Display module and display device

Abstract

The present application discloses a display module and a display device, wherein the display module comprises at least a display panel, a conductive layer, and a buffer heat dissipation layer; the display panel has a first through hole penetrating the display panel in a direction perpendicular to the display panel; the conductive layer is located on the back of the display panel and in contact with the display panel, and the conductive layer is arranged close to the first through hole; the buffer heat dissipation layer is located on the back of the display panel and comprises at least a buffer layer and a metal heat dissipation layer; wherein the buffer layer is arranged around the conductive layer, and the metal heat dissipation layer is located on the side of the buffer layer away from the display panel and in contact with the conductive layer. The present application can conduct the static electricity generated during the micro-drop test from the display panel to the metal heat dissipation layer through the conductive layer, thereby improving the problem of the first through hole of the display panel being illuminated after the entire device has been micro-dropped.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] In the modern communications industry, the market demand for mobile phones is growing. As mobile phones develop towards being lighter and thinner, mobile phone displays are also developing from LCD (Liquid Crystal Display) to OLED (Organic Light-Emitting Diode).

[0003] Among the mobile phone quality inspections, a micro-drop test is performed on the entire device. This often results in the front camera hole on the panel becoming shiny. Analysis indicates that static electricity generated during the drop process is transferred to the panel and accumulates near the front camera hole, preventing it from being released. Therefore, it's necessary to address this issue of the front camera hole becoming shiny after the micro-drop test. Summary of the Invention

[0004] The present application provides a display module and a display device, which can conduct the static electricity generated during the micro-drop test from the display panel to the metal heat dissipation layer through the conductive layer, thereby improving the problem of the first through hole of the display panel being illuminated after the entire device is micro-dropped.

[0005] The present application provides a display module, comprising at least:

[0006] The display panel has a first through hole penetrating the display panel in a direction perpendicular to the display panel;

[0007] a conductive layer, located on the back of the display panel and in contact with the display panel; wherein the conductive layer is disposed near the first through hole;

[0008] A buffer heat dissipation layer is located on the back of the display panel and includes at least a buffer layer and a metal heat dissipation layer; wherein the buffer layer is arranged around the conductive layer, and the metal heat dissipation layer is located on a side of the buffer layer away from the display panel and in contact with the conductive layer.

[0009] Optionally, a distance between a projection of any one of the conductive layer, the buffer layer and the metal heat dissipation layer in a direction perpendicular to the display panel and a projection of the first through hole in a direction perpendicular to the display panel is greater than or equal to 0.

[0010] Optionally, the conductive layer has a second through hole correspondingly connected to the first through hole;

[0011] The central axis of the first through hole coincides with the central axis of the second through hole, and the aperture of the second through hole is greater than or equal to the aperture of the first through hole.

[0012] Optionally, the metal heat dissipation layer is further located on a side of the conductive layer away from the display panel; the metal heat dissipation layer has a third through hole correspondingly connected to the second through hole;

[0013] The central axis of the third through hole coincides with the central axis of the second through hole, and the aperture of the third through hole is greater than or equal to the aperture of the first through hole.

[0014] Optionally, the buffer heat dissipation layer further includes an adhesive layer located between the display panel and the buffer layer; the adhesive layer is arranged around the conductive layer;

[0015] A distance between a projection of the adhesive layer in a direction perpendicular to the display panel and a projection of the first through hole in a direction perpendicular to the display panel is greater than or equal to 0.

[0016] Optionally, the display module further includes a backplane located between the display panel and the buffer heat dissipation layer; the backplane is arranged around the conductive layer;

[0017] A distance between a projection of the back plate in a direction perpendicular to the display panel and a projection of the first through hole in a direction perpendicular to the display panel is greater than or equal to 0.

[0018] Optionally, the display module further comprises a glass cover plate located on a side of the display panel away from the conductive layer and a light shielding layer located on a side of the glass cover plate close to the display panel;

[0019] The light-shielding layer has a fourth through hole; the central axis of the fourth through hole coincides with the central axis of the first through hole, and the aperture of the fourth through hole is smaller than the aperture of the first through hole; the projection of the light-shielding layer in the direction perpendicular to the display panel completely covers the projection of the conductive layer in the direction perpendicular to the display panel.

[0020] Optionally, the display module further includes a polarizer located between the glass cover plate and the display panel, and an optical adhesive layer located between the polarizer and the glass cover plate;

[0021] The first through hole extends toward the direction close to the glass cover plate and passes through the polarizer and the optical adhesive layer.

[0022] Optionally, the material of the conductive layer includes conductive foam.

