A solder strip processing mechanism

Abstract

The present invention provides a solder ribbon processing mechanism, which includes a plurality of first solder ribbon clamping components, a plurality of second solder ribbon clamping components, a plurality of first solder ribbon cutters and a plurality of second solder ribbon cutters. The plurality of first solder ribbon clamping components cooperate to clamp all the odd-numbered solder ribbons among a plurality of solder ribbons, and each first solder ribbon cutter is used to cut off all the odd-numbered solder ribbons at corresponding positions to obtain a plurality of first solder ribbon groups. The plurality of second solder ribbon clamping components cooperate to clamp all the even-numbered solder ribbons among a plurality of solder ribbons, and each second solder ribbon cutter is used to cut off all the even-numbered solder ribbons at corresponding positions to obtain a plurality of second solder ribbon groups. The present invention can automatically cut the solder ribbons into first solder ribbon groups and second solder ribbon groups, and realizes the misalignment processing between the first solder ribbon groups and the second solder ribbon groups, as well as adjusts the spacing between the first solder ribbon groups and the spacing between the second solder ribbon groups, greatly improving the production efficiency of IBC battery strings.

Description

Technical Field

[0001] The present invention relates to the field of battery production, and more particularly to a solder ribbon processing mechanism. Background Art

[0002] The front side of a back-contact (IBC) solar cell does not have main grid lines, and the positive electrode rows and negative electrode rows are both arranged on the back side of the solar cell, thereby reducing the light shielding of the solar cell and improving the light conversion efficiency of the solar cell.

[0003] As Figure 1 shown, the back-contact solar cell 200 has a first electrode (such as a positive electrode) and a second electrode (such as a negative electrode) with opposite polarities on its back side. The first electrodes are arranged in columns to form at least two columns of first electrode rows 201, the second electrodes are arranged in columns to form at least two columns of second electrode rows 202, and the first electrode rows 201 and the second electrode rows 202 are arranged in an interleaved manner.

[0004] As Figure 2 shown, the method of welding back-contact solar cells into a string is as follows: N (4 in the figure) solar cells 200 are laid face up in sequence, and the polarities of the electrode rows of adjacent solar cells on the same straight line are opposite. N + 1 (five in the figure) solder ribbon groups are used to weld N solar cells 200 into a string, where: the first solder ribbon group (the 1st, 3rd, and 5th solder ribbon groups in the figure) and the second solder ribbon group (the 2nd and 4th solder ribbon groups in the figure) are laid in an interleaved manner.

[0005] In the traditional back-contact solar cell string welding process, in order to achieve the staggered laying of the first solder ribbon group and the second solder ribbon group, the solder ribbon traction mechanism needs to alternately traction and obtain the first solder ribbon group and the second solder ribbon group from the solder ribbon feeding station, and then staggeredly lay the first solder ribbon group and the second solder ribbon group on the solar cells.

[0006] In the traditional back-contact solar cell string welding process, the solder ribbon processing efficiency is low, which ultimately affects the production efficiency of the solar cell string. Summary of the Invention

[0007] In order to solve the above technical problems, the present invention provides a solder ribbon processing mechanism, which adopts the following technical solutions:

[0008] A solder ribbon processing mechanism for processing a plurality of solder ribbons extending along a first horizontal direction to obtain a plurality of first solder ribbon groups and a plurality of second solder ribbon groups. The solder ribbon processing mechanism includes a plurality of first solder ribbon clamping assemblies, a plurality of second solder ribbon clamping assemblies, a plurality of first solder ribbon cutters, and a plurality of second solder ribbon cutters arranged along the first horizontal direction, where:

[0009] A plurality of first solder ribbon clamping components cooperate to clamp all the odd-numbered solder ribbons among a plurality of solder ribbons. A first solder ribbon cutter is arranged between each adjacent pair of first solder ribbon clamping components. Each first solder ribbon cutter is used to cut off all the odd-numbered solder ribbons at corresponding positions to obtain a plurality of first solder ribbon groups;

[0010] A plurality of second solder ribbon clamping components cooperate to clamp all the even-numbered solder ribbons among a plurality of solder ribbons. A second solder ribbon cutter is arranged between each adjacent pair of second solder ribbon clamping components. Each second solder ribbon cutter is used to cut off all the even-numbered solder ribbons at corresponding positions to obtain a plurality of second solder ribbon groups;

[0011] Before all the odd-numbered solder ribbons are cut off, the plurality of first solder ribbon clamping components and the plurality of second solder ribbon clamping components translate relative to each other in a first horizontal direction so that all the odd-numbered solder ribbons are staggered from all the even-numbered solder ribbons by a predetermined distance in the first horizontal direction;

[0012] After all the odd-numbered solder ribbons are cut off, each first solder ribbon clamping component clamps a corresponding first solder ribbon group, and each first solder ribbon clamping component is further configured to separate in the first horizontal direction to implement the spacing of each first solder ribbon group;

[0013] After all the even-numbered solder ribbons are cut off, each second solder ribbon clamping component clamps a corresponding second solder ribbon group, and each second solder ribbon clamping component is further configured to separate in the first horizontal direction to implement the spacing of each second solder ribbon group.

[0014] Through the cooperation of the first solder ribbon clamping components, the second solder ribbon clamping components, the first solder ribbon cutters and the second solder ribbon cutters, the present invention automatically cuts the solder ribbons into the first solder ribbon groups and the second solder ribbon groups, and realizes the misalignment treatment between the first solder ribbon groups and the second solder ribbon groups, as well as the adjustment of the spacing between each first solder ribbon group and the spacing between each second solder ribbon group.

[0015] In this way, the subsequent solder ribbon laying mechanism can lay all the first solder ribbon groups and the second solder ribbon groups onto the battery cells at one time, thereby greatly improving the production efficiency of the IBC battery string.

