Phase change energy storage and cooling system and electronic components

Abstract

A phase-change energy storage heat dissipation system and an electronic component, the phase-change energy storage heat dissipation system is suitable for a periodically or pulsed heating element with a horizontal heat dissipation surface, the phase-change energy storage heat dissipation system includes a plurality of panels arranged in a stacked manner, and the plurality of panels are perpendicular to the horizontal heat dissipation surface; a temperature-averaging plate and a heat dissipation component are arranged between the plurality of panels, the heat dissipation component is arranged adjacent to the temperature-averaging plate, at least part of the temperature-averaging plate is located at the bottom of the heat dissipation system in the vertical direction, and at least part of the heat dissipation component is located at the top of the heat dissipation system in the vertical direction; the heat dissipation component includes a phase-change material inlet and a channel, the phase-change material inlet is located at the top of the heat dissipation component in the vertical direction, the channel is located inside the heat dissipation component, there are multiple channels, and the multiple channels are connected to the phase-change material inlet. The present application can improve the heat dissipation effect of a periodically or pulsed heating element.

Description

Technical Field

[0001] The present application relates to the technical field of electronic components, and in particular to a phase change energy storage and heat dissipation system and an electronic component. Background Art

[0002] A heat pipe is a component that uses the liquid phase change process to carry the latent heat of vaporization to improve the heat transfer capacity of the cooling system. Cooling systems with heat pipes have been widely used in the electronic engineering industry.

[0003] In the related art, a heat dissipation system with heat pipes includes a heat-absorbing base plate, heat pipes and heat dissipation fins. The heat-absorbing base plate is connected to the heat dissipation surface of the heating element. Multiple heat pipes are arranged on the side of the heat-absorbing base plate away from the heat dissipation surface. The heat-absorbing ends of the multiple heat pipes are all connected to the heat-absorbing base plate, the heat dissipation ends of the multiple heat pipes are all away from the heating element, and the heat dissipation fins are connected to the heat dissipation ends of the heat pipes.

[0004] However, the heat dissipation system with the heat pipe has a poor heat dissipation effect on the heating element. Summary of the Invention

[0005] In view of the above problems, the present application provides a phase change energy storage heat dissipation system and an electronic component, which can improve the heat dissipation effect of the heating element.

[0006] In order to achieve the above objectives, this application provides the following technical solutions:

[0007] A first aspect of the embodiments of the present application provides a phase-change energy storage and heat dissipation system suitable for a periodically or pulsed heating element having a horizontal heat dissipation surface, wherein the phase-change energy storage and heat dissipation system comprises a plurality of panels arranged in a stacked manner, wherein the plurality of panels are perpendicular to the horizontal heat dissipation surface;

[0008] A temperature vapor chamber and a heat dissipation assembly are provided between the plurality of panels, the heat dissipation assembly is provided adjacent to the temperature vapor chamber, at least part of the temperature vapor chamber is located at the bottom of the heat dissipation system in the vertical direction, and at least part of the heat dissipation assembly is located at the top of the heat dissipation system in the vertical direction;

[0009] The heat dissipation component includes a phase change material inlet and a channel. The phase change material inlet is located at the top of the heat dissipation component in the vertical direction. The channel is located inside the heat dissipation component. There are multiple channels, and all of the channels are connected to the phase change material inlet.

[0010] In a feasible embodiment, the plurality of channels are arranged in a network and are interconnected, and at least one channel is connected to the phase change material inlet.

[0011] In a feasible embodiment, a plurality of the channels are arranged in parallel, and each channel extends in a vertical direction; the top of each channel in the vertical direction is connected to the phase change material inlet, and the bottom of each channel in the vertical direction is connected to each other.

[0012] In one possible implementation, the device further comprises a uniform distribution pool and a partition, wherein both the uniform distribution pool and the partition are located between the phase change material inlet and the channel;

[0013] The uniform distribution pool is located on a side of the partition close to the phase change material inlet, and the uniform distribution pool is connected to the phase change material inlet;

[0014] The partition is provided with a plurality of through holes, and the through holes are connected with the uniform distribution pool and the channel.

[0015] In one possible implementation, the vapor chamber includes a condensate pool and a steam chamber, the condensate pool is located at the bottom of the heat dissipation system in the vertical direction, and the steam chamber is located at the top of the heat dissipation system in the vertical direction;

[0016] The extension plane of the condensate pool is parallel to the horizontal heat dissipation surface, the extension direction of the steam chamber is perpendicular to the extension plane of the condensate pool, and the bottom of the steam chamber along the vertical direction is connected to the condensate pool;

[0017] At least a portion of the heat dissipation component is located at the top of the heat dissipation system along the vertical direction, and the heat dissipation component and the steam chamber are adjacently arranged.

[0018] In a feasible embodiment, the condensate pool includes a plurality of micro-channels, the plurality of micro-channels are parallel to each other in an extension plane of the condensate pool, and adjacent micro-channels are connected to each other through the steam chamber.

[0019] In an achievable embodiment, the vapor chamber further comprises a steam chamber micro-channel, wherein a plurality of the steam chamber micro-channels are provided, and the plurality of steam chamber micro-channels are all located on the cavity wall of the steam chamber;

[0020] Each of the steam chamber microchannels extends along the extension direction of the steam chamber, and a bottom end of each of the steam chamber microchannels in the vertical direction is communicated with the condensate pool.

[0021] In one possible implementation, the steam chamber includes a plurality of sub-steam chambers, and the plurality of sub-steam chambers are arranged at intervals in a direction parallel to the horizontal heat dissipation surface;

[0022] The bottoms of the plurality of sub-steam chambers along the vertical direction are all connected to each other and to the condensate pool, and the tops of the plurality of sub-steam chambers along the vertical direction are all connected to each other.

