Display module and glass with undercut plastic frame

Abstract

The present disclosure relates to display modules and glass with undercut plastic frames. The present invention discloses an electronic device with a display assembly. Several layers can be combined to form a display assembly. For example, the display assembly may include a touch-sensitive layer (or touch detection layer), a display layer that presents visual information, and a force-sensitive layer (or force detection layer). The display layer may include a bend or fold that allows a portion of the display layer to bend around the force-sensitive layer. In addition, connectors (providing electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force-sensitive layer may include a connector on a second edge region that is perpendicular to or at least substantially perpendicular to the first edge region. By positioning the connector on the vertical edge region, the display assembly can reduce its footprint.

Description

[0001] This application is a divisional application of the invention patent application with application number 201780020811.X and application date September 20, 2017, and invention name “Display module and glass with undercut plastic frame”. Technical Field

[0002] The following description relates to an electronic device. Specifically, the following relates to an electronic device that includes a display assembly having several active layers. The display assembly is designed to bend or bend around the force-sensitive layer. In addition, in order to increase the amount of available space in the electronic device, the electrical connections and mechanical connections of the active layer are positioned in different locations. Background Art

[0003] An electronic device may include a display assembly. When the display assembly includes multiple layers, the volume occupied by the display assembly increases, which may cause engineering design changes to accommodate the increased volume. In addition, each of the layers requires electrical and mechanical connections. When the electrical and mechanical connections are stacked on top of each other or adjacent to each other, additional design challenges may result. Summary of the invention

[0004] In one aspect, a display assembly for an electronic device is described. The display assembly may include a touch-sensitive layer capable of detecting touch input capable of controlling the electronic device. The display assembly may also include a force-sensitive layer capable of detecting the magnitude of force applied to the touch-sensitive layer. The display assembly may also include a display layer capable of presenting visual information. The display layer may be at least partially positioned between the touch-sensitive layer and the force-sensitive layer. In some embodiments, the display layer is at least partially bent around the force-sensitive layer.

[0005] On the other hand, an electronic device is described. The electronic device may include a protective layer formed of a transparent material. The electronic device may also include a display assembly covered by the protective layer. The display assembly may include a force-sensitive layer capable of detecting the magnitude of a force applied to the protective layer. The display assembly may also include a display layer located between the touch-sensitive layer and the force-sensitive layer. In some embodiments, the display is bent at least partially around the force-sensitive layer that defines a bend. The electronic device may also include a frame that carries the protective layer. The frame may include a recess that at least partially receives the display at the bend.

[0006] In another aspect, a method for forming a display assembly for an electronic device is described. The method may include positioning a display layer between a touch-sensitive layer and a force-sensitive layer. The touch-sensitive layer may be configured to detect touch inputs for controlling the electronic device. The force-sensitive layer may be configured to detect a magnitude of force applied to the touch-sensitive layer. The method may also include bending the display layer so that the display layer is at least partially bent around the force-sensitive layer.

[0007] Other systems, methods, features and advantages of the embodiments will or will become apparent to one of ordinary skill in the art upon examination of the following drawings and detailed description. All such additional systems, methods, features and advantages are intended to be included within this specification and the present disclosure, to be included within the scope of these embodiments, and to be protected by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The present disclosure will be readily understood by the following detailed description taken in conjunction with the accompanying drawings, wherein like reference numerals refer to like structural elements, and wherein:

[0009] Figure 1 shows an isometric front view of an embodiment of an electronic device according to some described embodiments;

[0010] Figure 2 Shown in Figure 1 An isometric rear view of the electronic device shown in , further illustrating additional features of the electronic device;

[0011] Figure 3 Shown in Figure 1 A partially exploded view of an electronic device shown in , which shows various components of the electronic device;

[0012] Figure 4 Shown in Figure 1 A partially exploded view of the electronic device shown in , which further illustrates additional components of the electronic device;

[0013] Figure 5 Shown in Figure 1 The electronic device shown in Figure 1 A cross-sectional view taken along line AA in FIG.

[0014] Figure 6 showing a cross-sectional view of an alternative embodiment of an electronic device according to some of the described embodiments;

[0015] Figure 7 Shown in Figure 1 The electronic device shown in Figure 1 A cross-sectional view taken along line BB in FIG.

[0016] Figure 8 showing a cross-sectional view of an alternative embodiment of an electronic device according to some of the described embodiments;

[0017] Fig. 9 shows a plan view of an embodiment of a frame according to some described embodiments;

[0018] Fig.10 Shown in Fig. 9 A cross-sectional view of the frame shown in FIG. 1 taken along line AA;

[0019] Fig.11 A cross-sectional view showing an alternative embodiment of a frame according to some of the described embodiments showing a surface of the frame having protruding features;

[0020] Fig.12 A cross-sectional view of an embodiment of an electronic device is shown having a frame and a support element partially embedded in and extending substantially into the frame;

[0021] Fig.13 A cross-sectional view illustrating an embodiment of an electronic device according to some of the described embodiments showing the electronic device having a protective cover and sidewall members extended to provide additional support for the protective cover;

[0022] Fig.14 A cross-sectional view illustrating an embodiment of an electronic device according to some described embodiments showing the electronic device having various structural reinforcements;

[0023] Fig.15 A plan view of an embodiment of an electronic device according to some of the described embodiments is shown, showing a board positioned in a housing of the electronic device;

[0024] Fig.16 Shows Fig.15 A partial side view of the electronic device is shown, further illustrating the first extension of the plate being secured to the display assembly;

[0025] Fig.17 A cross-sectional view illustrating an embodiment of an electronic device according to some of the described embodiments, showing the electronic device having a housing and a support structure formed integrally with the housing;

[0026] Fig.18 shows a plan view of an embodiment of a protective cover according to some of the described embodiments;

[0027] Fig.19 Shown in Fig.18 A cross-sectional view of the protective cover shown in FIG. 1 taken along line BB, further illustrating the recess formed in the protective cover;

[0028] Fig. 20 A cross-sectional view of an embodiment of an electronic device according to some of the described embodiments is shown, showing a protective cover (eg, Fig.18 and Fig.19 As shown) is fixed together with the shell;

[0029] Fig.21A cross-sectional view of an embodiment of an electronic device according to some of the described embodiments is shown, showing a protective cover extending over the frame and positioned adjacent to a sidewall member;

[0030] Fig. 22 shows an exploded view of a battery according to some of the described embodiments;

[0031] Fig.23 Shows Fig. 22 A plan view of the first electrode shown;

[0032] Fig.24 shows a plan view of an alternative embodiment of an electrode suitable for use in a battery assembly according to some of the described embodiments;

[0033] Fig.25 shows a plan view of an alternative embodiment of an electrode suitable for use in a battery assembly according to some of the described embodiments;

[0034] Fig.26 shows a plan view of an alternative embodiment of an electrode suitable for use in a battery assembly according to some of the described embodiments;

[0035] Fig. 27 An embodiment of a battery in an electronic device according to some of the described embodiments is shown, wherein the battery has a shape to accommodate internal components of the electronic device;

[0036] Fig.28 An alternative embodiment of a battery assembly in an electronic device according to some of the described embodiments is shown, wherein the battery assembly has a shape to accommodate multiple internal components of the electronic device;

[0037] Fig.29 An alternative embodiment of a battery assembly in an electronic device according to some of the described embodiments is shown, wherein the battery assembly has an opening to accommodate internal components of the electronic device;

[0038] Fig.30 An alternative embodiment of a battery assembly in an electronic device according to some of the described embodiments is shown, wherein the battery assembly is positioned in a housing (of the electronic device) above a first internal component of the electronic device;

[0039] Fig.31 Shown in Fig.30 The electronic device shown in Fig.30 A cross-sectional view taken along line CC in FIG.

[0040] Fig.32 According to some of the described embodiments, Figure 4 An exploded view of the circuit board assembly shown in ;

[0041] Fig.33 Shown in Fig.32 A cross-sectional view of the circuit board assembly shown in , which shows various internal components of the circuit board assembly;

[0042] Fig.34 An alternative embodiment of a circuit board assembly is shown which shows the circuit board assembly modified for ingress protection;

[0043] Fig.35 An alternative embodiment of a circuit board assembly according to some of the described embodiments is shown, showing the circuit board assembly having a flexible circuit electrically coupled to a circuit board of the circuit board assembly;

[0044] Fig.36 Shows Fig.35 a cross-sectional view of the circuit board assembly shown showing the flexible circuit extending between the circuit boards;

[0045] Fig.37 illustrates a cross-sectional view of an alternative embodiment of a circuit board assembly according to some of the described embodiments, showing internal components of the circuit board assembly having corresponding geometries;

[0046] Fig.38 A cross-sectional view showing an alternative embodiment of a circuit board assembly according to some of the described embodiments showing the circuit board assembly having several solder resist layers for supporting the circuit board;

[0047] Fig.39 shows an isometric view of an embodiment of an audio module according to some described embodiments;

[0048] Fig.40 Shown in Fig.39 The audio module shown in Fig.39 A cross-sectional view taken along line DD in FIG. 1 , showing several internal features;

[0049] Fig.41 A cross-sectional view of an electronic device is shown, showing the audio module positioned in the electronic device;

[0050] Fig.42 shows an exploded view of a heat distribution assembly according to some described embodiments;

[0051] Fig.43 Shows Figure 1 a partial cross-sectional view of the electronic device shown, showing the heat distribution assembly positioned within the electronic device;

[0052] Fig.44 shows a side view of an alternative embodiment of a heat distribution assembly according to some described embodiments;

[0053] Fig.45 an isometric view illustrating an alternative embodiment of a heat distribution assembly according to some described embodiments showing the heat distribution assembly modified to receive a component;

[0054] Fig.46 shows an isometric view of an alternative embodiment of a heat distribution assembly according to some described embodiments;

[0055] Fig.47 A flow chart illustrating a method for forming a display assembly for an electronic device according to some of the described embodiments is shown;

[0056] Fig.48 A flow chart illustrating a method for forming a battery assembly for an electronic device according to some of the described embodiments is shown;

[0057] Fig.49 A flow chart illustrating a method for forming a circuit board assembly according to some of the described embodiments is shown;

[0058] Fig.50 A flowchart is shown according to some of the described embodiments, the flowchart showing a method for assembling an electronic device, the electronic device including a housing defining an interior cavity; and

[0059] Fig.51 A flow chart illustrating a method for making a heat distribution assembly for removing heat from a heat generating component in an electronic device having a housing sidewall is shown, according to some of the described embodiments.

[0060] Those skilled in the art will know and understand that, according to common practice, the various features of the drawings discussed below are not necessarily drawn to scale and that the sizes of the various features and elements of the drawings may be expanded or reduced to more clearly illustrate the embodiments of the invention described herein. DETAILED DESCRIPTION

[0061] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a preferred embodiment. On the contrary, it is intended to cover alternatives, modifications and equivalent forms that may be included in the essence and scope of the embodiments defined by the appended claims.

[0062] In the following detailed description, reference is made to the accompanying drawings which form a part of the specification and in which are shown by way of illustration specific embodiments in accordance with the described embodiments. Although these embodiments are described in sufficient detail to enable those skilled in the art to practice the embodiments, it is to be understood that these examples are not limiting, such that other embodiments may be used and changes may be made without departing from the spirit and scope of the described embodiments.

[0063] The following disclosure relates to an electronic device. The electronic device may include several reinforcements that are superior to traditional devices. For example, the electronic device may include a housing that defines an internal cavity of the electronic device. The electronic device may also include a display that extends to the housing in at least some positions, thereby increasing the size of the display. The display may be part of a display assembly that also includes a touch-sensitive layer and a force-sensitive layer. In order to accommodate the increased display size, the electronic device may include a frame (or frame) surrounding the display, wherein the frame has a reduced size. However, without specific modifications, the reduced size of the frame may expose the electrical and mechanical connections between the display assembly components and the flexible circuit (in the electronic device). In this regard, some components of the display assembly may be electrically coupled and mechanically coupled to their corresponding circuits (including flexible circuits) at different locations throughout the electronic device so as to hide the electrical and mechanical connections. For example, the touch-sensitive layer and the display may be electrically coupled and mechanically coupled to their corresponding circuits at one location within the electronic device, while the force-sensitive layer is electrically coupled and mechanically coupled to the circuit at another different location away from the electrical and mechanical connections between the touch-sensitive layer, the display and its corresponding flexible circuit. Additionally, by routing electrical and mechanical connections at different locations, the volume occupied by the display assembly (and its components) can be reduced, and additional space within the interior cavity of the electronic device can be made available for one or more different components within the electronic device.

[0064] The electronic device may also include a circuit board assembly designed to occupy less space in the electronic device. For example, the circuit board assembly may be divided into a first circuit board stacked above a second circuit board. The stacked configuration of multiple circuit boards (one stacked above another) can reduce the footprint of the circuit board assembly in two dimensions. In addition, the aforementioned circuit board may include operating components (e.g., integrated circuits or processor circuits) positioned on multiple opposing surfaces. In addition, the circuit board assembly may include an interposer or interconnector designed to transmit signals between the first circuit board and the second circuit board so that the first circuit board and the second circuit board (and their corresponding operating components) communicate with each other.

[0065] In some cases, the stacked circuit board assembly may include an operating component (located on one of the circuit boards) including a recessed portion and an additional operating component (located on the other circuit board) including a protrusion (or protruding feature) partially positioned in the recessed portion. In this way, based on the recessed portion receiving a portion of the additional operating component, the circuit boards can be positioned closer together, thereby further reducing the occupied area of ​​the stacked circuit board assembly. In addition, in some cases, the operating components can be electrically coupled to each other. For example, the recessed portion may include a connector, and the protrusion may include a connector electrically coupled to the connector of the recessed portion. Due to the electrical connection between the operating components, the circuit boards can also be electrically connected to each other. This can reduce the need for separate and dedicated electrical connectors for electrically coupling the circuit boards.

[0066] The electronic device may also include a battery assembly or an internal power supply. Due in part to the modification of the display assembly and the circuit board assembly to form additional space in the housing, the battery assembly may increase in size and occupy at least a portion of the additional space, thereby increasing the charge capacity of the battery assembly. In addition, the battery assembly may include shapes other than traditional straight shapes. For example, the battery assembly may include an L-shaped configuration, which is formed by die-cutting a number of electrodes in an L-shaped configuration to form a battery assembly, and the L-shaped configuration of the several electrodes is similar to the L-shaped configuration of the battery assembly. In addition, additional components such as antennas and circuits may be repositioned in the electronic device to increase the size of the battery assembly. In addition, the battery assembly may include modifications, such as channels, which are designed to accommodate flexible circuits that are routed across the battery assembly and specifically across the channels.

[0067] Additionally, in some cases, the housing may include a metal strip coupled to a transparent protective layer (such as a cover glass) covering the display assembly. The metal strip may include a metal such as aluminum, or a metal alloy including aluminum. The housing may also include an additional protective layer coupled to the metal strip. The additional protective layer may include a non-metallic material such as glass, sapphire, plastic, etc. The additional protective layer may substantially define a rear wall or bottom wall of the electronic device. Therefore, the housing's ability to distribute and dissipate heat from the electronic device may be limited because the amount of metal used for the housing is limited to the metal strip, and glass has a significantly lower thermal conductivity than the metal forming the metal strip.

[0068] When one or more components (such as integrated circuits) in an electronic device generate heat, it may be necessary to remove the heat from the internal cavity to avoid damage to one or more components in the electronic device. In this regard, the electronic device may include a heat distribution component that is arranged against or near an additional protective layer. The heat distribution component is designed to dissipate (or redistribute) the heat energy generated from one or more heat-generating components to the metal strip, thereby allowing the heat energy to dissipate from the electronic device. The heat distribution component may include several metal layers, one of which may have a relatively high thermal conductivity (compared to the remaining layers). Therefore, the electronic device may include a housing with a bottom wall made of glass, which can improve the overall aesthetics of the electronic device, while also being able to remove heat from the electronic device before the temperature in the electronic device rises and causes damage to any internal components of the electronic device. In addition, a layer with relatively low thermal conductivity prevents heat from being transferred to the bottom wall of the glass, thereby preventing or limiting heat from reaching the user when the user of the electronic device holds the electronic device.