[0016] In some embodiments, the first solder tape clamping assembly includes a first solder tape head chuck group and a first solder tape tail chuck group. The first solder tape head chuck group and the first solder tape tail chuck group cooperate to clamp all the odd-numbered solder tapes at corresponding positions. After all the odd-numbered solder tapes are cut, the first solder tape head chuck group clamps the head of the corresponding first solder tape group, and the first solder tape tail chuck group clamps the tail of the corresponding first solder tape group. The second solder tape clamping assembly includes a second solder tape head chuck group and a second solder tape tail chuck group. The second solder tape head chuck group and the second solder tape tail chuck group cooperate to clamp all the even-numbered solder tapes at corresponding positions. After all the even-numbered solder tapes are cut, the second solder tape head chuck group clamps the head of the corresponding second solder tape group, and the second solder tape tail chuck group clamps the tail of the corresponding second solder tape group.

[0017] By setting the first solder tape clamping assembly and the second clamping assembly, after the solder tapes are segmented and cut, the heads and tails of each first solder tape group are respectively clamped within the corresponding first solder tape tail chuck group and the first solder tape tail chuck group, preventing the heads and tails of the first solder tape group from dropping. Similarly, the heads and tails of each second solder tape group are respectively clamped within the corresponding second solder tape tail chuck group and the second solder tape tail chuck group.

[0018] In some embodiments, both the first solder tape head chuck group and the first solder tape tail chuck group include a plurality of first chucks arranged along a second horizontal direction perpendicular to the first horizontal direction. After all the odd-numbered solder tapes are cut, each first chuck correspondingly clamps the head or tail of a first solder tape. The second solder tape head chuck group and the second solder tape tail chuck group both include a plurality of second chucks arranged along the second horizontal direction. After all the even-numbered solder tapes are cut, each second chuck correspondingly clamps the head or tail of a second solder tape.

[0019] By setting the first solder tape head chuck group and the first solder tape tail chuck group, all the first solder tapes in the first solder tape group are firmly clamped. Similarly, by setting the second solder tape head chuck group and the second solder tape tail chuck group, all the second solder tapes in the second solder tape group are firmly clamped.

[0020] In some embodiments, both the first solder tape cutter and the second solder tape cutter include a mounting bracket, a fixed cutter, a movable cutter, and a movable cutter driving mechanism, where: the fixed cutter is fixedly arranged on the mounting bracket and extends along the second horizontal direction, and a fixed cutting edge is formed at the upper side edge of the fixed cutter; the movable cutter is slidably arranged on the mounting bracket and is in contact with the fixed cutter, and a plurality of hook cutters are arranged side by side along the second horizontal direction on the movable cutter, the hook cutters extend upward from the upper side edge of the movable cutter, and a movable cutting edge is formed at the lower side edge of the hook cutters; the movable cutter driving mechanism is used to drive the movable cutter to slide relative to the fixed cutter to realize the position switching of the movable cutter between the high position and the low position; when the movable cutter slides to the high position, a gap for the solder tape to pass through is formed between the movable cutting edges of the hook cutters and the fixed cutting edge of the fixed cutter; when the movable cutter slides to the low position, the movable cutting edges of the hook cutters cooperate with the fixed cutting edge of the fixed cutter to cut off the solder tape passing between them.

[0021] By setting the first solder tape cutter and the second solder tape cutter, when the first solder tape cutter cuts all the odd-numbered solder tapes, it can avoid all the even-numbered solder tapes that do not need to be cut. Similarly, when the second solder tape cutter cuts all the even-numbered solder tapes, it can avoid all the odd-numbered solder tapes that do not need to be cut. In addition, the hook cutter can cut both round solder tapes and flat solder tapes, increasing the compatibility of the first solder tape cutter and the second solder tape cutter.

[0022] In some embodiments, the first solder tape cutter is connected to the front first solder tape clamping component among adjacent first solder tape clamping components; the second solder tape cutter is connected to the front second solder tape clamping component among adjacent second solder tape clamping components.

[0023] By setting the installation methods of the first solder tape cutter and the second solder tape cutter, the first solder tape cutter and the second solder tape cutter can move synchronously with the first solder tape clamping component and the second solder tape clamping component. In this way, after the first solder tape clamping component and the second solder tape clamping component complete the dislocation of all the odd-numbered solder tapes and all the even-numbered solder tapes, the corresponding first solder tape cutter and second solder tape cutter can cut off all the odd-numbered solder tapes and all the even-numbered solder tapes at the corresponding positions, so as to obtain the first solder tape group and the second solder tape group.

[0024] In some embodiments, the solder tape processing mechanism further includes a base, a misalignment slide rail extending along a first horizontal direction, a first solder tape component separation slide rail, and a second solder tape component separation slide rail, wherein: the misalignment slide rail is disposed on the base, the first solder tape component separation slide rail is slidably connected to the misalignment slide rail, and a plurality of first solder tape clamping assemblies are connected to the first solder tape component separation slide rail; the second solder tape component separation slide rail is disposed on the base, and a plurality of second solder tape clamping assemblies are connected to the second solder tape component separation slide rail; before all the odd-numbered solder tapes are cut, the first solder tape component separation slide rail slides along the misalignment slide rail so that all the odd-numbered solder tapes are offset from all the even-numbered solder tapes by a predetermined distance in the first horizontal direction; after all the odd-numbered solder tapes are cut, the plurality of first solder tape clamping assemblies slide and separate along the first solder tape component separation slide rail to implement the separation of each first solder tape group; after all the even-numbered solder tapes are cut, the plurality of second solder tape clamping assemblies slide and separate along the second solder tape component separation slide rail to implement the separation of each second solder tape group.

