Micro-nano processing system

Abstract

The present invention provides a micro-nano processing system comprising: a sealed chemical reagent unit, a sealed UV exposure unit, an etching unit, and a gas purification unit; wherein the sealed chemical reagent unit, the sealed UV exposure unit, and the etching unit are connected via a sample transfer channel; the gas purification unit is airtightly connected to the sealed chemical reagent unit, the sealed UV exposure unit, and the etching unit via a gas circulation channel, so that the micro-nano processing system forms a gas circulation loop; the etching unit includes an ion beam etching preparation unit and an ion beam etching unit, which are sealed and connected via a vacuum gate valve; the micro-nano processing system also includes a sample inlet and outlet pipe for samples to enter and exit the micro-nano processing system. The micro-nano processing system of the present invention is cost-effective, easy to maintain, and simple to operate, and is particularly suitable for micro-nano processing of materials sensitive to oxygen and water vapor.

Description

Technical Field

[0001] The present invention relates to the field of micro-nano processing, and in particular to a micro-nano processing system. Background Art

[0002] When their scale and dimensions are reduced, low-dimensional materials often exhibit novel physical and chemical phenomena that differ from those of bulk materials due to size and dimensional effects, as well as surface and interface effects. Therefore, research and applications related to these phenomena are of great scientific and technological significance. Micro-nanofabrication technology is the technical foundation for the controllable creation of pre-designed artificial microstructures in materials that meet scale and dimensional requirements. It is the foundation of micro-nano science and technology, including fields such as microelectronics and micro-nano electromechanical systems.

[0003] Micro- and nano-fabrication of materials generally involves sample preparation, photoresist coating, pre-baking, exposure, post-baking, etching, and resist stripping. Exposure involves creating a pre-designed pattern on the sample surface using a mask on the cured photoresist. Two main methods are UV exposure and electron beam exposure. Etching involves "transferring" the pattern formed on the photoresist to the sample. Etching can be categorized as either wet or dry etching, using either corrosive liquid or ion beam etching. Currently, these steps are typically performed in a clean room. Clean room environmental parameters such as dust particle content, temperature, humidity, air pressure, and lighting must be strictly controlled according to standards to ensure the realization of the desired micro- and nano-scale artificial structures. Consequently, the costs associated with manufacturing, maintaining, and operating the micro- and nano-fabrication systems involved in micro- and nano-fabrication of samples are substantial.

[0004] In recent years, with the continuous emergence of new functional materials, people have found that they are easily degraded by reacting with oxygen and water vapor in an air environment. For example, iron-based superconductor material LiFeP (Europhys.Lett.87,37004(2009)), single-layer FeSe thin film material grown on SrTiO3 substrate (Chin.Phys.Lett.29,037402(2012)), chromium-based superconductor material K2Cr3As3 (Sci.China Mater.58,16(2015)), zinc-arsenic-based diluted magnetic semiconductor material Li(Zn,Mn)As (Nat.Commun.2,422(2011)), topological insulator material Bi2Se3 (Nature Phys.6,584(2010)) and KHgSb (Sci.Adv.3,e1602415(2017)), and quantum anomalous Hall effect material Cr 0.15 (Bi 0.1 Sb 0.9 ) 1.85Te3 (Science 340, 167 (2013)), etc. These new materials are of great scientific significance to both physics research and technological applications, and obtaining the microstructure of these materials is an essential step in conducting physical research and technological applications. Therefore, how to carry out the micro-nanofabrication of these quantum functional materials that are sensitive to oxygen and water vapor poses new challenges to both micro-nanofabrication technologies and micro-nanofabrication systems.

[0005] Currently, researchers have attempted to micro- and nanofabricate these oxygen- and moisture-sensitive materials using methods such as mechanical engraving (Science 340, 167 (2013)) and surface coating followed by micro- and nanofabrication (Sci. Rep. 4, 05817 (2014)). However, compared to micro- and nanofabrication, mechanical engraving offers lower structural precision and poor controllability and repeatability. Surface coating inevitably alters the sample's original state, hindering further characterization and testing of its physical and chemical properties.