[0023] In one possible implementation, at least part of the sub-steam chambers are located between part of the panels, and part of the panels include a plurality of first sequence panels and a plurality of second sequence panels, and the plurality of first sequence panels and the plurality of second sequence panels are alternately distributed in sequence;

[0024] The first sequence panel is provided with a plurality of first longitudinal through holes spaced apart and distributed in a direction parallel to the horizontal heat dissipation surface, and the solid parts between adjacent first longitudinal through holes form a first longitudinal support;

[0025] The second sequence panel is provided with a plurality of second longitudinal through holes spaced apart and distributed in a direction parallel to the horizontal heat dissipation surface, and the solid parts between adjacent second longitudinal through holes form second longitudinal supports;

[0026] Along the thickness direction of the panel, the first longitudinal through hole and the second longitudinal through hole are connected to each other; the first longitudinal support located in the middle of the first longitudinal through hole in the vertical direction and the second longitudinal support located in the middle of the second longitudinal through hole are connected to each other; the first longitudinal support located at both ends of the first longitudinal through hole in the vertical direction and the second longitudinal support located at both ends of the second longitudinal through hole in the vertical direction are at least partially staggered.

[0027] In one possible implementation, a plurality of steam chambers are provided, the plurality of steam chambers are spaced apart, and the bottom ends of the steam chambers in the vertical direction are connected to each other and to the condensate pool;

[0028] The heat dissipation assembly includes a first heat dissipation assembly, and the first heat dissipation assembly is located between the plurality of steam chambers.

[0029] In a feasible embodiment, the heat dissipation assembly further includes a second heat dissipation assembly, the second heat dissipation assembly is located on at least one side outside the plurality of steam chambers, and the second heat dissipation assembly and the first heat dissipation assembly are interconnected.

[0030] A second aspect of an embodiment of the present application provides an electronic component, comprising a heating element and the above-mentioned heat dissipation system, wherein the heating element has a horizontal heat dissipation surface, and the heat dissipation system is arranged on a side of the heating element close to the horizontal heat dissipation surface.

[0031] The embodiment of the present application provides a phase-change energy storage and heat dissipation system and an electronic component. The phase-change energy storage and heat dissipation system is particularly suitable for periodically or pulsed heating elements with a horizontal heat dissipation surface. The energy storage phase-change heat dissipation system is provided with a temperature equalizing plate and a heat dissipation component, so that the end of the temperature equalizing plate relatively close to the horizontal heat dissipation surface forms an evaporation end to absorb the heat of the heating element, and the end of the temperature equalizing plate relatively far from the horizontal heat dissipation surface forms an evaporation end to dissipate heat through the adjacent heat dissipation component; by providing a plurality of panels perpendicular to the horizontal heat dissipation surface, the plurality of panels form a layered structure, and the heat of the heating element flows along the layers where the panels are located, with smaller flow resistance, and the heat can quickly diffuse from the end close to the horizontal heat dissipation surface to the end far from the horizontal heat dissipation surface, resulting in higher heat dissipation efficiency and better heat dissipation effect; by arranging the heat dissipation component on the panel and adjacent to the temperature equalizing plate, the temperature equalizing plate is formed. The panel and heat dissipation assembly are separated by only a single wall, avoiding the contact thermal resistance and structural redundancy caused by physical structural connections, allowing heat to diffuse rapidly along the panel. By providing channels, phase-change material is filled into the channels during use. The phase-change material absorbs heat from the heat spreader and stores latent heat during the operating cycle of the heating element. It also exchanges heat with the surrounding environment and releases latent heat during the heating element's non-operating period. In this cycle, the phase-change material periodically or pulse-wise dissipates heat from the heating element to the surrounding environment. Multiple channels divide the phase-change material, expanding the heat transfer area between the heat spreader and the phase-change material, enhancing the heat transfer effect between the two, and improving the heat dissipation capacity of the heat dissipation system. This electronic component, including the above-mentioned heat dissipation system, has the same beneficial effects.

[0032] The construction of the present application as well as other objects and advantageous effects will become more apparent through the description of the preferred embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0034] Figure 1 A brief schematic diagram of the phase change energy storage and heat dissipation system provided in an embodiment of the present application;

[0035] Figure 2 for Figure 1 Top view in ;

[0036] Figure 3 for Figure 1 AA-direction specific structural diagram;

[0037] Figure 4 for Figure 3A partial enlarged view of point B;

[0038] Figure 5 for Figure 3 A partial enlarged view of point C in the middle

[0039] Figure 6 for Figure 1 BB view;

[0040] Figure 7 for Figure 6 A partial enlarged view of point D;

[0041] Figure 8 for Figure 6 A local enlarged view of point E;

[0042] Figure 9 A schematic structural diagram of the first panel of the phase change energy storage and heat dissipation system provided in an embodiment of the present application;

[0043] Figure 10 A schematic structural diagram of the second panel of the phase change energy storage and heat dissipation system provided in an embodiment of the present application;

[0044] Figure 11 A schematic structural diagram of the third panel of the phase change energy storage and heat dissipation system provided in an embodiment of the present application;

[0045] Figure 12 A schematic structural diagram of the fourth panel of the phase change energy storage and heat dissipation system provided in an embodiment of the present application;

[0046] Figure 13 A schematic structural diagram of the fifth panel of the phase change energy storage and heat dissipation system provided in an embodiment of the present application;

[0047] Figure 14 A schematic structural diagram of the sixth panel of the phase change energy storage and heat dissipation system provided in an embodiment of the present application;

[0048] Figure 15 A schematic structural diagram of the seventh panel of the phase change energy storage and heat dissipation system provided in an embodiment of the present application;

[0049] Figure 16 A schematic structural diagram of the eighth panel of the phase change energy storage and heat dissipation system provided in an embodiment of the present application;

[0050] Figure 17 A schematic structural diagram of the ninth panel of the phase change energy storage and heat dissipation system provided in an embodiment of the present application;

[0051] Figure 18 A schematic structural diagram of the tenth panel of the phase change energy storage and heat dissipation system provided in an embodiment of the present application;

[0052] Figure 19This is a schematic structural diagram of the eleventh panel of the phase change energy storage and heat dissipation system provided in an embodiment of the present application.

