Wafer boat

Abstract

The present invention provides a susceptor. The susceptor is used to accommodate a wafer, and the susceptor includes a housing, a first support rib, and a second support rib. The first support rib is disposed in the housing. The first support rib includes a front support portion, a middle support portion, and a rear support portion. The front support portion is connected to one end of the middle support portion, and the rear support portion is connected to the other end of the middle support portion. The front support portion has a front arc-shaped edge. The second support rib is disposed in the housing. The edge of the wafer is supported by the first support rib and the second support rib, and the front support portion, the middle support portion, and the rear support portion are in contact with the wafer simultaneously.

Description

Technical Field

[0001] Embodiments of the present invention relate to a susceptor, and more particularly to a susceptor having better supporting ability. Background Art

[0002] In the known art, a susceptor has a plurality of support ribs for supporting a wafer. The plurality of support ribs contact a contact area on the edge of the wafer. In order to prevent the support ribs from damaging the die on the wafer and to increase the effective area (the area where the die can be arranged) on the wafer, the contact area must be reduced. However, in the future trend, the thickness of the wafer tends to be reduced. Figure 7 Shows a known susceptor 9, in which the wafer W is supported by the support ribs 91. Refer to Figure 7 , since the thickness of the wafer is reduced, the central portion of the wafer will be deformed downward due to gravity. When the arm fork removes the wafer from the susceptor, the arm fork may collide with the wafer and cause damage to the wafer.

[0003] In the known art, a tongue plate is used to support the wafer to prevent the central portion of the wafer from deforming downward. The tongue plate supports the central portion of the wafer. However, for a wafer with a double-sided die configuration, the tongue plate may damage the die on the bottom of the wafer. Summary of the Invention

[0004] The purpose of the embodiments of the present invention is to provide a susceptor to solve at least one of the above problems.

[0005] The embodiments of the present invention are provided to solve the problems of the known art. A susceptor for receiving a wafer includes a housing, a first support rib, and a second support rib. The housing includes a front opening through which the wafer enters the housing. The first support rib is disposed in the housing. The second support rib is disposed in the housing, wherein the wafer is supported by the first support rib and the second support rib, the first support rib contacts a first contact area of the wafer, and the second support rib contacts a second contact area of the wafer. Relative to the center of the wafer, the range angle of the first contact area is between 80 degrees and 110 degrees, and the range angle of the second contact area is between 80 degrees and 110 degrees.

[0006] In one embodiment, the first contact area has a contact area width, and the contact area width is 3% - 8% of the radius of the wafer.

[0007] In one embodiment, the first support rib includes a first support surface, and an included angle is formed between the first support surface and a horizontal plane, and the included angle is between 0.5 degrees and 4 degrees.

[0008] In one embodiment, the first contact region has a front contact section and a rear contact section. The front contact section corresponds to the front opening, and the front contact section is connected to the rear contact section. Wherein, with respect to the center of the wafer, the angular range of the front contact section is between 25 degrees and 55 degrees, and the angular range of the rear contact section is between 50 degrees and 55 degrees.

[0009] In one embodiment, the front contact section has a front contact region width, and the front contact region width is 3% - 5% of the radius of the wafer. The rear contact section has a rear contact region width, and the rear contact region width is 5% - 8% of the radius of the wafer.

[0010] In another embodiment, the present invention provides a susceptor for accommodating a wafer, including a housing, a first support rib, and a second support rib. The housing includes a front opening, and the wafer enters the housing through the front opening. The first support rib is disposed in the housing. The first support rib includes a front support portion, a middle support portion, and a rear support portion. The front support portion corresponds to the front opening, the front support portion is connected to one end of the middle support portion, the rear support portion is connected to the other end of the middle support portion, and the front support portion has a front arc-shaped edge. The second support rib is disposed in the housing. The wafer is supported by the first support rib and the second support rib, and the front support portion, the middle support portion, and the rear support portion contact the wafer simultaneously.

[0011] In one embodiment, the middle support portion includes a straight edge, and the rear support portion has a rear arc-shaped edge.

[0012] In one embodiment, a rib notch is formed in the front support portion.