[0006] Currently, there is an urgent need for a micro-nano processing system that is cost-effective, easy to maintain, simple to operate, and suitable for materials that are sensitive to oxygen and water vapor. Summary of the Invention

[0007] The object of the present invention is to provide a micro-nano processing system which is cost-effective, easy to maintain and simple to operate, and is particularly suitable for micro-nano processing of materials that are sensitive to oxygen and water vapor.

[0008] The above-mentioned object of the present invention is achieved through the following technical solutions.

[0009] The present invention provides a micro-nano processing system, comprising:

[0010] Chemical reagent sealed unit, UV exposure sealed unit and etching unit and gas purification unit; wherein,

[0011] The chemical reagent sealed unit, the ultraviolet exposure sealed unit, and the etching unit are connected through a sample transfer channel; the gas purification unit is airtightly connected to the chemical reagent sealed unit, the ultraviolet exposure sealed unit, and the etching unit through a gas circulation channel, so that the micro-nano processing system forms a gas circulation loop; the etching unit includes an ion beam etching preparation unit and an ion beam etching unit that are sealed and connected through a vacuum gate valve;

[0012] The micro-nano processing system further includes a sample inlet and outlet pipeline for the sample to enter and leave the micro-nano processing system.

[0013] Preferably, in the micro-nano processing system described in the present invention, the sample inlet and outlet pipes are arranged on at least one of the chemical reagent sealed unit, the ultraviolet exposure sealed unit and the etching unit. When the sample inlet and outlet pipes are arranged on the etching unit, the sample inlet and outlet pipes are arranged on the ion beam etching preparation unit of the etching unit. On the one hand, the ion beam etching preparation unit is connected to other functional units of the micro-nano processing system to form a gas circulation loop. On the other hand, the ion beam etching preparation unit provides a buffered and stable environmental atmosphere for the ion beam etching unit, so that the operator can place the sample to be etched, take out the etched sample, and perform operations such as cleaning the sample stage, observation window, etc. that serve the ion beam etching unit.

[0014] Preferably, in the micro-nano processing system of the present invention, sealing valves are provided on both sides of the sample inlet and outlet pipes.

[0015] Preferably, in the micro-nano processing system of the present invention, a sample carrier is provided in the sample transfer channel, so that the sample can move freely in the sample transfer channel.

[0016] Preferably, in the micro-nano processing system of the present invention, sealing valves are provided at both ends of the sample transfer channel.

[0017] Preferably, in the micro-nano processing system described in the present invention, an oxygen content probe, a water vapor content probe and a gas pressure probe are provided on the gas circulation channel, and are respectively connected to the gas source and the mechanical pump through solenoid valves.

[0018] Preferably, in the micro-nano processing system described in the present invention, the chemical reagent enclosed unit includes a chemical reagent enclosed box and a hot plate, a glue spreader, a developer, a glue remover, a photoresist, and a refrigerator placed therein.

[0019] Preferably, in the micro-nano processing system of the present invention, the photoresist is placed in the refrigerator.

[0020] Preferably, in the micro-nano processing system of the present invention, the chemical reagent sealed box is provided with a first sealed box observation window and a first rubber glove interface.

[0021] Preferably, in the micro-nano processing system described in the present invention, the ultraviolet exposure closed unit includes an ultraviolet exposure closed box and an ultraviolet exposure machine placed therein.

[0022] Preferably, in the micro-nano processing system of the present invention, a second sealed box observation window and a second rubber glove interface are provided on the ultraviolet exposure sealed box.

[0023] Preferably, in the micro-nano processing system of the present invention, the ultraviolet exposure machine includes a mercury lamp light source, an alignment operating table and a display.

[0024] Preferably, in the micro-nano processing system of the present invention, the ion beam etching preparation unit comprises an ion beam etching preparation closed box; the ion beam etching preparation closed box is provided with a third closed box observation window and a third rubber glove interface.

[0025] Preferably, in the micro-nano processing system described in the present invention, the ion beam etching unit includes an ion beam etching vacuum chamber and a Kaufman ion source; a sample stage and a cooling device are provided in the ion beam etching vacuum chamber.