[0053] Description of reference numerals:

[0054] 100-Phase change energy storage and heat dissipation system;

[0055] 101 - first panel; 102 - second panel; 103 - third panel; 104 - fourth panel; 105 - fifth panel; 106 - sixth panel; 107 - seventh panel; 108 - eighth panel; 109 - ninth panel; 110 - tenth panel; 111 - eleventh panel;

[0056] 210- condensate pool; 211- micro channel;

[0057] 220 - steam chamber; 221 - sub-steam chamber; 222 - first longitudinal through hole; 223 - first transverse through hole; 224 - first connecting pin hole; 225 - second longitudinal through hole; 226 - second transverse through hole; 227 - second connecting pin hole;

[0058] 301-first heat dissipation component; 302-second heat dissipation component;

[0059] 310-phase change material inlet;

[0060] 320-uniform pool;

[0061] 330-partition;

[0062] 340-channel; 331-first micropore; 332-second micropore;

[0063] Q-heat; X-phase change material; Y-condensate; Z-steam. DETAILED DESCRIPTION

[0064] In the related art, a heat dissipation system with a heat pipe includes a heat-absorbing base plate, a heat pipe and a heat dissipation fin. The heat-absorbing base plate is connected to the heat dissipation surface of the heating element through an interface material that reduces the contact thermal resistance. A plurality of heat pipes are provided on the side of the heat-absorbing base plate facing away from the heat dissipation surface. Each heat pipe is U-shaped, and the two ends of the U-shaped heat pipe are a heat-absorbing end and a heat-dissipating end respectively. The heat-absorbing end of each U-shaped heat pipe is clamped on the heat-absorbing base plate, and the heat-dissipating end of each U-shaped heat pipe is located on the side away from the heating element and is spaced apart from the heat-absorbing base plate. A plurality of heat-dissipating fins are provided, and the plurality of heat-dissipating fins are spaced apart in parallel and are riveted to the heat-dissipating end of the U-shaped heat pipe.

[0065] However, the manufacturing method of discretely connecting the heat sink fins and the heat pipes in the above technical solution increases the contact thermal resistance and causes unnecessary material redundancy. Not only is the manufacturing process complex and consuming, but the heat dissipation effect on heating elements that work periodically or pulsed is poor.

[0066] In response to the above technical problems, the embodiments of the present application provide a phase-change energy storage and heat dissipation system and an electronic component. The phase-change energy storage and heat dissipation system is particularly suitable for periodically or pulsed heating elements with a horizontal heat dissipation surface. The energy storage phase-change heat dissipation system is provided with a temperature equalizing plate and a heat dissipation component, so that the end of the temperature equalizing plate relatively close to the horizontal heat dissipation surface forms an evaporation end to absorb the heat of the heating element, and the end of the temperature equalizing plate relatively far from the horizontal heat dissipation surface forms an evaporation end to dissipate heat through the adjacent heat dissipation component; by providing a plurality of panels perpendicular to the horizontal heat dissipation surface, the plurality of panels form a layered structure, and the heat of the heating element flows along the layers where the panels are located, with less flow resistance, and the heat can quickly diffuse from the end close to the horizontal heat dissipation surface to the end far from the horizontal heat dissipation surface, resulting in higher heat dissipation efficiency and better heat dissipation effect; by arranging the heat dissipation component on the panel and adjacent to the temperature equalizing plate, the temperature equalizing plate is formed. The panel and heat dissipation assembly are separated by only a single wall, avoiding the contact thermal resistance and structural redundancy caused by physical structural connections, allowing heat to diffuse rapidly along the panel. By providing channels, phase-change material is filled into the channels during use. The phase-change material absorbs heat from the heat spreader and stores latent heat during the operating cycle of the heating element. It also exchanges heat with the surrounding environment and releases latent heat during the heating element's non-operating period. In this cycle, the phase-change material periodically or pulse-wise dissipates heat from the heating element to the surrounding environment. Multiple channels divide the phase-change material, expanding the heat transfer area between the heat spreader and the phase-change material, enhancing the heat transfer effect between the two, and improving the heat dissipation capacity of the heat dissipation system. This electronic component, including the above-mentioned heat dissipation system, has the same beneficial effects.

[0067] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below in conjunction with the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals throughout represent the same or similar parts or parts with the same or similar functions. The described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0068] The electronic components provided in the embodiments of the present application are described below.

[0069] An embodiment of the present application provides an electronic component, including a heating element and a heat dissipation system. The heating element has a horizontal heat dissipation surface and operates periodically or pulsedly. The heat dissipation system is arranged on a side of the heating element close to the horizontal heat dissipation surface.

[0070] Among them, the electronic components may include circuit boards, and the heating elements may include chips on the circuit boards. The application scope of electronic components may include scenarios such as aviation and aerospace thermal control, power battery thermal management, electronic device thermal management, and building thermal management. The heating elements may be heating elements that work periodically or pulsed, which may include not only low-power, low-heat-flux-density heating elements in large spaces, but also high-power, high-heat-flux-density heating elements in small spaces. For example, the circuit board may include a circuit board in a lunar rover, whose heating elements have the characteristics of periodic operation. The circuit board may also be a circuit board in a missile electronic system, whose heating elements have the characteristics of pulsed operation.

[0071] It is understood that as the position and posture of the electronic component changes during use, the position and posture of the horizontal heat dissipation surface also change accordingly, that is, the horizontal heat dissipation surface can be tilted or vertical. The embodiments of the present application do not strictly require that the horizontal heat dissipation surface always remain horizontal, but rather that the horizontal heat dissipation surface can generally be horizontal.

[0072] The following will refer to Figures 1-19 The phase change energy storage and heat dissipation system 100 provided in an embodiment of the present application is described.

[0073] An embodiment of the present application provides a phase-change energy storage and heat dissipation system 100, which is suitable for a heating element with a horizontal heat dissipation surface that operates periodically or pulsed. The phase-change energy storage and heat dissipation system 100 includes a plurality of stacked panels, and the plurality of panels are perpendicular to the horizontal heat dissipation surface.