[0023] The present application also provides a display device, comprising the display module described above and an optical sensor arranged corresponding to the first through hole.

[0024] The display module and display device provided by the present application provide a channel for releasing static electricity for the display panel by setting a conductive layer connecting the display panel and the metal heat dissipation layer at a position near the first through hole on the back of the display panel. This allows the static electricity generated by the entire product manufactured using the display module provided by the embodiment of the present application during the micro-drop test to be conducted away through the conductive layer, which is beneficial to improving the problem of the outer periphery of the first through hole of the display panel being shiny after the entire product has been micro-dropped. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0026] Figure 1 A schematic diagram of a partial cross-sectional structure of a display module provided in an embodiment of the present application.

[0027] Figure 2 A top view of a conductive layer provided in an embodiment of the present application.

[0028] Figure 3 This is a schematic diagram of a partial cross-sectional structure of a buffer heat dissipation layer monomer provided in an embodiment of the present application.

[0029] Figure 4 This is a schematic diagram of a partial cross-sectional structure of a backplane unit provided in an embodiment of the present application.

[0030] Figure 5 A top view of a backplane unit provided in an embodiment of the present application.

[0031] Figure 6 A schematic diagram of a partial cross-sectional structure of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0034] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0035] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0036] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0037] like Figure 1 As shown, an embodiment of the present application provides a display module 1, which includes at least a display panel 2 and a conductive layer 3 and a buffer heat dissipation layer (SCF) 4 arranged on the back of the display panel 2; wherein, the display panel 2 has a first through hole 5 that penetrates the display panel 2 in a direction perpendicular to the display panel 2, the conductive layer 3 is in direct contact with the back of the display panel 2 and is arranged close to the first through hole 5, the buffer heat dissipation layer 4 includes at least a buffer layer 6 and a metal heat dissipation layer 7, the buffer layer 6 is arranged around the conductive layer 3, and the metal heat dissipation layer 7 is located on the side of the buffer layer 6 away from the display panel 2 and is in direct contact with the conductive layer 3.

[0038] It can be understood that the back of the display panel 2 is the side away from the display surface of the display panel 2; wherein the display surface is the light emitting surface, that is, the side used for displaying images.

[0039] Specifically, the display panel 2 includes an OLED device, but is not limited thereto.

[0040] Specifically, the function of the first through hole 5 is to provide an optical path for an optical device (such as a camera) installed in the display module 1 , or to accommodate the optical device.

[0041] Specifically, the distance between the projection of any one of the conductive layer 3, the buffer layer 6, and the metal heat dissipation layer 7 in a direction perpendicular to the display panel 2 and the projection of the first through hole 5 in a direction perpendicular to the display panel 2 is greater than or equal to 0. In other words, the conductive layer 3, the buffer layer 6, and the metal heat dissipation layer 7 do not block the first through hole 5 in a direction perpendicular to the display panel 2, thereby avoiding blocking the light path of an optical device (such as a camera) installed in the display module 1 or occupying the installation position of the optical device, thereby ensuring sufficient lighting for the optical device.

[0042] Specifically, the conductive layer 3 includes conductive foam, but is not limited thereto, and may also be other conductive materials. It should be noted that the conductive layer 3 is only provided near the first through hole 5 and does not need to be provided on the entire back of the display panel 2 to avoid material waste.

[0043] In a specific embodiment, the conductive layer 3 has a second through hole 8 corresponding to the first through hole 5; the central axis L of the first through hole 5 coincides with the central axis L of the second through hole 8 and the aperture of the second through hole 8 is greater than or equal to the aperture of the first through hole 5. It can be understood that Figure 2 As shown, the conductive layer 3 is an annular structure. In a preferred embodiment, the diameter of the second through hole 8 on the conductive layer 3 is larger than the diameter of the first through hole 5, which can avoid the conductive layer 3 blocking the first through hole 5 due to installation error.

[0044] Of course, in other embodiments, the conductive layer 3 may be a block-shaped structure and disposed on either side of the first through hole 5; or, in other embodiments, the conductive layer 3 may be composed of a plurality of conductive blocks spaced apart and distributed around the first through hole 5. It is understood that the present application does not impose any restrictions on the specific shape and structure of the conductive layer 3, as long as electrical connection can be achieved between the display panel 2 near the first through hole 5 and the metal heat dissipation layer 7.

[0045] In a specific embodiment, the metal heat dissipation layer 7 is also located on the side of the conductive layer 3 away from the display panel 2 . It can be understood that the side of the conductive layer 3 away from the display panel 2 is laminated to the metal heat dissipation layer 7 .