[0013] When applying the susceptor of the embodiment of the present invention, a plurality of the first support ribs and a plurality of the second support ribs only support the edge portion of the wafer and do not contact the central portion of the wafer. For a wafer with a double-sided die configuration, the die on the bottom surface of the wafer can be protected from being damaged. In one embodiment, with respect to the center of the wafer, the angular range of the first contact region is between 80 degrees and 110 degrees, and the angular range of the second contact region is between 80 degrees and 110 degrees. Thus, the wafer is fully supported by the first support rib and the second support rib, and the central portion of the wafer can be prevented from deforming downward. In another embodiment, the first support rib includes the front support portion, the middle support portion, and the rear support portion, and the front support portion has the front arc-shaped edge. The front support portion provides additional support for the wafer, so that the central portion of the wafer can be prevented from deforming downward. Description of the Drawings

[0014] Figure 1 is the susceptor of the embodiment of the present invention.

[0015] Figure 2 The susceptor of the first embodiment of the present invention.

[0016] Figure 3 is Figure 2 a sectional view taken along the III-III direction in

[0017] Figure 4 is Figure 2 an enlarged view of part IV of

[0018] Figure 5 The susceptor in the second embodiment of the present invention.

[0019] Figure 6 A modified example of the susceptor of the second embodiment of the present invention.

[0020] Figure 7 Shows a well-known susceptor, in which the wafers are supported by support ribs.

[0021] The reference numerals are as follows:

[0022] B, B1, B2: susceptor

[0023] W: wafer

[0024] 1, 1’: first support rib

[0025] 11~front support portion

[0026] 111: front arcuate edge

[0027] 12: middle support portion

[0028] 121: straight edge

[0029] 13: rear support portion

[0030] 131: rear arcuate edge

[0031] 18: edge

[0032] 19: first support surface

[0033] 2, 2’: second support rib

[0034] 28: edge

[0035] 3: housing

[0036] 31: front opening

[0037] 32: rear opening

[0038] 41: first contact area

[0039] 411: front contact section

[0040] 412: rear contact section

[0041] 42: Second contact area

[0042] 5: Rib notch

[0043] C: Center of the circle

[0044] 9: Wafer boat

[0045] 91: Support rib

[0046] θ1, θ2, θ11, θ12: Range angles

[0047] θ3, Included angle

[0048] w: Contact area width

[0049] w1: Front contact area width

[0050] w2: Rear contact area width

[0051] w3: Support part width

[0052] R: Radius

[0053] H: Horizontal plane

[0054] P: Spacing Detailed implementation manners

[0055] Figure 1 This is the wafer boat of an embodiment of the present invention. Refer to Figure 1 , the wafer boat B of the embodiment of the present invention is used to accommodate a wafer W. The wafer boat B includes a housing 3, a plurality of first support ribs 1 and a plurality of second support ribs 2. The housing 3 includes a front opening 31. Wherein, the wafer W enters the housing 3 through the front opening 31. The first support ribs 1 are arranged in the housing 3. Specifically, the first support ribs 1 are formed on a first inner wall of the housing 3. The second support ribs 2 are arranged in the housing 3. Specifically, the second support ribs 2 are formed on a second inner wall of the housing 3. The first inner wall and the second inner wall face each other. The wafer W is supported by the first support ribs 1 and the second support ribs 2.

[0056] Figure 2 This is the wafer boat of the first embodiment of the present invention. Refer to Figure 2, in the first embodiment, the edge 18 of the first support rib 1 of the susceptor B1 is arc-shaped. The edge 28 of the second support rib 2 of the susceptor B1 is arc-shaped. The first support rib 1 contacts a first contact area 41 of the wafer W, and the second support rib 2 contacts a second contact area 42 of the wafer W. With respect to the center C of the wafer W, the range angle θ1 of the first contact area 41 is between 80 degrees and 110 degrees, and the range angle θ2 of the second contact area 42 is between 80 degrees and 110 degrees. In one embodiment, the range angle θ1 of the first contact area 41 is 98 degrees, and the range angle θ2 of the second contact area 42 is 98 degrees.

[0057] Figure 3 is Figure 2 a sectional view taken along the III-III direction in Figure 2 and Figure 3 , in one embodiment, the first contact area 41 has a contact area width w, and the contact area width w is 3% - 8% of the radius R of the wafer.