[0069] In addition, when the user interacts with the display assembly, the force-sensitive layer can determine the magnitude of the force applied to the display so as to generate a command based on the magnitude of the determined force. However, the force applied to the display assembly (by covering the protective layer of the display assembly) can cause the display assembly and the protective layer to bend, thereby reducing the internal cavity and increasing the internal air pressure. The increased internal air pressure can affect other components, such as an audio module designed to generate sound energy. In order to isolate the audio module from the increased air pressure, the audio module may include a housing or shell that encapsulates the components of the audio module (including the rear cavity of the audio module), and a shielding cover is provided to isolate the air in the internal cavity of the electronic device, and thus isolate the rear cavity of the audio module from the pressure changes in the electronic device. In this way, the audio module will not be affected by the pressure changes in the electronic device, and will generate sound energy without being disturbed by the pressure changes.

[0070] Reference below Figure 1-51 These and other embodiments are discussed. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these figures is for illustrative purposes only and should not be construed as limiting.

[0071] Figure 1 An isometric front view of an embodiment of an electronic device 100 according to some of the described embodiments is shown. In some embodiments, the electronic device 100 is a tablet device. In other embodiments, the electronic device 100 is a wearable electronic device that includes one or more straps (not shown) designed to wrap around an appendage (e.g., a wrist) of a user to secure the electronic device 100 to the user. Figure 1In the illustrated embodiment, the electronic device 100 is a mobile communication device such as a smart phone. Therefore, as a non-limiting example, the electronic device 100 can implement wireless communication in the form of cellular network communication, Bluetooth communication (2.4GHz), and / or wireless local area network (WLAN) communication (2.4GHz to 5GHz). As shown, the electronic device 100 may include a display assembly 102, which includes a display layer designed to present visual information in the form of text information, static images, and / or video information. Although not shown in the figure, the display assembly 102 may also include a touch-sensitive layer, which is designed to detect touch input in the display assembly 102, so as to control the information presented on the display assembly 102, for example. In addition, the display assembly 102 may also include a force-sensitive layer designed to detect the size of the force applied to the display assembly 102. The size of the determined force may correspond to a specific input or command to a processor circuit (not shown) for controlling the display assembly 102. For example, the detected forces of different sizes may correspond to different or unique commands.

[0072] To protect the display assembly 102, the electronic device 100 may include a first protective layer 104 covering the display assembly 102. A second protective layer (not shown) of the electronic device 100 will be shown and discussed below. As a non-limiting example, the first protective layer 104 may include one or more transparent materials, including glass, sapphire, or plastic. As shown, the first protective layer 104 may include an opening to facilitate user interaction with the electronic device 100. For example, the first protective layer 104 may include a first opening 106 and a second opening 108. The electronic device 100 may include an image capture device (not shown) that captures one or more images through the first opening 106. The electronic device 100 may also include an audio module (not shown) that generates acoustic energy in the form of audible sound, which leaves the electronic device 100 via the second opening 108.

[0073] In addition, the electronic device 100 may include a band 110 that defines the outer periphery of the electronic device 100. Generally speaking, the band 110 includes a shape similar to a four-sided ring. However, other shapes are also possible. In addition, the band 110 may define multiple side walls and an opening to at least partially receive the first protective layer 104 and the second protective layer (not shown) and fix them together with the two protective layers. In some embodiments, the band 110 includes a metal, such as aluminum or an alloy including aluminum. In this regard, the band 110 can provide a rigid support structure for the electronic device 100. In addition, when the band 110 is formed by metal, the band 110 may include several side walls, some of which are used to support wireless communication. For example, the band 110 may include a first side wall component 112 that forms a U-shaped design, and a second side wall component 114 that also forms a U-shaped design. The first side wall component 112 and the second side wall component 114 can each function in conjunction with a radio circuit (not shown) in the electronic device 100, so that the first side wall component 112 and the second side wall component 114 each form at least a part of the antenna of its corresponding radio circuit. For example, the first side wall member 112 may function in conjunction with a WLAN radio circuit, and the second side wall member 114 may function in conjunction with a cellular network radio circuit.

[0074] In addition, the belt 110 may also include a third sidewall component 116 and a fourth sidewall component 118, wherein the third sidewall component 116 and the fourth sidewall component 118 are separated from the first sidewall component 112 and the second sidewall component 114 by a partitioning area or opening. For example, the belt 110 may include a first partitioning area 122 and a second partitioning area 124 that combine to separate the third sidewall component 116 from the first sidewall component 112 and the second sidewall component 114. In addition, the belt 110 may include a third partitioning area 126 and a fourth partitioning area 128 that combine to separate the fourth sidewall component 118 from the first sidewall component 112 and the second sidewall component 114. The aforementioned partitioning areas may be filled with a non-metallic material, such as molded plastic (or other non-conductive material), to provide flush coplanar surfaces for the portions of the belt 110. In the case where the first sidewall component 112 and the second sidewall component 114 are electrically isolated from the third sidewall component 116 and the fourth sidewall component 118, the first sidewall component 112 and the second sidewall component 114 can be used as a part of the antenna, and the third sidewall component 116 and the fourth sidewall component 118 can be used as an electrical ground for one or more internal components (not shown) electrically coupled to the third sidewall component 116 and the fourth sidewall component 118, respectively. In addition, each of the first sidewall component 112, the second sidewall component 114, the third sidewall component 116, and the fourth sidewall component 118 can provide a protective structural component for at least some internal components, and provide heat dissipation and heat removal functions for some heat generating components (not shown) of the electronic device 100, provided that the heat generating components are thermally coupled to at least one of the aforementioned components. In addition, the first sidewall component 112, the second sidewall component 114, the third sidewall component 116, and the fourth sidewall component 118 can each represent at least a portion of the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall, respectively.

[0075] The electronic device 100 may also include one or more input devices. For example, the electronic device 100 includes a first button 130 designed to generate an input when pressed. The input may generate an electrical signal sent to a processor circuit (not shown) in the electronic device 100 to change the visual information presented on the display assembly 102. As shown, the first button 130 is positioned along the third sidewall member 116. However, other positions are also possible. In addition, although not shown in the figure, the electronic device 100 may include a switch designed to provide additional user input functions.

[0076] In addition, the electronic device 100 may also include a data port 132 designed to receive a cable assembly (not shown) and electrically coupled to the cable assembly. The data port 132 may receive data / communication from the cable assembly, and receive electrical energy to charge a battery assembly (not shown) located in the electronic device 100. In addition, the electronic device 100 may include additional openings designed for various user interactions. For example, the electronic device 100 may include an audio module (not shown) located near an opening 134 or a through hole formed in the second side wall member 114. The opening 134 allows the acoustic energy generated from the audio module to leave the electronic device 100. In addition, the electronic device 100 may also include a microphone (not shown) located near an opening 136 or a through hole formed in the second side wall member 114. The microphone may be positioned to receive acoustic energy through the opening 136.

[0077] Figure 2 Shown in Figure 1 , which further illustrates additional features of the electronic device 100. As shown, the electronic device 100 may include a second protective layer 144 secured to the band 110. The second protective layer 144 may be combined with the band 110 to define a housing including an interior cavity or chamber that receives a number of internal components, such as circuit boards, integrated circuits, and battery components, as non-limiting examples. In this regard, the band 110 may include a first protective layer 104 (e.g., Figure 1 140 and receiving a first edge region of the belt 110, and a second edge region receiving the second protective layer 144, wherein the first edge region and the second edge region are located at opposite or opposite positions of the belt 110. In addition, the second protective layer 144 can be referred to as a bottom wall or a rear wall.

[0078] Generally, the second protective layer 144 may include one or more materials that provide an aesthetically pleasing finish, such as glass, sapphire, or plastic. Additionally, in some cases, the material composition of the second protective layer 144 may allow radio frequency ("RF") communications generated from an internal radio circuit (not shown) of the electronic device 100 to penetrate the second protective layer 144. In this way, the electronic device 100 may wirelessly communicate with other devices (not shown) via RF communications that are substantially uninhibited by the second protective layer 144.

[0079] In addition, the second protective layer 144 may include an opening to facilitate user interaction with the electronic device 100. For example, the second protective layer 144 may include a first opening 146 and a second opening 148. The electronic device 100 may include an image capture device (not shown) that captures one or more images through the first opening 146. The electronic device 100 may also include a flash module (not shown) aligned with the second opening 148, wherein the flash module generates light energy that passes through the second opening 148 during an image capture event from the image capture device so as to enhance the image quality of the one or more images acquired by the image capture device. In addition, in addition to the first button 130 (such as Figure 1 In addition to the first button 130, the electronic device 100 may further include a second button 150 that is designed to generate input when pressed in a similar manner to the first button 130. As shown, the second button 150 is positioned along the fourth side wall member 118. However, other locations are also possible.

[0080] Figure 3 Shown in Figure 1 , which shows various components of the electronic device 100. For simplicity, several features of the electronic device 100 are not shown. As shown, the first protective layer 104 can cover the display assembly 102. In addition, the first protective layer 104 can be fixed to the display assembly 102 in an adhesive manner by an adhesive layer (not shown).

[0081] As shown, the display assembly 102 may include a touch-sensitive layer 202 designed to receive touch input, a display layer 204 designed to present visual information, and a force-sensitive layer 206 designed to detect the magnitude of a force applied to or acting on the display layer 204 by applying force to at least one of the first protective layer 104, the touch-sensitive layer 202, and the display layer 204. In addition, although not shown in the figure, the display assembly 102 may include an adhesive layer for bonding the touch-sensitive layer 202 and the display layer 204 together and bonding the display layer 204 and the force-sensitive layer 206 together.

[0082] The touch-sensitive layer 202 is designed to receive touch input when, for example, a user (not shown) presses the first protective layer 104. The touch-sensitive layer 202 may include capacitive touch-sensitive technology. For example, the touch-sensitive layer 202 may include a capacitive material layer that holds an electric charge. The capacitive material layer is designed to form a portion of a plurality of capacitive parallel plates in a position corresponding to the display layer 204. In this regard, when a user touches the first protective layer 104, the user forms one or more capacitors. In addition, the user causes a voltage drop across one or more capacitors, which in turn causes the charge of the capacitive material to change at one or more specific contact points corresponding to the location of the user's touch input. The capacitance change and / or voltage drop may be measured by the electronic device 100 to determine the location of the touch input. In addition, the touch-sensitive layer 202 may include an edge region 226 that includes a connector (shown later).

[0083] In some embodiments, display layer 204 includes a liquid crystal display ("LCD") that relies on a backlight to present visual information. Figure 3 In the embodiment shown in , the display layer 204 includes an organic light emitting diode ("OLED") display designed to illuminate individual pixels when needed. When the display layer 204 includes OLED technology, the display layer 204 can have a reduced form factor compared to an LCD display. In this regard, the display assembly 102 can have a smaller footprint, thereby providing more room for other components such as a battery assembly (shown later). In addition, when the display layer 204 includes OLED technology, the display layer 204 can be bent or flexed without causing damage to the display layer 204. For example, as shown in FIG. Figure 3 As shown, the display layer 204 includes a bend 208. The bend 208 may include a 180 degree bend or a bend of approximately 180 degrees. The bend 208 allows the display layer 204 to bend or bend around at least a portion of the force sensitive layer 206, such as Figure 3 In addition, the display layer 204 may include an edge region 210 having a connector (not shown) for electrically and mechanically coupling the display layer 204 to a flexible circuit (not shown) electrically coupled to a circuit board assembly (not shown), wherein the flexible circuit enables the display layer 204 to communicate with the circuit board assembly. In addition, in some embodiments, the display layer 204 may include an active matrix organic light emitting diode ("AMOLED") display. In addition, as Figure 3 As shown, edge region 226 of touch-sensitive layer 202 is parallel or at least substantially parallel relative to edge region 210 of display layer 204 , even when display layer 204 includes curved portion 208 .

[0084] The force-sensitive layer 206 can operate by determining the magnitude of the force or pressure applied to the first protective layer 104, the touch-sensitive layer 202, and / or the display layer 204. In this regard, the force-sensitive layer 206 can distinguish between forces of different magnitudes applied to the electronic device 100. Forces of different magnitudes can correspond to different user inputs. The force-sensitive layer 206 may include a plurality of parallel capacitor plate arrangements, wherein one plate in each capacitor plate arrangement has an electric charge. When a force is applied to the first protective layer 104, the first protective layer 104 reduces the distance between one or more pairs of parallel plate capacitors, thereby causing a change in the capacitance between one or more pairs of parallel plate capacitors. The amount of change in the capacitance corresponds to the magnitude of the force acting on the first protective layer 104. In addition, as shown in the enlarged view, the force-sensitive layer 206 may include a connector 218 located on an edge region 220 of the force-sensitive layer 206, wherein the edge region 220 is perpendicular or at least substantially perpendicular to the edge region 210 of the display layer 204 and the edge region 226 of the touch-sensitive layer 202. Thus, connector 218 may be positioned vertically, or at least substantially vertically, relative to a connector (shown later) of display layer 204 .

[0085] In addition, in order to support the first protective layer 104 and facilitate the assembly of the first protective layer 104 and the belt 110 (eg Figure 1 ), the electronic device 100 may include a frame 154 that receives the first protective layer 104 and is fixed to the first protective layer by an adhesive layer 166. Therefore, the frame 154 may have a size and shape consistent with the first protective layer 104. The frame 154 may be at least partially positioned between the first protective layer 104 and the band 110. The frame 154 may be formed of a polymer material such as plastic, and may also include a metal ring (not shown) that is partially embedded in the polymer material during an insert molding operation. In this regard, the frame 154 may structurally support the first protective layer 104, as well as one or more components of the display assembly 102. This will be shown below.

[0086] Figure 4 Shown in Figure 11 is a partially exploded view of the electronic device 100 shown in FIG. 1 , which further shows additional components of the electronic device 100. For simplicity, several features of the electronic device 100 are not shown. As shown, the band 110 and the second protective layer 144 can be combined to provide an internal cavity 152 for several internal components. For example, the electronic device 100 may include a battery assembly 160 designed to distribute current to the operating components of the electronic device 100. The battery assembly 160 may include a rechargeable battery designed to receive current during recharging. For example, the electronic device 100 may include an inductive receiver coil 162 (formed by a metal such as steel) electrically coupled to the battery assembly 160. When placed near an alternating magnetic field from a device (not shown) located outside the electronic device, the inductive receiver coil 162 may receive an induced current from the alternating magnetic field. The induced current from the inductive receiver coil 162 passes through a transformer, thereby converting the alternating current into a direct current that is subsequently used to charge (or recharge) the battery assembly 160. In addition, the second protection layer 144 provides little or no impedance to the external magnetic field, so that the alternating magnetic field reaches the inductive receiver coil 162 .

[0087] Additionally, the battery assembly 160 may also include a channel 164 having a reduced size (e.g., in the z dimension of a Cartesian coordinate) to allow components such as a flexible circuit (not shown) to extend along the battery assembly 160 and pass over the battery assembly 160 along the channel 164. Due in part to the increased space provided by the channel 164, other internal components such as an antenna element (not shown) may be repositioned within the interior cavity 152 of the electronic device 100, thereby creating additional space for the battery assembly 160. In this way, the volume (size) of the battery assembly 160 may be increased, and the increased volume allows the battery assembly 160 to increase the electrical storage capacity, allowing the electronic device 100 to provide a longer use time of the electronic device 100 between charging events of the battery assembly 160.

[0088] The electronic device 100 may also include a circuit board assembly 170 having a plurality of operating components. As shown, the circuit board assembly 170 may include a first circuit board 172 and a second circuit board 174, wherein the first circuit board 172 is stacked above the second circuit board 174. In this way, the circuit board assembly 170 may save space in the x-dimension and the y-dimension in the internal cavity 152. In addition, the first circuit board 172 and the second circuit board 174 may include a plurality of surfaces, wherein each of the plurality of surfaces is designed to carry one or more components (e.g., a processor circuit). Various features of the circuit board assembly 170 will be discussed below.

