A broadband reflective intelligent metasurface with electromagnetic wave amplification function
By designing a broadband reflective intelligent metasurface with a multi-layered structure, combining power synthesis and distribution networks, broadband amplification of electromagnetic waves is achieved, solving the problems of narrow bandwidth, high cost and large power consumption in the existing technology, reducing hardware costs and energy consumption, and improving communication signal quality.
Patent Information
- Application Number
- CN202210690964.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-17
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2042-06-17
AI Technical Summary
The existing intelligent metasurface systems have problems with narrow operating bandwidth, high cost and large power consumption in electromagnetic signal amplification, and the number of amplifiers in traditional designs leads to excessive hardware costs and energy consumption.
Design a broadband reflective intelligent metasurface with a multi-layer structure, including a metal patch layer, a dielectric layer, a microstrip circuit layer and a gap layer. Combined with a power synthesis network and a power distribution network, broadband amplification of electromagnetic waves is achieved by loading an amplifier to reduce the number of amplifier usage.
It expands the working bandwidth, reduces system cost and power consumption, realizes low-cost and low-power electromagnetic signal amplification effect, and improves the quality of communication signals.
Smart Images
Figure CN114976664B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to an electromagnetic wave amplification technology based on a broadband reflective intelligent metasurface structure with a loadable amplifier, and belongs to the fields of communication and new artificial electromagnetic materials. Background Art
[0002] With the rapid development of the Internet of Things technology, ubiquitous wireless connections will become a reality, which puts forward higher requirements for the system capacity of the sixth-generation mobile communication system. Existing technologies, such as ultra-dense networking, millimeter-wave communication technology, etc., will require greater hardware expenditure, higher maintenance costs, more complex signal processing, and more energy consumption due to the need for more base stations and higher radio frequencies. Based on this, intelligent metasurfaces have received extensive attention due to their unique characteristics of low cost, low energy consumption, and high reliability.
[0003] An intelligent metasurface is an artificial electromagnetic surface structure composed of a large number of carefully designed tunable electromagnetic units, which can realize the intelligent control of spatial electromagnetic waves and form an electromagnetic field with adjustable amplitude, phase, polarization, and frequency. The intelligent metasurface can be arranged in outdoor or indoor environments and combined with existing transceivers to achieve joint optimization of wireless channels, thereby realizing the reshaping of the wireless channel environment and functions such as improving the signal-to-noise ratio and enhancing the signal coverage range.
[0004] However, most of the current systems based on intelligent metasurfaces rely on the amplitude and phase control capabilities of the intelligent metasurface to achieve the required functions, and rarely consider the amplification of electromagnetic signals, which greatly limits their role. Because in actual applications, the communication path based on the intelligent metasurface is often longer than the normal communication path, which leads to more signal losses. To solve this problem, people usually use a larger intelligent metasurface array to increase the signal strength, but this also leads to higher hardware costs.
[0005] According to the paper "Controllable Reflection-enhancement Metasurfaces via Amplification Excitation of Transistor Circuit", the intelligent metasurface with amplification function can achieve the amplification function of electromagnetic signals, but it has the following technical disadvantages:
[0006] 1. The working bandwidth of the intelligent metasurface proposed in this paper is very narrow and cannot meet the requirements of communication systems.
[0007] The intelligent metasurface proposed in this paper requires each unit to be equipped with a triode amplifier, which greatly increases its cost and power consumption.
[0008] Based on this, we need to design a broadband reflective intelligent metasurface with electromagnetic wave amplification function, and load as few amplifiers as possible to reduce costs and power consumption. Summary of the Invention
[0009] Technical Problem: In order to effectively enhance the electromagnetic wave signal energy within a broadband range, the present invention provides a broadband reflective intelligent metasurface with electromagnetic wave amplification function. By using a broadband reflective metasurface structure that can load amplifiers, the reception, energy amplification, and re-radiation of incident electromagnetic waves are realized. At the same time, a power combining network and a power distribution network are introduced, so that the intelligent metasurface structure can achieve electromagnetic energy amplification within a broadband range and minimize the use of amplifiers to reduce costs and power consumption.