[0025] By providing a misalignment slide rail, a first solder tape component separation slide rail, and a second solder tape component separation slide rail on the base, and arranging all the first solder tape clamping assemblies and all the second solder tape clamping assemblies on the first solder tape component separation slide rail and the second solder tape component separation slide rail respectively, the misalignment between the first solder tape clamping assembly and the second solder tape clamping assembly, and the separation between each first solder tape clamping assembly and each second solder tape clamping assembly are achieved.

[0026] In some embodiments, the solder tape processing mechanism further includes a misalignment driving component, a first separation driving component, and a second separation driving component disposed on the base, wherein: the misalignment driving component is used to drive the first solder tape component separation slide rail to slide along the misalignment slide rail; the first separation driving component is used to drive the plurality of first solder tape clamping assemblies to slide and separate along the first solder tape component separation slide rail; the second separation driving component is used to drive the plurality of second solder tape clamping assemblies to slide and separate along the second solder tape component separation slide rail.

[0027] It can be seen that by providing a misalignment driving component, the automatic misalignment between the first solder tape clamping assembly and the second solder tape clamping assembly can be achieved. By providing the first separation driving component and the second separation driving component, the automatic separation between each first solder tape clamping assembly and each second solder tape clamping assembly is achieved.

[0028] In some embodiments, among a plurality of first solder tape clamping assemblies, the first solder tape clamping assembly located at the rearmost end is fixed on the first solder tape component spacing slide rail, and the remaining first solder tape clamping assemblies are all slidably connected to the first solder tape component spacing slide rail; adjacent first solder tape clamping assemblies are connected by a first connecting rod, wherein at least one end of the first connecting rod is movably connected to the corresponding first solder tape clamping assembly and can slide relative to the first solder tape clamping assembly in the first horizontal direction; the driving end of the first spacing driving assembly is connected to the first solder tape clamping assembly located at the foremost end, and the first spacing driving assembly drives the first solder tape clamping assembly located at the foremost end to slide, thereby driving a plurality of first solder tape clamping assemblies to slide apart;

[0029] Among a plurality of second solder tape clamping assemblies, the second solder tape clamping assembly located at the rearmost end is fixed on the second solder tape component spacing slide rail, and the remaining second solder tape clamping assemblies are all slidably connected to the second solder tape component spacing slide rail; adjacent second solder tape clamping assemblies are connected by a second connecting rod, wherein at least one end of the second connecting rod is movably connected to the corresponding second solder tape clamping assembly and can slide relative to the second solder tape clamping assembly in the first horizontal direction; the driving end of the second spacing driving assembly is connected to the second solder tape clamping assembly located at the foremost end, and the second spacing driving assembly drives the second solder tape clamping assembly located at the foremost end to slide, thereby driving a plurality of second solder tape clamping assemblies to slide apart.

[0030] By setting the installation manner of each first solder tape clamping assembly, it is achieved that only by driving the first solder tape clamping assembly located at the foremost end to slide, each first solder tape clamping assembly can be driven to slide apart. Similarly, by setting the installation manner of each second solder tape clamping assembly, it is achieved that only by driving the second solder tape clamping assembly located at the foremost end to slide, each second solder tape clamping assembly can be driven to slide apart.

[0031] In some embodiments, at least one end of the first connecting rod is provided with a first connecting slide hole extending in the first horizontal direction, and a first connecting slide block is provided on the corresponding first solder tape clamping assembly, and the first connecting slide block penetrates into the first connecting slide hole and can slide in the first connecting slide hole; at least one end of the second connecting rod is provided with a second connecting slide hole extending in the first horizontal direction, and a second connecting slide block is provided on the corresponding second solder tape clamping assembly, and the second connecting slide block penetrates into the second connecting slide hole and can slide in the second connecting slide hole.

[0032] By providing a first connection sliding hole at the end of the first connecting rod and a first connection slider on the corresponding first solder tape clamping assembly, the movable connection between adjacent first solder tape clamping groups is achieved, that is, adjacent first solder tape clamping groups can achieve relative displacement within a certain stroke. Similarly, by providing a second connection sliding hole at the end of the second connecting rod and a second connection slider on the corresponding second solder tape clamping assembly, the movable connection between adjacent second solder tape clamping groups is achieved, that is, adjacent second solder tape clamping groups can achieve relative displacement within a certain stroke.

[0033] In some embodiments, the first solder tape clamping group at the forefront is located in front of the second solder tape clamping assembly at the forefront, and the first solder tape clamping group at the forefront is configured to be able to move up and down in the vertical direction; or, the second solder tape clamping group at the forefront is located in front of the first solder tape clamping assembly at the forefront, and the second solder tape clamping group at the forefront is configured to be able to move up and down in the vertical direction.

[0034] Configuring the first solder tape clamping group or the second solder tape clamping group at the forefront to be liftable can achieve avoidance of the solder tape traction mechanism.

[0035] In some embodiments, the first solder tape head chuck group of the first solder tape clamping assembly at the forefront is configured to be able to move up and down in the vertical direction; or, the second solder tape head chuck group of the second solder tape clamping assembly at the forefront is configured to be able to move up and down in the vertical direction.