[0026] In a specific embodiment of the present invention, the ion beam etching unit further includes a vacuum pump associated therewith for evacuating the ion beam etching vacuum chamber. Preferably, the vacuum pump may be a two-stage pump assembly consisting of a molecular pump and a mechanical pump. The molecular pump's air inlet is connected to the ion beam etching vacuum chamber via a vacuum gate valve, the molecular pump's air outlet is connected to the mechanical pump's air inlet, and the mechanical pump's air outlet is connected to an exhaust gas recovery pipeline.

[0027] Preferably, in the micro-nano processing system of the present invention, an ion beam etching unit observation window is provided on the ion beam etching vacuum chamber. Preferably, in the micro-nano processing system of the present invention, the gas purification unit includes a gas purification box and a blower, an organic gas purification column, and an oxygen-water purification column disposed therein.

[0028] In a specific embodiment of the present invention, the chemical reagent sealed unit, the ultraviolet exposure sealed unit, the ion beam etching preparation unit and the gas purification unit are connected through a sample transfer channel or a gas circulation channel, and are filled with a protective atmosphere gas at an atmospheric pressure to form a closed loop of the gas environment.

[0029] In a specific embodiment of the present invention, the sample transfer channel can not only meet the gas tightness, but also realize the transfer of samples between the chemical reagent sealed unit, the ultraviolet exposure sealed unit, and the ion beam etching preparation unit under an atmospheric pressure environment.

[0030] In a specific embodiment of the present invention, a sample carrier may be provided in the sample transfer channel to transfer the sample. Specifically, fixed pulleys may be placed at both ends of the sample transfer channel to move the sample carrier, thereby achieving sample transfer.

[0031] In a specific embodiment of the present invention, the air pressure within the micro-nano processing system is regulated by a gas purification unit. A gas pressure probe can be provided on the gas circulation channel to detect the pressure within the micro-nano processing system. A mechanical pump and a gas source can be connected to the gas circulation channel via respective solenoid valves. To maintain a balance between the air pressure within the gas circulation channel and the air pressure of the system's surrounding environment, within a set error range, when the value detected by the gas pressure probe is less than the air pressure value of the system's surrounding environment, a first solenoid valve opens, and the gas source replenishes gas into the gas circulation channel. When the value detected by the gas pressure probe is greater than the air pressure value of the system's surrounding environment, a second solenoid valve opens, and the mechanical pump extracts gas from the gas circulation channel.

[0032] In a specific embodiment of the present invention, the protective atmosphere gas is generally nitrogen or argon. In the micro-nano processing system of the present invention, the overall pressure inside the control system is about 1 standard atmosphere. At the same time, the residual oxygen and water vapor content in the gas inside the control system is maintained at a low level. Generally, the relative content of residual oxygen and water vapor is less than 1×10 -7 , that is 0.1ppm.

[0033] In a specific embodiment of the present invention, one end of the sample inlet and outlet conduit can be connected to a chemical reagent enclosure, a UV exposure enclosure, or an ion beam etching preparation enclosure. The other end of the sample inlet and outlet conduit can be connected to another enclosure containing a protective atmosphere, or to an air environment depending on actual working requirements.

[0034] In a specific embodiment of the present invention, the gas environment of the sample inlet and outlet pipeline can be switched between a vacuum environment and a protective atmosphere environment at one atmospheric pressure according to work requirements.

[0035] In a specific embodiment of the present invention, the gas environment of the ion beam etching vacuum chamber can be switched between a vacuum environment and a protective atmosphere environment at atmospheric pressure according to work requirements.

[0036] In a specific embodiment of the present invention, chemical reagents such as photoresist, developer, and degumming solution are all organic liquids that do not contain water.

[0037] In a specific embodiment of the present invention, the interior of the organic gas purification column is filled with materials such as activated carbon that absorb organic molecules, and the interior of the oxygen-water purification column is filled with materials such as copper catalysts and molecular sieves that absorb oxygen and water vapor.