[0010] Technical Solution: To achieve the above object, a broadband reflective intelligent metasurface with electromagnetic wave amplification function adopted by the present invention is a multi-layer laminated structure, which is sequentially provided with a metal patch layer, an F4B dielectric layer, a metal slot layer, a Ro4350B dielectric layer, a microstrip circuit layer, an air dielectric layer, and a metal backplane layer from top to bottom; wherein, there are 4 patches in the metal patch layer respectively distributed on the F4B dielectric layer, and there are 4 pairs of metal slots in the metal slot layer respectively distributed between the F4B dielectric layer and the Ro4350B dielectric layer. A microstrip circuit layer composed of microstrip lines is provided below the Ro4350B dielectric layer, and an air dielectric layer is arranged between the microstrip circuit layer and the metal backplane layer.
[0011] The microstrip circuit layer is composed of a power combining network and a power distribution network, and the power combining network and the power distribution network are arranged alternately, that is, a part of the power combining network is located in the power distribution network, and a part of the power distribution network is located in the power combining network.
[0012] The power combining network is composed of two identical reverse C-shaped microstrip lines and a U-shaped microstrip line connected to the middle of the two identical reverse C-shaped microstrip lines. The middle of the U-shaped microstrip line is the first port.
[0013] The power distribution network is composed of two identical forward C-shaped microstrip lines and an inverted U-shaped microstrip line connected to the middle of the two identical forward C-shaped microstrip lines. The middle of the inverted U-shaped microstrip line is the second port.
[0014] The metal slots in the metal slot layer are hourglass-shaped slot structures, so that better impedance matching and energy coupling are realized between the metal patch layer and the microstrip circuit layer, thereby expanding the working bandwidth of the intelligent metasurface.
[0015] The hourglass-shaped slot structure described above consists of a horizontally arranged hourglass-shaped slot structure and a vertically arranged hourglass-shaped slot structure, forming a pair of hourglass-shaped slot structures.
[0016] The structural parameters of the horizontal hourglass-shaped slot and the vertical hourglass-shaped slot are as follows: a1 = 4.2 mm, a2 = 0.24 mm, a3 = 1.5 mm, a4 = 0.48 mm, h1 = 4.8 mm, h2 = 8.28 mm, h3 = 5.1 mm, h4 = 12 mm.
[0017] The microstrip circuit layer is loaded with an amplifier, which is loaded on the main branch of the microstrip line. The main branch of the microstrip line is respectively connected to the first port of the power combining network and the second port of the power distribution network, thereby realizing the amplification of the electromagnetic wave signal energy.
[0018] The overall structure of the intelligent metasurface is composed of 2×2 identical metasurfaces described above.
[0019] The intelligent metasurface uses metal patches to receive y-polarized electromagnetic waves, and couples the energy to the horizontal hourglass-shaped slots of the metal slot layer through the F4B dielectric layer. Subsequently, the electromagnetic energy is further coupled to each branch of the microstrip line of the microstrip circuit layer through the Ro4350B dielectric layer, and is aggregated to the main branch of the microstrip line through the power combining network. The electromagnetic energy on the main branch of the microstrip line is amplified by the loaded amplifier, and the amplified electromagnetic energy is distributed to each branch of the microstrip line through the power distribution network, and is coupled to the vertical hourglass-shaped slots of the metal slot layer through the Ro4350B dielectric layer. This energy passes through the F4B dielectric layer again, is further coupled to the metal patch layer, and is re-radiated in the form of x polarization.
[0020] By using the broadband reflective intelligent metasurface structure loaded with an amplifier, the reception, amplification, and re-radiation of electromagnetic waves in a broadband range are realized, so as to amplify the reflection energy of electromagnetic waves in the broadband range.