[0089] The electronic device 100 may also include a first audio module 182 and a second audio module 184 designed to generate acoustic energy in the form of audible sound. Each of the audio modules may include an opening for emitting acoustic energy. However, each audio module is designed to include an acoustic cavity (defined by its corresponding audio module) that is isolated from the internal cavity 152 of the electronic device 100. Thus, when the first protective layer 104 (e.g., Figure 3 When the electronic device 100 is provided with a touch input and / or a force input to change the internal cavity 152 (as shown in FIG. 1 ), the audio module is (acoustically) unaffected by the change in the internal cavity 152 and the associated increased air pressure in the internal cavity 152. This will be discussed further below.

[0090] The electronic device 100 may also include a heat distribution component 190. Although not shown in the figure, the heat distribution component 190 may include several material layers. In some embodiments, the material layers are different. For example, some layers are formed by a first type of material, while other layers are formed by a second type of material different from the first type of material. The first type of material may include a material with a relatively high thermal conductivity. For example, the first type of material may include copper known to have a thermal conductivity of approximately 400W / m*K (watts / meter / Kelvin). Alternatively, the first type may include graphite known to have a thermal conductivity of approximately 170W / m*K. Therefore, the first type of material is very suitable for receiving thermal energy and transferring or distributing thermal energy from one position in the electronic device 100 to another position, thereby facilitating the removal of thermal energy in the electronic device 100. The second type of material may include a more sturdy material, such as stainless steel. In this regard, the second type of material may have a relatively low thermal conductivity. However, the second type of material can 1) provide a protective covering for the first type of material, 2) provide structural support for the electronic device 100, and / or 3) provide a workable surface for securing components (not shown) to the heat distribution assembly 190, such as by a welding operation. The various layers of the heat distribution assembly 190 are discussed further below.

[0091] The heat distribution assembly 190 is designed to redirect or redistribute heat generated in the electronic device 100. For example, the circuit board assembly 170 may include operating components, such as integrated circuits, that are known to convert electrical energy (provided by the battery assembly 160) into thermal energy during operation. As a non-limiting example, the heat distribution assembly 190 may be thermally coupled to the circuit board assembly 170 through contact between the heat distribution assembly 190 and the circuit board assembly 170. In addition, the heat distribution assembly 190 may be thermally coupled to the strip 110 so that thermal energy received by the heat distribution assembly 190 from the circuit board assembly 170 may be at least partially transferred to the strip 110. Thus, at least a portion of the thermal conductivity lost by using the second protective layer 144 (non-metallic) is regained by using the heat distribution assembly 190. In addition, the heat distribution assembly 190 may have a size and shape that is consistent with the second protective layer 144, so that the heat distribution assembly 190 covers or at least substantially covers the surface of the second protective layer 144. For example, the x-dimension and the y-dimension of the heat distribution assembly 190 can be the same or substantially similar to the x-dimension and the y-dimension, respectively, of the second protective layer 144 .

[0092] Although not shown in the figure, the electronic device 100 may include additional components, such as a haptic engine and an internal antenna as non-limiting examples. In addition, although not shown in the figure, the electronic device 100 may include several flexible circuits that electrically connect the electronic components (e.g., the display assembly 102, the circuit board assembly 170) to each other and to the battery assembly 160.

[0093] Figure 5 Shown in Figure 1 The electronic device 100 shown in FIG. Figure 1 2. As shown in the figure, the layers of the display assembly 102, namely the touch-sensitive layer 202, the display layer 204, and the force-sensitive layer 206, are assembled. Although not shown in the figure, the display assembly 102 may include an adhesive layer for bonding the touch-sensitive layer 202 to the display layer 204 and bonding the display layer 204 to the force-sensitive layer 206.

[0094] The touch-sensitive layer 202 is designed to receive touch input when, for example, a user (not shown) presses the first protective layer 104. The touch input can be relayed from the touch-sensitive layer 202 to the circuit board assembly 170 (eg, Figure 4 The first flexible circuit is electrically and mechanically coupled to the touch-sensitive layer 202 through the connector 222 of the touch-sensitive layer 202. The connector 222 may be positioned at an edge region 226 of the touch-sensitive layer 202 (e.g., Figure 3 As shown, the first flexible circuit 212 can be bent or flexed around the display layer 204 and the force-sensitive layer 206 to electrically and mechanically couple with the touch-sensitive layer 202.

[0095] The frame 154 may include design considerations for accommodating the display assembly 102. For example, the frame 154 may include a notch 156 or undercut area designed to at least partially receive the first flexible circuit 212 and / or the display layer 204. Figure 5 As shown, the notch 156 has a size and shape for receiving the curved / bending area of ​​the display layer 204 and the first flexible circuit 212. Although the notch 156 has a curvature that generally corresponds to the first flexible circuit 212 and the display layer 204, other shapes including straight edges are possible for the notch 156. In addition, the notch 156 can be formed during the molding operation of the frame 154. Alternatively, the notch 156 can be formed after the molding operation, for example, by a cutting operation.

[0096] In addition, the frame 154 is connected to the first protective layer 104 and the second side wall member 114 (the second side wall member of the belt 110, such as Figure 1 The frame 154 may include a support element 158 ​​partially embedded in the frame 154. In some embodiments, the support element 158 ​​includes a ring formed of a metal material that extends continuously around the display assembly 102 according to the frame 154. However, the support element 158 ​​may also be discontinuous and thus selectively embedded in the frame 154. As shown, the support element 158 ​​may extend along the frame 154 to support the display assembly 102 and the first protective layer 104. In addition, the first flexible circuit 212 may be fixed to the support element 158 ​​by an adhesive layer (not shown).

[0097] Figure 5 Also shown are some components of the display assembly 102 that are coupled to the flexible circuit at one location while other components are not coupled. For example, the touch-sensitive layer 202 is electrically and mechanically coupled to the first flexible circuit 212 via the connector 222, and the display layer 204 is electrically and mechanically coupled to the second flexible circuit 214 via the connector 224, wherein the connector 222 and the connector 224 are adjacent to the second sidewall member 114 (defined by the U-shaped configuration, as shown in FIG. 1 ). Figure 1 The connector 218 of the force-sensitive layer 206 (as shown) is positioned. Figure 33 ). In addition, connectors 222 and 224 are electrically and mechanically coupled to first and second flexible circuits 212 and 214, respectively, at locations adjacent to recesses 156 in frame 154, whereas force-sensitive layer 206 is not. In addition, connector 222 may be positioned parallel or at least substantially parallel to connector 224. Force-sensitive layer 206 may be positioned at another separate location (e.g., connector 218 on edge region 220, as shown in FIG. 3 ). Figure 3 The flex circuit (not shown) is electrically coupled and mechanically coupled to a flexible circuit (not shown). This will be shown and described below.

[0098] Figure 6 A cross-sectional view of an alternative embodiment of an electronic device 250 according to some of the described embodiments is shown. The electronic device 250 may include any one or more of the features or one or more of the components previously described for the electronic device. For example, the electronic device 250 may include a display assembly 252 that includes a touch-sensitive layer 262, a display layer 264, and a force-sensitive layer 266. However, as Figure 6 As shown, the display layer 264 may include a configuration that is substantially flat throughout the display layer 264 , wherein the flexible circuit 274 bends around the force-sensitive layer 266 to electrically and mechanically couple with the display layer 264 .

[0099] Figure 7 Shown in Figure 1 The electronic device 100 shown in FIG. Figure 1 BB in FIG. As shown in the figure, the connector 218 (also shown in FIG. 206 ) of the force-sensitive layer 206 Figure 3 206 is electrically and mechanically coupled to the third flexible circuit 216, which is connected to the circuit board assembly 170 (as shown in FIG. Figure 4 The third flexible circuit 216 can be electrically coupled to the support element 158 ​​by bonding with an adhesive layer (not shown) to enable the force-sensitive layer 206 to communicate with the circuit board assembly 170. In addition, the third flexible circuit 216 can be fixed together with the support element 158 ​​by bonding with an adhesive layer (not shown).

[0100] like Figure 7 As shown, only the force-sensitive layer 206 includes electrical and mechanical connections to the flexible circuit. In other words, compared to the connector 222 of the touch-sensitive layer 202 (e.g. Figure 5 ) and the connector 224 of the display layer 204 (as shown Figure 5 As shown in FIG. 1 , connectors 218 providing electrical and mechanical connections between the force-sensitive layer 206 and the third flexible circuit 216 are located at different locations of the electronic device 100. In addition, based on the positions of the corresponding edge areas, the connectors 218 of the force-sensitive layer 206 are positioned vertically or at least substantially vertically relative to the connectors 222 of the touch-sensitive layer 202 and the connectors 224 of the display layer 204.

[0101] Additionally, the connector 218 is adjacent to the third side wall member 116 (also shown as Figure 1 As shown), the third side wall member 116 is partially formed by being perpendicular or substantially perpendicular to the second side wall member 114 (as shown Figure 1 and Figure 5 Thus, the frame 154 may not require a notch 156 (as shown). Figure 5 ) to accommodate the display layer 204 and the first flexible circuit 212 (as shown Figure 5 ). Thus, the frame 154 may include an asymmetric frame. Furthermore, the additional material of the frame 154 may allow for additional structural rigidity to support the display assembly 102 and the first protective layer 104.

[0102] Figure 8 A cross-sectional view of an alternative embodiment of an electronic device 300 according to some of the described embodiments is shown. The electronic device 300 may include any one or more of the features or one or more components previously described for the electronic device. For example, the electronic device 300 may include a first protective layer 304 secured to the display assembly 302, and a frame 354 that supports the first protective layer 304. However, the first protective layer 304 may include an extension 306 that extends radially outward from the first protective layer 304 at least partially in a circumferential manner. In order to accommodate the extension 306, the frame 354 may include a recess 366 for receiving the extension 306. The extension 306 provides additional structural contours to the first protective layer 304, and may also provide additional surface area to bond the first protective layer 304 to the frame 354. For example, as Figure 8 As shown, the first protective layer 304 is adhesively fixed to the frame 354 by an adhesive layer 362, which extends through an area partially defined by the interface between the frame 354 and the first protective layer 304 (including the extension 306). In addition, the distance or gap between the frame 354 and the first protective layer 304 (including the extension 306) can cause the adhesive layer 362 to extend through the interface area through capillary forces. Therefore, the frame 354 is adhesively fixed to the first protective layer 304 through multiple (vertical) surfaces to form a strong bond that resists or offsets forces applied to the electronic device 300 in multiple directions.

[0103] Fig. 9A plan view of an embodiment of a frame 454 according to some of the described embodiments is shown. As shown, the frame 454 may include a support element 458, which may include a metal ring molded into the frame 454. The frame 454 may be implemented into one or more electronic devices described herein and may include any of the features previously described for the frame. In order to improve the adhesion between an adhesive (not shown) and a surface 462 of the frame 454, the surface 462 may include certain modifications. For example, as shown in the enlarged view, the surface 462 may include a textured area 464 designed to increase the surface tension or surface energy of the surface 462. The textured area 464 may enhance the adhesion of the frame 454 to a transparent cover (e.g., Figure 5 The first protective layer 104 shown in the figure is provided with an adhesive (eg, Figure 5 The bonding is performed by the adhesive layer 166 shown.

[0104] Fig.10 Shown in Fig. 9 4. A cross-sectional view of the frame 454 shown in FIG. 4 taken along line AA. As shown, the textured region 464 may include a plurality of pits or indentations formed into the frame 454 along the surface 462. The textured region 464 provides additional surface area for the aforementioned adhesive. Several different processes may be used to form the textured region 464. For example, a molding tool (not shown) for molding the frame 454 may include a protruding feature having a shape corresponding to the shape of the textured region 464. Alternatively, the frame 454 may be formed with a molding tool that does not include a protruding feature, and after the molding operation of forming the frame 454, the surface 462 may be etched by, for example, a laser to form the textured region 464. In addition, although the textured region 464 defines a plurality of pits or indentations formed into the frame 454, several shapes other than the pits or indentations are also possible. For example, the textured region 464 may include a plurality of linear and / or nonlinear indentations.

[0105] Fig.11 A cross-sectional view of an alternative embodiment of a frame 554 according to some of the described embodiments is shown, which shows that a surface 562 of the frame 554 has a protruding feature 564. The frame 554 may include any of the features previously described for the frame. In this regard, the surface 562 may be used to attach the frame to the adhesive (e.g., Figure 5 Adhesive layer 166 shown) to receive a transparent cover (e.g., Figure 5104). As shown, the protruding features 564 can extend from the surface 562. The frame 554, and specifically the protruding features 564, can be formed by a molding tool (not shown) including an insert that is designed to withdraw a portion of the molding material (used to form the frame 554) so ​​that the protruding features 564 extend from the surface 562. The protruding features 564 provide additional surface area for the aforementioned adhesive.

[0106] Fig.12 A cross-sectional view of an embodiment of an electronic device 700 is shown, showing the electronic device 700 having a frame 754 and a support element 758 partially embedded in the frame 754 and extending substantially into the frame 754. The electronic device 700 may include any of the features described herein for the electronic device. In addition, similar to the previous embodiments, the support element 758 may include a ring formed of a metal material that surrounds the display assembly 702 of the electronic device 700 and extends from the frame 754. As shown, the support element 758 may extend beyond the display assembly 702 in the z dimension and also beyond the protective cover 704 (similar to the Figure 1 The first protective layer 104 is shown).

[0107] To further extend the support element 758 in the z dimension, the frame 754 can be widened in the y dimension. Figure 1 The size of the second sidewall member 114 shown can be reduced in the y dimension to offset the increased size of the frame 754. In addition, one or more materials used to form the frame 754 can be changed to accommodate the support elements 758. For example, the frame 754 can include a nylon material mixed with a glass-filled material that enhances the overall strength and rigidity of the frame 754. However, in some embodiments, the frame 754 is formed of ceramic. In this regard, the sidewall member 714 and any remaining sidewall members can also be formed of ceramic.

[0108] When the support element 758 extends in the manner described, other factors should be considered. For example, in some cases, the sidewall component 714 forms a part of an antenna assembly (not shown), which includes an antenna component designed to provide wireless communication for the electronic device 700. When formed of metal, the support element 758 may cause some interference to the antenna component. This may include forming a parallel plate capacitor between the antenna assembly (including the sidewall component 714) and the support element 758. Therefore, the size, shape, material and position of the support element 758 should be considered to prevent undesirable interference. It should be noted that additional techniques can be used to optimize the size of the support element 758 and the proximity to the sidewall component 714. This may include, for example, reducing the z dimension of the support element 758, and / or providing an opening or discontinuous portion in the support element 758.

[0109] The electronic device 700 may include a surface 762 that receives and is bonded to the protective cover 704. The surface 762 may include a dimension 766 that provides a substantially flat surface. However, in some embodiments, the surface 762 is modified to enhance bonding to the protective cover 704. In addition, the frame 754 may include a notch 756 or undercut formed into the frame 754 that allows the frame 754 to receive the display assembly 702, including the flexible circuit and flexible layer of the display assembly 702. The size of the notch 756 may be adjusted (e.g., increased) based on the increased size of the frame 754. However, by increasing the size of the notch 756 (in the y dimension), additional material of the frame 754 may be removed at a position below the surface 762. It should be noted that the size of the notch 756 may be optimized using the dimension 766 of the surface 762 using additional techniques.