[0074] A temperature spreader and a heat dissipation assembly are arranged between the multiple panels. The heat dissipation assembly is arranged adjacent to the temperature spreader. At least part of the temperature spreader is located at the bottom of the heat dissipation system in the vertical direction, and at least part of the heat dissipation assembly is located at the top of the heat dissipation system in the vertical direction.

[0075] The heat dissipation component includes a phase change material inlet 310 and a channel 340 . The phase change material inlet 310 is located at the top of the heat dissipation component in the vertical direction. The channel 340 is located inside the heat dissipation component. There are multiple channels 340 , and all of the multiple channels 340 are connected to the phase change material inlet 310 .

[0076] The panel may comprise a ceramic, metal, or composite material. For example, the panel may be a copper alloy sheet or a stainless steel sheet. The panels may have the same shape and size, such that their orthographic projections on each other overlap, and the panels may be welded together.

[0077] Multiple panels are perpendicular to the horizontal heat dissipation surface, forming a layered structure. Heat Q from the heating element flows along the layers where the panels are located, reducing flow resistance. Heat Q can quickly diffuse from the end closest to the horizontal heat dissipation surface to the end farther away from the horizontal heat dissipation surface, improving heat dissipation efficiency and effectiveness.

[0078] A vapor chamber is a heat pipe structure formed within multiple panels. By arranging the panels perpendicular to the horizontal heat dissipation surface, the vapor chamber achieves improved heat transfer and heat dissipation. Furthermore, at least a portion of the vapor chamber is located at the vertical bottom of the heat dissipation system. The portion of the vapor chamber that is relatively close to the horizontal heat dissipation surface forms the evaporation end, absorbing heat Q from the heating element. The end of the vapor chamber that is relatively far from the horizontal heat dissipation surface forms the condensation end. Heat Q transferred to the condensation end is dissipated through the adjacent heat dissipation component.

[0079] The heat sink is formed within multiple panels. The panels' perpendicular placement relative to the horizontal heat sink surface enhances heat transfer and dissipation. Furthermore, the adjacent heat sink and vapor chamber, separated by a single wall, avoid the contact thermal resistance and structural redundancy inherent in physical connections, allowing heat Q to diffuse rapidly along the panels.

[0080] Phase change material inlet 310 is used to charge phase change material X into channel 340. Phase change material X has a high latent heat per unit mass, but many phase change materials X have poor thermal conductivity (for example, the thermal conductivity of paraffin, a phase change material X, is much lower than that of materials such as metals, semiconductors, and ceramics). This severely impacts the energy storage and release rates of phase change material X. Phase change material X enters channel 340 and is divided by multiple channels 340. This expands the heat transfer area between phase change material X and the vapor chamber, enhancing heat transfer between them and improving the heat dissipation capacity of the heat dissipation system.

[0081] The phase change material X undergoes a phase change transformation of the material state by absorbing or releasing a large amount of latent heat, which can realize the storage and release of a large amount of heat Q at a constant temperature. According to the principle of conservation of energy, for the entire phase change energy storage and heat dissipation system 100, the heat Q applied by the heating element to the phase change material X through the temperature homogenizer, the solid sensible heat absorption in the phase change material X, the phase change latent heat absorption during the melting process, the liquid sensible heat absorption, and the heat Q of the phase change material X and the surrounding environment are all the same. Therefore, the heat Q in the heating element can be dissipated to the surrounding environment through the temperature homogenizer and the phase change material X in turn, realizing the transfer process of heat Q. In addition, the phase change material X can absorb the heat Q of the temperature homogenizer and store latent heat during the working cycle of the heating element, and can also exchange heat with the surrounding environment and release latent heat during the non-working period of the heating element. In this cycle, the phase change material X periodically or pulsedly dissipates the heat Q of the heating element to the surrounding environment along with the heating element. Among them, pulse can be understood as a special case of periodicity, which has only one working cycle, and the rest of the time is a non-working cycle.

[0082] For example, the phase change material X can be solid at room temperature. When the heating element is in its operating cycle, the phase change material X absorbs heat Q, causing its temperature to rise continuously, and the phase change material X to soften. Near its melting point, the phase change material X is in a solid-liquid mixed state and maintains a constant temperature. When the heating element is not in its operating cycle, the solid-liquid mixed phase change material X releases heat Q to the surrounding environment and gradually hardens. As the heat Q is continuously released, the phase change material X solidifies again.

[0083] It is understood that in order to make the temperature fluctuations of the phase-change energy storage and heat dissipation system 100 uniform and prevent the temperature of the heating element from exceeding the allowable temperature during the operating cycle, the heat absorption of the phase-change material X should be matched with the heat output of the heating element to prevent the phase-change material X from completely melting and causing further temperature increases. Furthermore, since the phase-change material X is in a solid-liquid mixed state during the operating cycle, a sealing cover (not shown) should be provided at the phase-change material inlet 310 to prevent the phase-change material X from overflowing through the phase-change material inlet 310.

[0084] It is understandable that the size of the channel 340 can be conventional millimeter-level size or micrometer-level size, and both can achieve the above technical effects. The following description assumes that the size of the channel 340 is micrometer-level size.

[0085] In the embodiment of the present application, the multiple channels 340 may include the following two arrangements:

[0086] In the first possible arrangement, refer to Figure 3-Figure 8 As shown, the plurality of channels 340 are arranged in a network and are interconnected, and at least one channel 340 is connected to the phase change material inlet 310 .

[0087] In this way, a plurality of interconnected channel sections can be formed inside the heat dissipation component, which can expand the heat transfer area between the phase change material X and the temperature homogenizing plate and improve the heat dissipation effect.

[0088] In a feasible embodiment, the channel 340 can be composed of multiple Figure 10 The second panel 102 and the plurality of Figure 11 The third panels 103 are formed by alternately stacking and welding.

