Laminated coil component

Abstract

This invention relates to a laminated coil component. The laminated coil component comprises: a substrate formed by laminating multiple insulating layers in a lamination direction, having a first end face and a second end face opposed in the length direction, a first main face and a second main face opposed in a height direction orthogonal to the length direction, and a first side face and a second side face opposed in a width direction orthogonal to the length and height directions; a coil disposed inside the substrate and formed by electrically connecting multiple coil conductors; and a first external electrode extending from at least a portion of the first end face of the substrate across a portion of the first main face and electrically connected to the coil, wherein the lamination direction of the insulating layers and the direction of the coil axis are parallel to the first main face of the substrate, which serves as a mounting surface; and at least a portion of the substrate contains a magnetic phase comprising Fe, Ni, Zn, and Cu and a non-magnetic phase comprising Si.

Description

Technical Field

[0001] This invention relates to laminated coil components. Background Technology

[0002] As a stacked coil component with excellent high-frequency characteristics, Patent Document 1 discloses a stacked coil component with a transmission coefficient S21 of -1.0dB or more and 0dB or less at 40GHz.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-186255

[0004] However, with the development of high-speed and high-capacity communication, it is required that the transmission coefficient S21 of the stacked coil component be large up to higher frequency bands, and that the deviation of the transmission coefficient S21 up to the high frequency band be small. Summary of the Invention

[0005] The present invention was made to solve the above-mentioned problems, and its purpose is to provide a stacked coil component with a large transmission coefficient S21 and a small deviation in the high-frequency band.

[0006] The laminated coil component of the present invention is characterized by comprising: a substrate, which is formed by laminating multiple insulating layers in a lamination direction and has a first end face and a second end face facing each other in a length direction, a first main face and a second main face facing each other in a height direction orthogonal to the length direction, and a first side face and a second side face facing each other in a width direction orthogonal to the length direction and the height direction; a coil disposed inside the substrate and formed by electrically connecting multiple coil conductors; and a first external electrode extending from at least a portion of the first end face of the substrate and extending over a portion of the first main face, and electrically connected to the coil, wherein the lamination direction of the insulating layers and the coil axis of the coil are... The direction is parallel to the first main surface of the substrate, which serves as the mounting surface. At least a portion of the substrate contains a magnetic phase comprising Fe, Ni, Zn, and Cu, and a non-magnetic phase comprising Si. The first external electrode has a base electrode and a plating electrode disposed on the base electrode in sequence from the substrate side. The end of the portion of the plating electrode present on the first main surface of the substrate in the length direction is located closer to the second end face of the substrate than the end of the portion of the base electrode present on the first main surface of the substrate in the length direction. The distance in the length direction between the end of the plating electrode and the end of the base electrode is 30 μm or less.

[0007] According to the present invention, a stacked coil component with a large transmission coefficient S21 and a small deviation in the high-frequency band can be provided. Attached Figure Description

[0008] Figure 1 This is a perspective view showing an example of a stacked coil component of the present invention.

[0009] Figure 2 This indicates the view from the first end face of the substrate. Figure 1 A planar schematic diagram of the state of the stacked coil component.

[0010] Figure 3 This indicates the view from the first principal plane of the matrix. Figure 1 A planar schematic diagram of the state of the stacked coil component.

[0011] Figure 4 This indicates viewing from the first side of the substrate. Figure 1 A planar schematic diagram of the state of the stacked coil component.

[0012] Figure 5 This indicates viewing from the second side of the substrate. Figure 1 A planar schematic diagram of the state of the stacked coil component.

[0013] Figure 6 This indicates the view from the second end face of the substrate. Figure 1 A planar schematic diagram of the state of the stacked coil component.

[0014] Figure 7 It means and Figure 1 A cross-sectional schematic diagram of an example of the portion corresponding to line segment A1-A2 in the diagram.

[0015] Figure 8 It means to Figure 7 A three-dimensional schematic diagram of an example of the state of the substrate and coil after disassembly.

[0016] Figure 9 It means to Figure 7 A planar schematic diagram of an example of the state of the substrate and coil after disassembly.

[0017] Figure 10 yes Figure 1 A side view of the stacked coil component.

[0018] Figure 11 It means Figure 10 A schematic diagram of a portion of the cross-section of the first substrate and the first external electrode along the length and height directions.

[0019] Figure 12 It means Figure 10 A schematic diagram of a portion of the cross-section of the second substrate and the second external electrode along the length and height directions.

[0020] Figure 13 This is a graph showing the measurement results of the transmission coefficient S21 of samples 1, 3 and 4 of the stacked coil component.

[0021] Explanation of reference numerals in the attached figures

[0022] 1…Laminated coil component; 10…Substrate; 11a…First end face; 11b…Second end face; 12a…First main face; 12b…Second main face; 13a…First side face; 13b…Second side face; 15, 15a, 15b, 15c, 15d, 15e…Insulating layer; 21…First external electrode; 21a, 22a…Base electrode; 21aa, 22aa…Long length end of the portion of the base electrode present on the first main face of the substrate; 21b, 22b…Platinum electrode; 21ba, 22ba…Long length end of the portion of the plating electrode present on the first main face of the substrate; 22…Second external electrode; 30…Coil; 31, 31a, 31b, 31c, 31d…Coil conductor; 34a, 34b, 34c, 34d, 34e…Through hole conductor; 41…First connecting conductor; 42…Second connecting conductor; 50a…First contour line; 50b…Second contour line; 50c…Third contour line; 50d…Fourth contour line; 50e…Fifth contour line; 50g…Seventh contour line; 50h…Eighth contour line; 61…First base portion; 61a, 62a…First region; 61aa, 62ab…Second end face side of the first region Part; 61ab, 62aa… Ends on the first end face side of the first region; 61b, 62b… Second region; 62… Second substrate portion; a, b… Distance in the length direction between the end of the portion of the plated electrode present on the first main surface of the substrate and the end of the portion of the base electrode present on the first main surface of the substrate; C… Coil shaft; E1… Dimension in the height direction of the first external electrode; E2… Dimension in the length direction of the first external electrode; E3… Dimension in the height direction of the second external electrode; E4… Dimension in the length direction of the second external electrode; G… Interface; H 1…First reference position; H2…Second reference position; L…Length direction; L1…Dimension in the length direction of the stacked coil component; L2…Dimension in the length direction of the substrate; L3…Dimension in the length direction of the coil; P1, P2…Dimensions or distances in the length direction from the first reference position; Q1, Q2…Dimensions or distances in the length direction from the second reference position; T…Height direction; T1…Dimension in the height direction of the stacked coil component; T2…Dimension in the height direction of the substrate; W…Width direction; W1…Dimension in the width direction of the stacked coil component; W2…Dimension in the width direction of the substrate. Detailed Implementation

[0023] The laminated coil component of the present invention will now be described. Furthermore, the present invention is not limited to the following structures, and appropriate modifications can be made without departing from the spirit of the invention. Additionally, the present invention also includes structures that combine multiple of the preferred structures described below.

[0024] The stacked coil component of the present invention comprises: a substrate formed by stacking a plurality of insulating layers in a stacking direction, and having a first end face and a second end face opposed in the length direction, a first main face and a second main face opposed in the height direction orthogonal to the length direction, and a first side face and a second side face opposed in the width direction orthogonal to the length and height directions; a coil disposed inside the substrate and formed by electrically connecting a plurality of coil conductors; and a first external electrode extending from at least a portion of the first end face of the substrate throughout a portion of the first main face and electrically connected to the coil.

[0025] Figure 1 This is a perspective view showing an example of a stacked coil component of the present invention.

[0026] like Figure 1 As shown, the stacked coil component 1 has a base 10, a first external electrode 21, and a second external electrode 22. Although in Figure 1 Not shown in the figure, but as described later, the stacked coil component 1 also has a coil disposed inside the base 10.

[0027] In this instruction manual, such as Figure 1 As shown, the length, height, and width directions are defined by L, T, and W, respectively. Here, the length direction L, height direction T, and width direction W are orthogonal to each other.

[0028] The substrate 10 has a first end face 11a and a second end face 11b opposite each other in the length direction L, a first main face 12a and a second main face 12b opposite each other in the height direction T, and a first side face 13a and a second side face 13b opposite each other in the width direction W, for example, it is cuboid or substantially cuboid.

[0029] The first end face 11a and the second end face 11b of the substrate 10 do not need to be strictly orthogonal to the length direction L. Furthermore, the first main face 12a and the second main face 12b of the substrate 10 do not need to be strictly orthogonal to the height direction T. Additionally, the first side face 13a and the second side face 13b of the substrate 10 do not need to be strictly orthogonal to the width direction W.

[0030] When the stacked coil component 1 is mounted on the substrate, the first main surface 12a of the substrate 10 becomes the mounting surface.

[0031] Preferably, the substrate 10 has rounded corners and edges. The corners of the substrate 10 are the parts where three faces of the substrate 10 intersect. The edges of the substrate 10 are the parts where two faces of the substrate 10 intersect.

[0032] Figure 2 This indicates the view from the first end face of the substrate. Figure 1 A planar schematic diagram of the state of the stacked coil component. Figure 3 This indicates the view from the first principal plane of the matrix. Figure 1 A planar schematic diagram of the state of the stacked coil component. Figure 4 This indicates viewing from the first side of the substrate. Figure 1 A planar schematic diagram of the state of the stacked coil component. Figure 5 This indicates viewing from the second side of the substrate. Figure 1 A planar schematic diagram of the state of the stacked coil component. Figure 6 This indicates the view from the second end face of the substrate. Figure 1 A planar schematic diagram of the state of the stacked coil component.

[0033] like Figure 1 , Figure 2 as well as Figure 3 As shown, the first external electrode 21 extends from at least a portion of the first end face 11a of the substrate 10, and here extends from a portion of the first end face 11a of the substrate 10 to a portion of the first main face 12a. If the first external electrode 21 is provided on the first main face 12a of the substrate 10, which serves as a mounting surface, the mountability of the stacked coil component 1 is improved.

[0034] like Figure 2 As shown, the first external electrode 21 covers the region of the first end face 11a of the substrate 10 that includes the ridge portion intersecting with the first main face 12a, but does not cover the region that includes the ridge portion intersecting with the second main face 12b. Therefore, the first end face 11a of the substrate 10 is exposed in the region that includes the ridge portion intersecting with the second main face 12b.

[0035] When viewed from the length direction L, the dimension E1 of the first external electrode 21 in the height direction T is... Figure 2 The width W is constant, but it may not be constant. For example, when viewed from the length direction L, the first outer electrode 21 may also be a mountain-shaped structure whose dimension E1 in the height direction T increases along the width direction W from the end toward the center.