[0021] Advantageous effects: Compared with the prior art, the technical solution of the present invention has the following advantageous technical effects:
[0022] 1. By reasonably designing the thickness of each layer and the slot shape of the metal slot layer, the present invention successfully expands the working bandwidth of the reflective intelligent metasurface. By loading an amplifier, it can realize the amplification of electromagnetic signal energy in a broadband range, thereby effectively enhancing communication signals. In summary, the present invention can greatly improve the signal quality of communication.
[0023] 2. The present invention can greatly reduce the use of amplifiers by introducing a power synthesis network and a power distribution network. This design can greatly reduce the cost and power consumption of the system based on the smart metasurface, making it possible to widely use and popularize smart metasurfaces with electromagnetic energy amplification function.
[0024] 3. Traditional smart metasurfaces mainly achieve the required functions through the ability to control the amplitude and phase of electromagnetic waves, and rarely consider the amplification of electromagnetic signals. The existing smart metasurfaces with amplification functions have the problems of narrow working bandwidth and large number of amplifiers required, resulting in high power consumption and cost. The broadband reflective smart metasurface of the present invention has the characteristics of broadband operation and can achieve amplification of electromagnetic energy within a broadband range by loading amplifiers. On this basis, the structure greatly reduces the use of amplifiers by introducing a power synthesis network and a power distribution network. Combined with the above, this makes it possible to design a low-cost, low-power broadband reflective smart metasurface with electromagnetic wave amplification function. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 This is a schematic diagram of the structure of each layer of a broadband reflective smart metasurface based on a loaded amplifier.
[0026] The figure includes: a metal patch layer 1, an F4B dielectric layer 2, a metal gap layer 3, a Ro4350B dielectric layer 4, a microstrip circuit layer 5, an air dielectric layer 6 and a metal backplane layer 7.
[0027] Figure 2 It is a schematic diagram of the structure of the F4B dielectric layer and the metal patch layer covering it.
[0028] Figure 3 It is a structural schematic diagram of the metal gap layer, which also includes two specific gap structures on the metal gap layer: a horizontal hourglass-shaped gap and a longitudinal hourglass-shaped gap.
[0029] Figure 4 This is a schematic diagram of the structure of the Ro4350B dielectric layer and the microstrip circuit layer on top of it. Figure 4 (a) is a schematic diagram of the overall structure of the microstrip circuit layer. Figure 4 (b) is a schematic diagram of the structure of the power synthesis network. Figure 4 (c) is a schematic diagram of the structure of the power distribution network, which includes a power synthesis network 51 and a power distribution network 52.
[0030] Figure 5 When the broadband reflective smart metasurface is not loaded with an amplifier and a microstrip line, Figure 4 (b) Figure 4 (c) Schematic diagram of S parameters when the first port and the second port are excited.
[0031] Figure 6 It is the reflection gain situation of the broadband reflective intelligent metasurface structure when an amplifier is loaded and when no amplifier is loaded. Specific implementation manner
[0032] The present invention will be further clarified below in conjunction with the accompanying drawings and specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and not to limit the scope of the present invention. After reading the present invention, various equivalent modifications made by those skilled in the art fall within the scope defined by the appended claims of this application.
[0033] An implementation manner of the present invention is as follows Figure 1 As shown, the broadband reflective intelligent metasurface structure based on a loaded amplifier is composed of a metal patch layer, an F4B dielectric layer, a metal slot layer, a Ro4350B dielectric layer, a microstrip circuit layer, an air dielectric layer, and a metal backplane layer. The thicknesses of each layer structure are 0.036 mm, 4.57 mm, 0.036 mm, 0.762 mm, 0.036 mm, 12 mm, and 1 mm respectively. The overall manufacturing process of this structure is as follows. First, select the F4B dielectric and print the metal patch layer on it using the printed circuit board process. Subsequently, select the Ro4350B dielectric and print the metal slot layer and the microstrip circuit layer on its front and back respectively using the printed circuit board process. Finally, press the above two printed circuit boards together, and finally load the metal backplane at a position with a suitable air dielectric layer interval behind it using the screw connection technology.