[0036] By configuring the first solder tape head chuck group of the first solder tape clamping assembly at the forefront or the second solder tape head chuck group of the second solder tape clamping assembly at the frontmost side to be liftable, the avoidance of the solder tape traction mechanism can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a structural diagram of a back-connected solar cell;

[0038] Figure 2 It is a schematic structural diagram of four back-connected solar cells welded into a string by a solder tape group;

[0039] Figure 3 It is a schematic structural diagram of the solder tape processing mechanism according to an embodiment of the present invention from one perspective;

[0040] Figure 4 It is a schematic structural diagram of the solder tape processing mechanism according to an embodiment of the present invention from another perspective;

[0041] Figure 5 It is a schematic diagram of the first solder tape clamping assembly and the second solder tape clamping assembly clamping the solder tape in an embodiment of the present invention;

[0042] Figure 6 Schematic diagram of the assembly of a first solder tape clamping assembly and a corresponding first solder tape cutter in an embodiment of the present invention;

[0043] Figure 7 Schematic diagram of the structure of the first solder tape cutter in an embodiment of the present invention;

[0044] Figures 1 to 7 It includes the following reference numerals:

[0045] First solder tape clamping assembly 1, second solder tape clamping assembly 2, first solder tape cutter 3, second solder tape cutter 4, offset slide rail 5, first solder tape component spacing slide rail 6, second solder tape component spacing slide rail 7, connecting rod 8, first solder tape head chuck group 11, first solder tape tail chuck group 12, first mounting bracket 31, fixed cutter 32, movable cutter 33, movable cutter drive mechanism 34, hook cutter 35;

[0046] Solar cell 200, first electrode row 201, second electrode row 202. Detailed implementation manners

[0047] To make the above objects, features, and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation manners.

[0048] The following will introduce the battery string welding equipment and battery string welding method provided by the present invention through two embodiments by way of example.

[0049] In the traditional back-connected battery string welding process, in order to achieve the offset laying of the first solder tape group and the second solder tape group, the solder tape traction mechanism needs to alternately traction and obtain the first solder tape group and the second solder tape group from the solder tape feeding station, and then lay the first solder tape group and the second solder tape group on the solar cell alternately.

[0050] In the traditional back-connected battery string welding process, the solder tape processing efficiency is low, which ultimately affects the production efficiency of the battery string.

[0051] In view of this, the present invention provides a solder tape processing mechanism, which can automatically cut the multiple solder tapes pulled out by the solder tape traction mechanism along the first horizontal direction into a first solder tape group and a second solder tape group, and realize the offset processing between the first solder tape group and the second solder tape group, and adjust the spacing between the first solder tape groups and the spacing between the second solder tape groups.

[0052] In this way, the subsequent solder tape laying mechanism can lay all the first solder tape groups and the second solder tape groups on the solar cell at one time, thereby greatly improving the production efficiency of the IBC battery string.

[0053] Such as Figures 3 to 5As shown in the figure, the solder tape processing mechanism provided by the present invention includes a plurality of first solder tape clamping components 1, a plurality of second solder tape clamping components 2, a plurality of first solder tape cutters 3, and a plurality of second solder tape cutters 4 arranged along the first horizontal direction (the X-axis direction in the figure), where:

[0054] A plurality of first solder tape clamping components 1 cooperate to clamp all the odd-numbered solder tapes among a plurality of solder tapes. A first solder tape cutter 3 is provided between each adjacent pair of first solder tape clamping components 1. Each first solder tape cutter 3 is used to cut off all the odd-numbered solder tapes at corresponding positions, thereby obtaining a plurality of first solder tape groups.

[0055] A plurality of second solder tape clamping components 2 cooperate to clamp all the even-numbered solder tapes among a plurality of solder tapes. A second solder tape cutter 4 is provided between each adjacent pair of second solder tape clamping components 2. Each second solder tape cutter 4 is used to cut off all the even-numbered solder tapes at corresponding positions, thereby obtaining a plurality of second solder tape groups.

[0056] Before all the odd-numbered solder tapes are cut off, a plurality of first solder tape clamping components 1 and a plurality of second solder tape clamping components 2 translate relative to each other in the first horizontal direction, so that all the odd-numbered solder tapes are offset from all the even-numbered solder tapes by a predetermined distance in the first horizontal direction.

[0057] After all the odd-numbered solder tapes are cut off, each first solder tape clamping component 1 holds a corresponding first solder tape group, and each first solder tape clamping component 1 is further configured to separate in the first horizontal direction to implement the spacing of each first solder tape group.

[0058] After all the even-numbered solder tapes are cut off, each second solder tape clamping component 2 holds a corresponding second solder tape group, and each second solder tape clamping component 2 is further configured to separate in the first horizontal direction to implement the spacing of each second solder tape group.

[0059] In order to enable those skilled in the art to more clearly understand the structure and working principle of the solder tape processing mechanism provided by the present invention, the working process of the solder tape processing mechanism provided by the embodiments of the present invention will be descriptively described below.

[0060] As Figure 5 shown, in one embodiment, the solder tape processing mechanism provided by the present invention includes six first solder tape clamping components 1, six second solder tape clamping components 2, five first solder tape cutters 3, and five second solder tape cutters 4, where: a first solder tape cutter 3 is provided between each adjacent pair of first solder tape clamping components 1, and a second solder tape cutter 4 is provided between each adjacent pair of second solder tape clamping components 2.

[0061] Figure 5 The process of cutting and adjusting the solder tape by the solder tape processing mechanism in the embodiment is as follows:

[0062] First, a solder strip traction mechanism is used to traction multiple (17 in the figure) solder strips extending along the first horizontal direction (the X-axis direction in the figure) onto the solder strip processing mechanism.

[0063] Control the first solder strip clamping assembly 1 and the second solder strip clamping assembly 2 to clamp the solder strips. Among them: six first solder strip clamping assemblies 1 cooperate to clamp all the odd-numbered solder strips from different positions, and six second solder strip clamping assemblies 2 cooperate to clamp all the even-numbered solder strips from different positions.

[0064] Control the six first solder strip clamping assemblies 1 to translate relative to the six second solder strip clamping assemblies 2, so that all the odd-numbered solder strips and all the even-numbered solder strips are staggered by a predetermined distance in the first horizontal direction.

[0065] Next, control the five first solder strip cutters 3 and the five second solder strip cutters 4 to synchronously cut all the odd-numbered solder strips and all the even-numbered solder strips from the corresponding positions. In this way, six first solder strip groups and six second solder strip groups are obtained. Moreover, each first solder strip group is respectively clamped on the corresponding first solder strip clamping assembly 1, and each second solder strip group is clamped on the corresponding second solder strip clamping assembly 2.