[0046] Specifically, the metal heat dissipation layer 7 has a third through-hole 9 that communicates with the second through-hole 8. The central axis of the third through-hole 9 coincides with the central axis of the second through-hole 8, and the diameter of the third through-hole 9 is greater than or equal to the diameter of the first through-hole 5. In a preferred embodiment, the diameter of the third through-hole 9 on the metal heat dissipation layer 7 is greater than the diameter of the first through-hole 5, which can prevent the metal heat dissipation layer 7 from blocking the first through-hole 5 due to installation errors.

[0047] Specifically, the material of the metal heat dissipation layer 7 includes copper, but is not limited thereto.

[0048] Specifically, the buffer heat dissipation layer 4 also includes an adhesive layer 10 located between the display panel 2 and the buffer layer 6; the adhesive layer 10 is arranged around the conductive layer 3; the distance between the projection of the adhesive layer 10 in the direction perpendicular to the display panel 2 and the projection of the first through hole 5 in the direction perpendicular to the display panel 2 is greater than or equal to 0.

[0049] As will be appreciated, the buffer layer 6 and adhesive layer 10 on the buffer heat dissipation layer 4 are provided with a through hole having a larger aperture than the third through hole 9. This through hole accommodates the conductive layer 3 while also preventing the buffer layer 6 and adhesive layer 10 from obstructing the first through hole 5 in a direction perpendicular to the display panel 2. In a preferred embodiment, the orthographic projections of the through holes on the buffer layer 6 and adhesive layer 10 on the display panel 2 coincide, and the central axis of the through holes on the buffer layer 6 and adhesive layer 10 coincide with the central axis of the third through hole 9 on the metal heat dissipation layer 7.

[0050] It should be noted that the buffer heat dissipation layer in the prior art covers the entire back area of ​​the display panel except the first through hole or most of the back area except the first through hole. The through hole opened at the position corresponding to the first through hole in the buffer heat dissipation layer in the prior art runs through the entire buffer heat dissipation layer, that is, the aperture of the openings on each film layer is the same. However, based on the prior art, the present application sets the aperture of the openings of the metal heat dissipation layer 7 in the buffer heat dissipation layer 4 to be smaller than the apertures of the openings on other film layers in the buffer heat dissipation layer 4, which is beneficial for the installation of the conductive layer 3 and the stable connection between the conductive layer 3 and the metal heat dissipation layer 7, thereby facilitating the stable conduction of static electricity around the first through hole 5 of the display panel 2 to the metal heat dissipation layer 7. Figure 3 As shown, an embodiment of the present application provides a buffer heat dissipation layer monomer 11, which includes a buffer heat dissipation layer 4 and a first release film 12 and a first protective film 13 provided on opposite sides of the buffer heat dissipation layer 4. The apertures of the openings of the buffer layer 6 and the adhesive layer 10 in the buffer heat dissipation layer 4 are the same, and are larger than the aperture of the openings of the metal heat dissipation layer 7. It is understood that the first release film 12 is removed before the buffer heat dissipation layer 4 is attached to the back of the display panel 2, and the first protective film 13 is removed after attachment.

[0051] Specifically, the material of the buffer layer 6 includes foam, but is not limited thereto; the material of the adhesive layer 10 includes embossed adhesive, but is not limited thereto.

[0052] It can be understood that the buffer heat dissipation layer 4 is a composite film structure, and may further include a PI (polyimide) layer or a PET (polyethylene terephthalate) layer between the buffer layer 6 and the metal heat dissipation layer 7, but is not limited thereto.

[0053] Specifically, the display module 1 also includes a back plate (BP) 14 located between the display panel 2 and the buffer heat dissipation layer 4; the back plate 14 is arranged around the conductive layer 3; the distance between the projection of the back plate 14 in the direction perpendicular to the display panel 2 and the projection of the first through hole 5 in the direction perpendicular to the display panel 2 is greater than or equal to 0.

[0054] As will be appreciated, a through hole having a larger diameter than the first through hole 5 is provided on the back plate 14. This through hole accommodates the conductive layer 3 while also preventing the back plate 14 from obstructing the first through hole 5 in a direction perpendicular to the display panel 2. In a preferred embodiment, the through hole on the back plate 14 coincides with the orthographic projections of the through holes in the buffer layer 6 and the adhesive layer 10 on the display panel 2, i.e., the apertures of the three openings are the same.