[0110] In addition, in order to fix the frame 754 with the sidewall member 714, the electronic device 700 may include an adhesive 768 that bonds the frame 754 to the sidewall member 714. As shown, the amount of adhesive 768 used generally allows the sidewall member 714, the frame 754 and the protective cover 704 to form a generally continuous and flat configuration, as shown by the edges of the aforementioned parts aligned with each other. However, in order to provide additional protection to the protective cover 704 by the sidewall member 714, the amount of adhesive 768 used can be reduced, so that the protective cover 704 is lower relative to the sidewall member 714 in the z dimension. In this way, the sidewall member 714 can additionally cover a portion of the protective cover 704 and provide additional protection to the protective cover 704 to avoid it from being subjected to forces having a force component in the y dimension. It should be noted that additional techniques can be used to optimize the amount of adhesive 768 used and adjust the size of the frame 754, the sidewall member 714 and the protective cover 704 so as to maintain a generally continuous and flat configuration.

[0111] Fig.13 A cross-sectional view of an embodiment of an electronic device 800 according to some of the described embodiments is shown, showing that the electronic device 800 has a protective cover 804 and a sidewall member 814 that is extended to provide additional support for the protective cover 804. The electronic device 800 may include any of the features described herein for the electronic device. Compared to the previous embodiments, the sidewall member 814 includes an outer periphery 824 that is raised or elevated in the z dimension. Therefore, the material (in the y dimension) forming the sidewall member 814 is increased and provides additional support for the protective cover 804. In addition, the sidewall member 814 may include an edge 826 that is parallel or at least substantially parallel to the surface 806 of the protective cover 804. Therefore, the sidewall member 814 may also provide additional support to the protective cover 804 and the frame 854 located between the protective cover 804 and the sidewall member 814.

[0112] Fig.14 A cross-sectional view of an embodiment of an electronic device 900 according to some of the embodiments is shown, which shows that the electronic device 900 has various structural reinforcements. The electronic device 900 may include any feature described herein for the electronic device. Similar to the previous embodiment, the electronic device 900 may include a display assembly 902, which includes a touch-sensitive layer 912 designed to receive touch input, a display layer 914 designed to present visual information, and a force-sensitive layer 916 designed to detect the magnitude of the force applied to or acting on the display layer 914 by applying force to at least one of the touch-sensitive layer 912, the display layer 204, and the protective cover 904 covering the display assembly 902. The display assembly 902 may also include a plate 918 fixed to the force-sensitive layer 916. As shown, the plate 918 is located below the force-sensitive layer 916. However, in some embodiments (not shown), the plate 918 is positioned between the display layer 914 and the force-sensitive layer 916.

[0113] Plate 918 may comprise a rigid material, such as metal or plastic. Plate 918 may provide structural support and rigidity to display assembly 902. Thus, when electronic device 900 is dropped, plate 918 may shield display assembly 902 from impacts caused by another component (not shown) in electronic device 900. Additionally, plate 918 may prevent the layers of display assembly 902 from bending, which in turn may prevent the layers from overcoming adhesion and peeling off from each other.

[0114] In some embodiments, the electronic device includes a flexible circuit coupled to a touch input layer. In order to limit the movement of the flexible circuit, an adhesive is applied to a support element (embedded in a frame) to adhere the flexible circuit to the support element. However, adhesives are known to shrink when cured. The shrinking effect of the adhesive provides a tensile force to the flexible circuit, which in turn causes other components to be subjected to undesirable tensile forces, which can change the position of some components or even damage some components.

[0115] Generally speaking, the amount of shrinkage of an adhesive (from an uncured state to a cured state) depends on the amount of adhesive used. To reduce the tension caused by shrinkage, the electronic device can be modified to limit the amount of adhesive required. For example, Fig.14 The electronic device 900 is shown having a board 928 positioned on a flexible circuit 922 (similar to Figure 5 The board 928 can be positioned between the support element 958 and the adhesive 930 disposed on the support element 958. The board 928 can include a metal plate that is used as a spacer that can be fixed to the flexible circuit 922. The board 928 can occupy the space between the flexible circuit 922 and the support element 958 that would otherwise be occupied by the adhesive 930. In this way, the amount of adhesive 930 used can be reduced, and therefore the shrinkage effect of the adhesive 930 can also be reduced. In addition, the board 928 is designed and positioned to absorb some of the forces that would otherwise affect the display assembly 902. Therefore, when the display assembly 902 is turned on and is presenting visual information, the board 928 can limit or prevent visual problems, such as display artifacts.

[0116] Similar to the previous embodiments, the display layer 914 extends beyond the force-sensitive layer 916 and includes a curved portion. Fig.14 As shown, the display layer 914 may include a first material 932 covering the surface of the display layer 914. The first material 932 may include a potting material that protects the display layer 914 and specifically protects the curved region of the display layer 914 from external forces. To provide the first material, a needle (not shown) may be inserted into a position within the curved region of the display layer 914. The needle may disperse the material when it is pulled out of the electronic device 900.

[0117] The display layer 914 may also include a second material 934 covering the surface of the display layer 914, the second material including a plurality of metal traces (not shown). The second material 934 is designed to provide a compressive force to the metal traces and prevent a tensile force from acting on the metal traces, thereby preventing the metal traces from being damaged. In addition, the second material 934 may provide rigidity and structural support for the display layer 914.

[0118] Fig.15A plan view of an embodiment of an electronic device 1000 according to some of the described embodiments is shown, showing a board 1018 positioned in a housing 1010 of the electronic device 1000. For purposes of illustration, several features including a transparent cover and a display assembly have been removed. The electronic device 1000, the housing 1010, and the board 1018 may include any of the features described herein for the electronic device, the housing, and the board, respectively. The board 1018 is designed for use with a display assembly (now shown). In this regard, the board 1018 may include the previously described features of the board 918 ( Fig.14 Any feature described in (shown in).

[0119] The plate 1018 may include a recess 1020 designed to receive a portion of a display assembly. For example, the recess 1020 may receive a display assembly (similar to the recess 1020 in FIG. Figure 5 ) and / or a flexible circuit associated with the display assembly (such as in Figure 5 In other words, the bend area associated with the display assembly can bend around the plate 1018 along the flat edge 1022 of the plate 1018 and avoid contacting the housing 1010. Therefore, the notch 1020 can be referred to as a cut-away area of ​​the plate 1018.

[0120] In addition, the board 1018 may include extensions, such as a first extension 1024 and a second extension 1026. As shown, the first extension 1024 and the second extension 1026 extend beyond the flat edge 1028 of the board 1018. The display assembly (not shown) may include a bend region and a flexible circuit that bends around the flat edge 1028 in the manner previously described and may be positioned between the first extension 1024 and the second extension 1026. The first extension 1024 and the second extension 1026 extend the board 1018 in the y-dimension. In this way, an external force having a force component in the y-dimension applied to the electronic device 1000 may cause the board 1018 (and the display assembly carried by the board 1018) to shift relative to the housing 1010 in the y-dimension. However, the first extension 1024 and the second extension 1026 are designed to engage the side wall member 1014 of the housing 1010 (similar to the side wall member 1014 of the housing 1010) before the bend region and / or the flexible circuit of the display assembly engage the housing 1010. Figure 1 The second side wall member 114 is shown. Thus, the display assembly can be prevented from being damaged and / or the electrical connection from being disconnected.

[0121] Fig.16 Shows Fig.151000, further illustrating a first extension 1024 of the plate 1018 that is secured to the display assembly 1002. As shown, the display assembly 1002 can be bent around the plate 1018. In addition, the plate 1018 can extend laterally in the y dimension beyond the display assembly 1002 and the frame 1054 that secures the protective cover 1004 above the display assembly 1002. Thus, the first extension 1024 and the second extension 1026 ( Fig.15 ) can be combined to provide a buffer for the display assembly 1002 to resist the force applied to the display assembly 1002, which causes the display assembly to move toward the housing 1010 ( Fig.15 The side wall member 1014 (indicated in FIG. 1 ) moves. The frame 1054, the protective cover 1004, and the display assembly 1002 may include any of the features previously described for the frame, the protective cover, and the display assembly, respectively.

[0122] Fig.17 A cross-sectional view of an embodiment of an electronic device 1100 according to some of the described embodiments is shown, showing that the electronic device 1100 has a housing 1110 and a support structure 1120 formed integrally with the housing 1110. For simplicity, some features and components of the electronic device 1100 are not shown. However, the electronic device 1100 and the housing 1110 may include any features described herein for the electronic device and the housing, respectively. Unlike previous embodiments in which the electronic device has a frame fixed to the housing, the support structure 1120 may be part of the housing 1110. In some embodiments, the housing 1110 is formed of a metal, such as aluminum or an alloy containing aluminum. Fig.17 In the illustrated embodiment, the housing 1110 is formed of ceramic. The ceramic material can provide a strong housing while also minimizing the effects of RF interference on an antenna assembly (not shown) of the electronic device 1100.

[0123] The support structure 1120 can receive and support the protective cover 1104 (similar to Figure 1 104). In addition, the support structure 1120 may include a notch 1156 designed to receive a curved area of ​​the display assembly 1102 and / or a curved area of ​​the flexible circuit 1112 used with the display assembly 1102. The notch 1156 may extend circumferentially around the display assembly 1102. Thus, the notch 1156 may be integrated into the housing 1110. This may reduce associated costs and manufacturing time associated with the use of a frame.

[0124] Fig.18A plan view of an embodiment of a protective cover 1204 according to some of the described embodiments is shown. The protective cover 1204 may include any of the features described herein for the protective cover and / or protective layer. Thus, the protective cover 1204 may include a transparent material such as glass, sapphire, plastic, etc. In this regard, the protective cover 1204 is designed to cover a display assembly (not shown). The protective cover 1204 may include a base portion and a recess (shown below) partially defined by a dashed line 1206.

[0125] Fig.19 Shown in Fig.18 , taken along line BB of the protective cover 1204 shown in , which further illustrates a recess 1208 formed in the protective cover 1204. The recess 1208 can define a cavity that extends partially into the material forming the protective cover 1204. In this way, the recess can receive or at least partially receive the display assembly. This will be further described below. In addition, the protective cover 1204 may include a base portion 1212 extending around the recess 1208.

[0126] Fig. 20 A cross-sectional view of an embodiment of an electronic device 1200 is shown according to some of the described embodiments, showing a protective cover 1204 (in Fig.18 and Fig.19 1204) is fixed with housing 1210. For simplicity, some features and components of electronic device 1200 are not shown. However, electronic device 1200 may include any features described herein for electronic devices. As shown, electronic device 1200 may include display assembly 1202 fixed to protective cover 1204 and positioned in recess 1208. Display assembly 1202 may be partially fitted into recess 1208, or may be fully fitted into recess 1208, depending on the desired configuration. By fitting display assembly 1202 into recess 1208 of protective cover 1204, protective cover 1204 may enhance the protection provided to display assembly 1202 by covering multiple dimensions of display assembly 1202. Therefore, before display assembly 1202 is subjected to any impact, the impact force applied to electronic device 1200 may be absorbed or at least partially absorbed by protective cover 1204. In addition, by modifying the protective cover 1204, design modifications to other components may be limited, thereby reducing manufacturing and engineering costs. In addition, the frame 1254 may not require a notch (such as Figure 5 The recess 156 shown in FIG. 1204 may also be provided to the protective cover 1204 and may therefore provide additional support to the protective cover 1204.

[0127] Fig.21A cross-sectional view of an embodiment of an electronic device 1300 according to some of the described embodiments is shown, which shows that the protective cover 1304 extends above the frame 1354 and is positioned adjacent to the sidewall member 1314. The electronic device 1300, the sidewall member 1314, and the frame 1354 may include any of the features described herein for the electronic device, the sidewall member, and the frame, respectively. As shown, the frame 1354 may be modified and reduced in size to allow the protective cover 1304 to extend above the frame 1354 and interface with the sidewall member 1314. This allows the protective cover 1204 and specifically the bent portion 1306 of the protective cover 1304 to receive direct protection from the sidewall member 1314, which is opposite to the frame 1354 extending between the sidewall member 1314 and the protective cover 1304 (as shown in other embodiments). In addition, the protective cover 1304 may define an extended protective cover having a relatively large length in the y dimension. This can allow the display assembly 1302 of the electronic device 1300 to be modified to also increase the size in the y dimension. Alternatively or in combination, the extended length of the protective cover 1304 and the display assembly 1302 can facilitate achieving a display assembly that is symmetrical in appearance, which can also allow the display frame (not shown) that partially covers the display assembly that is symmetrical in appearance to be modified. By providing a symmetrical display assembly, the overall appearance of the electronic device 1300 can be enhanced.

[0128] Fig. 22 An exploded view of a battery assembly 160 according to some of the described embodiments is shown. As shown, the battery assembly 160 may include a first covering element 1402 and a second covering element 1404, wherein the first covering element 1402 is sealed together with the second covering element 1404 to form a housing that shields the internal components of the battery assembly 160. The housing formed by the first covering element 1402 and the second covering element 1404 may define a cavity for receiving and enclosing the internal components. For example, the battery assembly 160 may also include a first electrode 1406 and a second electrode 1408 separated from the first electrode 1406 (such that each of the first electrode 1406 and the second electrode 1408 includes a single electrode), wherein the separator 1410 provides a certain physical isolation between the first electrode 1406 and the second electrode 1408, while also allowing charge to flow between the first electrode 1406 and the second electrode 1408. As is generally known in the battery art, one of the first electrode 1406 and the second electrode 1408 comprises an anode, and the remaining electrode (of the first electrode 1406 and the second electrode 1408) comprises a cathode. In addition, as is generally known, the electrodes can be used to convert chemical energy into electricity for powering electronic devices (such as in Figure 11412 and components of the circuit board 1412 may be connected to the circuit board assembly 170 ( Figure 4 ) are electrically connected.

[0129] In addition, the first cover element 1402 can form a channel 164 in the z dimension that provides additional space for components (not shown) such as a flexible circuit. In other words, the size (such as height) of the battery assembly 160 is reduced in a position corresponding to the channel 164, while still providing sufficient space for the circuit board 1412 to be positioned below the channel 164. In this way, components can be positioned across the channel 164, thereby allowing the electronic device 100 ( Figure 1 ) in order to create additional space for the battery assembly 160. Thus, the battery assembly 160 may include a large size corresponding to a larger charge capacity. Although the first covering element 1402 and the second covering element 1404 may provide a shielding cover including an electrical shielding cover, the aforementioned covering elements may allow some electrical connections. For example, the first covering element 1402 may include an opening 1414 near the circuit board 1412. In addition, although not shown in the figures, the first covering element 1402 and / or the second covering element 1404 may include additional openings to allow one or more additional components to be electrically coupled to the battery assembly 160. Although conventional battery electrodes include a generally rectilinear shape, the electrodes in the battery assembly 160 and the battery assemblies described herein may include different shapes. For example, as Fig. 22 As shown, the first electrode 1406 and the second electrode 1408 include an "L-shaped configuration" where at least one surface includes six different sides. This will be discussed further below.

[0130] Fig.23 For Fig. 22 . As shown, the first electrode 1406 includes an L-shaped configuration. In this regard, the first electrode 1406 may include a first portion 1420 or a first rectangular portion, and a second portion 1422 or a second rectangular portion extending from the first portion 1420. The dashed line represents the interface region between the first portion 1420 and the second portion 1422. In some embodiments (not shown), the first portion 1420 has the same or substantially similar dimensions as the second portion 1422. However, in Fig.23 In the illustrated embodiment, the dimensions of the first portion 1420 are greater than the dimensions of the second portion 1422 .

[0131] The first electrode 1406 may also be characterized as including a first wall 1434 having a first dimension 1444 and a second wall 1436 having a second dimension 1446. As shown, the first wall 1434 is parallel or at least substantially parallel relative to the second wall 1436, and the second dimension 1446 is smaller than the first dimension 1444. In addition, the first electrode 1406 may include a third wall 1438 having a third dimension 1448 (separating the first wall 1434 from the second wall 1436), and a fourth wall 1440 having a fourth dimension 1450. As shown, the third wall 1438 is parallel or at least substantially parallel relative to the fourth wall 1440, and the fourth dimension 1450 is smaller than the third dimension 1448. In addition, the first electrode 1406 may include a fifth wall 1442 that is parallel or at least substantially parallel relative to the third wall 1438. The fifth wall 1442 may include a fifth dimension 1452 that is smaller than the third dimension 1448. Fig.23 1448. In addition, the third wall 1438 is perpendicular or at least substantially perpendicular to the first wall 1434 and the second wall 1436. In some embodiments (not shown), the first dimension 1444 is the same as the second dimension 1446. In addition, in some embodiments (not shown), the first dimension 1444 is smaller than the second dimension 1446. In addition, it should be noted that the second electrode 1408 ( Fig. 22 ) and is included in the battery assembly 160 ( Fig. 22 Any one or more additional electrodes and one or more separators in the embodiment shown in FIG. 1404 may include a size and shape that is the same as or substantially similar to the size and shape of the first electrode 1406.