[0038] In a specific embodiment of the present invention, the material of the sealed box observation window can be glass, organic glass, quartz, etc.

[0039] The present invention has the following beneficial effects:

[0040] The micro-nano processing system of the present invention can complete micro-nano processing of samples in a protective atmosphere environment, thereby obtaining micro-nano structures of materials that are sensitive to oxygen and water vapor.

[0041] The micro-nano processing system of the present invention can cover the surface of a material sample that is sensitive to oxygen and water vapor with a layer of photoresist film with an artificially set pattern in a protective atmosphere, so that other tests such as electrical transport testing, magnetic testing, optical testing, thermal testing, and acoustic testing can be carried out without causing deterioration.

[0042] The micro-nanofabrication system of this invention places all micro-nanofabrication operations and materials in an oxygen-free, water-free, protective atmosphere. Compared to replacing the entire cleanroom atmosphere with an oxygen-free, water-free, protective atmosphere, this solution offers significantly lower system and testing costs.

[0043] The micro-nano processing system of the present invention is scalable. Through design and integration, operations such as sample preparation, crystal structure characterization, micro-nano processing, electrical testing, and magnetic testing can all be performed in a protective atmosphere environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, in which:

[0045] Figure 1 A schematic diagram of a micro-nano processing system according to a specific embodiment of the present invention;

[0046] FIG2( a ) is an optical microscope image of a sample after a development operation according to an embodiment of the present invention;

[0047] FIG2( b ) is an optical microscope image of a sample after a stripping operation according to an embodiment of the present invention;

[0048] Wherein, the reference numerals:

[0049] 1-Sealed box under other protective atmosphere; 2-Sample inlet and outlet pipes; 3-Chemical reagent sealed box; 4-First sealed box observation window; 5-First rubber glove interface; 6-Hot plate; 7-Spreading machine; 8-Developing solution; 9-Degumming solution; 10-Photoresist; 11-Refrigerator; 12-First sample transfer channel; 13-UV exposure sealed box; 14-Second sealed box observation window; 15-Second rubber glove interface; 16-Mercury lamp; 17-Alignment operation table; 18-Display; 19-Second sample transfer channel; 20-Sample carrier; 21-Ion beam etching preparation sealed box; 22- Observation window of the third sealed box; 23-third rubber glove interface; 24-vacuum gate valve; 25-ion beam etching vacuum chamber; 26-ion beam etching unit observation window; 27-sample stage; 28-cooling device; 29-Kaufman ion source; 30-first gas circulation channel; 31-gas purification box; 32-blower; 33-oxygen-water purification column; 34-organic gas purification column; 35-second gas circulation channel; 36-first solenoid valve; 37-gas source; 38-second solenoid valve; 39-mechanical pump; 40-gas pressure probe; 41-oxygen content probe; 42-water vapor content probe. DETAILED DESCRIPTION

[0050] With reference now to the accompanying drawings, schematic diagrams of the structures disclosed herein are described in detail. Although the drawings are provided to illustrate embodiments of the present invention, they are not necessarily drawn to scale according to specific embodiments, and certain features may be enlarged, removed, or partially cut away to better illustrate and explain the present disclosure. Certain directional terms used hereinafter to describe the drawings will be understood to have their ordinary meanings and refer to those directions to which the drawings relate when viewed normally.

[0051] Reference Figure 1 , Figure 1 A schematic diagram of a micro-nano processing system according to a specific embodiment of the present invention is shown. The micro-nano processing system of the present invention includes: a chemical reagent sealed unit, a UV exposure sealed unit, an etching unit, and a gas purification unit; wherein the chemical reagent sealed unit, UV exposure sealed unit, and etching unit are connected via a sample transfer channel; the gas purification unit is airtightly connected to the chemical reagent sealed unit, UV exposure sealed unit, and etching unit via a gas circulation channel, so that the micro-nano processing system forms a gas circulation loop; the etching unit includes an ion beam etching preparation unit and an ion beam etching unit, which are sealed and connected via a vacuum gate valve 24; the micro-nano processing system also includes a sample inlet and outlet pipe 2, which allows samples to enter and exit the micro-nano processing system.