[0036] The first external electrode 21 can be as follows: Figure 1 and Figure 2 The shown arrangement is on a portion of the first end face 11a of the substrate 10, or it can be arranged on the entire first end face 11a of the substrate 10.

[0037] like Figure 3 As shown, the first external electrode 21 covers the region of the first main surface 12a of the substrate 10 that includes the ridge portion intersecting with the first end surface 11a, but does not cover the region that includes the ridge portion intersecting with the second end surface 11b.

[0038] When viewed from the height direction T, the dimension E2 of the first external electrode 21 in the length direction L is... Figure 3 The width W is constant, but it may not be constant. For example, when viewed from the height T, the first outer electrode 21 may also be a mountain-shaped structure whose dimension E2 in the length L increases along the width W from the end toward the center.

[0039] like Figure 1 , Figure 4 as well as Figure 5 As shown, the first external electrode 21 can extend from a portion of the first end face 11a of the substrate 10, across a portion of the first main face 12a, a portion of the first side face 13a, and a portion of the second side face 13b. More specifically, the first external electrode 21 can cover the region of the first side face 13a of the substrate 10 that includes the vertices intersecting with the first end face 11a and the first main face 12a, but does not cover the region that includes the vertices intersecting with the first end face 11a and the second main face 12b. Similarly, the first external electrode 21 can cover the region of the second side face 13b of the substrate 10 that includes the vertices intersecting with the first end face 11a and the first main face 12a, but does not cover the region that includes the vertices intersecting with the first end face 11a and the second main face 12b.

[0040] like Figure 4 As shown, preferably in the first external electrode 21, the outline of the portion covering the first side surface 13a of the substrate 10 includes, in addition to the first outline 50a which is opposite to the ridge portion intersecting the first side surface 13a and the first end surface 11a, and the second outline 50b which is opposite to the ridge portion intersecting the first side surface 13a and the first main surface 12a, an outline that is inclined relative to the first outline 50a and the second outline 50b.

[0041] like Figure 5 As shown, preferably in the first external electrode 21, the outline of the portion covering the second side surface 13b of the substrate 10 includes, in addition to the third outline 50c which is opposite to the ridge portion intersecting the second side surface 13b and the first end surface 11a, and the fourth outline 50d which is opposite to the ridge portion intersecting the second side surface 13b and the first main surface 12a, an outline that is inclined relative to the third outline 50c and the fourth outline 50d.

[0042] The first external electrode 21 may not be provided on the first side surface 13a of the substrate 10. Alternatively, the first external electrode 21 may not be provided on the second side surface 13b of the substrate 10.

[0043] The first external electrode 21 may also extend from the first end face 11a of the substrate 10 to a portion of each of the first main face 12a, the second main face 12b, the first side face 13a, and the second side face 13b.

[0044] like Figure 1 , Figure 3 as well as Figure 6 As shown, the second external electrode 22 extends from at least a portion of the second end face 11b of the substrate 10, and here from a portion of the second end face 11b of the substrate 10, across a portion of the first main face 12a. If the second external electrode 22 is provided on the first main face 12a of the substrate 10, which serves as the mounting surface, the mountability of the stacked coil component 1 is improved.

[0045] like Figure 6 As shown, the second external electrode 22 covers the region of the second end face 11b of the substrate 10 that includes the ridge portion intersecting with the first main face 12a, but does not cover the region that includes the ridge portion intersecting with the second main face 12b. Therefore, the second end face 11b of the substrate 10 is exposed in the region that includes the ridge portion intersecting with the second main face 12b.

[0046] When viewed from the length direction L, the dimension E3 of the second external electrode 22 in the height direction T is... Figure 6 The width W is constant, but it may not be constant. For example, when viewed from the length direction L, the second outer electrode 22 may also be a mountain-shaped structure with a dimension E3 in the height direction T that increases along the width direction W from the end toward the center.

[0047] The second external electrode 22 can be as follows: Figure 1 and Figure 6 The shown arrangement is on a portion of the second end face 11b of the substrate 10, or it can be arranged on the entire second end face 11b of the substrate 10.

[0048] like Figure 3 As shown, the second external electrode 22 covers the region of the first main surface 12a of the substrate 10 that includes the ridge portion intersecting with the second end surface 11b, but does not cover the region that includes the ridge portion intersecting with the first end surface 11a.

[0049] When viewed from the height direction T, the dimension E4 of the second external electrode 22 in the length direction L is... Figure 3The width W is constant, but it may not be constant. For example, when viewed from the height T, the second outer electrode 22 may also be a mountain-shaped structure whose dimension E4 in the length L increases along the width W from the end toward the center.

[0050] like Figure 1 , Figure 4 as well as Figure 5 As shown, the second external electrode 22 can extend from a portion of the second end face 11b of the substrate 10, across a portion of the first main face 12a, a portion of the first side face 13a, and a portion of the second side face 13b. More specifically, the second external electrode 22 can cover the region of the first side face 13a of the substrate 10 that includes the vertices intersecting with the second end face 11b and the first main face 12a, but does not cover the region that includes the vertices intersecting with the second end face 11b and the second main face 12b. Additionally, the second external electrode 22 can cover the region of the second side face 13b of the substrate 10 that includes the vertices intersecting with the second end face 11b and the first main face 12a, but does not cover the region that includes the vertices intersecting with the second end face 11b and the second main face 12b.

[0051] like Figure 4 As shown, preferably in the second external electrode 22, the outline of the portion covering the first side surface 13a of the substrate 10 includes, in addition to the fifth outline 50e which is opposite to the ridge portion intersecting the first side surface 13a and the second end surface 11b, and the sixth outline 50f which is opposite to the ridge portion intersecting the first side surface 13a and the first main surface 12a, an outline that is inclined relative to the fifth outline 50e and the sixth outline 50f.

[0052] like Figure 5 As shown, preferably in the second external electrode 22, the outline of the portion covering the second side surface 13b of the substrate 10 includes, in addition to the seventh outline 50g which is opposite to the ridge portion intersecting the second side surface 13b and the second end surface 11b, and the eighth outline 50h which is opposite to the ridge portion intersecting the second side surface 13b and the first main surface 12a, an outline that is inclined relative to the seventh outline 50g and the eighth outline 50h.

[0053] The second external electrode 22 may not be provided on the first side surface 13a of the substrate 10. Alternatively, the second external electrode 22 may not be provided on the second side surface 13b of the substrate 10.

[0054] The second external electrode 22 may also extend from the second end face 11b of the substrate 10 to a portion of each of the first main face 12a, the second main face 12b, the first side face 13a, and the second side face 13b.

[0055] The size of the stacked coil component 1 is not particularly limited, but is preferably 0603, 0402 or 1005.

[0056] For cases where the stacked coil component 1 has dimensions of 0603, 0402, or 1005, the following are specific examples of preferred dimensions for the stacked coil component 1, the substrate 10, the first external electrode 21, and the second external electrode 22.

[0057] (1) When the laminated coil component 1 is 0603 in size

[0058] • The dimension L1 in the longitudinal direction L of the laminated coil component 1 is preferably 0.57 mm or more. Furthermore, the dimension L1 in the longitudinal direction L of the laminated coil component 1 is preferably 0.63 mm or less.

[0059] • The dimension T1 in the height direction T of the stacked coil component 1 is preferably 0.27 mm or more. Furthermore, the dimension T1 in the height direction T of the stacked coil component 1 is preferably 0.33 mm or less.

[0060] • The dimension W1 in the width direction W of the laminated coil component 1 is preferably 0.27 mm or more. Furthermore, the dimension W1 in the width direction W of the laminated coil component 1 is preferably 0.33 mm or less.

[0061] • The dimension L2 in the length direction L of the substrate 10 is preferably 0.57 mm or more. Furthermore, the dimension L2 in the length direction L of the substrate 10 is preferably 0.63 mm or less.

[0062] • The dimension T2 in the height direction T of the substrate 10 is preferably 0.27 mm or more. Furthermore, the dimension T2 in the height direction T of the substrate 10 is preferably 0.33 mm or less.

[0063] • The dimension W2 in the width direction W of the substrate 10 is preferably 0.27 mm or more. Furthermore, the dimension W2 in the width direction W of the substrate 10 is preferably 0.33 mm or less.

[0064] • The dimension E1 in the height direction T of the first external electrode 21 is preferably 0.10 mm or more and 0.20 mm or less. Furthermore, when the dimension E1 in the height direction T of the first external electrode 21 is not constant along the width direction W, its maximum value is preferably within the above range.

[0065] • The dimension E2 of the first external electrode 21 along the length direction L is preferably 0.12 mm or more and 0.22 mm or less. Furthermore, if the dimension E2 of the first external electrode 21 along the length direction L is not constant along the width direction W, its maximum value is preferably within the above range.

[0066] • The dimension E3 in the height direction T of the second external electrode 22 is preferably 0.10 mm or more and 0.20 mm or less. Furthermore, when the dimension E3 in the height direction T of the second external electrode 22 is not constant along the width direction W, its maximum value is preferably within the above range.

[0067] • The dimension E4 of the second external electrode 22 in the length direction L is preferably 0.12 mm or more and 0.22 mm or less. Furthermore, if the dimension E4 of the second external electrode 22 in the length direction L is not constant along the width direction W, its maximum value is preferably within the above range.

[0068] (2) When the laminated coil component 1 is 0402 in size

[0069] • The dimension L1 in the longitudinal direction L of the laminated coil component 1 is preferably 0.38 mm or more. Furthermore, the dimension L1 in the longitudinal direction L of the laminated coil component 1 is preferably 0.42 mm or less.

[0070] • The dimension T1 in the height direction T of the stacked coil component 1 is preferably 0.18 mm or more. Furthermore, the dimension T1 in the height direction T of the stacked coil component 1 is preferably 0.22 mm or less.

[0071] • The dimension W1 in the width direction W of the laminated coil component 1 is preferably 0.18 mm or more. Furthermore, the dimension W1 in the width direction W of the laminated coil component 1 is preferably 0.22 mm or less.

[0072] • The dimension L2 in the length direction L of the substrate 10 is preferably 0.38 mm or more. Furthermore, the dimension L2 in the length direction L of the substrate 10 is preferably 0.42 mm or less.

[0073] • The dimension T2 in the height direction T of the substrate 10 is preferably 0.18 mm or more. Furthermore, the dimension T2 in the height direction T of the substrate 10 is preferably 0.22 mm or less.

[0074] • The dimension W2 in the width direction W of the substrate 10 is preferably 0.18 mm or more. Furthermore, the dimension W2 in the width direction W of the substrate 10 is preferably 0.22 mm or less.