[0132] Fig.24 A plan view of an alternative embodiment of an electrode 1506 suitable for use in a battery assembly according to some of the described embodiments is shown. As shown, the electrode 1506 may include a "C-shaped configuration." In this regard, the electrode 1506 may include a first portion 1520 or a first rectangular portion. The electrode 1506 may also include a second portion 1522 or a second rectangular portion, and a third portion 1524 or a third rectangular portion, both of which extend vertically or substantially vertically relative to the first portion 1520. The dotted lines represent the boundary areas between the first portion 1520 and the second portion 1522 and between the first portion 1520 and the third portion 1524. In some embodiments (not shown), the size of the first portion 1520 is the same or substantially similar to that of the second portion 1522 and the third portion 1524. However, in Fig.24In the embodiment shown, the size of the first portion 1520 is larger than the size of the second portion 1522 and also larger than the size of the third portion 1524. Fig.24 As shown, the size of the second portion 1522 is the same or substantially similar to the size of the third portion 1524. However, in some embodiments (not shown), the size of the second portion 1522 can be different from the size of the third portion 1524. For example, the size of the second portion 1522 can be larger or smaller than the size of the third portion 1524.

[0133] The electrode 1506 may also be characterized as including a first wall 1534 having a first dimension 1544 and a second wall 1536 having a second dimension 1546. As shown, the first wall 1534 is parallel or at least substantially parallel relative to the second wall 1536, and the second dimension 1546 includes a length that is the same as or at least substantially similar to the length of the first dimension 1544. In addition, the electrode 1506 may include a third wall 1538 having a third dimension 1548 (separating the first wall 1534 from the second wall 1536), a fourth wall 1540 having a fourth dimension 1550, and a fifth wall 1542 having a fifth dimension 1552. As shown, the third wall 1538 is parallel or at least substantially parallel relative to the fourth wall 1540 and the fifth wall 1542. In addition, each of the fourth dimension 1550 and the fifth dimension 1552 is smaller than the third dimension 1548. In addition, the third wall 1538 is perpendicular or at least substantially perpendicular relative to the first wall 1534 and the second wall 1536. As shown in FIG. Fig.24 As shown, the first dimension 1544 is the same as the second dimension 1546. However, the first dimension 1544 may be different from the second dimension 1546, such as being smaller or larger than the second dimension. In addition, the electrode 1506 may include a sixth wall 1562 that is parallel or at least substantially parallel relative to the third wall 1538. The sixth wall 1562 may include a sixth dimension 1572 that is smaller than the third dimension 1548. Fig.24 As shown, fourth dimension 1550, fifth dimension 1552, and sixth dimension 1572 may be combined to equal third dimension 1548. Additionally, it should be noted that any one or more additional electrodes and one or more separators included in a battery assembly (not shown) may include sizes and shapes that are the same or substantially similar to the sizes and shapes of electrode 1506.

[0134] Fig.25A plan view of an alternative embodiment of an electrode 1606 suitable for use in a battery assembly according to some of the embodiments described is shown. As shown, the electrode 1606 may include an "I-shaped configuration". In this regard, the electrode 1606 may include a first portion 1620 or a first rectangular portion, a second portion 1622 or a second rectangular portion, and a third portion 1624 or a third rectangular portion. The dotted line represents the interface region between the first portion 1620 and the second portion 1622 and between the first portion 1620 and the third portion 1624. As shown, both the second portion 1622 and the third portion 1624 extend perpendicularly or substantially perpendicularly to the first portion 1620. Similar to a shape similar to the letter "I", the first portion 1620 may be centered or substantially centered relative to the second portion 1622 and the third portion 1624. As shown, the size of the first portion 1620 is the same or substantially similar to the second portion 1622 and the third portion 1624. However, in some embodiments (not shown), the size of the first portion 1620 is different from the size of the second portion 1622 and also different from the size of the third portion 1624. Fig.25 As shown, the size of the second portion 1622 is the same or substantially similar to the size of the third portion 1624. However, in some embodiments (not shown), the size of the second portion 1622 can be different from the size of the third portion 1624. For example, the size of the second portion 1622 can be larger or smaller than the size of the third portion 1624. Additionally, in some embodiments, the third portion 1624 is removed from the electrode 1606 so that the electrode 1606 includes a "T-shaped configuration."

[0135] The electrode 1606 may also be characterized as including a first wall 1634 having a first dimension 1644 and a second wall 1636 having a second dimension 1646. As shown, the first wall 1634 is parallel or at least substantially parallel relative to the second wall 1636, and the second dimension 1646 includes a length that is the same as or at least substantially similar to the length of the first dimension 1644. Additionally, the electrode 1606 may include a third wall 1638 having a third dimension 1648. The third wall 1638 may be perpendicular or at least substantially perpendicular relative to the first wall 1634 and the second wall 1636, and the third dimension 1648 includes a length that is the same as or at least substantially similar to the length of the first dimension 1644 and the second dimension 1646.

[0136] The electrode 1606 may also be characterized as having a first portion 1620 that is aligned with and symmetrically disposed about a first longitudinal axis 1652 extending through the first portion 1620. The term "longitudinal" as used throughout the detailed description and in the claims refers to a direction extending along the major axis of a component, wherein the "major" dimension corresponds to the largest (longest) dimension of a portion of the electrode. The electrode 1606 may also include a second portion 1622 and a third portion 1624 that are aligned with and symmetrically disposed about a second longitudinal axis 1654 and a third longitudinal axis 1656, respectively. The second longitudinal axis 1654 may be aligned parallel to the third longitudinal axis 1656. In addition, the first longitudinal axis 1652 may be perpendicular to the second longitudinal axis 1654 and the third longitudinal axis 1656. In addition, it should be noted that any one or more additional electrodes and one or more separators included in a battery assembly (not shown) may include sizes and shapes that are the same or substantially similar to the sizes and shapes of the electrode 1606.

[0137] Fig.26 1706 is a plan view of an alternative embodiment of an electrode 1706 suitable for use in a battery assembly according to some of the described embodiments. As shown, the electrode 1706 may include an "L-shaped configuration" similar to the first electrode 1406 ( Fig.23 In this regard, the electrode 1706 may include a first portion 1720 or a first rectangular portion and a second portion 1722 or a second rectangular portion extending perpendicularly from the first portion 1720. The dashed line represents the interface region between the first portion 1720 and the second portion 1722. In some embodiments (not shown), the first portion 1720 is the same or substantially similar in size to the second portion 1722. However, in Fig.26 In the illustrated embodiment, the size of the first portion 1720 is greater than the size of the second portion 1722. In addition, the electrode 1706 may also include an opening 1730 that defines a void or space in the electrode 1706. The opening 1730 may allow a battery assembly (not shown) that includes the electrode 1706 and other electrodes having a similar size and shape to the electrode 1706 to position a component (not shown) at a position corresponding to the opening 1730. In this way, when the opening of the electrode and the opening of the separator are aligned with each other to form a continuous through hole through the electrode layer and the separator layer of the battery assembly, the battery assembly can accommodate the component through the opening 1730. This will be discussed further below. In addition, although the opening 1730 is shown as being located in the electrode 1706, other embodiments such as in Figure 23-25 The embodiments of the electrodes shown in may also include openings.

[0138] exist Figure 23-26 The various embodiments of the electrodes shown and described in the drawings may be formed by a cutting operation including die cutting. The die cutting operation may include subjecting the electrode sheet to a cutting operation using a die having a predetermined size and shape. The die may include the same Figure 23-26 The size and shape of the electrode shown in FIG. 1 corresponds to the size and shape of the electrode shown in FIG. It should be noted that the separator can be die-cut in a similar manner. Therefore, the shape of the electrode described herein can include shapes other than a rectangular shape. In this regard, the battery assembly can include a size and shape based on the size and shape of the electrode and the separator, so that the battery assembly can be of various sizes and shapes to increase the size of the battery assembly and / or accommodate other internal components in the electronic device.

[0139] Figure 27-29 Various embodiments of battery assemblies suitable for use with the electronic devices described herein are shown. Figure 27-29 Some components of the electronic device shown in FIG. The die cutting operation (described above) used to form the electrodes for use in the battery assembly described herein can be cut into various sizes and shapes. In this regard, the battery assembly can be of different sizes and shapes. In addition, in Figure 27-29 The electronic device and battery assembly shown in the may include any one or more components and one or more features previously described for the electronic device. In addition, although a specific number of embodiments of the battery assembly are shown, several other configurations are possible.

[0140] Fig. 27 An embodiment of a battery assembly 1860 located in an electronic device 1800 according to some of the embodiments is shown, wherein the battery assembly 1860 has a shape that accommodates an internal component 1870 of the electronic device 1800. As shown, the battery assembly 1860 may include a C-shaped configuration to accommodate an internal component 1870 that may include a circuit board assembly (previously described). The term "accommodate" may refer to modifying the size and shape of a component (such as the battery assembly 1860) in order to avoid or reduce modifying the size, shape and / or position of another component (such as the internal component 1870) in the electronic device 1800. For example, the battery assembly shown and described herein can accommodate another one or more components by providing space that would otherwise be occupied by a traditional linear battery. In addition, any one or more electrodes and one or more separators of the battery assembly 1860 also include a C-shaped configuration having a shape similar to the shape of the electrode 1506 (shown in Figure 24). Therefore, the battery assembly 1860 may include a housing including a C-shaped configuration defined by one or more covering elements.

[0141] Fig.28An alternative embodiment of a battery assembly 1960 located in an electronic device 1900 according to some of the described embodiments is shown, the battery assembly 1960 having a shape to accommodate multiple internal components of the electronic device 1900. As shown, the battery assembly 1960 may include an "I-shaped" configuration to accommodate a first internal component 1970 and a second internal component 1972. Each of the first internal component 1970 and the second internal component 1972 may represent a component such as a circuit board, an audio module, a flexible circuit, or the like. Fig.28 Also shown are first inner member 1970 and second inner member 1972 positioned in different spaces between the extensions of battery assembly 1960. In addition, any one or more electrodes and one or more separators of battery assembly 1960 also include an I-shaped configuration having a shape similar to that of electrode 1606 (e.g., Fig.25 Thus, the battery assembly 1960 may include a housing including an I-shaped configuration defined by one or more covering elements.

[0142] Fig.29 An alternative embodiment of a battery assembly 2060 located in an electronic device 2000 according to some of the described embodiments is shown, wherein the battery assembly 2060 has an opening 2062 for accommodating an internal component 2072 of the electronic device 2000. As shown, the opening 2062 may include a size and shape such that the internal component 2072 may be positioned using the perimeter of the opening 2062. Although the opening 2062 includes a generally circular opening, the opening 2062 may have other shapes, including, as non-limiting examples, a three-sided shape and a four-sided shape. In addition, as shown in FIG. Fig.29 As shown, the battery assembly 2060 may include an L-shaped configuration (although other aforementioned shapes are also possible) to accommodate the internal component 2070 (which may include a circuit board assembly), and may also include an opening 2062. The L-shaped configuration of the battery assembly 2060 allows the internal component 2070 to be at least partially positioned between the edges of the battery assembly 2060, such as the first edge 2064 and the second edge 2066. In addition, the battery assembly including the L-shaped configuration and the opening (similar to the opening 2062) may include electrodes and separators that are aligned with each other and have a contact with the electrode 1706 ( Fig.26 In other words, any one or more electrodes and one or more separators of the battery assembly 2060 also include an L-shaped configuration having a shape similar to that of the electrode 1706 ( Fig.26 Thus, the battery assembly 2060 may include a housing including an L-shaped configuration and an opening defined by one or more covering elements.

[0143] In addition to having a variety of sizes and shapes (other than traditional rectilinear shapes), the battery assemblies described herein may include additional features. Fig.30 An alternative embodiment of a battery assembly 2160 in an electronic device 2100 is shown, wherein the battery assembly 2160 is positioned in a housing 2102 (of the electronic device 2100) above a first interior component 2172 (shown in phantom) of the electronic device 2100, in accordance with some of the described embodiments. Figure 5 Due to the additional space provided by the battery assembly 2160 (shown in Figure 21), the battery assembly 2160 can cover or overlie some components, such as the first inner component 2172. In addition, in order to accommodate the circuit board assembly 2170 within the housing 2102, the battery assembly 2160 can include an L-shaped configuration. In this way, the battery assembly 2160 provides a location to accommodate a portion of the circuit board assembly 2170 (also including an L-shaped configuration, as shown herein), while the original linear battery may not accommodate the circuit board assembly 2170. Fig.30 As shown, the circuit board assembly 2170 can be "matched" with the battery assembly 2160 similar to a puzzle piece. In addition, the battery assembly 2160 can also include a channel 2162 that defines the battery assembly 2160 of reduced size. In this way, the electronic device 2100 can include a flexible circuit 2164 that passes over the battery assembly 2160 along the channel 2162 and is electrically coupled to the circuit board assembly 2170 and a second internal component 2174 that can include an operating component (such as an audio module as a non-limiting example) so that the second internal component 2174 is electrically connected to the circuit board assembly 2170. Although the flexible circuit 2164 is described as being electrically coupled to the second internal component 2174, the flexible circuit 2164 can also be electrically coupled to a third internal component (not shown) such as an antenna. In either of the above situations, the channel 2162 formed in the battery assembly 2160 allows the various internal components to be rearranged. Additionally, the battery assembly 2160 may include increased dimensions corresponding to the increased electrical storage capacity because the battery assembly 2160 may be positioned above the first inner component 2172 .

[0144] Fig.31 Shown in Fig.30 The electronic device 2100 shown in FIG. Fig.30 21. The battery assembly 2160 may pass over the first internal component 2172 due in part to the die cutting operation of the electrodes and separators (described above). Fig.31As shown, a portion of the battery assembly 2160 can be placed flat on the housing 2102, while another portion of the battery assembly 2160 covers the first internal component 2172. In other words, the battery assembly 2160 can be raised above the first internal component 2172 and also at least partially conform to the size and shape of the first internal component 2172. In addition, the electrode can also pass over the first internal component 2172. For example, the battery assembly 2160 includes a first electrode 2182 and a second electrode 2184, wherein the separator 2186 is positioned between the first electrode 2182 and the second electrode 2184. As shown in FIG. Fig.31 As shown, the first electrode 2182, the second electrode 2184, and the separator 2186 can pass over the first internal component 2172. In addition, the die cutting operation can form the first electrode 2182 and the second electrode 2184 so that the electrodes terminate before entering the battery assembly 2160 at a location corresponding to the channel 2162, thereby allowing the channel 2162 to reduce the size of the battery assembly 2160 to receive the flexible circuit 2164. Although not shown in the figure, the channel 2162 may include a size and shape for receiving two or more flexible circuits to facilitate the connection of additional internal components (not shown) with the circuit board assembly 2170 ( Fig.30 Thus, the flexible circuit 2164 (or an additional flexible circuit) does not need to be positioned around the perimeter of the battery assembly 2160.