[0066] Finally, control the six first solder strip clamping assemblies 1 to translate and separate, so as to adjust the distance between the six first solder strip groups to a predetermined distance. Control the six second solder strip clamping assemblies 2 to translate and separate, so as to adjust the distance between the six second solder strip groups to a predetermined distance.

[0067] Continue to participate Figure 3 As shown, optionally, the solder strip processing mechanism in the embodiment of the present invention further includes a base, and a dislocation slide rail 5, a first solder strip group separation slide rail 6 and a second solder strip group separation slide rail 7 extending along the first horizontal direction. Among them:

[0068] The dislocation slide rail 5 is arranged on the base, the first solder strip group separation slide rail 6 is slidably connected to the dislocation slide rail 5, and several first solder strip clamping assemblies 1 are connected to the first solder strip group separation slide rail 6.

[0069] The second solder strip group separation slide rail 7 is arranged on the base, and several second solder strip clamping assemblies 2 are connected to the second solder strip group separation slide rail 7.

[0070] Before all the odd-numbered solder strips are cut, control the first solder strip group separation slide rail 6 to slide along the dislocation slide rail 5, so that all the odd-numbered solder strips and all the even-numbered solder strips are staggered by a predetermined distance in the first horizontal direction.

[0071] After all the odd-numbered solder tapes are cut off, control several first solder tape clamping components 1 to slide apart along the first solder tape group spacing slide rail 6, so as to adjust the spacing between each first solder tape group to a predetermined spacing.

[0072] After all the even-numbered solder tapes are cut off, control several second solder tape clamping components 2 to slide apart along the second solder tape group spacing slide rail 7, so as to adjust the spacing between each second solder tape group to a predetermined spacing.

[0073] Optionally, the solder tape processing mechanism in the embodiment of the present invention further includes a misalignment driving component, a first spacing driving component and a second spacing driving component arranged on the base, wherein: the misalignment driving component is used to drive the first solder tape group spacing slide rail 6 to slide along the misalignment slide rail 5. The first spacing driving component is used to drive several first solder tape clamping components 1 to slide apart along the first solder tape group spacing slide rail 6. The second spacing driving component is used to drive several second solder tape clamping components 2 to slide apart along the second solder tape group spacing slide rail 7.

[0074] It can be seen that by setting the misalignment driving component, automatic misalignment between the first solder tape clamping component and the second solder tape clamping component can be realized. By setting the first spacing driving component and the second spacing driving component, automatic spacing between each first solder tape clamping component and between each second solder tape clamping component is realized.

[0075] Such as Figure 3 and Figure 4 As shown, optionally, among several first solder tape clamping components 1, the first solder tape clamping component 1 at the rearmost end is fixed on the first solder tape group spacing slide rail 6, and the remaining first solder tape clamping components 1 are all slidably connected to the first solder tape group spacing slide rail 6. The driving end of the first spacing driving component is connected to the first solder tape clamping component 1 at the foremost end.

[0076] Adjacent first solder tape clamping components 1 are all connected by a first connecting rod 8, wherein at least one end of the first connecting rod 8 is movably connected to the corresponding first solder tape clamping component 1 and can slide relative to the first solder tape clamping component 1 in the first horizontal direction. In this way, relative displacement between adjacent first solder tape clamping components 1 can be realized.

[0077] In the initial state, each first solder tape clamping component 1 is close to each other. When the first cutter 3 finishes cutting all the odd-numbered solder tapes to obtain several first solder tape groups. The first spacing driving component drives the first solder tape clamping component 1 at the foremost end to slide away from the first solder tape clamping component 1 at the rearmost end, so as to drive several first solder tape clamping components 1 to slide apart until the spacing between the first solder tape groups is adjusted to a predetermined spacing.

[0078] By making the above settings for the installation method of the first solder strip clamping assembly 1, only by controlling the first distance separating drive assembly to drive the first solder strip clamping assembly at the forefront to slide can the sliding separation of each first solder strip clamping assembly be driven. Conventional linear drive devices such as air cylinders and screw motors can be used as the first distance separating drive assembly.

[0079] Similarly, among several second solder strip clamping assemblies 2, the second solder strip clamping assembly 2 at the rearmost end is fixed on the second solder strip group distance separating slide rail 7, and the remaining second solder strip clamping assemblies 2 are all slidably connected to the second solder strip group distance separating slide rail 7. The driving end of the second distance separating drive assembly is connected to the second solder strip clamping assembly 2 at the forefront.

[0080] Adjacent second solder strip clamping assemblies 2 are connected by a second connecting rod 9. Among them, at least one end of the second connecting rod 9 is movably connected to the corresponding second solder strip clamping assembly 2 and can slide relative to the second solder strip clamping assembly 2 in the first horizontal direction. In this way, relative displacement can be achieved between adjacent second solder strip clamping assemblies 2.

[0081] In the initial state, each second solder strip clamping assembly 2 is close to each other. After the second cutter 4 cuts all the even-numbered solder strips to obtain several second solder strip groups. The second distance separating drive assembly drives the second solder strip clamping assembly 2 at the forefront to slide away from the second solder strip clamping assembly 2 at the rearmost end, thereby driving the sliding separation of several second solder strip clamping assemblies until the distance between the second solder strip groups is adjusted to a predetermined distance.

[0082] By making the above settings for the installation method of the second solder strip clamping assembly 2, only by controlling the second distance separating drive assembly to drive the second solder strip clamping assembly at the forefront to slide can the sliding separation of each second solder strip clamping assembly be driven. Conventional linear drive devices such as air cylinders and screw motors can be used as the second distance separating drive assembly.