[0075] • The dimension E1 in the height direction T of the first external electrode 21 is preferably 0.06 mm or more and 0.13 mm or less. Furthermore, when the dimension E1 in the height direction T of the first external electrode 21 is not constant along the width direction W, its maximum value is preferably within the above range.

[0076] • The dimension E2 of the first external electrode 21 along the length direction L is preferably 0.08 mm or more and 0.15 mm or less. Furthermore, if the dimension E2 of the first external electrode 21 along the length direction L is not constant along the width direction W, its maximum value is preferably within the above range.

[0077] • The dimension E3 in the height direction T of the second external electrode 22 is preferably 0.06 mm or more and 0.13 mm or less. Furthermore, when the dimension E3 in the height direction T of the second external electrode 22 is not constant along the width direction W, its maximum value is preferably within the above range.

[0078] • The dimension E4 of the second external electrode 22 in the length direction L is preferably 0.08 mm or more and 0.15 mm or less. Furthermore, if the dimension E4 of the second external electrode 22 in the length direction L is not constant along the width direction W, its maximum value is preferably within the above range.

[0079] (3) When the laminated coil component 1 is 1005 in size

[0080] • The dimension L1 in the longitudinal direction L of the laminated coil component 1 is preferably 0.95 mm or more. Furthermore, the dimension L1 in the longitudinal direction L of the laminated coil component 1 is preferably 1.05 mm or less.

[0081] • The dimension T1 in the height direction T of the stacked coil component 1 is preferably 0.45 mm or more. Furthermore, the dimension T1 in the height direction T of the stacked coil component 1 is preferably 0.55 mm or less.

[0082] • The dimension W1 in the width direction W of the laminated coil component 1 is preferably 0.45 mm or more. Furthermore, the dimension W1 in the width direction W of the laminated coil component 1 is preferably 0.55 mm or less.

[0083] • The dimension L2 in the length direction L of the substrate 10 is preferably 0.95 mm or more. Alternatively, the dimension L2 in the length direction L of the substrate 10 is preferably 1.05 mm or less.

[0084] • The dimension T2 in the height direction T of the substrate 10 is preferably 0.45 mm or more. Furthermore, the dimension T2 in the height direction T of the substrate 10 is preferably 0.55 mm or less.

[0085] • The dimension W2 in the width direction W of the substrate 10 is preferably 0.45 mm or more. Furthermore, the dimension W2 in the width direction W of the substrate 10 is preferably 0.55 mm or less.

[0086] • The dimension E1 in the height direction T of the first external electrode 21 is preferably 0.15 mm or more and 0.33 mm or less. Furthermore, when the dimension E1 in the height direction T of the first external electrode 21 is not constant along the width direction W, its maximum value is preferably within the above range.

[0087] • The dimension E2 of the first external electrode 21 along the length direction L is preferably 0.20 mm or more and 0.38 mm or less. Furthermore, if the dimension E2 of the first external electrode 21 along the length direction L is not constant along the width direction W, its maximum value is preferably within the above range.

[0088] • The dimension E3 in the height direction T of the second external electrode 22 is preferably 0.15 mm or more and 0.33 mm or less. Furthermore, when the dimension E3 in the height direction T of the second external electrode 22 is not constant along the width direction W, its maximum value is preferably within the above range.

[0089] • The dimension E4 of the second external electrode 22 along the length direction L is preferably 0.20 mm or more and 0.38 mm or less. Furthermore, if the dimension E4 of the second external electrode 22 along the length direction L is not constant along the width direction W, its maximum value is preferably within the above range.

[0090] In the stacked coil component of the present invention, the stacking direction of the insulating layer and the direction of the coil axis are parallel to the first main surface of the substrate, which serves as the mounting surface.

[0091] Figure 7 It means and Figure 1 A cross-sectional schematic diagram of an example of the portion corresponding to line segment A1-A2 in the diagram.

[0092] like Figure 7 As shown, the substrate 10 is formed by stacking multiple insulating layers 15 in a stacking direction, here in the longitudinal direction L. That is, the stacking direction of the insulating layers 15 is parallel to the longitudinal direction L and parallel to the first main surface 12a of the substrate 10, which serves as the mounting surface. Furthermore, in Figure 7 For ease of explanation, the boundaries of these insulating layers 15 are shown, but in reality, the boundaries are not clearly visible.

[0093] A coil 30 is disposed inside the substrate 10. The coil 30 is formed by electrically connecting a plurality of coil conductors 31, for example, in a solenoid shape. The coil conductors 31 are stacked together with the insulating layer 15 in the longitudinal direction L. Furthermore, in Figure 7 The shape of the coil 30, the position of the coil conductor 31, and the connection of the coil conductor 31 are not strictly shown. For example, adjacent coil conductors 31 in the length direction L are connected via... Figure 7 The conductors in the through holes (not shown) are electrically connected to each other.

[0094] The coil 30 has a coil axis C. The coil axis C of the coil 30 extends along the length direction L and passes between the first end face 11a and the second end face 11b of the base 10. That is, the direction of the coil axis C of the coil 30 is parallel to the first main face 12a of the base 10, which serves as the mounting surface. In addition, the coil axis C of the coil 30 passes through the center of the shape of the coil 30 when viewed from the length direction L.

[0095] As described above, the stacking direction of the insulating layer 15 and the direction of the coil axis C of the coil 30 are parallel to the first main surface 12a of the base 10, which serves as the mounting surface.

[0096] The stacking direction of the insulating layer 15 and the direction of the coil axis C of the coil 30 can be as follows: Figure 7 The direction of the insulating layer 15 may be parallel to the length direction L, or it may not be parallel. For example, the stacking direction of the insulating layer 15 may be parallel to the width direction W, and the direction of the coil axis C of the coil 30 may be parallel to the length direction L. In this case, the stacking direction of the insulating layer 15 and the direction of the coil axis C of the coil 30 are also parallel to the first main surface 12a of the base 10, which serves as the mounting surface.

[0097] The stacked coil component 1 may also have a first connecting conductor 41 and a second connecting conductor 42.

[0098] The first connecting conductor 41 passes through Figure 7 Multiple through-hole conductors, not shown, are electrically connected and stacked together with the insulating layer 15 in the longitudinal direction L to form a structure. The first connecting conductor 41 is exposed from the first end face 11a of the substrate 10.

[0099] The first external electrode 21 is electrically connected to the coil 30 via the first connecting conductor 41. Here, among the plurality of coil conductors 31, the coil conductor 31a is provided at the position closest to the first end face 11a of the substrate 10. That is, the first external electrode 21 is electrically connected to the coil conductor 31a via the first connecting conductor 41.

[0100] The first connecting conductor 41 connects the first external electrode 21 to the coil 30. Preferably, the first connecting conductor 41 is a straight line connecting the first external electrode 21 and the coil 30, specifically connecting the first external electrode 21 and the coil conductor 31a. Furthermore, it is preferable that, when viewed from the length direction L, the first connecting conductor 41 overlaps with the coil conductor 31a and is located closer to the first main surface 12a of the base 10, which serves as the mounting surface, than the coil axis C. This facilitates the electrical connection between the first external electrode 21 and the coil 30.

[0101] The first connecting conductor 41 is a straight line connecting the first external electrode 21 and the coil 30. This means that when viewed from the length direction L, the through-hole conductors constituting the first connecting conductor 41 overlap each other. Therefore, the through-hole conductors constituting the first connecting conductor 41 may not be strictly arranged in a straight line.

[0102] The first connecting conductor 41 is preferably connected to the portion of the coil conductor 31a closest to the first main surface 12a of the substrate 10. This reduces the area of ​​the portion of the first external electrode 21 on the first end face 11a of the substrate 10. Consequently, the stray capacitance between the first external electrode 21 and the coil 30 is reduced, thus correspondingly improving the high-frequency characteristics of the laminated coil component 1.

[0103] The first connecting conductor 41 can be set to only one or multiple.

[0104] The second connecting conductor 42 passes through Figure 7 Multiple through-hole conductors, not shown, are electrically connected and stacked together with the insulating layer 15 in the longitudinal direction L to form a structure. The second connecting conductor 42 is exposed from the second end face 11b of the substrate 10.

[0105] The second external electrode 22 is electrically connected to the coil 30 via the second connecting conductor 42. Here, among the plurality of coil conductors 31, a coil conductor 31d is provided at the position closest to the second end face 11b of the substrate 10. That is, the second external electrode 22 is electrically connected to the coil conductor 31d via the second connecting conductor 42.

[0106] The second connecting conductor 42 connects the second external electrode 22 to the coil 30. Preferably, the second connecting conductor 42 is a straight line connecting the second external electrode 22 and the coil 30, specifically connecting the second external electrode 22 and the coil conductor 31d. Furthermore, it is preferable that, when viewed from the length direction L, the second connecting conductor 42 overlaps with the coil conductor 31d and is located closer to the first main surface 12a of the base 10, which serves as the mounting surface, than the coil axis C. This facilitates the electrical connection between the second external electrode 22 and the coil 30.

[0107] The second connecting conductor 42 is a straight line connecting the second external electrode 22 and the coil 30. This means that when viewed from the length direction L, the through-hole conductors constituting the second connecting conductor 42 overlap each other. Therefore, the through-hole conductors constituting the second connecting conductor 42 may not be strictly arranged in a straight line.

[0108] The second connecting conductor 42 is preferably connected to the portion of the coil conductor 31d closest to the first main surface 12a of the substrate 10. This reduces the area of ​​the portion of the second external electrode 22 on the second end surface 11b of the substrate 10. Consequently, the stray capacitance between the second external electrode 22 and the coil 30 is reduced, and the high-frequency characteristics of the stacked coil component 1 are correspondingly improved.

[0109] The second connecting conductor 42 can be set to one or multiple.

[0110] The dimension L3 in the length direction L of the coil 30 is preferably 85% or more and 94% or less of the dimension L2 in the length direction L of the base 10, more preferably 90% or more and 94% or less.

[0111] The dimension L3 in the length direction L of the coil 30 represents the distance in the length direction L from the coil conductor 31a, which is electrically connected to the first external electrode 21 via the first connecting conductor 41, to the coil conductor 31d, which is electrically connected to the second external electrode 22 via the second connecting conductor 42 (including the dimensions in the length direction L of the coil conductors 31a and 31d). That is, the dimension L3 in the length direction L of the coil 30 represents the dimension in the length direction L of the arrangement area of ​​the coil conductors 31.