[0034] The F4B dielectric layer and the metal patch layer structure covered thereon are as Figure 2 shown. Four metal patches are evenly and symmetrically distributed on the F4B dielectric layer for receiving and re-radiating electromagnetic waves. The relevant parameters of this structure are: unit period p = 90 mm, patch spacing s = 40 mm, and patch size a = 14.1 mm.
[0035] The schematic structural diagram of the metal slot layer is as Figure 3 shown. Two pairs of hourglass-shaped slot structures are distributed on the metal slot layer in a 2×2 form for coupling electromagnetic energy between the metal patch layer and the microstrip circuit layer. The hourglass-shaped slot structures thereon can effectively expand the working bandwidth of this intelligent metasurface. The structural parameters of the horizontal hourglass-shaped slot and the vertical hourglass-shaped slot are: a1 = 4.2 mm, a2 = 0.24 mm, a3 = 1.5 mm, a4 = 0.48 mm, h1 = 4.8 mm, h2 = 8.28 mm, h3 = 5.1 mm, h4 = 12 mm.
[0036] The Ro4350B dielectric layer and the microstrip circuit layer structure covered thereon are as Figure 4As shown, electromagnetic energy is collected from the microstrip line branches through the power combining network and enters the microstrip line main branch, then enters the amplifier. The amplified energy then enters the corresponding microstrip line branches through the power distribution network. Figure 4 (b), Figure 4 (c) shows the schematic structural diagrams of the power combining network and the power distribution network, which are mainly symmetrically composed of four microstrip line branches. The relevant structural parameters are: l1 = 7.475 mm, l2 = 12.225 mm, l3 = 6.225 mm, l4 = 12.225 mm, l5 = 7.475 mm, l6 = 24.45 mm, w1 = 1.55 mm, w2 = 0.85 mm, w3 = 5.8 mm, w4 = 6.45 mm, w5 = 12.225 mm, w6 = 14 mm, m1 = 28.45 mm, m2 = 12.225 m, m3 = 14 mm, n1 = 14 mm, n2 = 12.225 mm, n3 = 6.325 mm, n4 = 1.55 mm, n5 = 0.85 mm, n6 = 5.8 mm.
[0037] When the broadband reflective intelligent metasurface is not loaded with an amplifier and the microstrip line main branch, when excited at the first port and the second port as shown in Figure 4 (b), Figure 4 (c), the corresponding S-parameters are as shown in Figure 5 . It can be seen from the figure that within 5 GHz - 6 GHz, the amplitudes of S 11 and S 22 are both less than -10 dB, which means that this reflective intelligent metasurface can work normally within 5 GHz - 6 GHz and has a relatively wide operating bandwidth. And S 21 is less than -2 dB within 5 GHz - 6 GHz, which indicates that the two ports have a high isolation degree within this frequency range, ensuring that the amplifier loaded on it can work normally.
[0038] Under the condition of normal incidence, the gains of this broadband reflective intelligent metasurface with and without an amplifier loaded are as shown in Figure 6 . It can be seen from the figure that when no amplifier is loaded, the gain of the shown intelligent metasurface is less than 0 within the operating bandwidth and cannot achieve the effect of amplifying electromagnetic energy. While after loading the amplifier, the shown intelligent metasurface can provide a gain of about 10 dB within the operating bandwidth, realizing the effective amplification of electromagnetic wave energy.