[0052] In a specific embodiment of the present invention, sealing valves are installed on both sides of the sample inlet and outlet pipe 2. Sealing valves are installed at both ends of the first sample transfer channel 12. A sample carrier 20 is installed in the second sample transfer channel 19, allowing the sample to move freely within the sample transfer channel. An oxygen content probe 41, a water vapor content probe 42, and a gas pressure probe 40 are installed in the second gas circulation channel 35.

[0053] In a specific embodiment of the present invention, the chemical reagent sealed unit includes a chemical reagent sealed box 3 and a hot plate 6, a glue spreader 7, a developer 8, a degumming solution 9, a photoresist 10, and a refrigerator 11 placed therein; the photoresist 10 is placed in the refrigerator 11; the chemical reagent sealed box 3 is provided with a first sealed box observation window 4 and a first rubber glove interface 5.

[0054] In a specific embodiment of the present invention, the ultraviolet exposure closed unit includes an ultraviolet exposure closed box 13 and an ultraviolet exposure machine placed therein; the ultraviolet exposure closed box 13 is provided with a second closed box observation window 14 and a second rubber glove interface 15; the ultraviolet exposure machine includes a mercury lamp 16, an alignment operating table 17 and a display 18.

[0055] In a specific embodiment of the present invention, the ion beam etching preparation unit includes an ion beam etching preparation closed box 21 ; a third closed box observation window 22 and a third rubber glove interface 23 are provided on the ion beam etching preparation closed box 21 .

[0056] In a specific embodiment of the present invention, the ion beam etching unit includes an ion beam etching vacuum chamber 25 and a Kaufman ion source 29. A sample stage 27 and a cooling device 28 are provided in the ion beam etching vacuum chamber 25. An ion beam etching unit observation window 26 is provided in the ion beam etching vacuum chamber 25.

[0057] In a specific embodiment of the present invention, the gas purification unit includes a gas purification box 31 and a blower 32, an oxygen-water purification column 33 and an organic gas purification column 34 placed therein.

[0058] In a specific embodiment of the present invention, the gas pressure in the micro-nano processing system is regulated by a gas purification unit. A gas pressure probe 40 can be provided on the second gas circulation channel 35 to detect the gas pressure in the micro-nano processing system. The mechanical pump 39 and the protective gas source 37 can be connected to the second gas circulation channel 35 via solenoid valves, respectively. In order to maintain a balance between the gas pressure in the gas circulation channel and the pressure of the surrounding environment of the system, within a set error range, when the value detected by the gas pressure probe 40 is less than the pressure value of the surrounding environment of the system, the first solenoid valve 36 is opened and the protective gas source 37 replenishes gas into the gas circulation channel; and when the value detected by the gas pressure probe 40 is greater than the pressure value of the surrounding environment of the system, the second solenoid valve 38 is opened and the mechanical pump 39 extracts gas from the gas circulation channel.

[0059] Micro-nano processing of samples generally includes steps such as sample preparation, glue spreading, pre-baking, exposure, post-baking, etching, and glue removal, and the present invention also includes the operation step of sample transfer. In a specific embodiment of the present invention, sample transfer is carried out in a sample transfer channel. The transfer of samples is carried out under a controllable protective atmosphere. When the distance between the two closed boxes involved in the sample transfer is relatively close, the sample can be directly transferred manually through the sample transfer channel. When the distance between the two closed boxes is relatively far, the sample can be transferred with the help of a sample carrier. In a specific embodiment of the present invention, a fixed pulley is placed at both ends of a longer sample transfer channel. With the help of a fixed pulley and a rope, the sample carrier can be moved back and forth in the sample transfer channel, thereby realizing the transfer of the sample. The following further illustrates the disclosure of the present invention through specific operating steps.

[0060] Step 1: Sample Preparation

[0061] This procedure is performed within a sealed chemical reagent chamber. The sample to be processed is transferred from another sealed chamber under a protective atmosphere to the sealed chemical reagent chamber via the sample inlet and outlet tubes. Check the sample surface for cleanliness. If contaminants are present, decontamination may be performed using physical or chemical methods, depending on the specific situation.