[0145] Fig.32 According to some of the described embodiments, Figure 4 . As shown, the circuit board assembly 170 may include a first circuit board 172 and a second circuit board 174. In some embodiments, each of the first circuit board 172 and the second circuit board 174 includes a printed circuit board. In addition, the first circuit board 172 can be fixed together with the second circuit board 174 in a stacked configuration and positioned above the second circuit board. Fig.32 As shown, the first circuit board 172 includes a size and shape that is the same as or at least partially similar to the size and shape of the second circuit board 174. However, in some embodiments (not shown), the first circuit board 172 includes at least some differences in size and / or shape compared to the second circuit board 174. Although the stacked configuration of the circuit board assembly 170 increases the size and shape of the circuit board assembly 170 in the electronic device 100 ( Figure 1 The stacked configuration reduces the footprint of the circuit board assembly 170 in the x and y dimensions. The additional space provided by stacking the aforementioned circuit boards can be used in the electronic device 100 for other components such as the battery assembly 160 (in Figure 4 In addition, by reducing the display assembly 102 ( Figure 5The additional space provided by the reduced size of display assembly 102 (shown in FIG. 1 ) provides room for circuit board assembly 170. In other words, the additional space in the z-dimension, enabled in part by the reduced size of display assembly 102, allows for a stacked configuration of circuit board assembly 170. Although not shown in the figures, circuit board assembly 170 may include three or more circuit boards in a stacked configuration and in electrical communication with each other.

[0146] The first circuit board 172 and / or the second circuit board 174 may include a number of operating components. An "operating component" may refer to a component, such as an integrated circuit or a processor circuit, that performs one or more operations, such as executing instructions from a software application stored on a memory circuit. An operating component may also be referred to as a transistor. An operating component located on either the first circuit board 172 and / or the second circuit board 174 may convert electrical energy into thermal energy during operation. However, a heat distribution assembly (not shown) is designed to remove thermal energy from the circuit board assembly 170. This will be discussed below. Fig.32 As shown, the circuit board may include operating components located on multiple surfaces. For example, the first circuit board 172 may include a first mounting surface 2202 and a second mounting surface 2204 opposite to the first mounting surface 2202, wherein the first mounting surface 2202 has a first operating component 2212 and the second mounting surface 2204 has a second operating component 2214 (as shown in dashed lines). Fig.32 As shown, the first mounting surface 2202 and the second mounting surface 2204 may include additional operating components. In addition, it should be noted that the operating components on the first circuit board 172 may be in electrical communication with each other. The communication device may include, for example, at least one through hole (not shown) extending through the first circuit board 172.

[0147] The second circuit board 174 can include a first mounting surface 2206 that includes a number of operating components such as operating components 2216. The second circuit board 174 also includes a second mounting surface 2208 opposite the first mounting surface 2206. In some embodiments, the second mounting surface 2208 includes one or more operating components that are electrically connected to the operating components located on the first mounting surface 2206. In addition, it should be noted that when the circuit board assembly 170 is assembled, the second circuit board 174 is overlaid (or covered) by the first circuit board 172 in a stacked configuration. However, it should be noted that the first circuit board 172 is still separated from the second circuit board 174 by at least a certain gap or space. In addition, when the circuit board assembly 170 is assembled, the first mounting surface 2206 of the second circuit board 174 faces the second mounting surface 2204 of the first circuit board 172, and vice versa.

[0148] The first circuit board 172 can be mechanically connected to the second circuit board 174 by a plurality of rivet nuts connected to rivets. Fig.32 As shown, the second circuit board 174 includes a first self-clinching nut column 2222 designed to be connected to a first rivet 2224 located on the first circuit board 172 . Fig.19 Each of the remaining self-clinching nut standoffs (not shown) may be connected to Fig.32 The standoffs are designed to not only provide a mechanical connection, but also maintain a desired distance between the first circuit board 172 and the second circuit board 174 so that components on the second mounting surface 2204 of the first circuit board 172 do not (physically) interfere with components on the first mounting surface 2206 of the second circuit board 174, and vice versa. Additionally, the positioning of the standoffs and rivets can be reversed so that the first circuit board 172 includes the standoffs and the second circuit board 174 includes the rivets.

[0149] In order to electrically couple the first circuit board 172 to the second circuit board 174, a number of interposers may be used to route electrical signals between the first circuit board 172 and the second circuit board 174. Fig.32 As shown, the second circuit board 174 may include a number of interposers, such as interposer 2232, which is electrically coupled to the second circuit board 174 by, for example, a soldering operation. Several additional interposers (not shown) are shown. In addition, although not shown in the figure, the second circuit board 174 may include a number of metal traces that electrically couple the interposer to one or more operating components on the second circuit board 174. In addition, when the first circuit board 172 is electrically coupled to the second circuit board 174, each of the interposers may be electrically coupled to one or more metal traces (not shown) on the second mounting surface 2204 of the first circuit board 172.

[0150] The circuit board assembly 170 may include a number of shielding elements that shield components of the circuit board assembly 170 from electromagnetic interference ("EMI"). For example, the circuit board assembly 170 may include a first shielding element 2242 that covers components positioned on the first mounting surface 2202 of the first circuit board 172. The first shielding element 2242 may include a metal-based material designed to provide an EMI shielding cover for components on the first mounting surface 2202. The circuit board assembly 170 may also include a second shielding element 2244 that is designed to provide an EMI shielding cover for components located on the second mounting surface 2204 of the first circuit board 172 and on the first mounting surface 2206 of the second circuit board 174. The second shielding element 2244 may include a metal, such as copper or brass. The second shielding element 2244 may be secured to (and between) the first circuit board 172 and the second circuit board 174 via a number of solder joints disposed on each circuit board. For example, Fig.32The second circuit board 174 is shown with first solder joints 2250 positioned around the outer perimeter of the second circuit board 174. Several additional solder joints are shown in addition to the first solder joints 2250, but are not labeled. The first circuit board 172 may also include solder joints (not shown) located at locations corresponding to solder joints on the second circuit board 174. In some embodiments, the second shielding element 2244 includes several discontinuous structural elements. Fig.32 In the illustrated embodiment, the second shielding element 2244 may include a single continuous structural member designed to extend along the outer perimeter of the circuit board assembly 170. Alternatively, the second shielding element 2244 may include several shielding element portions that are combined with each other to form the second shielding element 2244.

[0151] The circuit board assembly 170 may also include a third shielding element 2246 positioned on the second mounting surface 2208 of the second circuit board 174. The third shielding element 2246 is designed to be combined with the first shielding element 2242 and the second shielding element 2244 to provide an EMI shield for the circuit board assembly 170. In addition, the second mounting surface 2208 of the second circuit board 174 may include a metal trace (through the second mounting surface 2208). In this regard, in addition to forming an EMI shield, the third shielding element 2246 may also define at least a portion of the electrical ground path of the circuit board assembly 170 because the third shielding element 2246 is electrically connected to the second mounting surface 2208 via the metal trace. In addition, when one or more components of the circuit board assembly 170 generate EMI during operation, the aforementioned shielding element may enable the electronic device 100 ( Figure 1 Components located externally relative to circuit board assembly 170 (shown in FIG. 1 ) shield EMI generated by one or more components of circuit board assembly 170.

[0152] Fig.33 Shown in Fig.32 , which illustrates various internal components of the circuit board assembly 170. As shown, the first circuit board 172 can be separated from the second circuit board 174 by the standoffs 2226. In addition, in order to mechanically couple the first circuit board 172 to the second circuit board 174, the standoffs 2226 can be mechanically coupled to the rivets 2228, wherein the standoffs 2226 and the rivets 2228 are electrically isolated from the components of the first circuit board 172 and the second circuit board 174.

[0153] The first circuit board 172 may include a through hole 2218 formed of metal to provide an electrical connection between the first operating component 2212 and the second operating component 2214. In addition, the first circuit board 172 may be electrically connected to the second circuit board 174 through an interposer 2234. As shown, the interposer 2234 may be electrically and mechanically connected to a first solder joint 2262 located on the first circuit board 172, and may also be electrically and mechanically connected to a second solder joint 2264 located on the second circuit board 174. In addition to the interposer 2234, several additional interposers (not shown) may also be used to carry signals between the circuit boards. The first circuit board 172 may include a first metal trace 2272 electrically connected to the second operating component 2214 and the through hole 2218, and the second circuit board 174 may include a second metal trace 2274 electrically connected to the third operating component 2220 located on the second circuit board 174. In this way, the third operating component 2220 can be electrically connected to the second operating component 2214 through the interposer 2234 and the metal trace. The third operating component 2220 can be in electrical communication with the first operating component 2212 through the vias 2218, the interposer 2234, and the metal traces. The circuit board assembly 170 can use several additional metal traces, vias, and solder joints to provide additional electrical communication pathways.

[0154] Fig.34 An alternative embodiment of a circuit board assembly 2370 is shown, which shows a circuit board assembly 2370 modified for ingress protection. The circuit board assembly 2370 may include any of the components and features previously described for the circuit board assembly, such as a first circuit board 2372 and a second circuit board 2374. However, as Fig.34 As shown, the circuit board assembly 2370 may include a potting material 2390 embedded in the circuit board assembly 2370 between the first circuit board 2372 and the second circuit board 2374. The potting material 2390 may include a resin that is cured to form a liquid-resistant shield for various operating components of the circuit board assembly 2370, such as the operating component 2314. In this regard, the potting material 2390 may prevent damage to the circuit board assembly 2370 and specifically the components of the circuit board assembly 2370 due to the ingress of liquid. In addition, the potting material 2390 may extend to the first shielding element 2342 and the second shielding element 2344 of the circuit board assembly 2370 to prevent corrosion of components such as the standoff 2326. The potting material 2390 may be used with the circuit assemblies described herein.

[0155] Fig.35An alternative embodiment of a circuit board assembly 2470 according to some of the described embodiments is shown, which shows a circuit board assembly 2470 having a flexible circuit 2402 electrically coupled to a circuit board of the circuit board assembly. The circuit board assembly 2470 may include any of the components and / or features previously described for the circuit board assembly. For example, as shown, the circuit board assembly 2470 may include a first circuit board 2472 and a second circuit board 2474. The circuit board assembly 2470 may also include a first shielding element 2442 disposed above the first circuit board 2472 and at least some of the components. The circuit board assembly 2470 may also include a second shielding element 2444 covering a gap between the first circuit board 2472 and the second circuit board 2474. The circuit board assembly 2470 may also include a third shielding element 2446 disposed above the second circuit board 2474. However, Fig.35 The circuit board assembly 2470 in the embodiment does not use an interposer to achieve electrical connectivity between the first circuit board 2472 and the second circuit board 2474 (and their corresponding components), but instead uses a flexible circuit 2402 to transmit electrical signals between operating components located on the first circuit board 2472 and / or the second circuit board 2474.

[0156] The flexible circuit 2402 can be electrically and mechanically coupled to the first circuit board 2472, and form a loop for electrically and mechanically coupling with the second circuit board 2474. The electrical coupling and mechanical coupling can be performed using a thermocompression welding operation. A thermocouple (not shown) can be used as a "thermocompression head" that is heated to provide thermal energy to the flexible circuit 2402 and welding elements (not shown) on the first circuit board 2472 and the second circuit board 2474, thereby forming an electromechanical connection between the flexible circuit 2402 and the first circuit board 2472 and the second circuit board 2474. It should be noted that multiple thermocompression welding operations can be used to couple the flexible circuit 2402 to the first circuit board 2472 and the second circuit board 2474.

[0157] Fig.36 Shown in Fig.352 is a cross-sectional view of the circuit board assembly 2470 shown in FIG. 2 taken along line DD, which shows a flexible circuit board 2402 extending between the circuit boards. As shown, the flexible circuit 2402 is electromechanically connected to the first solder joint 2412 and the second solder joint 2414 located on the first circuit board 2472 and the second circuit board 2474, respectively. In addition, the first solder joint 2412 can be electrically coupled to the first metal trace 2422 on the first circuit board 2472, and the second solder joint 2414 can be electrically coupled to the second metal trace 2424 on the second circuit board 2474. Therefore, the flexible circuit 2402 can be electrically coupled to a number of operating components (not shown), some of which are electrically coupled to the first metal trace 2422 and located on the first circuit board 2472, and some of which are electrically coupled to the second metal trace 2424 and located on the second circuit board 2474.

[0158] Fig.37 A cross-sectional view of an alternative embodiment of a circuit board assembly 2570 according to some of the described embodiments is shown, which shows that the internal components of the circuit board assembly 2570 have corresponding geometries. The circuit board assembly 2570 may include any of the components and / or features previously described for the circuit board assembly. For example, the circuit board assembly 2570 may include a first circuit board 2572 and a second circuit board 2574, wherein the first circuit board 2572 is in electrical communication with the second circuit board 2574 via an interposer 2520. An additional interposer (not shown) may electrically couple the first circuit board 2572 (and the components thereon) to the second circuit board 2574 (and the components thereon). The first circuit board 2572 may include a first mounting surface 2502 having a first operative component 2512 and a second mounting surface 2504 (opposite the first mounting surface 2502) having a second operative component 2514 electrically coupled to a metal trace (not shown). Additionally, the second circuit board 2574 may include a third operating component 2516 electrically coupled to a metal trace (not labeled), wherein the third operating component 2516 and the metal trace are located on the first mounting surface 2506 of the second circuit board 2574 .

[0159] like Fig.37As shown, the second operating member 2514 and the third operating member 2516 can be in a nested configuration. For example, the third operating member 2516 can include a protrusion 2518 that extends at least partially into the recess 2522 of the second operating member 2514. The corresponding geometry between the second operating member 2514 and the third operating member 2516 can allow for a circuit board assembly 2570 of reduced size (or reduced height), thereby reducing the overall space occupied by the circuit board assembly 2570 in the electronic device (not shown). In other words, because the components of the first circuit board 2572 and the second circuit board 2574 form a corresponding or nested configuration in a manner similar to the nested configuration of the second operating member 2514 and the third operating member 2516, the spacing or gap between the first circuit board 2572 and the second circuit board 2574 can be reduced compared to previous embodiments.

[0160] Additionally, in some cases, components on different circuit boards may be electrically and mechanically coupled to each other in a direct manner. Fig.37 The first circuit board 2572 is also shown to have a fourth operating member 2534 located on the second mounting surface 2504 and a fifth operating member 2536 located on the first mounting surface 2506 of the second circuit board 2574. The fourth operating member 2534 may include a recessed portion 2542 and a connector 2544 positioned in the recessed portion 2542. In addition, the fifth operating member 2536 may include a protrusion 2538 extending into the recessed portion 2542. The protrusion 2538 may include a connector 2554 that is electrically and mechanically coupled to the connector 2544. In this way, the fourth operating member 2534 is electrically and mechanically coupled to the fifth operating member 2536.

[0161] In addition, when the circuit board assembly 2570 includes operating components such as the fourth operating component 2534 and the fifth operating component 2536, the first circuit board 2572 can be electrically coupled to the second circuit board 2574 through the fourth operating component 2534 and the fifth operating component 2536. Therefore, the circuit board assembly 2570 may not require an interposer (such as the interposer 2520) to provide electrical communication between the first circuit board 2572 and the second circuit board 2574. In addition, as Fig.37 As shown, the first circuit board 2572 may include a through hole 2546 electrically coupled to the fourth operating member 2534 and a metal trace (not shown). In this way, the first operating member 2512 can be electrically connected to the fifth operating member 2536 through the metal trace, the through hole 2546 and the fourth operating member 2534. It should be noted that in some embodiments, the circuit board assembly 2570 includes a combination of the second operating member 2514 and the third operating member 2516 and the fourth operating member 2534 and the fifth operating member 2536.

[0162] Fig.38 A cross-sectional view of an alternative embodiment of a circuit board assembly 2670 according to some of the described embodiments is shown, which shows a circuit board assembly 2670 having several solder resist layers for supporting the circuit board. The circuit board assembly 2670 may include any of the components and / or features previously described for the circuit board assembly. For example, the circuit board assembly 2670 may include a first circuit board 2672 and a second circuit board 2674. In addition, each of the first circuit board 2672 and the second circuit board 2674 may include several solder joints (not labeled), wherein the interposer is electrically coupled to the solder joints from the first circuit board 2672 and to the solder joints from the second circuit board 2674. For example, Fig.38 A circuit board assembly 2670 is shown having a first interposer 2602, a second interposer 2604, and a third interposer 2606, wherein the first interposer is electrically and mechanically coupled to solder points (not labeled) on the first circuit board 2672 and the second circuit board 2674, the second interposer is electrically and mechanically coupled to solder points (not labeled) on the first circuit board 2672 and the second circuit board 2674, and the third interposer is electrically and mechanically coupled to solder points (not labeled) on the first circuit board 2672 and the second circuit board 2674.