[0089] The second panel 102 is provided with a plurality of first micropores 331. Each first micropore 331 extends in a direction parallel to the horizontal heat dissipation surface, and the plurality of first micropores 331 are spaced apart in a direction perpendicular to the horizontal heat dissipation surface. The third panel 103 is provided with a plurality of second micropores 332. Each second micropore 332 extends in a direction perpendicular to the horizontal heat dissipation surface, and the plurality of second micropores 332 are spaced apart in a direction parallel to the horizontal heat dissipation surface.

[0090] When the second panel 102 and the third panel 103 are stacked, portions of the first micropores 331 and the second micropores 332 are partially interconnected, forming a network of interconnected channels 340. Furthermore, the substantial portions between the first micropores 331 on the second panel 102 are interconnected with the substantial portions between the second micropores 332 on the third panel 103, ensuring sufficient structural strength for the heat dissipation assembly.

[0091] In some embodiments, multiple stacked second panels 102 can be provided, and then multiple stacked third panels 103 can be welded adjacent to each other. The first micropores 331 on the multiple second panels 102 are interconnected, and the second micropores 332 on the multiple third panels 103 are interconnected, and the two intersect to form a set of channel segments. Multiple sets of adjacent channel segments can be provided to form interconnected channels 340 arranged in a network.

[0092] In some embodiments, as Figure 16-Figure 19 As shown, a portion of the structure of the temperature equalizer is required to be provided at the bottom of the panel near the vertical direction where the channel 340 is partially formed, so that the number and length of the first micropores 331 and the second micropores 332 at corresponding locations are slightly different. However, this does not affect the first micropores 331 and the second micropores 332 at other locations from being interconnected to form the channel 340. The embodiment of the present application does not impose any restrictions on the extension length of the first micropores 331 and the second micropores 332, as long as the first micropores 331 and the second micropores 332 staggered on adjacent panels can be interconnected to provide a circulation channel for the refrigerant.

[0093] In a second possible arrangement, multiple channels 340 are arranged in parallel, and each channel 340 extends in the vertical direction; the top of each channel 340 in the vertical direction is connected to the phase change material inlet 310, and the bottom of each channel 340 in the vertical direction is connected to each other.

[0094] In one feasible embodiment, second micropores 332 can be formed on multiple stacked panels. The second micropores 332 on adjacent panels are interconnected to form multiple parallel channels 340. Furthermore, the solid portions between the second micropores 332 on each panel are interconnected with the solid portions between the second micropores 332 on adjacent panels, ensuring sufficient structural strength of the heat dissipation assembly.

[0095] In this way, the channel 340 can also divide the phase change material X and increase the heat transfer area between the temperature homogenizing plate and the phase change material X, thereby improving the heat dissipation effect.

[0096] It should be noted that, in the two possible arrangements of the channel 340 , the channel 340 may extend along a straight line or along a curve, which is not limited in the embodiment of the present application.

[0097] In one possible implementation, Figure 3 and Figure 6 As shown, the phase change energy storage and heat dissipation system 100 further includes a uniform distribution pool 320 and a partition 330 , and both the uniform distribution pool 320 and the partition 330 are located between the phase change material inlet 310 and the channel 340 .

[0098] The uniform distribution pool 320 is located on a side of the partition plate 330 close to the phase change material inlet 310 , and the uniform distribution pool 320 is in communication with the phase change material inlet 310 .

[0099] The partition 330 is provided with a plurality of through holes, which communicate with the uniform distribution pool 320 and the channel 340 .

[0100] The uniformly distributed pool 320 can be formed by interconnected through-holes on multiple panels, or can be formed by the aforementioned channel 340. The partition 330 can be formed by welding the solid parts of multiple panels together, with vertical through-holes formed on some of the panels to connect the uniformly distributed pool 320 and the channel 340.

[0101] In this way, the uniform distribution pool 320 and the partition 330 can form a buffer structure between the channel 340 and the phase change material inlet 310, which is conducive to the uniform distribution of the phase change material X.

[0102] In one possible implementation, Figures 13-19As shown, the temperature homogenizing plate includes a condensation pool 210 and a steam chamber 220 . The condensation pool 210 is located at the bottom of the heat dissipation system in the vertical direction, and the steam chamber 220 is located at the top of the heat dissipation system in the vertical direction.

[0103] The extension plane of the condensate pool 210 is parallel to the horizontal heat dissipation surface, the extension direction of the steam chamber 220 is perpendicular to the extension plane of the condensate pool 210 , and the bottom of the steam chamber 220 is connected to the condensate pool 210 in the vertical direction.

[0104] At least a portion of the heat dissipation component is located at the top of the heat dissipation system in the vertical direction, and the heat dissipation component and the steam chamber 220 are adjacently disposed.

[0105] The condensate pool 210 is arranged near the horizontal heat dissipation surface. The condensate Y in the condensate pool 210 absorbs the heat Q of the heating element and undergoes a vaporization phase change to steam Z. The steam Z after the phase change enters the steam chamber 220 and flows toward the end of the steam chamber 220 away from the horizontal heat dissipation surface. During the flow of steam Z, its heat Q is absorbed by the phase change material X in the heat dissipation component and changes into condensate Y. The condensate Y after the phase change flows back into the condensate pool 210 along the cavity wall of the steam chamber 220, and this cycle repeats continuously, dissipating the heat Q of the heating element through the heat dissipation component.

[0106] The extended surface of the condensate pool 210 is distributed across the entire horizontal heat dissipation surface, increasing the contact area between the condensate Y and the horizontal heat dissipation surface and dissipating heat uniformly at all locations on the horizontal heat dissipation surface. The heat dissipation assembly is positioned adjacent to the steam chamber 220 to maximize absorption of heat Q transferred from the steam chamber 220.

[0107] In one possible implementation, Figure 5 and Figure 8 Combined with Figure 13 and Figure 14 As shown, the condensate pool 210 includes a plurality of micro channels 211 . The plurality of micro channels 211 are parallel to each other in an extension plane of the condensate pool 210 . The plurality of micro channels 211 are interconnected through the steam chamber 220 .