[0055] It should be noted that the backplane in the prior art covers the entire back area of ​​the display panel excluding the first through hole, or most of the back area excluding the first through hole, and the aperture of the through hole opened in the backplane corresponding to the first through hole in the prior art is equal to the aperture of the first through hole. For example, the through hole in the backplane and the first through hole in the display panel are formed using the same process. However, based on the prior art, the aperture of the opening in the backplane 14 is larger than the aperture of the first through hole 5 to install the conductive layer 3. Therefore, the backplane 14 in the present application can be opened before being attached to the back of the display panel 2.

[0056] Specifically, such as Figure 4 and Figure 5 As shown, in the backplane 14 attachment process, an embodiment of the present application provides a backplane monomer 15, which includes a backplane body 16 and a second release film 17 and a second protective film 18 arranged on opposite sides of the backplane body 16. The backplane body 16 includes a backplane 14 and a gasket 19 of the same thickness. The backplane 14 has a through hole passing through the backplane 14. The gasket 19 is located in the through hole and is spaced apart from the backplane 14 to form an annular opening. The aperture of the through hole of the backplane 14 is larger than the aperture of the first through hole 5. The cross section of the gasket 19 can be circular, the central axis of the gasket 19 coincides with the central axis of the through hole of the backplane 14, and the diameter of the gasket 19 is smaller than the aperture of the first through hole 5.

[0057] Specifically, the first through hole 5 is formed after the back plate 14 is attached. In the process of attaching the back plate 14, after the second release film 17 on the back plate body 16 is torn off, the side of the back plate body 16 away from the second protective film 18 is attached to the back of the display panel 2, so that the annular opening between the back plate 14 and the gasket 19 exposes the edge 20 of the preset area of ​​the first through hole 5, so as to facilitate the hole opening operation of the display panel 2. In addition, before the first through hole 5 is formed, the gasket 19 covers the preset area of ​​the first through hole 5, which can protect the integrity of the film layer structure located on the preset area of ​​the first through hole 5 during the rolling process of the back plate body 16, and avoid damage to the film layer at the edge of the first through hole 5 of the display panel 2 after the first through hole 5 is formed. It can be understood that the gasket 19 is removed together with the film layer on the preset area of ​​the first through hole 5.

[0058] In a specific embodiment, when the buffer heat dissipation layer 4 is composed of a buffer layer 6, an adhesive layer 10 and a metal heat dissipation layer 7, the height of the conductive layer 3 in a direction perpendicular to the display panel 2 is equal to the sum of the heights of the back panel 14, the buffer layer 6 and the adhesive layer 10 in a direction perpendicular to the display panel 2.

[0059] Specifically, the display module 1 also includes a glass cover plate (CG) 21 located on the side of the display panel 2 away from the conductive layer 3 and a shading layer 22 located on the side of the glass cover plate 21 close to the display panel 2; the shading layer 22 has a fourth through hole 23; the central axis of the fourth through hole 23 coincides with the central axis of the first through hole 5, and the aperture of the fourth through hole 23 is smaller than the aperture of the first through hole 5; the projection of the shading layer 22 in the direction perpendicular to the display panel 2 completely covers the projection of the conductive layer 3 in the direction perpendicular to the display panel 2.

[0060] It can be understood that the light-shielding layer 22 is arranged in the area around the first through hole 5, and is used to block part of the first through hole 5 and the outer part of the first through hole 5, such as blocking the frame part of the first through hole 5; the light-shielding layer 22 can not only block the routing structure at the frame of the first through hole 5, but also prevent light leakage at the first through hole 5.

[0061] Specifically, the material of the light shielding layer 22 includes black ink, but is not limited thereto.

[0062] Specifically, the display module 1 also includes a polarizer (POL) 24 located between the glass cover plate 21 and the display panel 2, and an optical adhesive (OCA) layer 25 located between the polarizer 24 and the glass cover plate 21; the first through hole 5 extends toward the direction close to the glass cover plate 21 and passes through the polarizer 24 and the optical adhesive layer 25.

[0063] It can be understood that the first through hole 5 extending to penetrate the polarizer 24 and the optical adhesive layer 25 can provide more light to the area of ​​the first through hole 5 , which is beneficial to improving the imaging effect of the optical device installed in the display module 1 .

[0064] In the embodiment of the present application, a conductive layer 3 connecting the display panel 2 and the metal heat dissipation layer 7 is provided on the back of the display panel 2 near the first through hole 5, thereby providing a channel for releasing static electricity for the display panel 2. This allows the static electricity generated by the entire product manufactured using the display module 1 provided in the embodiment of the present application during the micro-drop test to be conducted away through the conductive layer 3, which is beneficial to improving the problem of the outer periphery of the first through hole 5 of the display panel 2 being shiny after the entire product has been micro-dropped.