[0163] In order to prevent the solder joints from oxidizing and / or preventing the formation of solder "bridges" between adjacent solder joints during the soldering operation, the circuit board assembly 2670 may include several solder resist layers. For example, the circuit board assembly 2670 may include a first solder resist layer 2622 located between the first interposer 2602 and the second interposer 2604, and a second solder resist layer 2624 located between the second interposer 2604 and the third interposer 2606. Based on their positions, the first solder resist layer 2622 may prevent the formation of a solder bridge between the first interposer 2602 and the second interposer 2604 (thereby preventing undesirable electrical coupling between the first interposer 2602 and the second interposer 2604), and the second solder resist layer 2624 may prevent the formation of a solder bridge between the second interposer 2604 and the third interposer 2606 (thereby preventing undesirable electrical coupling between the second interposer 2604 and the third interposer 2606). In addition, the first solder resist layer 2622 and the second solder resist layer 2624 may provide a support structure that maintains a desired distance or spacing between the first circuit board 2672 and the second circuit board 2674. In addition, in order to hold the first circuit board 2672 and the second circuit board 2674, both the first circuit board 2672 and the second circuit board 2674 may be clamped to the ends of the first solder resist layer 2622 and the second solder resist layer 2624. The interposer, solder joint, and solder resist layer may represent several additional interposers, solder joints, and solder resist layers, respectively.

[0164] Fig.39An isometric view of an embodiment of an audio module 2700 according to some of the described embodiments is shown. The audio module 2700 may be used to replace the first audio module 182 ( Figure 4 ). The audio module 2700 can be used as a receiver module designed to generate acoustic energy in the form of audible sound. Generally speaking, receiver modules are used in low-power applications associated with relatively low-frequency outputs. However, the audio module 2700 may include modifications to the enhanced audio performance associated with the audio speaker module.

[0165] The audio module 2700 may include an audio module housing 2702 having an audio module opening 2704. The audio module housing 2702 may define an internal acoustic cavity divided into a front cavity and a rear cavity. This will be shown below. The audio module housing 2702 may carry a diaphragm 2706 or a film designed to vibrate to produce acoustic energy in the form of audible sound. Therefore, the diaphragm 2706 may be referred to as a film or an acoustic membrane. The diaphragm 2706 may include additional thickness to process additional vibration energy (associated with the additional power provided to the audio module 2700), and therefore process additional audio frequencies. In addition, the audio module opening 2704 may represent a single unmodified opening in the audio module housing 2702, and any other openings in the audio module housing 2702 (e.g., for wiring and electrical communication) may be air-sealed and liquid-sealed. In this regard, during changes in air pressure in an electronic device (not shown), the diaphragm 2706 may be prevented from being subjected to undesirable vibrations caused by air entering the audio module housing 2702. This will be further described below. Additionally, in some embodiments, diaphragm 2706 comprises a liquid-resistant diaphragm (or liquid-resistant membrane) designed to resist damage due to exposure to liquids, such as water.

[0166] Fig.40 Shows Fig.39 The audio module 2700 shown in FIG. Fig.39 DD in FIG. 2 , which shows several internal features of the audio module 2700. As shown, the audio module 2700 includes a voice coil 2708 and a magnet 2710. The voice coil 2708 is designed to receive an alternating current to form an electromagnet with alternating magnetic polarity. The alternating magnetic polarity can cause the voice coil to vibrate based on the interaction (attraction and repulsion) with the external magnetic field of the magnet 2710.

[0167] The diaphragm 2706 is positioned in the audio module housing 2702 and divides the acoustic cavity (partially defined by the audio module housing 2702) into a front cavity 2720 and a rear cavity 2722. As shown, the front cavity 2720 is accessible to the audio module opening 2704, while the rear cavity 2722 is sealed and isolated from the audio module opening 2704. In addition, when the audio module 2702 is positioned in the electronic device 100 ( Figure 1 ), the audio module housing 2702 can seal and isolate the components of the audio module 2700 from the air in the electronic device 100, such that, for example, the diaphragm 2706 is not acoustically driven or otherwise affected by changes in air pressure in the electronic device 100. As shown, the front cavity 2720 and the rear cavity 2722 can be shielded from changes in pressure in the electronic device 100. However, when the diaphragm 2706 vibrates to form acoustic energy, the acoustic energy leaves the audio module opening 2704. In addition, in some embodiments, the audio module 2700 includes an air port 2730 that allows air to enter the rear cavity 2722 (in a manner such that air enters the audio module opening 2704) and leave the rear cavity 2722 to reach the audio module opening 2704, so that when the air pressure of the external ambient air changes, the rear cavity 2722 can be balanced with the ambient air. In addition, although the audio module 2700 can replace the first audio module 182 ( Figure 4 ), but the audio module 2700 may include a different design and shape, so that the audio module 2700 can also replace the second audio module 184 ( Figure 4 ).

[0168] Fig.41 1 shows a cross-sectional view of the electronic device 100, which shows the audio module 2700 positioned in the electronic device 100. As shown, the audio module 2700 and specifically the audio module opening 2704 and the opening 134 (both in Figure 12724). In addition, the mesh material 2724 may cover the opening 134 and provide an aesthetic finish. In addition, in some embodiments, the audio module 2700 is equipped with a bracket 2726. The bracket 2726 may be fixed to the audio module 2700 by an adhesive 2728, which may include a liquid-resistant adhesive to prevent liquid from entering the electronic device 100 around the bracket 2726. In addition, the bracket 2726 may include a sealing element 2732, which is positioned between the audio module 2700 and the bracket 2726 to form an entry barrier between the audio module 2700 and the bracket 2726. In this way, the audio module 2700 is positioned in the electronic device 100 so that any liquid entering the opening 134 may extend into the front cavity 2720, but not into the rear cavity 2722. In addition, any air entering the opening 134 may extend into both the front cavity 2720 and the rear cavity 2722, wherein the rear cavity uses an air port 2730 to receive air. The air ports 2730 may also allow air to exit the rear cavity 2722. Thus, the audio module 2700 may provide acoustic energy while preventing liquid from entering the electronic device 100. Additionally, the acoustic energy generated by the diaphragm 2706 may exit the audio module 2700 via the audio module opening 2704 and may also exit the electronic device 100 via the opening 134.

[0169] In addition, if Fig.41 As shown, the audio module 2700 can be positioned in the electronic device 100 so that the audio module opening 2704 is only exposed to ambient air (external to the electronic device 100) that enters the electronic device 100 through the opening 134. In other words, the audio module housing 2702 is sealed in a certain manner so that changes in the internal cavity that cause changes in the air pressure in the electronic device 100 by, for example, pressing the first protective layer 104 and the display assembly 102 will not cause air to enter the audio module housing 2702, thereby preventing the diaphragm 2706 from generating undesirable acoustic noise.

[0170] Fig.42 An exploded view of a heat distribution assembly 190 according to some of the described embodiments is shown. The heat distribution assembly 190 may include several material layers that provide not only enhanced heat transfer characteristics but also structural support. The enhanced heat transfer characteristics and structural support may be useful when the heat distribution assembly 190 is used in an electronic device that has a substantially non-metallic exterior and therefore has reduced heat transfer capabilities, such as having a second protective layer 144 (in Figure 2 In this regard, a heat distribution assembly 190 may be used in an electronic device to direct heat energy away from the non-metallic bottom wall toward another structural feature of the electronic device, such as the aforementioned side wall component.

[0171] As shown, the heat distribution assembly 190 may include several material layers. For example, the heat distribution assembly 190 may include a first layer 2802 formed of a first type of material, which may include a durable material such as stainless steel. The first layer 2802 may include a bottom wall 2812, and a first side wall 2822 and a second side wall 2824, both of which extend vertically or at least substantially vertically from the bottom wall 2812. When assembled in the electronic device 100 ( Figure 1 and Figure 2 ), the heat distribution assembly 190 and specifically the first layer 2802 is thermally coupled to one or more heat generating components in the electronic device 100. At least one of the bottom wall 2812, the first side wall 2822, and the second side wall 2824 may include a contact surface that is in direct thermal contact or at least thermally coupled to a heat generating component in the electronic device. This will be shown below.

[0172] The heat distribution assembly 190 may also include a second layer 2804 designed to engage and thermally couple to the first layer 2802. The second layer 2804 may include a bottom wall 2814, and a first side wall 2832 and a second side wall 2834, both of which extend perpendicularly, or at least substantially perpendicularly, from the bottom wall 2814. When the heat distribution assembly 190 has been assembled, the bottom wall 2814, the first side wall 2832, and the second side wall 2834 of the second layer 2804 may respectively engage the bottom wall 2812, the first side wall 2822, and the second side wall 2824 of the first layer 2802. Additionally, the second layer 2804 may be formed of a second type of material, which may include a material having a relatively higher thermal conductivity (compared to the first type of material of the first layer 2802), such as copper or graphite. In this regard, the second layer 2804 is designed to redistribute, redirect, or otherwise propagate thermal energy away from heat generating components (not shown) in the electronic device when the heat generating components are thermally coupled to the heat distribution assembly 190. The second layer 2804 may receive thermal energy from the first layer 2802 when the first layer 2802 receives thermal energy from one or more heat generating components. At least one of the bottom wall 2816, the first side wall 2842, and the second side wall 2844 may include a contact surface that is in direct thermal contact with, or at least thermally coupled to, the second layer 2804.

[0173] In addition, the heat distribution assembly 190 may include a third layer 2806 that combines with the first layer 2802 and enhances the structural support and rigidity of the heat distribution assembly 190. Thus, the third layer 2806 may be formed of a third type of material, which in some cases is the same or similar to the first type of material of the first layer 2802. The third layer 2806 may include a bottom wall 2816, and a first side wall 2842 and a second side wall 2844, both of which extend from the bottom wall 2816 in a vertical or at least substantially vertical manner. When the heat distribution assembly 190 has been assembled, the bottom wall 2816, the first side wall 2842, and the second side wall 2844 of the third layer 2806 may respectively engage the bottom wall 2814, the first side wall 2832, and the second side wall 2834 of the second layer 2804. In addition, when the heat distribution assembly 190 is positioned on the electronic device 100 ( Figure 1 and Figure 2 ), the first side wall 2842 and the second side wall 2844 of the third layer 2806 may be respectively joined and thermally coupled to the third side wall member 116 and the fourth side wall member 118 ( Figure 1 Thus, the heat distribution assembly 190 can be thermally coupled to the belt 110 ( Figure 1 and Figure 2 At least one of the bottom wall 2814, the first side wall 2832, and the second side wall 2834 may include a contact surface that is in direct thermal contact with, or at least thermally coupled to, the first layer 2802.

[0174] Based on the aforementioned material composition of heat distribution assembly 190, second layer 2804 may include heat transfer properties that are different from the heat transfer properties of first layer 2802 and third layer 2806. For example, second layer 2804 may be formed of a material having a relatively higher thermal conductivity than one or more materials forming first layer 2802 and third layer 2806. Additionally, first layer 2802 and third layer 2806 may be formed of a material having a relatively higher durability or stiffness than the material forming second layer 2804.

[0175] In order to assemble the heat distribution assembly 190 with different material combination layers, each layer may undergo a coating operation designed to combine the layers together. The coating operation may include placing each material layer on a separate roller and then pressing the layers together as the layers pass through the roller. The pressing effect can form molecular bonds between the molecules of the metal. It should be noted that the coating operation can be used when the second layer 2804 contains copper. When the second layer 2804 contains graphite, different assembly operations can be used. This will be shown and discussed below. In addition, when the heat distribution assembly 190 is assembled, the first layer 2802 and the third layer 2806 can provide support for the second layer 2804, and can also provide certain structural support for the electronic device (not shown) carrying the heat distribution assembly 190. Although the second layer 2804 is mainly used for heat transfer, the first layer 2802 and the third layer 2806 can also provide at least some heat transfer capabilities. In addition, although the first layer 2802 and the third layer 2806 are mainly used for structural support, the second layer 2804 can also provide at least some structural support.

[0176] Fig.43 Shows Figure 1 A partial cross-sectional view of the electronic device 100 is shown, which shows the heat distribution assembly 190 positioned in the electronic device 100. For illustrative purposes, some components of the electronic device 100 have been removed. As shown, the heat distribution assembly 190 can be in direct thermal contact with or at least thermally coupled to the circuit board assembly 170, so that heat generated from one or more operating components of the circuit board assembly 170 can be transferred from the circuit board assembly 170 to at least some layers of the heat distribution assembly 190. For example, as shown in the first enlarged view 2850, a flow of thermal energy (represented by dashed lines with arrows) or heat flow generated from the operating components of the circuit board assembly 170 can pass through the first layer 2802 to the second layer 2804. As shown, the contact surface (bottom wall 2812, Fig.42 2804) is in thermal contact with the circuit board assembly 170. In addition, due in part to the relatively higher thermal conductivity of the second layer 2804 (compared to the third layer 2806), the thermal energy tends to extend through the first layer 2802 and perpendicularly or at least partially perpendicularly to the first layer 2802, and continue through the second layer 2804 without passing through the third layer 2806. As further shown in the figure, the thermal energy flow is relative to the contact surface of the second layer 2804 (bottom wall 2814, Fig.24 Thus, the relatively low thermal conductivity of the third layer 2806 can prevent the accumulation of thermal energy (also referred to as hot spots) at one or more locations near the second protective layer 144. This will be discussed further below.

[0177] In addition, if Fig.43As shown, the heat distribution assembly 190 can be designed to engage the strip 110. For example, as shown in the second enlarged view 2852, the contact surface of the first side wall 2842 of the third layer 2806 of the heat distribution assembly 190 can engage the third side wall component 116 of the strip 110. Therefore, the third layer 2806 can be in direct thermal contact or at least thermally coupled with the third side wall component 116. The second layer 2804 can distribute or redirect thermal energy to the third layer 2806, and specifically, from the first side wall 2832 of the second layer 2804 to the first side wall 2842 of the third layer 2806, so that the thermal energy is distributed to the third side wall component 116, where the thermal energy can then be dissipated from the third side wall component 116 to the ambient air. The heat distribution assembly 190 may also engage the fourth side wall member 118 of the belt 110 so that the heat distribution assembly 190 may be connected in a similar manner to the third side wall member 116 (i.e., through the side walls of the second layer 2804 and the third layer 2806, Fig.42 144) to distribute the heat to the fourth side wall member 118. Thus, at least one of the side wall members, which serves as a distributed heat sink to prevent the heat generated by the circuit board assembly 170 from being trapped at or near the second protective layer 144, must prevent the formation of hot spots.

[0178] In addition, the heat distribution assembly 190 can prevent or limit the second protective layer 144 from receiving thermal energy generated from the operating components of the circuit board assembly 170 because the third layer 2806 provides the smallest thermal conductivity compared to the second layer 2804, so that the thermal energy in the electronic device 100 is mainly carried by the second layer 2804. In this regard, the second layer 2804 can define a thermal path or a primary thermal path for thermal energy generated by the operating components of the circuit board assembly 170. Although Fig.43 The heat distribution assembly 190 is shown receiving heat from one or more operating components of the circuit board assembly 170, but it should be noted that the heat distribution assembly 190 can receive heat from any heat generating component of the electronic device 100 that is thermally coupled to the heat distribution assembly 190. In addition, the heat distribution assembly 190 can provide a rigid support structure for supporting the second protective layer 144. For example, the first layer 2802 and the third layer 2806 of the heat distribution assembly 190 can extend across the major surface of the second protective layer 144, as shown in FIG. Fig.43 shown.