[0108] Each panel can be formed with at least one micro-channel 211. Both sidewalls of the micro-channel 211 are parallel to the horizontal heat dissipation surface, and the opening of the micro-channel 211 points toward the adjacent panel. At least one point on the sidewall of the micro-channel 211 facing away from the horizontal heat dissipation surface is connected to the steam chamber 220. In this way, the micro-channels 211 on adjacent panels can be interconnected through the steam chamber 220, facilitating the distribution of the condensate Y within each micro-channel 211.

[0109] The structure of the plurality of micro-channels 211 can form a micro-channel 211 group, so that the condensate Y can be evenly distributed in the micro-channel 211 group, and the heat dissipation area between the condensate Y and the heating element can be expanded.

[0110] To further expand the heat dissipation area between the condensate Y and the heating element, the panel formed with the micro-grooves 211 can have a thickness ranging from 0.05 mm to 0.1 mm. For example, the panel thickness can range from 0.05 mm, 0.07 mm, or 0.1 mm. This ensures sufficient structural strength while allowing for the formation of as many micro-grooves 211 as possible within a certain thickness range. The thickness of other panels (such as the second panel 102 and the third panel 103) can range from 0.3 mm to 0.4 mm, which meets design requirements while also saving costs.

[0111] The micro-grooves 211 can be formed by a material removal process, for example, by using a semi-etching technique, in which a portion of the thickness of the solid material at the corresponding location of the thin plate is removed using an etching solution, while a portion of the thickness of the solid material is retained, and the space where the material is removed forms the micro-grooves 211. The cross-sectional shape of the micro-grooves 211 can include a triangle, a rectangle, a trapezoid, or a polygon.

[0112] In a feasible embodiment, the temperature vapor chamber further includes a steam cavity micro-groove (not shown), and a plurality of steam cavity micro-grooves are provided. The plurality of steam cavity micro-grooves are all located on the cavity wall of the steam cavity 220 .

[0113] Each steam chamber micro-channel extends along the extension direction of the steam chamber 220 , and the bottom end of each steam chamber micro-channel in the vertical direction is connected to the condensate pool 210 .

[0114] In this way, the condensate L in the condensate pool 210 can enter the steam chamber 220 via the steam microchannels, and the condensate L in the steam microchannels can be heated and vaporized in the steam chamber 220, further increasing the heat dissipation area of ​​the condensate L and improving the heat dissipation efficiency.

[0115] It is understandable that the steam micro-channels can be grooved in the middle of the panel in the thickness direction to form a micro-channel structure, and can also be grooved in the side of the panel in the thickness direction, and the micro-channel structure can be formed together with the help of adjacent panels.

[0116] In one possible implementation, Figure 13 and Figure 14 As shown, the steam chamber 220 includes a plurality of sub-steam chambers 220 , and the plurality of sub-steam chambers 220 are arranged at intervals along a direction parallel to the horizontal heat dissipation surface.

[0117] The bottoms of the plurality of sub-steam chambers 220 along the vertical direction are all connected to each other and to the condensate pool 210 , and the tops of the plurality of sub-steam chambers 220 along the vertical direction are all connected to each other.

[0118] In this way, the steam chamber 220 is set as a structure in which multiple sub-steam chambers 220 are interconnected, which not only ensures that the steam Z formed by the condensate pool 210 diffuses rapidly along the sub-steam chamber 220, but also forms support in the solid part between adjacent sub-steam chambers 220. The supports on adjacent panels are connected to each other, which can ensure the structural strength of the temperature equalizing plate.

[0119] In a feasible embodiment, at least part of the sub-steam chambers 221 are located between some panels, and the some panels include a plurality of first sequence panels and a plurality of second sequence panels, and the plurality of first sequence panels and the plurality of second sequence panels are alternately distributed in sequence.

[0120] The first sequence panel is provided with a plurality of first longitudinal through holes 222 spaced apart and distributed in a direction parallel to the horizontal heat dissipation surface, and the solid portions between adjacent first longitudinal through holes 222 form first longitudinal supports.

[0121] The second sequence panel is provided with a plurality of second longitudinal through holes 225 spaced apart and distributed in a direction parallel to the horizontal heat dissipation surface, and the solid portions between adjacent second longitudinal through holes 225 form second longitudinal supports.

[0122] Along the thickness direction of the panel, the first longitudinal through-hole 222 and the second longitudinal through-hole 225 are interconnected. The first longitudinal support located in the middle of the first longitudinal through-hole 222 in the vertical direction and the second longitudinal support located in the middle of the second longitudinal through-hole 225 are interconnected. The first longitudinal supports located at both ends of the first longitudinal through-hole 222 in the vertical direction and the second longitudinal supports located at both ends of the second longitudinal through-hole 225 in the vertical direction are at least partially staggered.

[0123] In the embodiment of the present application, the steam chamber 220 may be composed of multiple Figure 13 The fifth panel 105 (ie, the first sequence panel) and the plurality of panels shown are Figure 14 The sixth panel 106 (ie, the second sequence of panels) is formed by alternately stacking and welding.

[0124] The fifth panel 105 is provided with a plurality of first longitudinal through holes 222. Each first longitudinal through hole 222 extends perpendicular to the horizontal heat dissipation surface, and a gap is provided between each first longitudinal through hole 222 and the condensate pool 210. The plurality of first longitudinal through holes 222 are spaced apart in a direction parallel to the horizontal heat dissipation surface.

[0125] Among them, the first longitudinal through holes 222 located in the odd-numbered columns are provided with first connecting pin holes 224 at the bottom in the vertical direction. The first connecting pin holes 224 extend toward the condensate pool 210 and are connected with the condensate pool 210. The first connecting pin holes 224 also extend toward the direction of the first longitudinal through holes 222 of the adjacent previous even-numbered columns and are connected with the bottom of the first longitudinal through holes 222 of the previous even-numbered columns in the vertical direction. Among them, the direction close to the refrigerant inlet is called the front, and the direction close to the refrigerant outlet is called the rear. Thus, the first longitudinal supports located at the bottom in the vertical direction are connected to each other in pairs, and one of the first longitudinal supports is connected to the bottom of the condensate pool 210.

