate body portion 12, and the refrigeration pipeline 2 work simultaneously, the superconducting working fluid in the blowing channels 13 of the first plate body portion 11 and the second plate body portion 12 adjacent to the refrigeration pipeline 2 will have its temperature reduced due to the influence of the refrigeration pipeline 2. At this time, the first plate body portion 11 and the second plate body portion 12 can absorb more heat, further improving the heat dissipation efficiency of the radiator provided in this application.

[0045] In a specific embodiment, the first plate body portion 11 includes: a first filling port 111 formed by extending outward from the side edge of the first plate body portion 11; the first filling port 111 is used to fill the blowing channel 13 of the first plate body portion 11 with superconducting working fluid; the second plate body portion 12 includes: a second filling port 121 formed by extending outward from the side edge of the second plate body portion 12; the second filling port 121 is used to fill the blowing channel 13 of the second plate body portion 12 with superconducting working fluid. The first filling port 111 is located on the unenclosed side of the first plate body portion 11. The second filling port 121 can be located on the same side of the second plate body portion 12 as the first plate body portion 11 has the first filling port 111, or can be located on the side of the second plate body portion 12 opposite to the side where the first plate body portion 11 has the first filling port 111, and is set according to the actual situation.

[0046] In a specific embodiment, the refrigeration pipeline 2 includes: a first pipe body portion 21 formed by extending along the outer side of the edge of the first plate body portion 11 away from the second plate body portion 12; and a second pipe body portion 22 formed by meandering and bending from the outer side of the edge of the first plate body portion 11 away from the side with the first filling port 111 towards the side with the first filling port 111; the first pipe body portion 21 and the second pipe body portion 22 are connected. As Figure 3 shown, the second pipe body portion 22 is located between the first plate body portion 11 and the second plate body portion 12 and is arranged in a meandering and bending form, which can increase the area on the blowing plate 1, thereby enhancing the heat dissipation effect of the refrigeration pipeline 2 on the chip to be cooled. Of course, in practical applications, the shape of the second pipeline can also be set according to the actual situation; in a specific example, the heat conducting block 3 is sequentially attached to the first pipe body portion 21, the first plate body portion 11, the second pipe body portion 22, and the second plate body portion 12. In this way, after the heat conducting block 3 absorbs the heat on the chip to be cooled, it can directly transfer the heat to the first pipe body portion 21, the first plate body portion 11, the second pipe body portion 22, and the second plate body portion 12 to cool the chip to be cooled, greatly improving the heat dissipation efficiency.

[0047] Furthermore, the first tube body 21 includes a first pipe opening 211; the second tube body 22 includes a second pipe opening 221 located between the first plate body 11 and the second plate body 12; the first pipe opening 211, the first filling port 111 and the second pipe opening 221 are respectively located on the same side edge of the blowing plate 1. Preferably, the first filling port 111 and the second filling port 121 are located on the same side edge of the blowing plate 1, that is, the first pipe opening 211, the first filling port 111, the second pipe opening 221 and the second filling port 121 are respectively located on the same side edge of the blowing plate 1. Such a design makes the structure of the entire radiator simple and compact, occupies less space, and is more convenient when the entire refrigeration pipeline 2 is connected to a refrigeration system with a compressor.

[0048] Furthermore, the first pipe opening 211 and the second pipe opening 221 both include a connecting pipe 5 connected to a refrigeration system with a compressor. In practical applications, the refrigerant is poured into the refrigeration pipeline 2 through the first pipe opening 211 and the second pipe opening 221, and then the first pipe opening 211 and the second pipe opening 221 are sealed, and then the connecting pipe 5 is welded at the first pipe opening 211 and the second pipe opening 221, and the refrigerant or other liquid is poured into the refrigeration pipeline 2 through the connecting pipe 5; finally, the refrigeration system with a compressor is connected to the connecting pipe 5, and here, the connecting pipe 5 is actually connected to the compressor; when the refrigeration system with a compressor is in the working room, the refrigeration pipeline 2 can achieve heat dissipation.