[0062] Step 2: Spreading glue

[0063] This process is performed in a sealed chemical chamber. Under yellow light, the sample is first placed on the working position of the spreader. Then, photoresist is removed from the refrigerator and dripped onto the sample surface. After a series of low-speed and high-speed rotations, the photoresist is evenly spread across the sample surface.

[0064] Step 3: Pre-baking

[0065] This operation is carried out in a sealed chemical reagent box. Under yellow light, the sample obtained in step 2 is transferred to a hot plate and baked to remove the solvent in the photoresist, release the stress in the photoresist, and prevent the photoresist from contaminating the equipment.

[0066] Step 4: Exposure

[0067] This procedure is performed within a sealed UV exposure chamber. After the sample obtained in step 3 has cooled naturally under yellow light, it is transferred to the sealed UV exposure chamber. The UV exposure equipment within the chamber includes a mercury lamp, an alignment table, a display, and other components. The sample is placed on the table, and alignment between the sample and the photoresist is achieved using the alignment table and display. The shutter between the mercury lamp and the sample is then opened to expose the sample.

[0068] Step 5: Post-baking

[0069] This operation step is carried out in a sealed chemical reagent box. Under yellow light, the sample obtained in step 4 is transferred back to the sealed chemical reagent box and then placed on a heating plate for baking.

[0070] Step 6: Development

[0071] This operation is performed in a sealed chemical chamber. After the sample obtained in step 5 has cooled naturally under yellow light, it is developed with a developer. After development, a photoresist pattern is obtained, as shown in Figure 2(a).

[0072] Step 7: Etching

[0073] This operation step is carried out in the ion beam etching preparation unit and the ion beam etching unit. Etching can be specifically divided into the following steps: (a) transferring the sample obtained in step 6 to the ion beam etching preparation unit; (b) filling the ion beam etching vacuum chamber with one atmosphere of pressure and opening the vacuum gate valve between the ion beam etching vacuum chamber and the ion beam etching preparation closed box; placing the sample on the sample stage in the ion beam etching vacuum chamber through the ion beam etching preparation unit. The ion beam etching unit observation window can help adjust the position of the sample to be etched; in addition, the sample stage is connected to a cooling device to prevent the photoresist on the sample from carbonizing due to overheating during etching; (c) closing the vacuum gate valve and pumping the vacuum of the ion beam etching vacuum chamber to less than 1.0×10 -4 Pa; (d) rotating the angle of the sample stage so that it faces the Kaufman ion source, then turning on the Kaufman ion source, and etching the sample through the electrically neutral argon atoms emitted by the Kaufman ion source to obtain the desired sample protected by the photoresist pattern.

[0074] Step 8: Remove glue

[0075] This operation is performed within a sealed chemical chamber. The sample obtained in step 7 is transferred back into the sealed chemical chamber and then immersed in a degumming solution to remove the photoresist from the sample surface. A micrograph of the sample's microstructure after photoresist removal is shown in Figure 2(b).

[0076] All of the above operations are performed in a sealed box or vacuum chamber, that is, all operations are completed in a controlled protective atmosphere. After the sample is micro-processed, it can be transferred to another sealed box under a protective atmosphere for packaging and other operations.

[0077] Due to its design, the sealed chamber allows for a constant, slight inflow of air, causing the oxygen and water vapor content of the protective atmosphere to increase. Furthermore, organic gas molecules are released into the atmosphere during processes such as coating, developing, and stripping. To maintain low residual oxygen and water vapor levels in the protective atmosphere and remove small amounts of organic gas molecules, a gas purification unit is required. This unit primarily consists of a gas purification chamber, a blower, an oxygen-water purification column, and an organic molecule purification column. The gas purification unit is connected to the sealed chamber via a sample transfer channel or a gas circulation channel, forming a closed loop. The blower circulates the protective gas within the closed loop. When the gas reaches the oxygen-water purification column, its internal copper catalyst and molecular sieve absorb residual oxygen and water vapor in the protective atmosphere, respectively, ensuring that oxygen and water vapor levels meet the standard of less than 0.1 ppm. Oxygen and water vapor levels are measured by oxygen and water vapor sensors. When the gas circulates to the organic molecule purification column, it passes through the activated carbon inside and adsorbs the organic gas molecules in the protective atmosphere gas.