[0126] The fifth panel 105 is also provided with first transverse through holes 223. These first transverse through holes 223 are located at the top vertical ends of each first longitudinal through hole 222 and extend parallel to the horizontal heat dissipation surface. A gap is provided between the first transverse through holes 223 and the top vertical ends of each first longitudinal through hole 222. As a result, the first longitudinal supports at the top vertical ends are sequentially connected to one another, and the two first longitudinal supports at the ends parallel to the horizontal heat dissipation surface are each connected to the solid portion of the fifth panel 105.

[0127] The sixth panel 106 is provided with a plurality of second longitudinal through holes 225. Each second longitudinal through hole 225 extends perpendicular to the horizontal heat dissipation surface, and a gap is provided between each second longitudinal through hole 225 and the condensate pool 210. The plurality of second longitudinal through holes 225 are spaced apart in a direction parallel to the horizontal heat dissipation surface.

[0128] The second longitudinal through holes 225 in the odd-numbered columns are provided with second connecting pin holes 227. These second connecting pin holes 227 extend toward and communicate with the condensate pool 210. These second connecting pin holes 227 also extend toward the second longitudinal through holes 225 in the next even-numbered column and communicate with the vertical bottom of the second longitudinal through holes 225 in that column. Thus, the second longitudinal supports at the bottom of the vertical direction are connected to each other in pairs, and one of the second longitudinal supports is connected to the bottom of the condensate pool 210.

[0129] The sixth panel 106 is also provided with second transverse through-holes 226. These are located at the vertical top ends of each second vertical micro-hole and extend parallel to the horizontal heat dissipation surface. A gap is provided between the second transverse through-holes 226 and the vertical top ends of each second longitudinal through-hole 225. This ensures that the second longitudinal supports at the vertical tops are sequentially connected to one another, and the two second longitudinal supports at the two ends parallel to the horizontal heat dissipation surface are each connected to the solid portion of the sixth panel 106.

[0130] Between the fifth and sixth panels 105 and 106, in the middle of the vertical direction, each first longitudinal through hole 222 and each second longitudinal through hole 225 are interconnected, forming a sub-steam chamber 221. At the bottom of the vertical direction, adjacent first longitudinal through holes 222 are interconnected via the first connecting pin hole 224 and the second longitudinal through hole 225, while adjacent second longitudinal through holes 225 are interconnected via the second connecting pin hole 227 and the first longitudinal through hole 222. At the top of the vertical direction, the distance between the second longitudinal through hole 225 and the condensate pool 210 is smaller than the distance between the first longitudinal through hole 222 and the condensate pool 210. The orthographic projection of the second transverse through hole 226 on the fifth panel 105 overlaps the first transverse through hole 223 and the top ends of each first longitudinal through hole 222, so that each first longitudinal through hole 222 is interconnected via the second transverse through hole 226, and each second longitudinal through hole 225 is interconnected via the first longitudinal through hole 222 and the second transverse through hole 226.

[0131] In a feasible embodiment, the heat dissipation system further includes a liquid injection port (not shown) with a sealing cover, and the liquid injection port is connected to the top end of the steam chamber 220 in the vertical direction.

[0132] In this way, supplementary condensate Y can be injected into the condensate pool 210 through the liquid injection port.

[0133] In one possible implementation, Figure 3 and Figure 6 As shown, a plurality of steam chambers 220 are provided, and the plurality of steam chambers 220 are distributed at intervals, and the bottom ends of the steam chambers 220 along the vertical direction are connected to each other and to the condensate pool 210 .

[0134] The heat dissipation assembly includes a first heat dissipation assembly 301 , which is located between the plurality of steam chambers 220 .

[0135] In this way, the condensate pool 210 absorbs heat Q from the heating element and converts it into steam Z. The steam Z can flow within different steam chambers 220 and dissipate the heat Q through the first heat dissipation components 301 between the steam chambers 220. The first heat dissipation components 301 are formed between the multiple steam chambers 220, ensuring full contact between the first heat dissipation components 301 and the steam chambers 220, thereby improving the heat dissipation effect.

[0136] In a feasible embodiment, the heat dissipation assembly further includes a second heat dissipation assembly 302 , which is located on at least one side outside the plurality of steam chambers 220 , and the second heat dissipation assembly 302 and the first heat dissipation assembly 301 are interconnected.

[0137] In this way, multiple steam chambers 220 form a common area, and a second heat dissipation component 302 is set on the side of the steam chamber 220 located at the edge of the common area, away from the center. The second heat dissipation component 302 is used to assist in absorbing the heat Q of multiple steam chambers 220, further improving the heat dissipation effect.

[0138] In the embodiment of the present application, two steam chambers 220 are arranged at intervals, and a first heat dissipation component 301 is arranged between the two steam chambers 220. Second heat dissipation components 302 are respectively arranged on the left side of the left steam chamber 220 and on the right side of the right steam chamber 220.

[0139] It is worth mentioning that Figures 9-19 Only the panels in the partial arrangement order forming the phase change energy storage and heat dissipation system 100 are shown. For example, a set number of panels such as Figures 9-19 These panels are stacked one on top of the other to form Figure 3 and Figure 6 The second heat dissipation component 302, the steam chamber 220 and the first heat dissipation component 301 on the left side of the phase change energy storage and heat dissipation system 100 are shown, while the steam chamber 220 and the second heat dissipation component 302 on the right side can be symmetrically arranged with reference to the structure of the above panel.

[0140] It should be noted that, in the description of the embodiments of this application, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0141] In the description of the embodiments of the present application, the terms "upper," "lower," "front," "back," "vertical," "horizontal," "top," "bottom," "inside," "outside," and the like indicate positions or location relationships based on the positions or location relationships shown in the accompanying drawings. These terms are intended only to facilitate the description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present application. Furthermore, the term "plurality" means two or more, unless otherwise specifically specified.