[0058] Referring to Figure 3 , in one embodiment, the first support rib 1 includes a first support surface 19, and an included angle θ3 is formed between the first support surface 19 and a horizontal plane H. The included angle θ3 is between 0.5 degrees and 4 degrees. In one embodiment, the included angle θ3 is between 1 degree and 2 degrees. The included angle θ3 between the first support surface 19 and the horizontal plane H increases the contact area between the first support surface 19 and the wafer W, thereby avoiding stress concentration and protecting the wafer from damage.

[0059] Referring to Figure 2 , in one embodiment, the first contact area 41 has a front contact segment 411 and a rear contact segment 412. The front contact segment 411 corresponds to the front opening 31, and the front contact segment 411 connects the rear contact segment 412. Among them, with respect to the center C of the wafer W, the range angle θ11 of the front contact segment 411 is between 25 degrees and 55 degrees, and the range angle θ12 of the rear contact segment 412 is between 50 degrees and 55 degrees. In one embodiment, the range angle θ11 of the front contact segment 411 is 55 degrees, and the range angle θ12 of the rear contact segment 412 is 43 degrees.

[0060] Figure 4 is Figure 2 an enlarged view of part IV of Figure 2 , Figure 3 and Figure 4, in one embodiment, the front contact section 411 has a front contact area width w1, and the front contact area width w1 is 3% to 5% of the radius R of the wafer W. The rear contact section 412 has a rear contact area width w2, and the rear contact area width w2 is 5% to 8% of the radius R of the wafer W. In one embodiment, the front contact area width w1 is at least 3% of the radius R of the wafer W, and the rear contact area width w2 is 7.5% of the radius R of the wafer W.

[0061] With reference Figure 3 , in one embodiment, the spacing P between the two first support ribs is 6.35 mm.

[0062] Refer to Figure 1 and Figure 2 , in one embodiment, the housing 3 includes a rear opening 32, and the rear opening 32 is opposite to the front opening 31.

[0063] Figure 5 is the wafer boat in the second embodiment of the present invention. Refer to Figure 5 , similar to the first embodiment, the wafer boat B2 includes a housing, a first support rib 1', and a second support rib 2'. The housing includes a front opening 31, and the wafer W enters the housing through the front opening 31. The first support rib 1' is disposed in the housing, and the first support rib 1' includes a front support portion 11, a middle support portion 12, and a rear support portion 13. The front support portion 11 corresponds to the front opening 31, the front support portion 11 connects one end of the middle support portion 12, and the rear support portion 13 connects the other end of the middle support portion 12. The middle support portion 12 includes a straight edge 121, and the front support portion 11 has a front arc-shaped edge 111. The second support rib 2' is disposed in the housing. The wafer W is supported by the first support rib 1' and the second support rib 2', and the front support portion 11, the middle support portion 12, and the rear support portion 13 simultaneously contact the wafer W.

[0064] Refer to Figure 5 , in one embodiment, the rear support portion 13 has a rear arc-shaped edge 131.

[0065] Figure 6 is a variant of the wafer boat in the second embodiment of the present invention. Refer to Figure 6 , in one embodiment, a rib notch 5 is formed in the front support portion 11. The rib notch 5 is used for detection by a wafer sensor.

[0066] With reference Figure 5 and Figure 6 , in one embodiment, the front support portion 11 has a support portion width w3. The support portion width w3 is 20% of the radius R of the wafer W.

[0067] In one embodiment, an arm fork is used to transfer the wafer. The arm fork can be inserted into the susceptor through the front opening 31. The arm fork can be a flat arm fork or a fork-shaped arm fork.

[0068] In one embodiment, since the first support rib and the second support rib have provided sufficient support for the wafer, there is no need to form an additional support structure between the first support rib and the second support rib. In other words, in the embodiments of the present invention, the central portion of the wafer does not need to be supported by an additional support structure.

[0069] In one embodiment, the size of the wafer can be equal to or less than 12 inches.