[0112] When the dimension L3 of the coil 30 in the length direction L is less than 85% of the dimension L2 of the substrate 10 in the length direction L, the stray capacitance of the coil 30 increases, thus raising concerns about a decrease in the high-frequency characteristics of the laminated coil component 1. When the dimension L3 of the coil 30 in the length direction L is greater than 94% of the dimension L2 of the substrate 10 in the length direction L, the stray capacitance between the first external electrode 21 and the coil 30 increases, and the stray capacitance between the second external electrode 22 and the coil 30 also increases, thus raising concerns about a decrease in the high-frequency characteristics of the laminated coil component 1.

[0113] Figure 8 It means to Figure 7 A three-dimensional schematic diagram of an example of the state of the substrate and coil after disassembly. Figure 9 It means to Figure 7 A planar schematic diagram of an example of the state of the substrate and coil after disassembly.

[0114] exist Figure 8 and Figure 9 In the example shown, the substrate 10 is stacked in the stacking direction, which is the length direction L, with insulating layers 15a, 15b, 15c, 15d, and 15e serving as insulating layers 15.

[0115] In this specification, unless otherwise specified, insulating layers 15a, 15b, 15c, 15d, and 15e are referred to as insulating layer 15.

[0116] Coil conductors 31a, 31b, 31c, and 31d, serving as coil conductors 31, are respectively disposed on the main surfaces of insulating layers 15a, 15b, 15c, and 15d. Coil conductors 31a, 31b, 31c, and 31d are stacked together with insulating layers 15a, 15b, 15c, and 15d along the length direction L, and the coil conductors are electrically connected.

[0117] In this specification, without special distinction between coil conductor 31a, coil conductor 31b, coil conductor 31c, and coil conductor 31d, they are referred to as coil conductor 31.

[0118] exist Figure 8 and Figure 9 In the example shown, the lengths of coil conductors 31a, 31b, 31c, and 31d are each 3 / 4 of the length of a turn of coil 30. That is, the number of layers of coil conductors used to form the 3 turns of coil 30 is 4. In the substrate 10, coil conductors 31a, 31b, 31c, and 31d are repeatedly stacked as a unit (3 turns).

[0119] Pad portions may also be provided at both ends of the coil conductor 31. More specifically, pad portions may also be provided at both ends of the coil conductors 31a, 31b, 31c, and 31d.

[0120] When viewed from the length direction L, the pad portion of the coil conductor 31 can be circular or polygonal.

[0121] Insulating layers 15a, 15b, 15c, and 15d are respectively provided with through-hole conductors 34a, 34b, 34c, and 34d in a manner that extends through the length direction L.

[0122] Through-hole conductors 34a, 34b, 34c, and 34d are respectively connected to one end of coil conductors 31a, 31b, 31c, and 31d. As described above, when pad portions are provided at both ends of coil conductors 31a, 31b, 31c, and 31d, through-hole conductors 34a, 34b, 34c, and 34d are respectively connected to the pad portions of coil conductors 31a, 31b, 31c, and 31d.

[0123] The insulating layer 15a of the coil conductor 31a and the through-hole conductor 34a, the insulating layer 15b of the coil conductor 31b and the through-hole conductor 34b, the insulating layer 15c of the coil conductor 31c and the through-hole conductor 34c, and the insulating layer 15d of the coil conductor 31d and the through-hole conductor 34d are considered as a unit. Figure 8 and Figure 9 The portion enclosed by the dashed line in the diagram is repeatedly stacked. Thus, coil conductors 31a, 31b, 31c, and 31d are electrically connected via through-hole conductors 34a, 34b, 34c, and 34d. That is, adjacent coil conductors in the longitudinal direction L are electrically connected to each other via through-hole conductors.

[0124] Thus, a solenoid coil 30 is formed inside the base 10.

[0125] When viewed from the length direction L, the coil 30 can be circular or polygonal. Furthermore, when the coil 30 includes pad portions, for example, when pad portions are provided at both ends of the coil conductor 31, the shape of the coil 30 represents the shape excluding the pad portions.

[0126] When viewed from the length direction L, the inner diameter of the coil conductor 31 is preferably 15% to 40% of the dimension W2 in the width direction W of the base 10. The inner diameter of the coil conductor 31 is synonymous with the coil diameter of the coil 30. When viewed from the length direction L, if the coil 30 is polygonal, the diameter of the circle whose area is equivalent to that of the polygon is taken as the coil diameter of the coil 30, i.e., the inner diameter of the coil conductor 31.

[0127] The number of turns of coil 30 is preferably 35 or more, more preferably 35 or more and 45 or less. If the number of turns of coil 30 is 35 or more, the impedance of the laminated coil component 1 increases, and the transmission coefficient S21 in the high-frequency band also increases. As a result, the high-frequency characteristics of the laminated coil component 1 are improved.

[0128] A through-hole conductor 34e is provided in the insulating layer 15e in a manner that extends through the length direction L.

[0129] A pad portion connected to the via conductor 34e may also be provided on the main surface of the insulating layer 15e.

[0130] Multiple insulating layers 15e of the conductors with through holes 34e are stacked to overlap with the insulating layer 15a of the coil conductor 31a and the conductors with through holes 34a located at one end of the coil 30. Thus, the conductors with through holes 34e are electrically connected to each other to form a first connecting conductor 41, which is exposed from the first end face 11a of the substrate 10. As a result, the first external electrode 21 and the coil conductor 31a are electrically connected to each other via the first connecting conductor 41.

[0131] Multiple layers of insulating layer 15e with through-hole conductor 34e are stacked to overlap with the insulating layer 15d of coil conductor 31d and through-hole conductor 34d located at the other end of coil 30. Thus, the through-hole conductors 34e are electrically connected to each other to form a second connecting conductor 42, which is exposed from the second end face 11b of substrate 10. Consequently, the second external electrode 22 and coil conductor 31d are electrically connected to each other via the second connecting conductor 42.

[0132] The dimensions of the first connecting conductor 41 and the second connecting conductor 42 along the length direction L are preferably 2.5% or more and 7.5% or less of the dimension L2 along the length direction L of the substrate 10, more preferably 2.5% or more and 5.0% or less. As a result, the inductance of the first connecting conductor 41 and the second connecting conductor 42 is reduced, thereby improving the high-frequency characteristics of the laminated coil component 1.

[0133] The dimensions of the first connecting conductor 41 and the second connecting conductor 42 in the width direction W are preferably 8.0% or more and 20% or less of the dimension W2 in the width direction W of the substrate 10.

[0134] For cases where the stacked coil component 1 has dimensions of 0603, 0402, or 1005, the following shows specific examples of preferred dimensions for the coil conductor 31, the first connecting conductor 41, and the second connecting conductor 42.

[0135] (1) When the laminated coil component 1 is 0603 in size

[0136] • When viewed from the length direction L, the inner diameter of the coil conductor 31 is preferably 50 μm or more and 100 μm or less.

[0137] • The dimensions of the first connecting conductor 41 and the second connecting conductor 42 in the length direction L are preferably 15 μm or more and 45 μm or less, more preferably 15 μm or more and 30 μm or less.

[0138] • The dimensions of the first connecting conductor 41 and the second connecting conductor 42 in the width direction W are preferably 30 μm or more and 60 μm or less, respectively.

[0139] (2) When the laminated coil component 1 is 0402 in size

[0140] • When viewed from the length direction L, the inner diameter of the coil conductor 31 is preferably 30 μm or more and 70 μm or less.

[0141] • The dimensions of the first connecting conductor 41 and the second connecting conductor 42 in the length direction L are preferably 10 μm or more and 30 μm or less, more preferably 10 μm or more and 25 μm or less.

[0142] • The dimensions of the first connecting conductor 41 and the second connecting conductor 42 in the width direction W are preferably 20 μm or more and 40 μm or less, respectively.

[0143] (3) When the laminated coil component 1 is 1005 in size

[0144] • When viewed from the length direction L, the inner diameter of the coil conductor 31 is preferably 80 μm or more and 170 μm or less.

[0145] • The dimensions of the first connecting conductor 41 and the second connecting conductor 42 in the length direction L are preferably 25 μm or more and 75 μm or less, more preferably 25 μm or more and 50 μm or less.

[0146] • The dimensions of the first connecting conductor 41 and the second connecting conductor 42 in the width direction W are preferably 40 μm or more and 100 μm or less, respectively.

[0147] Materials used to construct coil conductors 31a, 31b, 31c, 31d, 34a, 34b, 34c, 34d, and 34e include, for example, Ag, Au, Cu, Pd, Ni, Al, and alloys containing at least one of these metals.

[0148] In the stacked coil component of the present invention, at least a portion of the substrate contains a magnetic phase comprising Fe, Ni, Zn and Cu and a non-magnetic phase comprising Si.

[0149] In the stacked coil component 1, at least a portion of the substrate 10 contains a magnetic phase comprising Fe, Ni, Zn and Cu and a non-magnetic phase comprising Si.

[0150] The magnetic phase may also include Co, Bi, Sn, Mn, etc.

[0151] The magnetic phase is preferably composed of Ni-Cu-Zn ferrite materials.

[0152] The Ni-Cu-Zn ferrite material preferably contains, when the total weight is set to 100 mol%, 40 mol% or more and 49.5 mol% of Fe (calculated as Fe2O3), 10 mol% or more and 45 mol% of Ni (calculated as NiO), 2 mol% or more and 35 mol% of Zn (calculated as ZnO), and 6 mol% or more and 13 mol% of Cu (calculated as CuO).

[0153] Ni-Cu-Zn ferrite materials may also contain additives such as Co, Bi, Sn, and Mn, as well as unavoidable impurities.

[0154] The non-magnetic phase is preferably composed of borosilicate glass material.

[0155] The borosilicate glass material preferably comprises, when the total weight is set to 100 wt%, 70 wt% and 85 wt% of Si (in terms of SiO2), 10 wt% and 25 wt% of B (in terms of B2O3), 0.5 wt% and 5 wt% of alkali metal A (in terms of A2O), and 0 wt% and 5 wt% of Al (in terms of Al2O3).

[0156] Borosilicate glass materials may also contain magnesium olivine (2MgO·SiO2), quartz (SiO2), etc. as fillers.

[0157] The non-magnetic phase can also be composed of oxides represented as aZnO·SiO2 (where a is 1.8 or more and 2.2 or less). Examples of such oxides include Zn2SiO4, which is known as zinc silicosite. In such oxides, a portion of the Zn can be replaced by Cu.