[0083] In order to realize the movable connection between the end of the first connecting rod 8 and the first solder strip clamping assembly 1 and ensure that the first connecting rod 8 can slide relative to the first solder strip clamping assembly 1 in the first horizontal direction. Optionally, at least one end of the first connecting rod 8 is provided with a first connecting sliding hole (such as a waist-shaped hole) extending in the first horizontal direction, and a first connecting slider is provided on the corresponding first solder strip clamping assembly 1, and the first connecting slider penetrates into the first connecting sliding hole and can slide in the first connecting sliding hole.

[0084] Similarly, at least one end of the second connecting rod 9 is provided with a second connecting sliding hole (such as a waist-shaped hole) extending in the first horizontal direction, and a second connecting slider is provided on the corresponding second solder strip clamping assembly 2, and the second connecting slider penetrates into the second connecting sliding hole and can slide in the second connecting sliding hole.

[0085] Such asFigure 6 As shown, optionally, the first solder tape clamping assembly 1 includes a first solder tape head chuck group 11 and a first solder tape tail chuck group 12. After the solder tape is drawn onto the solder tape processing mechanism, the first solder tape head chuck group 11 and the first solder tape tail chuck group 12 cooperate to clamp all the odd-numbered solder tapes at corresponding positions. After all the odd-numbered solder tapes are cut, the first solder tape head chuck group 11 clamps the head of the corresponding first solder tape group, and the first solder tape tail chuck group 12 clamps the tail of the corresponding first solder tape group.

[0086] Optionally, both the first solder tape head chuck group 11 and the first solder tape tail chuck group 12 include a number of first chucks arranged along a second horizontal direction perpendicular to the first horizontal direction (such as Figure 6 the Y-axis direction in the figure). After all the odd-numbered solder tapes are cut, each first chuck in the first solder tape head chuck group 11 correspondingly clamps the head of a first solder tape, and each first chuck in the first solder tape tail chuck group 12 correspondingly clamps the tail of a first solder tape.

[0087] The structure of the second solder tape clamping assembly 2 is the same as that of the first solder tape clamping assembly 1. It includes a second solder tape head chuck group and a second solder tape tail chuck group. After the solder tape is drawn onto the solder tape processing mechanism, the second solder tape head chuck group and the second solder tape tail chuck group cooperate to clamp all the even-numbered solder tapes at corresponding positions. After all the even-numbered solder tapes are cut, the second solder tape head chuck group clamps the head of the corresponding second solder tape group, and the second solder tape tail chuck group clamps the tail of the corresponding second solder tape group.

[0088] Optionally, both the second solder tape head chuck group and the second solder tape tail chuck group include a number of second chucks arranged along the second horizontal direction. After all the even-numbered solder tapes are cut, each second chuck in the second solder tape tail chuck group correspondingly clamps the head of a second solder tape, and each second chuck in the second solder tape tail chuck group correspondingly clamps the tail of a second solder tape.

[0089] Optionally, in order to avoid the solder tape traction mechanism and prevent the solder tape traction mechanism from colliding with the first solder tape clamping assembly 1 or the second solder tape clamping assembly 2 at the forefront when the solder tape is drawn onto the solder tape processing mechanism, the first solder tape clamping assembly 1 or the second solder tape clamping assembly 2 at the forefront is configured to be liftable.

[0090] When it is necessary to draw the solder tape onto the solder tape processing mechanism, first control the first solder tape clamping assembly at the forefront or the second solder tape clamping assembly at the forefront to descend to a low position, so as to avoid the solder tape traction mechanism. After the traction of the solder tape is completed, then control the first solder tape clamping assembly at the forefront or the second solder tape clamping assembly at the forefront to rise and reset.

[0091] Further, only the first solder tape head chuck group 11 of the first solder tape clamping assembly 1 at the forefront for clamping the head of the solder tape can be set to be liftable, or only the second solder tape head chuck group of the second solder tape clamping assembly 2 at the forefront for clamping the head of the solder tape can be set to be liftable.

[0092] When it is necessary to pull the solder tape onto the solder tape processing mechanism, first control the first solder tape head chuck group 11 of the first solder tape clamping assembly 1 at the forefront to descend to the low position, or first control the second solder tape head chuck group of the second solder tape clamping assembly at the forefront to descend to the low position, so as to achieve avoidance of the solder tape pulling mechanism. After the pulling of the solder tape is completed, then control the first solder tape head chuck group 11 of the first solder tape clamping assembly at the forefront or the second solder tape head chuck group of the second solder tape clamping assembly 2 at the forefront to rise and reset.

[0093] Optionally, the structures of the first solder tape cutter 3 and the second solder tape cutter 4 are the same. Taking the first solder tape cutter 3 as an example, as Figure 7 shown, it includes a first mounting bracket 31, a fixed cutter 32, a movable cutter 33 and a movable cutter driving mechanism 34, wherein:

[0094] The fixed cutter 32 is fixedly arranged on the first mounting bracket 31 and extends along the second horizontal direction. A fixed cutting edge is formed at the upper side edge of the fixed cutter 32.

[0095] The movable cutter 33 is slidably arranged on the first mounting bracket 31 and fits with the fixed cutter 32. A plurality of hook cutters 35 are arranged side by side on the movable cutter 33 along the second horizontal direction. The hook cutters 35 protrude upward from the upper side edge of the movable cutter 33, and a movable cutting edge is formed at the lower side edge of the hook cutters 35.

[0096] The movable cutter driving mechanism 34 is used to drive the movable cutter 33 to slide relative to the fixed cutter 32 to realize the position switching of the movable cutter 33 between the high position and the low position. When the movable cutter 33 slides to the high position, a gap for the solder tape to pass through is formed between the movable cutting edges of each hook cutter 35 and the fixed cutting edge of the fixed cutter 32. When the movable cutter 33 slides to the low position, the movable cutting edges of each hook cutter 35 cooperate with the fixed cutting edge of the fixed cutter 32 to cut off the odd-numbered solder tapes passing between them.