[0078] The operation of the gas purification unit mainly includes circulation, scrubbing, regeneration of oxygen and water purification column materials, replacement of organic molecule purification column materials, etc. The circulation operation is: turn on the fan and turn on the two purification columns to circulate the protective atmosphere in the purification system and the closed box. The scrubbing operation is: turn off the fan and turn off the two purification columns, and use a clean protective atmosphere to replace the contaminated protective atmosphere inside the closed box. The regeneration operation of the oxygen and water purification column materials is: turn off the fan and turn off the oxygen and water purification column, use a reducing gas such as a mixture of hydrogen and argon, and reduce the purification materials (copper catalyst, molecular sieve) in the oxygen and water purification column that have adsorbed enough oxygen and water vapor. The replacement of organic molecule purification column materials is to regularly replace the activated carbon in the organic molecule purification column.

[0079] Finally, it should be noted that the above embodiments are intended only to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions to the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention and are intended to be encompassed by the claims of the present invention.

Claims

1. A micro-nano processing system, comprising: Chemical reagent sealed unit, UV exposure sealed unit and etching unit and gas purification unit; wherein, The chemical reagent sealed unit, the ultraviolet exposure sealed unit, and the etching unit are connected through a sample transfer channel; the gas purification unit is airtightly connected to the chemical reagent sealed unit, the ultraviolet exposure sealed unit, and the etching unit through a gas circulation channel, so that the micro-nano processing system forms a gas circulation loop; the etching unit includes an ion beam etching preparation unit and an ion beam etching unit that are sealed and connected through a vacuum gate valve; The micro-nano processing system further includes a sample inlet and outlet pipe for samples to enter and leave the micro-nano processing system; Sealing valves are provided on both sides of the sample inlet and outlet pipes; Sealing valves are provided at both ends of the sample transfer channel; The gas circulation channel is provided with an oxygen content probe, a water vapor content probe and a gas pressure probe; The gas purification unit comprises a gas purification box and a fan, an organic gas purification column and an oxygen-water purification column placed therein.

2. The micro-nano processing system according to claim 1, wherein: A sample carrier is provided in the sample transfer channel, so that the sample can move freely in the sample transfer channel.

3. The micro-nano processing system according to claim 1, wherein: The chemical reagent sealed unit comprises a chemical reagent sealed box body and a hot plate, a glue spreader, a developer, a glue remover, a photoresist and a refrigerator placed therein.

4. The micro-nano processing system according to claim 3, wherein: The photoresist is placed in the refrigerator.

5. The micro-nano processing system according to claim 3, wherein: The chemical reagent sealed box is provided with a first sealed box observation window and a first rubber glove interface.

6. The micro-nano processing system according to claim 1, wherein: The ultraviolet exposure closed unit comprises an ultraviolet exposure closed box and an ultraviolet exposure machine placed therein.

7. The micro-nano processing system according to claim 6, wherein: The ultraviolet exposure closed box is provided with a second closed box observation window and a second rubber glove interface.

8. The micro-nano processing system according to claim 6, wherein: The ultraviolet exposure machine comprises a mercury lamp light source, an alignment operating table and a display.

9. The micro-nano processing system according to claim 1, wherein: The ion beam etching preparation unit comprises an ion beam etching preparation closed box; a third closed box observation window and a third rubber glove interface are provided on the ion beam etching preparation closed box.

10. The micro-nano processing system according to claim 1, wherein: The ion beam etching unit comprises an ion beam etching vacuum chamber and a Kaufman ion source; a sample stage and a cooling device are arranged in the ion beam etching vacuum chamber.

11. The micro-nano processing system according to claim 10, wherein: An ion beam etching unit observation window is provided on the ion beam etching vacuum chamber.

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