[0158] The magnetic and non-magnetic phases are distinguished as follows. First, the laminated coil component is ground until approximately the center in the width direction, thereby... Figure 7 The cross-sections along the length and height directions are shown in the figure. Next, elemental mapping is performed on the exposed cross-sections of the matrix using scanning transmission electron microscopy-energy dispersive X-ray analysis (STEM-EDX). Then, the regions containing Fe are treated as magnetic phases, and the regions containing Si are treated as non-magnetic phases to distinguish between the two phases.

[0159] Figure 10 yes Figure 1 A side view of the stacked coil component.

[0160] exist Figure 10In the example shown, in the stacked coil component 1, when an interface G is defined at the center position of the substrate 10 along the height direction T and the width direction W, the substrate 10 has a first substrate portion 61 containing a first end face 11a and a second substrate portion 62 containing a second end face 11b, arranged along the length direction L with the interface G as the boundary. That is, the substrate 10 is divided into the first substrate portion 61 and the second substrate portion 62 along the length direction L by the interface G.

[0161] Regarding interface G, the center position of the length direction L of the base 10 is determined as the position that bisects the maximum dimension in the length direction L of the base 10.

[0162] The first external electrode 21 is disposed on the surface of the first substrate portion 61.

[0163] The second external electrode 22 is disposed on the surface of the second substrate portion 62.

[0164] In the stacked coil component of the present invention, the first external electrode has a base electrode and a plating electrode disposed on the base electrode in sequence from the substrate side. The end of the portion of the plating electrode present on the first main surface of the substrate in the longitudinal direction is located closer to the second end face of the substrate than the end of the portion of the base electrode present on the first main surface of the substrate in the longitudinal direction.

[0165] Figure 11 It means Figure 10 A schematic diagram of a portion of the cross-section of the first substrate and the first external electrode along the length and height directions.

[0166] like Figure 11 As shown, the first external electrode 21 has a base electrode 21a and a plating electrode 21b disposed on the base electrode 21a, starting from the substrate 10 side.

[0167] The end 21ba of the portion of the coated electrode 21b existing on the first main surface 12a of the substrate 10 in the length direction L is located closer to the second end surface 11b of the substrate 10 than the end 21aa of the portion of the base electrode 21a existing on the first main surface 12a of the substrate 10 in the length direction L. Figure 11 (The middle is the right side).

[0168] In a stacked coil component, the length-direction end of the portion of the substrate electrode present on the first main surface of the substrate and the length-direction end of the portion of the plating electrode present on the first main surface of the substrate are determined by a cross-section along the length and height directions at approximately the center of the width direction.

[0169] As with the stacked coil component of the present invention, in the external electrode having a base electrode and a plated electrode, the plated electrode is often formed to be significantly elongated relative to the base electrode along the surface of the substrate. Thus, when the external electrode is formed with the plated electrode significantly elongated, the stray capacitance between the external electrode and the coil increases, resulting in concerns about a reduction in the high-frequency characteristics of the stacked coil component.

[0170] In contrast, in the stacked coil component of the present invention, the distance in the length direction between the end of the plated electrode and the end of the base electrode is 30 μm or less.

[0171] In the stacked coil component 1, the distance a along the length direction L between the end 21ba of the portion of the plated electrode 21b existing on the first main surface 12a of the substrate 10 and the end 21aa of the portion of the base electrode 21a existing on the first main surface 12a of the substrate 10 is 30 μm or less. More specifically, the distance a along the length direction L between the end 21ba of the plated electrode 21b and the end 21aa of the base electrode 21a is greater than 0 μm and less than 30 μm. In this case, the plated electrode 21b does not elongate significantly relative to the base electrode 21a along the first main surface 12a of the substrate 10, which can suppress the increase of stray capacitance between the coil 30 and the first external electrode 21, and thus the high-frequency characteristics of the stacked coil component 1 are correspondingly improved.

[0172] When the distance a in the length direction L between the end 21ba of the plating electrode 21b and the end 21aa of the base electrode 21a is greater than 30μm, the plating electrode 21b elongates significantly relative to the base electrode 21a along the first main surface 12a of the substrate 10, which cannot suppress the increase of stray capacitance between the coil 30 and the first external electrode 21.

[0173] As described above, in the stacked coil component of the present invention, even though the external electrode, here the first external electrode, has a plated electrode, the high-frequency characteristics are excellent because the distance in the length direction between the end of the plated electrode and the end of the base electrode is less than 30 μm. That is, in the stacked coil component of the present invention, the transmission coefficient S21 in the high-frequency band is large, and the deviation of the transmission coefficient S21 up to the high-frequency band becomes small.

[0174] The base electrode 21a preferably contains Ag.

[0175] The plated electrode 21b preferably contains at least one of Ni and Sn.

[0176] The plating electrode 21b can be a single-layer structure or a multi-layer structure, but a multi-layer structure is preferred. When the plating electrode 21b is a multi-layer structure, it preferably has a Ni plating electrode and a Sn plating electrode sequentially from the substrate electrode 21a side.

[0177] In addition to elemental analysis using energy-dispersive X-ray analysis (EDX), it also utilizes... Figure 11 Information such as density in the cross-section along the length and height directions shown distinguishes the plated electrode 21b from the base electrode 21a formed by methods other than plating.

[0178] When a first reference position H1 is defined that overlaps with the end 21aa of the base electrode 21a in the height direction T, the first substrate portion 61 preferably contains at least a portion extending from the first reference position H1 toward the second end face 11b (in Figure 11 In the middle, a first region 61a with a dimension P1 of 20 μm in the length direction L (towards the right). That is, the first region 61a preferably includes at least a range from a position 0 μm to a position 20 μm away from the first reference position H1 in the length direction L towards the second end face 11b.

[0179] The end portion 61aa on the second end face 11b side of the first region 61a preferably exists at a distance P1 of 20 μm or more and 60 μm or less from the first reference position H1 along the length direction L. That is, the first region 61a preferably includes a range from a position at a distance P1 of 0 μm from the first reference position H1 toward the second end face 11b along the length direction L to a position of α1 μm (20 ≤ α1 ≤ 60).

[0180] Preferably, the first region 61a further includes at least the area extending from the first reference position H1 toward the first end face 11a (in Figure 11 In the first region 61a, the dimension P2 is 20 μm along the length direction L (towards the left). That is, preferably, the first region 61a also includes at least a range from a position 0 μm to a position 20 μm away from the first reference position H1 along the length direction L towards the first end face 11a.

[0181] The end portion 61ab on the first end face 11a side of the first region 61a is preferably located at a distance P2 of 20 μm or more and 60 μm or less from the first reference position H1 along the length direction L. That is, the first region 61a preferably also includes a range from a position at a distance P2 of 0 μm from the first reference position H1 toward the first end face 11a along the length direction L to a position of α2 μm (20 ≤ α2 ≤ 60).

[0182] Preferably, only a non-magnetic phase exists in the first region 61a, or both a non-magnetic phase and a magnetic phase exist. Therefore, when forming the coated electrode 21b, it is possible to suppress significant elongation of the coated electrode 21b relative to the base electrode 21a along the first main surface 12a of the substrate 10. That is, the distance a in the length direction L between the end 21ba of the coated electrode 21b and the end 21aa of the base electrode 21a is preferably less than 30 μm. As a result, the end 21ba of the coated electrode 21b is preferably as follows: Figure 11 As shown, it stays at the position that overlaps with the first region 61a.

[0183] In the first region 61a, the volume ratio of the non-magnetic phase to the total volume of the magnetic and non-magnetic phases is preferably 60% by volume or more. More specifically, in the first region 61a, the volume ratio of the non-magnetic phase to the total volume of the magnetic and non-magnetic phases is preferably 60% by volume or more and 100% by volume or less. Therefore, when forming the plating electrode 21b, the distance a in the length direction L between the end 21ba of the plating electrode 21b and the end 21aa of the substrate electrode 21a is easily reduced to 30 μm or less.

[0184] The first region 61a preferably contains 30.0% or more of Si, calculated as SiO2, when the total weight is set to 100% by weight. As a result, when forming the plating electrode 21b, the distance a in the length direction L between the end 21ba of the plating electrode 21b and the end 21aa of the substrate electrode 21a is easily reduced to 30 μm or less.

[0185] Furthermore, the first region 61a preferably contains less than 85.0% Si as SiO2 when the total weight is set to 100% by weight.

[0186] The first region 61a preferably includes, when the total weight is set to 100 wt%, 30.0 wt% or more and 85.0 wt% of Si (in terms of SiO2), 4.0 wt% or more and 15.0 wt% of B (in terms of B2O3), 0 wt% or more and 45.0 wt% of Fe (in terms of Fe2O3), 0 wt% or more and 15.0 wt% of Ni (in terms of NiO), 0 wt% or more and 8.0 wt% of Zn (in terms of ZnO), and 0 wt% or more and 5.0 wt% of Cu (in terms of CuO).

[0187] The first region 61a preferably includes, when the total weight is set to 100% by weight, 0.3% to 1.5% by weight of K (calculated as K2O) and 0.9% to 3.5% by weight of Mg (calculated as MgO).

[0188] Preferably, a second region 61b exists in the first substrate portion 61, in addition to the first region 61a.

[0189] Preferably, only the magnetic phase exists in the second region 61b, or both the magnetic and non-magnetic phases exist. This makes it easier to increase the impedance of the laminated coil component 1. Consequently, the high-frequency characteristics of the laminated coil component 1 are easily improved.

[0190] In the second region 61b, the volume ratio of the non-magnetic phase to the total volume of the magnetic and non-magnetic phases is preferably 50% or less by volume. More specifically, in the second region 61b, the volume ratio of the non-magnetic phase to the total volume of the magnetic and non-magnetic phases is preferably 0% or more and 50% or less by volume. Therefore, in the second region 61b, the volume ratio of the magnetic phase to the total volume of the magnetic and non-magnetic phases is equal to or greater than the volume ratio of the non-magnetic phase to the total volume of the magnetic and non-magnetic phases, thus the impedance of the laminated coil component 1 tends to increase. As a result, the high-frequency characteristics of the laminated coil component 1 are easily improved.

[0191] In each of the first and second regions, the ratio of the volume of the non-magnetic phase to the total volume of the magnetic and non-magnetic phases is determined as follows. First, the laminated coil component is ground until approximately the center in the width direction, thereby... Figure 7 , Figure 11 The cross-sections along the length and height directions are exposed as shown. Next, in the exposed cross-section of the first substrate portion, after measuring the volume ratio of the non-magnetic phase in the first region, a range with a length dimension of 20 μm from the first reference position toward the second end face is selected as the target region. Similarly, in the exposed cross-section of the first substrate portion, after measuring the volume ratio of the non-magnetic phase in the second region, a range with a length dimension of 20 μm from the first end face toward the second end face is selected as the target region. Then, in each target region, three 20 μm angular regions are extracted, and elemental mapping is performed using scanning transmission electron microscopy-energy dispersive X-ray analysis, thereby distinguishing the magnetic and non-magnetic phases as described above. Then, for each of the three regions, based on the obtained elemental mapping images, the ratio of the area of ​​the non-magnetic phase to the total area of ​​the magnetic and non-magnetic phases is measured using image analysis software. Then, the average value is calculated based on these measured area ratios, and this average value is used as the ratio of the volume of the non-magnetic phase to the total volume of the magnetic and non-magnetic phases.