[0142] In the description of the embodiments of the present application, the terms "first," "second," "third," "fourth," etc. (if any) are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the numbers used in this way are interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products, or apparatus.

[0143] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A phase change energy storage and heat dissipation system, characterized in that: Suitable for a periodic or pulsed heating element with a horizontal heat dissipation surface, the phase change energy storage heat dissipation system comprises a plurality of panels arranged in a stacked manner, and the plurality of panels are perpendicular to the horizontal heat dissipation surface; A temperature averaging plate and a heat dissipation component are arranged between the plurality of panels, the heat dissipation component is arranged adjacent to the temperature averaging plate, at least part of the temperature averaging plate is located at the bottom of the heat dissipation system in the vertical direction, and at least part of the heat dissipation component is located at the top of the heat dissipation system in the vertical direction; The heat dissipation component includes a phase change material inlet and a channel. The phase change material inlet is located at the top of the heat dissipation component in the vertical direction, and the channel is located inside the heat dissipation component. There are multiple channels, and the multiple channels are all connected to the phase change material inlet.

2. The phase change energy storage and heat dissipation system according to claim 1, characterized in that: The plurality of channels are arranged in a mesh shape and are interconnected, and at least one of the channels is connected to the phase change material inlet.

3. The phase change energy storage and heat dissipation system according to claim 1, characterized in that: The plurality of channels are arranged in parallel, and each of the channels extends in a vertical direction; the top of each of the channels in the vertical direction is connected to the phase change material inlet, and the bottom of each of the channels in the vertical direction is connected to each other.

4. The phase change energy storage and heat dissipation system according to any one of claims 1 to 3, characterized in that: It also includes a uniform distribution pool and a partition, wherein the uniform distribution pool and the partition are both located between the phase change material inlet and the channel; The uniform distribution pool is located on one side of the partition plate close to the phase change material inlet, and the uniform distribution pool is connected to the phase change material inlet; The partition is provided with a plurality of through holes, and the through holes are connected with the uniform distribution pool and the channel.

5. The phase change energy storage and heat dissipation system according to any one of claims 1 to 3, characterized in that: The temperature homogenizing plate includes a condensate pool and a steam chamber, wherein the condensate pool is located at the bottom of the heat dissipation system in the vertical direction, and the steam chamber is located at the top of the heat dissipation system in the vertical direction; The extension plane of the condensate pool is parallel to the horizontal heat dissipation surface, the extension direction of the steam chamber is perpendicular to the extension plane of the condensate pool, and the bottom of the steam chamber along the vertical direction is connected to the condensate pool; At least a portion of the heat dissipation component is located at the top of the heat dissipation system along the vertical direction, and the heat dissipation component and the steam chamber are adjacently arranged.

6. The phase change energy storage and heat dissipation system according to claim 5, characterized in that: The condensate pool includes a plurality of micro channels, the plurality of micro channels are parallel to each other in an extension plane of the condensate pool, and adjacent micro channels are connected to each other through the steam chamber.

7. The phase change energy storage and heat dissipation system according to claim 5, characterized in that: The temperature homogenizing plate further comprises a steam cavity micro-channel, wherein a plurality of the steam cavity micro-channels are provided, and the plurality of the steam cavity micro-channels are all located on the cavity wall of the steam cavity; Each of the steam chamber microchannels extends along the extension direction of the steam chamber, and the bottom end of each of the steam chamber microchannels along the vertical direction is connected to the condensate pool.

8. The phase change energy storage and heat dissipation system according to claim 5, characterized in that: The steam chamber comprises a plurality of sub-steam chambers, and the plurality of sub-steam chambers are arranged at intervals in a direction parallel to the horizontal heat dissipation surface; The bottoms of the plurality of sub-steam chambers along the vertical direction are interconnected and connected to the condensate pool, and the tops of the plurality of sub-steam chambers along the vertical direction are interconnected.

9. The phase change energy storage and heat dissipation system according to claim 8, characterized in that: At least part of the sub-steam chambers are located between part of the panels, part of the panels include a plurality of first sequence panels and a plurality of second sequence panels, and the plurality of first sequence panels and the plurality of second sequence panels are alternately distributed in sequence; The first sequence panel is provided with a plurality of first longitudinal through holes spaced apart and distributed in a direction parallel to the horizontal heat dissipation surface, and the solid parts between adjacent first longitudinal through holes form a first longitudinal support; The second sequence panel is provided with a plurality of second longitudinal through holes spaced apart and distributed in a direction parallel to the horizontal heat dissipation surface, and the solid parts between adjacent second longitudinal through holes form a second longitudinal support; Along the thickness direction of the panel, the first longitudinal through hole and the second longitudinal through hole are interconnected; the first longitudinal support located in the middle of the first longitudinal through hole in the vertical direction and the second longitudinal support located in the middle of the second longitudinal through hole are interconnected; the first longitudinal support located at both ends of the first longitudinal through hole in the vertical direction and the second longitudinal support located at both ends of the second longitudinal through hole in the vertical direction are at least partially staggered.

10. The phase change energy storage and heat dissipation system according to claim 5, characterized in that: The steam chambers are provided in plurality, the plurality of steam chambers are distributed at intervals, and the bottom ends of the steam chambers in the vertical direction are connected to each other and to the condensate pool; The heat dissipation assembly includes a first heat dissipation assembly, and the first heat dissipation assembly is located between the plurality of steam chambers.

11. The phase change energy storage and heat dissipation system according to claim 10, characterized in that: The heat dissipation component further includes a second heat dissipation component, which is located on at least one side outside the plurality of steam chambers, and the second heat dissipation component is connected to the first heat dissipation component.

12. An electronic component, characterized in that: It comprises a heat generating element and a heat dissipation system as claimed in any one of claims 1 to 11, wherein the heat generating element has a horizontal heat dissipation surface, and the heat dissipation system is arranged on a side of the heat generating element close to the horizontal heat dissipation surface.

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