[0097] Since an avoidance space is formed between adjacent hook cutters 35, when the first solder tape cutter 3 cuts off all the odd-numbered solder tapes, it can avoid all the even-numbered solder tapes that do not need to be cut.

[0098] Similarly, when the second solder tape cutter 4 cuts off all the even-numbered solder tapes, it can avoid all the odd-numbered solder tapes that do not need to be cut.

[0099] Optionally, among two adjacent first solder tape clamping assemblies 1, the first solder tape cutter 3 is connected to the first solder tape clamping assembly located on the front side. For example, as Figure 6 shown, it is connected to the first solder tape tail chuck group 12 of the first solder tape clamping assembly 1 located on the front side. In this way, during the misalignment process of the solder tape, the first solder tape cutter 3 can slide synchronously with the corresponding first solder tape clamping assembly 1. After the misalignment operation of the solder tape is completed, the first solder tape cutter 3 can cut all the odd-numbered solder tapes at the corresponding position, thereby obtaining the first solder tape group.

[0100] Similarly, among two adjacent second solder tape clamping assemblies 2, the second solder tape cutter 4 is connected to the second solder tape clamping assembly located on the front side. For example, it is connected to the second solder tape tail chuck group of the second solder tape clamping assembly 2 located on the front side. In this way, during the misalignment process of the solder tape, the second solder tape cutter 4 can slide synchronously with the corresponding second solder tape clamping assembly 2. After the misalignment operation of the solder tape is completed, the second solder tape cutter 4 can cut all the even-numbered solder tapes at the corresponding position, thereby obtaining the second solder tape group.

[0101] It should be noted that the various optional implementation manners in the first embodiment described above also apply to this embodiment, and will not be elaborated here.

[0102] The above has described the present invention in sufficient detail with a certain degree of particularity. Those of ordinary skill in the art should understand that the descriptions in the embodiments are merely exemplary. All changes made without departing from the true spirit and scope of the present invention should fall within the protection scope of the present invention. The scope of protection required by the present invention is defined by the claims described, rather than by the above descriptions in the embodiments.

Claims

1. A solder strip processing mechanism, characterized in that, For processing multiple solder tapes extending along a first horizontal direction to obtain a plurality of first solder tape groups and a plurality of second solder tape groups, the solder tape processing mechanism includes a plurality of first solder tape clamping components, a plurality of second solder tape clamping components, a plurality of first solder tape cutters, and a plurality of second solder tape cutters arranged along the first horizontal direction, where: The plurality of first solder tape clamping components cooperate to clamp all the odd-numbered solder tapes among the multiple solder tapes. A first solder tape cutter is provided between each adjacent pair of the first solder tape clamping components. Each first solder tape cutter is configured to cut all the odd-numbered solder tapes at corresponding positions to obtain a plurality of the first solder tape groups; The plurality of second solder tape clamping components cooperate to clamp all the even-numbered solder tapes among the multiple solder tapes. A second solder tape cutter is provided between each adjacent pair of the second solder tape clamping components. Each second solder tape cutter is configured to cut all the even-numbered solder tapes at corresponding positions to obtain a plurality of the second solder tape groups; Before all the odd-numbered solder tapes are cut, the plurality of first solder tape clamping components and the plurality of second solder tape clamping components translate relative to each other in the first horizontal direction so that all the odd-numbered solder tapes are staggered from all the even-numbered solder tapes by a predetermined distance in the first horizontal direction; After all the odd-numbered solder tapes are cut, each of the first solder tape clamping components clamps a corresponding first solder tape group, and each of the first solder tape clamping components is further configured to separate in the first horizontal direction to implement spacing of each of the first solder tape groups; After all the even-numbered solder tapes are cut, each of the second solder tape clamping components clamps a corresponding second solder tape group, and each of the second solder tape clamping components is further configured to separate in the first horizontal direction to implement spacing of each of the second solder tape groups; The solder tape processing mechanism further includes a base, a misalignment slide rail extending along the first horizontal direction, a first solder tape group spacing slide rail, and a second solder tape group spacing slide rail, where: The misalignment slide rail is provided on the base. The first solder tape group spacing slide rail is slidably connected to the misalignment slide rail, and the plurality of first solder tape clamping components are connected to the first solder tape group spacing slide rail; The second solder tape group spacing slide rail is provided on the base, and the plurality of second solder tape clamping components are connected to the second solder tape group spacing slide rail; Before all the odd-numbered solder tapes are cut, the first solder tape group spacing slide rail slides along the misalignment slide rail so that all the odd-numbered solder tapes are staggered from all the even-numbered solder tapes by a predetermined distance in the first horizontal direction; After all the odd-numbered solder tapes are cut, the plurality of first solder tape clamping components slide and separate along the first solder tape group spacing slide rail to implement spacing of each of the first solder tape groups; After all the even-numbered solder tapes are cut, the plurality of second solder tape clamping components slide and separate along the second solder tape group spacing slide rail to implement spacing of each of the second solder tape groups; The first solder strip cutter and the second solder strip cutter both include a mounting bracket, a fixed cutter, a movable cutter and a movable cutter driving mechanism.

2. The solder strip processing mechanism according to claim 1, wherein: The first solder strip clamping assembly includes a first solder strip head chuck group and a first solder strip tail chuck group. The first solder strip head chuck group and the first solder strip tail chuck group cooperate to clamp all the odd-numbered solder strips at corresponding positions. After all the odd-numbered solder strips are cut off, the first solder strip head chuck group clamps the head of the corresponding first solder strip group, and the first solder strip tail chuck group clamps the tail of the corresponding first solder strip group; The second solder strip clamping assembly includes a second solder strip head chuck group and a second solder strip tail chuck group. The second solder strip head chuck group and the second solder strip tail chuck group cooperate to clamp all the even-numbered solder strips at corresponding positions. After all the even-numbered solder strips are cut off, the second solder strip head chuck group clamps the head of the corresponding second solder strip group, and the second solder strip tail chuck group clamps the tail of the corresponding second solder strip group.