[0192] The second region 61b preferably contains 25.0% or less of Si (equivalent to SiO2) when the total weight is set to 100% by weight. This makes it easier to increase the impedance of the laminated coil component 1. Consequently, the high-frequency characteristics of the laminated coil component 1 are easily improved.

[0193] Furthermore, the second region 61b may not contain Si.

[0194] The second region 61b preferably includes, when the total weight is set to 100 wt%,: Si, which is 0 wt% or more and 25.0 wt% or less as SiO2; B, which is 0 wt% or more and 5.0 wt% or less as B2O3; Fe, which is 45.0 wt% or more and 70.0 wt% or less as Fe2O3; Ni, which is 10.0 wt% or more and 20.0 wt% or less as NiO; and Zn, which is 5.0 wt% or more and 12.0 wt% or less as ZnO.

[0195] Preferably, the Si content in the first region 61a when the total weight is 100% by weight is at least 7.0% by weight more than the Si content in the second region 61b when the total weight is 100% by weight, calculated as SiO2. That is, the difference between the Si content in the first region 61a and the second region 61b when the total weight is 100% by weight is preferably at least 7.0% by weight, calculated as SiO2. Furthermore, the difference between the Si content in the first region 61a and the second region 61b when the total weight is 100% by weight is preferably 60.0% by weight or less. Additionally, the Si content in the second region 61b when the total weight is 100% by weight can also be 0% by weight.

[0196] The composition of the first and second regions was confirmed by analyzing the aforementioned target regions using inductively coupled plasma atomic emission spectrometry / inductively coupled plasma mass spectrometry (ICP-AES / MS).

[0197] The first substrate portion 61 preferably contains a first region 61a and a second region 61b, but it is also possible to have only the first region 61a.

[0198] The second substrate portion 62 and the second external electrode 22, as shown below, preferably have the same structure as the first substrate portion 61 and the first external electrode 21.

[0199] Figure 12 It means Figure 10 A schematic diagram of a portion of the cross-section of the second substrate and the second external electrode along the length and height directions.

[0200] like Figure 12 As shown, the second external electrode 22 has a base electrode 22a and a plating electrode 22b disposed on the base electrode 22a, starting from the substrate 10 side.

[0201] The end 22ba of the portion of the coated electrode 22b existing on the first main surface 12a of the substrate 10 in the length direction L is located closer to the first end face 11a of the substrate 10 than the end 22aa of the portion of the base electrode 22a existing on the first main surface 12a of the substrate 10 in the length direction L. Figure 11 (The middle is the left side).

[0202] The distance b along the length direction L between the end 22ba of the portion of the coated electrode 22b existing on the first main surface 12a of the substrate 10 and the end 22aa of the portion of the base electrode 22a existing on the first main surface 12a of the substrate 10 is 30 μm or less. More specifically, the distance b along the length direction L between the end 22ba of the coated electrode 22b and the end 22aa of the base electrode 22a is greater than 0 μm and less than 30 μm.

[0203] The preferred structures of the substrate electrode 22a and the plating electrode 22b are the same as the preferred structures of the substrate electrode 21a and the plating electrode 21b, respectively.

[0204] When defining a second reference position H2 that overlaps with the end 22aa of the base electrode 22a in the height direction T, it is preferable that the second substrate portion 62 has at least a portion extending from the second reference position H2 toward the first end face 11a (in... Figure 12 In the middle, a first region 62a with a dimension Q1 of 20 μm in the length direction L (towards the left). That is, preferably the first region 62a includes at least a range from a position 0 μm to a position 20 μm away from the second reference position H2 in the length direction L towards the first end face 11a.

[0205] The end portion 62aa on the side of the first end face 11a in the first region 62a is preferably located at a distance Q1 of 20 μm or more and 60 μm or less from the second reference position H2 in the longitudinal direction L. That is, the first region 62a preferably includes a range from a position at a distance Q1 of 0 μm from the second reference position H2 toward the first end face 11a to a position at a distance β1 μm (20 ≤ β1 ≤ 60).

[0206] Preferably, the first region 62a further includes at least the area extending from the second reference position H2 toward the second end face 11b (in Figure 12 In the first region 62a, the dimension Q2 is 20 μm along the length direction L (towards the right). That is, preferably, the first region 62a also includes at least a range from a position 0 μm to 20 μm along the length direction L from the second reference position H2 toward the second end face 11b.

[0207] The end portion 62ab on the second end face 11b side of the first region 62a is preferably located at a distance Q2 of 20 μm or more and 60 μm or less from the second reference position H2 along the length direction L. That is, the first region 62a preferably also includes a range from a position at a distance Q2 of 0 μm from the second reference position H2 toward the second end face 11b to a position at a distance β2 μm (20 ≤ β2 ≤ 60).

[0208] Preferably, the first region 62a contains only a non-magnetic phase, or contains both a non-magnetic phase and a magnetic phase.

[0209] Preferably, the second matrix portion 62 also contains a second region 62b in addition to the first region 62a.

[0210] Preferably, only a magnetic phase exists in the second region 62b, or both a magnetic phase and a non-magnetic phase exist.

[0211] The preferred ratio of the volume of the non-magnetic phase in each of the first region 62a and the second region 62b to the total volume of the magnetic phase and the non-magnetic phase is the same as the preferred ratio of the volume of the non-magnetic phase in each of the first region 61a and the second region 61b to the total volume of the magnetic phase and the non-magnetic phase.

[0212] For the second substrate portion, the volume ratio of the non-magnetic phase in each of the first and second regions to the total volume of the magnetic and non-magnetic phases is also determined as described above. Furthermore, when measuring the volume ratio of the non-magnetic phase in the first region at the exposed cross-section of the second substrate portion, a region with a length dimension of 20 μm extending from the second reference position toward the first end face is selected as the target region. Similarly, when measuring the volume ratio of the non-magnetic phase in the second region at the exposed cross-section of the second substrate portion, a region with a length dimension of 20 μm extending from the second end face toward the first end face is selected as the target region.

[0213] The preferred compositions of the first region 62a and the second region 62b are the same as the preferred compositions of the first region 61a and the second region 61b, respectively.

[0214] The second substrate portion 62 preferably contains both a first region 62a and a second region 62b, but it may also contain only the first region 62a.

[0215] The stacked coil component 1 is manufactured, for example, by the following method.

[0216] <Magnetic Material Manufacturing Process>

[0217] First, weigh Fe2O3, NiO, ZnO, and CuO to make them into the specified proportions.

[0218] Next, these weighed materials are wet-mixed and then pulverized to form a slurry. The mixing time for the weighed materials is, for example, more than 4 hours and less than 8 hours.

[0219] Then, after drying the resulting slurry, it is pre-fired. The pre-fired temperature is, for example, above 700℃ and below 800℃. The pre-fired time is, for example, above 2 hours and below 5 hours.

[0220] In this way, powdered magnetic materials are produced, and more specifically, powdered ferrite materials are produced.

[0221] The ferrite material preferably comprises, when the total weight is set to 100 mol%, 40 mol% or more and 49.5 mol% of Fe (calculated as Fe2O3), 10 mol% or more and 45 mol% of Ni (calculated as NiO), 2 mol% or more and 35 mol% of Zn (calculated as ZnO), and 6 mol% or more and 13 mol% of Cu (calculated as CuO).

[0222] <Non-magnetic material manufacturing process>

[0223] First, prepare borosilicate glass powder containing Si, B, alkali metals, and Al in a specified ratio.

[0224] The borosilicate glass material preferably comprises, when the total weight is set to 100 wt%, 70 wt% and 85 wt% of Si (in terms of SiO2), 10 wt% and 25 wt% of B (in terms of B2O3), 0.5 wt% and 5 wt% of alkali metal A (in terms of A2O), and 0 wt% and 5 wt% of Al (in terms of Al2O3).

[0225] Next, as fillers, forsterite powder and quartz powder are prepared.

[0226] Then, borosilicate glass powder, forsterite powder, and quartz powder are wet-mixed in a specified ratio and then pulverized to produce a non-magnetic material.

[0227] <Raw Film Production Process>

[0228] First, magnetic and non-magnetic materials are weighed in a specified ratio. Next, these materials are mixed with organic binders such as polyvinyl butyral resin, organic solvents such as ethanol and toluene, and plasticizers, and then pulverized to form a slurry. Then, the slurry is formed into sheets of a specified thickness using a scraper or similar method, and subsequently die-cut into a specified shape to produce green sheets.

[0229] When producing green films, by adjusting the proportions of magnetic and non-magnetic materials, a first type of green film is produced in which the volume of non-magnetic material is 60% or more of the total volume of magnetic and non-magnetic materials, and a second type of green film is produced in which the volume of non-magnetic material is 50% or less of the total volume of magnetic and non-magnetic materials.

[0230] In addition, by adjusting the proportions of magnetic and non-magnetic materials during the production of green wafers, a third type of green wafer containing more than 30.0% Si (equivalent to SiO2) when the total weight is set to 100% by weight, and a fourth type of green wafer containing less than 25.0% Si (equivalent to SiO2) when the total weight is set to 100% by weight, can be produced.

[0231] Hereinafter, without making a special distinction between the first type of raw slices, the second type of raw slices, the third type of raw slices, and the fourth type of raw slices, they will be referred to as "raw slices".

[0232] In the following procedures, the case where the first type of raw slices and the second type of raw slices are used in combination as raw slices will be described. Furthermore, the same applies when the third type of raw slices and the fourth type of raw slices are used in combination as raw slices.

[0233] <Conductor Pattern Forming Process>

[0234] First, through holes are formed by laser irradiation of designated areas on the raw film.

[0235] Next, conductive paste such as Ag paste is filled into the through-holes and coated onto the surface of the green sheet using methods such as screen printing. Thus, a conductor pattern for through-hole conductors is formed in the through-holes of the green sheet, and a coil conductor pattern connected to the through-hole conductor pattern is formed on the surface. In this way, a coil sheet with both the coil conductor pattern and the through-hole conductor pattern formed on the green sheet is produced. Multiple coil sheets are produced, and each coil sheet is then coated with... Figure 8 and Figure 9 The coil conductor shown is equivalent to a coil conductor with a conductor pattern, and with... Figure 8 and Figure 9 The via conductor shown is equivalent to the via conductor pattern.