[0179] Fig.44A side view of an alternative embodiment of a heat distribution assembly 2900 according to some of the described embodiments is shown. The heat distribution assembly 2900 may include any one or more materials and / or one or more features previously described for the heat distribution assembly. The heat distribution assembly 2900 may include a first layer 2902, a second layer 2904 (shown as a dotted line) and a third layer 2906, wherein the second layer 2904 is embedded between the first layer 2902 and the third layer 2906. As shown, the second layer 2904 may be completely covered by the first layer 2902 and the third layer 2906. This prevents the second layer 2904 from moving or shifting relative to the first layer 2902 and / or the third layer 2906. However, it should be noted that the second layer 2904 may still receive heat passing through the first layer 2902 and / or the third layer 2906.

[0180] Fig.45 An isometric view of an alternative embodiment of a heat distribution assembly 3000 according to some of the described embodiments is shown, showing the heat distribution assembly 3000 modified to receive a component 3010. The heat distribution assembly 3000 can include any one or more materials and / or one or more features previously described for heat distribution assemblies. As shown, the heat distribution assembly 3000 can include a first layer 3002, a second layer 3004, and a third layer 3006, wherein the second layer 3004 is embedded between the first layer 3002 and the third layer 3006.

[0181] However, the second layer 3004 can be modified to reduce the size of the heat distribution assembly 3000. For example, a portion of the second layer 3004 can be locally removed at a desired location so that a portion of the heat distribution assembly 3000 includes only the first layer 3002 and the third layer 3006, thereby (locally) reducing the size of the heat distribution assembly 3000 without the second layer 3004. Due to the reduction in size, the heat distribution assembly 3000 can include a first channel 3012 that receives a component 3010. The heat distribution assembly 3000 can also include a second channel 3014 that can receive a second component (not shown). It should be noted that the locations of the first channel 3012 and the second channel 3014 correspond to locations where the second layer 3004 is not present. However, any one or more components fixed together with the heat distribution assembly 3000 at the first channel 3012 and / or the second channel 3014 can be thermally coupled to the second layer 3004 so that thermal energy generated by the one or more components can be pumped from the one or more components to the second layer 3004.

[0182] As non-limiting examples, component 3010 may be secured to heat distribution assembly 3000 by welding, soldering, or adhering (via adhesive). Additionally, the dimensions of first channel 3012 allow component 3010 to be positioned in heat distribution assembly 3000 such that component 3010 is at least coplanar with respect to first layer 3002 and in some cases slightly embedded. It should be noted that the dimensions of second channel 3014 may allow a second component (not shown) to be positioned in heat distribution assembly 3000 such that the second component is at least coplanar with respect to third layer 3006 and in some cases slightly embedded. Additionally, as non-limiting examples, component 3010 may represent one or more components, such as the aforementioned heat generating components, audio modules, brackets, or connectors. Alternatively, component 3010 may include a thermally conductive layer designed to receive (and thereby dissipate) thermal energy from heat distribution assembly 3000.

[0183] Fig.46 An isometric view of an alternative embodiment of a heat distribution assembly 3100 according to some of the described embodiments is shown. The heat distribution assembly 3100 can include any one or more materials and / or one or more features previously described for the heat distribution assembly. As shown, the heat distribution assembly 3100 can include a first layer 3102, a second layer 3104, and a third layer 3106, wherein the second layer 3104 is positioned between the first layer 3102 and the third layer 3106.

[0184] In some embodiments, the second layer 3104 comprises a metal, such as copper. Fig.46 In the illustrated embodiment, the second layer 3104 comprises graphite. In order to combine the second layer 3104 with the first layer 3102 and the third layer 3106, the heat distribution assembly 3100 may undergo a welding operation. For example, as shown in FIG. 46, the heat distribution assembly 3100 includes a plurality of welds, such as a first weld 3112 and a second weld 3114, both of which represent a plurality of welds located between the first layer 3102 and the second layer 3104. In addition, the heat distribution assembly 3100 may include a plurality of welds represented by a third weld 3116 located between the third layer 3106 and the second layer 3104. By welding the second layer 3104 with the first layer 3102 and the third layer 3106, the second layer 3104 may resist shear forces that would otherwise displace the second layer 3104 relative to the first layer 3102 and the third layer 3106, particularly when the second layer 3104 comprises a particulate material such as graphite.

[0185] Fig.47 A flowchart 3200 is shown illustrating a method for forming a display assembly for an electronic device according to some of the described embodiments. The electronic device may include a portable electronic device such as a mobile wireless communication device including a smart phone or a wearable electronic device.

[0186] In step 3202, the display layer is positioned between the touch-sensitive layer and the force-sensitive layer. The touch-sensitive layer is configured to detect touch inputs that control the electronic device. The force-sensitive layer is configured to detect the magnitude of the force applied to the touch-sensitive layer. Each of the display layer, the touch-sensitive layer, and the force-sensitive layer may include an edge region that includes at least one connector. In addition, some edge regions with one or more connectors may be perpendicular to or parallel to other edge regions. For example, the touch-sensitive layer may include an edge region with a connector, and the display layer may include an edge region with a connector, wherein the aforementioned edge regions are parallel or at least substantially parallel to each other. In addition, the touch-sensitive layer may include an edge region that includes a connector. However, the edge region of the force-sensitive layer may be perpendicular or at least substantially perpendicular to the edge region of the display layer and / or the edge region of the touch-sensitive layer.

[0187] In step 3204, the display layer is bent so that the display layer is at least partially bent around the force-sensitive layer. In some cases, the display layer is pre-bent. In addition, the edge region of the display (carrying the connector) may be separated from the main portion of the display layer. The main portion of the display layer refers to the surface that defines most of the display layer, and the secondary portion of the display layer refers to a portion separated from the main portion by a bend. The edge portion with the connector may be positioned on or carried by the secondary portion.

[0188] Fig.48 A flowchart 3300 is shown that illustrates a method for forming a battery assembly for an electronic device according to some of the described embodiments. The battery assembly can be used to provide current to several internal components (such as integrated circuits, audio modules, cameras, lighting elements, etc.) located in the electronic device.

[0189] In step 3302, a housing is provided. The housing is designed to provide a housing for several components of the battery. The housing may include a first covering element, and after the component is positioned between the first covering element and the second covering element, the first covering element and the second covering element are sealed together. In addition, the housing may be in one of several different shapes. In this regard, based on the shape of the electrode and the separator, the housing may include an L-shaped configuration, an I-shaped configuration, or a C-shaped configuration (as a non-limiting example). In addition, any of the aforementioned configurations may include an opening or through hole designed to accommodate an internal component of an electronic device or to provide space for the internal component.

[0190] In step 3304, multiple electrodes are inserted into the shell. The multiple electrodes may include multiple anode pairs and cathode pairs. In addition, each pair of electrodes is separated by a separator for physically isolating the electrode pairs from each other, while still allowing charge to flow between the electrode pairs. In addition, each electrode may undergo a die-cutting operation to form the electrode with a specific size and shape. The size and shape may include the size and shape according to the shell. In this regard, as a non-limiting example, each electrode in the electrode pair may include an L shape, a C shape, or an I shape. In addition, when the shell includes an opening, each separator and each electrode in the electrode pair may include the aforementioned opening to provide a through hole in the battery assembly.

[0191] In step 3306, a channel is formed in the housing. The channel may define a reduced dimension in the housing. In this regard, the housing may (substantially) include a first height. However, at a position corresponding to the channel, the housing may include a second height that is less than the first height. The channel is designed to thin the profile of the battery assembly so that additional components (such as a flexible circuit) can easily pass along the channel over the battery. In this regard, the channel may allow the additional component to be relocated in the electronic device. However, the housing of the battery can still receive components, such as a circuit board, at a position corresponding to (or within) the channel.

[0192] Fig.49 A flow chart 3400 is shown according to some of the described embodiments, which illustrates a method for forming a circuit board assembly. The circuit board assembly is designed to carry a number of operating components. The circuit board assembly may include a stacked configuration in which a first circuit board is stacked with a second circuit board, or alternatively the second circuit board is overlaid by the first circuit board. When positioned in a housing or casing of an electronic device, the stacked configuration can reduce the overall space occupied by the circuit board assembly (in multiple dimensions).

[0193] In step 3402, a first circuit board is provided. The first circuit board may include a first operating component. The first operating component includes a recessed portion. In addition, the first circuit board may include multiple (opposite) surfaces, wherein each surface is designed to carry multiple operating components, and some operating components are electrically connected to each other through metal traces and / or through holes.

[0194] In step 3404, the second circuit board is fixed together with the first circuit board so that the first circuit board covers the second circuit board. The second circuit board may include a second operating component having a protrusion.

[0195] In step 3406, the protrusion of the second operating component is positioned (or at least partially positioned) in the recess. In this way, the first operating component "mates" with the second operating component via the recess and the protrusion. This can reduce the gap between the first circuit board and the second circuit board because the first operating component and the second operating component are positioned closer to each other, as opposed to operating components that cannot mate with each other. As a result, the circuit board assembly can include a thinner profile and take up less space in the electronic device.

[0196] Fig.50 A flowchart 3500 according to some of the embodiments is shown, which illustrates a method for assembling an electronic device, the electronic device including a housing defining an internal cavity. The housing may include a through hole leading to the internal cavity. In step 3502, an audio module is disposed in the internal cavity. The audio module may include an audio module housing that carries a diaphragm. The audio module may also include an audio module opening formed in the audio module housing and aligned with the through hole. In addition, in addition to the audio module opening, the audio module housing may not have additional openings, or alternatively, may include one or more openings covered by an airtight and liquid-tight seal, so that the audio module housing defines a sound cavity (including a front cavity and a rear cavity) that is separated from the air in the internal cavity defined by the housing.

[0197] In step 3504, a bracket is positioned around a portion of the audio module housing. For example, the bracket may at least partially surround a portion of the audio module housing associated with the audio module opening, thereby providing additional support to the audio module housing. In addition, the bracket may be adhesively secured to the housing at or near the through hole. The adhesive used to secure the bracket to the housing may include a liquid-resistant adhesive.

[0198] In step 3506, a sealing element seals and isolates the support from the housing at the through hole. The sealing element can be positioned between the support and the housing, and can also engage the support and the housing. In this regard, the audio module housing is sealed and isolated from the air in the internal cavity, and the diaphragm can be sealed and isolated from the air in the internal cavity. In addition, the audio module housing is positioned and designed to receive air from the external environment outside the electronic device or discharge air to the external environment, such as air entering the through hole. In addition, the audio module can use the diaphragm to emit sound energy leaving the audio module opening and the through hole.

[0199] Fig.51 A flow chart 3600 is shown illustrating a method for making a heat distribution assembly for removing heat energy from heat generating components in an electronic device having a housing sidewall, according to some of the described embodiments. The heat distribution assembly is designed to provide structural support for the electronic device, particularly when a glass bottom wall coupled to the housing sidewall defines a housing for the electronic device.

[0200] In step 3602, a first layer is secured to a second layer. The first layer may include a first bottom wall and a first side wall extending from the first bottom wall. The second layer may include a second bottom wall engaging the first bottom wall. Additionally, the second layer may also include a second side wall extending from the second bottom wall and engaging the first side wall. In some cases, the first layer comprises a first type of material, such as steel (including stainless steel), to provide structural support. Additionally, in some cases, the second layer comprises a second type of material, such as copper or graphite, which is designed to enhance the thermal conductivity of the heat distribution assembly. Additionally, the first layer and the second layer may each include an additional side wall.

[0201] In step 3604, the third layer is fixed to the second layer. The third layer may include a third bottom wall that engages the second bottom wall. The third layer may also include a third side wall extending from the third bottom wall and engaging the second side wall and the housing side wall. The third layer may include a third type of material, such as steel (including stainless steel). In this regard, the third layer may be combined with the first layer to provide additional structural support. In addition, the first layer and the third layer may completely cover the second layer, so that the second layer is hidden by the first layer and the third layer.

[0202] When the heat distribution assembly has been assembled and positioned in an electronic device, the first layer is designed to distribute heat energy from the heat generating component to the second layer. In addition, the second layer is designed to distribute heat energy among various locations of the second layer so that the heat energy reaches the third layer and can be distributed to the housing sidewall.

[0203] The various aspects, embodiments, specific implementations or features of the embodiments may be used individually or in any combination. The various aspects of the embodiments may be implemented by software, hardware or a combination of hardware and software. The embodiments may also be implemented as computer readable code for controlling production operations on a computer readable medium, or as computer readable code for controlling a production line on a computer readable medium. A computer readable medium is any data storage device that can store data, which can then be read by a computer system. Examples of computer readable media include read-only memory, random access memory, CD-ROM, HDD, DVD, magnetic tape and optical data storage devices. Computer readable media may also be distributed in a network coupled computer system so that the computer readable code is stored and executed in a distributed manner.

[0204] In the above description, for the purpose of explanation, the specific nomenclature used provides a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that these specific details are not required to practice the embodiments. Therefore, for the purpose of illustration and description, the foregoing description of the specific embodiments described herein is presented. They are not intended to be exhaustive or to limit the embodiments to the disclosed precise form. It will be apparent to those of ordinary skill in the art that many modifications and variations are possible based on the above teachings.

Claims

1. A display assembly for an electronic device, the display assembly comprising: a touch-sensitive layer capable of detecting touch input capable of controlling the electronic device, the touch-sensitive layer comprising a first edge region having a first electrical connector; A display layer, the display layer comprising a bending region having a 180-degree bend and a second edge region having a second electrical connector; a flexible circuit coupled to the first electrical connector, the flexible circuit wrapping around a periphery of the bending region and extending parallel to the second electrical connector; a frame defining an undercut region that at least partially receives the display layer at the bend region; and A band defines an outer perimeter of the electronic device, the frame being coupled to the band.

2. The display assembly of claim 1, further comprising: a force-sensitive layer capable of detecting an amount of force applied to the touch-sensitive layer; and The third edge region has a third electrical connector. The display assembly of claim 2 , wherein the first edge region is perpendicular to the third edge region.

4. The display assembly of claim 1, wherein the display layer comprises a curved organic light emitting diode display.

5. An electronic device comprising: a protective layer, wherein the protective layer is formed of a transparent material; A display assembly, wherein the display assembly is covered by the protective layer, and the display assembly comprises: a touch-sensitive layer capable of detecting a touch input applied to the protective layer; a display layer defining a 180 degree bend positioned at a periphery of the display assembly; a frame carrying the protective layer, the frame defining an undercut region that at least partially receives the display layer at the 180 degree bend, the frame including a support element that supports the display assembly; and A band defines an outer perimeter of the electronic device, the frame being coupled to the band.

6. The electronic device according to claim 5, further comprising: a flexible circuit coupled to the touch-sensitive layer at a connector, the flexible circuit being wrapped around the display layer; Wherein the undercut region receives at least a portion of the flexible circuit.

7. The electronic device according to claim 5, wherein: The touch sensitive layer includes a first edge region having a first connector electrically and mechanically coupled to a first flexible circuit; The display layer includes a second edge region having a second connector electrically and mechanically coupled to a second flexible circuit; and The first edge region is parallel to the second edge region.

8. The electronic device according to claim 7, wherein: The belt is formed of metal, and comprises: Part I; and The second part, the second part is opposite to the first part; wherein the first connector is closer to the first portion than the second connector; and The second connector is closer to the second portion than the first connector.

9. The electronic device according to claim 8, wherein: The belt further includes a third portion and a fourth portion; and The first portion, the second portion, the third portion, and the fourth portion are electrically isolated from each other.

10. The electronic device of claim 7, further comprising a force-sensitive layer comprising a third edge region having a third connector electrically and mechanically coupled to a third flexible circuit. The electronic device according to claim 10 , wherein the first edge region is perpendicular to the third edge region.

12. The electronic device according to claim 5, wherein: The support element is embedded in the frame; and The electronic device also includes an adhesive between the support member and the display assembly.

13. The electronic device of claim 12, further comprising a flexible circuit secured to the support element and coupled to the display assembly by an adhesive.

14. The electronic device according to claim 5, wherein: The frame includes a notch; and The protective layer includes an extension positioned in the recess.

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