[0049] In a specific embodiment, the heat conductive block 3 and the heat sink 4 can be respectively arranged on one side surface and the other opposite side surface of the blowing plate 1 by brazing; a process combining sintering and brazing can also be used to make the connection between the heat conductive block 3 and the heat sink 4 and the blowing plate 1 more stable; of course, in actual applications, after welding is completed, thermal conductive glue can also be used to fill the gap between the heat conductive block 3 and the blowing plate 1 and the gap between the heat sink 4 and the blowing plate 1, so as to further enhance the stability of the connection between the heat conductive block 3 and the heat sink 4 and the blowing plate 1. In actual applications, after the heat conductive block 3 and the heat sink 4 are respectively welded to the blowing plate 1, superconducting medium is injected into the first plate body 11 and the second plate body 12 through the first filling port 111 and the second filling port 121 respectively, and refrigerant is poured into the refrigeration pipeline 2 through the first pipe port 211 and the second pipe port 221. After the filling is completed, the first filling port 111 and the second filling port 121 are closed, and the two connecting pipes 5 are respectively welded to the first pipe port 211 and the second pipe port 221; welding can be used to close the first filling port 111 and the second filling port 121.

[0050] In a specific embodiment, the heat conducting block 3 can be made of a high thermal conductivity material, such as an aluminum block or a copper block; it can be brazed and welded on the first pipe part, the first plate part 11, the second pipe part and the second pipe part 22. The heat sink 4 can be formed by bending in a circuitous manner, and such a design makes the heat sink 4 have a larger heat dissipation area and higher heat dissipation efficiency; of course, without affecting the use effect of the present application, the heat sink 4 can also be a fin, a fin, a folded sheet and a hobbing sheet, without limitation; here, the heat sink 4 can be a composite material, and its thickness is preferably 0.5 mm, and is not limited to composite materials.

[0051] In a specific embodiment, the first plate body 11 and the second plate body 12 each include a plurality of sequentially arranged nip points 14; the cross-sectional shape of the nip point 14 may be circular, elliptical or polygonal; wherein, when the cross-sectional shape of the nip point 14 is polygonal, the edge of the nip point 14 is rounded; thus, it is beneficial for the superconducting medium to flow along the nip points 14 in the blowing channel 13; the gaps between adjacent nip points 14 are interconnected to form the blowing channel 13;

[0052] In a specific embodiment, the side of the blowing plate 1 having the heat conductive block 3 is a blowing surface, and the other opposite side surface is a blowing surface or a non-blowing surface, that is, the side surface of the blowing plate 1 facing away from the heat conductive block 3 is a blowing surface or a non-blowing surface; the design is performed according to actual conditions.

[0053] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A radiator, characterized in that, include: A blowing plate, the blowing plate comprising a first plate body and a second plate body; A refrigeration pipeline is formed on the inflation plate by circuitous bending, and the refrigeration pipeline is half surrounded by the outer periphery of the first plate body; The first plate body and the second plate body are both provided with interconnected inflation channels, and the inflation channels are filled with superconducting working medium; The radiator further comprises: A heat conduction block disposed on the first plate portion, the refrigeration pipeline and the second plate portion; A heat sink is arranged on a surface of the blowing plate that is away from the heat conducting block.

2. The heat sink according to claim 1, characterized in that: The first plate body portion comprises: a first filling port formed by extending outward from the side edge of the first plate body portion; the first filling port is used to fill the superconducting working medium into the inflation channel of the first plate body portion; The second plate body portion comprises: a second filling port formed by extending outwardly from the side edge of the second plate body portion; the second filling port is used for filling the superconducting working medium into the inflation channel of the second plate body portion.

3. The heat sink according to claim 2, characterized in that: The refrigeration pipeline comprises: a first tube body portion extending along the outer side of a side edge of the first plate body portion away from the second plate body portion; and A second tube portion formed by bending from the outer side of a side edge of the first plate portion away from the first filling port toward the side having the first filling port; The first tube body portion is communicated with the second tube body portion.

4. The heat sink according to claim 3, characterized in that: The heat conducting block is sequentially arranged on the first tube body portion, the first plate body portion, the second tube body portion and the second plate body portion.

5. The heat sink according to claim 3, characterized in that: The first tube body portion includes a first tube opening; The second tube body portion includes a second tube opening located between the first plate body portion and the second plate body portion; The first pipe opening, the first filling opening and the second pipe opening are respectively located on the same side edge of the blowing plate.

6. The heat sink according to claim 5, characterized in that The first pipe opening and the second pipe opening both include connecting pipes connected to a refrigeration system with a compressor.

7. The heat sink according to claim 1, characterized in that: The refrigeration pipeline is filled with refrigerant.

8. The heat sink according to claim 2, characterized in that: The first filling port and the second filling port are located on the same side edge of the blowing plate.

9. The heat sink according to claim 1, characterized in that: The first plate body and the second plate body both include a plurality of sequentially arranged nip points; The gaps between adjacent nip points are interconnected to form the inflation channel.

10. The heat sink according to claim 1, characterized in that The one side of the inflation plate with the heat conducting block is the inflation surface, and the other side surface opposite to the inflation plate is the non-inflation surface.

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