3. The solder strip processing mechanism according to claim 2, wherein: Both the first solder strip head chuck group and the first solder strip tail chuck group include a plurality of first chucks arranged along a second horizontal direction perpendicular to the first horizontal direction. After all the odd-numbered solder strips are cut off, each of the first chucks correspondingly clamps the head or tail of a first solder strip; Both the second solder strip head chuck group and the second solder strip tail chuck group include a plurality of second chucks arranged along the second horizontal direction. After all the even-numbered solder strips are cut off, each of the second chucks correspondingly clamps the head or tail of a second solder strip.

4. The solder strip processing mechanism according to claim 1, wherein: The fixed cutter is fixedly arranged on the mounting bracket and extends along a second horizontal direction perpendicular to the first horizontal direction. A fixed cutting edge is formed at the upper side edge of the fixed cutter; The movable cutter is slidably arranged on the mounting bracket and is in contact with the fixed cutter. A plurality of hook knives are arranged side by side along the second horizontal direction on the movable cutter. The hook knives extend upward from the upper side edge of the movable cutter, and a movable cutting edge is formed at the lower side edge of the hook knives; The movable cutter driving mechanism is used to drive the movable cutter to slide relative to the fixed cutter to realize the position switching of the movable cutter between a high position and a low position; When the movable cutter slides to the high position, a gap for the solder strip to pass through is formed between the movable cutting edge of each hook knife and the fixed cutting edge of the fixed cutter; when the movable cutter slides to the low position, the movable cutting edge of each hook knife and the fixed cutting edge of the fixed cutter cooperate to cut off the solder strip passing between them.

5. The solder strip processing mechanism according to claim 1, wherein: The first solder strip cutter is connected to the front-side first solder strip clamping assembly among adjacent first solder strip clamping assemblies; The second solder tape cutter is connected to the front second solder tape clamping assembly among the adjacent second solder tape clamping assemblies.

6. The solder strip processing mechanism according to claim 1, characterized in that: The solder tape processing mechanism further includes a dislocation driving assembly, a first spacing driving assembly, and a second spacing driving assembly arranged on the base, where: the dislocation driving assembly is used to drive the first solder tape component spacing slide rail to slide along the dislocation slide rail; the first spacing driving assembly is used to drive a plurality of the first solder tape clamping assemblies to slide and separate along the first solder tape component spacing slide rail; the second spacing driving assembly is used to drive a plurality of the second solder tape clamping assemblies to slide and separate along the second solder tape component spacing slide rail.

7. The solder tape processing mechanism according to claim 6, wherein: Among the plurality of the first solder tape clamping assemblies, the last first solder tape clamping assembly is fixed on the first solder tape component spacing slide rail, and the remaining first solder tape clamping assemblies are all slidably connected to the first solder tape component spacing slide rail; adjacent first solder tape clamping assemblies are connected by a first connecting rod, wherein at least one end of the first connecting rod is movably connected to the corresponding first solder tape clamping assembly and can slide in the first horizontal direction relative to the first solder tape clamping assembly; The driving end of the first spacing driving assembly is connected to the foremost first solder tape clamping assembly, and the first spacing driving assembly drives the foremost first solder tape clamping assembly to slide, thereby driving a plurality of the first solder tape clamping assemblies to slide and separate; Among the plurality of the second solder tape clamping assemblies, the last second solder tape clamping assembly is fixed on the second solder tape component spacing slide rail, and the remaining second solder tape clamping assemblies are all slidably connected to the second solder tape component spacing slide rail; adjacent second solder tape clamping assemblies are connected by a second connecting rod, wherein at least one end of the second connecting rod is movably connected to the corresponding second solder tape clamping assembly and can slide in the first horizontal direction relative to the second solder tape clamping assembly; The driving end of the second spacing driving assembly is connected to the foremost second solder tape clamping assembly, and the second spacing driving assembly drives the foremost second solder tape clamping assembly to slide, thereby driving a plurality of the second solder tape clamping assemblies to slide and separate.

8. The solder tape processing mechanism according to claim 7, wherein: At least one end of the first connecting rod is provided with a first connecting slide hole extending along the first horizontal direction, and a first connecting slider is provided on the corresponding first solder tape clamping assembly, and the first connecting slider penetrates into the first connecting slide hole and can slide in the first connecting slide hole; At least one end of the second connecting rod is provided with a second connecting slide hole extending along the first horizontal direction, and a second connecting slider is provided on the corresponding second solder tape clamping assembly, and the second connecting slider penetrates into the second connecting slide hole and can slide in the second connecting slide hole.

9. The solder tape processing mechanism according to claim 2, wherein: The first solder tape clamping assembly at the foremost end is on the front side of the second solder tape clamping assembly at the foremost end, and the first solder tape clamping assembly at the foremost end is configured to be able to move up and down in the vertical direction; Or, The second solder tape clamping assembly at the foremost end is on the front side of the first solder tape clamping assembly at the foremost end, and the second solder tape clamping assembly at the foremost end is configured to be able to move up and down in the vertical direction.

10. The solder tape processing mechanism according to claim 9, wherein: The first solder tape head chuck group of the first solder tape clamping assembly at the foremost end is configured to be able to move up and down in the vertical direction; or, The second solder tape head chuck group of the second solder tape clamping assembly at the foremost end is configured to be able to move up and down in the vertical direction.

Images