[0039] The present invention proposes an electromagnetic energy amplification method based on a broadband reflective intelligent metasurface structure with a loaded amplifier. This method realizes the amplification of the reflected energy of electromagnetic waves in a broadband range by using the broadband reflective intelligent metasurface structure with a loaded amplifier to receive, amplify, and re-radiate electromagnetic waves in a broadband range. The principle of the electromagnetic wave amplification function of the broadband reflective intelligent metasurface designed in the present invention is as follows: The intelligent metasurface uses a metal patch layer to receive y-polarized electromagnetic waves, and couples the energy to the four transverse hourglass-shaped slots of the metal slot layer through the F4B dielectric layer. Subsequently, the electromagnetic energy is further coupled to each microstrip line branch corresponding to the power combining network of the microstrip circuit layer through the Ro4350B dielectric layer, and is aggregated to the main microstrip line through the power combining network. The electromagnetic energy on the main microstrip line is amplified by the loaded amplifier, and the amplified electromagnetic energy is distributed to each corresponding microstrip line branch through the power distribution network, and is coupled to the four longitudinal hourglass-shaped slots of the metal slot layer through the Ro4350B dielectric layer. This energy passes through the F4B dielectric layer again, is further coupled to the metal patch layer, and is re-radiated in the form of x polarization. Through the above methods of receiving, amplifying, and re-radiating, the intelligent metasurface can effectively enhance the electromagnetic energy in a broadband range, and by introducing a power combining network and a power distribution network, the use of amplifiers can be greatly reduced, thereby greatly reducing the cost and power consumption of the system based on this intelligent metasurface.
[0040] The above are only partial embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.
Claims
1. A broadband reflective intelligent metasurface with electromagnetic wave amplification function, characterized in that The metasurface is a multi-layer laminated structure, and is sequentially provided with a metal patch layer (1), an F4B dielectric layer (2), a metal slot layer (3), a Ro4350B dielectric layer (4), a microstrip circuit layer (5), an air dielectric layer (6) and a metal backplane layer (7) from top to bottom; wherein, there are 4 patches in the metal patch layer (1) respectively distributed on the F4B dielectric layer (2), and there are 4 pairs of metal slots in the metal slot layer (3) respectively distributed between the F4B dielectric layer (2) and the Ro4350B dielectric layer (4). A microstrip circuit layer (5) composed of microstrip lines is provided below the Ro4350B dielectric layer (4), and an air dielectric layer (6) is between the microstrip circuit layer (5) and the metal backplane layer (7); The microstrip circuit layer (5) is composed of a power combining network (51) and a power distribution network (52). The power combining network (51) and the power distribution network (52) are arranged alternately, that is, a part of the power combining network (51) is located in the power distribution network (52), and a part of the power distribution network (52) is located in the power combining network (51); The metal slots in the metal slot layer (3) are in a hourglass-shaped slot structure, so that the electromagnetic wave energy can achieve better impedance matching and energy coupling between the metal patch layer (1) and the microstrip circuit layer (5), thereby expanding the working bandwidth of the intelligent metasurface.
2. The broadband reflective intelligent metasurface with electromagnetic wave amplification function according to claim 1, wherein: The power combining network (51) is composed of two identical reverse C-shaped microstrip lines and a U-shaped microstrip line connected to the middle parts of the two identical reverse C-shaped microstrip lines. The middle of the U-shaped microstrip line is the first port.
3. The broadband reflective intelligent metasurface with electromagnetic wave amplification function according to claim 1, wherein: The power distribution network (52) is composed of two identical forward C-shaped microstrip lines and an inverted U-shaped microstrip line connected to the middle parts of the two identical forward C-shaped microstrip lines. The middle of the inverted U-shaped microstrip line is the second port.
4. A broadband reflective intelligent metasurface with electromagnetic wave amplification function according to claim 1, characterized in that: The hourglass-shaped slot structure is composed of a horizontally arranged hourglass-shaped slot structure and a vertically arranged hourglass-shaped slot structure to form a pair of hourglass-shaped slot structures.
5. The broadband reflective intelligent metasurface with electromagnetic wave amplification function according to claim 3, characterized in that: The microstrip circuit layer (5) is loaded with an amplifier. The amplifier is loaded on the main branch of the microstrip line, and the main branch of the microstrip line is respectively connected to the first port of the power combining network (51) and the second port of the power distribution network (52), so as to realize the amplification of the electromagnetic wave signal energy.
6. The broadband reflective intelligent metasurface with electromagnetic wave amplification function according to claim 1, wherein: The overall structure of the intelligent metasurface is composed of 2×2 of the same metasurfaces.