[0065] Combine Figure 1 He Ru Figure 6 As shown, the embodiment of the present application further provides a display device 26 , which includes the display module 1 described in the aforementioned embodiment and an optical sensor 27 arranged corresponding to the first through hole 5 .

[0066] In one embodiment, the optical sensor 27 is at least partially located in the first through hole 5 of the display panel 2, and the optical sensor 27 is located in the through holes on the back plate 14 and the buffer heat dissipation layer 4. In other embodiments, the optical sensor 27 is at least partially located in the through holes on the back plate 14 and the buffer heat dissipation layer 4.

[0067] Specifically, the optical sensor 27 includes a camera, a fingerprint recognition sensor, a face recognition sensor or other sensors.

[0068] In the embodiment of the present application, a conductive layer 3 connecting the display panel 2 and the metal heat dissipation layer 7 is provided on the back of the display panel 2 near the first through hole 5, so that a channel for releasing static electricity is provided for the display panel 2, so that the static electricity generated by the display device 26 during the micro-drop test is conducted away through the conductive layer 3, which is beneficial to improving the problem of the outer periphery of the first through hole 5 of the display panel 2 being shiny after the entire device is micro-dropped.

[0069] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0070] The above is a detailed introduction to a display module and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display module, characterized in that: At least: The display panel has a first through hole penetrating the display panel in a direction perpendicular to the display panel; a conductive layer, located on the back of the display panel and in contact with the display panel; wherein the conductive layer is disposed near the first through hole; a buffer heat dissipation layer, located on the back of the display panel and comprising at least a buffer layer and a metal heat dissipation layer; wherein the buffer layer is arranged around the conductive layer, and the metal heat dissipation layer is located on a side of the buffer layer away from the display panel and in contact with the conductive layer; Wherein, a side of the conductive layer close to the first through hole is exposed by the first through hole.

2. The display module according to claim 1, wherein: A distance between a projection of any one of the conductive layer, the buffer layer, and the metal heat dissipation layer in a direction perpendicular to the display panel and a projection of the first through hole in a direction perpendicular to the display panel is greater than or equal to 0.

3. The display module according to claim 2, wherein: The conductive layer has a second through hole correspondingly connected to the first through hole; The central axis of the first through hole coincides with the central axis of the second through hole, and the aperture of the second through hole is greater than or equal to the aperture of the first through hole.

4. The display module according to claim 3, wherein: The metal heat dissipation layer is also located on a side of the conductive layer away from the display panel; the metal heat dissipation layer has a third through hole correspondingly connected to the second through hole; The central axis of the third through hole coincides with the central axis of the second through hole, and the aperture of the third through hole is greater than or equal to the aperture of the first through hole.

5. The display module according to claim 1, wherein: The buffer heat dissipation layer further includes an adhesive layer located between the display panel and the buffer layer; the adhesive layer is arranged around the conductive layer; A distance between a projection of the adhesive layer in a direction perpendicular to the display panel and a projection of the first through hole in a direction perpendicular to the display panel is greater than or equal to 0.

6. The display module according to claim 1, wherein: The display module further includes a back plate located between the display panel and the buffer heat dissipation layer; the back plate is arranged around the conductive layer; A distance between a projection of the back plate in a direction perpendicular to the display panel and a projection of the first through hole in a direction perpendicular to the display panel is greater than or equal to 0.

7. The display module according to claim 1, wherein: The display module further includes a glass cover plate located on a side of the display panel away from the conductive layer and a light shielding layer located on a side of the glass cover plate close to the display panel; The light-shielding layer has a fourth through hole; the central axis of the fourth through hole coincides with the central axis of the first through hole, and the aperture of the fourth through hole is smaller than the aperture of the first through hole; the projection of the light-shielding layer in the direction perpendicular to the display panel completely covers the projection of the conductive layer in the direction perpendicular to the display panel.

8. The display module according to claim 7, wherein: The display module further includes a polarizer located between the glass cover plate and the display panel, and an optical adhesive layer located between the polarizer and the glass cover plate; The first through hole extends toward the direction close to the glass cover plate and passes through the polarizer and the optical adhesive layer.

9. The display module according to claim 1, wherein: The material of the conductive layer includes conductive foam.

10. A display device, characterized in that: The display module comprises the display module according to any one of claims 1 to 9 and an optical sensor arranged corresponding to the first through hole.

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