[0236] In addition, conductive sheets, unlike coil sheets, are manufactured by filling the through-holes with conductive pastes such as Ag paste using methods such as screen printing. Multiple conductive sheets are also manufactured, and the pattern of the conductive hole conductor on each sheet is formed accordingly. Figure 8 and Figure 9 The via conductor shown is equivalent to the via conductor pattern.

[0237] When manufacturing coil sheets and conductive sheets, in the first substrate portion and the second substrate portion of the subsequently formed substrate, a first type of green sheet is used for sheets arranged in the area to be the first region, and a second type of green sheet is used for sheets arranged in the area to be the second region.

[0238] <Fabrication process of laminated precast components>

[0239] The coil piece and the conductive piece are positioned at a ratio equivalent to Figure 8 and Figure 9 After being stacked sequentially along the lamination direction, they are hot-pressed together to produce a laminated preform. Thus, in the laminated preform, in the first substrate portion and the second substrate portion of the subsequently formed substrate, a first type of green sheet is placed in the area to be the first region, and a second type of green sheet is placed in the area to be the second region.

[0240] <Substrate and Coil Manufacturing Process>

[0241] First, the laminated preform is cut into specified sizes using a cutting machine or similar equipment to create segmented chips.

[0242] Next, the segmented chips are calcined. The calcination temperature is, for example, above 900℃ and below 920℃. The calcination time is, for example, above 2 hours and below 4 hours.

[0243] By calcining the segmented chip, the green sheets of coil and conductive sheets become insulating layers. As a result, a substrate is fabricated by stacking multiple insulating layers in the lamination direction, here in the length direction.

[0244] Here, as described above, when fabricating the laminated preform, a first type of green sheet is placed in the region desired to be the first region and a second type of green sheet is placed in the region desired to be the second region in both the first and second substrate portions of the substrate. Therefore, in the first and second substrate portions of the substrate fabricated in this process, in the first region, the volume of the non-magnetic phase relative to the total volume of the magnetic and non-magnetic phases is 60% or more by volume, and in the second region, the volume of the non-magnetic phase relative to the total volume of the magnetic and non-magnetic phases is 50% or less by volume.

[0245] By calcining the segmented chips, the conductor patterns for the coil conductors and the conductor patterns for the via conductors of the coil sheet become the coil conductors and via conductors, respectively. As a result, a coil is manufactured by stacking multiple coil conductors in the longitudinal direction and electrically connecting them via via conductors.

[0246] Thus, a substrate and a coil disposed inside the substrate are fabricated. The stacking direction of the insulating layer and the direction of the coil axis are parallel to the first main surface of the substrate, which serves as the mounting surface, and here, parallel to the length direction.

[0247] By calcining the segmented chip, the via conductors of the conductive sheet are patterned into via conductors. As a result, a first connecting conductor and a second connecting conductor are fabricated by stacking and electrically connecting multiple via conductors along their length. The first connecting conductor is exposed from a first end face of the substrate. The second connecting conductor is exposed from a second end face of the substrate.

[0248] For the substrate, for example, rounding can be achieved by performing tumbling grinding to give the corners and edges a rounded shape.

[0249] <External Electrode Forming Process>

[0250] First, the substrate is obliquely immersed in a layer formed by stretching a conductive paste containing Ag and glass frit to a predetermined thickness. Next, the resulting coating is sintered to form a base electrode extending from a portion of the first end face of the substrate across a portion of each of the first main surface, the first side surface, and the second side surface. Similarly, a base electrode extending from a portion of the second end face of the substrate across a portion of each of the first main surface, the first side surface, and the second side surface is formed. The sintering temperature of the coating is, for example, 800°C or higher and 820°C or lower.

[0251] Then, Ni-plated electrodes and Sn-plated electrodes are sequentially formed on each base electrode through electroplating or the like.

[0252] At this time, the end of the portion of the coated electrode existing on the first main surface of the substrate in the length direction is located closer to the second end face of the substrate than the end of the portion of the base electrode existing on the first main surface of the substrate in the length direction. However, the distance in the length direction between the end of the coated electrode, here the end of the Sn coated electrode, and the end of the base electrode is less than 30 μm.

[0253] As a method to ensure that the distance in the longitudinal direction between the end of the plating electrode and the end of the substrate electrode is 30 μm or less, one example is the method described above, in which a first green sheet is arranged in the first substrate portion and the second substrate portion of the substrate in the region where it is desired to be the first region. If such a method is used, in the first substrate portion and the second substrate portion of the fabricated substrate, the volume ratio of the non-magnetic phase to the total volume of the magnetic phase and the non-magnetic phase in the first region is 60% or more by volume. Therefore, when forming the plating electrode, the distance in the longitudinal direction between the end of the plating electrode and the end of the substrate electrode can easily be made 30 μm or less.

[0254] In this way, a first external electrode electrically connected to the coil via a first connecting conductor and a second external electrode electrically connected to the coil via a second connecting conductor are formed.

[0255] Thus, a stacked coil component 1 is manufactured.

[0256]

Example

[0257] The following describes embodiments of the stacked coil component of the present invention in more detail. However, the present invention is not limited to these embodiments.

[0258] Samples 1 to 5 of the laminated coil component were manufactured using the following method.

[0259] <Magnetic Material Manufacturing Process>

[0260] First, the following components were weighed: Fe₂O₃ (48.0 mol%), NiO (14.0 mol%), ZnO (30.0 mol%), and CuO (8.0 mol%). Next, these components were placed in a ball mill with pure water and PSZ (partially stabilized zirconia) medium and mixed for 6 hours, then pulverized to form a slurry. The resulting slurry was then dried and pre-calcined at 800°C for 2 hours. This process produces a powdered magnetic material, more specifically, a powdered ferrite material.

[0261] <Non-magnetic material manufacturing process>

[0262] First, borosilicate glass powder containing Si, B, alkali metals, and Al in a specified ratio is prepared. Next, magnesium olivine powder and quartz powder are prepared as fillers. Then, they are wet-mixed in a ratio of 72% by weight of borosilicate glass powder, 4% by weight of magnesium olivine powder, and 24% by weight of quartz powder, and then pulverized to produce a non-magnetic material.

[0263] Here, matrix samples for confirming the composition of the matrix of samples 1 to 5 of the subsequently obtained laminated coil components are prepared using the following method. First, a mixture of 100% by volume of magnetic material and 0% by volume of non-magnetic material is weighed. Next, these weighed materials, polyvinyl butyral resin as an organic binder, ethanol and toluene as organic solvents, plasticizer, and PSZ medium are placed in a ball mill, mixed, and pulverized to prepare a slurry. Then, the slurry is formed into a sheet using a scraper method, laminated, and hot-pressed to produce a green preform. The green preform is then punched and calcined at 910°C for 4 hours to produce a circular plate-shaped matrix sample A with a thickness of 0.5 mm and a diameter of 10 mm.

[0264] In addition, except that the magnetic and non-magnetic materials are mixed in the proportions shown in Table 1, matrix samples B, C and D are prepared in the same manner as matrix sample A.

[0265] The compositions shown in Table 1 were confirmed by analyzing matrix samples A, B, C, and D using inductively coupled plasma atomic emission spectrometry / inductively coupled plasma mass spectrometry.

[0266] When observing the composition shown in Table 1, it can also be said that green wafers C and D are equivalent to a third type of green wafer containing more than 30.0% Si (in terms of SiO2) when the total weight is set to 100% by weight. It can also be said that green wafers A and B are equivalent to a fourth type of green wafer containing less than 25.0% Si (in terms of SiO2) when the total weight is set to 100% by weight.

[0267] Table 1

[0268]

[0269] <Raw Film Production Process>

[0270] A green sheet A, constituting the aforementioned green preform, is prepared using a material with the same composition as the substrate sample A. That is, in the subsequently prepared substrate, the region formed by the green sheet A has the same composition as the substrate sample A.

[0271] Similarly, green sheet B is prepared using a material with the same composition as matrix sample B, green sheet C is prepared using a material with the same composition as matrix sample C, and green sheet D is prepared using a material with the same composition as matrix sample D. In the subsequently prepared matrix, the region formed by green sheet B has the same composition as matrix sample B, the region formed by green sheet C has the same composition as matrix sample C, and the region formed by green sheet D has the same composition as matrix sample D.

[0272] Green sheets C and D are classified as the first type, where the volume of non-magnetic material relative to the total volume of magnetic and non-magnetic materials is 60% or more. Green sheets A and B are classified as the second type, where the volume of non-magnetic material relative to the total volume of magnetic and non-magnetic materials is 50% or less.

[0273] <Conductor Pattern Forming Process>

[0274] First, through holes are formed by laser irradiation of designated areas on the raw film.

[0275] Next, Ag paste is filled into the through-holes and coated onto the surface of the green sheet using screen printing. This forms a conductor pattern for the through-hole conductor in the green sheet, and a coil conductor pattern connected to the through-hole conductor pattern is formed on the surface. Thus, a coil sheet with both the coil conductor pattern and the through-hole conductor pattern is produced on the green sheet. Multiple coil sheets are produced, and each coil sheet is then coated with... Figure 8 and Figure 9 The coil conductor shown is equivalent to a coil conductor with a conductor pattern, and with... Figure 8 and Figure 9 The via conductor shown is equivalent to the via conductor pattern.

[0276] In addition, by using screen printing to fill the through-holes with Ag paste, conductive sheets with conductor patterns for conductive conductors formed on the raw sheet are produced, unlike coil sheets. Multiple conductive sheets are also produced, and the pattern of each conductive sheet is... Figure 8 and Figure 9 The via conductor shown is equivalent to the via conductor pattern.

[0277] <Fabrication process of laminated precast components>

[0278] The coil and the conductive piece are positioned at an equivalent ratio Figure 8 and Figure 9 After being stacked in sequence along the stacking direction, they are hot-pressed together to produce a laminated preform.

[0279] <Substrate and Coil Manufacturing Process>

[0280] First, the laminated preform is cut into specified sizes using a cutting machine to create segmented chips.

[0281] Next, the slicing chips were calcined at 910°C for 4 hours.

[0282] By calcining the segmented chip, the green sheets of coil and conductive sheets become insulating layers. As a result, a substrate is fabricated by stacking multiple insulating layers in the lamination direction, here in the length direction.