[0070] For the susceptor applying the embodiments of the present invention, a plurality of first support ribs and a plurality of second support ribs only support the edge portion of the wafer and do not contact the central portion of the wafer. For a wafer having a double-sided die configuration, the die on the bottom surface of the wafer can be protected from being damaged. In one embodiment, with respect to the center of the circle of the wafer, the range angle of the first contact area is between 80 degrees and 110 degrees, and the range angle of the second contact area is between 80 degrees and 110 degrees. Thus, the wafer is sufficiently supported by the first support rib and the second support rib, and the central portion of the wafer can be prevented from deforming downward. In another embodiment, the first support rib includes the front support portion, the middle support portion, and the rear support portion, and the front support portion has the front arcuate edge. The front support portion provides additional support for the wafer, so that the central portion of the wafer can be prevented from deforming downward.

[0071] Although the present invention has been disclosed above with specific preferred embodiments, it is not intended to limit the present invention. Those skilled in the art can still make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to that defined by the appended claims.

Claims

1. A susceptor for accommodating a wafer, comprising: A housing including a front opening through which the wafer enters the housing; A first support rib disposed in the housing; and A second support rib disposed in the housing, wherein the wafer is supported by the first support rib and the second support rib, the first support rib contacts a first contact area of the wafer, and the second support rib contacts a second contact area of the wafer. Wherein, relative to the center of the wafer, the angular range of the first contact area is between 80 degrees and 110 degrees, and the angular range of the second contact area is between 80 degrees and 110 degrees. Wherein, the first contact area has a front contact section and a rear contact section, the front contact section corresponds to the front opening, and the front contact section connects the rear contact section. Wherein, relative to the center of the wafer, the angular range of the front contact section is between 25 degrees and 55 degrees, and the angular range of the rear contact section is between 50 degrees and 55 degrees.

2. The susceptor according to claim 1, wherein, The first contact area has a contact area width which is 3% - 8% of the radius of the wafer.

3. The susceptor according to claim 1, wherein, The first support rib includes a first support surface, and an included angle is formed between the first support surface and a horizontal plane, and the included angle is between 0.5 degrees and 4 degrees.

4. The susceptor according to claim 1, wherein, The front contact section has a front contact area width which is 3% - 5% of the radius of the wafer, and the rear contact section has a rear contact area width which is 5% - 8% of the radius of the wafer.

5. A susceptor for accommodating a wafer, comprising: A housing including a front opening through which the wafer enters the housing; A first support rib disposed in the housing, wherein the first support rib includes a front support portion, a middle support portion, and a rear support portion. The front support portion corresponds to the front opening, the front support portion connects one end of the middle support portion, the rear support portion connects the other end of the middle support portion, and the front support portion has a front arc-shaped edge; and A second support rib disposed in the housing. Wherein, the wafer is supported by the first support rib and the second support rib, and the front support portion, the middle support portion, and the rear support portion contact the wafer simultaneously. Wherein, the first support rib contacts a first contact area of the wafer, and the second support rib contacts a second contact area of the wafer. Wherein, relative to the center of the wafer, the angular range of the first contact area is between 80 degrees and 110 degrees, and the angular range of the second contact area is between 80 degrees and 110 degrees. Wherein, the first contact area has a front contact section and a rear contact section, the front contact section corresponds to the front opening, and the front contact section connects the rear contact section. Wherein, relative to the center of the wafer, the angular range of the front contact section is between 25 degrees and 55 degrees, and the angular range of the rear contact section is between 50 degrees and 55 degrees.

6. The susceptor according to claim 5, wherein, The middle support portion includes a straight edge, and the rear support portion has a rear arc-shaped edge.

7. The susceptor according to claim 5, wherein, The first support rib includes a first support surface, and an included angle is formed between the first support surface and a horizontal plane, and the included angle is between 0.5 degrees and 4 degrees.

8. The susceptor according to claim 5, wherein, The front support portion contacts the wafer through the front contact section, the rear support portion contacts the wafer through the rear contact section, the front contact section has a front contact area width, and the front contact area width is 3% to 5% of the radius of the wafer. The rear contact section has a rear contact area width, and the rear contact area width is 5% to 8% of the radius of the wafer.

9. The susceptor according to claim 5, wherein, A rib notch is formed in the front support portion.

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