[0283] By calcining the segmented chips, the conductor patterns for the coil conductors and the conductor patterns for the via conductors of the coil sheet become the coil conductors and via conductors, respectively. As a result, a coil is manufactured by stacking multiple coil conductors in the longitudinal direction and electrically connecting them via via conductors.

[0284] Thus, a substrate and a coil disposed inside the substrate are fabricated. The stacking direction of the insulating layer and the direction of the coil axis are parallel to the first main surface of the substrate, which serves as the mounting surface, and here, parallel to the length direction.

[0285] By calcining the segmented chip, the via conductors of the conductive sheet are patterned into via conductors. As a result, a first connecting conductor and a second connecting conductor are fabricated by stacking and electrically connecting multiple via conductors along their length. The first connecting conductor is exposed from a first end face of the substrate. The second connecting conductor is exposed from a second end face of the substrate.

[0286] Then, the substrate and the medium are placed together into a rotary drum mill, and the substrate is subjected to drum grinding to give the corners and edges rounded corners.

[0287] <External Electrode Forming Process>

[0288] First, the substrate is obliquely immersed in a layer formed by stretching a conductive paste containing Ag and glass frit to a predetermined thickness. Next, the resulting coating is sintered at 810°C to form a base electrode extending from a portion of the first end face of the substrate across a portion of each of the first main surface, the first side surface, and the second side surface. Similarly, a base electrode extending from a portion of the second end face of the substrate across a portion of each of the first main surface, the first side surface, and the second side surface is formed. The thickness of each base electrode is 5 μm.

[0289] Then, Ni-plated electrodes and Sn-plated electrodes are sequentially formed on each base electrode by electroplating.

[0290] In this way, a first external electrode electrically connected to the coil via a first connecting conductor and a second external electrode electrically connected to the coil via a second connecting conductor are formed.

[0291] Thus, samples 1 to 5 of the laminated coil component were manufactured. Samples 1 to 5 of the laminated coil component have dimensions of 0.6 mm in the length direction, 0.3 mm in the height direction, and 0.3 mm in the width direction, respectively.

[0292] In samples 1 to 5 of the stacked coil component, when a first reference position is defined that overlaps in the height direction with the end of the portion of the base electrode of the first external electrode that exists on the first main surface of the substrate in the length direction, the first region of the first base portion of the substrate is set as the dimension in the length direction from the first reference position toward the second end face ( Figure 11 The dimension P1 in the figure is within a range of 20 μm, and the dimension in the length direction from the first reference position toward the first end face is ( Figure 11 The area with dimension P2) is 20 μm. In addition, in the samples 1 to 5 of the laminated coil component, the area outside the first region is designated as the second region in the first substrate portion of the substrate.

[0293] In samples 1 to 5 of the stacked coil component, when a second reference position is defined that overlaps in the height direction with the end of the portion of the base electrode of the second external electrode that exists on the first main surface of the substrate in the length direction, the first region of the second substrate portion of the substrate is set as the dimension in the length direction from the second reference position toward the first end face ( Figure 12 The dimension Q1 in the middle is in the range of 20 μm, and the dimension in the length direction from the second reference position toward the second end face is ( Figure 12 The area with dimension Q2) is 20 μm. In addition, in the samples 1 to 5 of the laminated coil component, the area outside the first region is designated as the second region in the second substrate portion of the substrate.

[0294] In samples 1 to 5 of the laminated coil components, the combinations shown in Table 2 were used as green sheets constituting the first and second regions for the first and second substrate portions. As a result, in samples 1 to 5 of the laminated coil components, the ratio of the volume of the non-magnetic phase in the first region to the total volume of the magnetic and non-magnetic phases, and the ratio of the volume of the non-magnetic phase in the second region to the total volume of the magnetic and non-magnetic phases, are shown in Table 2. Furthermore, in samples 1 to 5 of the laminated coil components, the Si content (converted to SiO2) in the first and second substrate portions, and the Si content (converted to SiO2) in the second region, are shown in Table 2 (referred to as "SiO2 content" in Table 2).

[0295] [evaluate]

[0296] The following evaluation was performed on samples 1 to 5 of the laminated coil components.

[0297] <Location of the base electrode and the coating electrode>

[0298] First, the sample of the stacked coil component is held vertically with its first side facing upwards, and the surrounding area is sealed with resin. Next, the sample of the stacked coil component is ground using a grinder until approximately the center in the width direction, thereby exposing the cross-sections along the length and height directions. Then, the exposed cross-section of the sample of the stacked coil component is processed by focused ion beam (FIB) using a "SMI3050R" focused ion beam processing device manufactured by Seiko Nanotechnology Co., Ltd., thereby obtaining a cross-section for observation.

[0299] Then, for the cross-section of the stacked coil component specimen for observation, a scanning electron microscope (SEM) was used to photograph the portion of the base electrode and the plating electrode of the first external electrode that exists on the first main surface of the substrate. Similarly, photographs were taken of the portion of the base electrode and the plating electrode of the second external electrode that exists on the first main surface of the substrate. The positions of the base electrode and the plating electrode were then confirmed using the photographs. In the length direction, the end of the plating electrode is located closer to the center of the substrate than the end of the base electrode. Furthermore, the length direction distance between the end of the plating electrode and the end of the base electrode is shown in Table 2.

[0300] Table 2

[0301]

[0302] In Table 2, the test samples marked with * are comparative examples outside the scope of this invention.

[0303] As shown in Table 2, in samples 3, 4 and 5 of the stacked coil component, the distance in the length direction between the end of the plated electrode and the end of the base electrode is less than 30 μm.

[0304] On the other hand, in the sample 1 and sample 2 of the stacked coil component, the distance in the length direction between the end of the plated electrode and the end of the base electrode is greater than 30 μm.

[0305] That is, in the samples 3, 4 and 5 of the stacked coil component, compared with the samples 1 and 2 of the stacked coil component, the elongation of the plated electrode along the first main surface of the substrate relative to the base electrode was suppressed.

[0306] <Transmission coefficient S21>

[0307] For samples 1, 3, and 4 of the stacked coil component, while varying the frequency from 30 GHz to 70 GHz, the transmission coefficient S21, which is calculated based on the power ratio of the transmitted signal to the input signal, was determined using a network analyzer.

[0308] Figure 13 This is a graph showing the measurement results of the transmission coefficient S21 of samples 1, 3 and 4 of the stacked coil component.

[0309] like Figure 13As shown, in samples 3 and 4 of the laminated coil components, compared with sample 1 of the laminated coil components, the transmission coefficient S21 in the high-frequency bands such as 40 GHz and 50 GHz is larger, and the deviation of the transmission coefficient S21 up to the high-frequency band is smaller. Furthermore, although not shown, sample 5 of the laminated coil components also confirmed, similarly to samples 3 and 4, that the transmission coefficient S21 in the high-frequency band is large, and its deviation is small.

Claims

1. A stacked coil component, characterized in that, have: The substrate is formed by stacking multiple insulating layers in a stacking direction and has a first end face and a second end face opposite each other in the length direction, a first main face and a second main face opposite each other in the height direction orthogonal to the length direction, and a first side face and a second side face opposite each other in the width direction orthogonal to the length direction and the height direction. A coil, disposed inside the substrate, and formed by electrically connecting a plurality of coil conductors; and A first external electrode extends from at least a portion of the first end face of the substrate across a portion of the first main face and is electrically connected to the coil. The stacking direction of the insulating layer and the direction of the coil axis are parallel to the first main surface of the substrate, which serves as the mounting surface. At least a portion of the matrix contains a magnetic phase containing Fe, Ni, Zn, and Cu, and a non-magnetic phase containing Si. The first external electrode, starting from the substrate side, sequentially comprises a base electrode and a plating electrode disposed on the base electrode. The end of the portion of the coated electrode present on the first main surface of the substrate in the longitudinal direction is located closer to the second end face of the substrate than the end of the portion of the base electrode present on the first main surface of the substrate in the longitudinal direction. The distance in the length direction between the end of the coated electrode and the end of the substrate electrode is less than 30 μm. When an interface is defined at the center position along the height and width directions of the substrate, the substrate has a first substrate portion including the first end face and a second substrate portion including the second end face, arranged along the length direction with the interface as the boundary. When a first reference position is defined that overlaps with the end of the base electrode in the height direction, there exists a first region in the first substrate portion that includes a range of 20 μm in the length direction extending from the first reference position toward the second end face. In the first region, only the non-magnetic phase exists, or both the non-magnetic phase and the magnetic phase exist. A second region exists in addition to the first region in the first substrate portion. In the second region, only the magnetic phase exists, or both the magnetic phase and the non-magnetic phase exist. In terms of SiO2 conversion, the Si content in the first region when the total weight is 100% is greater than the Si content in the second region when the total weight is 100% is greater.

2. The laminated coil component according to claim 1, characterized in that, The first region contains more than 30.0% by weight of Si when the total weight is set to 100% by weight, converted to SiO2.

3. The laminated coil component according to claim 2, characterized in that, The first region, when the total weight is set to 100% by weight, includes: The Si content, calculated as SiO2, is 30.0% to 85.0% by weight or more. The amount of B, calculated as B2O3, is 4.0% to 15.0% by weight. Fe, converted to Fe2O3, is calculated as 0% by weight or more and 45.0% by weight or less. Ni, converted to NiO, is calculated as 0% by weight or more and 15.0% by weight or less. Zn, calculated as 0% to 8.0% by weight of Zn, is equivalent to ZnO. The amount of Cu is calculated as 0% to 5.0% by weight of CuO.

4. The laminated coil component according to claim 3, characterized in that, The first region, when the total weight is set to 100% by weight, also includes: The K content, calculated as 0.3% to 1.5% by weight (based on K2O conversion), is... The amount of Mg is calculated as 0.9% to 3.5% by weight, which is equivalent to MgO.

5. The laminated coil component according to claim 1, characterized in that, The second region contains less than 25.0% Si when the total weight is set to 100% by weight, converted to SiO2.

6. The laminated coil component according to claim 5, characterized in that, The second region, when the total weight is set to 100% by weight, includes: The Si content calculated using SiO2 as a conversion factor is 0% to 25.0% by weight. Calculated using B2O3 as a conversion factor, B is 0% to 5.0% by weight. Fe, converted to Fe2O3, is 45.0% to 70.0% by weight or more. Ni, converted to NiO, is 10.0% to 20.0% by weight or more. Zn, calculated as 5.0% to 12.0% by weight (based on ZnO conversion).

7. The laminated coil component according to any one of claims 1 to 6, characterized in that, The Si content in the first region when the total weight is 100% by weight is more than 7.0% by weight more than the Si content in the second region when the total weight is 100% by weight, calculated as SiO2.

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